CN114574701B - Recovery and extraction device and method for metal in circuit board - Google Patents
Recovery and extraction device and method for metal in circuit board Download PDFInfo
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- CN114574701B CN114574701B CN202210175839.3A CN202210175839A CN114574701B CN 114574701 B CN114574701 B CN 114574701B CN 202210175839 A CN202210175839 A CN 202210175839A CN 114574701 B CN114574701 B CN 114574701B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B1/00—Preliminary treatment of ores or scrap
- C22B1/005—Preliminary treatment of scrap
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/02—Obtaining noble metals by dry processes
- C22B11/021—Recovery of noble metals from waste materials
- C22B11/025—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper, or baths
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
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Abstract
The invention discloses a device and a method for recovering and extracting metal in a circuit board, wherein the method comprises the following steps: grinding the circuit board into circuit board powder, then adding carbon black powder, and uniformly mixing to obtain mixed powder; and (3) carrying out flash evaporation on the mixed powder for 0.8-1.2s under the condition of the Joule heat of 3000-3500K, and condensing the gas after flash evaporation to obtain solid, namely the recovered and extracted metal. The device and the method for recovering and extracting the metal in the circuit board have high recovery efficiency, remarkably improve the recovery rate of the precious metals Au and Ag compared with the traditional hydrometallurgy and pyrometallurgy, are convenient to operate, consume less energy and save time.
Description
Technical Field
The invention relates to the technical field of metal recovery, in particular to a device and a method for recovering and extracting metal in a circuit board.
Background
The process of recovering precious metals from electronic waste, called urban mining, is very important to the national recycling economy. At present, the main metal recovery methods comprise pyrometallurgy and hydrometallurgy, wherein the pyrometallurgy lacks selectivity, generates toxic smog, and the hydrometallurgy has strong selectivity, but has slow leaching rate and generates a large amount of waste liquid.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a device and a method for recovering and extracting metals from a circuit board, so as to solve the problems of slow leaching process and environmental pollution of the existing metal recovery method.
The technical scheme for solving the technical problems is as follows: the method for recovering and extracting the metal in the circuit board comprises the following steps:
(1) Grinding the circuit board into circuit board powder, then adding carbon black powder, and uniformly mixing to obtain mixed powder;
(2) And (3) carrying out flash evaporation on the mixed powder for 0.8-1.2s under the condition of the Joule heat of 3000-3500K, and condensing the gas after flash evaporation to obtain solid, namely the recovered and extracted metal.
The invention has the beneficial effects that: the carbon black powder can improve the electrical conductivity of the circuit board powder, and in a short time of about 1s, when very high sub-second pulse current passes through the precursor, joule heat can be generated, so that the mixed powder can reach the ultrahigh temperature of about 3400K instantly, at the temperature, most metals can be evaporated into gas due to the high vapor pressure difference between the metals and matrix materials (carbon, ceramic and glass), and the gas is condensed into solid, so that the effect of metal separation is achieved.
On the basis of the technical scheme, the invention can be further improved as follows:
further, the circuit board powder in the step (1) is added with an additive to form mixed powder, wherein the additive is NaCl, naI, naF, PTEE, CPVC or a mixture of NaCl and at least one of NaI and NaF.
The beneficial effects of adopting the further technical scheme are as follows: the additive can generate chemical reaction with metal in the circuit board, and the vapor pressure of the formed metal halide is much higher than that of a metal simple substance, so that the recovery rate of the metal can be improved, the recovery rate of Rh, pd and Ag with high content in the circuit board can be improved to about 90% by using the halide additive, and the recovery rate of Au can be improved to 89.8%. In addition, toxic heavy metals including Cd, hg, as, pb and Cr can be removed and collected, and the health risk and the environmental impact of the recovery process are reduced to the maximum extent.
Further, the mass ratio of the circuit board powder to the carbon black powder to the additive is 1:1.5-2.5:2.5-3.5.
Further, the mass ratio of the circuit board powder, the carbon black powder and the additive is 1:2:3.
the invention also provides a device for recovering the metal by adopting the method for recovering and extracting the metal in the circuit board, which comprises a capacitor discharging assembly, a flash evaporation cavity and a gas condensing assembly; the capacitor discharging assembly comprises a capacitor, a millisecond switch, a solid electrode and a hollow electrode, the capacitor is respectively connected with the solid electrode and the hollow electrode, and the millisecond switch is arranged between the capacitor and the solid electrode; one end of the flash evaporation cavity is connected with the solid electrode, a porous copper electrode is arranged inside the other end of the flash evaporation cavity, and the porous copper electrode is connected with the hollow electrode; the hollow electrode is provided with a recovery pipeline and is connected with the gas condensation component through the recovery pipeline.
The beneficial effects of the invention are as follows: discharge through the condenser subassembly that discharges, utilize the millisecond switch to control discharge time, when discharge time control is about 1s, flash chamber intracavity circuit board powder can bear a higher voltage in the short time, including circuit board powder resistance is less, so can produce a very big electric current, the joule heat that this electric current produced, can make circuit board powder reach temperature about 3400K in the twinkling of an eye, consequently most of metals are with the form of steam, through porous copper electrode, hollow electrode and recovery tube volatilize, porous copper electrode can make steam volatilize on the one hand, on the other hand porous copper electrode can fix flash chamber intracavity circuit board powder, prevent that the powder from revealing, steam volatilized after passing through gas condensation subassembly condensation, can become metal solid and stay in the cold trap, and what left in the flash chamber is the residue after circuit board powder metal retrieves and draws.
On the basis of the technical scheme, the invention can be further improved as follows:
furthermore, the solid electrode and the hollow electrode are made of copper.
Further, a graphite electrode is arranged inside one end, close to the solid electrode, of the flash evaporation cavity, the graphite electrode is connected with the solid electrode, a first O-shaped ring is sleeved on the solid electrode, and the first O-shaped ring is connected with the flash evaporation cavity in a sealing mode; the hollow electrode is sleeved with a second O-shaped ring, and the second O-shaped ring is hermetically connected with the flash evaporation cavity.
The beneficial effect of adopting the further technical scheme is as follows: the graphite electrode is arranged in the flash evaporation cavity, so that the air tightness of the flash evaporation cavity is better, and the first O-shaped ring and the second O-shaped ring can further improve the air tightness of the flash evaporation cavity.
Further, the top of the flash evaporation cavity is provided with a feed inlet, a feed baffle is movably arranged between the feed inlet and the flash evaporation cavity, the bottom of the flash evaporation cavity is provided with a discharge outlet, and a discharge baffle is movably arranged between the discharge outlet and the flash evaporation cavity.
The beneficial effect of adopting the further technical scheme is as follows: when taking feeding baffle out, feed inlet and flash distillation chamber intercommunication can add the flash distillation intracavity with circuit board powder through the feed inlet, then insert feeding baffle again and carry out the flash distillation, and after the flash distillation, take discharge baffle out, and at this moment, the surplus residue accessible discharge gate after the flash distillation is got rid of, so can be convenient for feed and the ejection of compact, convenient and fast.
Furthermore, the material of feeding baffle and discharge baffle is glass.
Further, the recycling pipeline is provided with a vacuumizing assembly.
The beneficial effects of adopting the further technical scheme are as follows: the vacuum pumping assembly is used for vacuumizing the recovery pipeline, so that the flow rate of the metal steam can be improved, the condensation residue of the metal steam in the recovery pipeline is reduced, and the recovery efficiency of the metal is improved.
Furthermore, the vacuumizing assembly comprises a vacuum pump, a first air valve and a second air valve, the vacuum pump is connected with the recovery pipeline, the first air valve is arranged between the vacuum pump and the recovery pipeline, the second air valve is arranged on the recovery pipeline, the second air valve is close to the hollow electrode, the vacuumizing assembly further comprises a barometer, and the barometer is arranged on the recovery pipeline.
Further, the gas condensation component comprises a collecting bottle and a liquid nitrogen bottle, the collecting bottle is connected with the recovery pipeline in a sealing mode, and the collecting bottle is arranged in the liquid nitrogen bottle.
The beneficial effects of adopting the further technical scheme are as follows: the liquid nitrogen can be used for condensing the metal vapor into a solid state for collection, and the operation is convenient and fast.
Further, the millisecond switch comprises an electromagnetic relay, a first direct-current power supply, a thyristor and a signal generator, one end of the electromagnetic relay is connected with the first direct-current power supply, the other end of the electromagnetic relay is connected with the thyristor, and the thyristor and the signal generator are electrically connected.
The beneficial effect of adopting the further technical scheme is as follows: the waveform emitted by the signal generator is a square wave, the time of flash evaporation can be controlled by setting the duty ratio of the square wave, and the square wave can trigger the on and off of the thyristor, so that the on and off of the electromagnetic relay are controlled, the on and off of the whole capacitor discharging assembly is controlled, and the flash evaporation is realized.
Further, the number of the capacitors is at least 1, and when the number of the capacitors exceeds 1, the capacitors are arranged in parallel.
The beneficial effects of adopting the further technical scheme are as follows: the plurality of capacitors are connected in parallel, so that the total capacitance of the whole capacitor can be improved, and the flash evaporation cavity can reach higher flash evaporation temperature.
Further, be provided with the subassembly that charges on the condenser, the subassembly that charges includes second DC power supply, switch and resistance, second DC power supply and condenser electric connection, switch and resistance are located between second DC power supply and the condenser.
The beneficial effects of adopting the further technical scheme are as follows: the charging component is used for charging the capacitor.
The invention has the following beneficial effects: the device and the method for recovering and extracting the metal in the circuit board have high recovery efficiency, remarkably improve the recovery rate of precious metals such as Au, ag and the like compared with the traditional hydrometallurgy and pyrometallurgy, have convenient operation and small energy consumption, and save a large amount of time and energy.
Drawings
FIG. 1 is a schematic view of a device for recovering and extracting metals from a circuit board according to the present invention.
Wherein, 1, flash evaporation cavity; 2. a capacitor; 3. a solid electrode; 4. a hollow electrode; 5. a porous copper electrode; 6. a recovery pipeline; 7. a graphite electrode; 8. a first O-ring; 9. a second O-ring; 10. A feed inlet; 11. a feed baffle; 12. a discharge port; 13. a discharge baffle; 14. a vacuum pump; 15. a first air valve; 16. a second air valve; 17. a barometer; 18. a collection bottle; 19. a liquid nitrogen bottle; 20. an electromagnetic relay; 21. a thyristor; 22. a signal generator; 23. a first direct current power supply; 24. a second direct current power supply; 25. a switch; 26. and (4) resistance.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention. The examples, in which specific conditions are not specified, were carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Referring to fig. 1, a device for recovering and extracting metal from a circuit board includes a capacitor discharge assembly, a flash chamber 1 and a gas condensation assembly; the capacitor discharging assembly comprises a capacitor 2, a millisecond switch, a solid electrode 3 and a hollow electrode 4, wherein the capacitor 2 is respectively connected with the solid electrode 3 and the hollow electrode 4, and the millisecond switch is arranged between the capacitor 2 and the solid electrode 3; one end of the flash evaporation cavity 1 is connected with the solid electrode 3, a porous copper electrode 5 is arranged inside the other end of the flash evaporation cavity 1, and the porous copper electrode 5 is connected with the hollow electrode 4; the hollow electrode 4 is provided with a recovery pipeline 6, and the hollow electrode 4 is connected with the gas condensation component through the recovery pipeline 6. Discharge through the condenser subassembly that discharges, utilize the millisecond switch to control discharge time, when discharge time control is about 1s, circuit board powder can bear a higher voltage in the short time in the flash chamber 1, including circuit board powder resistance is less, so can produce a very big electric current, the joule heat that this electric current produced, can make circuit board powder reach temperature about 3400K in the twinkling of an eye, consequently most of metal is with the form of steam, through porous copper electrode 5, hollow electrode 4 and recovery pipeline 6 volatilize, porous copper electrode 5 can make steam volatilize on the one hand, on the other hand porous copper electrode 5 can fix circuit board powder in flash chamber 1, prevent that the powder from revealing, steam volatilized after passing through the condensation of gas condensation subassembly, can become the metal solid and stay in the cold trap, and what left in the flash chamber 1 is the circuit board powder metal and retrieve the residue after drawing. The solid electrode 3 and the hollow electrode 4 are made of copper for better conductivity.
In order to ensure that the air tightness of the flash evaporation cavity 1 is better, a graphite electrode 7 is arranged inside one end of the flash evaporation cavity 1 close to the electrode 3, the graphite electrode 7 is connected with the solid electrode 3, a first O-shaped ring 8 is sleeved on the solid electrode 3, and the first O-shaped ring 8 is hermetically connected with the flash evaporation cavity 1; the hollow electrode 4 is sleeved with a second O-shaped ring 9, and the second O-shaped ring 9 is hermetically connected with the flash evaporation cavity 1.
The top of the flash evaporation cavity 1 is provided with a feeding hole 10, a feeding baffle 11 is movably arranged between the feeding hole 10 and the flash evaporation cavity 1, a discharging hole 12 is arranged at the bottom of the flash evaporation cavity 1, and a discharging baffle 13 is movably arranged between the discharging hole 12 and the flash evaporation cavity 1. When taking feeding baffle 11 out, feed inlet 10 and flash chamber 1 intercommunication can add the circuit board powder through feed inlet 10 in flash chamber 1, then insert feeding baffle 11 again and carry out the flash distillation, after the flash distillation, take discharge baffle 13 out, and at this moment, surplus residue accessible discharge gate 12 after the flash distillation is got rid of, so can be convenient for feed and the ejection of compact, convenient and fast. In order to avoid the metal vapor residue, the material of the feeding baffle plate 11 and the discharging baffle plate 13 is glass.
A vacuum pumping assembly is arranged on the recovery pipeline 6. The recovery pipeline 6 can be vacuumized, the flow rate of the metal steam can be improved, the condensation residue of the metal steam in the recovery pipeline 6 is reduced, and the recovery efficiency of the metal is improved. The vacuumizing assembly comprises a vacuum pump 14, a first air valve 15 and a second air valve 16, the vacuum pump 14 is connected with the recovery pipeline 6, the first air valve 15 is arranged between the vacuum pump 14 and the recovery pipeline 6, the second air valve 16 is arranged on the recovery pipeline 6, the second air valve 16 is close to the hollow electrode 4, the vacuumizing assembly further comprises a barometer 17, and the barometer 17 is arranged on the recovery pipeline 6. When the vacuum is pumped, the second air valve 16 is closed, then the first air valve 15 is opened, the vacuum pump 14 is started, the recovery pipeline 6 is pumped to be vacuum, then the first air valve 15 is closed, the second air valve 16 is opened, and the flash evaporation is carried out.
The gas condensation component comprises a collecting bottle 18 and a liquid nitrogen bottle 19, the collecting bottle 18 is hermetically connected with the recovery pipeline 6, and the collecting bottle 18 is arranged in the liquid nitrogen bottle 19. The liquid nitrogen can be used for condensing the metal steam into a solid state for collection, and the method is convenient and quick.
The millisecond switch comprises an electromagnetic relay 20, a thyristor 21 and a signal generator 22, wherein one end of the electromagnetic relay 20 is provided with a first direct-current power supply 23, the first direct-current power supply 23 is connected with the electromagnetic relay 20, the other end of the electromagnetic relay 20 is connected with the thyristor 21, and the thyristor 21 is electrically connected with the signal generator 22. The waveform emitted by the signal generator 22 is a square wave, the time of flash evaporation can be controlled by setting the duty ratio of the square wave, and the square wave can trigger the on and off of the thyristor, so that the on and off of the electromagnetic relay 20 are controlled, the on and off of the whole capacitor discharging assembly are controlled, and flash evaporation is realized.
The number of the capacitors 2 is at least 1, and when the number of the capacitors exceeds 1, the capacitors are arranged in parallel. The plurality of capacitors 2 are connected in parallel, so that the total capacitance of the whole capacitor 2 can be improved, and the flash evaporation cavity 1 can reach higher flash evaporation temperature. In order to charge the capacitor 2, a charging component is disposed on the capacitor 2, the charging component includes a second dc power supply 24, a switch 25 and a resistor 26, the second dc power supply 24 is electrically connected to the capacitor 2, and the switch 25 and the resistor 26 are located between the second dc power supply 24 and the capacitor 2.
Example 1:
the method for recovering the metal by adopting the recovery and extraction device for the metal in the circuit board comprises the following steps:
(1) Grinding the circuit board by using a hammer mill to obtain 50mg of circuit board powder, then adding 100mg of carbon black powder with the average diameter of 10nm, and uniformly mixing to obtain mixed powder;
(2) Adding mixed powder into a quartz tube flash evaporation cavity 1 with the inner diameter of 8mm and the outer diameter of 12mm through a feeding hole 10, then adjusting the positions of a solid electrode 3 and a hollow electrode 4, compressing the mixed powder, vacuumizing a pipeline by using a vacuum pump 14, finally setting the pulse wave width of a signal generator 22 to be 1s, carrying out flash evaporation, and collecting solids in a bottle 18 after the flash evaporation is finished, namely the recovered and extracted metals (Rh, pd, ag and Au); wherein the flash evaporation temperature is 3400K.
Example 2:
the method for recovering the metal by adopting the recovery and extraction device for the metal in the circuit board comprises the following steps:
(1) Grinding the circuit board by using a hammer mill to obtain 50mg of circuit board powder, then adding 100mg of carbon black powder with the average diameter of 10nm and 300mg of NaCl powder, and uniformly mixing to obtain mixed powder;
(2) Adding mixed powder into a quartz tube flash evaporation cavity 1 with the inner diameter of 8mm and the outer diameter of 12mm through a feeding hole 10, then adjusting the positions of a solid electrode 3 and a hollow electrode 4, compressing the mixed powder, vacuumizing a pipeline by using a vacuum pump 14, finally setting the pulse wave width of a signal generator 22 to be 1s, carrying out flash evaporation, and collecting solids in a bottle 18 after the flash evaporation is finished, namely the recovered and extracted metals (Rh, pd, ag and Au); wherein the flash evaporation temperature is 3400K.
Example 3:
the method for recovering the metal by adopting the recovery and extraction device for the metal in the circuit board comprises the following steps:
(1) Grinding the circuit board by using a hammer mill to obtain 50mg of circuit board powder, then adding 150mg of carbon black powder with the average diameter of 10nm and 250mg of NaI powder, and uniformly mixing to obtain mixed powder;
(2) Adding mixed powder into a quartz tube flash evaporation cavity 1 with the inner diameter of 8mm and the outer diameter of 12mm through a feeding hole 10, then adjusting the positions of a solid electrode 3 and a hollow electrode 4, compressing the mixed powder, vacuumizing a pipeline by using a vacuum pump 14, finally setting the width of a pulse wave of a signal generator 22 to be 0.8s, carrying out flash evaporation, and collecting solids in a bottle 18 to obtain recovered and extracted metals (Rh, pd, ag and Au) after the flash evaporation is finished; wherein the flash evaporation temperature is 3500K.
Example 4:
the method for recovering the metal by adopting the recovery and extraction device for the metal in the circuit board comprises the following steps:
(1) Grinding the circuit board by using a hammer mill to obtain 50mg of circuit board powder, then adding 250mg of carbon black powder with the average diameter of 10nm and 350mg of NaF powder, and uniformly mixing to obtain mixed powder;
(2) Adding mixed powder into a quartz tube flash evaporation cavity 1 with the inner diameter of 8mm and the outer diameter of 12mm through a feeding hole 10, then adjusting the positions of a solid electrode 3 and a hollow electrode 4, compressing the mixed powder, vacuumizing a pipeline by using a vacuum pump 14, finally setting the width of a pulse wave of a signal generator 22 to be 1.2s, carrying out flash evaporation, and collecting solids in a bottle 18 to obtain recovered and extracted metals (Rh, pd, ag and Au) after the flash evaporation is finished; wherein the flash evaporation temperature is 3000K.
Comparative example 1:
a method for recovering and extracting metals in a circuit board by adopting a pyrometallurgical method comprises the following steps:
grinding the circuit board by a hammer mill to obtain 50mg of circuit board powder, then placing the circuit board powder in a high-temperature incinerator, incinerating to strip off non-metallic substances, then placing the incinerated substances into a high-temperature smelter for melting, and then electrolyzing the melted substances to obtain recovered metals (Rh, pd, ag and Au).
Test example:
the recovery rate detection is carried out on the metals recovered and extracted in the examples 1-4 and the comparative example 1, and the specific detection calculation method comprises the following steps: the total mass of the circuit board is M, the concentration measurement c of the precious metal is measured, the mass of the collected metal is M, and the recovery rate of the metal is as follows: y = M/(c × M).
The results of frequent measurement and calculation are shown in table 1, and it can be seen from table 1 that when the recovery and extraction device and method for metals in the circuit board of the present invention are used for recovering metals, the recovery rates of Rh, pd and Ag are increased to about 90%, and the recovery rate of Au is increased to 89.8%, which indicates that the present invention can effectively increase the recovery rate of metals in the circuit board.
TABLE 1 recovery of metals
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. A method for recovering and extracting metal in a circuit board is characterized by comprising the following steps:
(1) Grinding the circuit board into circuit board powder, then adding carbon black powder, and uniformly mixing to obtain mixed powder;
(2) Flash evaporating the mixed powder under Joule heating for 0.8-1.2s to reach 3000-3500K, and condensing the flash evaporated gas to obtain solid as recovered metal;
the circuit board powder obtained in the step (1) is further added with the following additives to form mixed powder, wherein the additives are NaCl, naI, naF, PTEE or CPVC;
the mass ratio of the circuit board powder to the carbon black powder to the additive is 1:1.5-2.5:2.5-3.5;
the device for recovering the metal in the circuit board by the recovery and extraction method comprises a capacitor discharge assembly, a flash evaporation cavity (1) and a gas condensation assembly; the capacitor discharging assembly comprises a capacitor (2), a millisecond switch, a solid electrode (3) and a hollow electrode (4), the capacitor (2) is respectively connected with the solid electrode (3) and the hollow electrode (4), and the millisecond switch is arranged between the capacitor (2) and the solid electrode (3); one end of the flash evaporation cavity (1) is connected with the solid electrode (3), a porous copper electrode (5) is arranged inside the other end of the flash evaporation cavity (1), and the porous copper electrode (5) is connected with the hollow electrode (4); the hollow electrode (4) is provided with a recovery pipeline (6), and the hollow electrode (4) is connected with the gas condensation component through the recovery pipeline (6).
2. The method for recovering and extracting the metal in the circuit board according to claim 1, wherein a graphite electrode (7) is arranged inside one end of the flash evaporation cavity (1) close to the solid electrode (3), the graphite electrode (7) is connected with the solid electrode (3), a first O-shaped ring (8) is sleeved on the solid electrode (3), and the first O-shaped ring (8) is hermetically connected with the flash evaporation cavity (1); the hollow electrode (4) is sleeved with a second O-shaped ring (9), and the second O-shaped ring (9) is hermetically connected with the flash evaporation cavity (1).
3. The method for recovering and extracting the metal in the circuit board according to claim 1, wherein a feeding hole (10) is formed in the top of the flash evaporation cavity (1), a feeding baffle (11) is movably arranged between the feeding hole (10) and the flash evaporation cavity (1), a discharging hole (12) is formed in the bottom of the flash evaporation cavity (1), and a discharging baffle (13) is movably arranged between the discharging hole (12) and the flash evaporation cavity (1).
4. The method for recovering and extracting metals from circuit boards according to claim 1, wherein a vacuum-pumping assembly is arranged on the recovery pipeline (6).
5. The method for recovering and extracting metals from circuit boards according to claim 1, wherein the gas condensation assembly comprises a collection bottle (18) and a liquid nitrogen bottle (19), the collection bottle (18) is hermetically connected with the recovery pipeline (6), and the collection bottle (18) is arranged in the liquid nitrogen bottle (19).
6. The method for recovering and extracting metal from circuit board according to claim 1, wherein the millisecond switch comprises an electromagnetic relay (20), a first direct current power supply (23), a thyristor (21) and a signal generator (22), one end of the electromagnetic relay (20) is connected with the first direct current power supply (23), the other end of the electromagnetic relay (20) is connected with the thyristor (21), and the thyristor (21) and the signal generator (22) are electrically connected.
7. The method for recovering and extracting metals from circuit boards according to claim 1, wherein the number of the capacitors (2) is at least 1, and when the number of the capacitors exceeds 1, the capacitors are arranged in parallel.
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| CN102268550A (en) * | 2011-07-27 | 2011-12-07 | 上海交通大学 | Recovering method of zinc in waste circuit board |
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| CN105969992A (en) * | 2016-07-04 | 2016-09-28 | 中节能（汕头）循环经济有限公司 | Method for recycling fine tin from waste circuit board |
| CN111943180A (en) * | 2020-08-25 | 2020-11-17 | 天能帅福得能源股份有限公司 | Simple and efficient graphene preparation process |
| CN113802009A (en) * | 2021-09-17 | 2021-12-17 | 淮安中顺环保科技有限公司 | Printed circuit board recycling and gold removing process |
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