CN114616932B

CN114616932B - Substrate working machine and cleaning method

Info

Publication number: CN114616932B
Application number: CN201980101733.5A
Authority: CN
Inventors: 仲川史人
Original assignee: Fuji Corp
Current assignee: Fuji Corp
Priority date: 2019-11-12
Filing date: 2019-11-12
Publication date: 2023-09-19
Anticipated expiration: 2039-11-12
Also published as: WO2021095110A1; JP7260663B2; JPWO2021095110A1; CN114616932A

Abstract

The present invention provides a substrate working machine, comprising: a supply member that supplies a fluid used for producing the electronic substrate to the electronic substrate; a first supporting part for the first wiping body; a second supporting part for the second wiping body to be arranged; an actuator that moves at least one of the first support portion and the second support portion; and a control unit that executes the following cleaning process: the first support portion and the second support portion are brought into a state of proximity by an actuator to clean the supply member.

Description

Substrate working machine and cleaning method

Technical Field

The present disclosure relates to a substrate working machine and a cleaning method for cleaning a supply member for applying a fluid to an electronic substrate.

Background

Conventionally, various techniques have been proposed for the substrate working machine and the cleaning method. For example, the technique described in patent document 1 below includes: a nozzle having a liquid ejection section for ejecting a liquid to an object to be coated; a liquid storage tank for storing a liquid medicine for preventing the liquid existing in the liquid ejection portion from drying, and having an opening at an upper side, into which the nozzle can be inserted; and a brush disposed inside the liquid storage tank and rubbing the liquid ejection portion to clean the liquid ejection portion when the nozzle is inserted into the liquid storage tank.

Prior art literature

Patent literature

Patent document 1:2017-7435

Disclosure of Invention

Problems to be solved by the invention

The present invention aims to provide a substrate working machine with a supply component for coating fluid on an electronic substrate, which is more suitable for cleaning the supply component.

Means for solving the problems

Disclosed is a substrate working machine provided with: a supply member that supplies a fluid used for producing the electronic substrate to the electronic substrate; a first supporting part for the first wiping body; a second supporting part for the second wiping body to be arranged; an actuator that moves at least one of the first support portion and the second support portion; and a control unit that executes the following cleaning process: the first support portion and the second support portion are brought into a state of proximity by an actuator to clean the supply member.

Effects of the invention

According to the present disclosure, in a substrate working machine provided with a supply member for applying a fluid to an electronic substrate, the supply member is preferably cleaned.

Drawings

Fig. 1 is a perspective view showing a substrate working machine according to the present embodiment.

Fig. 2 is a perspective view showing the suction nozzle.

Fig. 3 is a perspective view showing the suction nozzle.

Fig. 4 is a plan view showing the nozzle stocker.

Fig. 5 is a side view showing a nozzle stocker.

Fig. 6 is a side view showing the shutter moving device.

Fig. 7 is a diagram for explaining a control structure of the pair of substrate work machines.

Fig. 8 is a side view schematically showing the cleaning unit.

Fig. 9 is a plan view schematically showing the needle, the first wiper, and the second wiper.

Fig. 10 is a flowchart for implementing the cleaning method.

Fig. 11 is a side view schematically showing the cleaning unit.

Fig. 12 is a side view schematically showing the cleaning unit.

Fig. 13 is a side view schematically showing the cleaning unit.

Fig. 14 is a plan view schematically showing the needle, the first wiper, and the second wiper.

Fig. 15 is a plan view schematically showing the needle, the first wiper, and the second wiper.

Fig. 16 is a plan view schematically showing the needle, the first wiper, and the second wiper.

Fig. 17 is a plan view schematically showing a modification of the needle, the first wiper, and the second wiper.

Fig. 18 is a flowchart showing the execution timing of the cleaning method.

Fig. 19 is a perspective view showing a needle transfer nozzle.

Detailed Description

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, in the drawings, a part of the structure is omitted and the drawing is performed, and the dimensional ratios of the drawn parts and the like are not necessarily accurate. Further, in the drawings, reference numeral D1 denotes an X-axis direction which is a left-right direction. Reference numeral D2 denotes a Y-axis direction as a front-rear direction. Reference numeral D3 denotes a Z-axis direction as an up-down direction.

As shown in fig. 1, in the present embodiment, two pairs of substrate work machines 16a and 16b are provided on a common base 14 in a state of being arranged adjacent to each other. The X-axis direction D1 is a direction in which the pairs of substrate work machines 16a and 16b are adjacently aligned. The Y-axis direction D2 is a horizontal direction orthogonal to the X-axis direction D1. The Z-axis direction D3 is a direction orthogonal to the horizontal plane, which is both the X-axis direction D1 and the Y-axis direction D2. Thus, the X-axis direction D1, the Y-axis direction D2, and the Z-axis direction D3 are orthogonal to each other.

Each pair of substrate work machines 16a and 16b has the same structure. Hereinafter, the pair of substrate work machines 16a and 16b will be collectively referred to as "pair of substrate work machines 16" without distinction. The substrate working machine 16 includes a substrate working machine main body 20, a carrying device 22, a moving device 24, a supply device 26, a head unit 28, a nozzle station 34, and the like.

The substrate work machine body 20 includes a frame portion 30 and a beam portion 32. The beam portion 32 is erected above the frame portion 30. Further, a tape feeder support table 77 is provided at the front end of the frame portion 30.

The conveyance device 22 includes two transfer devices 40 and 42 and a substrate holding device 48 (fig. 7). The transfer devices 40 and 42 extend in the X-axis direction D1 and are provided in parallel to each other in the frame portion 30. The transfer devices 40 and 42 use a transfer motor 46 (fig. 7) as a driving unit or the like, and transport an electronic substrate 44 (fig. 8) such as a printed board supported by the transfer devices 40 and 42 in the X-axis direction D1. The substrate holding device 48 (fig. 7) pushes and fixes the electronic substrate 44 (fig. 8) carried in a predetermined position.

The moving device 24 includes a Y-axis direction sliding mechanism, not shown, an X-axis direction sliding mechanism, and the like. The Y-axis direction slide mechanism includes a pair of guide rails, a slider, a Y-axis motor 62 (fig. 7), and the like, which are not shown, and extend in the Y-axis direction D2. The guide rail is fixed to the beam portion 32. The slider is guided by the guide rail by the driving of the Y-axis motor 62 (fig. 7), and moves to an arbitrary position in the Y-axis direction D2. Similarly, the X-axis direction slide mechanism includes a pair of guide rails, a slider 50, an X-axis motor 64 (fig. 7), and the like, which are not shown, and extend in the X-axis direction D1. The guide rail of the X-axis direction sliding mechanism is fixed to the slider of the Y-axis direction sliding mechanism. The slider 50 of the X-axis direction slide mechanism is guided by a guide rail by the driving of the X-axis motor 64 (fig. 7) and moves to an arbitrary position in the X-axis direction D1. The head unit 28 is fixed to the slider 50 of the X-axis direction slide mechanism.

The feeder 26 is a feeder type feeder and is provided at the front end of the frame 30. The supply device 26 has a plurality of tape feeders 70. The tape feeder 70 is supported on a tape feeder support table 77. The tape feeder 70 pulls out and unseals the carried element wound around the reel 72 by driving the feeding device 78 (fig. 7) or the like, and feeds out and supplies the electronic element to the downstream side of the tape feeder 70.

A head unit 28 is provided with a head selected from a plurality of types of heads in a replaceable manner. Among the various types of heads, there are, for example, a mounting head 29, a bonding head (hereinafter, referred to as a GL head) 500 (fig. 8), and the like. In fig. 1, a mounting head 29 is mounted to a head unit 28. The head unit 28 includes a positive and negative pressure supply device 52 (fig. 7), a nozzle lifting device 54 (fig. 7), a nozzle rotating device 56 (fig. 7), and the like. In contrast, the mounting head 29 includes four nozzle shafts (not shown) and the like. The GL head 500 (fig. 8) will be described later.

The nozzle axes are equally arranged on the XY plane (horizontal plane) with respect to the axis of the mounting head 29 having a substantially circular shape on the XY plane (horizontal plane). A nozzle holder (not shown) is fixed below the nozzle shaft. The nozzle holder holds the nozzle 260 (fig. 2 and 3) so as to be detachable. The mounting head 29 is provided with a supply path for supplying negative pressure air and positive pressure air from the positive and negative pressure supply device 52 of the head unit 28. Accordingly, the mounting head 29 sucks and holds the electronic component 58 (fig. 8) by the suction nozzle 260 (fig. 2 and 3) by supplying negative pressure air, and can detach the held electronic component 58 (fig. 8) by supplying a small amount of positive pressure air. That is, the mounting head 29 adsorbs the electronic component 58 (fig. 8) and mounts it on the electronic substrate 44 (fig. 8).

The nozzle lifting device 54 lifts the nozzle shaft in the up-down direction, i.e., the Z-axis direction D3. The nozzle rotation device 56 revolves the nozzle shaft around the axis of the mounting head 29. In detail, the nozzle rotation device 56 intermittently rotates the nozzle shaft for each predetermined stop position. The nozzle lifting device 54 lifts the nozzle shaft at one of four stop positions, that is, at a predetermined lifting position. The nozzle rotation device 56 rotates the nozzle shaft around its axis. Thereby, the suction nozzle 260 (fig. 8) can change the position of the held electronic component 58 (fig. 8) in the up-down direction and the holding posture of the electronic component 58 (fig. 8).

A nozzle station 34 is provided on the frame portion 30, having a nozzle stocker 600. A plurality of suction nozzles 260 (fig. 2 and 3) are accommodated in the nozzle stocker 600. In the nozzle station 34, the nozzle 260 (fig. 2 and 3) attached to the attachment head 29 and the nozzle 260 (fig. 2 and 3) accommodated in the nozzle stocker 600 are replaced as necessary. The nozzle stocker 600 is detachable from the nozzle station 34, and can collect the suction nozzles 260 (fig. 2 and 3) stored in the nozzle stocker 600, supply the suction nozzles 260 (fig. 2 and 3) to the nozzle stocker 600, and the like, outside the substrate work machine 16.

The suction nozzle 260 will be described with reference to fig. 2 and 3. The suction nozzle 260 is composed of a main body cylinder 264, a flange 266, a suction tube 268, and a locking pin 270. The main body cylinder 264 has a cylindrical shape, and the flange 266 is fixed so as to protrude toward the outer peripheral surface of the main body cylinder 264. The suction pipe 268 has a thin tubular shape, and is held by the main body cylinder 264 so as to be movable in the axial direction in a state extending downward from the lower end portion of the main body cylinder 264. The locking pin 270 is provided at the upper end portion of the main body cylinder 264 so as to extend in the radial direction of the main body cylinder 264. The suction nozzle 260 is detachably attached to the mounting head 29 by a one-touch operation using the locking pin 270. A spring (not shown) is incorporated in the mounting head 29, and the spring imparts an elastic force to the suction pipe 268 of the suction nozzle 260 mounted to the mounting head 29. As a result, the suction pipe 268 is biased in a direction extending downward from the lower end portion of the main body cylinder 264 by the elastic force of the spring incorporated in the mounting head 29. Further, a two-dimensional code 274 is attached to the upper surface of the flange 266. The two-dimensional code 274 shows an ID (identification) of the nozzle 260, etc., as individual information.

The mounting operation to the substrate working machine 16 will be described. The electronic substrate 44 (fig. 8) is transported to a predetermined position by the transfer devices 40, 42, and is fixed by the substrate holding device 48. In contrast, the moving device 24 moves the mounting head 29 to the supplying device 26. Next, the suction nozzle 260 is lowered to the feeding position of the feeding device 26, and the electronic component 58 is sucked and held (fig. 8). Thereafter, the suction nozzle 260 is lifted. Further, since the mounting head 29 has four nozzle shafts, four electronic components 58 (fig. 8) can be held at maximum. When the mounting head 29 suctions and holds the plurality of electronic components 58 (fig. 8), rotation of the nozzle shaft toward the lifting position and lifting at the lifting position are repeated. Next, the moving device 24 moves the mounting head 29 to above the mounting position of the electronic substrate 44 (fig. 8). Next, the suction nozzle 260 is lowered to a position near the electronic board 44 (fig. 8), and the electronic component 58 (fig. 8) is separated. As in the case of the suction of the electronic components 58 (fig. 8), when the mounting head 29 mounts a plurality of electronic components 58 (fig. 8), the rotation of the nozzle shaft toward the lifting position and the lifting at the lifting position are repeated. Further, a plurality of electronic components 58 (fig. 8) are mounted on the electronic substrate 44 (fig. 8) by repeating a series of operations from the suction of the electronic components 58 (fig. 8) to the detachment by the mounting head 29.

Next, the nozzle stocker 600 will be described with reference to fig. 4 and 5. The nozzle stocker 600 is configured to be able to accommodate a plurality of nozzles to which the electronic components 58 (fig. 8) are mounted, like the nozzles 260 described above. The nozzle stocker 600 is provided with a nozzle housing table 620 as a nozzle stocker main body or a nozzle housing part, and a shutter 622 as a nozzle removal preventing part or a nozzle detachment preventing part.

As shown in fig. 4, the nozzle housing base 620 is provided with a plurality of nozzle housing holes 624, and each of the nozzles 260 is removably housed. These nozzle receiving holes 624 constitute nozzle receiving portions, respectively. The nozzle receiving holes 624 are arranged at a constant pitch in the direction of movement of the barrier 622 (the front-rear direction D2) and the direction orthogonal to the direction of movement of the barrier (the left-right direction D1) in a plane parallel to the plate surface of the nozzle receiving table 620. The nozzle receiving holes 624 are stepped holes each having a large diameter hole portion 626 capable of receiving the flange portion 266 of the suction nozzle 260 and a small diameter hole portion 628 capable of receiving the suction pipe 268.

Further, for each of the plurality of nozzle storage holes 624 of the nozzle stocker 600, a storage unit individual identification code is set as storage unit individual identification information for individually identifying the nozzle storage holes 624 in the nozzle stocker 600, and in the present embodiment, a number as a storage unit individual identification code is drawn for each of all the nozzle storage holes 624 on the upper surface of the nozzle storage base 620. When the operator stores the suction nozzle 260 in the nozzle storage hole 624, the nozzle storage position is indicated by the number, and the operator can observe the number to store the suction nozzle 260 in the designated nozzle storage hole 624.

Next, the shutter 622 will be described. The shutter 622 has a plate shape, and is provided with a plurality of openings 660 corresponding to the nozzle housing holes 624, and is attached to the nozzle housing table 620 so as to be movable in a direction parallel to the plate surface. The opening 660 is formed in a tumbler shape in which a large opening 662 having a size corresponding to the large diameter hole 626 of the nozzle receiving hole 624 and a small opening 664 having a size corresponding to the small diameter hole 628 are partially overlapped.

A tension coil spring 668 (hereinafter simply referred to as a spring) as an elastic member, which is one type of urging means, is disposed between the nozzle housing table 620 and the barrier 622, and urges the barrier 622 toward a direction in which the removal of the nozzle is prevented, as shown in fig. 4. The shutter 622 is lowered laterally from the upper surface of the nozzle housing table 620, then is bent downward of the nozzle housing table 620, and a spring 668 is provided in the bent portion 670. The nozzle extraction prevention position is a state in which the small opening 664 is located on the nozzle receiving hole 624. In this state, the portion of the shutter 622 defining the small opening 664 engages with the flange 266 of the nozzle 260 accommodated in the nozzle accommodating hole 624, and the nozzle 260 is prevented from being taken out of the nozzle stocker 600. In addition, the suction nozzle 260 can be taken out from the nozzle stocker 600 in a state where the large opening portion 662 is located on the nozzle receiving hole 624 and the barrier 622 is located at the position allowing the nozzle to be taken out.

The shutter 622 is engaged with a shutter moving device 770 (fig. 6) provided in the frame portion 30 and moves in a state where the nozzle stocker 600 is mounted on a stocker holding table 764 (fig. 6) of the frame portion 30. Accordingly, the opening 674 and the engaging portion 676 are provided in the curved portion 670 of the shutter 622, and the shutter moving device 770 (fig. 6) is engaged. These openings 674 and the engaging portions 676 are positioned on the axis of the spring 668.

The lower side of the nozzle stocker 600 is supported by a positioning pin 774 (fig. 8) protruding upward from the stocker holding table 764 (fig. 6), a support member 820 (fig. 8), and the like, and is attached to the stocker holding table 764 (fig. 6) of the frame portion 30.

The movement of the shutter 622 between the nozzle-extraction-preventing position and the nozzle-extraction-allowing position is guided by the guide 680. The guide device 680 includes a plurality of guide pins 682 as guide members provided upright on the nozzle housing table 620, and a plurality of long holes 684 as guided portions provided in parallel with the moving direction of the guide pins 682 on the barrier 622 and fitted with the guide pins 622. The guide device 680 also functions as a movement limit defining device that defines a movement limit of the shutter 622 based on the biasing force of the spring 668. By engaging the guide pin 682 with the end surface of the long hole 684, the movement limit of the shutter 622 is regulated, and the shutter is held in a state of being positioned at the nozzle withdrawal preventing position. In a state where the nozzle stocker 600 is detached from the stocker holding table 764 (fig. 6) of the frame portion 30, the shutter 622 is positioned at the nozzle withdrawal prevention position by the urging force of the spring 668, and also functions to prevent the nozzle 260 from coming off the nozzle storage table 620 during the transport of the nozzle storage table 620. The barrier 622 is also an anti-slip member. The guide 680 also functions as a rotation preventing device that prevents the shutter 622 from rotating in a direction parallel to the plate surface of the nozzle housing table 620.

The shutter 622 is prevented from rising from the nozzle storage stand 620 by a plurality of long holes 688 provided in parallel with the moving direction (the front-rear direction D2) thereof and a rising prevention member 690 provided upright on the nozzle storage stand 620. The floating preventing element 690 is inserted into the long hole 688 so as to be movable relative to each other, and prevents the floating of the baffle 622 at a head portion of a large diameter, not shown. These long holes 688 and the floating preventing member 690 constitute a floating preventing means 694. In fig. 4, the floating-up preventing member is illustrated by a two-dot chain line.

The shutter movement device 770 will be described with reference to fig. 6. The shutter moving device 770 includes a pair of air cylinders 800 provided to the hopper holding table 764 in the front-rear direction D2. The cylinder 800 is one type of fluid pressure cylinder as a fluid pressure actuator, and constitutes a driving source. The cylinders 800 are arranged in the vertical direction D3, and the cylinder housing 802 is shared, an engagement member 806 is provided in the vertical direction D3 over the front end portion of each piston rod 804, and an engagement portion 808 is provided at the upper end portion of the engagement member 806. The engagement portion 808 is long in the width direction of the hopper holding table 764, and can engage with the shutter even if the shape and size of the nozzle hopper are different. The length of the engaging portion 808 in the direction parallel to the front-rear direction D2 of the stocker holding table 764 is slightly shorter than the length of the opening 674 provided in the above-described barrier 622 in the front-rear direction D2 (the direction parallel to the barrier moving direction), and the engaging portion 808 is fitted into the opening 674 with a gap left in the front-rear direction D2. Further, an inclined surface 810 inclined downward as going forward is provided at the front portion of the engagement portion 808.

When the nozzle stocker 600 is mounted on the stocker holding table 764 of the frame portion 30, the engaging member 806 is fitted into the opening 674 of the barrier 622 at the engaging portion 808, and the barrier 622 is moved by the expansion and contraction of the piston rod 804. The shutter 622 is moved to the nozzle removal permission position by contraction of the piston rod 804, is opened, is moved to the nozzle removal prevention position by extension, and is closed, and the contracted end of the piston rod 804 is regulated by abutment of the engagement member 806 with the stopper 812 provided protruding from the cylinder housing 802, and the extension end is regulated by the stroke end of the piston. In the present embodiment, the stopper 812 is constituted by an adjustment bolt, and can adjust the retracted end position of the piston rod 804, that is, the retracted end position of the engaging member 806.

When the nozzle stocker 600 is mounted on the stocker holding table 764 of the frame portion 30, the piston rod 804 is located at the extended end position, that is, the engagement standby position, and the engagement portion 808 is fitted into the opening 674 by the mounting of the nozzle stocker 600 onto the stocker holding table 764. When the piston rod 804 is contracted in this state, the shutter 622 moves against the urging force of the spring 668, and moves toward the nozzle extraction allowable position. The movement of the shutter 622 is guided by the guide 680, but before the guide pin 682 engages with the end surface of the long hole 684, the engaging member 806 abuts against the stopper 812 to prevent the movement of the shutter 622, and is positioned at the position allowing the nozzle to be taken out.

When the piston rod 804 is extended, the shutter 622 follows the engagement member 806 by the urging force of the spring 668, and moves toward the nozzle extraction preventing position. Then, before the piston rod 804 reaches the stroke end, the guide pin 682 engages with the end surface of the long hole 684 to stop the shutter 622 at the nozzle removal prevention position, and the piston rod 804 is further slightly extended from this state to reach the stroke end, and the engaging portion 808 is held in a state of being positioned in the opening 674 and being fitted with a gap left on both sides in the shutter movement direction. This position is the engagement standby position. The compressed air continues to be supplied to the air cylinder 800, and even if the nozzle stocker 600 is detached from the stocker holding table 764, the engagement member 806 is held in the state of being positioned at the engagement standby position, and then the engagement portion 808 is fitted into the opening 674 when the nozzle stocker 600 is mounted on the stocker holding table 764.

The control system structure of the substrate work machine 16 will be described with reference to fig. 7. The substrate working machine 16 is provided with a control device 140 and the like in addition to the above-described configuration. The control device 140 includes a CPU141, a RAM142, a ROM143, and the like. The CPU141 controls the respective parts electrically connected by executing various programs stored in the ROM 143. Here, each section refers to the conveyance device 22, the moving device 24, the head unit 28, the supply device 26, the shutter moving device 770, and the like. The RAM142 is used as a main storage device used by the CPU141 for executing various processes. The ROM143 stores a control program, various data, and the like.

The conveyance device 22 includes, in addition to the above-described configuration, a drive circuit 132 that drives the conveyance motor 46, a drive circuit 133 that drives the substrate holding device 48, and the like. The moving device 24 has a driving circuit 134 for driving the X-axis motor 64, a driving circuit 135 for driving the Y-axis motor 62, and the like, in addition to the above-described configuration.

The head unit 28 has a drive circuit 136 for driving the positive and negative pressure supply device 52, a drive circuit 137 for driving the nozzle lifting device 54, a drive circuit 138 for driving the nozzle rotation device 56, and the like, in addition to the above-described configuration. The supply device 26 has a driving circuit 131 for driving the delivery device 78, in addition to the above-described configuration. The shutter moving device 770 has a driving circuit 139 for driving the cylinder 800, and the like, in addition to the above-described configuration.

With such a control system configuration, servo control is performed on the substrate work machine 16. In the servo control, the control device 140 functions as a controller, and the driving circuits 131, 132, 133, 134, 135, 136, 137, 138 function as servo amplifiers. Accordingly, a servo motor is used for the conveyance motor 46, the Y-axis motor 62, and the X-axis motor 64. Further, in the substrate holding device 48, the positive and negative pressure supply device 52, the nozzle lifting device 54, the nozzle rotating device 56, and the delivery device 78, servo motors are used as driving units and detecting units for servo control.

As shown in fig. 8, in the case where the mounting head 29 is mounted on the head unit 28 in the substrate working machine 16, the electronic component 58 held by the suction nozzle 260 is mounted on the electronic substrate 44 as described above. Further, in fig. 8, for the sake of schematic representation, one suction nozzle 260 among the four suction nozzles 260 held in the mounting head 29 is shown.

In contrast, when the GL head 500 is attached to the attachment head 29, the adhesive 902 is extruded from the tip of the needle 900 provided in the GL head 500. Accordingly, a cylinder (not shown) that communicates with the needle 900 and accommodates the adhesive 902 is incorporated in the GL head 500, and positive-pressure air is supplied from the positive-pressure and negative-pressure supply device 52 of the head unit 28 to the cylinder (not shown). Thus, the substrate working machine 16 can perform a work (hereinafter, simply referred to as a coating work) of coating the adhesive 902 on the electronic substrate 44.

However, when the adhesive 902 is attached to the outer periphery of the tip end of the needle 900 or the like, there is a possibility that the shape of the adhesive 902 applied to the electronic substrate 44 is deformed or the adhesive 902 is attached to the electronic substrate 44 other than the application point. Therefore, the substrate working machine 16 is provided with a cleaning unit 910 for removing the adhesive 902 adhering to the outer periphery of the tip end of the needle 900 or the like.

The cleaning unit 910 is attached to the stocker holding table 764 of the frame unit 30 instead of the nozzle stocker 600. Accordingly, similarly to the nozzle stocker 600, the lower side of the cleaning unit 910 is supported by the positioning pins 774, the support members 820, and the like protruding upward from the stocker holding table 764, and is attached to the stocker holding table 764 of the frame portion 30.

The cleaning unit 910 includes a main body 912, a guide rail 914, a slider 916, a guide plate 918, and the like. The guide rail 914 is provided along the front-rear direction D2 on the upper surface of the main body 912 having a substantially rectangular parallelepiped shape in plan view. The slider 916 is slidably mounted on the rail 914. The guide plate 918 is fixed to the left surface of the slider 916, and extends through the left side of the body 912 to a position lower than the body 912.

An opening 920 is formed at the lower end of the guide plate 918. The length of the opening 920 in the front-rear direction D2 is slightly shorter than the length of the engagement portion 808 of the shutter moving device 770 in the front-rear direction D2. When the cleaning unit 910 is attached to the stocker holding table 764 of the frame portion 30, the engagement portion 808 located at the above-described nozzle removal preventing position is fitted into the opening 920 with a gap left in the front-rear direction D2.

The cleaning unit 910 further includes a first support portion 922 and a second support portion 924 that face each other in the front-rear direction D2. The first support 922 is provided on the upper surface of the main body 912 so as to protrude upward in contact with the rear end of the rail 914. The second support 924 is provided on the upper surface of the slider 916 so as to protrude upward. Accordingly, when the engaging portion 808 of the shutter moving device 770 moves from the above-described nozzle-removal preventing position to the nozzle-removal allowing position, the second supporting portion 924 provided on the slider 916 moves rearward, approaching the first supporting portion 922.

A first wiper 926 is provided on a front surface of the first support 922 facing the second support 924. A second wiper 928 is provided on the rear surface of the second support 924 facing the first support 922. The first wiper 926 and the second wiper 928 are made of a soft material such as a sponge that easily absorbs the adhesive 902.

As shown in fig. 9, a pair of protruding portions 930a, 930b having a triangular shape in plan view are formed on the side surface of the second wiper 928 facing the first wiper 926, to the right and left of the needle 900 located at a lower limit position described later. A pair of protrusions 930a, 930b protrude toward the first wiper 926. A flat surface 929 of the second wiper 928 facing the first wiper 926 is formed between the pair of protruding portions 930a, 930b. The flat surface 929 of the second wiper 928 is connected to the inclined surface 932a on the left side of one protruding portion 930a on the right side thereof, and is connected to the inclined surface 932b on the right side of the other protruding portion 930b on the left side thereof. The left inclined surface 932a of one protruding portion 930a faces rearward (needle 900) as it faces rightward. The inclined surface 932b on the right side of the other protruding portion 930b faces rearward (needle 900) as it faces leftward.

Further, a pair of protruding portions 930a, 930b may be provided to the first wiper 926. In this case, the pair of protruding portions 930a, 930b are provided on the side surface of the first wiper 926 facing the second wiper 928. Alternatively, one of the pair of protruding portions 930a, 930b may be provided to the second wiper 928, and the other may be provided to the first wiper 926. Hereinafter, the pair of protruding portions 930a and 930b will be collectively referred to as protruding portion 930 without distinction.

The control program of the cleaning method 10 shown in the flowchart of fig. 10 is stored in the ROM143 of the control device 140, and is executed by the CPU141 of the control device 140 when the adhesive 902 adhering to the outer periphery of the tip end or the like of the needle 900 is removed from the substrate work machine 16. The control routine shown in the flowchart of fig. 10 will be described below with reference to specific examples shown in fig. 11 to 16. When the cleaning method 10 is executed, first, a cleaning process S10 is performed.

The cleaning process S10 includes a pressing process S12, a approaching process S14, a pinching process S16, and a rotating process S18. In the pressing process S12, as shown in fig. 11, the outer periphery of the tip of the needle 900 is pressed against the first wiper 926. Therefore, the needle 900 at the initial position moves downward to the lower limit position between the first wiper 926 and the second wiper 928 in the front-rear direction D2 at the tip end thereof, and then moves rearward until being pressed by the first wiper 926. As a result, as shown in fig. 11 and 14, the rear portion of the outer periphery of the tip of the needle 900 is in contact with the first wiper 926.

In the approaching process S14, as shown in fig. 12, the second support portion 924 is moved rearward to approach the first support portion 922. Therefore, the engagement portion 808 of the shutter moving device 770 is moved from the above-described nozzle-extraction preventing position to the nozzle-extraction allowing position by the air cylinder 800. Thus, in the holding process S16, as shown in fig. 12 and 15, the entire outer periphery of the tip of the needle 900 is held by the first wiper 926 and the second wiper 928.

At this time, the flat surface 929 of the second wiper 928, the inclined surface 932a on the left side of the one protruding portion 930a, and the inclined surface 932b on the right side of the other protruding portion 930b are in contact so as to surround the front portion of the outer periphery of the tip of the needle 900. Thus, the protruding portion 930 contacts the region of the needle 900 that is not opposite to the first wiper 926 and the second wiper 928.

In the rotation process S18, as shown in fig. 16, for example, the needle 900 is rotated about the axis 934 thereof in a clockwise direction in a plan view. Such rotation of the needle 900 is performed by the nozzle rotation device 56 of the head unit 28 to which the GL head 500 is mounted.

In the recovery process S20, the needle 900 is returned to the home position. Thus, first, the rotation of the needle 900 is stopped. Next, as shown in fig. 13, the needle 900 is returned to the initial position while being lifted. Thereby, the needle 900 is pulled out from between the first wiper 926 and the second wiper 928, and the adhesive 902 adhering to the outer periphery of the tip of the needle 900 or the like is removed. The needle 900 may be rotated and raised. Thereafter, the engaging portion 808 of the shutter moving device 770 is moved from the above-described nozzle take-out permission position to the nozzle take-out prevention position by the air cylinder 800. Thereby, the first wiper 926 is separated from the second wiper 928.

In the present embodiment, for example, as shown in fig. 17, when the stopper 936 is connected to the right side of the needle 900 via the connection portion 938, the adhesive 902 attached to the outer periphery of the distal end of the needle 900 can be removed in addition to the adhesive attached to the stopper 936, the connection portion 938, and the like. In the following description, the same reference numerals are given to the portions substantially common to the present embodiment, and detailed description thereof is omitted.

In this case, the tip of the protruding portion 930a of the second wiper 928 faces the connecting portion 938 between the needle 900 and the stopper 936 at the lower limit position. Further, a protruding portion 940 having a triangular shape in a plan view is formed on the first wiper 926 and on a plane 942 opposed to the second wiper 928, at a position right of the stopper 936 positioned at the lower limit.

In this way, in the above-described sandwiching process S16, when the entire region of the outer periphery of the tip of the needle 900 is sandwiched by the first wiper 926 and the second wiper 928, the tip of the protruding portion 930a of the second wiper 928 enters between the stopper 936 and the needle 900. Thus, the protruding portion 930a of the second wiper 928 contacts the stopper 936, the needle 900, and the coupling portion 938. Further, the stopper 936 is contacted so as to be surrounded by the flat surface 942 of the first wiper 926, the inclined surface 944 on the left side of the protruding portion 940 of the first wiper 926, and the inclined surface 932c on the right side of the protruding portion 930a of the second wiper 928. The inclined surface 944 on the left side of the protruding portion 940 of the first wiper 926 is directed forward (stopper 936) as it is directed rightward. The inclined surface 932c on the right side of the protruding portion 930a of the second wiper 928 faces rearward (stopper 936) as it faces leftward.

In addition, the stopper 936 keeps a certain distance between the tip of the needle 900 and the electronic substrate 44 by making the lower end of the stopper 936 collide with the electronic substrate 44 during the coating operation.

Next, the timing of executing the cleaning method 10 will be described. The cleaning method 10 is performed when the coating operation is performed. For this purpose, first, a brief description will be given of the coating operation with reference to fig. 18. The control program shown in the flowchart of fig. 18 is stored in the ROM143 of the control device 140, and is executed by the CPU141 of the control device 140 when a coating operation is performed on the substrate work machine 16.

In the start processing S30, a start button, not shown, is pressed by the operator. Thereby, the coating operation is started. In the correction process S32, the GL head 500 with the needle 900 attached thereto is calibrated. Here, when the calibration in the correction processing S32 is poor (S34: no), the condition correction processing S36 is performed. In the condition correction process S36, the operator performs condition correction of the coating operation, cleaning of the GL head 500, and the like. After that, the start processing S30 is repeated. On the other hand, if the calibration in the correction process S32 is good (yes in S34), the production process S38 is performed. In the production process S38, the adhesive 902 is applied to the electronic substrate 44 using the needle 900 attached to the GL head 500. When the number of electronic substrates 44 coated with the adhesive 902 reaches a predetermined number, the control routine shown in the flowchart of fig. 18 ends.

In the application work performed in this way, the cleaning method 10 may be performed at, for example, time T1 between the condition correction process S36 and the start process S30, at time T2 between the determination process S34 and the production process S38, or at time T3 every time the adhesive 902 is applied to a predetermined number of electronic substrates 44 in the production process S38.

The cleaning method 10 may be performed at a timing immediately after the exhaust of the interior of the GL head 500 is performed, or at an arbitrary timing based on an instruction from the operator.

As described in detail above, in the substrate alignment machine 16 including the needle 900 for applying the adhesive 902 to the electronic substrate 44, the first support portion 922 and the second support portion 924 provided with the first wiper 926 and the second wiper 928 are brought close to remove the adhesive 902 from the outer periphery of the tip end or the like of the needle 900, so that the needle 900 is more preferably cleaned.

Incidentally, in the present embodiment, the suction nozzle 260 is an example of a suction nozzle. The state of the nozzle stocker 600 when the engagement portion 808 is located at the nozzle extraction blocking position is an example of the nozzle extraction blocking state. The state of the nozzle stocker 600 when the engagement portion 808 is located at the nozzle take-out permission position is an example of the nozzle take-out permission state. The cylinder 800 is an example of an actuator and a driving device. Needle 900 is an example of a feeding member. The shaft 934 of the needle 900 is an example of a shaft of a supply member. The approach processing S14 in the cleaning processing S10 is an example of the cleaning processing and the cleaning process.

In the substrate working machine of the present invention, the first wiper may be provided on at least one surface of the first wiper.

In this case, the flat surface 929 of the second wiper 928, the inclined surface 932a on the left side of the one protruding portion 930a, and the inclined surface 932b on the right side of the other protruding portion 930b are examples of three surfaces. The flat surface 942 of the first wiper 926, the inclined surface 944 on the left side of the protruding portion 940 of the first wiper 926, and the inclined surface 932c on the right side of the protruding portion 930a of the second wiper 928 are examples of three surfaces.

The present disclosure is not limited to the above embodiments, and various modifications can be made without departing from the spirit and scope thereof.

For example, the mounting head 29 may hold a transfer pin for transferring solder to the electronic board 44 instead of the suction nozzle 260. In this case, for example, the needle transfer nozzle 950 shown in fig. 19 is held by the mounting head 29.

The needle transfer nozzle 950 includes a holder suction portion 952, a flange portion 954, a coupling portion 956, a plurality of transfer pins 958, and the like. The holder suction portion 952 has a disk shape. The holder suction portion 952 is sucked to the mounting head 29. The flange 954 has a disk shape with a smaller diameter than the holder suction portion 952. The flange 954 is disposed below the holder suction portion 952. The connection portion 956 has a columnar shape long in the up-down direction D3. The connection portion 956 connects the bracket suction portion 952 and the flange portion 954. The plurality of transfer pins 958 are disposed on the lower surface of the flange 954. The plurality of transfer pins 958 are configured to mirror-symmetrical to the land pattern of the electronic substrate 44. A transfer solder 960 is attached to the tips of the plurality of transfer pins 958 by an immersion device, not shown.

Even in this case, the cleaning unit 910 can remove the solder 960 adhering to the outer peripheries of the tips of the plurality of transfer pins 958 and the like by bringing the first support portion 922 and the second support portion 924 provided with the first wiper 926 and the second wiper 928 close to each other, and thereby desirably clean the plurality of transfer pins 958.

Incidentally, a plurality of transfer pins 958 is one example of a supply member. Solder 960 is one example of a fluid.

In addition, the concept of cleaning includes cleaning by cleaning with a liquid.

Description of the reference numerals

10: cleaning method 16: for the substrate working machine 44: electronic substrate 140: control device 260: suction nozzle 600: nozzle stocker 800: cylinder 900: needle 902: adhesive 922: first support 924: second support 926: first wiper 928: second wiper 929: plane 930 of the second wiper: the protruding portion 932a of the second wiper body: an inclined surface 932b on the left side of one protruding portion: an inclined surface 932c on the right side of the other protruding portion: an inclined surface 934 on the right side of one protruding portion: needle shaft 942: plane 944 of first wiper: inclined surface 958 on the left side of the protruding portion of the first wiper: transfer pin 960: solder S10: cleaning process S12: pressing process S14: approach processing S16: clamping process S18: spin processing

Claims

1. A substrate working machine is provided with:

a supply member that supplies a fluid used for producing the electronic substrate to the electronic substrate;

a first supporting part for the first wiping body;

a second supporting part for the second wiping body to be arranged;

a driving device that is used as an actuator for moving at least one of the first support portion and the second support portion, and that shifts a nozzle stocker that accommodates a nozzle used in the production of the electronic substrate to a state allowing nozzle take-out or a state preventing nozzle take-out; and

a control unit that executes the following cleaning process: the supply member is cleaned by bringing the first support portion and the second support portion into a state of proximity by the driving device,

the control section causes the nozzle stocker to shift from the nozzle take-out permission state to the nozzle take-out prevention state by the driving device, thereby separating the first wiper from the second wiper.

2. The work machine for aligning a substrate according to claim 1, wherein,

the cleaning process includes a pressing process of pressing the supply member against the first wiper body.

3. The work machine for aligning a substrate according to claim 1 or 2, wherein,

the cleaning process includes a holding process of holding the supply member with the first wiper and the second wiper.

4. The work machine for aligning a substrate according to claim 3, wherein,

the cleaning process includes a rotation process of rotating the supply member about an axis of the supply member.

5. The work machine for aligning a substrate according to claim 3, wherein,

at least one of the first wiper and the second wiper has a protruding portion protruding toward at least the other of the first wiper and the second wiper opposite to the at least one of the first wiper and the second wiper,

the protruding portion is in contact with a region of the supply member which is not opposed to the first wiper body and the second wiper body.

6. The work machine for aligning a substrate according to claim 4, wherein,

7. In a substrate working machine provided with a supply member for supplying a fluid used in the production of an electronic substrate to the electronic substrate, a first support portion for a first wiper, a second support portion for a second wiper, and a driving device for wiping the fluid from the supply member, the driving device is used as an actuator for moving at least one of the first support portion and the second support portion, and for shifting a nozzle stocker for accommodating a nozzle used in the production of the electronic substrate to a state allowing or preventing the nozzle from being taken out,

the cleaning method comprises the following steps:

a cleaning step of cleaning the supply member by bringing the first support portion and the second support portion into a state of proximity by the driving device; and

and a separation step of separating the first wiper from the second wiper by transferring the nozzle stocker from the nozzle take-out permission state to the nozzle take-out prevention state by the driving device.