CN114619132A - 大推力驱动片及其制备方法 - Google Patents
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- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 235000012431 wafers Nutrition 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 230000010287 polarization Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
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- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229920006335 epoxy glue Polymers 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 8
- 238000001465 metallisation Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 4
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
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- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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Abstract
本发明属于压电陶瓷驱动技术领域,具体涉及大推力驱动片的制备方法,将惠丰内部粉料经过压制成型、排塑、烧结、金属化、极化处理后获得陶瓷晶片,将所述陶瓷晶片分别粘贴在铜基板的两侧分别作为正极和负极,在作为正极的陶瓷晶片上粘贴连接蓝宝石。本发明提供的大推力驱动片的制备方法,使现有超声波双晶片驱动的制备成本降低50%,推动力可大于250g,推动距离16μm±2μm,重复使用次数达到20亿次以上。
Description
技术领域
本发明属于压电陶瓷驱动技术领域,具体涉及大推力驱动片及其制备方法。
背景技术
超声波楔焊机用于焊接圆形铝线或者铝带,超声波双晶片驱动安装于楔焊机的劈刀前端,在焊接时夹住铝线,移动时松开铝线。目前超声波双晶片驱动为异形结构,加工过于复杂,只能推动70g,距离12μm,使用次数15亿次,无法满足250g以上的大推力需求,因而无法满足更大质量及更粗的铝线焊接需求。
发明内容
针对上述现有技术的不足,本发明提供了大推力驱动片及其制备方法,目的是为了解决目前超声波双晶片驱动为异形结构,加工过于复杂,只能推动70g,距离12μm,使用次数15亿次,无法满足250g以上的大推力需求的技术问题。
本发明提供的大推力驱动片及其制备方法,具体技术方案如下:
大推力驱动片的制备方法,将红丹粉、钛白粉、氧化锆、二氧化锡和五氧化二铌经过压制成型、排塑、烧结、金属化、极化处理后获得陶瓷晶片,将所述陶瓷晶片分别粘贴在铜基板的两侧分别作为正极和负极,在作为正极的陶瓷晶片上粘贴连接蓝宝石。其中,按照质量百分比计算,红丹粉65%、钛白粉15.50%、氧化锆15.6%、二氧化锡2.58%、五氧化二铌1.32%。
在某些实施方式中,所述压制成型处理中,压力为40MPa,成型压块的厚度为15~20mm。
在某些实施方式中,所述排塑的温度为850℃;所述烧结温度为1200-1250℃。
在某些实施方式中,金属化处理前,烧结获得的坯片先进行尺寸加工,并进行超声清洗,所述金属化处理为将尺寸加工后的坯片上下两个面上进行被银处理。
进一步,所述被银处理为分子银浆印刷,烧银温度为750~850℃,870℃渗银。
在某些实施方式中,所述极化处理采用空气极化,极化半小时测D33大于等于520为合格。
在某些实施方式中,所述陶瓷晶片与铜基板连接、所述陶瓷晶片与所述蓝宝石连接均通过环氧胶水连接。
进一步,所述环氧胶水采用550目的钢网印刷进行涂抹,所述环氧胶水固化温度为80℃。
本发明还提供了另一个技术方案,即大推力驱动片,利用上述的方法制备的大推力驱动片。
本发明具有以下有益效果:本发明提供的大推力驱动片的制备方法,通过改善原有的压电陶瓷片薄需要驱动电压低,所以推动的距离短,推力小,使超声波双晶片驱动的制备成本降低50%,推动力可大于250g,推动距离16μm±2μm,重复使用次数达到20亿次以上,材料的耐久性和稳定性较好、贴合的工艺控制精度高,体现出能使用时间长。
附图说明
图1是本发明提供的大推力驱动片的剖面结构示意图;
图2是本发明提供的大推力驱动片的平面结构示意图;
图3是异形结构的驱动片的测试结果;
图4本发明实施例提供的大推力驱动片的测试结果。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明白,以下结合具体实施例,并参照附图,对本发明进一步详细说明。
实施例
本实施例提供的大推力驱动片及其制备方法,技术方案如下:
大推力驱动片的制备方法,将红丹粉65%、钛白粉15.50%、氧化锆15.6%、二氧化锡2.58%、五氧化二铌1.32%经过压制成型、排塑、烧结、金属化、极化处理后获得陶瓷晶片,将所述陶瓷晶片分别粘贴在铜基板2的两侧分别作为正极1和负极3,在作为正极1的陶瓷晶片上粘贴连接蓝宝石4。
大推力驱动片的制备方法,具体的实施流程如下:
一、成型
模具:60mm*30.5mm*50mm,手动压机;
压力:40MPa;
成型坯件的厚度:15~20mm;
二、排塑、烧结
1、排塑温度为850℃。
2、烧结实际温度控制在1200℃-1250℃之间。
3、机加工:将烧结后的坯件进行切割,切割厚度为0.51±0.01mm,并进行超声清洗。
三、金属化
被银处理:分子银浆印刷870℃渗银。
四、极化
采用空气极化,极化半个小时测D33≥520为合格。
五、CNC
陶瓷晶片的开孔与铜基片孔尺寸相同、将陶瓷晶片加工长x宽x厚为35.1*15.2*0.45mm
六、表面处理
用砂纸打磨去除表面颗粒,最小功率超声振洗
七、粘合晶片铜片
环氧胶水(搅拌均匀,在要贴合的陶瓷片和铜片上用550目钢网印刷胶水,用专用工装定位固化,固化温度80℃,固化4小时)
八、粘合蓝宝石
砂纸去除边缘多余胶水,专用钻床磨内孔去除内孔多余胶水,用环氧胶水粘接蓝宝石,用专用定位工装进行定位。常温固化48小时。
本实施例还提供了依据上述方法制备的大推力驱动片,如图1-2所示,并分别对现有异形结构的驱动片和本实施例提供的大推力驱动片进行测试,测试结果如图3-4所示。其中A面指代具有蓝宝石面,B面指代无蓝宝石面。
综上所述,本发明提供的大推力驱动片的制备方法,使现有超声波双晶片驱动的制备成本降低50%,推动力可大于250g,推动距离16μm±2μm,重复使用次数达到20亿次以上。
上述仅本发明较佳可行实施例,并非是对本发明的限制,本发明也并不限于上述举例,本技术领域的技术人员,在本发明的实质范围内,所作出的变化、改型、添加或替换,也应属于本发明的保护范围。
Claims (9)
1.大推力驱动片的制备方法,其特征在于,将红丹粉、钛白粉、氧化锆、二氧化锡和五氧化二铌经过压制成型、排塑、烧结、金属化、极化处理后获得陶瓷晶片,将所述陶瓷晶片分别粘贴在铜基板的两侧分别作为正极和负极,在作为正极的陶瓷晶片上粘贴连接蓝宝石。
2.根据权利要求1所述的大推力驱动片的制备方法,其特征在于,所述压制成型处理中,压力为40MPa,成型压块的厚度为15~20mm。
3.根据权利要求1所述的大推力驱动片的制备方法,其特征在于,所述排塑的温度为850℃;所述烧结温度为1200-1250℃。
4.根据权利要求1所述的大推力驱动片的制备方法,其特征在于,金属化处理前,烧结获得的坯片先进行尺寸加工,并进行超声清洗,所述金属化处理为将尺寸加工后的坯片上下两个面上进行被银处理。
5.根据权利要求4所述的大推力驱动片的制备方法,其特征在于,所述被银处理为分子银浆印刷,烧银温度为750~850℃,870℃渗银。
6.根据权利要求1所述的大推力驱动片的制备方法,其特征在于,所述极化处理采用空气极化,极化半小时测D33大于等于520为合格。
7.根据权利要求1所述的大推力驱动片的制备方法,其特征在于,所述陶瓷晶片与铜基板连接、所述陶瓷晶片与所述蓝宝石连接均通过环氧胶水连接。
8.根据权利要求7所述的大推力驱动片的制备方法,其特征在于,所述环氧胶水采用550目的钢网印刷进行涂抹,所述环氧胶水固化温度为80℃。
9.大推力驱动片,其特征在于,利用权利要求1-9任一项所述的方法制备的大推力驱动片。
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