CN213944679U

CN213944679U - Bending equipment for pins of electronic devices

Info

Publication number: CN213944679U
Application number: CN202022479739.9U
Authority: CN
Inventors: 单瑜彤; 谢明养; 吴刚; 文志博; 张海深; 谢建修; 谢寿财
Original assignee: Shenzhen Weizhen Motor Co ltd
Current assignee: Shenzhen Weizhen Motor Co ltd
Priority date: 2020-10-30
Filing date: 2020-10-30
Publication date: 2021-08-13
Anticipated expiration: 2030-10-30

Abstract

The utility model belongs to the technical field of automation, and particularly discloses a bending device for pins of electronic devices, which comprises a material conveying device and a bending device, wherein the material conveying device is used for conveying materials to be processed to stations to be bent in sequence; the bending device is provided with a station to be bent and connected with the conveying device, the bending device comprises a material receiving assembly matched with a discharge port of the conveying device and bending assemblies arranged on two opposite sides and above the material receiving assembly, and the bending assemblies comprise a first bending assembly and a second bending assembly. With this structural design's equipment of bending, accomplish automatic feeding back through the feeding device, the rethread is bent the subassembly through first subassembly and the second subassembly of bending respectively and is carried out the pin and bend the shaping, and the pin uniformity of bending is good, and it is efficient to bend.

Description

Bending equipment for pins of electronic devices

Technical Field

The utility model relates to an automatic technical field especially relates to an equipment of bending for electron device pin.

Background

In the related art, when pins of electronic devices (such as capacitors 3, resistors and the like) for a plug-in are bent, the pins are poor in bending consistency, low in bending efficiency, time-consuming and labor-consuming due to the lack of necessary bending equipment, and therefore, improvement is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an equipment of bending for electron device pin, the equipment of should bending is automatic to be bent efficiently, and the pin uniformity of bending is good, can effectively promote the efficiency of bending of pin.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a bending apparatus for an electronic device pin, comprising:

the material conveying device is used for conveying the material pieces to be processed to the station to be bent in sequence;

the bending device is provided with the station of waiting to bend and with the feeding device is connected, the bending device include with the discharge gate matched with of feeding device connects the material subassembly, and sets up connect the subassembly of bending of the relative both sides of material subassembly and top, the subassembly of bending is including the first subassembly of bending that is used for material spare once to bend, and is used for cooperating the second subassembly of bending that material spare secondary was bent is accomplished to first subassembly of bending.

The feeding device comprises a vibration disc, a feeding rail connected with a discharge port of the vibration disc, and a feeding mechanism connected with a discharge port of the feeding rail.

The material receiving assembly comprises a positioning seat and a first air cylinder arranged on the lower bottom surface of the workbench and used for driving the positioning seat to lift.

The feeding mechanism comprises a carrier arranged at the tail end of the conveying rail and used for conveying a material piece, a feeding seat matched with the carrier, a second air cylinder used for driving the carrier to slide along the width direction of the conveying rail, a feeding piece in sliding fit with the carrier and the feeding seat, and a third air cylinder used for driving the feeding piece to move back and forth along the length direction of the conveying rail.

The material loading seat and the carrier are both provided with a slideway which is communicated with the positioning seat in a penetrating way, and the material part slides into the containing position of the positioning seat under the driving action of the material loading part.

The first bending assembly comprises a lower die arranged on one side of the positioning seat, an upper die arranged above the positioning seat, a fourth cylinder used for driving the lower die to horizontally reciprocate and a fifth cylinder used for driving the upper die and the lower die to be assembled.

The second bending assembly is arranged on one side, far away from the lower die, of the positioning seat, and comprises a sliding block, a sixth air cylinder, a seventh air cylinder and a pressure head, wherein the sliding block is arranged along the length direction of the material conveying rail, the sixth air cylinder is used for driving the sliding block to slide back and forth, the seventh air cylinder is fastened with the sliding block and is arranged along the width direction of the material conveying rail, and the pressure head is connected with the seventh air cylinder and is used for bending the material for the second time.

And a support is erected between the lower die and the pressure head, and the fifth cylinder is erected along the height direction of the support.

The middle part of the lower end face of the upper die is provided with a bulge, and the root of the bulge is provided with an arc.

The lower die comprises a die holder and two molding rods extending out of one side of the die holder at intervals, and the tops of the two molding rods are matched with the circular arcs.

The beneficial effects of the utility model reside in that: the utility model discloses a bending device for pins of electronic devices, which comprises a material conveying device and a bending device, wherein the material conveying device is used for conveying materials to be processed to stations to be bent in sequence; the bending device is provided with a station to be bent and connected with the conveying device, the bending device comprises a material receiving assembly matched with a discharge port of the conveying device and bending assemblies arranged on two opposite sides and above the material receiving assembly, and the bending assemblies comprise a first bending assembly and a second bending assembly. With this structural design's equipment of bending, accomplish automatic feeding back through the feeding device, the rethread is bent the subassembly through first subassembly and the second subassembly of bending respectively and is carried out the pin and bend the shaping, and the pin uniformity of bending is good, and it is efficient to bend.

Drawings

Fig. 1 is an axonometric view of the bending apparatus of the present invention for pins of electronic devices.

Fig. 2 is an isometric view of the loading mechanism and first bending assembly of fig. 1 after assembly.

Fig. 3 is an isometric view of fig. 1 with the vibratory pan and feed rail removed.

Figure 4 is the utility model discloses bend electric capacity finished product axonometric drawing after the shaping.

In the figure:

1. a feeding device; 11. a vibrating pan; 12. a material conveying rail; 13. a feeding mechanism; 131. a carrier; 132. a feeding seat; 133. a second cylinder; 134. feeding parts; 135. a third cylinder;

2. a bending device; 21. a material receiving assembly; 211. positioning seats; 212. a first cylinder; 221. a first bending assembly; 2211. a lower die; 2211a, a die holder; 2211b, forming rod; 2212. an upper die; 2212a, projection 2212b, circular arc; 23. a support; 2215. a fourth cylinder; 2216. a fifth cylinder; 222. a second bending assembly; 2221. a slider; 2222. a sixth cylinder; 2223. a seventh cylinder; 2224. and (4) pressing head.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

Referring to fig. 1 to 4, the embodiment provides a bending apparatus for pins of an electronic device, including a feeding device 1 and a bending device 2, specifically, the feeding device 1 is mainly used for sequentially conveying materials to be processed to a station to be bent, and further specifically, the feeding device 1 includes a vibration tray 11, a feeding rail 12 connected to a discharge port of the vibration tray 11, and a feeding mechanism 13 connected to a discharge port of the feeding rail 12.

Furthermore, the feeding mechanism 13 includes a carrier 131 disposed at the end of the conveying rail 12 for transferring the material, a feeding seat 132 engaged with the carrier 131, a second cylinder 133 for driving the carrier 131 to slide along the width direction of the conveying rail 12, a feeding member 134 engaged with the carrier 131 and the feeding seat 132, and a third cylinder 135 for driving the feeding member 134 to move back and forth along the length direction of the conveying rail 12; preferably, in the present embodiment, a slide way is formed through both the loading seat 132 and the carrier 131, and when the carrier 131 transfers the material delivered from the delivery rail 12 to the loading seat 132 side by the action of the second air cylinder 133, the loading part 134 is driven by the third air cylinder 135 to slide along the slide way to the bending device 2, so as to perform the bending operation.

More specifically, the bending device 2 in this embodiment is provided with a station to be bent and connected to the feeding device 1, and further, the bending device 2 includes a material receiving assembly 21 matched with a discharge port of the feeding device 1, and bending assemblies arranged on two opposite sides and above the material receiving assembly 21, where the bending assemblies include a first bending assembly 221 for bending the material once, and a second bending assembly 222 for matching the first bending assembly 221 to complete the secondary bending of the material; preferably, the receiving assembly 21 includes a positioning seat 211, and a first cylinder 212 disposed on the lower bottom surface of the worktable for driving the positioning seat 211 to ascend and descend.

Further preferably, a storage position communicated with the slide way is arranged on the positioning seat 211, and when the material loading part 134 is driven by the third cylinder 135 to slide the material along the slide way to the bending device 2, the positioning seat 211 is lifted upwards by the first cylinder 212, so that the storage position on the positioning seat 211 is aligned with the slide way, that is, the material sliding out through the slide way slides into the storage position, thereby facilitating the subsequent operation.

More specifically, the first bending assembly 221 in this embodiment includes a lower die 2211 disposed on one side of the positioning seat 211, an upper die 2212 disposed above the positioning seat 211, a fourth cylinder 2215 for driving the lower die 2211 to move horizontally back and forth, and a fifth cylinder 2216 for driving the upper die 2212 and the lower die 2211 to be matched; for easy understanding, the material in this embodiment is preferably a capacitor 3 with two pins, after the capacitor 3 is moved to the receiving slot of the positioning seat 211, the lower mold 2211 is moved to one side of the capacitor 3 under the driving action of the fourth cylinder 2215, and in this embodiment, for convenience of completing one-step forming of the two pins 31 of the capacitor 3 under the action of the upper mold 2212 and the lower mold 2211, the lower mold 2211 includes a mold base 2211a and two forming rods 2211b extending outward from one side of the mold base 2211a, for convenience of bending, the two forming rods 2211b are horizontally inserted outside the two pins 31, the middle of the lower end surface of the upper mold 2212 is provided with a protrusion 2212a, the root of the protrusion 2212a is provided with an arc 2212b matched with the top of the two forming rods 2211b, when the upper mold is closed, the protrusion 2212a is pressed between the two pins 31 turned upside down and driven by the forming rods 2211b, and then the one-step molding of the pin is completed.

Furthermore, in this embodiment, the second bending assembly 222 is disposed on a side of the positioning seat 211 far from the lower mold 2211, the second bending assembly 222 includes a sliding block 2221 disposed along the length direction of the material conveying rail 12, a sixth air cylinder 2222 for driving the sliding block 2221 to slide back and forth, a seventh air cylinder 2223 fastened to the sliding block 2221 and disposed along the width direction of the material conveying rail 12, and a press head 2224 connected to the seventh air cylinder 2223 for bending the material twice, further, in this embodiment, a support 23 is disposed between the lower mold 2211 and the press head 2224, and the fifth air cylinder 2216 is disposed along the height direction of the support 23.

Through the arrangement of the second bending assembly 222, after two pins of the capacitor 3 are bent once, the pressing head 2224 is driven to press the once-formed horizontal pin arm down to a downward-inclined state under the action of the sixth cylinder 2222 and the seventh cylinder 2223, and then the secondary forming of the pins of the capacitor 3 is completely completed by the repeated operation of the upper die 2212 and the lower die 2211 in the first bending assembly 221.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious modifications, rearrangements and substitutions without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A bending apparatus for pins of an electronic device, comprising:

the material conveying device (1) is used for conveying the materials to be processed to the stations to be bent in sequence;

bending device (2), be provided with wait to bend the station and with feeding device (1) is connected, bending device (2) include with the discharge gate matched with of feeding device (1) connects material subassembly (21), and set up connect the subassembly of bending of the relative both sides of material subassembly (21) and top, the subassembly of bending is including first subassembly (221) of bending that is used for material spare once, and is used for the cooperation first subassembly (221) of bending accomplishes second subassembly (222) of bending of material spare secondary.

2. The bending apparatus for pins of electronic devices according to claim 1, wherein the feeding device (1) comprises a vibrating tray (11), a feeding rail (12) connected to a discharge port of the vibrating tray (11), and a feeding mechanism (13) connected to a discharge port of the feeding rail (12).

3. The bending equipment for the pins of the electronic device according to claim 2, wherein the receiving assembly (21) comprises a positioning seat (211) and a first air cylinder (212) arranged on the lower bottom surface of the workbench and used for driving the positioning seat (211) to ascend and descend.

4. The bending apparatus for pins of electronic devices according to claim 3, wherein the feeding mechanism (13) comprises a carrier (131) disposed at the end of the feeding rail (12) for transferring the material, a feeding seat (132) engaged with the carrier (131), a second cylinder (133) for driving the carrier (131) to slide along the width direction of the feeding rail (12), a feeding member (134) slidably engaged with the carrier (131) and the feeding seat (132), and a third cylinder (135) for driving the feeding member (134) to move back and forth along the length direction of the feeding rail (12).

5. The bending apparatus for electronic device pins according to claim 4, wherein the feeding seat (132) and the carrier (131) are both provided with a slide way penetrating through the positioning seat (211), and the material slides into the receiving position of the positioning seat (211) under the driving action of the feeding member (134).

6. The bending apparatus for electronic device pins according to claim 3, wherein the first bending assembly (221) comprises a lower die (2211) disposed on one side of the positioning seat (211), an upper die (2212) disposed above the positioning seat (211), a fourth cylinder (2215) for driving the lower die (2211) to reciprocate horizontally, and a fifth cylinder (2216) for driving the upper die (2212) to be matched with the lower die (2211).

7. The bending apparatus for pins of electronic devices according to claim 6, wherein the second bending assembly (222) is disposed on a side of the positioning seat (211) away from the lower mold (2211), and the second bending assembly (222) comprises a slider (2221) disposed along a length direction of the feeding rail (12), a sixth cylinder (2222) for driving the slider (2221) to slide back and forth, a seventh cylinder (2223) fastened to the slider (2221) and disposed along a width direction of the feeding rail (12), and a pressing head (2224) connected to the seventh cylinder (2223) for secondary bending of the material.

8. The bending apparatus for electronic device pins as claimed in claim 7, wherein a support (23) is erected between the lower die (2211) and the ram (2224), and the fifth cylinder (2216) is erected along a height direction of the support (23).

9. The bending apparatus for electronic device pins according to claim 6, wherein the middle of the lower end surface of the upper die (2212) is provided with a protrusion (2212a), and the root of the protrusion (2212a) is provided with a circular arc (2212 b).

10. The bending apparatus for electronic device pins as claimed in claim 9, wherein the lower mold (2211) comprises a mold base (2211a) and two molding rods (2211b) extending outside the mold base (2211a) at intervals, and the tops of the two molding rods (2211b) are matched with the circular arcs (2212 b).