CN114585222A - Fin radiator and manufacturing method thereof - Google Patents
Fin radiator and manufacturing method thereof Download PDFInfo
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- CN114585222A CN114585222A CN202210006367.9A CN202210006367A CN114585222A CN 114585222 A CN114585222 A CN 114585222A CN 202210006367 A CN202210006367 A CN 202210006367A CN 114585222 A CN114585222 A CN 114585222A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a fin radiator and a manufacturing method thereof, and aims to provide a fin radiator and a manufacturing method thereof, wherein the fin radiator is convenient to process and manufacture, the fins of the radiator are smooth, and the thickness and the material of the fins can be adjusted and combined according to actual needs. The fin radiator comprises a base plate and a fin assembly, the fin assembly comprises a plurality of radiating fins distributed side by side, the lower edges of the radiating fins are provided with a welding plate formed by bending, the upper edges of the radiating fins are provided with buckling parts, each buckling part comprises a buckling groove and a buckling piece, and the buckling pieces of one radiating fin in two radiating fins distributed randomly and adjacently are clamped in the buckling grooves of the other radiating fin so as to enable the radiating fins of the fin assembly to be connected into a whole, and the radiating fins are welded and connected with the base plate through the welding plate.
Description
Technical Field
The invention relates to a radiator, in particular to a fin radiator and a manufacturing method thereof.
Background
The existing fin radiator is generally produced and manufactured by adopting the following three modes, wherein one mode is that a gear-shoveling machine is used for removing materials to obtain fins, so that the gear-shoveling type fin radiator is manufactured; secondly, opening the die by manufacturing a special die to obtain the open-mode fin radiator; and thirdly, processing the base plate and the fins of the radiator separately, forming fin grooves on the base plate, enabling the fin grooves to correspond to the fins one to one, inserting the fins into the corresponding fin grooves, and welding the fins and the base plate into a whole to obtain the pinion-type fin radiator. The fin radiator manufactured by the three methods has the following defects that the fin flatness is poor, the fin cannot be processed too thin, and otherwise the fin radiator is easy to deform to influence the radiating efficiency; the open-mode fin radiator needs to be manufactured with a die, is inconvenient to manufacture, has long period and low efficiency, and is easy to crack due to poor heat treatment; the pin-type fin radiator needs to machine and form a plurality of fin grooves on the surface of the substrate, so that the manufacturing is inconvenient and the efficiency is low.
Disclosure of Invention
The invention aims to provide a finned radiator and a manufacturing method thereof, wherein the finned radiator is convenient to process and manufacture, fins of the radiator are flat, and the thickness and the material of the fins can be adjusted and combined according to actual needs.
The technical scheme of the invention is as follows:
the utility model provides a fin radiator, includes base plate and fin subassembly, and the fin subassembly includes a plurality of radiating fin that distribute side by side, radiating fin's lower limb is equipped with the fashioned welding board of bending, and radiating fin's top edge is equipped with buckling part, and buckling part includes fastening groove and lock joint piece, and a radiating fin's in two radiating fin of arbitrary adjacent distribution lock joint piece card is established in another radiating fin's fastening groove to make each radiating fin of fin subassembly even as an organic whole, radiating fin passes through the welding board and links to each other with the base plate welding. The finned radiator of the scheme is convenient to process and manufacture, fins of the radiator are smooth, and the thickness of the fins and the material of the fins can be adjusted according to actual needs.
Preferably, the lower surfaces of the welding plates of the respective heat dissipating fins of the fin assembly are located in the same plane.
Preferably, the width of the welding plate is the same as the distance between two adjacent radiating fins.
A method for manufacturing a fin radiator sequentially comprises the following steps,
a, manufacturing a fin assembly, wherein radiating fins are formed by punching a section plate, then, all the radiating fins are sequentially connected into the fin assembly through buckling parts, and the buckling piece of one radiating fin of two radiating fins which are randomly and adjacently distributed in the fin assembly is clamped in the buckling groove of the other radiating fin so as to connect all the radiating fins into a whole;
b, welding and forming the base plate and the fin component, wherein the welding and forming of the base plate and the fin component comprises the following steps,
b1, placing a solder sheet for soldering the base plate and the fin assembly on the upper surface of the base plate, the fin assembly being placed on the solder sheet by the soldering plate;
b2, placing the substrate, the solder sheet and the fin assembly into a welding furnace, and heating the substrate, the solder sheet and the fin assembly through the welding furnace to melt the solder sheet; and then, the substrate, the solder sheet and the fin assembly are moved out of the welding furnace and cooled to room temperature, so that the fin assembly and the substrate are welded into a whole.
According to the method for manufacturing the fin radiator, the radiating fins of the fin assembly are formed by punching the section plates, the fastening piece of one radiating fin of two radiating fins which are randomly and adjacently distributed is clamped in the fastening groove of the other radiating fin, so that the radiating fins of the fin assembly are connected into a whole, and then the radiating fins are welded and connected with the base plate through the welding plate, so that the fin radiator is manufactured, and the fin radiator is convenient to process and manufacture. Each radiating fin connects gradually through buckling part and forms the fin subassembly as an organic whole to when making fin subassembly and base plate welding, the fin subassembly can directly support through the welding plate and weld on the base plate surface, need not extra frock and supports the radiating fin of fin subassembly, greatly simplifies welding preorder work, makes things convenient for welding process, raises the efficiency. Meanwhile, the radiating fins are connected with the base plate in a welding mode through the welding plate, so that the stability of a welding structure can be improved, the contact area between the radiating fins and the base plate can be increased, and the heat conduction efficiency between the base plate and the radiating fins can be improved. In addition, the thickness and the material of the radiating fins can be formed by punching the section plates with different thicknesses and materials according to actual needs, the radiating fins in the same fin component can be made of the same material, and the radiating fins made of different materials can be combined to realize the integration of materials with different heat conduction efficiencies.
Preferably, the upper surface of the solder sheet is provided with a plurality of supporting bosses for supporting the fin assembly, the supporting bosses are made of the same material as the solder sheet and are close to the edge of the upper surface of the solder sheet, in the step B1, the fin assembly is supported on each supporting boss through the welding plate, so that a heat conduction gap layer is formed between the welding plate of the fin assembly and the upper surface of the solder sheet, in the step B2, in the process that the welding furnace heats the substrate, the solder sheet and the fin assembly, heat in the welding furnace can directly heat the solder sheet through the heat conduction gap layer, so that the solder sheet is uniformly melted as a whole. Because the fin assembly is arranged on the welding flux sheet through the welding plate, and the number, the density and the number of the radiating fins of the fin assembly are large, the step B2 is realized, in the process of heating the base plate, the welding flux sheet and the fin assembly in a welding furnace, the welding flux sheet is not uniformly melted, especially for a large-area fin radiator, the problem of nonuniform melting of the welding flux sheet is more obvious, the edge of the welding flux sheet is quickly melted, the middle part of the welding flux sheet is slowly melted, bubbles and bulges are caused to appear between the welding plate and the base plate, the welding quality of the radiating fins and the base plate is influenced, and the heat conduction efficiency between the base plate and the radiating fins is influenced. In order to solve the problem, the scheme is that a supporting boss which is made of the same material as the solder sheet is arranged on the upper surface of the solder sheet, the supporting boss is close to the edge of the upper surface of the solder sheet, and then a heat conduction gap layer is formed between the upper surfaces of the solder sheet and the welding plate through a supporting fin assembly, so that in the step B2, in the process that a welding furnace heats a substrate, the solder sheet and the fin assembly, heat in the welding furnace can directly heat the solder sheet through the heat conduction gap layer to enable the solder sheet to be integrally and uniformly melted, and the problems of bubbles and bulges caused by nonuniform melting (the middle surface of an edge block) of the solder sheet can be effectively avoided; and after the solder sheet is integrally and uniformly melted, the supporting lug boss can be automatically melted, so that the welding plate of the radiating fin is connected with the base plate in a welding way, and no additional control or other procedures are needed, thereby being very convenient for actual production and processing.
Preferably, in the step B2, the fin assembly remains supported by the solder plates to the respective support bosses when the middle portion of the solder sheet starts to melt during the heating of the base plate, the solder sheet, and the fin assembly in the solder oven. Therefore, in the step B2, in the process that the substrate, the solder sheet and the fin assembly are heated by the welding furnace, the heat in the welding furnace can directly heat the solder sheet through the heat conduction gap layer, so that the solder sheet is integrally and uniformly melted; the problem that the whole solder sheet is uniformly melted because the fin component is descended and supported on the solder sheet because the supporting boss is melted down without melting the middle part of the solder sheet is solved.
Preferably, in the step B2, during the heating of the substrate, the solder sheet and the fin assembly in the soldering furnace, the central portion of the solder sheet is completely melted first, and then the supporting bosses are completely melted. Thus, in the step B2, in the process that the substrate, the solder sheet and the fin assembly are heated by the soldering furnace, the heat in the soldering furnace can directly heat the solder sheet through the heat conduction gap layer, so that the solder sheet is uniformly melted as a whole.
Preferably, the supporting bosses are arranged in two rows, each row of the supporting bosses at least comprises two supporting bosses, the two rows of the supporting bosses are distributed on two opposite sides of the upper surface of the solder sheet, and in the step B2, in the process of heating the substrate, the solder sheet and the fin assembly in the soldering furnace, the supporting bosses in one row of the supporting bosses are completely melted firstly, and the supporting bosses in the other row of the supporting bosses are completely melted later. Because the lower surface of each radiating fin's of fin subassembly welding plate is located the coplanar, and the clearance between each welding plate is very little, if each welding plate of fin subassembly is that the level descends then appears easily, some air that are located the welding plate below in fin subassembly middle part can't in time be emptied, and lead to appearing the problem of bubble and swell easily between some welding plates in fin subassembly middle part and the base plate. In order to solve the problem, the base plate is heated in a welding furnace, and the solder sheets and the fin component are completely melted in the process of heating the base plate in the welding furnace, so that the support bosses in one row of the support bosses are completely melted firstly, and the support bosses in the other row of the support bosses are completely melted later, so that the fin component is inclined at a small angle at one side in the descending process, the melted solder sheets are contacted at one side of the fin component firstly, then the opposite side, opposite to the fin component, of the fin component is gradually descended to be contacted with the melted solder sheets, so that air below each welding plate of the fin component can be effectively discharged, and the problems of bubbles and bulges between some welding plates in the middle of the fin component and the base plate are avoided.
Preferably, the outer diameter of the supporting boss in one of the two rows of supporting bosses is smaller than the outer diameter of the supporting boss in the other row of supporting bosses, so that in the step B2, in the process of heating the substrate, the solder sheet and the fin assembly in the soldering furnace, the supporting bosses in one row of supporting bosses are completely melted first, and the supporting bosses in the other row of supporting bosses are completely melted later.
Preferably, the thickness of the solder sheet is 0.1-1.5 mm, the height of the supporting boss is 0.5-3 mm, and the outer diameter of the supporting boss is 2-10 mm.
The invention has the beneficial effects that: not only processing preparation is convenient, and the fin of radiator is level and smooth moreover, and fin thickness and fin material can be adjusted and make up according to actual need.
Drawings
Fig. 1 is a schematic structural view of a fin radiator of the present invention.
Fig. 2 is a schematic structural diagram of a base plate of a fin heat sink according to the present invention.
Fig. 3 is a schematic structural diagram of a heat dissipating fin of a fin heat sink according to the present invention.
Fig. 4 is a schematic structural diagram of a fin assembly of a fin radiator in the assembling process.
Fig. 5 is a schematic view showing a structure of a solder sheet of a fin heat sink of the present invention.
In the figure:
a substrate 1;
the heat radiating fin comprises a fin component 2, a heat radiating fin 2.1, a buckling part 2.2, a buckling piece 2.21, a buckling groove 2.22 and a welding plate 2.3;
Detailed Description
The first embodiment is as follows: as shown in fig. 1, 2, 3 and 4, a fin heat sink includes a base plate 1 and a fin assembly 2, wherein the fin assembly includes a plurality of heat dissipation fins 2.1 distributed side by side. In this embodiment, the heat dissipating fin is formed by press molding a profile plate. The lower edge of the radiating fin is provided with a welding plate 2.3 which is formed by bending, and the welding plate is vertical to the radiating fin. The upper edge of the radiating fin is provided with a buckling part 2.2. The fastening portion includes a fastening groove 2.22 and a fastening tab 2.21. The buckling groove and the buckling piece are formed in a stamping mode. In this embodiment, the fastening pieces are perpendicular to the heat dissipating fins, and the fastening grooves are provided on one side of the fastening pieces connected to the heat dissipating fins. The buckling piece 2.21 of one of the two radiating fins which are randomly and adjacently distributed is clamped in the buckling groove 2.22 of the other radiating fin so as to enable the radiating fins of the fin component to be connected into a whole, and the radiating fins are connected with the base plate in a welding mode through the welding plate. In this embodiment, the fastening piece of one of the two adjacent heat dissipation fins is embedded in the fastening groove of the other heat dissipation fin.
The lower surfaces of the welding plates of the radiating fins of the fin assembly are positioned in the same plane. The width of the welding plate is the same as the distance between two adjacent radiating fins. Of course, the width of the welding plate can be smaller than the distance between two adjacent radiating fins.
In this embodiment, each radiating fin connects gradually as an organic whole through buckling part and forms the fin subassembly to make fin subassembly and base plate welding make, the fin subassembly can directly support through the welding plate and weld on the base plate surface, need not extra frock and supports the radiating fin of fin subassembly, greatly simplifies welding preorder work, makes things convenient for welding process, raises the efficiency. Meanwhile, the radiating fins are connected with the base plate in a welding mode through the welding plate, so that the stability of a welding structure can be improved, the contact area between the radiating fins and the base plate can be increased, and the heat conduction efficiency between the base plate and the radiating fins can be improved. In addition, the thickness and the material of the radiating fins can be formed by punching the section plates with different thicknesses and materials according to actual needs, the radiating fins in the same fin component can be made of the same material, and the radiating fins made of different materials can be combined to realize the integration of materials with different heat conduction efficiencies.
The second embodiment is as follows: a method for manufacturing a finned radiator is disclosed, and the specific structure of the finned radiator refers to the first specific embodiment. The method for manufacturing the finned radiator sequentially comprises the following steps,
manufacturing a fin assembly, namely, as shown in fig. 3 and 4, punching and forming a heat radiating fin 2.1 by a section plate, then sequentially connecting the heat radiating fins into an integrated fin assembly through buckling parts 2.2, and clamping and arranging a buckling piece 2.21 of one heat radiating fin of two heat radiating fins which are randomly and adjacently distributed in the fin assembly in a buckling groove 2.22 of the other heat radiating fin so as to connect the heat radiating fins into a whole;
b, welding and forming the base plate and the fin component, wherein the welding and forming of the base plate and the fin component comprises the following steps,
b1, placing a solder sheet for soldering the base plate and the fin assembly on the upper surface of the base plate, the fin assembly being placed on the solder sheet by the soldering plate;
b2, placing the substrate, the solder sheet and the fin assembly into a welding furnace, and heating the substrate, the solder sheet and the fin assembly through the welding furnace to melt the solder sheet; and then, the substrate, the solder sheet and the fin assembly are moved out of the welding furnace and cooled to room temperature, so that the fin assembly and the substrate are welded into a whole.
In the method for manufacturing the fin radiator, the radiating fins of the fin assembly are formed by stamping the section plate, the fastening piece of one radiating fin of any two radiating fins which are adjacently distributed is clamped in the fastening groove of the other radiating fin so as to connect all the radiating fins of the fin assembly into a whole, and then the radiating fins are welded and connected with the base plate through the welding plate to manufacture the fin radiator, which is convenient to process and manufacture. Each radiating fin connects gradually through buckling part and forms the fin subassembly as an organic whole to make fin subassembly and base plate welding make, the fin subassembly can directly support through the welding board and weld on the base plate surface, need not extra frock and support the radiating fin of fin subassembly, greatly simplify welding preorder work, make things convenient for welding process, raise the efficiency. Meanwhile, the radiating fins are connected with the base plate in a welding mode through the welding plate, so that the stability of a welding structure can be improved, the contact area between the radiating fins and the base plate can be increased, and the heat conduction efficiency between the base plate and the radiating fins can be improved. In addition, the thickness and the material of the radiating fins can be formed by punching the section plates with different thicknesses and materials according to actual needs, the radiating fins in the same fin component can be made of the same material, and the radiating fins made of different materials can be combined to realize the integration of materials with different heat conduction efficiencies.
Further, as shown in fig. 5, the upper surface of the solder sheet 3 is provided with a plurality of supporting bosses 3.1 for supporting the fin assembly, the supporting bosses are made of the same material as the solder sheet, and the supporting bosses are close to the edge of the upper surface of the solder sheet. In step B1, the fin assembly is supported on each supporting boss by the welding plate, so that a heat conduction gap layer is formed between the welding plate of the fin assembly and the upper surface of the solder sheet. In the step B2, in the process that the welding furnace heats the substrate, the solder sheet and the fin assembly, the heat in the welding furnace can directly heat the solder sheet through the heat conduction gap layer, so that the solder sheet is uniformly melted as a whole. In the embodiment, the thickness of the solder sheet is 0.1-1.5 mm, the height of the supporting boss is 0.5-3 mm, and the outer diameter of the supporting boss is 2-10 mm. Because the fin assembly is arranged on the welding flux sheet through the welding plate, and the number, the density and the number of the radiating fins of the fin assembly are large, the step B2 is realized, in the process of heating the base plate, the welding flux sheet and the fin assembly in a welding furnace, the welding flux sheet is not uniformly melted, especially for a large-area fin radiator, the problem of nonuniform melting of the welding flux sheet is more obvious, the edge of the welding flux sheet is quickly melted, the middle part of the welding flux sheet is slowly melted, bubbles and bulges are caused to appear between the welding plate and the base plate, the welding quality of the radiating fins and the base plate is influenced, and the heat conduction efficiency between the base plate and the radiating fins is influenced. In order to solve the problem, the scheme is that a supporting boss which is made of the same material as the solder sheet is arranged on the upper surface of the solder sheet, the supporting boss is close to the edge of the upper surface of the solder sheet, and then a heat conduction gap layer is formed between the upper surfaces of the solder sheet and the welding plate through a supporting fin assembly, so that in the step B2, in the process that a welding furnace heats a substrate, the solder sheet and the fin assembly, heat in the welding furnace can directly heat the solder sheet through the heat conduction gap layer to enable the solder sheet to be integrally and uniformly melted, and the problems of bubbles and bulges caused by nonuniform melting (the middle surface of an edge block) of the solder sheet can be effectively avoided; and after the solder sheet is integrally and uniformly melted, the supporting lug boss can be automatically melted, so that the welding plate of the radiating fin is connected with the base plate in a welding way, and no additional control or other procedures are needed, thereby being very convenient for actual production and processing.
Further, in the step B2, during the heating of the base plate, the solder sheet and the fin assembly in the soldering furnace, the fin assembly remains supported on the respective support bosses by the soldering plate as the middle portion of the solder sheet starts to melt. Therefore, in the step B2, in the process that the substrate, the solder sheet and the fin assembly are heated by the welding furnace, the heat in the welding furnace can directly heat the solder sheet through the heat conduction gap layer, so that the solder sheet is integrally and uniformly melted; the problem that the whole solder sheet is uniformly melted because the fin component is descended and supported on the solder sheet because the supporting boss is melted down without melting the middle part of the solder sheet is solved.
Further, in the step B2, in the process of heating the substrate, the solder sheet and the fin assembly in the soldering furnace, the middle portion of the solder sheet is completely melted first, and then each support boss is completely melted. Thus, in the step B2, in the process that the substrate, the solder sheet and the fin assembly are heated by the soldering furnace, the heat in the soldering furnace can directly heat the solder sheet through the heat conduction gap layer, so that the solder sheet is uniformly melted as a whole.
Further, the support bosses are arranged in two rows, each row of the support bosses comprises at least two support bosses, for example, each row of the support bosses comprises two or three support bosses, and the two rows of the support bosses are distributed on two opposite sides of the upper surface of the solder sheet. And B2, in the process of heating the base plate, the solder sheet and the fin assembly in the soldering furnace, the support bosses in one row of the support bosses are completely melted firstly, and the support bosses in the other row of the support bosses are completely melted later. Because the lower surface of each radiating fin's of fin subassembly welding plate is located the coplanar, and the clearance between each welding plate is very little, if each welding plate of fin subassembly is the level decline, then appear being located the unable evacuation in time of some air of the welding plate below in the middle part of the fin subassembly easily, and lead to appearing the problem of bubble and swell between some welding plates in the middle part of the fin subassembly and the base plate easily. In order to solve the problem, the base plate is heated in a welding furnace, and the solder sheets and the fin component are completely melted in the process of heating the base plate in the welding furnace, so that the support bosses in one row of the support bosses are completely melted firstly, and the support bosses in the other row of the support bosses are completely melted later, so that the fin component is inclined at a small angle at one side in the descending process, the melted solder sheets are contacted at one side of the fin component firstly, then the opposite side, opposite to the fin component, of the fin component is gradually descended to be contacted with the melted solder sheets, so that air below each welding plate of the fin component can be effectively discharged, and the problems of bubbles and bulges between some welding plates in the middle of the fin component and the base plate are avoided.
In this embodiment, the outer diameters of the support bosses in the same row of support bosses are the same. The outer diameter of the supporting boss in one row of the two rows of supporting bosses is smaller than that of the supporting boss in the other row of the supporting bosses, so that in the step B2, in the process of heating the substrate, the solder sheet and the fin assembly in the welding furnace, the supporting bosses in one row of the supporting bosses are completely melted firstly, and the supporting bosses in the other row of the supporting bosses are completely melted later.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and all simple modifications, alterations and equivalents of the above embodiments according to the technical spirit of the present invention are still within the protection scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides a fin radiator, includes base plate and fin subassembly, and the fin subassembly includes a plurality of radiating fin that distribute side by side, characterized by, radiating fin's lower limb is equipped with the fashioned welding plate of bending, and radiating fin's top edge is equipped with buckling part, and buckling part includes fastening groove and fastening piece, and a radiating fin's among two radiating fin that arbitrary adjacent distributed fastening piece card is established in another radiating fin's fastening groove to make each radiating fin of fin subassembly even as an organic whole, radiating fin passes through the welding plate and links to each other with the base plate welding.
2. The finned heat sink as claimed in claim 1, wherein the lower surfaces of the weld plates of the respective heat dissipating fins of said fin block are located in the same plane.
3. The finned heat sink as claimed in claim 1, wherein said welded plate has a width equal to the spacing between two adjacent fins.
4. A method for manufacturing a finned heat sink as claimed in claim 1, comprising the steps of,
a, manufacturing a fin assembly, wherein radiating fins are formed by punching a section plate, then, all the radiating fins are sequentially connected into the fin assembly through buckling parts, and the buckling piece of one radiating fin of two radiating fins which are randomly and adjacently distributed in the fin assembly is clamped in the buckling groove of the other radiating fin so as to connect all the radiating fins into a whole;
b, welding and forming the base plate and the fin component, wherein the welding and forming of the base plate and the fin component comprises the following steps,
b1, placing a solder sheet for soldering the base plate and the fin assembly on the upper surface of the base plate, the fin assembly being placed on the solder sheet by the soldering plate;
b2, placing the substrate, the solder sheet and the fin assembly into a welding furnace, and heating the substrate, the solder sheet and the fin assembly through the welding furnace to melt the solder sheet; and then, the substrate, the solder sheet and the fin assembly are moved out of the welding furnace and cooled to room temperature, so that the fin assembly and the substrate are welded into a whole.
5. The method as claimed in claim 4, wherein the solder sheet has a plurality of supporting projections on its upper surface for supporting the fin assembly, the supporting projections being made of the same material as the solder sheet and being located near the edges of the upper surface of the solder sheet,
in the step B1, the fin assembly is supported on each supporting boss through the welding plate, so that a heat conduction gap layer is formed between the welding plate of the fin assembly and the upper surface of the welding sheet,
in the step B2, during the process of heating the substrate, the solder sheet and the fin assembly by the soldering furnace, the heat in the soldering furnace can directly heat the solder sheet through the heat conducting gap layer, so that the solder sheet is uniformly melted as a whole.
6. The method for manufacturing a finned heat sink as claimed in claim 5, wherein in said step B2, during the heating of the base plate, the solder sheet and the fin block in the soldering furnace, the fin block is kept supported on the support bosses by the soldering plate when the middle portion of the solder sheet starts to melt.
7. The method as claimed in claim 5 or 6, wherein in the step B2, the middle part of the solder sheet is completely melted first and then the supporting bosses are completely melted during the heating of the base plate, the solder sheet and the fin assembly in the soldering furnace.
8. The method as claimed in claim 5 or 6, wherein the supporting bosses are arranged in two rows, each row of supporting bosses comprises at least two supporting bosses, and the two rows of supporting bosses are distributed on two opposite sides of the upper surface of the solder sheet, and in the step B2, the supporting bosses in one row of supporting bosses are completely melted first and the supporting bosses in the other row of supporting bosses are completely melted later during the heating of the substrate, the solder sheet and the fin assembly in the soldering furnace.
9. The method as claimed in claim 8, wherein the outer diameter of the supporting bosses of one of the two rows of supporting bosses is smaller than the outer diameter of the supporting bosses of the other row of supporting bosses, so that in the step B2, the supporting bosses of one row of supporting bosses are completely melted first and the supporting bosses of the other row of supporting bosses are completely melted later during the heating of the substrate, the solder sheet and the fin assembly in the soldering furnace.
10. The method as claimed in claim 5 or 6, wherein the solder sheet has a thickness of 0.1-1.5 mm, the height of the support boss is 0.5-3 mm, and the outer diameter of the support boss is 2-10 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210006367.9A CN114585222A (en) | 2022-01-05 | 2022-01-05 | Fin radiator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210006367.9A CN114585222A (en) | 2022-01-05 | 2022-01-05 | Fin radiator and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114585222A true CN114585222A (en) | 2022-06-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210006367.9A Pending CN114585222A (en) | 2022-01-05 | 2022-01-05 | Fin radiator and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN114585222A (en) |
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2022
- 2022-01-05 CN CN202210006367.9A patent/CN114585222A/en active Pending
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