CN214544255U - Symmetric reed for miniature resonator - Google Patents
Symmetric reed for miniature resonator Download PDFInfo
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- CN214544255U CN214544255U CN202120776993.7U CN202120776993U CN214544255U CN 214544255 U CN214544255 U CN 214544255U CN 202120776993 U CN202120776993 U CN 202120776993U CN 214544255 U CN214544255 U CN 214544255U
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- reed
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Abstract
The utility model discloses a miniature resonator is with symmetrical formula reed, including parcel mechanism, block mechanism and combined mechanism, its characterized in that: clamping mechanisms are arranged on two sides of the top end of the wrapping mechanism, and a combination mechanism is arranged at the middle end in the clamping mechanism; the engagement mechanism includes: mounting grooves; the buckle set up in the bottom middle part of mounting groove. This symmetrical formula reed for microresonator, the shell and the base of part adopt ceramic material, because pottery has heat source stability height, the comparatively even characteristics of heat-conduction, guarantee the equilibrium temperature of inside wafer, put into the inside of mounting groove with the wafer afterwards, can directly utilize the inside of the buckle embedding draw-in groove of mounting groove bottom both sides, the inside both sides of mounting groove are provided with the insulating pad of rubber material, under the impact that receives external force, insulating pad has good shock-absorbing function, the inside of mounting groove is provided with curved support, make the damage that the unexpected impact of the wafer that can step forward on the base brought.
Description
Technical Field
The utility model relates to a micro resonator technical field specifically is a micro resonator is with symmetrical formula reed.
Background
The resonator is a resonance element made by using the piezoelectric effect of a quartz crystal built therein, and is used together with a semiconductor device and a resistance-capacitance element to constitute a quartz crystal oscillator, which is an oscillator with high precision and high stability, widely used in various oscillation circuits of televisions, computers, automobiles, and the like, and used in communication systems for frequency generators, generating clock signals for data processing, and providing reference signals for specific systems.
The symmetrical reed for the miniature resonator on the market is under the action of external force when in use, so that the internal wafer is easy to vibrate, and the normal use of the device is further influenced.
Disclosure of Invention
An object of the utility model is to provide a miniature resonator is with symmetrical formula reed to the miniature resonator that provides in solving above-mentioned background art receives under the effect of external force with symmetrical formula reed in use, makes inside wafer receive vibrations easily, and then influences the device's the problem of normal use.
In order to achieve the above object, the utility model provides a following technical scheme: a symmetrical reed for a miniature resonator comprises a wrapping mechanism, clamping mechanisms and a combination mechanism, wherein the clamping mechanisms are arranged on two sides of the top end of the wrapping mechanism, and the combination mechanism is arranged at the middle end inside the clamping mechanisms;
the engagement mechanism includes:
mounting grooves;
the buckle is arranged in the middle of the bottom end of the mounting groove;
the clamping groove is arranged on the side of the buckle;
and the insulating gaskets are arranged on two sides of the top end of the mounting groove.
Preferably, closely laminate between insulating pad and the mounting groove, and insulating pad distributes along the vertical axis symmetry of mounting groove.
Preferably, the buckle passes through the mounting groove and constitutes the block structure with the draw-in groove, and matches each other between the outside dimension of buckle and the inside dimension of draw-in groove.
Preferably, the wrapping mechanism further comprises:
a base;
the shell is arranged on two sides of the top end of the base;
the bottom plate is arranged at the bottom end of the interior of the shell;
and the insulators are arranged on two sides of the middle end of the base.
Preferably, the shell is fixedly connected with the base, and the shell is wrapped.
Preferably, the combination mechanism further comprises:
a base;
the bracket is arranged on two sides of the bottom end of the base;
the wafer is arranged in the middle of the top end of the base;
the plating layers are arranged on two sides of the wafer;
the reed is arranged at the bottom of the wafer;
the conductive adhesive is arranged on two sides of the plating layer;
the top plate is arranged at the bottom of the reed;
and the lead is arranged at the bottom of the top plate.
Preferably, the brackets are distributed in a curve shape, and the brackets are arranged in a group.
Preferably, the reeds are mutually attached to the wafer, and the reeds are distributed in a U shape.
Compared with the prior art, the beneficial effects of the utility model are that: this symmetrical formula reed for microresonator, the shell and the base of part adopt ceramic material, because pottery has heat source stability height, the comparatively even characteristics of heat-conduction, guarantee the equilibrium temperature of inside wafer, when putting into the inside of mounting groove with the wafer afterwards, can directly utilize the inside of the buckle embedding draw-in groove of mounting groove bottom both sides, the inside both sides of mounting groove are provided with the insulating pad of rubber material, under the impact that receives external force, insulating pad has good shock-absorbing function, the inside of mounting groove is provided with the support of curve form, make the damage that the unexpected impact of buffering that wafer on the base can be further brought.
Closely laminate between insulating pad and the mounting groove, the inside both sides of mounting groove are provided with insulating pad, because insulating pad adopts the rubber material, under the impact that receives external force, insulating pad has good shock-absorbing function, can effectually reduce the damage degree of inside wafer, has improved the protective capacities of wafer.
The support is the curve and distributes, is the curve through the support and distributes for the damage that the unexpected impact of buffering that wafer on the base can further brought, and the support sets up to a set of, can effectively ensure the focus stability of base, also improves holistic shock resistance and shock resistance simultaneously.
Laminating each other between reed and the wafer, and the reed is the U shape and distributes, through laminating each other between them, reed and wafer direct contact have the effect of support and interconnecting link, and the reed is the U shape, can effectual reduction external force to the influence of crystal vibrations, also reduced the influence to working circuit simultaneously.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic view of the three-dimensional structure of the reed of the present invention;
fig. 3 is a schematic view of a part of an enlarged structure at a in fig. 1 according to the present invention.
In the figure: 1. a wrapping mechanism; 101. a base; 102. a housing; 103. a base plate; 104. an insulator; 2. a clamping mechanism; 201. mounting grooves; 202. buckling; 203. a card slot; 204. an insulating spacer; 3. a combination mechanism; 301. a base; 302. a support; 303. a wafer; 304. plating; 305. a reed; 306. a conductive adhesive; 307. a top plate; 308. and (7) leading wires.
Detailed Description
Referring to fig. 1-3, the present invention provides a technical solution: a symmetrical reed for a miniature resonator comprises a packaging mechanism 1, clamping mechanisms 2 and a combination mechanism 3, wherein the clamping mechanisms 2 are arranged on two sides of the top end of the packaging mechanism 1, and the combination mechanism 3 is arranged at the middle end in the clamping mechanisms 2;
the engaging mechanism 2 includes:
a mounting groove 201;
the buckle 202 is arranged in the middle of the bottom end of the mounting groove 201;
a card slot 203 arranged at the side of the buckle 202;
and the insulating gaskets 204 are arranged on two sides of the top end of the mounting groove 201.
Closely laminate between insulating washer 204 and the mounting groove 201, and insulating washer 204 is along the vertical axis symmetric distribution of mounting groove 201, and the inside both sides of mounting groove 201 are provided with insulating washer 204, because insulating washer 204 adopts the rubber material, under the impact that receives external force, insulating washer 204 has good shock-absorbing function, can effectually reduce the damage degree of inside wafer 303, has improved wafer 303's protective capacities.
Buckle 202 passes through mounting groove 201 and draw-in groove 203 and constitutes the block structure, and match each other between the external dimension of buckle 202 and the internal dimension of draw-in groove 203, when the user puts into the inside of mounting groove 201 with wafer 303, can be directly with the inside of buckle 202 embedding draw-in groove 203 of mounting groove 201 bottom both sides, also guaranteed its mounting groove 201 steadiness on bottom plate 103 as far as when reaching spacing effect, match each other between the external dimension of buckle 202 and the internal dimension of draw-in groove 203 simultaneously, buckle 202 is placed when the inside of draw-in groove 203, can be effectual when the guarantee is firm, effectual fixed action has been played, reduce the danger coefficient to follow-up produced of use.
The wrapping mechanism 1 further includes:
a base 101;
a housing 102 disposed at both sides of the top end of the base 101;
a bottom plate 103 disposed at the inner bottom end of the housing 102;
and insulators 104 disposed at both sides of the middle end of the base 101.
For fixed connection between shell 102 and the base 101, and shell 102 is the parcel form, and the shell 102 and the base 101 of part adopt ceramic material, and the shell 102 of parcel form is favorable to improving inside stability, because pottery has the heat source stability height, the comparatively even characteristics of heat-conduction, ensures the equilibrium temperature of inside wafer 303, prevents that wafer 303 from producing the great phenomenon of vibration frequency when using.
The combining mechanism 3 further includes:
a base 301;
the brackets 302 are arranged on two sides of the bottom end of the base 301;
a wafer 303 disposed at the middle of the top end of the susceptor 301;
plating layers 304 disposed on both sides of the wafer 303;
a reed 305 disposed on the bottom of the wafer 303;
conductive adhesive 306 disposed on both sides of the plating layer 304;
a top plate 307 provided at the bottom of the reed 305;
and a lead 308 provided at the bottom of the top plate 307.
Laminating each other between reed 305 and the wafer 303, and reed 305 is the U shape and distributes, through laminating each other between them, reed 305 and wafer 303 direct contact have the effect of support and interconnecting link, and reed 305 is the U shape, can effectual reduction external force to the influence of wafer 303 vibrations, has also reduced the influence to working circuit simultaneously.
The working principle is as follows: for the symmetrical reed for the micro-resonator, firstly, the shell 102 and the base 101 of the part are made of ceramic materials, the wrapped shell 102 is beneficial to improving the internal stability, the ceramic has the characteristics of high heat source stability and uniform heat conduction, the balanced temperature of the internal wafer 303 is ensured, when the wafer 303 is placed in the mounting groove 201, the buckles 202 on the two sides of the bottom end of the mounting groove 201 can be directly embedded into the clamping grooves 203, the stability of the mounting groove 201 on the bottom plate 103 is ensured as much as possible while the limiting effect is achieved, meanwhile, the insulating gaskets 204 are arranged on the two sides of the inside of the mounting groove 201, the insulating gaskets 204 are made of rubber materials, under the impact of external force, the insulating gaskets 204 have good shock absorption function, the damage degree of the internal wafer 303 can be effectively reduced, the support 302 is arranged in the mounting groove 201, meanwhile, the support 302 is distributed in a curve shape, so that the wafer 303 on the base 301 can further buffer damage caused by accidental impact, and the reed 305 is directly contacted with the wafer 303 due to the mutual adhesion between the wafer 303 and the reed 305, so that the support has the functions of supporting and connecting circuits.
Claims (8)
1. The utility model provides a symmetry formula reed for miniature resonator, includes parcel mechanism, block mechanism and combined mechanism, its characterized in that: clamping mechanisms are arranged on two sides of the top end of the wrapping mechanism, and a combination mechanism is arranged at the middle end in the clamping mechanism;
the engagement mechanism includes:
mounting grooves;
the buckle is arranged in the middle of the bottom end of the mounting groove;
the clamping groove is arranged on the side of the buckle;
and the insulating gaskets are arranged on two sides of the top end of the mounting groove.
2. The symmetrical reed for the microresonator of claim 1, wherein: closely laminate between insulating pad and the mounting groove, and insulating pad is along the vertical axis symmetric distribution of mounting groove.
3. The symmetrical reed for the microresonator of claim 1, wherein: the buckle passes through the mounting groove and constitutes the block structure with the draw-in groove, and matches each other between the outside dimension of buckle and the inside dimension of draw-in groove.
4. The symmetrical reed for the microresonator of claim 1, wherein: the wrapping mechanism further comprises:
a base;
the shell is arranged on two sides of the top end of the base;
the bottom plate is arranged at the bottom end of the interior of the shell;
and the insulators are arranged on two sides of the middle end of the base.
5. The symmetrical reed for the microresonator of claim 4, wherein: the shell is fixedly connected with the base, and the shell is wrapped.
6. The symmetrical reed for the microresonator of claim 1, wherein: the combination mechanism further comprises:
a base;
the bracket is arranged on two sides of the bottom end of the base;
the wafer is arranged in the middle of the top end of the base;
the plating layers are arranged on two sides of the wafer;
the reed is arranged at the bottom of the wafer;
the conductive adhesive is arranged on two sides of the plating layer;
the top plate is arranged at the bottom of the reed;
and the lead is arranged at the bottom of the top plate.
7. The symmetrical reed for the microresonator of claim 6, wherein: the supports are distributed in a curve shape and are arranged into a group.
8. The symmetrical reed for the microresonator of claim 6, wherein: the reeds are mutually attached to the wafer and distributed in a U shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120776993.7U CN214544255U (en) | 2021-04-16 | 2021-04-16 | Symmetric reed for miniature resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120776993.7U CN214544255U (en) | 2021-04-16 | 2021-04-16 | Symmetric reed for miniature resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214544255U true CN214544255U (en) | 2021-10-29 |
Family
ID=78275291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120776993.7U Active CN214544255U (en) | 2021-04-16 | 2021-04-16 | Symmetric reed for miniature resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214544255U (en) |
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2021
- 2021-04-16 CN CN202120776993.7U patent/CN214544255U/en active Active
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