CN114629464A - 弹性波装置封装及包含弹性波装置的模块 - Google Patents

弹性波装置封装及包含弹性波装置的模块 Download PDF

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Publication number
CN114629464A
CN114629464A CN202210338284.XA CN202210338284A CN114629464A CN 114629464 A CN114629464 A CN 114629464A CN 202210338284 A CN202210338284 A CN 202210338284A CN 114629464 A CN114629464 A CN 114629464A
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CN
China
Prior art keywords
wave device
hole
elastic wave
wiring
mounting side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210338284.XA
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English (en)
Chinese (zh)
Inventor
门川裕
中村博文
熊谷浩一
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Sanyan Japan Technology Co ltd
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Sanyan Japan Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sanyan Japan Technology Co ltd filed Critical Sanyan Japan Technology Co ltd
Publication of CN114629464A publication Critical patent/CN114629464A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/205—Constructional features of resonators consisting of piezoelectric or electrostrictive material having multiple resonators

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202210338284.XA 2021-06-15 2022-04-01 弹性波装置封装及包含弹性波装置的模块 Pending CN114629464A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-099133 2021-06-15
JP2021099133A JP2022190738A (ja) 2021-06-15 2021-06-15 弾性波デバイスパッケージ、および弾性波デバイスを含むモジュール

Publications (1)

Publication Number Publication Date
CN114629464A true CN114629464A (zh) 2022-06-14

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ID=81905542

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CN202210338284.XA Pending CN114629464A (zh) 2021-06-15 2022-04-01 弹性波装置封装及包含弹性波装置的模块

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JP (1) JP2022190738A (https=)
CN (1) CN114629464A (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1611002A (zh) * 2001-12-28 2005-04-27 埃普科斯股份有限公司 结构高度低的封装元器件及制造方法
US20060220230A1 (en) * 2005-03-31 2006-10-05 Renesas Technology Corp. Semiconductor device and method of manufacturing thereof
JP2017022501A (ja) * 2015-07-08 2017-01-26 太陽誘電株式会社 弾性波デバイス、分波器、及びモジュール
CN110034740A (zh) * 2017-12-12 2019-07-19 株式会社村田制作所 电子部件模块

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091380A (ja) * 1998-09-09 2000-03-31 Mitsubishi Electric Corp フリップチップの実装構造
DE10104574A1 (de) * 2001-02-01 2002-08-08 Epcos Ag Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung
JP4238668B2 (ja) * 2003-08-07 2009-03-18 ソニー株式会社 半導体装置の製造方法
JP2008166884A (ja) * 2006-12-27 2008-07-17 Daishinku Corp 圧電振動デバイスの製造方法、およびその製造方法による圧電振動デバイス
JP2013225749A (ja) * 2012-04-20 2013-10-31 Kyocera Corp 圧電デバイス及びモジュール部品
JP6407102B2 (ja) * 2014-07-30 2018-10-17 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP7262743B2 (ja) * 2018-12-20 2023-04-24 三安ジャパンテクノロジー株式会社 弾性波デバイスを含むモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1611002A (zh) * 2001-12-28 2005-04-27 埃普科斯股份有限公司 结构高度低的封装元器件及制造方法
US20060220230A1 (en) * 2005-03-31 2006-10-05 Renesas Technology Corp. Semiconductor device and method of manufacturing thereof
JP2017022501A (ja) * 2015-07-08 2017-01-26 太陽誘電株式会社 弾性波デバイス、分波器、及びモジュール
CN110034740A (zh) * 2017-12-12 2019-07-19 株式会社村田制作所 电子部件模块

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JP2022190738A (ja) 2022-12-27

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