CN114615877A - Chip mounting mechanism and method for improving working efficiency and chip mounting precision of die bonder - Google Patents
Chip mounting mechanism and method for improving working efficiency and chip mounting precision of die bonder Download PDFInfo
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- CN114615877A CN114615877A CN202210191658.XA CN202210191658A CN114615877A CN 114615877 A CN114615877 A CN 114615877A CN 202210191658 A CN202210191658 A CN 202210191658A CN 114615877 A CN114615877 A CN 114615877A
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- 230000001360 synchronised effect Effects 0.000 claims description 16
- 238000007689 inspection Methods 0.000 claims description 12
- 238000011179 visual inspection Methods 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims 1
- 230000008569 process Effects 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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Abstract
The invention provides a chip mounting mechanism and a chip mounting method for improving the working efficiency and chip mounting precision of a die bonder.
Description
Technical Field
The invention relates to the technical field of SMT electronic component production, in particular to a chip mounting mechanism and a chip mounting method for improving the working efficiency and chip mounting precision of a die bonder.
Background
The chip mounter in the chip mounter constructs the structure of many swing arms of chip mounter or single suction nozzle linear drive structure, can have following problem: (1) the distance between the two structures from the adsorption pickup to the bonding process in the Y direction is large, the consumed time is longest, the current mounting capacity efficiency is poor, and the equipment efficiency limit of the single-nozzle linear driving structure is 14K/H; (2) in the laminating process, a mechanical sensor is used for sensing pressure, but the pressure precision requirement of chip laminating cannot accurately meet the standard requirement; (3) the stroke error or the circumferential error on the X, Y, Z shaft existing in the chip attaching process has no precision compensation, and the precision requirement cannot meet the standard requirement; (4) the patch mechanism has overlarge load, the wear rate of the structural part is overhigh under the limit capacity, and the production and maintenance cost is overhigh.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a chip mounting mechanism and a chip mounting method for improving the working efficiency and the chip mounting precision of a die bonder.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip mounting mechanism for improving the working efficiency and chip mounting precision of a die bonder,
the mechanism comprises a mechanism base, two groups of mounting components and a linear operation assembly, wherein the front end of the mechanism base is provided with a mounting support, the two groups of mounting components are arranged on the mechanism base in an attached mode, have the same structure and are fixedly spaced in the Y-axis direction, and the two groups of mounting components are set, so that one Y-direction reciprocating motion action is reduced in the process of picking and mounting two chips, the beat time is effectively shortened, and the working efficiency is improved;
the mounting component comprises a mounting head component and a voice coil motor component, the voice coil motor component comprises a motor stator and a motor rotor, the motor stator is fixedly arranged on the mechanism base, the motor rotor is connected with the component, and the motor rotor only moves in the Z-axis direction relative to the motor stator; the mounting head assembly is fixed on the mounting bracket in a circumferential rotating mode through a bearing set, the mounting head assembly is arranged downwards, and a mounting head is arranged at the lowest part of the mounting head assembly; the voice coil motor is set, so that the upper and lower micro processes of the mounting head can be controlled independently in the picking process, other chips cannot be touched by mistake in the picking process, and meanwhile, the mounting acting force can be controlled by adjusting the current in the mounting process to replace the traditional sensor induction;
the linear operation assembly comprises three groups of X-axis operation assemblies, Y-axis operation assemblies and Z-axis operation assemblies which are arranged in the X-axis direction, the Y-axis direction and the Z-axis direction and driven by linear motors, and the X-axis operation assemblies, the Y-axis operation assemblies and the Z-axis operation assemblies respectively drive the mechanism base and the surface-mounted component to perform linear operation along the X-axis direction, the Y-axis direction and the Z-axis direction.
Preferably, the mounting component further comprises a servo motor assembly, wherein the servo motor assembly comprises a servo motor provided with a rotating shaft, two synchronous wheels respectively arranged on the rotating shaft and the mounting head assembly, and a synchronous belt; the synchronous belt is sleeved on the two synchronous wheels, the servo motor is erected on the mechanism base and is arranged at the rear position of the mounting head component, the rear servo motor is utilized and the synchronous belt is used for driving the mounting head component to rotate, the weight above the mounting head component is reduced, the torque used by the mounting head component, particularly the mounting head component, in the circumference compensation process is reduced, the abrasion of the mounting head component and the servo motor is reduced, and the synchronous belt is more favorable for maintaining equipment and prolonging the service life of the equipment.
Preferably, the X-axis running assembly comprises an X-direction motor bracket, an X-direction linear motor and an X-direction linear slide rail; the Y-axis running assembly comprises a Y-direction motor support, a Y-direction linear motor, a Y-direction linear slide rail, a Y-direction sliding assembly and a Y-direction guide rail assembly; the Z-direction motor support is arranged on the base, and the Z-direction linear motor support is arranged on the base.
Preferably, the Y-direction motor support is fixed on the X-direction motor support, and the Z-direction motor support is fixed on the Y-direction motor support;
the X-direction linear motor is fixed on the X-direction motor bracket, and the X-direction linear slide rail is fixed on the X-direction motor bracket; the Y-direction linear motor is fixed on the Y-direction motor bracket, and the Z-direction linear motor is fixed on the Z-direction motor bracket;
the Y-direction linear sliding rail is fixed on the Y-direction guide rail assembly, the Z-direction linear sliding rail is fixed on the Y-direction sliding assembly, the Y-direction guide rail assembly is connected with the X-direction linear sliding rail through a first linear sliding block, and the Y-direction sliding assembly is connected with the Y-direction linear sliding rail through a second linear sliding block;
the mounting bracket is connected with the Z-direction linear slide rail through a third linear slide block;
the rotor of the X-direction linear motor is connected with the Y-direction guide rail assembly, the rotor of the Y-direction linear motor is connected with the Y-direction sliding assembly, and the rotor of the Z-direction linear motor is connected with the mounting support.
In the straight line operation subassembly, the part structure is retrencied between X axle operation subassembly, Y axle operation subassembly, the Z axle operation subassembly, especially the integration of Y to the slip subassembly, Y to the guide rail subassembly, lets equipment in the straight line operation in-process, and the route is simple, and the structure is retrencied, lets equipment quality reduce to promote overall equipment operating efficiency.
A chip mounting method for improving working efficiency and chip mounting precision of a die bonder comprises the following steps:
s1, pick and fit position setting: setting the position coordinates of a pickup chip as a position A, and the position coordinates of two pasted chips as a position B and a coordinate C;
s2, picking up by the left mounting head: the left mounting head is located at the position A, the mounting bracket is driven by the Z-direction linear motor to descend to a first picking position, the left mounting head is driven by the left voice coil motor to descend to a second picking position, the left mounting head picks up a chip, and the left mounting head is driven by the left voice coil motor to ascend to the first picking position;
s3, picking up by the right mounting head: the Y-direction linear motor drives the mounting support to move left, the right mounting head moves left to a position A, the right voice coil motor drives the right mounting head to descend to a second picking position, the right mounting head picks up one chip, and the right voice coil motor drives the right mounting head to ascend to a first picking position;
s4, visual inspection and compensation: the visual inspection part respectively performs error inspection on the positions of the chips picked up by the left mounting head and the right mounting head, wherein the error inspection comprises the position deviation of the inspection chip on the axis and the position deviation of the chip on the circumferential angle, the processing end generates an axis compensation command and a circumference compensation command according to the inspection result of the visual inspection part, and transmits the axis compensation command to be executed by the Y-direction linear motor, the X-direction linear motor and the circumference compensation command to be executed by the servo motor;
s5, axial direction movement and axial compensation: the Y-direction linear motor and the X-direction linear motor receive and execute an axis compensation instruction of the processing end, the Z-direction linear motor drives the mounting bracket to ascend to a pre-picking position, the Y-direction linear motor drives the mounting bracket to move to the left to a position B according to the axis compensation instruction, and the X-direction linear motor drives the mounting bracket to move and compensate along the X direction according to the axis compensation instruction;
s6, circumference compensation: the servo motor receives and executes a circumferential compensation command of the processing end, and angular rotation compensation is respectively carried out on the two mounting head assemblies through the synchronous belt;
s7, mounting the right mounting head: the right mounting head is located at the position B, the Z-direction linear motor drives the mounting bracket to descend to the first mounting position, the right voice coil motor drives the right mounting head to descend to the second mounting position, the right mounting head mounts a chip, and the right voice coil motor drives the right mounting head to ascend to the first mounting position;
s8, mounting the left mounting head: the Y-direction linear motor drives the mounting support to move left, the left mounting head moves left to a position C, the left voice coil motor drives the left mounting head to descend to a second mounting position, the left mounting head mounts a chip, and the left voice coil motor drives the left mounting head to ascend to a first mounting position;
s9, picking and homing: and the mounting support is driven by the linear motor in the Z direction to ascend, the mounting support is driven by the linear motor in the Y direction to move to the right, and the mounting support is driven by the linear motor in the X direction to move to the left mounting head to move to the coordinate original position of the pick-up chip A.
Furthermore, in S3 and S9, the Z-direction linear motor, the Y-direction linear motor, and the X-direction linear motor respectively and simultaneously perform driving actions, thereby effectively improving the efficiency.
Further, in S7 and S8, the right side is pasted and is adorned a chip, a chip is pasted and is adorned head dress chip, left side, all is driven by voice coil motor, the first second that descends is pasted and is adorned to voice coil motor drive left side is pasted and is adorned the head with the right side, predetermines by the processing end and pastes dress power value to through the electric current size on the adjustment voice coil motor coil by voice coil motor, the control is actually pasted the effort and is reached and predetermine dress power value, thereby reaches the effect of accurate control laminating effort.
Further, in S3, Y moves to the linear electric motor drive subsides dress support left side, and the right side is pasted dress head left side and is moved to position A' S in-process, and X can be based on left side and paste dress head and right side and paste dress head difference drive dress support and make displacement compensation in the X axle direction at the epaxial fixed coordinate of X to linear electric motor, makes the accurate left side of right side subsides dress head move to position A, two subsides dress head X axle errors on the compensation preparation technology.
Further, in S8, the Y moves to the left to the linear motor driving mounting bracket, the left mounting head moves to the left to position C, and the X moves to the left to the linear motor to drive the mounting bracket to perform displacement compensation in the X axis direction based on the fixed coordinate difference of the left mounting head and the right mounting head on the X axis, so that the left mounting precision head moves to the left to position C to compensate the X axis error of the two mounting heads in the manufacturing process.
Compared with the prior art, the invention has the beneficial effects that: (1) the two groups of mounting components are set, so that the action of Y-direction reciprocating motion is reduced in the process of picking and mounting two chips, thereby effectively shortening the beat time and improving the working efficiency; (2) the voice coil motor is set, so that the upper and lower micro processes of the mounting head can be controlled independently in the picking process, other chips cannot be touched by mistake in the picking process, and meanwhile, the mounting acting force can be controlled by adjusting the current in the mounting process, the traditional sensor induction is replaced, and the mounting precision is improved; (3) the rear servo motor is utilized, the synchronous belt is used for driving the mounting head assembly to rotate, the weight above the mounting head assembly is reduced, the torque used by the mounting head assembly, particularly the mounting head in the circumferential compensation process is reduced, the abrasion of the mounting head assembly and the servo motor is reduced, the maintenance of equipment is facilitated, and the service life of the equipment is prolonged; (4) in the linear operation assembly, the parts among the X-axis operation assembly, the Y-axis operation assembly and the Z-axis operation assembly are simplified in structure, and particularly the Y-direction sliding assembly and the Y-direction guide rail assembly are integrated, so that the equipment is simple in path and simplified in structure in the linear operation process, the quality of the equipment is reduced, and the operation efficiency of the overall equipment is improved; (5) utilize linear electric motor's effect principle, conveniently carry out the straight line compensation to the error that picks up and laminate in-process existence, promote and paste the dress precision.
Drawings
FIG. 1 is a right schematic view of a linearly traveling assembly according to embodiment 1 of the present invention;
FIG. 2 is a schematic front view of a linearly traveling module according to embodiment 1 of the present invention;
FIG. 3 is a schematic view of a servo motor and a voice coil motor according to embodiment 1 of the present invention;
FIG. 4 is a schematic flow chart of embodiment 2 of the present invention;
description of reference numerals: the linear motor comprises a 1X-direction motor support, a 2X-direction linear motor, a 3X-direction linear sliding rail, a 4Y-direction motor support, a 5Y-direction linear motor, a 6Z-direction motor support, a 7Z-direction linear motor, an 8-mounting support, a 9Z-direction linear sliding rail, a 10Y-direction sliding assembly, a 11Y-direction guide rail assembly, a 12Y-direction linear sliding rail, a 13-mounting head assembly, a 131-mounting head, a 132 bearing, a 14-mechanism base, a 15-voice coil motor assembly, a 16-motor stator, a 17-motor rotor, an 18-servo motor, a 19 rotating shaft, a 20-synchronous wheel and a 21-synchronous belt.
Detailed Description
In order to further understand the objects, structures, features and functions of the present invention, the following embodiments are described in detail.
Embodiment 1, as shown in fig. 1 to 3, a die bonder mechanism for improving working efficiency and die bonder precision includes a mechanism base 14 having a die bonder bracket 8 at a front end thereof, two die bonder components attached to the mechanism base 14 and having the same structure and a fixed interval in a Y-axis direction, and a linear motion assembly.
Because the manufacturing process requirement of the die bonder patch mechanism is high, ideally, the mounted components only have fixed intervals in the Y-axis direction, the general interval is 23-25mm, and actually, a position error also exists in the X-axis in the manufacturing process.
The two groups of mounting components are set, so that the action of Y-direction reciprocating motion is reduced in the process of picking and mounting two chips, the beat time is effectively shortened, the working efficiency is improved, and the equipment efficiency is improved to more than 24K/H from the original 14K/H.
The surface-mounted part comprises a surface-mounted head assembly 13 and a voice coil motor assembly 15, wherein the voice coil motor assembly 15 comprises a motor stator 16 and a motor rotor 17, the motor stator 16 is fixedly arranged on the mechanism base 14, the motor rotor 17 is connected with the part, and the motor rotor 17 only moves in the Z-axis direction relative to the motor stator 16; the mounting head assembly 13 is fixed on the mounting support 8 in a circular rotation mode through the bearing 132 group, the mounting head assembly 13 is arranged downwards, and the mounting head 131 is arranged at the lowest part of the mounting head assembly 13.
The voice coil motor is a special type direct drive motor, has the characteristics of simple structure, small volume, high speed, high acceleration response and the like, and has the working principle that a force is generated when an electrified coil (conductor) is placed in a magnetic field, the force is proportional to the current applied to the coil, and the motion form of the voice coil motor manufactured on the basis of the principle can be a straight line or an arc.
Therefore, the force is proportional to the current applied to the coil, the effect of the mechanical sensor in the mounting process can be improved, the structure of the mounted component can be simplified, and the process requirements of mounting different types of chips can be applied more effectively.
The linear operation assembly comprises three groups of X-axis operation assemblies, Y-axis operation assemblies and Z-axis operation assemblies which are arranged in the X-axis direction, the Y-axis direction and the Z-axis direction and driven by linear motors, and the X-axis operation assemblies, the Y-axis operation assemblies and the Z-axis operation assemblies respectively drive the mechanism base 14 and the surface-mounted component to perform linear operation along the X-axis direction, the Y-axis direction and the Z-axis direction.
In the specific implementation of this embodiment, the mounting component further includes a servo motor 18 assembly, where the servo motor 18 assembly includes a servo motor 18 having a rotating shaft 19, two synchronous wheels 20 respectively disposed on the rotating shaft 19 and the mounting head assembly 13, and a synchronous belt 21; hold-in range 21 cup joints on two synchronizing wheels 20, servo motor 18 erects on mechanism base 14, set up in the first subassembly 13 rear position of subsides, servo motor 18 if direct mount is on the first subassembly 13 of subsides, not only can improve on the technological requirement, the promotion that the cost that can lead to production facility is showing like this, the weight of pasting first subassembly 13 top itself is installed in the increase simultaneously, make circumference compensation process paste the increase of the moment of torsion that first subassembly 13 especially pasted the first 131 use, make the wearing and tearing of pasting first subassembly 13 and servo motor 18, it aggravates to age, increase the later maintenance degree of difficulty and cost.
In the specific implementation of the embodiment, the X-axis operation assembly comprises an X-direction motor bracket 1, an X-direction linear motor 2 and an X-direction linear slide rail 3; the Y-axis running assembly comprises a Y-direction motor support 4, a Y-direction linear motor 5, a Y-direction linear slide rail 12, a Y-direction sliding assembly 10 and a Y-direction guide rail assembly 11; comprises a Z-direction motor bracket 6, a Z-direction linear motor 7 and a Z-direction linear slide rail 9.
In the specific implementation of the embodiment, the Y-direction motor support 4 is fixed on the X-direction motor support 1, and the Z-direction motor support 6 is fixed on the Y-direction motor support 4;
the X-direction linear motor 2 is fixed on the X-direction motor support 1, and the X-direction linear slide rail 3 is fixed on the X-direction motor support 1; the Y-direction linear motor 5 is fixed on the Y-direction motor support 4, and the Z-direction linear motor 7 is fixed on the Z-direction motor support 6;
the Y-direction linear slide rail 12 is fixed on the Y-direction guide rail assembly 11, the Z-direction linear slide rail 9 is fixed on the Y-direction sliding assembly 10, the Y-direction guide rail assembly 11 is connected with the X-direction linear slide rail 3 through a first linear slide block, and the Y-direction sliding assembly 10 is connected with the Y-direction linear slide rail 12 through a second linear slide block;
the mounting bracket 8 is connected with a Z-direction linear slide rail 9 through a third linear slide block;
the rotor of the X-direction linear motor 2 is connected with the Y-direction guide rail assembly 11, the rotor of the Y-direction linear motor 5 is connected with the Y-direction sliding assembly 10, and the rotor of the Z-direction linear motor 7 is connected with the mounting support 8.
All structural parts in this embodiment all use the aluminum alloy material, reduce the quality of equipment as far as, also can promote operating rate to a certain extent.
s1, pickup and bonding position setting: setting the position coordinates of a pickup chip as a position A, and the position coordinates of two pasted chips as a position B and a coordinate C;
s2, picking up by the left mounting head: the left mounting head is located at the position A, the mounting bracket is driven by the Z-direction linear motor to descend to the first picking position, the left voice coil motor drives the left mounting head to descend to the second picking position, the left mounting head picks up one chip, and the left voice coil motor drives the left mounting head to ascend to the first picking position;
s3, picking up by the right mounting head: the Y-direction linear motor drives the mounting support to move left, the right mounting head moves left to a position A, the right voice coil motor drives the right mounting head to descend to a second picking position, the right mounting head picks up one chip, and the right voice coil motor drives the right mounting head to ascend to a first picking position;
s4, visual inspection and compensation processing: the visual inspection part respectively performs error inspection on the positions of the chips picked up by the left mounting head and the right mounting head, wherein the error inspection comprises the position deviation of the inspection chip on the axis and the position deviation of the chip on the circumferential angle, the processing end generates an axis compensation command and a circumference compensation command according to the inspection result of the visual inspection part, and transmits the axis compensation command to be executed by the Y-direction linear motor, the X-direction linear motor and the circumference compensation command to be executed by the servo motor;
s5, axial direction movement and axial compensation: the Y-direction linear motor and the X-direction linear motor receive and execute an axis compensation instruction of the processing end, the Z-direction linear motor drives the mounting bracket to ascend to a pre-picking position, the Y-direction linear motor drives the mounting bracket to move to the left to a position B according to the axis compensation instruction, and the X-direction linear motor drives the mounting bracket to move and compensate along the X direction according to the axis compensation instruction;
s6, circumference compensation: the servo motor receives and executes a circumference compensation command of the processing end, and respectively carries out angle rotation compensation on the two mounting head assemblies through the synchronous belt;
s7, mounting a right mounting head: the right mounting head is located at the position B, the Z-direction linear motor drives the mounting bracket to descend to the first mounting position, the right voice coil motor drives the right mounting head to descend to the second mounting position, the right mounting head mounts a chip, and the right voice coil motor drives the right mounting head to ascend to the first mounting position;
s8, mounting the left mounting head: the Y-direction linear motor drives the mounting support to move left, the left mounting head moves left to a position C, the left voice coil motor drives the left mounting head to descend to a second mounting position, the left mounting head mounts a chip, and the left voice coil motor drives the left mounting head to ascend to a first mounting position;
s9, picking and returning: and the mounting support is driven to ascend by the Z-direction linear motor, the mounting support is driven to move to the right by the Y-direction linear motor, and the mounting support is driven by the X-direction linear motor to move to the coordinate original position of the pick-up chip A along the X-direction to the left mounting head.
In this embodiment, in S3 and S9, the Z-direction linear motor, the Y-direction linear motor, and the X-direction linear motor are driven simultaneously.
When this embodiment is implemented specifically, in S7 and S8, a chip is pasted to right side subsides dress head, a chip is pasted to left side subsides dress head, all drive by voice coil motor, and voice coil motor drive left side is pasted dress head and right side and is pasted dress head and descend to the second and paste the dress position, predetermine by the processing end and paste the dress power value to through the electric current size on the adjustment voice coil motor coil, control actual dress effort reaches and predetermines a dress power value by voice coil motor.
When this embodiment is implemented specifically, in S3, Y moves to the linear electric motor drive subsides dress support left side, and right subsides dress head left side moves to position a' S in-process, and X can make displacement compensation in the X axis direction to linear electric motor based on left subsides dress head and right dress head difference drive subsides dress support in the epaxial fixed coordinate of X, makes the accurate left movement of right dress head to position a, two dress head X axle errors on the compensation preparation technology.
When this embodiment is implemented specifically, in S8, Y moves to the left to the linear electric motor drive pastes dress support, and left mounting head moves to position C to the left, and X makes displacement compensation to the linear electric motor can paste dress support and make in the X axle direction based on left mounting head and the difference drive of right mounting head fixed coordinate on the X axle, makes left mounting accurate head move to position C to the left, compensates two mounting head X axle errors on the manufacturing process.
In the implementation of this embodiment, in the processes from S1 to S9, the coordinates of the two mounted chips are position B and coordinate C, and in the next complete mounting process, since the mounting is performed at different mounting points on the lead frame, new position B and coordinate C need to be set again,
the present invention has been described in relation to the above embodiments, which are only exemplary of the implementation of the present invention. It should be noted that the disclosed embodiments do not limit the scope of the invention. Rather, it is intended that all such modifications and variations be included within the spirit and scope of this invention.
Claims (9)
1. The utility model provides an improve solid brilliant quick-witted work efficiency and paster mechanism of paster precision which characterized in that:
the mechanism comprises a mechanism base, two groups of surface mounting components and a linear operation assembly, wherein the front end of the mechanism base is provided with a surface mounting bracket;
the mounting component comprises a mounting head component and a voice coil motor component, the voice coil motor component comprises a motor stator and a motor rotor, the motor stator is fixedly arranged on the mechanism base, the motor rotor is connected with the component, and the motor rotor only moves in the Z-axis direction relative to the motor stator; the mounting head assembly is fixed on the mounting bracket in a circumferential rotating mode through a bearing set, the mounting head assembly is arranged downwards, and a mounting head is arranged at the lowest part of the mounting head assembly;
the linear operation assembly comprises three groups of X-axis operation assemblies, Y-axis operation assemblies and Z-axis operation assemblies which are arranged in the X-axis direction, the Y-axis direction and the Z-axis direction and driven by linear motors, and the X-axis operation assemblies, the Y-axis operation assemblies and the Z-axis operation assemblies respectively drive the mechanism base and the surface-mounted component to perform linear operation along the X-axis direction, the Y-axis direction and the Z-axis direction.
2. The die bonder for improving working efficiency and die bonding precision of claim 1, wherein: the mounting component also comprises a servo motor assembly, wherein the servo motor assembly comprises a servo motor provided with a rotating shaft, two synchronous wheels respectively arranged on the rotating shaft and the mounting head assembly, and a synchronous belt; the synchronous belts are sleeved on the two synchronous wheels, and the servo motor is erected on the mechanism base and arranged at the rear position of the mounting head component.
3. The die bonder for improving working efficiency and die bonding precision of claim 1, wherein: the X-axis running assembly comprises an X-direction motor bracket, an X-direction linear motor and an X-direction linear slide rail; the Y-axis running assembly comprises a Y-direction motor support, a Y-direction linear motor, a Y-direction linear slide rail, a Y-direction sliding assembly and a Y-direction guide rail assembly; the Z-direction motor support is arranged on the base, and the Z-direction linear motor support is arranged on the base.
4. The die bonder for improving working efficiency and die bonding precision of claim 3, wherein: the Y-direction motor support is fixed on the X-direction motor support, and the Z-direction motor support is fixed on the Y-direction motor support;
the X-direction linear motor is fixed on the X-direction motor bracket, and the X-direction linear slide rail is fixed on the X-direction motor bracket; the Y-direction linear motor is fixed on the Y-direction motor bracket, and the Z-direction linear motor is fixed on the Z-direction motor bracket;
the Y-direction linear sliding rail is fixed on the Y-direction guide rail assembly, the Z-direction linear sliding rail is fixed on the Y-direction sliding assembly, the Y-direction guide rail assembly is connected with the X-direction linear sliding rail through a first linear sliding block, and the Y-direction sliding assembly is connected with the Y-direction linear sliding rail through a second linear sliding block;
the mounting bracket is connected with the Z-direction linear slide rail through a third linear slide block;
the rotor of the X-direction linear motor is connected with the Y-direction guide rail assembly, the rotor of the Y-direction linear motor is connected with the Y-direction sliding assembly, and the rotor of the Z-direction linear motor is connected with the mounting support.
5. A chip mounting method for improving working efficiency and chip mounting precision of a die bonder is characterized by comprising the following steps: the method comprises the following steps:
s1, pick and fit position setting: setting the position coordinates of a pickup chip as a position A, and the position coordinates of two pasted chips as a position B and a coordinate C;
s2, picking up by the left mounting head: the left mounting head is located at the position A, the mounting bracket is driven by the Z-direction linear motor to descend to the first picking position, the left voice coil motor drives the left mounting head to descend to the second picking position, the left mounting head picks up one chip, and the left voice coil motor drives the left mounting head to ascend to the first picking position;
s3, picking up by the right mounting head: the Y-direction linear motor drives the mounting support to move left, the right mounting head moves left to a position A, the right voice coil motor drives the right mounting head to descend to a second picking position, the right mounting head picks up one chip, and the right voice coil motor drives the right mounting head to ascend to a first picking position;
s4, visual inspection and compensation: the visual inspection part respectively performs error inspection on the positions of the chips picked up by the left mounting head and the right mounting head, wherein the error inspection comprises the position deviation of the inspection chip on the axis and the position deviation of the chip on the circumferential angle, the processing end generates an axis compensation command and a circumference compensation command according to the inspection result of the visual inspection part, and transmits the axis compensation command to be executed by the Y-direction linear motor, the X-direction linear motor and the circumference compensation command to be executed by the servo motor;
s5, axial direction movement and axial compensation: the Y-direction linear motor and the X-direction linear motor receive and execute an axis compensation instruction of the processing end, the Z-direction linear motor drives the mounting bracket to ascend to a pre-picking position, the Y-direction linear motor drives the mounting bracket to move to the left to a position B according to the axis compensation instruction, and the X-direction linear motor drives the mounting bracket to move and compensate along the X direction according to the axis compensation instruction;
s6, circumference compensation: the servo motor receives and executes a circumferential compensation command of the processing end, and angular rotation compensation is respectively carried out on the two mounting head assemblies through the synchronous belt;
s7, mounting the right mounting head: the right mounting head is located at the position B, the Z-direction linear motor drives the mounting bracket to descend to the first mounting position, the right voice coil motor drives the right mounting head to descend to the second mounting position, the right mounting head mounts a chip, and the right voice coil motor drives the right mounting head to ascend to the first mounting position;
s8, mounting the left mounting head: the Y-direction linear motor drives the mounting support to move left, the left mounting head moves left to a position C, the left voice coil motor drives the left mounting head to descend to a second mounting position, the left mounting head mounts a chip, and the left voice coil motor drives the left mounting head to ascend to a first mounting position;
s9, picking and returning: and the mounting support is driven by the linear motor in the Z direction to ascend, the mounting support is driven by the linear motor in the Y direction to move to the right, and the mounting support is driven by the linear motor in the X direction to move to the left mounting head to move to the coordinate original position of the pick-up chip A.
6. The die bonder working efficiency and die bonder accuracy improvement method according to claim 5, wherein: in S3 and S9, the Z-direction linear motor, the Y-direction linear motor, and the X-direction linear motor are driven simultaneously.
7. The die bonder working efficiency and die bonder accuracy improvement method according to claim 5, wherein: in S7 and S8, chip is pasted to right side subsides dress head dress, chip is pasted to left side dress head dress, all is driven by voice coil motor, the first and right second dress position of subsides of the left side of voice coil motor drive is pasted by the second, predetermines dress power value by the processing end to through the electric current size on the adjustment voice coil motor coil by voice coil motor, the control is actually pasted dress power and is reached and predetermine dress power value.
8. The die bonder working efficiency and die bonder accuracy improvement method according to claim 5, wherein: in S3, Y moves to the left to the linear motor drive pastes dress support, and the right side is pasted the head left side and is moved to position A' S in-process, and X can be based on left side and paste dress head and right side and paste dress head fixed coordinate difference drive dress support and make displacement compensation in the X axle direction to linear motor, makes the first accurate left movement of right side subsides to position A.
9. The die bonder working efficiency and die bonder accuracy improvement method according to claim 5, wherein: in S8, the Y-direction linear motor drives the mounting bracket to move to the left, the left mounting head moves to the left to position C, and the X-direction linear motor drives the mounting bracket to perform displacement compensation in the X-axis direction based on the fixed coordinate difference of the left mounting head and the right mounting head on the X-axis, so that the left mounting precision head moves to the left to position C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210191658.XA CN114615877A (en) | 2022-02-28 | 2022-02-28 | Chip mounting mechanism and method for improving working efficiency and chip mounting precision of die bonder |
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| CN202210191658.XA CN114615877A (en) | 2022-02-28 | 2022-02-28 | Chip mounting mechanism and method for improving working efficiency and chip mounting precision of die bonder |
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Citations (6)
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| JP2002232191A (en) * | 2001-02-07 | 2002-08-16 | Matsushita Electric Ind Co Ltd | Electronic component mounter |
| CN103327749A (en) * | 2013-05-24 | 2013-09-25 | 华南理工大学 | Electronic component placement equipment |
| CN106271607A (en) * | 2012-06-28 | 2017-01-04 | 环球仪器公司 | Make-up machinery, system and method flexibly |
| CN106771977A (en) * | 2016-12-31 | 2017-05-31 | 东莞市求是测试设备有限公司 | A kind of SMT intelligence initial workpiece testing equipment |
| CN112234784A (en) * | 2020-09-28 | 2021-01-15 | 湖南大学 | Linear rotating motor for SMD picking and mounting |
| US20220052017A1 (en) * | 2020-08-12 | 2022-02-17 | Fasford Technology Co., Ltd. | Die Bonding Apparatus and Manufacturing Method for Semiconductor Device |
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2022
- 2022-02-28 CN CN202210191658.XA patent/CN114615877A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232191A (en) * | 2001-02-07 | 2002-08-16 | Matsushita Electric Ind Co Ltd | Electronic component mounter |
| CN106271607A (en) * | 2012-06-28 | 2017-01-04 | 环球仪器公司 | Make-up machinery, system and method flexibly |
| CN103327749A (en) * | 2013-05-24 | 2013-09-25 | 华南理工大学 | Electronic component placement equipment |
| CN106771977A (en) * | 2016-12-31 | 2017-05-31 | 东莞市求是测试设备有限公司 | A kind of SMT intelligence initial workpiece testing equipment |
| US20220052017A1 (en) * | 2020-08-12 | 2022-02-17 | Fasford Technology Co., Ltd. | Die Bonding Apparatus and Manufacturing Method for Semiconductor Device |
| CN112234784A (en) * | 2020-09-28 | 2021-01-15 | 湖南大学 | Linear rotating motor for SMD picking and mounting |
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