CN114584072A

CN114584072A - Clock oscillator and preparation method thereof

Info

Publication number: CN114584072A
Application number: CN202110698159.5A
Authority: CN
Inventors: 伍伟; 王锦辉; 李�浩; 杨勇; 黄新华
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-11-30
Filing date: 2021-06-23
Publication date: 2022-06-03

Abstract

A clock oscillator, a manufacturing method and a using method of the clock oscillator, and a chip comprising the clock oscillator are provided. The clock oscillator comprises a resonator, a shock absorbing material layer and a base, wherein at least one part of the shock absorbing material layer is positioned between the resonator and the base. The clock oscillator is additionally provided with the shock-absorbing material layer between the resonator and the base, and the shock-absorbing material layer can effectively prevent mechanical wave conduction between the base and the resonator, so that the resonator is free from the influence of external vibration, the output frequency of the resonator is ensured not to be degraded under the condition of external vibration, and the shock resistance of the clock oscillator is improved.

Description

Clock oscillator and preparation method thereof

The present application claims priority from chinese patent application No. 202110106739.0 entitled "a clock oscillator and method for making the same" filed 26/1/2021 and chinese patent application No. 202011386388.5 entitled "a method for improving shock resistance of a clock oscillator" filed 30/11/2020, the entire contents of which are incorporated herein by reference.

Technical Field

The application relates to the field of computers, in particular to a clock oscillator with shock resistance, a preparation method and a use method of the clock oscillator, and a chip comprising the clock oscillator.

Background

The clock oscillator is an important device in an electronic system, and provides a necessary clock frequency for the electronic system, so that the electronic system can perform various operations at the clock frequency to realize normal operation. The clock oscillator is generally composed of modules such as an electrical/mechanical resonator, a feedback network, an amplification network, and an output network, and frequency selection is realized by using the resonance characteristics of the circuit/mechanical resonator to generate a frequency signal that oscillates periodically, that is, a clock signal.

When external environment vibration is transmitted to the resonator, the output frequency of the resonator may jump, and further, the performance of the whole electronic system is degraded and error codes are generated due to the instability of the clock signal. Therefore, the anti-seismic performance is an important performance index of the clock oscillator, and improving the anti-seismic performance of the clock oscillator is a technical problem to be solved urgently.

Disclosure of Invention

The clock oscillator is used for solving the technical problem that the clock oscillator is poor in anti-seismic performance.

In a first aspect, a clock oscillator is provided that includes a resonator, a layer of shock absorbing material, and a base, at least a portion of the layer of shock absorbing material being located between the resonator and the base.

The clock oscillator is additionally provided with the shock-absorbing material layer between the resonator and the base, and the shock-absorbing material layer can effectively prevent mechanical wave conduction between the base and the resonator, so that the resonator is free from the influence of external vibration, the output frequency of the resonator is ensured not to be degraded under the condition of external vibration, and the shock resistance of the clock oscillator is improved.

In one possible implementation, the layer of cushioning material includes a micro-scale layered structure or a nano-scale three-dimensional mesh structure.

In one possible implementation, the nanoscale, three-dimensional network structure comprises nanofibers.

In one possible implementation, the nanofibers comprise carbon nanofibers and/or ceramic nanofibers.

The materials of the structures can form a shock-absorbing material layer with the thickness of tens of micrometers to hundreds of micrometers, so that high shock-absorbing performance is realized by very thin thickness, and small-size packaging is ensured; the materials of the structures have high strength and high toughness, so that the problem that the materials of the traditional structures are difficult to have high strength and high toughness is overcome, and the reliability is ensured; and the materials of these structures can be prepared by large-scale biomaterial synthesis methods, are economical and cheap, and support large-scale manufacturing.

In one possible implementation, the structure of the shock-absorbing material layer includes a planar layered structure, the resonator is located on a first side of the shock-absorbing material layer, the base is located on a second side of the shock-absorbing material layer, and the second side of the shock-absorbing material layer is opposite to the first side of the shock-absorbing material layer.

In a possible implementation, the planar layered structure comprises a continuous planar layered structure, a planar grid layered structure or a plurality of point-like structures in the same plane.

In a possible implementation manner, the structure of the shock absorbing material layer includes a curved layered structure, and the shock absorbing material layer completely surrounds or semi-surrounds the resonator.

In one possible implementation, the curved layered structure comprises a continuous curved layered structure or a curved mesh layered structure.

In one possible implementation, the resonator is bonded to the surface of the layer of shock absorbing material to achieve a tight connection therebetween.

In one possible implementation, the clock oscillator further comprises an integrated circuit IC; wherein at least a portion of the layer of shock absorbing material is positioned between the IC and the resonator and the layer of shock absorbing material is in contact with a first surface of the IC, a second surface of the IC is in contact with the first surface of the base, and the first surface of the IC is opposite the second surface of the IC; or, the shock-absorbing material layer is in contact with the first surface of the base, the IC is in contact with the first surface of the base, and the IC is not overlapped with the shock-absorbing material layer.

In one possible implementation, the resonator is a crystal resonator or a semiconductor resonator.

In one possible implementation, the crystal resonator is a surface mount device SMD ceramic packaged crystal resonator.

In one possible implementation, the semiconductor resonator is a wafer-packaged semiconductor resonator.

The resonator is prepackaged so that a layer of shock absorbing material is disposed between the resonator and the base.

In one possible implementation manner, the resonator and the shock absorbing material layer are integrally packaged in a vacuum packaging or plastic packaging manner.

In a second aspect, there is provided a method of preparing a clock oscillator, the method comprising: disposing at least a portion of the layer of cushioning material between the resonator and the base; and integrally packaging the resonator and the shock absorbing material layer to obtain the clock oscillator.

According to the method, the shock-absorbing material layer is additionally arranged between the resonator and the base, and can effectively prevent mechanical wave conduction between the base and the resonator, so that the resonator is free from the influence of external vibration, the output frequency of the resonator is not degraded under the condition of external vibration, and the shock resistance of the clock oscillator is improved.

In one possible implementation, the structure of the layer of shock-absorbing material comprises a planar laminar structure, said disposing at least a portion of the layer of shock-absorbing material between the resonator and the base comprising: placing the resonator on a first side of the layer of shock absorbing material; placing a base on a second side of the layer of cushioning material, the second side of the layer of cushioning material being opposite the first side of the layer of cushioning material.

In a possible implementation manner, the planar layered structure includes a continuous planar layered structure, a planar grid layered structure or a plurality of point-like structures in the same plane.

In one possible implementation, the structure of the layer of shock absorbing material is a curved layered structure, and at least a portion of the layer of shock absorbing material is disposed between the resonator and the base, and the method includes: and fully surrounding or semi-surrounding the resonator by using the shock absorbing material layer.

In one possible implementation, the disposing at least a portion of the layer of shock absorbing material between the resonator and the base includes: and bonding the resonator with the surface of the shock absorbing material layer to realize tight connection between the resonator and the shock absorbing material layer.

In one possible implementation, the clock oscillator further includes an integrated circuit IC, and the disposing at least a portion of the layer of shock absorbing material between the resonator and the base includes: disposing at least a portion of the layer of shock absorbing material between a resonator and the IC, the layer of shock absorbing material in contact with a first surface of the IC, a second surface of the IC in contact with the first surface of the base, the first surface of the IC opposite the second surface of the IC.

In one possible implementation, the clock oscillator further includes an integrated circuit IC, and the disposing at least a portion of the layer of shock absorbing material between the resonator and the base includes: placing the resonator, the layer of shock absorbing material, and the IC on a first surface of the base, and the IC is non-overlapping with the layer of shock absorbing material.

In a possible implementation manner, the packaging manner of the integral package includes vacuum packaging or plastic packaging.

In one possible implementation, before disposing at least a portion of the layer of cushioning material between the resonator and the base, the method further includes: and carrying out vacuum packaging on the resonator.

In one possible implementation, when the resonator is a crystal resonator, vacuum packaging the resonator includes: carrying out Surface Mounting Device (SMD) ceramic packaging on the crystal resonator; when the resonator is a semiconductor resonator, the vacuum packaging of the resonator comprises the following steps: and carrying out wafer packaging on the semiconductor resonator. The resonator is prepackaged so that a layer of shock absorbing material is disposed between the resonator and the base.

In a third aspect, a method for obtaining a clock frequency is provided, where the clock frequency is obtained by the clock oscillator in the first aspect or any one of the possible implementation manners of the first aspect.

In a fourth aspect, a chip is provided, the chip comprising a clock oscillator as in the first aspect described above or any one of the possible implementations of the first aspect.

In a fifth aspect, an electronic device is provided, which includes the clock oscillator as described in the first aspect or any one of the possible implementation manners of the first aspect.

In one possible implementation, the electronic device is a communication device or a network device.

In a sixth aspect, an apparatus for obtaining a clock frequency is provided, the apparatus comprising a clock oscillator, a layer of shock absorbing material and a substrate, at least a portion of the layer of shock absorbing material being located between the clock oscillator and at least a portion of the substrate.

The device is in clock oscillator with add the shock absorber material layer between at least partly of base plate, this shock absorber material layer can stop mechanical wave conduction between base plate and clock oscillator effectively for clock oscillator avoids the influence of external vibrations, guarantees clock oscillator output frequency not to deteriorate under the condition that has external vibrations, promotes clock oscillator's shock resistance.

In one possible implementation, the shock absorbing material layer includes a micro-scale layered structure, a nano-scale three-dimensional mesh structure, or a polymer material.

In a possible implementation manner, the structure of the shock absorbing material layer includes a planar layered structure, the clock oscillator is located at a first side of the shock absorbing material layer, at least a portion of the substrate is located at a second side of the shock absorbing material layer, and the second side of the shock absorbing material layer is opposite to the first side of the shock absorbing material layer.

In a possible implementation manner, the substrate is a Flexible Printed Circuit (FPC), the FPC is U-shaped, the first part of the FPC is located on the first side of the shock-absorbing material layer, the second part of the FPC is located on the second side of the shock-absorbing material layer, and the first part of the FPC is located between the clock oscillator and the shock-absorbing material layer.

In one possible implementation, the structure of the shock absorbing material layer includes a curved layered structure, and the shock absorbing material layer completely surrounds or semi-surrounds the clock oscillator.

In one possible implementation, the clock oscillator includes a resonator and an integrated circuit IC, the resonator being a crystal resonator or a semiconductor resonator.

In a possible implementation manner, the device further includes a cover plate or a plastic package material, and the cover plate or the plastic package material is used for performing vacuum packaging on the clock oscillator.

In one possible implementation, the apparatus further includes a bonding line for electrically connecting the clock oscillator and the substrate.

In a seventh aspect, a method for manufacturing a device for obtaining a clock frequency is provided, the method including: disposing at least a portion of the layer of shock absorbing material between the clock oscillator and at least a portion of the substrate; integrally packaging the clock oscillator and the shock-absorbing material layer to obtain the device.

According to the method, the shock absorbing material layer is additionally arranged between the clock oscillator and at least one part of the substrate, and the shock absorbing material layer can effectively prevent mechanical wave conduction between the substrate and the clock oscillator, so that the clock oscillator is free from the influence of external vibration, the output frequency of the clock oscillator is ensured not to be degraded under the condition of the external vibration, and the shock resistance of the clock oscillator is improved.

In one possible implementation, the structure of the layer of cushioning material comprises a planar layered structure, the disposing at least a portion of the layer of cushioning material between the clock oscillator and at least a portion of the substrate comprising: the clock oscillator is arranged on the first side of the shock absorbing material layer, at least one part of the substrate is arranged on the second side of the shock absorbing material layer, and the second side of the shock absorbing material layer is opposite to the first side of the shock absorbing material layer.

In one possible implementation, the substrate is a Flexible Printed Circuit (FPC), the FPC is U-shaped, and at least a part of the shock absorbing material layer is disposed between the clock oscillator and at least a part of the substrate, including: and arranging the first part of the FPC at the first side of the shock-absorbing material layer, arranging the second part of the FPC at the second side of the shock-absorbing material layer, and arranging the first part of the FPC between the clock oscillator and the shock-absorbing material layer.

In one possible implementation, the structure of the shock absorbing material layer includes a curved layered structure, and the disposing at least a portion of the shock absorbing material layer between the clock oscillator and at least a portion of the substrate includes: and fully surrounding or semi-surrounding the clock oscillator by utilizing the shock absorbing material layer.

In one possible implementation, the integrally packaging the clock oscillator and the shock absorbing material layer includes: and carrying out vacuum packaging on the clock oscillator and the shock absorbing material layer by utilizing a cover plate or a plastic packaging material.

In one possible implementation, the method further includes: the clock oscillator and the substrate are electrically connected with a bonding wire.

In an eighth aspect, a method for obtaining a clock frequency is provided, wherein the clock frequency is obtained by the apparatus according to the sixth aspect or any one of the possible implementation manners of the sixth aspect.

In a ninth aspect, a chip is provided, the chip comprising the apparatus as in the sixth aspect or any one of the possible implementations of the sixth aspect.

A tenth aspect provides an electronic device comprising the apparatus as in any one of the possible implementation manners of the sixth aspect.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings used in the embodiments will be briefly described below. Obviously, the following drawings are only drawings of some embodiments of the present application, and it is obvious for those skilled in the art to obtain other technical solutions and drawings capable of implementing the present application as well without creative efforts.

Fig. 1 is a schematic diagram illustrating a basic principle of a clock oscillator according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a crystal oscillator according to an embodiment of the present invention;

FIG. 3a is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

FIG. 3b is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

FIG. 3c is a schematic structural diagram of a PCB carrying a crystal oscillator according to an embodiment of the present invention;

fig. 4a is a schematic structural diagram of a semiconductor resonator according to an embodiment of the present invention;

fig. 4b is a schematic structural diagram of a semiconductor oscillator according to an embodiment of the present invention;

FIG. 5a is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

fig. 5b is a schematic structural diagram of an SMD ceramic packaged crystal resonator according to an embodiment of the present invention;

FIG. 5c is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

FIG. 5d is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

fig. 5e is a schematic structural diagram of a crystal oscillator according to an embodiment of the present invention;

FIG. 5f is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a crystal oscillator according to an embodiment of the present invention;

FIG. 7a is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

FIG. 7b is a schematic diagram of a crystal oscillator according to an embodiment of the present invention;

fig. 8a is a schematic structural diagram of a semiconductor oscillator according to an embodiment of the present invention;

fig. 8b is a schematic structural diagram of a semiconductor oscillator according to an embodiment of the present invention;

fig. 9a is a schematic structural diagram of a semiconductor oscillator according to an embodiment of the present invention;

fig. 9b is a schematic structural diagram of a semiconductor oscillator according to an embodiment of the present invention;

fig. 10a is a schematic structural diagram of a semiconductor oscillator according to an embodiment of the present invention;

fig. 10b is a schematic structural diagram of a semiconductor oscillator according to an embodiment of the present invention;

fig. 11 is a flowchart of a method for manufacturing a clock oscillator according to an embodiment of the present invention;

FIG. 12a is a schematic diagram of an apparatus for obtaining a clock frequency according to an embodiment of the present invention;

FIG. 12b is a schematic diagram illustrating a structure of an apparatus for obtaining a clock frequency according to an embodiment of the present invention;

FIG. 12c is a schematic diagram of an apparatus for obtaining a clock frequency according to an embodiment of the present invention;

fig. 13 is a flowchart of a method for manufacturing a device for obtaining a clock frequency according to an embodiment of the present invention.

Detailed Description

Embodiments of the present application are described below with reference to the accompanying drawings.

Fig. 1 shows a basic principle schematic of a clock oscillator. As shown on the left side of fig. 1, the clock oscillator includes a resonator, a feedback network, a frequency selective network, an amplification network, and an output network. Combining the amplification, feedback and frequency-selection network loop model on the right side of the figure 1, the amplification network has power gain, when the resonator starts to vibrate, the amplification network works in a linear region to amplify a noise signal or an input signal, once the vibration of the resonator is established, the amplification network enters a nonlinear state, the loop gain is reduced, and the purposes of amplitude stabilization and frequency stabilization are achieved; the frequency selection network selects each frequency signal output by the amplification network, so that the frequency signal of the selected frequency point is output, and the signals of other frequencies are suppressed; the feedback network feeds back the frequency signal through the frequency selection network to the input end of the large network to form a closed-loop positive feedback network; and the output network shapes and drives the amplified stable frequency signal and outputs the signal to other devices.

Clock oscillators can be classified into different categories according to the difference in the resonator type, among which crystal oscillators and semiconductor oscillators are two typical mechanical oscillators.

Fig. 2 shows a schematic diagram of a crystal oscillator configuration. As shown in fig. 2, a crystal oscillator includes a crystal resonator, typically a thin slice cut from a quartz crystal at an azimuth angle, also known as a wafer or crystal. The crystal oscillator is in a semi-suspension structure, realizes frequency selection by utilizing the resonance characteristic of the crystal and outputs a specific frequency signal. In addition to the crystal resonator, the crystal oscillator includes an integrated circuit IC, conductive silver paste, a base, and a cover.

In a crystal oscillator, the thickness of a wafer is related to the fundamental frequency (fundamental frequency), which may also be referred to as the fundamental frequency or output frequency. Generally, the higher the fundamental frequency, the thinner the wafer thickness. For example, a wafer thickness of 156.25MHz is about 11 μm, a wafer thickness of 285MHz is about 7 μm, and a wafer thickness of 500MHz is about 3 μm.

In practical product applications, a clock oscillator with high frequency and low jitter performance is required in a high-speed analog-to-digital converter (ADC)/digital-to-analog converter (DAC), and a high-fundamental frequency crystal oscillator is a mainstream clock scheme of the high-speed ADC/DAC, so the micron-scale wafer is widely applied to these devices.

However, the thinner the thickness of the wafer, the poorer the shock resistance. Generally speaking, there is a theoretical relationship between the external stress and the fundamental frequency of the wafer, as represented by the following formula (1).

Wherein, K_FThe constant factor is f is the fundamental Frequency of the wafer, Δ f is the Frequency error caused by vibration, Force is the external Force on the wafer, Frequency constant is a constant, Diameter is the equivalent Diameter of the wafer, and Thickness is the Thickness of the wafer. As can be seen from formula (1), the same appliesUnder the influence of external stress, when the thickness of the wafer is thinner, the frequency error caused by vibration is larger, namely the anti-vibration performance of the wafer is poorer. Therefore, the above-mentioned micron-scale thickness of the wafer is more likely to cause frequency error when it is affected by external shock, thereby causing performance degradation and even breakage to cause the entire crystal oscillator to fail.

However, during the operation of the crystal oscillator, the influence of external vibration is inevitable. For example, environmental temperature changes will cause PCB stress release in the optical module of the communication device to generate acoustic emissions (acoustic emissions), wherein a typical scenario is that, during temperature changes, residual flux in solder paste on the PCB board cracks during temperature cycling, and acoustic emissions are accompanied during crack generation and propagation, and the acoustic emissions are usually high-frequency mechanical vibrations with a frequency of about 200 kHz. As shown in fig. 2, the wafer and the pedestal are generally rigidly connected, high-frequency mechanical vibration in the acoustic emission can be transmitted to the wafer, and the wafer is of a semi-suspended structure, and the high-frequency mechanical vibration will cause bending deformation of the wafer, which will cause a jump of the output frequency of the wafer, and further cause system performance degradation and service error. In the actual production process, the problems of crystal oscillator frequency hopping and service error codes caused by temperature change have seriously influenced the research and development production efficiency and the product competitiveness.

Fig. 3a shows a schematic diagram of a crystal oscillator configuration. In the crystal oscillator, the dispensing quantity of the conductive silver adhesive between the wafer and the base is increased so as to absorb external vibration and improve the anti-seismic performance of the crystal oscillator. However, since the external vibration belongs to mechanical waves and is transmitted by means of rigid bodies, the nature of rigid connection between the crystal resonator and the base cannot be changed by increasing the dispensing amount, and the transmission of external high-frequency mechanical waves to the crystal resonator cannot be prevented, so that the influence of the external vibration on the crystal oscillator cannot be effectively improved.

Fig. 3b shows a schematic diagram of a crystal oscillator configuration. In the crystal oscillator, the types of the conductive silver adhesive between the wafer and the base are replaced, so that the connection reliability between the base and the wafer is ensured, and the anti-seismic performance of the crystal oscillator is improved. However, similar to the crystal oscillator shown in fig. 3a, since the external vibration belongs to a mechanical wave, and is propagated by a rigid body, the nature of the rigid connection between the crystal resonator and the base cannot be changed by merely replacing the conductive silver paste, and the propagation of the external high-frequency mechanical wave to the crystal resonator cannot be prevented, so that the influence of the external vibration on the crystal oscillator cannot be effectively improved.

Fig. 3c shows a schematic diagram of a PCB board carrying a crystal oscillator. As shown in fig. 3c, oscillator pads for soldering and fixing the crystal oscillator are arranged on the PCB, and stress isolation grooves are arranged around the oscillator pads, so that a certain damping effect can be provided for the stress generated by thermal expansion and contraction of the PCB itself. However, such stress isolation grooves cannot isolate all external vibrations, for example, high frequency vibrations generated by cracks in the flux in the solder used for soldering the pad of the crystal oscillator during temperature cycling.

A semiconductor oscillator is another important type of clock oscillator, and compared with a crystal oscillator, a resonator in the semiconductor oscillator is a micro-nano structure prepared based on a semiconductor process, and is also called a semiconductor resonator. Semiconductor resonators in the micrometer range are also commonly referred to as Microelectromechanical Systems (MEMS) resonators. Fig. 4a shows a schematic configuration of a semiconductor resonator, and fig. 4b shows a semiconductor oscillator including the semiconductor resonator. As shown in fig. 4a, the semiconductor resonator is a Bulk Acoustic Wave (BAW) resonator, and is composed of an upper electrode, a lower electrode, a piezoelectric material layer, and a substrate. The piezoelectric material layer is sandwiched between the upper electrode and the lower electrode, and the three electrodes are integrally placed on the substrate. Optionally, an acoustic reflector (acoustic mirror) may be further disposed between the lower electrode and the substrate. As shown in fig. 4b, the BAW resonator is connected to an IC circuit and a substrate to form a BAW oscillator. The BAW oscillator is a kind of semiconductor oscillator, and its basic principle is that an electric transducer (not shown in fig. 4 a) converts an electric signal into an acoustic wave, which is transmitted in a piezoelectric material layer, and the acoustic wave is reflected and resonated in the piezoelectric material layer, and finally converts the acoustic wave into an electric signal with a higher frequency, so as to form an oscillation signal.

It should be noted that the semiconductor oscillator according to the embodiment of the present invention may be various types of semiconductor oscillators, including but not limited to the BAW oscillator shown in fig. 4 b. Other types of semiconductor oscillators, such as silicon MEMS oscillators, are also suitable for use in embodiments of the present invention.

The semiconductor oscillator is less affected by external vibration than a crystal oscillator. However, when external vibration is transmitted to the semiconductor resonator, bending deformation of the semiconductor resonator may still be caused, which may cause output frequency jump of the semiconductor resonator, and further cause system performance degradation and service error. However, no effective and reliable solution is available in the industry, which does not introduce performance cost and increase the complexity of the production process.

Therefore, it is an urgent technical problem to improve the anti-seismic performance of the clock oscillator.

The embodiment of the invention provides a clock oscillator, which comprises a resonator, a shock-absorbing material layer and a base, wherein at least one part of the shock-absorbing material layer is positioned between the resonator and the base. The clock oscillator is additionally provided with the shock-absorbing material layer between the resonator and the base, the shock-absorbing material layer can convert mechanical wave energy into heat energy through self deformation, so that mechanical wave conduction is effectively prevented between the base and the resonator, the resonator is free from the influence of external vibration, the output frequency of the resonator is not degraded under the condition of external vibration, and the shock resistance of the clock oscillator is improved.

The clock oscillator provided by the embodiment of the invention can be a crystal oscillator or a semiconductor oscillator.

Fig. 5a shows a crystal oscillator according to an embodiment of the present invention. The crystal oscillator comprises a crystal resonator, a shock-absorbing material layer and a base, wherein at least one part of the shock-absorbing material layer is positioned between the crystal resonator and the base. The crystal resonator and the base can be electrically connected or in signal communication. And, the crystal oscillator can also comprise a bonding pad for realizing electric connection or signal intercommunication with an external device. The number of the pads is not limited. The shock-proof material layer can effectively improve the shock-proof performance of the clock oscillator, and meanwhile, the reliability and small-size packaging of the whole oscillator element are guaranteed. For example, the cushioning material layer may be selected from cushioning materials having one or more of the following characteristics: 1) a micro-nano ultra-thin layer structure can be formed to reduce the increase of the thickness of the device as much as possible; 2) super elasticity to achieve high wave absorbing efficiency; 3) fatigue resistance, capability of repeated deformation without irreversible deformation; 4) the heat resistance is realized, and the property degradation can not occur when the heat-resistant alloy works at high temperature for a long time; 5) high strength, not easy to tear and impact resistance.

The influence of the added shock-absorbing material layer on the overall thickness of the device is an important consideration, the height of the current high-fundamental-frequency crystal oscillator is about 1.05mm, and in order to avoid serious influence on the thickness of the device, the thickness of the finally obtained shock-absorbing material layer is preferably in the micrometer magnitude, for example, less than several hundred micrometers. Taking carbon nanotubes and graphene as an example, although the two materials have superelasticity and thermo-mechanical stability, the related equipment and preparation process are complex, only millimeter-sized materials can be obtained at present, and the overall thickness of the clock oscillator is greatly increased when the material layer is applied to the shock absorbing material layer in the embodiment of the invention.

Optionally, the shock absorbing material may also be a polymer material. The high molecular polymer material can be a reverse deformation high elastic high molecular polymer material, such as silica gel, rubber, etc. The high molecular polymer material has the advantages of simple and convenient processing, large-scale preparation of the material, economy and cheapness.

Optionally, the shock absorbing material selected for the shock absorbing material layer in the embodiment of the present invention may be a micron-scale layered structure, or may be a nano-scale three-dimensional network structure. The materials of the two structures can form a shock-absorbing material layer with the thickness of tens of micrometers to hundreds of micrometers, so that high shock-absorbing performance is realized with very thin thickness, and small-size packaging is ensured; the materials with the two structures have high strength and high toughness, so that the problem that the materials with the traditional structures are difficult to have high strength and high toughness is solved, and the reliability is ensured; and the materials with the two structures can be prepared by a large-scale biological material synthesis method, are economical and cheap, and support large-scale manufacturing.

Optionally, the shock absorbing material selected for the shock absorbing material layer may be a carbon nanofiber material, or may be a ceramic nanofiber material. The nanofiber materials can ensure reliability and small-size packaging on the basis of improving the shock resistance of the clock oscillator.

Optionally, in the crystal oscillator, the crystal resonator may be vacuum-packaged in advance, so as to add a layer of shock absorbing material. The vacuum packaging may be Surface Mounted Devices (SMD) ceramic packaging. Fig. 5b shows a structural diagram of the crystal resonator of the SMD ceramic package, wherein the crystal resonator is in a half-suspended structure and is bonded to the SMD ceramic package housing through conductive silver paste. Alternatively, the SMD ceramic vacuum-packaged crystal resonator can meet the existing various common dimension specifications for crystal resonators, for example, the package size of the SMD ceramic vacuum-packaged crystal resonator may be differential SMD3225 or single-ended SMD 2520.

Optionally, the surfaces of the crystal resonator and the shock absorbing material layer, which are in contact with each other, are bonded to realize tight connection therebetween.

Optionally, the crystal oscillator further comprises an integrated circuit IC. The IC and the base can be electrically connected or communicated with each other through signals.

Optionally, at least a portion of the layer of shock absorbing material is located between the IC and the resonator, and the layer of shock absorbing material is in contact with a first surface of the IC, a second surface of the IC is in contact with a first surface of the base, the first surface of the IC is opposite the second surface of the IC; that is, the crystal resonator is placed in a stack with the IC, with the crystal oscillator shown in fig. 5a in a side view and fig. 5c in a top view.

Optionally, the shock absorbing material layer and the IC are both in contact with the first surface of the base, and the IC and the shock absorbing material layer are not overlapped; that is, the crystal resonator is placed in parallel with the IC, with the crystal oscillator shown in fig. 5d in a side view and fig. 5e in a top view.

Alternatively, the layer of cushioning material may be a layered structure.

Alternatively, the structure of the shock absorbing material layer may be a planar layered structure. At this time, as shown in fig. 5a and 5d, the crystal resonator is located on the first side of the shock absorbing material layer, the base is located on the second side of the shock absorbing material layer, and the second side of the shock absorbing material layer is opposite to the first side of the shock absorbing material layer. The planar layered structure includes, but is not limited to, a continuous planar layered structure, a planar grid layered structure, or a plurality of dot-shaped structures in the same plane. As shown in fig. 5f, when the structure of the shock absorbing material layer is a planar grid-type layered structure or a plurality of dot-shaped structures in the same plane, the shock absorbing material layer can still effectively prevent the conduction of mechanical waves between the base and the resonator, so that the resonator is protected from external shocks.

Optionally, the structure of the shock absorbing material layer may also be a curved-surface-type layered structure. At this time, as shown in fig. 6, the shock absorbing material layer completely surrounds or semi-surrounds the crystal resonator. The curved layered structure includes, but is not limited to, a continuous curved layered structure or a curved network layered structure.

Optionally, the crystal resonator and the shock absorbing material layer are integrally packaged to obtain the crystal oscillator. The integral packaging mode can be vacuum packaging or plastic packaging. For example, fig. 5a, 5d, 5f and 6 all show a vacuum package in which the crystal resonator, the shock absorbing material layer and the IC are placed on a ceramic base, which is covered with a metal cover. For another example, fig. 7a shows another vacuum packaging method, in which at least a portion of the shock absorbing material layer is located between the IC and the resonator, the shock absorbing material layer is in contact with a first surface of the IC, a second surface of the IC is in contact with a first surface of the base, the first surface of the IC is opposite to the second surface of the IC, the first surface of the base is covered with an arc-shaped cover plate, and further packaged with a resin material. In the vacuum packaging method shown in fig. 7a, the shock absorbing material layer may be in contact with the first surface of the base, the IC is in contact with the first surface of the base, and the IC and the shock absorbing material layer are not overlapped, and detailed illustration is not given here. For another example, fig. 7b shows a plastic package method in which the shock absorbing material layer completely surrounds the crystal resonator, the shock absorbing material layer contacts with the first surface of the IC, the second surface of the IC contacts with the first surface of the base, the first surface of the IC faces the second surface of the IC, that is, the first surface of the base is further placed on the base after being overlapped with the IC, and the first surface of the base is packaged with a plastic package material. It should be noted that, in the vacuum packaging manner shown in fig. 7b, the shock absorbing material layer may be in contact with the first surface of the base, the IC is in contact with the first surface of the base, and the IC and the shock absorbing material layer are not overlapped, and a specific illustration is not given here.

Fig. 8a shows a semiconductor oscillator according to an embodiment of the present invention. The semiconductor oscillator includes a semiconductor resonator, a layer of shock absorbing material, and a base, at least a portion of the layer of shock absorbing material being located between the semiconductor resonator and the base. The semiconductor resonator and the base can be electrically connected or in signal communication. And, the semiconductor oscillator may further include a pad for electrical connection or signal communication with an external device. The number of the pads is not limited. The performance requirements and specific types of the shock absorbing material selected for the shock absorbing material layer are the same as those of the crystal oscillator, and are not described herein again.

Alternatively, the semiconductor resonator may be a BAW resonator, a MEMS resonator, or another type of semiconductor resonator.

Alternatively, in the semiconductor oscillator, the semiconductor resonator may be wafer-packaged in advance.

Optionally, the surfaces of the semiconductor resonator and the shock absorbing material layer, which are in contact with each other, are bonded to realize tight connection therebetween.

Optionally, the semiconductor oscillator further comprises an IC. The IC and the base can be electrically connected or in signal communication.

Optionally, at least a portion of the layer of shock absorbing material is located between the IC and the resonator, and the layer of shock absorbing material is in contact with a first surface of the IC, a second surface of the IC is in contact with a first surface of the base, the first surface of the IC is opposite the second surface of the IC; that is, the semiconductor resonator is placed in stack with the IC, while the semiconductor oscillator is as shown in fig. 8 a.

Optionally, the shock absorbing material layer and the IC are both in contact with the first surface of the base, and the IC and the shock absorbing material layer are not overlapped; that is, the semiconductor resonator is placed in parallel with the IC, when the semiconductor oscillator is as shown in fig. 8 b.

Optionally, the structure of the shock absorbing material layer in the semiconductor oscillator is the same as that of the crystal oscillator, and may be a layered structure, and further, the layered structure may be a planar layered structure or a curved layered structure, which is not described herein again. Fig. 8a and 8b show the semiconductor oscillator using the shock absorbing material layer of the continuous planar type layered structure, fig. 9a shows the semiconductor oscillator using the shock absorbing material layer of the planar grid type layered structure or the plurality of dot type structures in the same plane, and fig. 9b shows the semiconductor oscillator using the shock absorbing material layer of the curved type layered structure.

Optionally, the semiconductor resonator and the layer of shock absorbing material are integrally packaged to obtain the semiconductor oscillator. The integral packaging mode can be vacuum packaging or plastic packaging. For example, fig. 8a, 8b, 9a and 9b each show a vacuum packaging method in which a semiconductor resonator, a shock absorbing material layer and an IC are placed on a ceramic base and covered with a metal cover. For another example, fig. 10a shows another vacuum packaging method, in which at least a part of the shock absorbing material layer is located between the IC and the resonator, the shock absorbing material layer is in contact with a first surface of the IC, a second surface of the IC is in contact with a first surface of the base, the first surface of the IC is opposite to the second surface of the IC, the first surface of the base is covered with an arc-shaped cover plate, and further packaged with a resin material. In the vacuum packaging method shown in fig. 10a, the shock absorbing material layer may be in contact with the first surface of the base, the IC may be in contact with the first surface of the base, and the IC may not overlap with the shock absorbing material layer, which is not specifically shown here. For another example, fig. 10b shows a mold package in which a layer of shock absorbing material completely surrounds the semiconductor resonator, the layer of shock absorbing material is in contact with a first surface of the IC, a second surface of the IC is in contact with a first surface of the base, the first surface of the IC is opposite to the second surface of the IC, i.e., the first surface of the base is further placed on the base after both are overlapped with the IC, and the first surface of the base is encapsulated with a mold package. In the vacuum packaging method shown in fig. 10b, the shock absorbing material layer may be in contact with the first surface of the base, the IC is in contact with the first surface of the base, and the IC and the shock absorbing material layer are not overlapped, and detailed illustration is not given here.

Optionally, in the crystal oscillator and the semiconductor oscillator, the electrodes in the vacuum-packaged crystal resonator may be led out by a wire bonding method, or the electrodes in the wafer-packaged semiconductor resonator may be led out by a wire bonding method.

Taking a crystal oscillator in an optical module of a communication device as an example, it can be found through actual on-board testing that the error rate of the optical module is more than 10% under the condition that a shock absorbing material layer is not added, and after the shock absorbing material layer is added, a basic error-free code can be realized. Therefore, the clock oscillator provided by the embodiment of the invention can obviously improve the shock resistance of the clock oscillator, improve the production process of products and improve the competitiveness of the products. Moreover, reliability and small-size packaging can be guaranteed on the basis of improving the shock resistance of the clock oscillator.

The embodiment of the invention provides a method for preparing a clock oscillator. According to the method, the shock-proof material layer is additionally arranged between the resonator and the base, and the shock-proof material layer can convert mechanical wave energy into heat energy through self deformation, so that the mechanical wave conduction is effectively prevented between the base and the resonator, the resonator is free from the influence of external vibration, the output frequency of the resonator is ensured not to be degraded under the condition of the external vibration, and the shock resistance of the clock oscillator is improved. As shown in fig. 11, the method includes steps S110 and S120.

S110, arranging at least one part of the shock absorbing material layer between the resonator and the base;

and S120, integrally packaging the oscillator and the shock absorbing material layer to obtain the clock oscillator.

The clock oscillator may be a crystal oscillator or a semiconductor oscillator.

The performance requirements, specific types and structures of the shock absorbing material selected for the shock absorbing material layer are the same as those of the above embodiments, and are not described herein again.

The packaging manner of the overall package is the same as that of the above embodiments, and is not described herein again.

Optionally, when the structure of the shock-absorbing material layer includes a planar layered structure, disposing at least a portion of the shock-absorbing material layer between the resonator and the base includes: placing the resonator on a first side of the layer of cushioning material; placing a base on a second side of the layer of cushioning material, the second side of the layer of cushioning material being opposite the first side of the layer of cushioning material.

Optionally, when the structure of the shock absorbing material layer is a curved-surface-type layered structure, at least a portion of the shock absorbing material layer is disposed between the resonator and the base, including: and fully surrounding or semi-surrounding the resonator by using the shock absorbing material layer.

Optionally, the structure of the shock absorbing material layer is a curved-surface-type layered structure, and at least a part of the shock absorbing material layer is disposed between the resonator and the base, including: and fully surrounding or semi-surrounding the resonator by using the shock absorbing material layer.

Optionally, the disposing at least a portion of the layer of shock absorbing material between the resonator and the base includes: and bonding the resonator with the surface of the shock absorbing material layer.

Optionally, the clock oscillator further includes an integrated circuit IC, and the disposing at least a portion of the layer of shock absorbing material between the resonator and the base includes: disposing at least a portion of the layer of shock absorbing material between the resonator and the IC, the layer of shock absorbing material in contact with a first surface of the IC, a second surface of the IC in contact with a first surface of the base, the first surface of the IC opposite the second surface of the IC.

Optionally, the clock oscillator further includes an integrated circuit IC, and the disposing at least a portion of the layer of shock absorbing material between the resonator and the base includes: placing the resonator, the layer of shock absorbing material, and the IC on a first surface of the base, and the IC is non-overlapping with the layer of shock absorbing material.

Optionally, before disposing at least a portion of the layer of shock absorbing material between the resonator and the base, the method further comprises:

and carrying out vacuum packaging on the resonator.

The vacuum packaging method of the crystal resonator and the semiconductor resonator is the same as that of the above embodiment, and is not described herein again.

The embodiment of the invention provides a method for obtaining clock frequency. The method obtains a stable and high-performance clock frequency through the clock oscillator in the embodiment.

An embodiment of the present invention provides a chip, where the chip includes the clock oscillator in the above embodiment.

An embodiment of the present invention provides an electronic device, which includes the clock oscillator in the above embodiment. Specifically, the electronic device may be a communication device or a network device, such as a router, a switch, or other forwarding devices, or a computer device, such as a personal computer or a server, or a communication terminal device, such as a mobile phone or a wearable smart device.

In addition, the embodiment of the invention provides a device for obtaining the clock frequency, which comprises a clock oscillator, a shock-absorbing material layer and a substrate, wherein at least one part of the shock-absorbing material layer is positioned between the clock oscillator and at least one part of the substrate. The device adds the shock-absorbing material layer between the clock oscillator and at least one part of the substrate, and the shock-absorbing material layer can effectively prevent the conduction of mechanical waves between the substrate and the clock oscillator, so that the clock oscillator is free from the influence of external vibration, the output frequency of the clock oscillator is ensured not to be degraded under the condition of external vibration, and the shock resistance of the clock oscillator is improved.

Fig. 12a to 12c illustrate an apparatus for obtaining a clock frequency according to an embodiment of the present invention. The device comprises a clock oscillator, a shock-absorbing material layer and a substrate, wherein at least one part of the shock-absorbing material layer is positioned between the clock oscillator and at least one part of the substrate. The clock oscillator and the substrate can be electrically connected or in signal communication. For example, the clock oscillator and the substrate may be electrically connected by a bonding wire (not shown). Optionally, the substrate may be provided with pads, and the number of the pads is not limited.

Optionally, the apparatus further includes a cover plate (as shown in fig. 12 a) or a plastic package material (as shown in fig. 12c), and the cover plate or the plastic package material is used for vacuum packaging of the clock oscillator.

Alternatively, the shock absorbing material layer may be a planar layered structure. At this time, as shown in fig. 12a, the clock oscillator is located at the first side of the shock absorbing material layer, the substrate is located at the second side of the shock absorbing material layer, and the second side of the shock absorbing material layer is opposite to the first side of the shock absorbing material layer. The planar layered structure includes, but is not limited to, a continuous planar layered structure, a planar grid-like layered structure, or a plurality of dot-like structures in the same plane.

Alternatively, the substrate may be a Flexible Printed Circuit Board (FPC). The FPC may be U-shaped. As shown in fig. 12b, the first portion of the FPC is located at the first side of the shock absorbing material layer, the second portion of the FPC is located at the second side of the shock absorbing material layer, and the first portion of the FPC is located between the clock oscillator and the shock absorbing material layer. Namely, the shock-absorbing material layer is filled between the upper and lower parallel surfaces of the U-shaped FPC. At the moment, when external vibration is transmitted, the shock absorbing material layer clamped between the upper and lower parallel surfaces of the FPC can convert mechanical wave energy into heat energy through self deformation, so that the mechanical wave conduction is effectively prevented between the substrate and the clock oscillator, and the clock oscillator is prevented from being influenced by the external vibration.

Optionally, conductive silver paste bonding or solder paste soldering may be used between the clock oscillator and the FPC.

Optionally, the structure of the shock absorbing material layer may also be a curved-surface-type layered structure. At this time, as shown in FIG. 12c, the shock absorbing material layer is completely surrounded. Alternatively, the layer of shock absorbing material may also semi-surround the clock oscillator. The curved layered structure includes, but is not limited to, a continuous curved layered structure or a curved network layered structure.

The structure of the shock absorbing material layer can refer to the structure of the above embodiment, for example, the planar layered structure includes a continuous planar layered structure, a planar mesh-type layered structure, or a plurality of dot-shaped structures in the same plane, and the curved layered structure includes a continuous curved layered structure or a curved mesh-type layered structure, which is not described herein again.

The shock-absorbing material selected for the shock-absorbing material layer may be the shock-absorbing material provided in the above embodiments, and is not described herein again.

The clock oscillator may be the clock oscillator provided in the above embodiment, where the clock oscillator includes a resonator and an integrated circuit IC, and the resonator is a crystal resonator or a semiconductor resonator, for example, the clock oscillator shown in fig. 2, fig. 3a, fig. 3b, fig. 5a, fig. 5d, fig. 6, fig. 7a, fig. 7b, fig. 8a, fig. 8b, fig. 9a, fig. 9b, fig. 10a, or fig. 10b, which is not described herein again.

The embodiment of the invention provides a preparation method of a device for obtaining clock frequency. According to the method, the shock absorbing material layer is additionally arranged between the clock oscillator and the substrate, mechanical wave energy can be converted into heat energy through self deformation of the shock absorbing material layer, so that mechanical wave conduction is effectively prevented between the clock oscillator and the substrate, the clock oscillator is free from the influence of external vibration, the output frequency of the clock oscillator is not degraded under the condition that the external vibration exists, and the shock resistance of the clock oscillator is improved. As shown in fig. 13, the method includes steps S210 and S220.

S210, arranging at least one part of the shock absorbing material layer between the clock oscillator and at least one part of the substrate;

s220, integrally packaging the clock oscillator and the shock absorbing material layer to obtain the device.

Optionally, the structure of the shock-absorbing material layer includes a planar layered structure, and at least a portion of the shock-absorbing material layer is disposed between the clock oscillator and at least a portion of the substrate, including:

disposing the clock oscillator on a first side of the layer of cushioning material,

and arranging at least one part of the substrate on the second side of the shock-absorbing material layer, wherein the second side of the shock-absorbing material layer is opposite to the first side of the shock-absorbing material layer.

Optionally, the base plate is flexible line way board FPC, FPC is the U-shaped, set up at least partly between clock oscillator and at least part of base plate with at least part of shock absorber material layer, include:

disposing a first portion of the FPC on a first side of the layer of cushioning material,

disposing a second portion of the FPC on a second side of the layer of cushioning material,

disposing the first portion of the FPC between the clock oscillator and the layer of shock absorbing material.

Optionally, the structure of the shock absorbing material layer includes a curved-surface-type layered structure, and at least a portion of the shock absorbing material layer is disposed between the clock oscillator and at least a portion of the substrate, including:

and fully surrounding or semi-surrounding the clock oscillator by using the shock absorbing material layer.

Optionally, the method further includes:

the clock oscillator and the substrate are electrically connected with a bonding wire.

The clock oscillator may be the clock oscillator provided in the above embodiments, for example, the clock oscillator shown in fig. 2, fig. 3a, fig. 3b, fig. 5a, fig. 5d, fig. 6, fig. 7a, fig. 7b, fig. 8a, fig. 8b, fig. 9a, fig. 9b, fig. 10a, or fig. 10b, which is not described herein again.

The packaging manner of the overall package is the same as that of the above embodiments, and is not described herein again. For example, the integrally packaging the clock oscillator and the shock absorbing material layer includes:

and carrying out vacuum packaging on the clock oscillator and the shock absorbing material layer by utilizing a cover plate or a plastic packaging material.

The embodiment of the invention provides a method for obtaining clock frequency. The method obtains a stable and high-performance clock frequency through the device in the embodiment.

An embodiment of the present invention provides a chip, where the chip includes the apparatus for obtaining a clock frequency in the foregoing embodiment.

An embodiment of the present invention provides an electronic device, which includes the apparatus for obtaining a clock frequency in the foregoing embodiment. Specifically, the electronic device may be a communication device or a network device, such as a router, a switch, or other forwarding devices, or the electronic device may also be a computer device, such as a personal computer or a server, or the electronic device may also be a communication terminal device, such as a mobile phone or a wearable smart device.

The terms "first," "second," and the like in this application are used for distinguishing between similar items and items that have substantially the same function or similar functionality, and it should be understood that "first," "second," and "nth" do not have any logical or temporal dependency or limitation on the number or order of execution. It will be further understood that, although the following description uses the terms first, second, etc. to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first image may be referred to as a second image, and similarly, a second image may be referred to as a first image, without departing from the scope of the various described examples. Both the first image and the second image may be images, and in some cases, may be separate and distinct images.

It should also be understood that, in the embodiments of the present application, the size of the serial number of each process does not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

It is to be understood that the terminology used in the description of the various described examples herein is for the purpose of describing particular examples only and is not intended to be limiting. As used in the description of the various described examples and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. The term "and/or" is an association that describes an associated object, meaning that three relationships may exist, e.g., A and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" in the present application generally indicates that the former and latter related objects are in an "or" relationship.

It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should also be understood that the terms "if" and "if" may be interpreted to mean "when" ("when" or "upon") or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined," or "if [ a stated condition or event ] is detected," may be interpreted to mean "upon determining," or "in response to determining," or "upon detecting [ a stated condition or event ], or" in response to detecting [ a stated condition or event ] ", depending on the context.

It should also be appreciated that reference throughout this specification to "one embodiment," "an embodiment," "one possible implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" or "one possible implementation" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A clock oscillator, characterized in that,

the clock oscillator comprises a resonator, a shock-absorbing material layer and a base, wherein at least one part of the shock-absorbing material layer is positioned between the resonator and the base.

2. The clock oscillator of claim 1, wherein the layer of shock absorbing material comprises a micro-scale layered structure, a nano-scale three-dimensional mesh structure, or a high molecular polymer material.

3. The clock oscillator of claim 2, wherein the nanoscale three-dimensional network comprises nanofibers.

4. The clock oscillator of claim 3, wherein the nanofibers comprise carbon nanofibers and/or ceramic nanofibers.

5. The clock oscillator of any of claims 1-4, wherein the structure of the layer of shock absorbing material comprises a planar layered structure, the resonator is located on a first side of the layer of shock absorbing material, the base is located on a second side of the layer of shock absorbing material, the second side of the layer of shock absorbing material being opposite the first side of the layer of shock absorbing material.

6. The clock oscillator of claim 5, wherein the planar layered structure comprises a continuous planar layered structure, a planar mesh layered structure, or a plurality of dot-like structures in the same plane.

7. The clock oscillator according to any of claims 1-4, wherein the structure of the layer of shock absorbing material comprises a curved laminar structure, the layer of shock absorbing material fully or semi-surrounding the resonator.

8. The clock oscillator of claim 7, wherein the curved layered structure comprises a continuous curved layered structure or a curved mesh layered structure.

9. The clock oscillator of any of claims 1-8, wherein the resonator is bonded to a surface of the layer of shock absorbing material.

10. The clock oscillator of any of claims 1-9, wherein the clock oscillator further comprises an Integrated Circuit (IC);

wherein at least a portion of the layer of shock absorbing material is located between the IC and the resonator, and the layer of shock absorbing material is in contact with a first surface of the IC, a second surface of the IC is in contact with the first surface of the base, and the first surface of the IC is opposite the second surface of the IC; alternatively, the first and second electrodes may be,

the shock-absorbing material layer is in contact with the first surface of the base, the IC is in contact with the first surface of the base, and the IC is not overlapped with the shock-absorbing material layer.

11. The clock oscillator of any of claims 1-10, wherein the resonator is a crystal resonator or a semiconductor resonator.

12. The clock oscillator of claim 11, wherein the crystal resonator is a Surface Mount Device (SMD) ceramic packaged crystal resonator.

13. The clock oscillator of claim 11, wherein the semiconductor resonator is a wafer-packaged semiconductor resonator.

14. The clock oscillator as recited in any one of claims 1-13, wherein the resonator and the shock absorbing material layer are integrally encapsulated by vacuum encapsulation or plastic encapsulation.

15. A method of preparing a clock oscillator, the method comprising:

disposing at least a portion of the layer of cushioning material between the resonator and the base;

and integrally packaging the resonator and the shock absorbing material layer to obtain the clock oscillator.

16. The method of claim 15, wherein the layer of cushioning material comprises a micro-scale layered structure, a nano-scale three-dimensional mesh structure, or a polymeric material.

17. The method of claim 16, wherein the nanoscale, three-dimensional network comprises nanofibers.

18. The method of claim 17, wherein the nanofibers comprise carbon nanofibers and/or ceramic nanofibers.

19. The method according to any one of claims 15-18, wherein the structure of the layer of cushioning material comprises a planar layered structure,

the disposing at least a portion of the layer of cushioning material between the resonator and the base includes:

placing the resonator on a first side of the layer of cushioning material;

placing a base on a second side of the layer of cushioning material, the second side of the layer of cushioning material being opposite the first side of the layer of cushioning material.

20. The method of claim 19, wherein the planar layered structure comprises a continuous planar layered structure, a planar grid-like layered structure, or a plurality of dot-like structures in the same plane.

21. The method according to any one of claims 15 to 18, wherein the shock-absorbing material layer is constructed in a curved layered structure,

and utilizing the shock absorbing material layer to completely or semi-surround the resonator.

22. The method of claim 21, wherein the curved layered structure comprises a continuous curved layered structure or a curved reticulated layered structure.

23. The method of any one of claims 15-22, wherein disposing at least a portion of the layer of shock absorbing material between the resonator and the base comprises:

and bonding the resonator with the surface of the shock absorbing material layer.

24. The method of any one of claims 15-23, wherein the clock oscillator further comprises an Integrated Circuit (IC), and wherein disposing at least a portion of the layer of shock absorbing material between the resonator and the base comprises:

disposing at least a portion of the layer of shock absorbing material between the resonator and the IC, the layer of shock absorbing material in contact with a first surface of the IC, a second surface of the IC in contact with the first surface of the base, the first surface of the IC opposite the second surface of the IC.

25. The method of any of claims 15-23, wherein the clock oscillator further comprises an Integrated Circuit (IC), and wherein disposing at least a portion of the layer of shock absorbing material between the resonator and the base comprises:

placing the resonator, the layer of shock absorbing material, and the IC on a first surface of the base, and the IC is non-overlapping with the layer of shock absorbing material.

26. The method according to any one of claims 15-25, wherein the integral package comprises a vacuum package or a plastic package.

27. The method of any one of claims 15-26, wherein prior to disposing at least a portion of the layer of shock absorbing material between the resonator and the base, the method further comprises:

and carrying out vacuum packaging on the resonator.

28. The method of claim 27,

when the resonator is a crystal resonator, the vacuum packaging is carried out on the resonator, and the method comprises the following steps: carrying out Surface Mounting Device (SMD) ceramic packaging on the crystal resonator;

when the resonator is a semiconductor resonator, the vacuum packaging of the resonator comprises the following steps: and carrying out wafer packaging on the semiconductor resonator.

29. A method of deriving a clock frequency, wherein the clock frequency is derived by a clock oscillator as claimed in any one of claims 1 to 14.

30. A chip, characterized in that it comprises a clock oscillator according to any of claims 1-14.

31. An electronic device, characterized in that the electronic device comprises a clock oscillator according to any of claims 1-14.

32. The electronic device of claim 31, wherein the electronic device is a communication device or a network device.

33. An apparatus for obtaining a clock frequency, the apparatus comprising a clock oscillator, a layer of cushioning material, and a substrate, at least a portion of the layer of cushioning material being located between the clock oscillator and at least a portion of the substrate.

34. The apparatus as claimed in claim 33, wherein the shock absorbing material layer comprises a micro-scale layered structure, a nano-scale three-dimensional mesh structure or a high polymer material.

35. The apparatus of claim 34, wherein the nanoscale, three-dimensional network comprises nanofibers.

36. The device of claim 35, wherein the nanofibers comprise carbon nanofibers and/or ceramic nanofibers.

37. The apparatus of any one of claims 33-36, wherein the structure of the layer of cushioning material comprises a planar layered structure, the clock oscillator is located on a first side of the layer of cushioning material, at least a portion of the substrate is located on a second side of the layer of cushioning material, the second side of the layer of cushioning material being opposite the first side of the layer of cushioning material.

38. The device of claim 37, wherein the substrate is a Flexible Printed Circuit (FPC), the FPC is U-shaped, a first portion of the FPC is located on a first side of the shock absorbing material layer, a second portion of the FPC is located on a second side of the shock absorbing material layer, and the first portion of the FPC is located between the clock oscillator and the shock absorbing material layer.

39. The device of claim 37 or 38, wherein the planar layered structure comprises a continuous planar layered structure, a planar grid-like layered structure, or a plurality of dot-like structures in the same plane.

40. The apparatus of any one of claims 33-36, wherein the structure of the layer of shock absorbing material comprises a curved laminar structure, and the layer of shock absorbing material fully surrounds or semi-surrounds the clock oscillator.

41. The apparatus of claim 40, wherein the curved layered structure comprises a continuous curved layered structure or a curved mesh layered structure.

42. The apparatus of any of claims 33-41, wherein the clock oscillator comprises a resonator and an Integrated Circuit (IC), and wherein the resonator is a crystal resonator or a semiconductor resonator.

43. The apparatus of any one of claims 33-42, further comprising a cover plate or a mold compound material, the cover plate or the mold compound material configured to vacuum encapsulate the clock oscillator.

44. The apparatus of any of claims 33-43, further comprising bonding wires for electrically connecting the clock oscillator and the substrate.

45. A method of making a device for obtaining a clock frequency, the method comprising:

disposing at least a portion of the layer of cushioning material between the clock oscillator and at least a portion of the substrate;

and integrally packaging the clock oscillator and the shock absorbing material layer to obtain the device.

46. The method of claim 45, wherein the layer of cushioning material comprises a micro-scale layered structure, a nano-scale three-dimensional mesh structure, or a polymeric material.

47. The method as recited in claim 46 wherein the nanoscale, three-dimensional network structure comprises nanofibers.

48. The method of claim 47, wherein the nanofibers comprise carbon nanofibers and/or ceramic nanofibers.

49. The method of any one of claims 45-48, wherein the structure of the layer of cushioning material comprises a planar layered structure, and wherein disposing at least a portion of the layer of cushioning material between the clock oscillator and at least a portion of the substrate comprises:

50. The method as claimed in claim 49, wherein the substrate is a flexible circuit board (FPC) having a U-shape, and wherein disposing at least a portion of the layer of shock absorbing material between the clock oscillator and at least a portion of the substrate comprises:

51. The method of claim 49 or 50, wherein the planar layered structure comprises a continuous planar layered structure, a planar web-format layered structure, or a plurality of dot-like structures in the same plane.

52. The method of any one of claims 45-51, wherein the structure of the layer of cushioning material comprises a curved laminar structure, and wherein disposing at least a portion of the layer of cushioning material between the clock oscillator and at least a portion of the substrate comprises:

53. The method of claim 52, wherein said curved layered structure comprises a continuously curved layered structure or a curved reticulated layered structure.

54. The method of any one of claims 45-53, wherein the clock oscillator comprises a resonator and an Integrated Circuit (IC), and wherein the resonator is a crystal resonator or a semiconductor resonator.

55. The method of any one of claims 45-54, wherein integrally encapsulating the clock oscillator and the layer of shock absorbing material comprises:

56. The method of any one of claims 45-55, further comprising:

57. A method of obtaining a clock frequency, wherein the clock frequency is obtained by an apparatus as claimed in any of claims 33 to 44.

58. A chip comprising the device of any one of claims 33-44.

59. An electronic device, characterized in that the electronic device comprises an apparatus according to any of claims 33-44.

60. The electronic device of claim 59, wherein the electronic device is a communication device or a network device.