CN114570852A - MOS tube pin forming device and method - Google Patents
MOS tube pin forming device and method Download PDFInfo
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- CN114570852A CN114570852A CN202210190312.8A CN202210190312A CN114570852A CN 114570852 A CN114570852 A CN 114570852A CN 202210190312 A CN202210190312 A CN 202210190312A CN 114570852 A CN114570852 A CN 114570852A
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000005452 bending Methods 0.000 claims abstract description 49
- 230000007246 mechanism Effects 0.000 claims description 24
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 10
- 230000001960 triggered effect Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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Abstract
The invention belongs to the field of semiconductor processing, and particularly relates to a device and a method for forming a pin of an MOS (metal oxide semiconductor) tube, wherein the device comprises the following components: a first die holder; the second die holder is opened and closed relative to the first die holder; the first die set comprises a first fixed die and a first movable die which are respectively arranged on the first die holder and the second die holder; the second die set comprises a second fixed die and a second movable die which are respectively arranged on the first die holder and the second die holder; and the third module comprises a third fixed die and a third movable die which are respectively arranged on the first die holder and the second die holder. According to the invention, the bending of the pins of the MOS in different directions is realized through the first module, the second module and the third module, each module is arranged at the same station, the simultaneous forming of the three pins can be realized through one-time press mounting, and the processing efficiency is improved.
Description
Technical Field
The invention belongs to the field of semiconductor processing, and particularly relates to a device and a method for forming a pin of an MOS (metal oxide semiconductor) tube.
Background
The MOS transistor is one of important control elements in a microelectronic circuit, generally includes three pins, i.e., a source electrode S, a drain electrode D, and a gate electrode G, and can control the on/off of the source electrode S and the drain electrode D by loading different electrical signals to the gate electrode G, thereby controlling the on/off of the circuit. MOS pipe generally is as a part of PCB subassembly, however the PCB board is in circuit design process, often because the space is limited and have to carry out some to the overall arrangement of via hole and dodge the design, this just leads to the distribution of MOS pipe mounting hole and the MOS pipe pin position after the encapsulation to distribute inconsistent, need carry out the plastic to the pin of MOS pipe this moment, pin shaping device among the prior art can only be towards a direction and buckle the pin, and the structure is complicated, equipment cost is high, then need operate through the multistation when needs are buckled to different directions to different pins, machining efficiency is low.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a device and a method for forming pins of a MOS transistor, which can simultaneously shape a plurality of pins in different directions, and have a simple structure, low cost and high processing efficiency.
In order to achieve the above and other related objects, the present invention provides a device for forming a pin of a MOS transistor, including:
a first die holder;
the second die holder is opened and closed relative to the first die holder;
the first die set and the first movable die are configured to be capable of bending a first pin of a MOS tube into a step shape along a first direction when the first die holder and the second die holder are closed;
the second die set and the second movable die are configured to be capable of bending a second pin of the MOS tube into a step shape along a first direction when the first die holder and the second die holder are folded;
the third fixed die and the third movable die are configured to bend a third pin of the MOS tube into a step shape along a second direction when the first die holder and the second die holder are folded, and the second direction is opposite to the first direction.
In an optional embodiment of the present invention, the first fixed mold includes a first fixed block and a first movable block, the first fixed block and the first movable mold are respectively provided with a first positioning surface and a second positioning surface for clamping the root of the first pin, and the first positioning surface and the second positioning surface are perpendicular to an opening and closing direction between the first mold base and the second mold base; the first fixed die is provided with a first guide surface, a first convex angle is formed between the first guide surface and the first positioning surface, the first movable die is provided with a second guide surface, a first concave angle is formed between the second guide surface and the second positioning surface, when the first fixed die and the first movable die are mutually folded, a first pin between the first fixed die and the first movable die can form a first bending section by taking the position of the first convex angle and the position of the first concave angle as an inflection point, and the length of the first guide surface and the length of the second guide surface are smaller than that of the first bending section, so that the end part of the first bending section can protrude out of the first guide surface and the second guide surface; the first movable block is located keep away from on the first fixed block one side of first locating surface, first movable block along being on a parallel with the direction of first locating surface for first fixed block activity sets up, first movable block is assembled for can be right when it is along being on a parallel with when the direction activity of first locating surface the first bending section epirelief first guide face with the part of second guide face is bent, and makes the tip of first bending section form and is on a parallel with the second bending section of first pin root.
In an optional embodiment of the present invention, the second module and the first module have the same or symmetrical structure.
In an optional embodiment of the present invention, the third movable mold includes a second fixed block and a second movable block, a third positioning surface and a fourth positioning surface for clamping the root of the third pin are respectively disposed on the second fixed block and the third fixed mold, and the third positioning surface and the fourth positioning surface are perpendicular to the opening and closing direction between the first mold base and the second mold base; a third guide surface is arranged on the third movable die, a second convex angle is formed between the third guide surface and the third positioning surface, a fourth guide surface is arranged on the third fixed die, a second concave angle is formed between the fourth guide surface and the fourth positioning surface, when the third fixed die and the third movable die are folded, a third bending section can be formed by a third pin between the third fixed die and the third movable die at the position of the second convex angle and the position of the second concave angle, and the lengths of the third guide surface and the fourth guide surface are smaller than that of the third bending section, so that the end part of the third bending section can protrude out of the third guide surface and the fourth guide surface; the second movable block is located keep away from on the second fixed block one side of third locating surface, the second movable block along being on a parallel with the direction of third locating surface for the second fixed block activity sets up, the second movable block is assembled for when it is along being on a parallel with when the direction activity of third locating surface, can be right the third bending section epirelief third guide face with the part of fourth guide face is bent, and makes the tip of third bending section form and is on a parallel with the fourth bending section of third pin root.
In an optional embodiment of the present invention, the first mold base is fixedly disposed relative to the MOS transistor, the second mold base is movably disposed relative to the MOS transistor, the second mold base is connected to the driving device, and the third fixed mold is movably disposed relative to the first mold base along a direction perpendicular to the fourth positioning surface.
In an optional embodiment of the present invention, the first die holder and the second die holder are arranged to be opened and closed with each other along a vertical direction, and the first die holder is located below the second die holder; the driving device comprises a driving seat, the second die holder is movably connected with the driving seat, a first pressure spring is arranged between the second die holder and the driving seat, and a limiting part used for limiting the movement stroke of the second die holder relative to the driving seat is arranged between the second die holder and the driving seat.
In an optional embodiment of the invention, a first linkage mechanism is arranged between the driving seat and the third fixed die, and the first linkage mechanism is assembled to drive the third fixed die to move upwards relative to the first die holder when the driving seat is down; a second linkage mechanism is arranged between the driving seat and the first movable block and the second movable block, and is assembled to drive the first movable block and the second movable block to move when the driving seat descends; the driving seat is assembled to drive the first movable die and the first fixed block to be folded firstly when the driving seat descends, then the first linkage mechanism is triggered, and finally the second linkage mechanism is triggered.
In an optional embodiment of the invention, the first linkage mechanism comprises a side insert block, the side insert block is movably connected with the second die holder, the moving direction of the side insert block is perpendicular to the opening and closing direction of the first die holder and the second die holder, and the side insert block is provided with a station a and a station b along the moving direction; the side insert block is provided with a guide groove, the guide groove comprises an inclined section and a vertical section extending downwards from the lower end of the inclined section, a drive rod is arranged on the drive seat, the lower end of the drive rod is provided with a guide pin in sliding fit with the guide groove, in the descending process of the drive seat relative to the second die holder, the side insert block can be driven to move from the station b to the station a when the guide pin slides in the inclined section, and the side insert block can be kept at the station a when the guide pin slides in the vertical section; be equipped with first wedge face on the side inserted block, third cover half bottom is equipped with the second wedge face, when first die holder and second die holder have closed, the side inserted block certainly station b to can pass through in the station a motion process first wedge face and the drive of second wedge face the third cover half upwards lifts.
In an optional embodiment of the present invention, the second linkage mechanism includes a first vertical insertion block and a second vertical insertion block fixedly connected to the driving seat, lower ends of the first vertical insertion block and the second vertical insertion block are respectively provided with a third wedge surface and a fourth wedge surface, an upper end of the first movable block is provided with a fifth wedge surface, an upper end of the second movable block is provided with a sixth wedge surface, the fifth wedge surface is arranged opposite to the third wedge surface along the vertical direction, and the sixth wedge surface is arranged opposite to the fourth wedge surface along the vertical direction; when the driving seat moves downwards relative to the first die holder and the second die holder after the first fixed block and the first movable die are folded and the second fixed block and the third fixed die are folded, the first movable block and the second movable block can be respectively driven by the first vertical insertion block and the second vertical insertion block to slide along the direction parallel to the first positioning surface; and a second pressure spring is arranged between the first movable block and the first die holder, and a third pressure spring is arranged between the second movable block and the second die holder.
In order to achieve the above and other related objects, the present invention further provides a method for forming a MOS transistor pin, which applies the above MOS transistor pin forming apparatus to process a MOS transistor pin.
The invention has the technical effects that:
according to the invention, the bending of the pins of the MOS in different directions is realized through the first module, the second module and the third module, each module is arranged at the same station, the simultaneous forming of the three pins can be realized through one-time press mounting, and the processing efficiency is improved.
The invention realizes the cooperative action of all mechanisms by using one power source, namely the driving seat, can finish the twice bending of three pins by only once stamping, simplifies the structure of the equipment, reduces the cost of the equipment and improves the processing efficiency.
According to the invention, each pin is bent twice, namely, the pins are sequentially bent from the root parts to the end parts, so that the pins can be prevented from being broken or damaged due to overlarge tension on the pins in the bending process.
Drawings
Fig. 1 is a schematic perspective view of a MOS transistor according to an embodiment of the present invention;
fig. 2 is a perspective view of a MOS transistor pin forming apparatus according to an embodiment of the present invention;
fig. 3 is a side view of a MOS transistor lead forming apparatus according to an embodiment of the present invention;
fig. 4 is a top view of a MOS transistor lead forming apparatus provided by an embodiment of the invention;
FIG. 5 is a sectional view A-A of FIG. 4;
fig. 6 is a side view of another station of the MOS transistor lead forming apparatus according to the embodiment of the present invention;
fig. 7 is a top view of another station of the MOS transistor lead forming apparatus according to the embodiment of the present invention;
FIG. 8 is a cross-sectional view B-B of FIG. 7;
FIG. 9 is a cross-sectional view C-C of FIG. 7;
fig. 10 is an exploded view of a MOS transistor lead forming apparatus according to an embodiment of the present invention;
FIG. 11 is a perspective view of a first die holder provided by an embodiment of the invention;
FIG. 12 is a perspective view of a first movable block provided by an embodiment of the present invention;
FIG. 13 is a perspective view of a third stationary mold provided in an embodiment of the present invention;
FIG. 14 is an exploded view of a second die holder provided by an embodiment of the invention;
FIG. 15 is a perspective view of a side insert block provided by an embodiment of the present invention;
FIG. 16 is a perspective view of a second movable block provided by an embodiment of the present invention;
fig. 17 is a perspective view of a driving socket provided in an embodiment of the present invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Referring to fig. 2-17, the MOS transistor pin forming apparatus of the present invention is used for processing the pins of the MOS transistor 1, i.e., the first pin 101, the second pin 102, and the third pin 103, into the state shown in fig. 1, and includes a first mold base 10; a second die holder 20, a first die set, a second die set and a third die set; the second die holder 20 is opened and closed relative to the first die holder 10;
the first die set comprises a first fixed die and a first movable die 21 which are respectively arranged on the first die holder 10 and the second die holder 20, the first fixed die and the first movable die 21 are oppositely arranged, and the first fixed die and the first movable die 21 are configured to press and bend the first pin 101 of the MOS tube 1 into a step shape along a first direction when the first die holder 10 is folded with the second die holder 20;
the second die set comprises a second fixed die and a second movable die which are respectively arranged on the first die holder 10 and the second die holder 20, the second fixed die and the second movable die are arranged oppositely, and the second fixed die and the second movable die are configured to be capable of bending the second pin 102 of the MOS tube 1 into a step shape along the first direction when the first die holder 10 is folded with the second die holder 20;
the third die set comprises a third fixed die 13 and a third movable die which are respectively arranged on the first die holder 10 and the second die holder 20, the third fixed die 13 and the third movable die are oppositely arranged, and the third fixed die 13 and the third movable die are configured to be capable of press-bending a third pin 103 of the MOS transistor 1 into a step shape along a second direction when the first die holder 10 is folded with the second die holder 20, wherein the second direction is opposite to the first direction.
Referring to fig. 3, 6, 8, 11, 12, and 14, specifically, the first fixed mold includes a first fixed block 11 and a first movable block 12, the first fixed block 11 and the first movable mold 21 are respectively provided with a first positioning surface 111 and a second positioning surface 211 for clamping the root of the first pin 101, and the first positioning surface 111 and the second positioning surface 211 are perpendicular to the opening and closing direction between the first mold base 10 and the second mold base 20; the first fixed die is provided with a first guide surface 112, a first convex angle is formed between the first guide surface 112 and the first positioning surface 111, the first movable die 21 is provided with a second guide surface 212, a first concave angle is formed between the second guide surface 212 and the second positioning surface 211, when the first fixed die and the first movable die 21 are folded, a first bending section can be formed by the first pin 101 between the first fixed die and the first movable die with the position of the first convex angle and the position of the first concave angle as an inflection point, and the length of the first guide surface 112 and the length of the second guide surface 212 are smaller than that of the first bending section, so that the end part of the first bending section can be protruded out of the first guide surface 112 and the second guide surface 212; the first movable block 12 is located on one side of the first fixed block 11 far away from the first positioning surface 111, the first movable block 12 is movably arranged relative to the first fixed block 11 along a direction parallel to the first positioning surface 111, the first movable block 12 is assembled to bend a portion of the first bending section protruding out of the first guide surface 112 and the second guide surface 212 when moving along a direction parallel to the first positioning surface 111, and the end of the first bending section forms a second bending section parallel to the root of the first pin 101.
Referring to fig. 2-17, in the embodiment of the invention, the second module and the first module are symmetrical to each other and are disposed on two sides of the third module, so detailed descriptions of the second module are omitted.
Referring to fig. 5, 9, and 13-16, the third movable mold includes a second fixed block 22 and a second movable block 24, a third positioning surface 221 and a fourth positioning surface 131 for clamping the root of the third pin 103 are respectively disposed on the second fixed block 22 and the third fixed mold 13, and the third positioning surface 221 and the fourth positioning surface 131 are perpendicular to the opening and closing direction between the first mold base 10 and the second mold base 20; a third guide surface 222 is arranged on the third movable mold, a second convex angle is formed between the third guide surface 222 and the third positioning surface 221, a fourth guide surface 132 is arranged on the third fixed mold 13, a second concave angle is formed between the fourth guide surface 132 and the fourth positioning surface 131, when the third fixed mold 13 and the third movable mold are folded, a third bending section can be formed by the third pin 103 between the third fixed mold 13 and the third movable mold at the position of the second convex angle and the position of the second concave angle, and the lengths of the third guide surface 222 and the fourth guide surface 132 are smaller than the length of the third bending section, so that the end part of the third bending section can be protruded out of the third guide surface 222 and the fourth guide surface 132; the second movable block 24 is located on the second fixed block 22 on a side far from the third positioning surface 221, the second movable block 24 is movably arranged relative to the second fixed block 22 along a direction parallel to the third positioning surface 221, and the second movable block 24 is assembled to bend a portion of the third bending section protruding from the third guide surface 222 and the fourth guide surface 132 and make an end of the third bending section form a fourth bending section parallel to the root of the third pin 103 when moving along a direction parallel to the third positioning surface 221.
Referring to fig. 2, as a preferred embodiment of the present invention, the first mold base 10 is fixedly disposed relative to the MOS transistor 1, the second mold base 20 is movably disposed relative to the MOS transistor 1, the second mold base 20 is connected to a driving device, and the third mold base 13 is movably disposed relative to the first mold base 10 along a direction perpendicular to the fourth positioning surface 131. Further, the first die holder 10 and the second die holder 20 are arranged to be opened and closed with each other along the vertical direction, and the first die holder 10 is located below the second die holder 20; the driving device comprises a driving seat 30, the driving seat 30 is connected with driving elements such as an air cylinder or an electric cylinder, the second die holder 20 is movably connected with the driving seat 30, a first pressure spring 32 is arranged between the second die holder 20 and the driving seat 30, and a limiting part used for limiting the movement stroke of the second die holder 20 relative to the driving seat 30 is arranged between the second die holder 20 and the driving seat 30.
Further, as shown in fig. 3, 5 and 9, a first linkage mechanism is disposed between the driving seat 30 and the third fixed mold 13, and the first linkage mechanism is configured to drive the third fixed mold 13 to move upward relative to the first mold base 10 when the driving seat 30 is located below; a second linkage mechanism is arranged between the driving seat 30 and the first movable block 12 and the second movable block 24, and the second linkage mechanism is assembled to drive the first movable block 12 and the second movable block 24 to move when the driving seat 30 descends; the driving seat 30 is configured to drive the first movable mold 21 to close with the first fixed block 11, trigger the first linkage mechanism, and trigger the second linkage mechanism.
Specifically, the first linkage mechanism comprises a side insert block 23, the side insert block 23 is movably connected with the second die holder 20, the moving direction of the side insert block 23 is perpendicular to the opening and closing direction of the first die holder 10 and the second die holder 20, and the side insert block 23 is provided with a station a and a station b along the moving direction; the side insert block 23 is provided with a guide groove, the guide groove comprises an inclined section 231 and a vertical section 232 extending downwards from the lower end of the inclined section 231, the drive seat 30 is provided with a drive rod 31, the lower end of the drive rod 31 is provided with a guide pin 311 in sliding fit with the guide groove, during the process that the drive seat 30 descends relative to the second die holder 20, the side insert block 23 can be driven to move from the station b to the station a when the guide pin 311 slides in the inclined section 231, and the side insert block 23 can be kept at the station a when the guide pin 311 slides in the vertical section 232; be equipped with first tapered wedge surface 233 on the side inserted block 23, third cover half 13 bottom is equipped with second tapered wedge surface 133, when first die holder 10 and second die holder 20 have foldd, side inserted block 23 certainly station b to station a motion in-process can pass through first tapered wedge surface 233 and second tapered wedge surface 133 drive third cover half 13 is ascending, be equipped with between third cover half 13 and the first die holder 10 and be used for driving the descending fourth pressure spring 15 of third cover half 13.
The second linkage mechanism comprises a first vertical insertion block 33 and a second vertical insertion block 34 fixedly connected with the driving seat 30, the lower ends of the first vertical insertion block 33 and the second vertical insertion block 34 are respectively provided with a third wedge surface and a fourth wedge surface, the upper end of the first movable block 12 is provided with a fifth wedge surface 121, the upper end of the second movable block 24 is provided with a sixth wedge surface 241, the fifth wedge surface 121 is arranged opposite to the third wedge surface along the vertical direction, and the sixth wedge surface 241 is arranged opposite to the fourth wedge surface along the vertical direction; when the driving seat 30 descends relative to the first die holder 10 and the second die holder 20 after the first fixed block 11 is folded with the first movable die 21 and the second fixed block 22 is folded with the third fixed die 13, the first movable block 12 and the second movable block 24 can be respectively driven to slide along a direction parallel to the first positioning surface 111 by the first vertical insertion block 33 and the second vertical insertion block 34; a second pressure spring 14 is arranged between the first movable block 12 and the first die holder 10, and a third pressure spring 25 is arranged between the second movable block 24 and the second die holder 20.
The invention also provides a method for forming the pins of the MOS tube, which is used for processing the pins of the MOS tube by applying the device for forming the pins of the MOS tube, and particularly, the device for forming the pins of the MOS tube can be arranged at the tail end of a packaging line of the MOS tube, the MOS tube is conveyed on the packaging conveying line in a fixed posture, when the MOS tube is conveyed to the device for forming the pins of the MOS tube, the conveying line can be controlled to pause, then the device for forming the pins of the MOS tube is controlled to execute one-time pressing action, and the whole process can be finished within 1 s. Or the conveying line can be kept in a moving state all the time, and then the MOS tube pin forming device is arranged on a synchronous conveying line and moves along with the MOS tube, so that the processing efficiency can be further improved.
The specific working process and principle of the invention are as follows:
the initial station is as shown in fig. 2-5, and the pins of the packaged MOS transistor are placed between the first die holder 10 and the second die holder 20; then the driving seat 30 is controlled to descend, in the descending process of the driving seat 30, the first movable die 21 is firstly folded with the first fixed block 11, the first pins 101 and the second pins 102 are bent downwards, then the driving seat 30 continues to descend, at this time, the first pressure spring 32 is compressed, the second die holder 20 and the driving seat 30 generate relative displacement, the side insert block 23 moves to the left side shown in fig. 5 and 9, the side insert block 23 drives the third fixed die 13 to ascend, the third fixed die 13 is folded with the second fixed block 22, and at this time, the third pins 103 are bent upwards; then, the driving base 30 continues to move downward, the side insert 23 is kept at the same position, the first vertical insert 33 and the second vertical insert 34 respectively drive the first movable block 12 and the second movable block 24 to slide to the right as shown in fig. 5 and 9, and the end portions of the first pin 101, the second pin 102 and the third pin 103 are bent again to the right, so that the pins are formed into the shape shown in fig. 1. Finally, the driving seat 30 moves upwards, and all the components reset under the action of the pressure spring.
In summary, the first module, the second module and the third module realize bending of the pins of the MOS in different directions, the modules are installed at the same station, and simultaneous molding of the three pins can be realized by one-time press-fitting, so that the processing efficiency is improved. The invention realizes the cooperative action of all mechanisms by using one power source, namely the driving seat 30, can finish the twice bending of three pins by only once stamping, simplifies the structure of the equipment, reduces the cost of the equipment and improves the processing efficiency. According to the invention, each pin is bent twice, namely, the pins are sequentially bent from the root parts to the end parts, so that the pins can be prevented from being broken or damaged due to overlarge tension on the pins in the bending process.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
In the description herein, numerous specific details are provided, such as examples of components and/or methods, to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that an embodiment of the invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of embodiments of the invention.
Reference throughout this specification to "one embodiment," "an embodiment," or "a specific embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment, and not necessarily in all embodiments, of the present invention. Thus, appearances of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined in any suitable manner with one or more other embodiments. It is to be understood that other variations and modifications of the embodiments of the invention described and illustrated herein are possible in light of the teachings herein and are to be considered as part of the spirit and scope of the present invention.
It will also be appreciated that one or more of the elements shown in the figures can also be implemented in a more separated or integrated manner, or even removed for inoperability in some circumstances or provided for usefulness in accordance with a particular application.
Additionally, any reference arrows in the drawings/figures should be considered only as exemplary, and not limiting, unless otherwise expressly specified. Further, as used herein, the term "or" is generally intended to mean "and/or" unless otherwise indicated. Combinations of components or steps will also be considered as being noted where terminology is foreseen as rendering the ability to separate or combine is unclear.
As used in the description herein and throughout the claims that follow, "a", "an", and "the" include plural references unless otherwise specified. Also, as used in the description herein and throughout the claims that follow, the meaning of "in …" includes "in …" and "on …" unless otherwise indicated.
The above description of illustrated embodiments of the invention, including what is described in the abstract, is not intended to be exhaustive or to limit the invention to the precise forms disclosed herein. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention, as those skilled in the relevant art will recognize and appreciate. As indicated, these modifications may be made to the present invention in light of the foregoing description of illustrated embodiments of the present invention and are to be included within the spirit and scope of the present invention.
The systems and methods have been described herein in general terms as the details aid in understanding the invention. Furthermore, various specific details have been given to provide a general understanding of the embodiments of the invention. One skilled in the relevant art will recognize, however, that an embodiment of the invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, and/or operations are not specifically shown or described in detail to avoid obscuring aspects of embodiments of the invention.
Thus, although the present invention has been described herein with reference to particular embodiments thereof, a latitude of modification, various changes and substitutions are intended in the foregoing disclosures, and it will be appreciated that in some instances some features of the invention will be employed without a corresponding use of other features without departing from the scope and spirit of the invention as set forth. Thus, many modifications may be made to adapt a particular situation or material to the essential scope and spirit of the present invention. It is intended that the invention not be limited to the particular terms used in following claims and/or to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Accordingly, the scope of the invention is to be determined solely by the appended claims.
Claims (10)
1. The utility model provides a MOS pipe pin forming device which characterized in that includes:
a first die holder;
the second die holder is opened and closed relative to the first die holder;
the first die set and the first movable die are configured to be capable of bending a first pin of a MOS tube into a step shape along a first direction when the first die holder and the second die holder are closed;
the second die set and the second movable die are configured to be capable of bending a second pin of the MOS tube into a step shape along a first direction when the first die holder and the second die holder are folded;
the third fixed die and the third movable die are configured to bend a third pin of the MOS tube into a step shape along a second direction when the first die holder and the second die holder are folded, and the second direction is opposite to the first direction.
2. The device for forming the pin of the MOS transistor according to claim 1, wherein the first fixed mold comprises a first fixed block and a first movable block, the first fixed block and the first movable mold are respectively provided with a first positioning surface and a second positioning surface for clamping the root of the first pin, and the first positioning surface and the second positioning surface are perpendicular to an opening and closing direction between the first mold base and the second mold base; the first fixed die is provided with a first guide surface, a first convex angle is formed between the first guide surface and the first positioning surface, the first movable die is provided with a second guide surface, a first concave angle is formed between the second guide surface and the second positioning surface, when the first fixed die and the first movable die are mutually folded, a first pin between the first fixed die and the first movable die can form a first bending section by taking the position of the first convex angle and the position of the first concave angle as an inflection point, and the length of the first guide surface and the length of the second guide surface are smaller than that of the first bending section, so that the end part of the first bending section can protrude out of the first guide surface and the second guide surface; the first movable block is located keep away from on the first fixed block one side of first locating surface, first movable block along being on a parallel with the direction of first locating surface for first fixed block activity sets up, first movable block is assembled for can be right when it is along being on a parallel with when the direction activity of first locating surface the first bending section epirelief first guide face with the part of second guide face is bent, and makes the tip of first bending section form and is on a parallel with the second bending section of first pin root.
3. The device for forming the MOS transistor pin according to claim 2, wherein the second module is identical or symmetrical to the first module.
4. The device for forming the pins of the MOS transistor according to claim 2, wherein the third movable mold comprises a second fixed mold and a second movable mold, the second fixed mold and the third fixed mold are respectively provided with a third positioning surface and a fourth positioning surface for clamping the roots of the third pins, and the third positioning surface and the fourth positioning surface are perpendicular to the opening and closing direction between the first mold base and the second mold base; a third guide surface is arranged on the third movable die, a second convex angle is formed between the third guide surface and the third positioning surface, a fourth guide surface is arranged on the third fixed die, a second concave angle is formed between the fourth guide surface and the fourth positioning surface, when the third fixed die and the third movable die are folded, a third bending section can be formed at the position of the second convex angle and the second concave angle as the inflection point of a third pin between the third fixed die and the third movable die, and the lengths of the third guide surface and the fourth guide surface are smaller than the length of the third bending section, so that the end part of the third bending section can be protruded out of the third guide surface and the fourth guide surface; the second movable block is located keep away from on the second fixed block one side of third locating surface, the second movable block along being on a parallel with the direction of third locating surface for the second fixed block activity sets up, the second movable block is assembled for when it is along being on a parallel with when the direction activity of third locating surface, can be right the third bending section epirelief third guide face with the part of fourth guide face is bent, and makes the tip of third bending section form and is on a parallel with the fourth bending section of third pin root.
5. The device for forming pins of MOS transistors according to claim 4, wherein the first mold base is fixedly disposed with respect to the MOS transistors, the second mold base is movably disposed with respect to the MOS transistors, the second mold base is connected to the driving device, and the third fixed mold is movably disposed with respect to the first mold base along a direction perpendicular to the fourth positioning surface.
6. The device for forming the pins of the MOS transistor according to claim 5, wherein the first mold base and the second mold base are vertically opened and closed with each other, and the first mold base is located under the second mold base; the driving device comprises a driving seat, the second die holder is movably connected with the driving seat, a first pressure spring is arranged between the second die holder and the driving seat, and a limiting part used for limiting the movement stroke of the second die holder relative to the driving seat is arranged between the second die holder and the driving seat.
7. The device for forming the pins of the MOS tube according to claim 6, wherein a first linkage mechanism is arranged between the driving seat and the third fixed die, and the first linkage mechanism is arranged to drive the third fixed die to move upwards relative to the first die holder when the driving seat is down; a second linkage mechanism is arranged between the driving seat and the first movable block and the second movable block, and is assembled to drive the first movable block and the second movable block to move when the driving seat descends; the driving seat is assembled to drive the first movable mold and the first fixed block to fold firstly when the driving seat descends, then the first linkage mechanism is triggered, and finally the second linkage mechanism is triggered.
8. The device for forming the pins of the MOS transistor according to claim 7, wherein the first linkage mechanism comprises a side insert block, the side insert block is movably connected with the second die holder, and the moving direction of the side insert block is perpendicular to the opening and closing direction of the first die holder and the second die holder, and the side insert block has a station a and a station b along the moving direction; the side insert block is provided with a guide groove, the guide groove comprises an inclined section and a vertical section extending downwards from the lower end of the inclined section, a drive rod is arranged on the drive seat, the lower end of the drive rod is provided with a guide pin in sliding fit with the guide groove, in the descending process of the drive seat relative to the second die holder, the side insert block can be driven to move from the station b to the station a when the guide pin slides in the inclined section, and the side insert block can be kept at the station a when the guide pin slides in the vertical section; be equipped with first wedge face on the side inserted block, third cover half bottom is equipped with the second wedge face, when first die holder and second die holder have closed, the side inserted block certainly station b to can pass through in the station a motion process first wedge face and the drive of second wedge face the third cover half upwards lifts.
9. The MOS tube pin forming device according to claim 7, wherein the second linkage mechanism comprises a first vertical insertion block and a second vertical insertion block fixedly connected with the driving seat, the lower ends of the first vertical insertion block and the second vertical insertion block are respectively provided with a third wedge surface and a fourth wedge surface, the upper end of the first movable block is provided with a fifth wedge surface, the upper end of the second movable block is provided with a sixth wedge surface, the fifth wedge surface is arranged opposite to the third wedge surface along the vertical direction, and the sixth wedge surface is arranged opposite to the fourth wedge surface along the vertical direction; when the driving seat moves downwards relative to the first die holder and the second die holder after the first fixed block and the first movable die are folded and the second fixed block and the third fixed die are folded, the first movable block and the second movable block can be respectively driven by the first vertical inserting block and the second vertical inserting block to slide along the direction parallel to the first positioning surface; and a second pressure spring is arranged between the first movable block and the first die holder, and a third pressure spring is arranged between the second movable block and the second die holder.
10. A method for forming a pin of a MOS transistor, wherein the pin of the MOS transistor is processed by using the device for forming a pin of a MOS transistor according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210190312.8A CN114570852A (en) | 2022-02-28 | 2022-02-28 | MOS tube pin forming device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210190312.8A CN114570852A (en) | 2022-02-28 | 2022-02-28 | MOS tube pin forming device and method |
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| CN114570852A true CN114570852A (en) | 2022-06-03 |
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| CN202210190312.8A Pending CN114570852A (en) | 2022-02-28 | 2022-02-28 | MOS tube pin forming device and method |
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