CN114570696A - Cleaning device for electronic wafer detection - Google Patents

Abstract

The utility model relates to an electron wafer detects uses belt cleaning device relates to the wafer detection field, and it includes the base station, be equipped with the supporting component who is used for the wafer installation on the base station, be equipped with drive wafer pivoted rotating assembly on the base station, fixedly connected with support frame on the base station, be equipped with the spraying assembly who is used for wasing the wafer on the support frame, spraying assembly includes fixed disk of fixed connection on the support frame, sliding connection is at the slider on the fixed disk and the nozzle of connection on the slider, be equipped with the gliding driving component of drive slider along wafer radius direction on the support frame. The method and the device have the effects of improving the uniformity and the thoroughness of wafer cleaning, and further improving the accuracy of the subsequent test data of the wafer.

Description

Cleaning device for electronic wafer detection

Technical Field

The application relates to the field of wafer detection, in particular to a cleaning device for electronic wafer detection.

Background

A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is. After dissolving, high-purity silicon crystal seed crystals are doped, and then the silicon crystal seed crystals are slowly pulled out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.

In the related art, the wafer is usually placed on a rotatable tray, and then the surface of the wafer is cleaned by spraying through a fixed nozzle.

In view of the above related technologies, the inventor believes that when a wafer rotates on a rotating tray, spraying through a fixed nozzle easily results in that a part of the edge area of the wafer cannot receive sufficient washing pressure of a cleaning solution, resulting in uneven and incomplete cleaning of the wafer, thereby affecting accuracy of subsequent test data of the wafer.

Disclosure of Invention

In order to improve the uniformity and the thoroughness of wafer cleaning and further improve the accuracy of subsequent test data of wafers, the application provides a cleaning device for electronic wafer detection.

The application provides a belt cleaning device for electronic wafer detects adopts following technical scheme:

the utility model provides an electron wafer detects uses belt cleaning device, includes the base station, be equipped with the supporting component who is used for the wafer installation on the base station, be equipped with drive wafer pivoted runner assembly on the base station, fixedly connected with support frame on the base station, be equipped with the subassembly that sprays that is used for wasing the wafer on the support frame, the subassembly that sprays includes fixed connection fixed disk, sliding connection on the support frame are in slider on the fixed disk is with connecting nozzle on the slider, be equipped with the drive on the support frame slider is along the gliding drive assembly of wafer radius direction.

Through adopting above-mentioned technical scheme, place the wafer on supporting component, the nozzle sprays the wafer surface, inform rotating assembly to drive the wafer and rotate, make the nozzle can carry out comprehensive cleanness to wafer circumference, along with the high-speed rotation of wafer, the slider removes along wafer radius direction, clean wafer different positions with the cooperation of pivoted wafer, until after accomplishing the cleanness to wafer edge, realize the thorough washing to the wafer surface, improve the homogeneity and the thoroughness abluent of wafer to improve the accuracy of the follow-up test data of wafer.

Optionally, the slider is provided with one at least along wafer circumferencial direction, drive assembly includes the slide bar of sliding connection on the support frame, the hinge bar of fixed connection at the slide bar tip, fixed connection is the first motor on the support frame, connect the helical gear of first motor output and the helical rack of fixed connection on the slide bar lateral wall, the helical gear with the meshing of helical rack, the hinge bar deviates from slide bar one end with the slider is articulated.

By adopting the technical scheme, the first motor is started to drive the helical gear to rotate, the helical gear is meshed with the helical gear to drive the helical gear and the sliding rod fixedly connected with the helical gear to move in the direction perpendicular to the surface of the base station, so that the hinged rod drives the sliding block to move in the radial direction of the fixed disk, the nozzle is driven to spray the wafer in the radial direction of the wafer, the cleaning effect on the edge of the wafer is improved, the uniformity and the thoroughness of wafer cleaning are improved, and the accuracy of the subsequent test data of the wafer is further improved.

Optionally, the slider exists in pairs, drive assembly includes second motor of fixed connection on the support frame, rotates the drive block of connecting on the fixed disk and articulates two connecting rods at the drive block both ends, the output of second motor with the drive block is connected, two the connecting rod deviates from one of a pair of sliders is connected respectively to the one end of drive block.

By adopting the technical scheme, when the second motor is started, the driving block is driven to swing, so that the two connecting rods swing, the sliding block is driven to slide in a reciprocating manner along the radius direction of the fixed disc, the nozzle is further driven to move in a reciprocating manner along the radius direction of the wafer, the cleaning effect on the surface of the wafer is achieved, the uniformity and the thoroughness of wafer cleaning are improved, and the accuracy of the subsequent test data of the wafer is further improved.

Optionally, at least one driving block is arranged along the direction of the output shaft of the second motor, and when the number of the driving blocks is greater than two, two adjacent driving blocks are fixedly connected through a connecting shaft.

By adopting the technical scheme, in order to improve the cleaning uniformity, at least one driving block, namely at least two connecting rods and two sliding blocks can be arranged, when two driving blocks need to be arranged, four connecting rods and four sliding blocks are needed, so that the analogy is carried out, the number of nozzles in the circumferential direction of the wafer is improved, the cleaning uniformity and thoroughness are improved, and the accuracy of the subsequent test data of the wafer is further improved.

Optionally, a through groove is formed in the fixed disc, the sliding block is connected in the through groove in a sliding mode, a limiting groove is formed in the through groove, a limiting block is fixedly connected to the sliding block, and the limiting block is connected in the limiting groove in a sliding mode.

Through adopting above-mentioned technical scheme, slider sliding connection leads to the inslot, and the setting of stopper and spacing groove plays spacing effect to the slip of slider, reduces the slider and follows the possibility that leads to the inslot and drop.

Optionally, the supporting assembly includes a placing table rotatably connected to the base table and a suction cup located in the placing table, a placing groove for placing the wafer is formed in the placing table, and the suction cup is located in the placing groove.

Through adopting above-mentioned technical scheme, through the suction on the sucking disc, adsorb the wafer in the standing groove, improve the stability of wafer installation, when reducing the high-speed rotation of support wafer, from the possibility that drops in the standing groove.

Optionally, a diversion trench is arranged in the placing trench, the diversion trench is arranged along the circumferential direction of the placing trench, a diversion port is arranged on the placing table, the diversion trench is communicated with the diversion port, a containing tank is arranged on the base station and is located below the diversion port, the containing tank is arranged in a circular ring shape, and a liquid outlet is arranged in the containing tank.

Through adopting above-mentioned technical scheme, the guiding gutter plays the water conservancy diversion effect to the spray water that enters into the standing groove, and the spray water is discharged from the guiding opening through the guiding gutter guiding opening, discharges from the leakage fluid dram after collecting through the holding tank again, reduces in the standing groove spray water and constantly piles up, causes secondary pollution to the wafer, influences the possibility of the follow-up test data accuracy of wafer.

Optionally, the rotating assembly comprises a driving motor connected to the lower portion of the base station, a driving pipe sleeve connected to an output end of the driving motor, and a driving shaft fixedly connected to the placing table, the driving shaft is inserted into the driving pipe sleeve, an inner gear sleeve is fixedly connected to the inside of the driving pipe sleeve, an outer gear sleeve is fixedly sleeved on the driving shaft, and the inner gear sleeve is meshed with the outer gear sleeve.

Through adopting above-mentioned technical scheme, driving motor starts the cooperation through outer tooth cover on interior tooth cover and the drive shaft in the drive tube sleeve, drives the drive shaft and places the platform and rotate to make the high-speed rotation of wafer.

Optionally, the base station bottom is equipped with the speed reduction subassembly, the speed reduction subassembly includes the cylinder of fixed connection in the base station bottom and connects the movable plate at the cylinder output, driving motor fixed connection be in on the movable plate.

Through adopting above-mentioned technical scheme, when the wafer had the risk that drops, the cylinder drove the movable plate and moves down, breaks away from interior tooth cover and outer tooth cover, makes the drive shaft and place the platform and only rotate under the inertia effect to static gradually, the slow deceleration of wafer can reduce suddenly the deceleration and lead to the wafer to collide with placing the platform under the inertia effect, influence the wafer quality, thereby influence the accuracy of follow-up test data.

To sum up, this application includes following beneficial technological effect:

1. through the arrangement of the rotating assembly for driving the wafer to rotate, the sliding block connected to the fixed disc in the radius direction in a sliding mode and the nozzles on the sliding block, the nozzles spray and clean the surface of the wafer along with the rotation of the wafer and move in the radius direction of the wafer, the defect that the edge of the wafer is not uniformly and completely cleaned is overcome, the uniformity and the thoroughness of wafer cleaning are improved, and the accuracy of wafer follow-up test data is improved.

2. Through the arrangement of the speed reduction assembly, the situation that the wafer and the supporting assembly move relatively along with the high-speed rotation of the wafer to cause the separation of the wafer is reduced, the rotating assembly is emergently decelerated, the wafer is slowly stopped, and the possibility of falling of the wafer is reduced.

Drawings

Fig. 1 is a front view of an electronic wafer inspection cleaning apparatus according to embodiment 1 of the present application.

Fig. 2 is a cross-sectional view at a-a in fig. 1.

Fig. 3 is a schematic structural diagram of a cleaning apparatus for electronic wafer inspection in embodiment 1 of the present application.

Fig. 4 is an enlarged view at B in fig. 3.

Fig. 5 is a schematic structural diagram of a cleaning apparatus for electronic wafer inspection in embodiment 2 of the present application.

Fig. 6 is a schematic diagram of a connection structure between two driving blocks in embodiment 2 of the present application.

Description of reference numerals: 1. a base station; 11. accommodating grooves; 12. a liquid discharge port; 13. a support frame; 2. a support assembly; 21. a placing table; 22. a suction cup; 211. a placement groove; 212. a diversion trench; 213. a flow guide port; 3. a spray assembly; 31. fixing the disc; 32. a slider; 33. a nozzle; 311. a through groove; 312. a limiting groove; 321. a limiting block; 34. a connecting plate; 4. a drive assembly; 41. a slide bar; 42. a hinged lever; 43. a first motor; 44. a helical gear; 45. a helical rack; 46. a second motor; 47. a drive block; 48. a connecting rod; 49. a connecting shaft; 5. a rotating assembly; 51. a drive motor; 52. a drive tube sleeve; 53. a drive shaft; 521. an inner gear sleeve; 531. an outer gear sleeve; 6. a speed reduction assembly; 61. a cylinder; 62. and (5) moving the plate.

Detailed Description

The present application is described in further detail below with reference to figures 1-6.

The embodiment of the application discloses belt cleaning device is used in electronic wafer detection.

Example 1

Referring to fig. 1 and 2, the cleaning device for electronic wafer detection comprises a base platform 1, a supporting component 2 for wafer installation is arranged on the base platform 1, a rotating component 5 for driving a wafer to rotate is arranged at the bottom of the base platform 1, a supporting frame 13 is fixedly connected to the base platform 1, the supporting frame 13 is arranged in an L shape, and a spraying component 3 for cleaning the wafer is arranged on the supporting frame 13.

Referring to fig. 2, the supporting component 2 is connected to the placing table 21 on the base table 1 in a rotating manner and is located the sucking disc 22 in the placing table 21, the placing groove 211 used for placing the wafer is arranged at the top of the placing groove 211, the sucking disc 22 is embedded at the bottom of the placing groove 211, a cavity is arranged below the placing groove 211 in the placing table 21, a suction pump is arranged in the cavity, and the suction pump is communicated with the sucking disc 22.

Referring to fig. 2, the rotating assembly 5 includes a driving motor 51 located below the base 1, a driving socket 52 connected to an output end of the driving motor 51, and a driving shaft 53 fixedly connected to the placing table 21, an inner gear sleeve 521 is fixedly connected to the inside of the driving socket 52, an outer gear sleeve 531 is fixedly sleeved on the driving shaft 53, and the inner gear sleeve 521 is engaged with the outer gear sleeve 531.

Referring to fig. 2, a speed reducing assembly 6 is disposed at the bottom of the base station 1, the speed reducing assembly 6 includes a cylinder 61 fixedly connected to the bottom of the base station 1 and a moving plate 62 connected to an output end of the cylinder 61, the driving motor 51 is fixedly connected to the moving plate 62, an output shaft of the driving motor 51 penetrates the moving plate 62, and a main body of the driving motor 51 and the driving pipe sleeve 52 are respectively located at two sides of the moving plate 62.

Referring to fig. 2 and 3, a connecting plate 34 is fixedly connected to a side wall of the supporting frame 13, the spraying assembly 3 includes a fixed disk 31 fixedly connected to the connecting plate 34, a sliding block 32 slidably connected to the fixed disk 31, and a nozzle 33 connected to the sliding block 32, the nozzle 33 is disposed on the sliding block 32 in a penetrating manner and faces the placing groove 211, and the nozzle 33 is connected to a spray pipe and is filled with cleaning water for spraying the wafer.

Referring to fig. 3 and 4, a through groove 311 is formed in the fixed disk 31, the through groove 311 is formed along the radial direction of the fixed disk 31, a limit groove 312 is formed in the inner wall of the through groove 311, the slider 32 is slidably connected in the through groove 311, a limit block 321 is fixedly connected to the side wall of the slider 32, and the limit block 321 is slidably connected in the limit groove 312.

Referring to fig. 2 and 3, at least one sliding block 32 is arranged along the circumferential direction of the wafer, four sliding blocks 32 are arranged in embodiment 1 of the present application, and are uniformly distributed along the circumferential direction of the wafer, and the supporting frame 13 is provided with a driving assembly 4 for driving the sliding block 32 to slide along the radial direction of the wafer.

Referring to fig. 3, the driving assembly 4 includes a sliding rod 41 slidably coupled to the supporting frame 13, a hinge rod 42 fixedly coupled to an end of the sliding rod 41, a first motor 43 fixedly coupled to the supporting frame 13, a helical gear 44 coupled to an output end of the first motor 43, and a helical rack 45 fixedly coupled to a side wall of the sliding rod 41, the helical gear 44 being engaged with the helical rack 45.

Referring to fig. 3, a through hole for the sliding of the sliding rod 41 is formed in the support frame 13, the sliding rod 41 slides along a direction perpendicular to the surface of the base station 1, one end of the hinge rod 42, which is away from the sliding rod 41, is hinged to the side wall of the top of the sliding block 32, and four hinge rods 42 are arranged in cooperation with the sliding block 32.

Referring to fig. 2, the inside guiding gutter 212 of having seted up of standing groove 211, the guiding gutter 212 is the annular setting along standing groove 211 circumference, place and seted up water conservancy diversion mouth 213 on the platform 21, guiding gutter 212 and water conservancy diversion mouth 213 intercommunication, holding tank 11 has been seted up on the base station 1, holding tank 11 is the annular setting, water conservancy diversion mouth 213 deviates from guiding gutter 212 one end and is located holding tank 11 top, along with placing platform 21 and rotating, discharged liquid can drop to annular holding tank 11 in the water conservancy diversion mouth 213, holding tank 11 bottom is equipped with leakage fluid dram 12 for the discharge cleaning solution.

The implementation principle of the embodiment 1 is as follows: firstly, a wafer is placed in the placing groove 211, the wafer is tightly sucked by the sucking disc 22, then the cleaning liquid sprayed out by the nozzle 33 acts on the surface of the wafer, meanwhile, the driving motor 51 works to drive the placing table 21 to rotate, so that the wafer is driven to rotate, the nozzle 33 sprays along the circumferential direction of the wafer, meanwhile, the first motor 43 works to drive the helical gear 44 to rotate, the helical gear 44 is meshed with the helical rack 45, the helical rack 45 and the sliding rod 41 are driven to move along the vertical direction, the hinge rod 42 is driven to swing, so that the sliding block 32 and the nozzle 33 are driven to reciprocate along the radial direction of the wafer, the cleaning effect on the surface of the wafer is improved, the cleaned cleaning water flows from the flow guide groove 212 to the flow guide port 213, then falls into the accommodating groove 11, and is discharged from the liquid discharge port 12.

Example 2

The difference with embodiment 1 is that the sliding blocks 32 of this embodiment need to exist in pairs, and the driving assembly 4 is different, referring to fig. 5 and fig. 6, the driving assembly 4 includes a second motor 46 fixedly connected to the supporting frame 13, a driving block 47 rotatably connected to the fixed disc 31, and two connecting rods 48 hinged at two ends of the driving block 47, an output end of the second motor 46 is connected to the driving block 47, an end of the connecting rod 48 opposite to the driving block 47 is connected to the sliding block 32, and the two connecting rods 48 on the same driving block 47 are respectively connected to one of the sliding blocks 32 in a group.

Referring to fig. 5 and 6, at least one driving block 47 is provided along the output shaft of the second motor 46, and two driving blocks 47 are provided in the embodiment of the present application, and the two driving blocks 47 are vertically arranged and connected through a connecting shaft 49.

The implementation principle of the embodiment 2 is as follows: the second motor 46 works to drive the driving block 47 to rotate, and the driving block 47 drives the two connecting rods 48 to rotate, so as to drive the sliding block 32 to slide in the through slot 311, and further drive the nozzle 33 to move.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (9)

1. A cleaning device for electronic wafer detection comprises a base platform (1), and is characterized in that: be equipped with supporting component (2) that are used for the wafer installation on base station (1), be equipped with drive wafer pivoted runner assembly (5) on base station (1), fixedly connected with support frame (13) is gone up in base station (1), be equipped with spray assembly (3) that are used for wasing the wafer on support frame (13), spray assembly (3) including fixed connection fixed disk (31), sliding connection on support frame (13) are in slider (32) and connection on fixed disk (31) are in nozzle (33) on slider (32), be equipped with the drive on support frame (13) slider (32) are along the gliding drive assembly (4) of wafer radius direction.

2. The cleaning apparatus for electronic wafer inspection according to claim 1, wherein: slider (32) are provided with one at least along wafer circumferencial direction, drive assembly (4) include sliding rod (41) of sliding connection on support frame (13), fixed connection at hinge bar (42) of sliding rod (41) tip, fixed connection first motor (43) on support frame (13), connect helical gear (44) and the helical rack (45) of fixed connection on slide bar (41) lateral wall at first motor (43) output, helical gear (44) with helical rack (45) meshing, hinge bar (42) deviate from slide bar (41) one end with slider (32) are articulated.

3. The cleaning apparatus for electronic wafer inspection according to claim 1, wherein: slider (32) exist in pairs, drive assembly (4) include second motor (46) of fixed connection on support frame (13), rotate drive block (47) of connection on fixed disk (31) and articulate two connecting rods (48) at drive block (47) both ends, the output of second motor (46) with drive block (47) are connected, two connecting rod (48) deviate from one of them in a pair of slider (32) is connected respectively to the one end of drive block (47).

4. The cleaning apparatus for electronic wafer inspection according to claim 3, wherein: at least one driving block (47) is arranged along the direction of an output shaft of the second motor (46), and when the number of the driving blocks (47) is more than two, the two adjacent driving blocks (47) are fixedly connected through a connecting shaft (49).

5. The cleaning apparatus for electronic wafer inspection according to claim 1, wherein: the fixed disk is characterized in that a through groove (311) is formed in the fixed disk (31), the sliding block (32) is connected in the through groove (311), a limiting groove (312) is formed in the through groove (311), a limiting block (321) is fixedly connected to the sliding block (32), and the limiting block (321) is connected in the limiting groove (312) in a sliding mode.

6. The cleaning apparatus for electronic wafer inspection according to claim 1, wherein: the supporting assembly (2) comprises a placing table (21) rotatably connected to the base table (1) and a sucking disc (22) located in the placing table (21), a placing groove (211) used for placing wafers is formed in the placing table (21), and the sucking disc (22) is located in the placing groove (211).

7. The cleaning apparatus for electronic wafer inspection according to claim 6, wherein: the novel liquid discharge device is characterized in that a flow guide groove (212) is formed in the placing groove (211), the flow guide groove (212) is arranged along the circumferential direction of the placing groove (211), a flow guide port (213) is formed in the placing table (21), the flow guide groove (212) is communicated with the flow guide port (213), an accommodating groove (11) is formed in the base platform (1), the accommodating groove (11) is located below the flow guide port (213), the accommodating groove (11) is arranged in a circular ring shape, and a liquid discharge port (12) is formed in the accommodating groove (11).

8. The cleaning apparatus for electronic wafer inspection according to claim 6, wherein: the rotating assembly (5) comprises a driving motor (51) connected to the lower portion of the base platform (1), a driving pipe sleeve (52) connected to the output end of the driving motor (51) and a driving shaft (53) fixedly connected to the placing platform (21), the driving shaft (53) is inserted into the driving pipe sleeve (52), an inner gear sleeve (521) is fixedly connected into the driving pipe sleeve (52), an outer gear sleeve (531) is fixedly sleeved on the driving shaft (53), and the inner gear sleeve (521) is meshed with the outer gear sleeve (531).

9. The cleaning apparatus for electronic wafer inspection according to claim 8, wherein: base station (1) bottom is equipped with speed reduction subassembly (6), speed reduction subassembly (6) are including cylinder (61) of fixed connection in base station (1) bottom and connection movable plate (62) at cylinder (61) output, driving motor (51) fixed connection be in on the movable plate (62).

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