CN114624814B - Flexible electrocardio demodulation electron skin based on polymer photon integrated chip - Google Patents
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G02B2006/12142—Modulator
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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Abstract
The invention discloses a flexible electrocardio-demodulation electronic skin based on a polymer photon integrated chip, which structurally comprises the polymer photon integrated chip and a flexible demodulation circuit, wherein: the polymer photonic integrated chip comprises a polydimethylsiloxane substrate, and a light source array, an input grating coupler array, a multimode interference coupler, a Mach-Zehnder electro-optic modulator, an output grating coupler and a photoelectric detector which are arranged on the polydimethylsiloxane substrate and are mutually connected through an optical waveguide; the flexible demodulation circuit comprises a board layer, a circuit layer and a component layer. Compared with the prior art, the invention overcomes the defects of weak electromagnetic interference resistance and the like of the traditional electrical technology, can realize electrocardiosignal detection based on the optical technology, can better realize the compatibility with a wearable system by adopting a flexible material, and solves the problem that a rigid chip is not easy to attach to a human body.
Description
Technical Field
The invention relates to a polymer photon integrated chip, in particular to a flexible electrocardio-demodulation electronic skin based on the polymer photon integrated chip, which can be used for measuring electrocardiosignals of a human body.
Background
At present, various wearable medical monitoring sensors appear at home and abroad, physiological signals such as heart rate, body temperature and blood pressure of a human body can be monitored in real time, and daily monitoring of common diseases is realized. Most wearable equipment used for monitoring electrocardio so far adopts the principle of electrical sensing, and in 2001, units such as Finland university develop an intelligent garment equipped with a microcomputer, a GPS and a communication device, which can continuously monitor the body temperature and the heartbeat condition of a user, remind the user when an abnormal condition occurs, and alarm the emergency center if the user does not respond. In 2008, researchers at the university of danish rational engineers studied a wearable Electronic textile "Electronic Patch" for non-invasive and wireless monitoring of human physiological signals. The ECG electrodes, blood oxygen content sensor, processing circuitry, wireless communication module and battery are integrated in an "Electronic Patch" and encapsulated in a polymer of 88X 60X 5mm size. The polymer is coated with adhesive and can be attached to relevant parts of human body to detect the electrocardio information of human body in real time and send the electrocardio information to a computer in a wireless mode for processing and displaying. The above reports basically use the electrical sensor to realize the detection of the physiological parameters of the human body, and these physiological signal monitoring devices realize the real-time monitoring of the signals by measuring the changes of the electrical properties of the sensing elements, such as resistance, current, voltage and the like, but the signal monitoring devices based on the electrical sensing principle generally have the defects of easy electromagnetic interference, complex structure and large volume, and are difficult to realize the purpose of real-time monitoring of the electrocardio by the intelligent wearable device, and the problems can be well avoided by the optical sensing principle. Compared with the traditional signal monitoring equipment based on the electrical principle, the optical sensor has the characteristics of electromagnetic interference resistance, electrical insulation, corrosion resistance, small size, light weight, variable appearance and small influence on a measured medium. Meanwhile, with the rapid development of the photon technology, the organic polymer optical waveguide gradually becomes a research hotspot due to the advantages of easy processing and convenient integration, and the huge commercial prospect is widely valued at home and abroad. The flexible electrocardio-demodulation electronic skin based on the polymer photonic integrated chip has important scientific significance and practical application value for real-time monitoring of human physiological information, early diagnosis of diseases and risk prediction.
Disclosure of Invention
The invention aims to provide a flexible electrocardio-demodulation electronic skin based on a polymer photon integrated chip, and realizes electrocardiosignal detection based on an optical technology.
The invention is realized by the following technical scheme:
a flexible electrocardio-demodulation electronic skin based on a polymer photon integrated chip comprises the polymer photon integrated chip and a flexible demodulation circuit; wherein:
the polymer photonic integrated chip comprises a polydimethylsiloxane substrate, and a light source array, an input grating coupler array, a multimode interference coupler, a Mach-Zehnder electro-optic modulator, an output grating coupler and a photoelectric detector which are arranged on the polydimethylsiloxane substrate and are mutually connected through an optical waveguide; the light source array is bonded on the upper layer of the input grating coupler array, and the photoelectric detector is bonded on the upper layer of the output grating coupler; leading out bonding pads from two ends of the polymer photonic integrated chip through conductive silver paste, and realizing corresponding connection with the flexible demodulation circuit through the bonding pads;
the flexible demodulation circuit comprises a board layer, a circuit layer and a component layer, wherein the circuit layer and the component layer are arranged on the board layer, the component layer and the polymer photonic integrated chip are electrically connected with the circuit layer through a conductive adhesive tape, and the circuit layer is formed by dispensing and printing conductive silver paste;
the polymer photonic integrated chip is used for acquiring electrocardiosignals of a human body, demodulating the electrocardiosignals and outputting electric signals, and the flexible demodulation circuit is used for processing and transmitting the electric signals output by the polymer photonic integrated chip;
the optical waveguide is a three-layer waveguide structure of polydimethylsiloxane, nonlinear polymer material and polydimethylsiloxane; forming a bonding pad on a three-layer optical waveguide structure of polydimethylsiloxane + nonlinear polymer material + polydimethylsiloxane by metal sputtering, patterning upper-layer polydimethylsiloxane by dry etching to form a groove similar to a microfluidic channel, and spin-coating a flexible photoresist on the groove and photoetching to form the groove and expose the bonding pad; dispensing a glue on the upper part of the input grating coupler array by using a benzocyclobutene polymer and placing a light source array to enable the light source array to be communicated with the bonding pad; forming a bonding pad on a three-layer waveguide structure of polydimethylsiloxane, a nonlinear polymer material and polydimethylsiloxane by metal sputtering, patterning upper polydimethylsiloxane by dry etching to form a groove, further spin-coating flexible photoresist and photoetching to form a groove and expose the bonding pad, and performing adhesive dispensing on the groove of the polydimethylsiloxane layer by conductive silver paste to manufacture a lead; and dispensing the part outside the bonding pad above the output grating coupler by using a benzocyclobutene polymer to form a light-transmitting insulating layer, and placing a photoelectric detector.
The component layer comprises a current-voltage conversion circuit, a voltage amplification circuit, a microprocessor with AD conversion and a Bluetooth module which are connected in sequence; the photoelectric detector converts an optical signal into an electric signal to be output, the electric signal is converted between current and voltage through the current-voltage conversion circuit, then the signal is amplified through the voltage amplifier, finally an analog signal is converted into a digital signal through the microprocessor with AD conversion, and the digital signal is transmitted to the upper computer through the Bluetooth module to be subjected to data processing.
The plate layer is formed by pouring polydimethylsiloxane, and the thickness is 200 mu m.
The preparation process of the polymer photonic integrated chip comprises the following steps: the polydimethylsiloxane cladding and the nonlinear polymer material core layer are respectively formed into films by utilizing a spin coating process, wherein the spin coating speed of the polydimethylsiloxane cladding is 500r/min, the spin coating speed of the nonlinear polymer material core layer is 1000r/min, after the spin coating of the polydimethylsiloxane cladding film is successful, the curing and surface modification are carried out, and a tackifier is coated to ensure that the nonlinear polymer material can be smoothly and rotatably coated above the polydimethylsiloxane cladding; the photoetching of the nonlinear polymer material core layer is to evaporate a metal layer on the upper layer and to prepare a mask by an uncovering-stripping process, then to form a core layer pattern by a dry etching process, the metal mask is stripped by an acetone solution, the metal layer is formed into a metal aluminum film with the thickness of 200nm by a magnetron sputtering process, then to form a pattern of an electrode in a Mach-Zehnder electro-optic modulator by the uncovering-stripping process, the etching of a polydimethylsiloxane cladding above a grating is to expose the grating structure formed by the nonlinear polymer material core layer to the outside by the dry etching process, and the dry etching is to use SF 6 And O 2 Mixed gas with gas flow rate ratio of SF 6 :O 2 =15:3。
The polydimethylsiloxane cladding surface modification process comprises the following steps: firstly, spin-coating a polydimethylsiloxane film and curing, and performing oxygen plasma cleaning on the cured polydimethylsiloxane film, wherein the oxygen plasma cleaning time is 5min, and the power is 400W; and soaking the cleaned polydimethylsiloxane film in a silanization reagent, and finally taking out and drying the polydimethylsiloxane film to finish the surface modification of the polydimethylsiloxane coating.
Compared with the prior art, the flexible electrocardio-demodulation electronic skin based on the polymer photon integrated chip overcomes the defects of weak electromagnetic interference resistance and the like of the traditional electrical technology, can realize electrocardiosignal detection based on the optical technology, can better realize the compatibility with a wearable system by adopting the flexible material, and solves the problem that a rigid chip is not easy to attach to a human body.
Drawings
FIG. 1 is a schematic diagram of a flexible electro-cardio demodulation electronic skin structure based on a polymer photonic integrated chip according to the present invention;
FIG. 2 is a schematic diagram of a flexible demodulation circuit;
FIG. 3 is a schematic structural diagram of a polymer photonic integrated chip;
FIG. 4 is a schematic structural diagram of a component layer of the flexible demodulation circuit;
FIG. 5 is a schematic diagram of a structure of an optical waveguide;
FIG. 6 is a schematic diagram of a Mach-Zehnder electro-optic modulator;
FIG. 7 is a schematic diagram of a non-linear polymer poling process;
FIG. 8 is a schematic diagram of two polarization modes; (a) a corona type polarization mode, (b) a contact type polarization mode;
FIG. 9 is a schematic diagram of a polymer photonic integrated chip fabrication process flow;
FIG. 10 is a schematic view of a process flow for modifying the surface of a Polydimethylsiloxane (PDMS) cladding;
fig. 11 is a schematic diagram of a bonding process flow of a light source array/photodetector.
Reference numerals:
1. the photonic integrated circuit comprises a polymer photonic integrated chip, 2, a flexible demodulation circuit, 3, a multimode interference coupler, 4, a light source array, 5, an input grating coupler array, 6, a photoelectric detector, 7, an output grating coupler, 8, electrodes, 9, a Mach-Zehnder electro-optic modulator, 10, a polydimethylsiloxane substrate, 11, an optical waveguide, 12, a bonding pad, 13, a conductive adhesive tape, 14, a polydimethylsiloxane cladding, 15, a nonlinear polymer material core layer, 16, a board layer, 17, a circuit layer, 18, a component layer, 61, a current-voltage conversion circuit, 62, a voltage amplification circuit, 63, a microprocessor with AD conversion, 64, a Bluetooth module, 65, power management, 66, a mobile phone mobile terminal, 70, a light source array/photoelectric detector, 71 and conductive silver paste.
Detailed Description
The technical solution of the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, a schematic diagram of a flexible electrocardiographic demodulation electronic skin structure based on a polymer photonic integrated chip of the present invention includes a polymer photonic integrated chip 1 and a flexible demodulation circuit 2. The polymer photonic integrated chip 1 is used for acquiring electrocardiosignals of a human body, demodulating the electrocardiosignals and outputting electric signals. The flexible demodulation circuit 2 performs current-voltage conversion, amplification, denoising processing and Bluetooth transmission on the electric signal output by the polymer photonic integrated chip 1.
Fig. 2 is a schematic diagram of a flexible demodulation circuit. The flexible demodulation circuit 2 includes a board layer 16, a wiring layer 17, and a component layer 18. Wherein the plate layer 16 is formed by casting Polydimethylsiloxane (PDMS) with a thickness of 200 μm. The circuit layer 17 is formed by dispensing and printing conductive silver paste, and the line width is 150 mu m. The component layer 18 and the polymer photonic integrated chip 1 are electrically connected with the circuit layer 17 through the conductive adhesive tape 13.
Fig. 3 is a schematic diagram of a polymer photonic integrated chip. The polymer photonic integrated chip 1 comprises a polydimethylsiloxane substrate 10, a multimode interference coupler 3, a light source array 4, an input grating coupler array 5, a photoelectric detector 6, an output grating coupler 7 and a Mach-Zehnder electro-optic modulator 9 (including an electrode 8) which are arranged on the polydimethylsiloxane substrate 10, and all the devices are mutually connected through an optical waveguide 11. The light source array is bonded to the upper layer of the input grating coupler array, and the photodetector is bonded to the upper layer of the output grating coupler array. The input grating coupler array 5 receives the output light of the light source array 4, is connected with the mach-zehnder electro-optic modulator 9 through an optical waveguide, and the output light passing through the mach-zehnder electro-optic modulator 9 passes through the optical waveguide 11, passes through the output grating coupler 7, and is output to the photoelectric detector 6. The light source array 4 and the photoelectric detector 6 are respectively bonded on the input grating coupler array 5 and the output grating coupler 7 through etching grooves and filling benzocyclobutene polymer. And leading out the bonding pads 12 from two ends of the polymer photonic integrated chip 1 through conductive silver paste. Corresponding connections to the flexible demodulation circuit are made through the pads 12.
Fig. 4 is a schematic diagram of a layer structure of components of the flexible demodulation circuit. The component layer 18 is divided into four parts, i.e., a current-voltage conversion circuit 61, a voltage amplification circuit 62, a microprocessor 63 having AD conversion, and a bluetooth module 64, which are connected in this order. The photoelectric detector 6 converts the optical signal into an electric signal to be output, the electric signal is converted between the current and the voltage through the current-voltage conversion circuit 61, the signal is amplified through the voltage amplifier 62, and finally the analog signal is converted into a digital signal through the microprocessor 63 with the AD conversion and transmitted to an upper computer (for example, a mobile phone mobile terminal 66) through the Bluetooth module 64, so that the data processing is facilitated. Power management 65 is used to power the component layer structure.
Fig. 5 is a schematic diagram of an optical waveguide structure. The optical waveguide is a rectangular optical waveguide structure composed of a polydimethylsiloxane cladding 14 arranged on the polydimethylsiloxane substrate 10 and a nonlinear polymer material core layer 15 embedded in the polydimethylsiloxane cladding 14.
Therefore, the polydimethylsiloxane cladding and the nonlinear polymer material core layer on the polydimethylsiloxane substrate form a polydimethylsiloxane + nonlinear polymer material + polydimethylsiloxane three-layer waveguide structure. The waveguide width is 2 μm and the thickness is 1 μm.
As shown in fig. 6, a schematic diagram of a mach-zehnder electro-optic modulator is shown. The Mach-Zehnder electro-optic modulator realizes photoelectric conversion, and the main function of the electrocardio-sensing is realized by utilizing the electro-optic effect of the poled polymer. The Mach-Zehnder electro-optic modulator mainly comprises an input end beam splitter, a modulation arm, an output end beam combiner and electrodes on two sides of the modulation arm, wherein one beam of light is divided into two beams of light which are completely the same after passing through the input end beam splitter, and the two beams of light are converged at the output end beam combiner through the modulation arm and output to a photoelectric detector to be converted into electric signals. When no external electric field is applied, the effective refractive index of the modulation arm waveguide is unchanged, two beams of light are finally converged at the output end beam combiner after passing through the upper and lower modulation arm waveguides, and the light intensity output by the multimode interference beam combiner is the maximum. When a certain external electric signal is applied to the modulation arm waveguide, the effective refractive index of the modulation arm waveguide is influenced due to the electro-optic effect of the polarized polymer material, so that the propagation mode of light in the modulation arm waveguide is influenced.
The electrooptical effect of the polarized polymer mainly refers to the second-order nonlinear optical property of the nonlinear electrooptical polymer material, but because the second-order nonlinear optical property of the polymer is weaker, the polymer material contains chromophore molecules through doping, linking or crosslinking and the like, and then the polymer material has higher second-order nonlinear optical property through polarization treatment. The nonlinear polymer material is realized by doping chromophore CLD-1 in polymethyl methacrylate, and the doping concentration is 30 wt%.
FIG. 7 shows a schematic diagram of a polarization process of a nonlinear polymer. Firstly, crosslinking chromophore molecules with larger microscopic second-order polarizability with a main polymer, and heating to the temperature near the glass transition temperature; then, a strong direct current polarization electric field is applied to the polymer film through the upper electrode and the lower electrode, so that charges in chromophore molecules are oriented along the direction of the electric field, the central symmetry of the cross-linked polymer material is broken, and the anisotropic non-central symmetry is realized, so that the polymer material has the electro-optic characteristic; and finally, cooling under the condition of keeping the electric field unchanged to ensure that the orientation of the polymer is fixed, and keeping the second-order optical nonlinearity obtained after polarization for a long time, wherein the polymer material after polarization has the electro-optic characteristic.
Fig. 8 is a schematic diagram showing two polarization modes. The polarization process is classified into corona-type polarization and contact-type polarization according to the type of polarization. The corona polarization uses a needle electrode or a wire electrode, a strong electric field is generated inside a polymer film by corona discharge on the surface of a polymer material, the dipole moment of chromophore molecules is further oriented in the direction of the electric field, the shape of the corona polarization electric field is elliptic, the concentration effect in a polarization area is strong because the needle electrode or the wire electrode is used in the corona polarization, and the polarization voltage is usually small in order to obtain a large electro-optic coefficient and not damage the polymer film, wherein (a) is a schematic diagram of the corona polarization mode. Different from a corona type polarization mode, contact type polarization utilizes a planar electrode, the contact type polarization is that a strong electric field is directly applied to a polymer film, the orientation of dipole moment of chromophore molecules according to the direction of the electric field is realized by directly contacting with the surface of the polymer film for charging and discharging, the polarization electric field direction is planar, compared with the corona type polarization, the electric field formed by the contact type polarization is more uniform, the polarization voltage requirement is higher, but the contact type polarization is more difficult to implement because the polymer film is easily damaged in the contact process and the condition requirement is higher, and (b) is shown as a schematic diagram of the contact type polarization mode. In this embodiment, a corona polarization mode is used, the positive electrode is a needle electrode, and the negative electrode is connected to an ITO conductive glass substrate. The polarization voltage of the polarization process is 1.8kV, the polarization temperature is 85 ℃, the polarization time is 30min, and the electro-optic coefficient of the nonlinear polymer is 70pm/V through experimental measurement.
FIG. 9 shows a flow chart of a fabrication process of a polymer photonic integrated chip.
The polymer photonic integrated chip is prepared by the steps of spin coating, photoetching, sputtering, etching, bonding and the like. Forming a film by utilizing a polydimethylsiloxane cladding and a nonlinear polymer material core layer through a spin coating process, wherein the spin coating speed of the polydimethylsiloxane cladding is 3500r/min, and the nonlinear polymer isThe spin coating speed of the material core layer is 1000 r/min. After the polydimethylsiloxane coating film is successfully coated in a spinning mode, curing and surface modification are carried out, and an adhesion promoter is coated to enable the nonlinear polymer material to be smoothly coated above the polydimethylsiloxane coating in a spinning mode. The photoetching of the nonlinear polymer material core layer is to form a core layer pattern by a dry etching process after a metal layer is evaporated on the upper layer and a mask is prepared by a lift-off process. The metal mask was peeled off by acetone solution. And forming a metal aluminum film with the thickness of 200nm by the metal layer through a magnetron sputtering process, and forming an electrode pattern by using a lift-off process. And etching the polydimethylsiloxane cladding above the grating by using a dry etching process to expose the grating structure formed by the nonlinear polymer material core layer to the outside. Dry etching with SF 6 And O 2 Mixed gas with gas flow rate ratio of SF 6 :O 2 =15:3。
FIG. 10 is a schematic diagram of a process flow for modifying the surface of a PDMS coating. Because polydimethylsiloxane has very low surface energy and shows hydrophobic characteristics after film formation, the coating of a nonlinear polymer material is difficult, and therefore, a polydimethylsiloxane cladding needs to be modified to show hydrophilicity so as to enhance the film formation quality of a nonlinear polymer material film on the polydimethylsiloxane cladding. This example uses O 2 The surface of the polydimethylsiloxane film is modified by a plasma (oxygen plasma) cleaning method. Firstly, spin-coating a Polydimethylsiloxane (PDMS) film and curing, and then carrying out O treatment on the cured PDMS film 2 plasma cleaning, O 2 The plasma cleaning time is 5min, and the power is 400W. And soaking the cleaned polydimethylsiloxane film in a silanization reagent, and finally taking out and drying the polydimethylsiloxane film to finish the surface modification of the polydimethylsiloxane film.
Fig. 11 is a schematic diagram of a bonding process of the light source array/photodetector 70.
The bonding process of the light source array comprises the following steps: and forming a bonding pad and a lead on the three-layer optical waveguide structure of the polydimethylsiloxane + the nonlinear polymer material + the polydimethylsiloxane by metal sputtering. A flexible photoresist is spin coated on this and photo-etched to form trenches and expose the pads. And dispensing and placing the light source array above the input grating coupler array by using benzocyclobutene polymer so as to communicate the light source array with the bonding pad.
The bonding process of the photoelectric detector comprises the following steps: a bonding pad is formed on a three-layer waveguide structure of polydimethylsiloxane + nonlinear polymer material + polydimethylsiloxane by metal sputtering, and then the upper Polydimethylsiloxane (PDMS) layer is patterned by dry etching to form a groove similar to a microfluidic channel. On the basis of the above-mentioned structure, a flexible photoresist is further spin-coated and photo-etched, so that a groove is formed and a bonding pad connected with the flexible demodulation circuit is exposed. And (5) carrying out glue dispensing on the groove of the polydimethylsiloxane layer by using conductive silver paste 71 to manufacture a lead. And dispensing the part outside the bonding pad above the output grating coupler by using a benzocyclobutene polymer to form a light-transmitting insulating layer, and placing a photoelectric detector.
The principle and the embodiment of the present invention are explained by the specific embodiments of the present invention, and the above description of the embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, the idea of the present invention may be changed in the specific embodiments and the application range, and the above contents should not be construed as limiting the present invention. Various modifications, equivalents, or variations may occur to those skilled in the art without departing from the spirit and scope of the present invention, and those changes, equivalents, or variations that fall within the spirit and principles of this application are intended to be covered by the following claims.
Claims (5)
1. A flexible electrocardio-demodulation electronic skin based on a polymer photonic integrated chip is characterized in that the structure of the electronic skin comprises the polymer photonic integrated chip and a flexible demodulation circuit, wherein:
the polymer photon integrated chip comprises a polydimethylsiloxane substrate and a polymer material arranged on the polydimethylsiloxane
A light source array, an input grating coupler array, a multi-mode interference coupler, a Mach-Zehnder electro-optic modulator, an output grating coupler and a photoelectric detector which are mutually connected through optical waveguides on a base siloxane substrate; the light source array is bonded on the upper layer of the input grating coupler array, and the photoelectric detector is bonded on the upper layer of the output grating coupler; leading out bonding pads from two ends of the polymer photonic integrated chip through conductive silver paste, and realizing corresponding connection with the flexible demodulation circuit through the bonding pads;
the flexible demodulation circuit comprises a board layer, a circuit layer and a component layer, wherein the circuit layer and the component layer are arranged on the board layer, the component layer and the polymer photonic integrated chip are electrically connected with the circuit layer through a conductive adhesive tape, and the circuit layer is formed by dispensing and printing conductive silver paste;
the polymer photonic integrated chip is used for acquiring electrocardiosignals of a human body, demodulating the electrocardiosignals and outputting electric signals, and the flexible demodulation circuit is used for processing and transmitting the electric signals output by the polymer photonic integrated chip;
the optical waveguide is a three-layer waveguide structure of polydimethylsiloxane, nonlinear polymer material and polydimethylsiloxane; forming a bonding pad on a three-layer optical waveguide structure of polydimethylsiloxane + nonlinear polymer material + polydimethylsiloxane by metal sputtering, patterning upper-layer polydimethylsiloxane by dry etching to form a groove similar to a microfluidic channel, and spin-coating a flexible photoresist on the groove and photoetching to form the groove and expose the bonding pad; dispensing a glue on the upper part of the input grating coupler array by using a benzocyclobutene polymer and placing a light source array to enable the light source array to be communicated with the bonding pad; forming a bonding pad on a three-layer waveguide structure of polydimethylsiloxane, a nonlinear polymer material and polydimethylsiloxane by metal sputtering, patterning upper polydimethylsiloxane by dry etching to form a groove, further spin-coating flexible photoresist and photoetching to form a groove and expose the bonding pad, and performing adhesive dispensing on the groove of the polydimethylsiloxane layer by conductive silver paste to manufacture a lead; and dispensing the part outside the bonding pad above the output grating coupler by using a benzocyclobutene polymer to form a light-transmitting insulating layer, and placing a photoelectric detector.
2. The flexible electrocardio-demodulation electronic skin based on the polymer photonic integrated chip as claimed in claim 1, wherein the component layer comprises a current-voltage conversion circuit, a voltage amplification circuit, a microprocessor with AD conversion and a Bluetooth module which are connected in sequence; the photoelectric detector converts an optical signal into an electric signal to be output, the electric signal is converted between current and voltage through the current-voltage conversion circuit, then the signal is amplified through the voltage amplifier, finally an analog signal is converted into a digital signal through the microprocessor with AD conversion, and the digital signal is transmitted to the upper computer through the Bluetooth module to be subjected to data processing.
3. The polymer photonic integrated chip-based flexible electro-cardio demodulation electronic skin according to claim 1, wherein the sheet material layer is formed by casting polydimethylsiloxane and has a thickness of 200 μm.
4. The flexible electrocardio-demodulation electronic skin based on the polymer photonic integrated chip as claimed in claim 1, wherein the preparation process of the polymer photonic integrated chip comprises: the polydimethylsiloxane cladding and the nonlinear polymer material core layer are respectively formed into films by utilizing a spin coating process, wherein the spin coating speed of the polydimethylsiloxane cladding is 500r/min, the spin coating speed of the nonlinear polymer material core layer is 1000r/min, after the spin coating of the polydimethylsiloxane cladding film is successful, the curing and surface modification are carried out, and a tackifier is coated to ensure that the nonlinear polymer material can be smoothly and rotatably coated above the polydimethylsiloxane cladding; the photoetching of the nonlinear polymer material core layer is that a metal layer is evaporated on the upper layer of the nonlinear polymer material core layer, a mask is prepared by utilizing an uncovering-stripping process, a dry etching process is utilized to form a core layer pattern, the metal mask is stripped by an acetone solution, the metal layer forms a metal aluminum film with the thickness of 200nm by utilizing a magnetron sputtering process, then a pattern of an electrode in the Mach-Zehnder electro-optic modulator is formed by utilizing the uncovering-stripping process, and the etching of a polydimethylsiloxane cladding layer above the grating utilizes dry etching to etchEtching to expose the grating structure composed of the core layer of non-linear polymer material, and dry etching with SF 6 And O 2 Mixed gas with gas flow rate ratio of SF 6 :O 2 =15:3。
5. The flexible electro-cardio demodulation electronic skin based on the polymer photonic integrated chip as claimed in claim 4, wherein the polydimethylsiloxane coating surface modification process comprises: firstly, spin-coating a polydimethylsiloxane film and curing, and performing oxygen plasma cleaning on the cured polydimethylsiloxane film, wherein the oxygen plasma cleaning time is 5min, and the power is 400W; and soaking the cleaned polydimethylsiloxane film in a silanization reagent, and finally taking out and drying the polydimethylsiloxane film to finish the surface modification of the polydimethylsiloxane coating.
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