CN113573480B - Method for printing solder paste on two sides of DBC ceramic copper-clad plate - Google Patents
Method for printing solder paste on two sides of DBC ceramic copper-clad plate Download PDFInfo
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- CN113573480B CN113573480B CN202110810835.3A CN202110810835A CN113573480B CN 113573480 B CN113573480 B CN 113573480B CN 202110810835 A CN202110810835 A CN 202110810835A CN 113573480 B CN113573480 B CN 113573480B
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- printing
- solder paste
- dbc
- nickel
- placing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to the field of solder paste printing, in particular to a method for printing solder paste on two sides of a DBC ceramic copper-clad plate, which comprises the following steps: step 1, printing solder paste on a nickel-plated aluminum plate by utilizing a printing steel screen; step 2, reserving solder paste printing areas on the front surface and the back surface of the DBC; step 3, placing the back of the DBC on a transfer plate; step 4, reversely buckling the nickel-plated aluminum plate on the transfer plate, and turning over to transfer the DBC to the position of the nickel-plated aluminum plate where the solder paste is printed; step 5, placing the nickel-plated aluminum plate on a printing tray; step 6, placing the printing support on a nickel-plated aluminum plate; step 7, printing solder paste on the front surface of the DBC by utilizing a printing steel mesh; step 8, after the DBC finishes printing the solder paste, taking away the printing steel mesh and placing the single-tube positioning clamp on the nickel-plated aluminum plate; step 9, placing the single tube on the DBC. Solves the problems of poor thickness accuracy and unfixed shape when the solder paste is printed on the two sides of the DBC.
Description
Technical Field
The application relates to the field of solder paste printing, in particular to a method for printing solder paste on two sides of a DBC ceramic copper-clad plate.
Background
The traditional large-size PCB or DBC is heavy and cannot be adhered to a steel mesh by solder paste when the solder paste is printed. The small-size DBC has the defects of inaccurate printed image and uneven solder paste thickness due to light weight, large printing area occupation ratio and poor adhesion on a steel mesh during printing, and the printed DBC cannot be used.
Disclosure of Invention
Based on the problems, the application provides a method for printing solder paste on both sides of a DBC ceramic copper-clad plate, which solves the problems of poor thickness accuracy and unfixed shape when the solder paste is printed on both sides of the DBC ceramic copper-clad plate.
In order to solve the technical problems, the application adopts the following technical scheme:
a method for printing solder paste on two sides of a DBC ceramic copper-clad plate comprises the following steps:
step 1, printing solder paste on a nickel-plated aluminum plate by utilizing a printing steel screen;
step 2, reserving solder paste printing areas on the front surface and the back surface of the DBC;
step 3, placing the back of the DBC on a transfer plate;
step 4, reversely buckling the nickel-plated aluminum plate on the transfer plate, and turning over to transfer the DBC to the position of the nickel-plated aluminum plate where the solder paste is printed;
step 5, placing the nickel-plated aluminum plate on a printing tray;
step 6, placing the printing support on a nickel-plated aluminum plate;
step 7, printing solder paste on the front surface of the DBC by utilizing a printing steel mesh;
step 8, after the DBC finishes printing the solder paste, taking away the printing steel mesh and placing the single-tube positioning clamp on the nickel-plated aluminum plate;
step 9, placing the single tube on the DBC.
Further, the area of the back solder paste printing area of the DBC is larger than that of the front solder paste printing area, and the total adhesive force of the back solder paste is larger than that of the front.
Further, the DBC is rectangular.
Further, a plurality of placing grooves are formed in the transfer plate and used for placing DBCs.
Further, a plurality of rectangular holes are formed in the printing support.
Further, the printing steel mesh is composed of a plurality of ribs, the printing steel mesh comprises transverse thick ribs and vertical thin ribs, and the thick ribs and the thin ribs form a plurality of rectangular printing grooves for printing solder paste.
Further, the thickness of the printing steel mesh was 0.3mm.
Compared with the prior art, the application has the beneficial effects that: the special-shaped steel mesh is designed to form thin ribs so that the generated soldering flux is converged into thick ribs, the thick ribs are formed to reduce the amount of solder paste and accelerate the soldering flux to flow out, and finally, the welding layer with low cavity rate and thinner tin thickness is welded.
Simultaneously, accomplish DBC double-sided printing tin cream through the flow that follow-up transfer plate and printing support combined together, adjust the printing tin thickness through support thickness, the extrusion force of steel mesh avoids DBC back tin cream to warp when the muscle of support bears the printing, because DBC back covers copper area and is greater than the front, place the support printing back, back tin cream total adhesion is greater than the front, DBC can not adhere on the steel mesh, the position of single tube has been fixed a position to single tube positioning fixture, each step has realized accurate location.
Drawings
Fig. 1 is a schematic structural view of the present embodiment;
fig. 2 is a schematic structural view of the printing steel mesh of the present embodiment.
Nickel plating aluminum plate 1, printing steel mesh 2, thick ribs 201, thin ribs 202, printing groove 203, transfer plate 3, printing support 4 and printing tray 5.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that, directions or positional relationships indicated by terms such as "inner", "outer", "upper", "lower", "horizontal", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. Features of the embodiments described below may be combined with each other without conflict.
Example 1
The application provides a die for plating solder paste on two sides of a planar nickel-plated aluminum plate 1+DBC+single tube before welding, which is shown in fig. 1, and comprises a nickel-plated aluminum plate 1, a printing steel mesh 2, a transfer plate 3, a printing bracket 4 and a printing tray 5, in particular:
and meanwhile, considering the factors such as creepage distance, heat dissipation and the like, the area of the solder paste printing area on the back of the DBC is larger than that of the solder paste printing area on the front, and the total adhesive force of the solder paste on the back is larger than that on the front. In this embodiment, the solder paste printing area is rectangular in shape.
As shown in fig. 2, the printing steel mesh 2 is used for printing solder paste, and is composed of a plurality of ribs, wherein the ribs comprise a transverse thick rib 201 and a vertical thin rib 202, the thick rib 201 and the thin rib 202 form a plurality of rectangular printing grooves 203 for printing solder paste, and the thickness of the printing steel mesh 2 is 0.3mm; in this embodiment, the large-sized DBC and device welding is large in welding surface, the solder paste volatilizes a large amount of flux in the melting process, if flux is not effectively led out, the welding void ratio is increased, welding failure is caused, thick ribs 201 are opened in the middle of a welding disc of a printed steel mesh 2 to reduce the amount of solder paste and accelerate flux to flow out, flux generated at thin ribs 202 is converged into the thick ribs 201, and finally, a welding layer with low void ratio and thinner tin thickness is welded.
The nickel-plated aluminum plate 1 is used for placing the transfer plate 3, the printing support 4 and the single-tube positioning clamp, and after the die is fixed, the nickel-plated aluminum plate 1 is placed on the printing tray 5 to perform the double-sided solder paste printing operation of the DBC ceramic copper-clad plate;
the transfer plate 3 is provided with a plurality of placing grooves for placing DBCs, the transfer plate 3 can be flexibly designed according to different patch positions, the price is low, the manufacturing period is short, and the method is particularly suitable for manufacturing small-batch samples in the research and development stage;
the printing support 4 is provided with a plurality of rectangular holes, the rectangular holes leak out of the front face of the DBC, the extrusion force of the printing steel mesh 2 during printing is born through ribs of the printing support 4 to avoid the deformation of solder paste on the back face of the DBC, and meanwhile, the copper-coated area on the back face of the DBC is larger than that of the front face, and after the support is placed for printing, the DBC cannot be adhered to the printing steel mesh 2.
Example 2
A method for printing solder paste on two sides of a DBC ceramic copper-clad plate comprises the following steps:
step 1, printing solder paste on a nickel-plated aluminum plate by utilizing a printing steel screen;
step 2, reserving solder paste printing areas on the front surface and the back surface of the DBC;
step 3, placing the back of the DBC on a transfer plate;
step 4, reversely buckling the nickel-plated aluminum plate on the transfer plate, and turning over to transfer the DBC to the position of the nickel-plated aluminum plate where the solder paste is printed;
step 5, placing the nickel-plated aluminum plate on a printing tray;
step 6, placing the printing support on a nickel-plated aluminum plate;
step 7, printing solder paste on the front surface of the DBC by utilizing a printing steel mesh;
step 8, after the DBC finishes printing the solder paste, taking away the printing steel mesh and placing the single-tube positioning clamp on the nickel-plated aluminum plate;
step 9, placing the single tube on the DBC.
The above is an embodiment of the present application. The above embodiments and specific parameters in the embodiments are only for clearly describing the inventive verification process of the inventor, and are not intended to limit the scope of the application, which is defined by the claims, and all equivalent structural changes made by applying the descriptions and the drawings of the application are included in the scope of the application.
Claims (5)
1. The method for printing solder paste on the two sides of the DBC ceramic copper-clad plate is characterized by comprising the following steps of: step 1, printing solder paste on a nickel-plated aluminum plate by utilizing a printing steel screen; step 2, reserving solder paste printing areas on the front surface and the back surface of the DBC; step 3, placing the back of the DBC on a transfer plate; step 4, reversely buckling the nickel-plated aluminum plate on the transfer plate, and turning over to transfer the DBC to the position of the nickel-plated aluminum plate where the solder paste is printed; step 5, placing the nickel-plated aluminum plate on a printing tray; step 6, placing the printing support on a nickel-plated aluminum plate; step 7, printing solder paste on the front surface of the DBC by utilizing a printing steel mesh; step 8, after the DBC finishes printing the solder paste, taking away the printing steel mesh and placing the single-tube positioning clamp on the nickel-plated aluminum plate; step 9, placing the single tube on the DBC;
the area of the back solder paste printing area of the DBC is larger than that of the front solder paste printing area, and the total adhesive force of the back solder paste is larger than that of the front; the DBC is rectangular.
2. The method for printing solder paste on the two sides of the DBC ceramic copper-clad plate according to claim 1, which is characterized in that: the transfer plate is provided with a plurality of placing grooves for placing DBCs.
3. The method for printing solder paste on the two sides of the DBC ceramic copper-clad plate according to claim 2, which is characterized in that: the printing support is provided with a plurality of rectangular holes.
4. The method for printing solder paste on both sides of the DBC ceramic copper-clad plate according to claim 3, wherein the method comprises the following steps: the printing steel mesh is composed of a plurality of ribs, and comprises transverse thick ribs and vertical thin ribs, wherein the thick ribs and the thin ribs form a plurality of rectangular printing grooves for printing solder paste.
5. The method for printing solder paste on the two sides of the DBC ceramic copper-clad plate according to claim 4, which is characterized in that: the thickness of the printing steel mesh is 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110810835.3A CN113573480B (en) | 2021-07-16 | 2021-07-16 | Method for printing solder paste on two sides of DBC ceramic copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110810835.3A CN113573480B (en) | 2021-07-16 | 2021-07-16 | Method for printing solder paste on two sides of DBC ceramic copper-clad plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113573480A CN113573480A (en) | 2021-10-29 |
| CN113573480B true CN113573480B (en) | 2023-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110810835.3A Active CN113573480B (en) | 2021-07-16 | 2021-07-16 | Method for printing solder paste on two sides of DBC ceramic copper-clad plate |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114260530A (en) * | 2021-12-27 | 2022-04-01 | 烟台台芯电子科技有限公司 | Welding process of large-area ceramic copper-clad plate based on IGBT module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN102734760A (en) * | 2011-04-13 | 2012-10-17 | 苏州世鼎电子有限公司 | Method for forming power connection points on metallic circuit by transferring solder pastes |
| CN211656562U (en) * | 2020-03-13 | 2020-10-09 | 广东芯聚能半导体有限公司 | Steel mesh and device for solder paste printing |
| CN112078232A (en) * | 2020-09-30 | 2020-12-15 | 成都赛力康电气有限公司 | DBC board double-sided printing tool and DBC board double-sided printing process |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374387B (en) * | 2007-08-24 | 2012-09-26 | 富葵精密组件(深圳)有限公司 | Method for welding electronic element on circuit board |
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2021
- 2021-07-16 CN CN202110810835.3A patent/CN113573480B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN102734760A (en) * | 2011-04-13 | 2012-10-17 | 苏州世鼎电子有限公司 | Method for forming power connection points on metallic circuit by transferring solder pastes |
| CN211656562U (en) * | 2020-03-13 | 2020-10-09 | 广东芯聚能半导体有限公司 | Steel mesh and device for solder paste printing |
| CN112078232A (en) * | 2020-09-30 | 2020-12-15 | 成都赛力康电气有限公司 | DBC board double-sided printing tool and DBC board double-sided printing process |
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| CN113573480A (en) | 2021-10-29 |
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