CN210196351U - Shock-absorbing structure for crystal oscillator - Google Patents
Shock-absorbing structure for crystal oscillator Download PDFInfo
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- CN210196351U CN210196351U CN201921059248.XU CN201921059248U CN210196351U CN 210196351 U CN210196351 U CN 210196351U CN 201921059248 U CN201921059248 U CN 201921059248U CN 210196351 U CN210196351 U CN 210196351U
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Abstract
The utility model relates to a crystal oscillator technical field discloses a shock-absorbing structure for crystal oscillator, crystal oscillator fixed connection is on the circuit board, shock-absorbing structure includes the base and fixes the elasticity damper on the base, fixed connection can be dismantled on elasticity damper to the circuit board, elasticity damper can absorb external shock for example strong vibration, strong impact, fall the vibration energy that etc. produced, reduce the mechanical resonance that the inside wafer of crystal oscillator produced because of external force by a wide margin, and then reduce the condition that crystal oscillator's phase noise worsens, promote communication quality and reliability in the use under the dynamic environment.
Description
Technical Field
The utility model relates to a crystal oscillator technical field, more specifically say, it relates to a shock-absorbing structure for crystal oscillator.
Background
The crystal oscillator is a key component of electronic equipment, and is generally used as a reference source of time or frequency in equipment such as communication, electronics, aerospace, instruments and meters due to good technical indexes such as frequency stability and phase noise, and is called as the heart of the electronic equipment.
The quartz resonator is used as a core element of the crystal oscillator, the working principle of the quartz resonator is the inverse piezoelectric effect of quartz, when alternating current is applied to two sides of a quartz wafer, the quartz resonator can generate a mechanical resonance phenomenon, and if the resonance frequency is just near the resonance frequency point of the quartz wafer, the alternating current frequency transmitted from electrodes on two sides of the wafer is the frequency point. Generally, the higher the frequency point is, the thinner the quartz slice thickness is, and as the performance of electronic equipment is improved, the accuracy of the output frequency of the crystal oscillator is often decisive for the performance of the equipment. However, a simple crystal oscillator cannot be used, and a corresponding peripheral circuit is required to implement the application function. Therefore, in production, the crystal oscillator (10) is generally fixed on a prefabricated circuit board (20) through welding points to form a complete machine so as to realize the predetermined function.
However, when the crystal oscillator is subjected to external action to generate a large acceleration, such as strong vibration, strong impact, falling, etc., additional mechanical resonance is brought, which is partially called interference, and the interference is loaded into a signal generated by the crystal oscillator to cause deterioration of phase noise, frequency stability, etc., the phase noise can reflect short-term stability of the frequency signal, and for vehicle-mounted and vehicle-mounted environments requiring communication in the mobile, the deterioration of the phase noise can cause deterioration of signal quality and stability, and in severe cases, data packet drop, error code, even communication incapability, etc. in the communication can be caused. Furthermore, the strong mechanical resonance may cause irreversible damage to the quartz wafer and the support, which may cause serious consequences such as malfunction of the crystal oscillator.
SUMMERY OF THE UTILITY MODEL
To the above problem, an object of the utility model is to provide a crystal oscillator uses shock-absorbing structure, it has the shock attenuation effectual, reduces crystal oscillator's phase noise and worsens, can realize the advantage of protection to crystal oscillator.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:
the utility model provides a crystal oscillator is with shock-absorbing structure, crystal oscillator fixed connection is on the circuit board, shock-absorbing structure includes the base and fixes elasticity damper on the base, the circuit board can be dismantled fixed connection and be in on the elasticity damper.
Through above-mentioned technical scheme, the elastic shock-absorbing component can absorb the vibration energy that external shock produced such as strong vibration, strong impact, fall etc. reduces the mechanical resonance that crystal oscillator inside wafer produced because of external force by a wide margin, and then reduces the condition that crystal oscillator's phase noise worsens, promotes communication quality and reliability in the use under the dynamic environment.
The utility model discloses further set up to: clamping holes are formed in the corners of the circuit board, and limiting parts penetrate through the clamping holes;
the elastic shock absorption assembly comprises a plurality of energy absorption elastic pieces detachably fixed on the base, limiting holes matched with the clamping holes are formed in one ends, far away from the base, of the energy absorption elastic pieces, and first mounting pieces are arranged in the limiting holes;
the limiting piece and the first mounting piece are detachably fixed and then tightly abut the upper circuit board and the energy-absorbing elastic piece.
Through the technical scheme, the limiting part tightly supports and fixes the circuit board on the energy-absorbing elastic part, so that the vibration energy received by the circuit board can be stably transmitted to the energy-absorbing elastic part and well absorbed, and the adverse effect brought by the vibration energy is reduced.
The utility model discloses further set up to: the energy-absorbing elastic piece comprises a first shock absorption block, a second shock absorption block and a third shock absorption block;
one end of the first damping block is fixedly connected with the second damping block in an L-shaped integrally formed mode, and the third damping block is fixedly connected with the joint of the first damping block and the second damping block in an integrally formed mode;
the limiting hole is formed in one surface, far away from the base, of the third damping block;
positioning holes are formed in the surfaces, close to the base, of the first damping block and the second damping block, a plurality of fixing holes matched with the positioning holes are formed in the surface, far away from the energy-absorbing elastic piece, of the base, and positioning pieces penetrate through the fixing holes;
all be provided with the second installed part in the locating hole, the setting element with the second installed part can be dismantled fixed back will the base with first snubber block and the second snubber block is close to the one side of base supports tightly.
Through above-mentioned technical scheme, the setting element can be with first snubber block and the stable fixing on the base of second snubber block, when energy-absorbing elastic component need be changed, convenient dismantlement and change.
The utility model discloses further set up to: and a buffer space is reserved between the third damping block and the base.
Through above-mentioned technical scheme, the elastic deformation space of third snubber block has been promoted in the buffering space, can absorb bigger vibration energy, and the shock attenuation effect is better.
The utility model discloses further set up to: one side of the third damping block, which is far away from the base, is fixedly connected with a limiting lug in an integrated forming mode, and one side, which is close to the circuit board, of the limiting lug is tightly abutted to the circuit board.
Through above-mentioned technical scheme, can both play good shock attenuation effect in three-dimensional direction to external vibration can play the cushioning effect and reduce the relative displacement that energy-absorbing elastic component produced because of deformation and circuit board when producing horizontal shearing force to energy-absorbing elastic component.
The utility model discloses further set up to: and operation empty grooves are formed in the ends, far away from each other, of the first damping block and the second damping block, so that an operation space is formed between the adjacent energy-absorbing elastic pieces.
Through above-mentioned technical scheme, make things convenient for the staff to pick up the circuit board to inwards observe from operating space.
The utility model discloses further set up to: the first installation part and the second installation part are both knurled nuts, and the limiting part and the positioning part are both screw fixing parts.
Through above-mentioned technical scheme, screw mounting and knurled nut's cooperation convenient to use, the arch of knurled nut surface can be fine moreover fixed with the energy-absorbing elastic component, stability is strong.
The utility model discloses further set up to: a first buffer arc surface and a second buffer arc surface are respectively arranged on the first shock absorption block and the second shock absorption block;
a third buffer arc is arranged at the joint of the third damping block and the first damping block, and a fourth buffer arc surface is arranged at the joint of the third damping block and the second damping block;
and a fifth buffer arc surface is formed on one side, close to the joint of the first damping block and the second damping block, of the third damping block.
Through the technical scheme, the transverse shearing force generated for the energy-absorbing elastic part in different vibration directions can be reduced, the shock absorption can be realized, the energy-absorbing elastic part can be protected, and the abrasion can be reduced.
The utility model discloses further set up to: and the first damping block, the second damping block and the third damping block are internally provided with damping cavities.
Through the technical scheme, when external force of the same size is faced, the damping cavity can improve the elastic deformation of the energy-absorbing elastic piece, and the damping effect is improved.
Compared with the prior art, the beneficial effects of the utility model are that:
the vibration energy generated by external impact such as strong vibration, strong impact, falling and the like can be absorbed through the elastic shock absorption assembly, the mechanical resonance of the crystal oscillator inner wafer caused by external force is greatly reduced, the phase noise deterioration condition of the crystal oscillator is further reduced, and the communication quality and reliability in the use process under the dynamic environment are improved.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a crystal oscillator and a circuit board in the prior art;
fig. 2 is a schematic overall structure diagram of a first embodiment of the present invention;
fig. 3 is a schematic view of an elastic damping assembly according to a first embodiment of the present invention (omitting a crystal oscillator and a circuit board);
fig. 4 is a cross-sectional view of a first embodiment of the present invention;
FIG. 5 is an enlarged view of portion A of FIG. 4;
fig. 6 is a bottom schematic view of the first embodiment of the present invention (the base is omitted);
fig. 7 is a sectional view of a second embodiment of the present invention.
Reference numerals: 1. a base; 11. a fixing hole; 12. a positioning member; 2. an elastic shock-absorbing member; 21. an energy-absorbing elastic member; 211. a first damper block; 212. a second damper block; 213. a third damper block; 214. a limiting hole; 215. a first mounting member; 216. positioning holes; 217. a second mount; 218. a limiting bump; 219. operating an empty groove; 22. a shock-absorbing cavity; 10. a crystal oscillator; 20. a circuit board; 30. a position clamping hole; 40. a limiting member; 01. a first buffer arc surface; 02. a second buffer arc surface; 03. a third buffer arc surface; 04. a fourth buffer arc surface; 05. and a fifth buffer cambered surface.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
Example one
A shock-absorbing structure for a crystal oscillator 10 is shown in fig. 1 and 2, and comprises a base 1 and an elastic shock-absorbing assembly 2, wherein the elastic shock-absorbing assembly 2 comprises four energy-absorbing elastic members 21 detachably fixed on the base 1. The crystal oscillator 10 is welded on the circuit board 20 in a spot welding mode, the circuit board 20 is detachably and fixedly connected to the elastic damping component 2, and the energy-absorbing elastic part 21 can absorb external vibration energy to reduce the vibration influence on the crystal oscillator 10.
The energy-absorbing elastic part 21 can be made of rubber and has good elastic property, the damping coefficient of the energy-absorbing elastic part can be properly adjusted according to the proportion, the vibration energy brought by the external environment can be absorbed, the silicon rubber can be selected, and 40-60% of the rubber filling degree proportion can be selected for achieving a good damping effect.
Wherein each energy-absorbing elastic member 21 comprises a first shock-absorbing mass 211, a second shock-absorbing mass 212 and a third shock-absorbing mass 213, as shown in figure 3. One end of the first damping block 211 and the second damping block 212 are fixedly connected in an L-shaped integrated manner, and are perpendicular to each other, and the third damping block 213 is fixedly connected at the joint of the first damping block 211 and the second damping block 212 in an integrated manner.
Positioning holes 216 (see fig. 6) have been all seted up to the one side that first snubber block 211 and second snubber block 212 are close to base 1, a plurality of fixed orificess 11 that match with positioning holes 216 have been seted up to the one side that base 1 keeps away from energy-absorbing elastic member 21, all wear to be equipped with setting element 12 in the fixed orifices 11, all be fixed with second installed part 217 in the positioning hole 216 (see fig. 6), setting element 12 can dismantle with second installed part 217 and can support base 1 and first snubber block 211 and the one side that second snubber block 212 is close to base 1 after fixed tightly.
Referring to fig. 4 and 5, the circuit board 20 has clamping holes 30 formed at corners, limiting members 40 penetrate through the clamping holes 30, limiting holes 214 matched with the clamping holes 30 are formed in the surfaces of the third damping blocks 213 away from the base 1, first mounting members 215 are fixed in the limiting holes 214, and the upper circuit board 20 and the energy-absorbing elastic members 21 are abutted tightly after the limiting members 40 and the first mounting members 215 are detachably fixed.
Therefore, the energy-absorbing elastic member 21 can absorb the vibration energy of the crystal oscillator 10 caused by strong vibration, strong impact, falling, etc., thereby greatly reducing the mechanical resonance of the internal wafer of the crystal oscillator 10 caused by external force, further reducing the phase noise deterioration of the crystal oscillator 10, and improving the communication quality and reliability in the use process under dynamic environment. Moreover, four energy-absorbing elastic pieces 21 are respectively arranged at four corners of the base 1 and are arranged in a centrosymmetric manner, so that the crystal oscillator 10 can be supported in a balanced manner, and the crystal oscillator 10 can be better stabilized during vibration in different dimensions, thereby being beneficial to improving the acceleration resistance sensitivity of the crystal oscillator 10.
Moreover, as shown in fig. 3 and 4, the first damping block 211 and the second damping block 212 are respectively provided with a first buffering arc surface 01 and a second buffering arc surface 02; a third buffer arc 03 is arranged at the joint of the third damping block 213 and the first damping block 211, and a fourth buffer arc surface 04 is arranged at the joint of the third damping block 213 and the second damping block 212; the fifth buffering cambered surface 05 is arranged on one side, close to the joint of the first damping block 211 and the second damping block 212, of the third damping block 213, so that transverse shearing force generated for the energy-absorbing elastic part 2 in different vibration directions can be reduced, the damping effect can be realized, the energy-absorbing elastic part 2 can be protected, and the abrasion can be reduced.
As shown in fig. 3 and 6, the first mounting member 215 (see fig. 5) and the second mounting member 217 may be knurled nuts, and the limiting member 40 and the positioning member 12 may be screw-fixed members matching with the knurled nuts. The screw fixing piece is convenient to use in cooperation with the knurled nut, the knurled nut can be fixed to the energy-absorbing elastic piece 21 in an injection molding mode, the protrusion on the outer surface of the knurled nut can be well fixed to the energy-absorbing elastic piece 21, stability is high, and the knurled nut is convenient to detach and replace when the energy-absorbing elastic piece 21 needs to be replaced.
As shown in fig. 3 and 6, a buffer space is left between the third damping block 213 and the base 1, so that the elastic deformation space of the third damping block 213 can be increased, larger vibration energy can be absorbed, and the damping effect is better. And, a limit bump 218 is integrally formed and fixedly connected to one surface of the third damper block 213 away from the base 1, and one surface of the limit bump 218 close to the circuit board 20 abuts against the circuit board 20. Can both play good shock attenuation effect in the three-dimensional direction to external vibration can play the cushioning effect and reduce the relative displacement that energy-absorbing elastic component 21 produced because of deformation and circuit board 20 when inhaling the horizontal shearing force that energy-absorbing elastic component 21 produced, reduces wearing and tearing.
As shown in fig. 3, an operation slot 219 is formed at each end of the first damping block 211 and the second damping block 212, which are far away from each other, so that an operation space is formed between the adjacent energy-absorbing elastic members 21, and the circuit board 20 can be conveniently taken up by a worker and can be inwardly observed from the operation space.
Example two
A damping structure for a crystal oscillator 10, which is different from the first embodiment in that, as shown in fig. 7, damping cavities 22 are formed in a first damping block 211, a second damping block 212 and a third damping block 213. When the same external force is applied, the damping cavity 22 can increase the elastic deformation of the energy-absorbing elastic member 21, thereby increasing the damping effect.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. The utility model provides a shock-absorbing structure for crystal oscillator, crystal oscillator (10) fixed connection is on circuit board (20), its characterized in that, shock-absorbing structure includes base (1) and fixes elasticity damper (2) on base (1), fixed connection can be dismantled in circuit board (20) on elasticity damper (2).
2. The shock-absorbing structure for the crystal oscillator according to claim 1, wherein the circuit board (20) is provided with a clamping hole (30) at each corner, and a limiting member (40) is arranged in each clamping hole (30) in a penetrating manner;
the elastic shock absorption assembly (2) comprises a plurality of energy absorption elastic pieces (21) detachably fixed on the base (1), limiting holes (214) matched with the clamping holes (30) are formed in one ends, far away from the base (1), of the energy absorption elastic pieces (21), and first mounting pieces (215) are arranged in the limiting holes (214);
the limiting piece (40) and the first mounting piece (215) are detachably fixed, and then the upper circuit board (20) and the energy-absorbing elastic piece (21) are abutted tightly.
3. The shock-absorbing structure for a crystal oscillator according to claim 2, wherein said energy-absorbing elastic member (21) comprises a first shock-absorbing block (211), a second shock-absorbing block (212), and a third shock-absorbing block (213);
one end of the first damping block (211) is fixedly connected with the second damping block (212) in an L-shaped integrally-formed mode, and the third damping block (213) is fixedly connected to the connection position of the first damping block (211) and the second damping block (212) in an integrally-formed mode;
the limiting hole (214) is formed in one surface, far away from the base (1), of the third damping block (213);
positioning holes (216) are formed in the surfaces, close to the base (1), of the first damping block (211) and the second damping block (212), a plurality of fixing holes (11) matched with the positioning holes (216) are formed in the surface, far away from the energy-absorbing elastic piece (21), of the base (1), and positioning pieces (12) penetrate through the fixing holes (11);
all be provided with second installed part (217) in locating hole (216), setting element (12) with second installed part (217) can be dismantled fixed back with base (1) with first snubber block (211) and second snubber block (212) are close to the one side of base (1) supports tightly.
4. The vibration damping structure for a crystal oscillator according to claim 3, wherein a buffer space is left between the third vibration damping block (213) and the base (1).
5. The shock-absorbing structure for the crystal oscillator according to claim 4, wherein a limit bump (218) is fixedly connected to one surface of the third shock-absorbing block (213) far away from the base (1) in an integrally molded manner, and one surface of the limit bump (218) near the circuit board (20) abuts against the circuit board (20).
6. The shock-absorbing structure for the crystal oscillator according to claim 3, wherein an operation recess (219) is formed at each end of the first shock-absorbing block (211) and the second shock-absorbing block (212) away from each other, so that an operation space is formed between the adjacent energy-absorbing elastic members (21).
7. The vibration damping structure for a crystal oscillator according to claim 3, wherein said first mounting member (215) and said second mounting member (217) are both knurled nuts, and said retaining member (40) and said positioning member (12) are both screw fasteners.
8. The shock absorption structure for the crystal oscillator according to claim 3, wherein the first shock absorption block (211) and the second shock absorption block (212) are respectively provided with a first buffering arc surface (01) and a second buffering arc surface (02);
a third buffer arc (03) is arranged at the joint of the third shock absorption block (213) and the first shock absorption block (211), and a fourth buffer arc surface (04) is arranged at the joint of the third shock absorption block (213) and the second shock absorption block (212);
and a fifth buffer arc surface (05) is formed on one side, close to the joint of the first damping block (211) and the second damping block (212), of the third damping block (213).
9. The vibration-damping structure for the crystal oscillator according to claim 3, wherein the first vibration-damping block (211), the second vibration-damping block (212) and the third vibration-damping block (213) are each provided with a vibration-damping cavity (22) therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921059248.XU CN210196351U (en) | 2019-07-05 | 2019-07-05 | Shock-absorbing structure for crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921059248.XU CN210196351U (en) | 2019-07-05 | 2019-07-05 | Shock-absorbing structure for crystal oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210196351U true CN210196351U (en) | 2020-03-27 |
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ID=69869195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921059248.XU Active CN210196351U (en) | 2019-07-05 | 2019-07-05 | Shock-absorbing structure for crystal oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210196351U (en) |
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2019
- 2019-07-05 CN CN201921059248.XU patent/CN210196351U/en active Active
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