CN114630500B - Welding device for high-heat-conductivity copper-clad ceramic substrate - Google Patents
Welding device for high-heat-conductivity copper-clad ceramic substrate Download PDFInfo
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- CN114630500B CN114630500B CN202111188449.1A CN202111188449A CN114630500B CN 114630500 B CN114630500 B CN 114630500B CN 202111188449 A CN202111188449 A CN 202111188449A CN 114630500 B CN114630500 B CN 114630500B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 128
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 238000003466 welding Methods 0.000 title claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910052802 copper Inorganic materials 0.000 claims abstract description 85
- 239000010949 copper Substances 0.000 claims abstract description 85
- 229910000679 solder Inorganic materials 0.000 claims abstract description 79
- 238000003825 pressing Methods 0.000 claims abstract description 45
- 238000005476 soldering Methods 0.000 claims description 64
- 238000001125 extrusion Methods 0.000 claims description 36
- 230000006835 compression Effects 0.000 claims description 19
- 238000007906 compression Methods 0.000 claims description 19
- 230000009471 action Effects 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 abstract description 63
- 238000005219 brazing Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a welding device of a high-heat-conductivity copper-clad ceramic substrate, and aims to provide the welding device of the high-heat-conductivity copper-clad ceramic substrate, which not only can reliably position copper sheets and ceramic plates, but also can effectively avoid the problem that a fluidized silver copper brazing sheet is connected with two adjacent copper sheets in the welding process, so that the two adjacent copper sheets are short-circuited after welding. The copper sheet limiting device comprises a substrate, wherein the upper surface of the substrate is provided with a ceramic plate limiting groove for limiting a ceramic plate, and the bottom surface of the ceramic plate limiting groove is provided with a plurality of copper sheet limiting grooves for limiting copper sheets; the solder resist preassembling grooves are arranged on the bottom surface of the ceramic plate limiting groove, a solder resist preassembling groove is arranged between any two adjacent copper sheet limiting grooves, and the two adjacent copper sheet limiting grooves are separated by the solder resist preassembling groove; and the upper pressing plate is positioned above the ceramic plate limiting groove and used for pressing the ceramic plate limited in the ceramic plate limiting groove.
Description
Technical Field
The invention relates to a welding device, in particular to a welding device for a high-heat-conductivity copper-clad ceramic substrate.
Background
The conventional method for manufacturing the high-heat-conductivity copper-clad ceramic substrate generally comprises the steps of plating a metal film (taking copper as an example) on a ceramic plate, and then carrying out laser painting to obtain a required surface. The existing manufacturing method of the high-heat-conductivity copper-clad ceramic substrate mainly has the defects that firstly, the connection between copper and nonmetal (ceramic plate) is not firm, and the performance of bearing tensile force or shearing force is poor; secondly, most of surface coating processes are electroplating, so that the problem of environmental protection exists; thirdly, laser engraving is needed after the ceramic surface is electroplated, and the cost is high.
To solve this problem, some inventors now directly weld a punched copper sheet to a ceramic plate through a silver brazing sheet to manufacture a high heat conduction copper-clad ceramic substrate, specifically, place the silver brazing sheet on the surface of the ceramic plate, and place the punched copper sheet on the silver brazing sheet; and then, putting the ceramic plate, the silver copper soldering lug and the copper sheet into a brazing furnace for welding. The manufacturing method of the high-heat-conductivity copper-clad ceramic substrate adopts the characteristic that the silver-copper soldering lug can directly form firm between the metal surface and the nonmetallic material, and the copper sheet is directly welded on the ceramic plate so as to effectively solve the problems; however, the existing manufacturing method of the high-heat-conductivity copper-clad ceramic substrate does not have standard operation equipment, copper sheets are easy to be positioned inaccurately in the manufacturing process, silver copper soldering lugs are melted to be in a fluid state in the welding process, and the adjacent two copper sheets are connected by the silver copper soldering lugs in the fluid state, so that the problem of short circuit between the two adjacent copper sheets after welding is caused.
Disclosure of Invention
The invention aims to provide the welding device for the high-heat-conductivity copper-clad ceramic substrate, which not only can reliably position copper sheets and ceramic plates, but also can effectively avoid the problem that a fluidized silver copper sheet is connected with two adjacent copper sheets in the welding process, so that the two adjacent copper sheets are short-circuited after welding.
The technical scheme of the invention is as follows:
a soldering apparatus for a high thermal conductivity copper-clad ceramic substrate, comprising:
the ceramic plate limiting groove used for limiting the ceramic plate is formed in the upper surface of the substrate, and a plurality of copper sheet limiting grooves used for limiting the copper sheets are formed in the bottom surface of the ceramic plate limiting groove;
the solder resist preassembling grooves are arranged on the bottom surface of the ceramic plate limiting groove, a solder resist preassembling groove is arranged between any two adjacent copper sheet limiting grooves, and the two adjacent copper sheet limiting grooves are separated by the solder resist preassembling groove;
and the upper pressing plate is positioned above the ceramic plate limiting groove and used for pressing the ceramic plate limited in the ceramic plate limiting groove.
The welding device of the high heat conduction copper-clad ceramic substrate of the scheme has the following specific operation,
firstly, positioning a copper sheet in a corresponding copper sheet limiting groove, and placing a silver copper brazing sheet on the upper surface of the corresponding copper sheet, wherein the groove depth of the copper sheet limiting groove is smaller than the sum of the thicknesses of the copper sheet and the silver copper brazing sheet;
secondly, filling the solder resist at the solder resist preassembling groove;
thirdly, placing the ceramic plate into the ceramic plate limiting groove, wherein the surface of the ceramic plate is supported on the silver copper soldering lug;
fourthly, pressing the ceramic plate limited in the ceramic plate limiting groove through the upper pressing plate;
fifthly, placing the welding device of the high-heat-conductivity copper-clad ceramic substrate into a vacuum brazing furnace for welding.
Therefore, the copper sheet and the ceramic plate can be reliably positioned, so that the accurate welding position of the copper sheet is ensured; and two silver copper soldering lugs which are adjacently distributed can be blocked by the solder resist filled in the solder resist preassembling groove, so that the problem that the adjacent two copper sheets are short-circuited after welding due to the fact that the adjacent two copper sheets are connected by the fluidized silver copper soldering lugs in the welding process is effectively avoided.
The device is characterized by further comprising a floating pressing device and a solder resist extrusion device, wherein the floating pressing device comprises a compression spring, a containing groove arranged on the lower surface of a base plate, a plurality of vertical guide holes which are arranged on the upper surface of the base plate and are communicated with the containing groove, vertical guide rods which are arranged in the vertical guide holes in a one-to-one corresponding sliding manner, a middle limiting block and an upper limiting block which are arranged on the vertical guide rods, a supporting flat plate which is arranged above the upper pressing plate, a locking bolt arranged in the middle of the supporting flat plate and a floating top plate which is arranged in the containing groove, the lower end of the vertical guide rods is connected with the floating top plate, the middle limiting block is arranged above the base plate, the middle limiting block is propped against the upper surface of the base plate under the action of the compression spring, strip-shaped sockets which are in one-to-one correspondence with the vertical guide rods are arranged on the supporting flat plate, the vertical guide rods are inserted in the corresponding strip-shaped sockets, and the supporting flat plate is arranged below the upper limiting block;
the solder resist extrusion device comprises a floating extrusion plate arranged in a solder resist preassembling groove, a vertical ejector rod via hole arranged on the bottom surface of the solder resist preassembling groove and communicated with the accommodating groove, and an ejector rod arranged in the vertical ejector rod via hole in a sliding way, wherein the ejector rod is positioned above the floating top plate,
when the limiting block is propped against the upper surface of the base plate and the floating extrusion plate is supported on the bottom surface of the solder resist preassembling groove under the action of dead weight, the lower end of the ejector rod stretches into the accommodating groove, and a gap is reserved between the lower end of the ejector rod and the floating top plate.
Because the solder resist is filled in the solder resist preassembling groove, after the ceramic plate is placed in the ceramic plate limiting groove and the surface of the ceramic plate is supported on the silver copper soldering lugs, the solder resist can not completely block the two silver copper soldering lugs which are adjacently distributed; more importantly, before the ceramic plate completely compresses the silver copper soldering lug and the copper sheet, because gaps may exist between the silver copper soldering lug and the copper sheet and between the silver copper soldering lug and the ceramic plate, some solder resist is extruded between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate under the extrusion action of the ceramic plate, so that poor welding between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate is caused, and the welding quality of the copper sheet on the ceramic plate is affected. In order to solve the problems, the scheme designs a floating pressing device and a solder resist extrusion device, in particular,
the fourth step, the specific operation of pressing the ceramic plate limited in the ceramic plate limiting groove through the upper pressing plate is as follows, (1) the upper pressing plate is placed on the ceramic plate; (2) Placing a support flat plate on the upper pressing plate, translating the support flat plate to enable the vertical guide rod to be inserted into the corresponding strip-shaped socket, and enabling the support flat plate to be positioned below the upper limiting block; (3) Tightening the locking bolt, wherein the lower end of the locking bolt firstly abuts against the upper pressing plate, and the supporting flat plate is jacked up to enable the supporting flat plate to abut against the upper limiting block; then, overcoming the acting force of the compression spring, driving the vertical guide rod and the floating top plate to move upwards through the supporting flat plate and the upper limiting block, wherein a gap is reserved between the lower end of the ejector rod and the floating top plate at the beginning of the upward movement of the floating top plate, so that the locking bolt firstly presses the upper pressing plate on the silver copper soldering lug and the copper sheet so as to eliminate the possible gap between the silver copper soldering lug and the copper sheet and between the silver copper soldering lug and the ceramic plate; then, the floating top plate is propped against the lower end of the ejector rod to drive the ejector rod and the floating extrusion plate to move upwards together, the floating extrusion plate is used for extruding the solder resist in the solder resist preassembling groove and filling the gap between the ceramic plate and the solder resist preassembling groove, so that two silver copper soldering lugs distributed adjacently are completely blocked, and the problem that after the surface of the ceramic plate is supported on the silver copper soldering lugs, the solder resist can not completely block the two silver copper soldering lugs distributed adjacently, and the adjacent two copper sheets are connected by the silver copper soldering lugs in a fluid state in the welding process, so that the adjacent two copper sheets are short-circuited is solved; more importantly, before the floating extrusion plate extrudes the solder resist in the solder resist preassembling groove, the upper pressing plate is tightly pressed on the silver copper soldering lug and the copper sheet, so that the possible gaps between the silver copper soldering lug and the copper sheet and between the silver copper soldering lug and the ceramic plate are eliminated, and the solder resist extruded in the solder resist preassembling groove cannot be extruded into the space between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate, so that the problem that the welding quality of the copper sheet is affected due to the fact that some solder resist is extruded into the space between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate under the extrusion action of the ceramic plate is solved.
Preferably, when the floating extrusion plate is supported on the bottom surface of the solder resist pre-installation groove, a distance between the upper surface of the floating extrusion plate and the notch of the solder resist pre-installation groove is equal to or greater than a distance between the lower end of the ejector pin and the inner top surface of the accommodating groove. Therefore, the problem that the floating extrusion plate is contacted with the ceramic plate in the process that the floating top plate drives the ejector rod and the floating extrusion plate to move upwards together can be avoided.
Preferably, the vertical guide holes are first-stage stepped holes with smaller inner diameters and larger inner diameters, the compression springs are sleeved on the vertical guide rods in a one-to-one correspondence mode, the lower ends of the compression springs are propped against the floating top plate, and the upper ends of the compression springs are propped against the step surfaces of the first-stage stepped holes.
Preferably, the edge of the supporting plate is provided with mounting convex blocks corresponding to the strip-shaped sockets one by one, the strip-shaped sockets are arranged on the larger mounting convex blocks, and the same side of each strip-shaped socket groove is opened. Thus, the mounting and the dismounting of the support plate are convenient.
Preferably, the middle limiting block is located in the middle of the vertical guide rod, and the upper limiting block is located at the upper end of the vertical guide rod.
Preferably, the solder resist pressing devices are in one-to-one correspondence with the solder resist pre-loading grooves.
Preferably, the groove depth of the ceramic plate limit groove is smaller than the thickness of the ceramic plate.
Preferably, the substrate is a graphite substrate.
Preferably, the upper platen is a graphite plate.
The beneficial effects of the invention are as follows: not only can reliably fix a position copper sheet and ceramic plate, can effectively avoid in the welding process moreover that the silver brazing piece that appears the flow state connects two adjacent copper sheets, leads to the problem of short circuit between two adjacent copper sheets after the welding.
Drawings
Fig. 1 is a schematic structural view of a soldering apparatus for a high thermal conductivity copper-clad ceramic substrate according to the present invention.
Fig. 2 is an enlarged view of a portion of fig. 1 at a.
Fig. 3 is a top view of fig. 1.
Fig. 4 is an exploded view of a copper sheet, silver copper tab and ceramic plate of a high thermal conductivity copper clad ceramic substrate prior to soldering.
In the figure:
a base plate 1, a ceramic plate limit groove 1.1 and a copper sheet limit groove 1.2;
a solder resist preassembling groove 2;
an upper platen 3;
the device comprises a floating pressing device 4, a containing groove 4.0, a compression spring 4.1, a vertical guide rod 4.2, a floating top plate 4.3, a supporting flat plate 4.4, a locking bolt 4.5, a vertical guide hole 4.6, a middle limiting block 4.7, an upper limiting block 4.8, a strip-shaped socket 4.9 and a mounting lug 4.10;
a solder resist extrusion device 5, a floating extrusion plate 5.1 and a push rod 5.2;
copper sheet 6;
silver brazing sheet 7;
and a ceramic plate 8.
Detailed Description
For the purpose of making the technical solution embodiment, the technical solution and the advantages of the present invention more apparent, the technical solution of the embodiment of the present invention will be clearly explained and illustrated below with reference to the accompanying drawings, but the following embodiment is only a preferred embodiment of the present invention, not all embodiments. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present invention.
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present solution and are not to be construed as limiting the solution of the present invention.
These and other aspects of embodiments of the invention will be apparent from and elucidated with reference to the description and drawings described hereinafter. In the description and drawings, particular implementations of embodiments of the invention are disclosed in detail as being indicative of some of the ways in which the principles of embodiments of the invention may be employed, but it is understood that the scope of the embodiments of the invention is not limited correspondingly. On the contrary, the embodiments of the invention include all alternatives, modifications and equivalents as may be included within the spirit and scope of the appended claims.
In the description of the present invention, it should be understood that the terms "thickness," "upper," "lower," "horizontal," "top," "bottom," "inner," "outer," "circumferential," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, the meaning of "a plurality" means at least two, for example, two, three, etc., unless explicitly defined otherwise, the meaning of "a number" means one or more.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
First embodiment: as shown in fig. 1, 2 and 4, a soldering device for a high-heat-conductivity copper-clad ceramic substrate comprises a substrate 1, a solder mask pre-loading groove 2 and an upper pressing plate 3.
The upper surface of base plate 1 is equipped with the ceramic plate spacing groove 1.1 that is used for spacing ceramic plate, and the bottom surface of ceramic plate spacing groove is equipped with a plurality of copper sheet spacing grooves 1.2 that are used for spacing copper sheet. The groove depth of the ceramic plate limiting groove is smaller than the thickness of the ceramic plate. The substrate is a graphite substrate, but of course, the substrate may also be a metal substrate, such as a steel plate, an iron plate, or the like.
The solder resist preassembling groove 2 is arranged on the bottom surface of the ceramic plate limiting groove, a solder resist preassembling groove is arranged between any two adjacent copper sheet limiting grooves, and the two adjacent copper sheet limiting grooves are separated through the solder resist preassembling groove.
The upper pressing plate 3 is located above the ceramic plate limiting groove and used for pressing the ceramic plate limited in the ceramic plate limiting groove. The upper pressing plate is a graphite plate, and of course, the upper pressing plate can also be a metal substrate, such as a steel plate, an iron plate, and the like.
The soldering device of the high heat conductivity copper-clad ceramic substrate of the embodiment is specifically operated as follows,
firstly, positioning a copper sheet 6 in a corresponding copper sheet limiting groove, and placing a silver copper brazing sheet 7 on the upper surface of the corresponding copper sheet, wherein the groove depth of the copper sheet limiting groove is smaller than the sum of the thicknesses of the copper sheet and the silver copper brazing sheet;
secondly, filling the solder resist at the solder resist preassembling groove;
thirdly, placing the ceramic plate 8 into a ceramic plate limiting groove, wherein the surface of the ceramic plate is supported on the silver copper soldering lug;
fourthly, pressing the ceramic plate limited in the ceramic plate limiting groove through the upper pressing plate;
fifthly, placing the welding device of the high-heat-conductivity copper-clad ceramic substrate into a vacuum brazing furnace for welding.
Therefore, the copper sheet and the ceramic plate can be reliably positioned, so that the accurate welding position of the copper sheet is ensured; and two silver copper soldering lugs which are adjacently distributed can be blocked by the solder resist filled in the solder resist preassembling groove, so that the problem that the adjacent two copper sheets are short-circuited after welding due to the fact that the adjacent two copper sheets are connected by the fluidized silver copper soldering lugs in the welding process is effectively avoided.
Further, as shown in fig. 1, 2 and 3, the soldering device for the high heat conductivity copper-clad ceramic substrate further comprises a floating pressing device 4 and a solder resist extrusion device 5. The floating pressing device 4 comprises a compression spring 4.1, a containing groove 4.0 arranged on the lower surface of the base plate, a plurality of vertical guide holes 4.6 which are arranged on the upper surface of the base plate and communicated with the containing groove, vertical guide rods 4.2 which are arranged in the vertical guide holes in a one-to-one corresponding sliding manner, a middle limiting block 4.7 and an upper limiting block 4.8 which are arranged on the vertical guide rods, a supporting flat plate 4.4 which is arranged above the upper pressing plate, a locking bolt 4.5 which is arranged in the middle of the supporting flat plate and a floating top plate 4.3 which is arranged in the containing groove. In this embodiment, the base plate is square, and vertical guiding hole is four, and four vertical guiding hole distributes in the four corners department of base plate. The lower end of the vertical guide rod is connected with the floating top plate. The middle limiting block is positioned above the base plate and abuts against the upper surface of the base plate under the action of the compression spring. In this embodiment, the middle limiting block is located in the middle of the vertical guide rod, and the upper limiting block is located at the upper end of the vertical guide rod. The support flat plate is provided with strip-shaped sockets 4.9 which are in one-to-one correspondence with the vertical guide rods. The vertical guide rod is inserted into the corresponding strip-shaped socket, and the supporting flat plate is positioned below the upper limiting block.
The solder resist extrusion device 5 comprises a floating extrusion plate 5.1 arranged in a solder resist preassembling groove, a vertical ejector rod via hole which is arranged on the bottom surface of the solder resist preassembling groove and communicated with the accommodating groove, and an ejector rod 5.2 which is arranged in the vertical ejector rod via hole in a sliding manner. The ejector rod is positioned above the floating top plate. In this embodiment, the solder resist pressing devices are in one-to-one correspondence with the solder resist pre-loading grooves.
When the limiting block is propped against the upper surface of the base plate and the floating extrusion plate is supported on the bottom surface of the solder resist preassembling groove under the action of dead weight, the lower end of the ejector rod stretches into the accommodating groove, and a gap is reserved between the lower end of the ejector rod and the floating top plate.
Because the solder resist is filled in the solder resist preassembling groove, after the ceramic plate is placed in the ceramic plate limiting groove and the surface of the ceramic plate is supported on the silver copper soldering lugs, the solder resist can not completely block the two silver copper soldering lugs which are adjacently distributed; more importantly, before the ceramic plate completely compresses the silver copper soldering lug and the copper sheet, because gaps may exist between the silver copper soldering lug and the copper sheet and between the silver copper soldering lug and the ceramic plate, some solder resist is extruded between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate under the extrusion action of the ceramic plate, so that poor welding between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate is caused, and the welding quality of the copper sheet on the ceramic plate is affected. In order to solve the problems, the scheme designs a floating pressing device and a solder resist extrusion device, in particular,
the fourth step, the specific operation of pressing the ceramic plate limited in the ceramic plate limiting groove through the upper pressing plate is as follows, (1) the upper pressing plate is placed on the ceramic plate; (2) Placing a support flat plate on the upper pressing plate, translating the support flat plate to enable the vertical guide rod to be inserted into the corresponding strip-shaped socket, and enabling the support flat plate to be positioned below the upper limiting block; (3) Tightening the locking bolt, wherein the lower end of the locking bolt firstly abuts against the upper pressing plate, and the supporting flat plate is jacked up to enable the supporting flat plate to abut against the upper limiting block; then, overcoming the acting force of the compression spring, driving the vertical guide rod and the floating top plate to move upwards through the support flat plate and the upper limiting block until the floating top plate abuts against the inner top surface of the accommodating groove; because a gap is formed between the lower end of the ejector rod and the floating top plate at the beginning of the upward movement of the floating top plate (when the middle limiting block is propped against the upper surface of the base plate and the floating extrusion plate is supported on the bottom surface of the solder resist preassembly groove under the action of dead weight), the locking bolt firstly presses the upper pressing plate on the silver copper soldering lug and the copper sheet so as to eliminate the possible gap between the silver copper soldering lug and the copper sheet and between the silver copper soldering lug and the ceramic plate; then, the floating top plate is propped against the lower end of the ejector rod to drive the ejector rod and the floating extrusion plate to move upwards together, the floating extrusion plate is used for extruding the solder resist in the solder resist preassembling groove and filling the gap between the ceramic plate and the solder resist preassembling groove, so that two silver copper soldering lugs distributed adjacently are completely blocked, and the problem that after the surface of the ceramic plate is supported on the silver copper soldering lugs, the solder resist can not completely block the two silver copper soldering lugs distributed adjacently, and the adjacent two copper sheets are connected by the silver copper soldering lugs in a fluid state in the welding process, so that the adjacent two copper sheets are short-circuited is solved; more importantly, before the floating extrusion plate extrudes the solder resist in the solder resist preassembling groove, the upper pressing plate is tightly pressed on the silver copper soldering lug and the copper sheet, so that the possible gaps between the silver copper soldering lug and the copper sheet and between the silver copper soldering lug and the ceramic plate are eliminated, and the solder resist extruded in the solder resist preassembling groove cannot be extruded into the space between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate, so that the problem that the welding quality of the copper sheet is affected due to the fact that some solder resist is extruded into the space between the silver copper soldering lug and the copper sheet and/or between the silver copper soldering lug and the ceramic plate under the extrusion action of the ceramic plate is solved.
Further, when the floating extrusion plate is supported on the bottom surface of the solder resist preassembling groove, the distance between the upper surface of the floating extrusion plate and the notch of the solder resist preassembling groove is greater than or equal to the distance between the lower end of the ejector rod and the inner top surface of the accommodating groove. Therefore, the problem that the floating extrusion plate is contacted with the ceramic plate in the process that the floating top plate drives the ejector rod and the floating extrusion plate to move upwards together can be avoided.
As shown in fig. 2, the vertical guide holes 4.6 are first-stage stepped holes with smaller inner diameters and larger inner diameters, the compression springs 4.1 are sleeved on the vertical guide rods in a one-to-one correspondence manner, the lower ends of the compression springs are propped against the floating top plate, and the upper ends of the compression springs are propped against the step surfaces of the first-stage stepped holes. Thus, during the upward movement of the floating roof, the compression spring can be accommodated in the vertical guide hole, so that the floating roof can be abutted against the inner top surface of the accommodating groove.
As shown in fig. 3, the edge of the supporting plate 4.4 is provided with mounting protruding blocks 4.10 corresponding to the strip-shaped inserting openings one by one, the strip-shaped inserting openings 4.9 are arranged on the larger mounting protruding blocks, and the same side of each strip-shaped inserting opening groove is opened. Thus, the mounting and the dismounting of the support plate are convenient.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any simple modification, variation and equivalent transformation of the above embodiment according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.
Claims (9)
1. The utility model provides a high heat conduction copper-clad ceramic substrate's welding device which characterized in that includes:
the ceramic plate limiting groove used for limiting the ceramic plate is formed in the upper surface of the substrate, and a plurality of copper sheet limiting grooves used for limiting the copper sheets are formed in the bottom surface of the ceramic plate limiting groove;
the solder resist preassembling grooves are arranged on the bottom surface of the ceramic plate limiting groove, a solder resist preassembling groove is arranged between any two adjacent copper sheet limiting grooves, and the two adjacent copper sheet limiting grooves are separated by the solder resist preassembling groove;
the upper pressing plate is positioned above the ceramic plate limiting groove and used for pressing the ceramic plate limited in the ceramic plate limiting groove;
a floating pressing device and a solder resist extruding device,
the floating pressing device comprises a compression spring, a containing groove arranged on the lower surface of the base plate, a plurality of vertical guide holes which are arranged on the upper surface of the base plate and are communicated with the containing groove, vertical guide rods which are arranged in the vertical guide holes in a one-to-one correspondence sliding manner, a middle limiting block and an upper limiting block which are arranged on the vertical guide rods, a support flat plate positioned above the upper pressing plate, a locking bolt arranged in the middle of the support flat plate and a floating top plate positioned in the containing groove, wherein the lower end of the vertical guide rods is connected with the floating top plate, the middle limiting block is positioned above the base plate, the middle limiting block is propped against the upper surface of the base plate under the action of the compression spring, strip-shaped sockets which are in one-to-one correspondence with the vertical guide rods are arranged on the support flat plate, the vertical guide rods are inserted in the corresponding strip-shaped sockets, and the support flat plate is positioned below the upper limiting block;
the solder resist extrusion device comprises a floating extrusion plate arranged in a solder resist preassembling groove, a vertical ejector rod via hole arranged on the bottom surface of the solder resist preassembling groove and communicated with the accommodating groove, and an ejector rod arranged in the vertical ejector rod via hole in a sliding way, wherein the ejector rod is positioned above the floating top plate,
when the limiting block is propped against the upper surface of the base plate and the floating extrusion plate is supported on the bottom surface of the solder resist preassembling groove under the action of dead weight, the lower end of the ejector rod stretches into the accommodating groove, and a gap is reserved between the lower end of the ejector rod and the floating top plate.
2. The soldering apparatus for copper-clad ceramic substrates with high thermal conductivity according to claim 1, wherein when the floating extrusion plate is supported on the bottom surface of the solder resist pre-loading groove, the distance between the upper surface of the floating extrusion plate and the notch of the solder resist pre-loading groove is equal to or greater than the distance between the lower end of the ejector pin and the inner top surface of the accommodating groove.
3. The welding device of the high-heat-conductivity copper-clad ceramic substrate according to claim 1 or 2, wherein the vertical guide holes are first-stage step holes with smaller inner diameters and larger lower diameters, the compression springs are sleeved on the vertical guide rods in a one-to-one correspondence mode, the lower ends of the compression springs are abutted to the floating top plate, and the upper ends of the compression springs are abutted to the step surfaces of the first-stage step holes.
4. The welding device for the high-heat-conductivity copper-clad ceramic substrate according to claim 1 or 2, wherein the edge of the supporting plate is provided with mounting lugs corresponding to the strip-shaped sockets one by one, the strip-shaped sockets are arranged on the larger mounting lugs, and the same side of each strip-shaped socket groove is opened.
5. The welding device for the high-heat-conductivity copper-clad ceramic substrate according to claim 1 or 2, wherein the middle limiting block is located in the middle of the vertical guide rod, and the upper limiting block is located at the upper end of the vertical guide rod.
6. The soldering apparatus for copper-clad ceramic substrates with high thermal conductivity according to claim 1 or 2, wherein the solder resist pressing means corresponds to the solder resist pre-loading grooves one by one.
7. The welding device for the high-heat-conductivity copper-clad ceramic substrate according to claim 1 or 2, wherein the groove depth of the ceramic plate limiting groove is smaller than the thickness of the ceramic plate.
8. The bonding apparatus for a copper-clad ceramic substrate with high thermal conductivity according to claim 1 or 2, wherein the substrate is a graphite substrate.
9. The welding device for the high-heat-conductivity copper-clad ceramic substrate according to claim 1 or 2, wherein the upper pressing plate is a graphite plate.
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