CN113996878B - Fixed fixture applied to reflow soldering of Metal Oxide Semiconductor (MOS) tube aluminum substrate - Google Patents
Fixed fixture applied to reflow soldering of Metal Oxide Semiconductor (MOS) tube aluminum substrate Download PDFInfo
- Publication number
- CN113996878B CN113996878B CN202111464768.0A CN202111464768A CN113996878B CN 113996878 B CN113996878 B CN 113996878B CN 202111464768 A CN202111464768 A CN 202111464768A CN 113996878 B CN113996878 B CN 113996878B
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- Prior art keywords
- bottom plate
- template
- holes
- mos tube
- positioning
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 39
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 238000005476 soldering Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 title abstract description 27
- 229910044991 metal oxide Inorganic materials 0.000 title description 2
- 150000004706 metal oxides Chemical class 0.000 title description 2
- 239000004065 semiconductor Substances 0.000 title description 2
- 238000003825 pressing Methods 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 12
- 238000003466 welding Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a fixed fixture for reflow soldering of an aluminum substrate of an MOS tube, which comprises a bottom plate, wherein the bottom plate is provided with a caulking groove for embedding the aluminum substrate, a template is detachably connected above the bottom plate, the template and the bottom plate are positioned by positioning pins, the positioning template is provided with a plurality of MOS tube positioning holes and a plurality of nut positioning holes, the plurality of MOS tube positioning holes correspond to the caulking groove on the bottom plate, and the plurality of nut positioning holes also correspond to the caulking groove on the bottom plate. The fixing clamp can fix the positions of the MOS tube and the aluminum substrate, ensure that the relative positions of the MOS tube and the aluminum substrate are not changed in the reflow soldering process, and finally obtain the high-quality aluminum-based MOS tube assembly.
Description
Technical Field
The invention relates to a fixed fixture applied to reflow soldering of an aluminum substrate of an MOS tube.
Background
The high-power MOS tube is serious in heating, so that the MOS tube is required to be cooled by using the cooling fin, but the MOS tube is conventionally fixed by adopting a screw and the cooling fin directly, so that the risk of short circuit exists, the current novel installation mode is to weld the MOS tube on the aluminum substrate in advance, then connect the integral structure of the aluminum substrate and the MOS tube to the cooling fin, thereby realizing the cooling of the MOS tube, and the MOS tube can be effectively prevented from short circuit due to the good insulating layer arranged on the aluminum substrate, thereby having good insulating effect on the MOS tube.
When welding MOS pipe and aluminium base board, adopt the reflow soldering to weld generally, but before the reflow soldering, the position of MOS pipe and aluminium base board can not fix, and though there is the solder paste to carry out simple adhesion between the two, the unable control MOS pipe takes place the displacement at the reflow soldering in-process, leads to the final product, and the position of MOS pipe can appear the microelement skew, leads to the MOS pipe pin when follow-up use, corresponds the problem on with the terminal on the PCB board.
Disclosure of Invention
The invention aims to solve the technical problems that: the fixing clamp is used for fixing the positions of the MOS tube and the aluminum substrate, so that the relative positions of the MOS tube and the aluminum substrate are not changed in the reflow soldering process, and finally the high-quality aluminum-based MOS tube assembly is obtained.
In order to solve the technical problems, the invention adopts the following technical scheme: be applied to fixed mounting anchor clamps of aluminium base board reflow soldering of MOS pipe, including the bottom plate, set up the caulking groove that is used for inlaying to establish aluminium base board on the bottom plate, bottom plate top detachably is connected with the template, and the template passes through the locating pin location with the bottom plate, has seted up a plurality of MOS pipe locating holes and a plurality of nut locating holes on the locating template, and a plurality of MOS pipe locating holes correspond with the caulking groove on the bottom plate, and a plurality of nut locating holes also correspond with the caulking groove on the bottom plate.
As a preferable scheme, one side of the caulking groove extends to the edge of the bottom plate along the width direction of the caulking groove, a discharge opening is formed at the edge of the bottom plate, and a baffle strip for inserting the discharge opening is arranged on the surface, facing the bottom plate, of the template.
As a preferable scheme, a cover plate is detachably connected above the template, one side of the cover plate, which is opposite to the template, is provided with elastic pressing blocks corresponding to the MOS tube positioning holes and the nut positioning holes one by one, and when the bottom plate, the template and the cover plate are connected with each other, the elastic pressing blocks are pressed on the MOS tubes in the corresponding MOS tube positioning holes or the nuts in the corresponding nut positioning holes.
As a preferable scheme, be provided with a plurality of subdivisions on the bottom plate and be provided with the locating hole down of caulking groove all around, be provided with the locating hole down with locating hole one-to-one on the template, be provided with the locating pin with locating hole one-to-one down on the apron, be provided with annular assembly groove down in the locating hole, the assembly inslot card is equipped with the jump ring, jump ring part protrusion outside the assembly groove, stretch into in the locating hole down, the locating pin free end is provided with annular draw-in groove, when the locating pin passed the locating hole and inserts down the locating hole, in the jump ring card income draw-in groove, make bottom plate, template and apron link together.
As a preferable scheme, when the locating pin is clamped with the clamp spring, the lower end of the locating pin extends out of the lower portion of the bottom plate.
As a preferable scheme, one surface of the cover plate, which is opposite to the template, is provided with pin holes corresponding to the positioning pins one by one, any one pin hole is coaxially arranged with the corresponding positioning pin, the diameter of the positioning pin is not greater than that of the pin hole, and the depth of the pin hole is smaller than the length of the positioning pin extending out of the lower part of the bottom plate.
As a preferred scheme, when the jump ring joint of locating pin lower extreme and lower locating hole, have the clearance between apron and the template, the height of clearance is not less than the thickness of MOS pipe and nut, the blend stop has two, is located the both sides of discharge opening respectively, and all MOS pipe locating holes and nut locating hole all set up between two blend stops, and the blend stop height is not greater than the degree of depth of caulking groove, the briquetting is connected with the one end of apron connection, is connected through the elastic component between base and the apron, and the base lower extreme face is relative with the template upper surface.
The beneficial effects of the invention are as follows: according to the invention, the caulking groove for positioning the aluminum substrate is arranged on the bottom plate, the MOS tube positioning hole and the nut positioning hole for positioning the MOS tube and the nut are arranged on the template, and the bottom plate and the template are positioned and involuted through the positioning pin, so that the positions of the MOS tube and the aluminum substrate are fixed, the relative positions of the MOS tube and the aluminum substrate are not changed in the reflow soldering process, and finally the high-quality aluminum-based MOS tube assembly is obtained.
Drawings
The invention is described in further detail below with reference to the attached drawing figures, wherein:
FIG. 1 is a schematic view of an exploded construction of a piece of furniture according to the present invention;
FIG. 2 is a partial cross-sectional view of a base plate;
FIG. 3 is a schematic view showing an assembled state structure of a first embodiment of the fixing clamp according to the present invention;
FIG. 4 is a schematic view showing an assembled state structure of a second embodiment of the fixing jig according to the present invention;
In fig. 1 to 4: 1. the metal-plastic composite material comprises a bottom plate, 2, caulking grooves, 3, templates, 4, positioning pins, 5, MOS tube positioning holes, 6, nut positioning holes, 7, a discharge opening, 8, a stop bar, 9, a cover plate, 10, a pressing block, 11, a lower positioning hole, 12, an upper positioning hole, 13, a pin hole, 14, an assembly groove, 15, a clamp spring, 16, a clamping groove, 17, a base, 18, an elastic piece, 100, an aluminum substrate, 200, MOS tubes, 300 and a nut.
Detailed Description
Specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Example 1:
As shown in fig. 1-3, the fixing clamp applied to reflow soldering of an aluminum substrate of a MOS tube comprises a bottom plate 1, a caulking groove 2 for embedding the aluminum substrate 100 is formed in the bottom plate 1, a template 3 is detachably connected to the upper side of the bottom plate 1, the template 3 and the bottom plate 1 are positioned through positioning pins 4, a plurality of MOS tube positioning holes 5 and a plurality of nut positioning holes 6 are formed in the template 3, the plurality of MOS tube positioning holes 5 correspond to the caulking groove 2in the bottom plate 1, and the plurality of nut positioning holes 6 also correspond to the caulking groove 2in the bottom plate 1.
One side of the caulking groove 2 extends to the edge of the bottom plate 1 along the width direction, a discharge opening 7 is formed at the edge of the bottom plate 1, and after the aluminum substrate 100, the MOS tube 200 and the nut 300 are welded, the template 3 and the bottom plate 1 are loosened, the aluminum substrate 100 can be removed from the discharge opening 7, so that the convenience of discharging is improved. In order to avoid inaccurate positioning of the aluminum substrate 100 caused by adding the discharge opening 7, in this embodiment, a barrier strip 8 for inserting the discharge opening 7 is arranged on one surface of the template 3 opposite to the bottom plate 1, and when the template 3 is connected with the bottom plate 1, the barrier strip 8 is inserted into the discharge opening 7 to block the aluminum substrate 100, so that the aluminum substrate 100 is prevented from moving in the welding process, and the welding quality is ensured.
In order to avoid the occurrence of cold welding in the welding process, in this embodiment, a cover plate 9 is further detachably connected above the template 3, one surface of the cover plate 9, which is opposite to the template 3, is provided with elastic pressing blocks 10 corresponding to the MOS tube positioning holes 5 and the nut positioning holes 6 one by one, and when the bottom plate, the template 3 and the cover plate 9 are mutually connected, the elastic pressing blocks 10 are in press connection with the MOS tubes 200 in the corresponding MOS tube positioning holes 5 or the nuts 300 in the corresponding nut positioning holes 6, so that the MOS tubes 200 and the nuts 300 are respectively clung to the aluminum substrate 100 in the welding process, and the welding quality is ensured.
In this embodiment, a plurality of lower locating holes 11 distributed around the caulking groove 2 are formed in the bottom plate 1, upper locating holes 12 corresponding to the lower locating holes 11 one by one are formed in the template 3, locating pins 4 corresponding to the lower locating holes 11 one by one are formed in the cover plate 9, annular assembling grooves 14 are formed in the lower locating holes 11, clamping springs 15 are clamped in the assembling grooves 14, part of the clamping springs 15 protrudes out of the assembling grooves 14 and stretches into the lower locating holes 11, annular clamping grooves 16 are formed in the free ends of the locating pins 4, and when the locating pins 4 penetrate through the upper locating holes 12 and are inserted into the lower locating holes 11, the clamping springs 15 are clamped into the clamping grooves 16, so that the bottom plate 1, the template 3 and the cover plate 9 are connected together, and the locating pins 4 play a role in locating and connecting simultaneously.
In this embodiment, it is still further preferable to set the length of the positioning pin 4, and in this embodiment, when the positioning pin 4 is engaged with the clamp spring 15, the lower end of the positioning pin 4 extends below the bottom plate 1. The separation of the locating pin 4 and the lower locating hole 11 is facilitated, and the locating pin 4 can be moved upwards only by abutting the lower end of the locating pin 4 on a table top and pressing the bottom plate 1 with force, so that the clamping groove 16 is separated from the clamping spring 15, and the cover plate 9, the template 3 and the bottom plate 1 are separated conveniently.
In the reflow soldering, a large number of fixing jigs are used together, so in this embodiment, it is further preferable that a pin hole 13 corresponding to the positioning pin 4 one by one is provided on one surface of the cover plate 9 facing away from the die plate 3, any pin hole 13 is coaxially provided with the corresponding positioning pin 4, the diameter of the positioning pin 4 is not larger than the diameter of the pin hole 13, so that the fixing jigs are stacked, and the positioning pin 4 exposed from the bottom of the upper fixing jigs can be inserted into the pin hole 13 on the cover plate 9 of the lower fixing jigs. The depth of the pin hole 13 is smaller than the length of the positioning pin 4 extending out of the lower part of the bottom plate 1, so that heat can enter between the two layers of fixed clamps, and the aluminum substrate 100, the MOS tube 200 and the nut 300 can be reliably welded.
The working procedure of this embodiment is: firstly, an aluminum substrate 100 is placed in a caulking groove 2 on a bottom plate 1, the caulking groove 2 is attached to one side far away from a discharge opening 7, then a template 3 is covered, solder paste is coated on positions, on which an MOS tube 200 and a nut 300 are attached, of the aluminum substrate 100 through each MOS tube positioning hole 5 and each nut positioning hole 6, then the MOS tube 200 and the nut 300 are embedded into the corresponding MOS tube positioning hole 5 and the corresponding nut positioning hole 6, finally a cover plate 9 is covered, a positioning pin 4 on the cover plate 9 penetrates through an upper positioning hole 12 and is inserted into a lower positioning hole 11 until a clamping spring 15 in the lower positioning hole 11 is clamped into a clamping groove 16 on the positioning pin 4, and the installation is finished.
And stacking a plurality of installed fixed fixtures, and entering reflow soldering equipment for reflow soldering.
After the reflow soldering is completed, the cover plate 9 and the template 3 are disassembled, and the soldered aluminum-based MOS tube assembly is removed from the discharge opening 7. When the discharge opening 7 is not arranged on the bottom plate 1, the aluminum-based MOS tube assembly can be poured out by turning over the bottom plate 1.
Example 2
This embodiment is substantially the same as embodiment 1 except that: in this embodiment, when the clamping groove 16 of the locating pin 4 is clamped with the clamping spring 15, a gap is formed between the cover plate 9 and the template 3, the height of the gap is greater than the thickness of the MOS tube 200 and the nut 300, two blocking strips 8 are respectively positioned on two sides of the discharge opening 7, all the MOS tube locating holes 5 and the nut locating holes 6 are respectively arranged between the two blocking strips 8, the height of the blocking strips 8 is not greater than the depth of the caulking groove 2, one end of the pressing block 10 connected with the cover plate 9 is connected with the base 17, the base 17 is connected with the cover plate 9 through the elastic piece 18, the elastic piece 18 can be a spring, a rubber pad or a sponge, the base 17 can be used as the elastic piece 18 when the base 17 is elastic. The lower end surface of the base 17 and the upper surface of the template 3 can move up and down along the locating pin 4 relative to the template 3, when the template 3 moves upwards, the base 17 can be jacked upwards, the pressing block 10 is separated from the MOS tube 200 and the nut 300, and the template 3 can move above the MOS tube 200 and the nut 300 entirely.
The working procedure of this embodiment is: the working process between welding and finishing is the same as that of embodiment 1, except that in this embodiment, the unloading process does not need to detach the cover plate 9 and the template 3 from the bottom plate 1, only needs to move the template 3 upward to the upper part of the MOS tube 200 and the nut 300 along the locating pin 4, and simultaneously lifts up the base 17 to separate the press block 10 from the MOS tube 200 and the nut 300, and then only needs to incline the whole fixing clamp to one side of the unloading opening 7, so that the welded aluminum-based MOS tube assembly can be removed from the unloading opening. The unloading process of this embodiment technical scheme is more swift convenient, and the back is accomplished in unloading moreover, and bottom plate 1, template 3 and apron 9 still are in an organic whole state, are convenient for accomodate, are difficult for chaotic.
The above embodiments are merely illustrative of the principles and effects of the present invention, and some of the applied embodiments, and are not intended to limit the invention; it should be noted that modifications and improvements can be made by those skilled in the art without departing from the inventive concept, and these are all within the scope of the present invention.
Claims (3)
1. Be applied to fixed mounting anchor clamps of MOS pipe aluminium base board reflow soldering, a serial communication port, including bottom plate (1), set up on bottom plate (1) and be used for inlaying caulking groove (2) of establishing aluminium base board (100), bottom plate (1) top detachably is connected with template (3), template (3) are fixed a position through locating pin (4) with bottom plate (1), set up a plurality of MOS pipe locating holes (5) and a plurality of nut locating holes (6) on template (3), a plurality of MOS pipe locating holes (5) correspond with caulking groove (2) on bottom plate (1), a plurality of nut locating holes (6) also correspond with caulking groove (2) on bottom plate (1);
One side of the caulking groove (2) extends to the edge of the bottom plate (1) along the width direction of the caulking groove, a discharge opening (7) is formed at the edge of the bottom plate (1), and a baffle strip (8) for inserting the discharge opening (7) is arranged on one surface of the template (3) opposite to the bottom plate (1);
A cover plate (9) is detachably connected above the template (3), one surface of the cover plate (9) opposite to the template (3) is provided with elastic pressing blocks (10) corresponding to the MOS tube positioning holes (5) and the nut positioning holes (6) one by one, and when the bottom plate, the template (3) and the cover plate (9) are connected with each other, the elastic pressing blocks (10) are pressed on the MOS tube (200) in the corresponding MOS tube positioning hole (5) or the nut (300) in the corresponding nut positioning hole (6);
The bottom plate (1) is provided with a plurality of lower locating holes (11) distributed around the caulking groove (2), the template (3) is provided with upper locating holes (12) which are in one-to-one correspondence with the lower locating holes (11), the cover plate (9) is provided with locating pins (4) which are in one-to-one correspondence with the lower locating holes (11), the lower locating holes (11) are internally provided with annular assembly grooves (14), the assembly grooves (14) are internally clamped with clamp springs (15), part of the clamp springs (15) protrude out of the assembly grooves (14) and extend into the lower locating holes (11), the free ends of the locating pins (4) are provided with annular clamping grooves (16), and when the locating pins (4) penetrate through the upper locating holes (12) and are inserted into the lower locating holes (11), the clamp springs (15) are clamped into the clamping grooves (16), so that the bottom plate (1), the template (3) and the cover plate (9) are connected together;
One surface of the cover plate (9) back to the template (3) is provided with pin holes (13) corresponding to the positioning pins (4) one by one, any one of the pin holes (13) and the corresponding positioning pin (4) are coaxially arranged, and the depth of the pin hole (13) is smaller than the length of the positioning pin (4) extending out of the lower part of the bottom plate (1).
2. The fixed mounting clamp according to claim 1, wherein when the positioning pin (4) is clamped with the clamp spring (15), the lower end of the positioning pin (4) extends out of the lower portion of the bottom plate (1).
3. The fixed mounting clamp according to claim 1, wherein when the clamping groove (16) of the positioning pin (4) is clamped with the clamping spring (15), a gap is formed between the cover plate (9) and the template (3), the height of the gap is not smaller than the thickness of the MOS tube (200) and the nut (300), the two baffle strips (8) are respectively arranged at two sides of the discharge opening (7), all the MOS tube positioning holes (5) and the nut positioning holes (6) are respectively arranged between the two baffle strips (8), the height of the baffle strips (8) is not larger than the depth of the caulking groove (2), a base (17) is connected to one end, connected with the cover plate (9), of the pressing block (10), the base (17) is connected with the cover plate (9) through an elastic piece (18), and the lower end face of the base (17) is opposite to the upper surface of the template (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111464768.0A CN113996878B (en) | 2021-12-03 | 2021-12-03 | Fixed fixture applied to reflow soldering of Metal Oxide Semiconductor (MOS) tube aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111464768.0A CN113996878B (en) | 2021-12-03 | 2021-12-03 | Fixed fixture applied to reflow soldering of Metal Oxide Semiconductor (MOS) tube aluminum substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113996878A CN113996878A (en) | 2022-02-01 |
| CN113996878B true CN113996878B (en) | 2024-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111464768.0A Active CN113996878B (en) | 2021-12-03 | 2021-12-03 | Fixed fixture applied to reflow soldering of Metal Oxide Semiconductor (MOS) tube aluminum substrate |
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| Country | Link |
|---|---|
| CN (1) | CN113996878B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216912417U (en) * | 2021-12-03 | 2022-07-08 | 张家港华捷电子有限公司 | Be applied to aluminium base board reflow soldering's of MOS pipe surely anchor clamps |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4985549B2 (en) * | 2008-06-06 | 2012-07-25 | 日産自動車株式会社 | Work positioning device |
| CN209897388U (en) * | 2019-01-22 | 2020-01-03 | 大佳田(上海)技术有限公司 | Stable MOS pipe is crossed reflow oven tool |
| CN109920755B (en) * | 2019-02-25 | 2021-01-05 | 天津大学 | Nano-silver solder paste low-pressure auxiliary sintering clamp and method |
| CN211352587U (en) * | 2019-10-25 | 2020-08-25 | 苏州华之杰电讯股份有限公司 | MOS (metal oxide semiconductor) tube mounting structure applied to electric tool switch |
| CN214685009U (en) * | 2021-04-30 | 2021-11-12 | 中国振华集团永光电子有限公司（国营第八七三厂） | Micro pipe anchor clamps for bonding wire |
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2021
- 2021-12-03 CN CN202111464768.0A patent/CN113996878B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216912417U (en) * | 2021-12-03 | 2022-07-08 | 张家港华捷电子有限公司 | Be applied to aluminium base board reflow soldering's of MOS pipe surely anchor clamps |
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| CN113996878A (en) | 2022-02-01 |
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