CN114566454A - Method and equipment for determining silicon wafer basket entering position and silicon wafer inserting system - Google Patents

Method and equipment for determining silicon wafer basket entering position and silicon wafer inserting system Download PDF

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Publication number
CN114566454A
CN114566454A CN202210102511.9A CN202210102511A CN114566454A CN 114566454 A CN114566454 A CN 114566454A CN 202210102511 A CN202210102511 A CN 202210102511A CN 114566454 A CN114566454 A CN 114566454A
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basket
silicon wafer
determining
tooth socket
flower basket
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CN202210102511.9A
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CN114566454B (en
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任新刚
鲁战锋
张珊
迪大明
成路
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Longi Green Energy Technology Co Ltd
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Longi Green Energy Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a method, equipment and an inserting piece system for determining the position of a silicon wafer entering a basket, relates to the technical field of silicon wafers, and aims to solve the problem that the yield of the silicon wafers is influenced because the silicon wafers are inaccurate in position and are easy to generate quality abnormity such as edge surface damage, fragments and cards when entering a flower basket. The method for determining the position of the silicon wafer in the basket comprises the following steps: a flower basket is arranged on a base of the sheet inserting machine. When the tooth socket on the uppermost layer of the flower basket is positioned at the bottom of the flower basket, the lower end face position of the tooth socket on the uppermost layer of the flower basket is adjusted to the first position by using a standard silicon wafer. When the tooth socket of the lowermost layer of the flower basket is positioned at the bottom of the flower basket, the position of the lower end face of the tooth socket of the lowermost layer of the flower basket is adjusted by using a standard silicon wafer so as to adjust the position of the lower end face of the tooth socket of the uppermost layer of the flower basket to a second position. And determining the position of each layer of tooth socket before the silicon wafer enters the basket based on the first position, the second position and the tooth socket number of the basket.

Description

Method and equipment for determining silicon wafer basket entering position and silicon wafer inserting system
Technical Field
The invention relates to the technical field of silicon wafers, in particular to a method and equipment for determining the position of a silicon wafer entering a basket and an inserting system.
Background
With the continuous increase of the demand of modern construction for high-efficiency energy, photovoltaic power generation is increasingly emphasized and vigorously developed by countries in the world as one of the important means for utilizing solar energy.
Currently, silicon wafer production is an important link in the photovoltaic industry chain. Generally, silicon wafers are cut from silicon rods, and the cut silicon wafers need to be cleaned. Before the silicon wafer is cleaned, the silicon wafer needs to be separately inserted into a flower basket and then cleaned by a cleaning machine. When the silicon wafer enters the flower basket, if the position of the silicon wafer entering the basket is not accurate, the defects of edge surface damage, fragments, cards and the like are easily caused, and the yield of the silicon wafer is influenced.
Disclosure of Invention
The invention aims to provide a method, equipment and an inserting piece system for determining the position of a silicon wafer entering a basket, which are used for solving the problem that when the silicon wafer enters a flower basket, the basket entering position is inaccurate, and the quality abnormity such as the damage of the edge surface of the silicon wafer, fragments and cards is easily generated, so that the yield of the silicon wafer is influenced.
In order to achieve the above purpose, the invention provides the following technical scheme:
in a first aspect, the invention provides a method for determining a silicon wafer basket-entering position, which is applied to a sheet inserting system, wherein the sheet inserting system comprises a sheet inserting machine and a flower basket, the flower basket is arranged on the sheet inserting machine, and the sheet inserting machine is used for inserting a silicon wafer into the flower basket. The method for determining the position of the silicon wafer in the basket comprises the following steps: installing a flower basket on a base of the sheet inserting machine, wherein the center position of the flower basket is superposed with the center position of the base; when the tooth socket on the uppermost layer of the flower basket is positioned at the bottom of the flower basket, the lower end face position of the tooth socket on the uppermost layer of the flower basket is adjusted to a first position by using a standard silicon wafer; the first position is that the lower end face of the uppermost tooth socket of the flower basket and a basket feeding conveying plate of the sheet inserting machine are positioned on the same plane; when the tooth socket at the lowest layer of the flower basket is positioned at the bottom of the flower basket, the position of the lower end face of the tooth socket at the lowest layer of the flower basket is adjusted by using a standard silicon wafer so as to adjust the position of the lower end face of the tooth socket at the uppermost layer of the flower basket to a second position; when the lower end surface of the tooth socket on the uppermost layer of the flower basket is located at the second position, the lower end surface of the tooth socket on the lowermost layer of the flower basket and a basket feeding conveying plate of the sheet inserting machine are located on the same plane; and determining the position of each layer of tooth socket before the silicon wafer enters the basket based on the first position, the second position and the tooth socket number of the basket.
Under the condition of adopting the technical scheme, the flower basket is arranged at the center of the base of the wafer inserting machine, so that the center of the flower basket is superposed with the center of the base, and therefore, the silicon wafer can be ensured to enter the flower basket at a proper transverse position.
When the tooth socket on the uppermost layer of the flower basket is positioned at the bottom of the flower basket, the lower end face position of the tooth socket on the uppermost layer of the flower basket is adjusted to the first position by using a standard silicon wafer. The first position is that the lower end face of the uppermost tooth groove of the flower basket and a basket entering conveying plate of the sheet inserting machine are located on the same plane. When the tooth socket at the lowest layer of the flower basket is positioned at the bottom of the flower basket, the lower end face position of the tooth socket at the lowest layer of the flower basket is adjusted by using a standard silicon chip so as to adjust the lower end face position of the tooth socket at the uppermost layer of the flower basket to a second position. When the lower end face of the tooth socket on the uppermost layer of the flower basket is located to the second position, the lower end face of the tooth socket on the lowermost layer of the flower basket and a basket feeding conveying plate of the sheet inserting machine are located on the same plane. And then, determining the position of each layer of tooth grooves before the silicon wafers enter the basket based on the first position, the second position and the number of the tooth grooves. It should be understood that, the first position is the lower end face position of the uppermost tooth socket of the basket when the basket starts to insert silicon wafers, and the second position is the lower end face position of the uppermost tooth socket of the basket when the basket starts to insert the last silicon wafer, and since the heights of all the tooth sockets in the basket are the same, the position of each tooth socket can be determined according to the first position and the number of the tooth sockets in the basket. Based on the method, the positions of all layers of tooth grooves of the flower basket can be determined by using the standard silicon wafers before the actual silicon wafers enter the flower basket, so that the actual silicon wafers can enter the flower basket at the accurate positions.
Furthermore, the lower end face of the uppermost tooth socket of the flower basket at the first position is located on the same plane as the basket entering conveying plate of the sheet inserting machine, and when the lower end face of the uppermost tooth socket of the flower basket is located to the second position, the lower end face of the lowermost tooth socket of the flower basket is located on the same plane as the basket entering conveying plate of the sheet inserting machine, so that the position of each layer of tooth socket of the flower basket determined by the first position and the second position can be used for ensuring that actual silicon wafers are always located on the same plane when entering the flower basket. Therefore, the method can avoid the phenomenon that the edge surface of the silicon wafer is damaged due to the collision between the silicon wafer and the teeth of the basket caused by the inaccurate position of the silicon wafer entering the basket, so that the quality abnormal phenomena of fragments or cards and the like are caused, and the yield of the silicon wafer is improved. In addition, the invention determines the position of each layer of tooth grooves before the silicon wafers are put into the basket, thereby saving the debugging time of the tooth grooves of the basket to a certain extent, improving the basket putting speed of the silicon wafers and further improving the efficiency of the whole production process. Therefore, the method for determining the basket entering position can solve the problem that when the silicon wafer enters the flower basket, the basket entering position is inaccurate, and the quality abnormity such as silicon wafer edge surface damage, fragments and cards is easily caused, so that the yield of the silicon wafer is influenced.
In a possible implementation manner, the basket entering conveying plate is used for inserting the silicon wafers into the flower basket, and a conveying plane of the basket entering conveying plate is parallel to the horizontal plane. When the uppermost layer tooth's socket of basket of flowers is located the bottom of basket of flowers, utilize standard silicon chip, the lower terminal surface position of the uppermost layer tooth's socket of adjustment basket of flowers includes to first position: placing a standard silicon wafer on a basket-entering conveying plate; and adjusting the position of the lower end face of the tooth socket on the uppermost layer of the flower basket by using the standard silicon wafer, and determining the position of the lower end face of the tooth socket on the uppermost layer of the flower basket as a first position when the standard silicon wafer enters the tooth socket on the uppermost layer of the flower basket in the horizontal direction.
Under the condition of adopting the technical scheme, the conveying plane of the entering basket conveying plate is parallel to the horizontal plane, and when the standard silicon wafer is placed on the entering basket conveying plate, the position of the lower end face of the tooth socket on the uppermost layer of the flower basket is adjusted, so that the standard silicon wafer can directly enter the tooth socket on the uppermost layer of the flower basket in the horizontal direction. Based on this, before the silicon chip is determined to enter the basket by utilizing the number of the tooth grooves based on the first position, the second position and the basket, when the tooth groove of each layer is positioned, the actual silicon chip can be ensured to enter the tooth groove of the basket in the horizontal direction, the phenomenon that the edge surface of the silicon chip is damaged due to collision of the subsequent silicon chip in the process of entering the basket is avoided, so that the abnormal phenomena of the quality such as fragments or cards are caused, and the yield of the silicon chip is improved.
In one possible implementation manner, when the lowermost gullet of the basket is located at the bottom of the basket, adjusting the lower end face position of the lowermost gullet of the basket using a standard silicon wafer to adjust the lower end face position of the uppermost gullet of the basket to the second position includes: the standard silicon wafer is placed on an in-basket transfer plate. And adjusting the position of the lower end face of the tooth socket at the lowest layer of the flower basket by using the standard silicon wafer, and determining the position of the lower end face of the tooth socket at the uppermost layer of the flower basket as a second position when the standard silicon wafer enters the tooth socket at the lowest layer of the flower basket in the horizontal direction.
Under the condition of adopting above-mentioned technical scheme, the conveying plane of income basket conveying board is parallel with the horizontal plane, and when the standard silicon chip was placed on going into the basket conveying board, the lower terminal surface position of the lower floor's tooth's socket of adjustment basket of flowers for the standard silicon chip can directly get into in the lower floor's tooth's socket of basket of flowers with the horizontal direction. Based on this, before the silicon chip is determined to enter the basket by utilizing the number of the tooth grooves based on the first position, the second position and the basket, when the tooth groove of each layer is positioned, the actual silicon chip can be ensured to enter the tooth groove of the basket in the horizontal direction, the phenomenon that the edge surface of the silicon chip is damaged due to collision of the subsequent silicon chip in the process of entering the basket is avoided, so that the abnormal phenomena of the quality such as fragments or cards are caused, and the yield of the silicon chip is improved.
In one possible implementation mode, the wafer inserting machine comprises a guide assembly connected with one side of the base, and the guide assembly is used for guiding the silicon wafers to be placed into the basket. After the flower basket is arranged on the base of the wafer inserting machine, the method for determining the position of the silicon wafer entering the basket further comprises the following steps: and setting a positioning reference surface on a base of the sheet inserting machine according to the central position of the flower basket and the size of the outer frame of the flower basket. The position of the guide assembly is determined using the positioning datum.
Adopt under the condition of above-mentioned technical scheme, according to the central point of basket of flowers puts and the size of the frame of basket of flowers, fix a position the reference surface in one side position determination of basket of flowers, utilize the reference surface to confirm the position of direction subassembly, when making the direction subassembly treat the silicon chip of income basket and lead to, can let the silicon chip directly get into the basket of flowers along the direction of direction subassembly, avoid the guide position to lead to the fact the silicon chip to collide with the basket of flowers frame production inadequately, lead to the faceted pebble damage of silicon chip, thereby cause quality abnormal phenomena such as piece or card.
In some embodiments, the guide assembly includes first and second oppositely disposed guide plates. Determining the position of the guide assembly using the positioning reference surface includes: and determining the distance between the surface of the first guide plate facing to the side of the second guide plate and the positioning reference surface by utilizing the distance between the positioning reference surface and the tooth root of the flower basket and the difference value between the width of the silicon chip and the width of the tooth groove of the flower basket. And determining the position of the first guide plate by using the positioning reference surface and the distance between the surface of the first guide plate facing to the side of the second guide plate and the positioning reference surface. And determining the position of the second guide plate by using the width of the silicon chip and the position of the first guide plate.
By adopting the technical scheme, the distance between the positioning reference surface and the tooth root of the flower basket and the difference between the width of the silicon wafer and the width of the tooth space of the flower basket are utilized to determine the distance between the first guide plate and the relative positioning reference surface of the second guide plate, then the positioning reference surface and the distance between the first guide plate and the relative positioning reference surface of the second guide plate are utilized to determine the installation position of the first guide plate, and finally, the installation position of the second guide plate is determined by utilizing the installation position of the first guide plate and the width of the silicon wafer, so that when a guide assembly guides the silicon wafer to be fed into the basket, the first guide plate is used as the reference, the allowance is remained at one side close to the second guide plate, the tolerance rate of the wafer inserting machine is improved, and when tolerance fluctuation of silicon wafer product production occurs, the collision between the silicon wafer and the flower basket can be avoided, the edge surface of the silicon wafer is damaged, and thus the abnormal phenomena of the quality such as fragments or cards are caused.
In a possible implementation manner, before the silicon wafer is placed into the basket and after the position of each layer of tooth socket is determined based on the first position, the second position and the number of tooth sockets of the basket, the method for determining the position of the silicon wafer in the basket further includes: and before the actual silicon wafer enters the corresponding layer of tooth grooves of the basket, adjusting the position of the upper end face of the corresponding layer of tooth grooves by using the thickness of the standard silicon wafer and the thickness of the actual silicon wafer.
By adopting the technical scheme, the position of the upper end surface of the corresponding layer of tooth grooves is adjusted by utilizing the difference between the thickness of the standard silicon wafer and the thickness of the actual silicon wafer, so that the height of the corresponding layer of tooth grooves can be adapted to the thicknesses of the silicon wafers with different specifications, the silicon wafers with different specifications can smoothly enter the tooth grooves of the basket, and the silicon wafers are further prevented from colliding with the teeth of the basket.
In some examples, before the actual silicon wafer enters the corresponding layer tooth socket of the basket, the position of the upper end face of the corresponding layer tooth socket is adjusted by using the thickness of a standard silicon wafer and the thickness of the actual silicon wafer, and the formula is satisfied, wherein B is A- (H)1-H2) C, wherein: b is the position of the upper end surface of the corresponding layer of tooth socket before the actual silicon wafer enters the basket, A is the position of the upper end surface of the corresponding layer of tooth socket after the standard silicon wafer enters the basket, and H1Is the thickness of a standard silicon wafer, H2C is the unit pulse value of a motor for driving the flower basket to lift.
Under the condition of adopting the technical scheme, when the position of the upper end face of the tooth socket of the corresponding layer is adjusted, the adjusted position can be refined according to the formula, so that the adjusted tooth socket can adapt to the thicknesses of silicon wafers with different specifications, the silicon wafers with different specifications can smoothly enter the tooth socket of the flower basket in a coupling manner, and the silicon wafers are further prevented from colliding with the teeth of the flower basket when entering the basket. In addition, the positions of the teeth of the flower basket can be set in advance by calculating and adjusting the positions of the upper end surfaces of the tooth grooves of the corresponding layers before the actual silicon wafers enter the basket, so that the adjustment time of the teeth of the flower basket can be shortened, and the basket entering speed of the silicon wafers is improved.
In a possible implementation manner, when the gullet at the uppermost layer of the basket is located at the bottom of the basket, the method for determining the position of the silicon wafer entering the basket further includes, by using a standard silicon wafer, adjusting the position of the lower end surface of the gullet at the uppermost layer of the basket to be before the first position: and determining the fixed position of the basket entering conveying plate by utilizing the distance between two adjacent basket toothed bars of the baskets along the conveying direction of the silicon wafers.
Adopt under the condition of above-mentioned technical scheme, utilize the distance between two adjacent basket of flowers ratchets of basket of flowers, confirm to go into the basket conveying board and stretch into the inside distance of basket of flowers, can avoid the silicon chip through going into the basket conveying board and get into the basket of flowers when inside, the whereabouts of silicon chip front end causes the scraping or collides with.
In a second aspect, the present invention further provides an apparatus for determining a position of a silicon wafer entering a basket, including a processor and a communication interface, where the communication interface is coupled to the processor, and the processor is configured to run a computer program or instructions to implement the method for determining a position of a silicon wafer entering a basket described in the first aspect or any possible implementation manner of the first aspect.
Compared with the prior art, the beneficial effects of the device for determining the position of the silicon wafer entering the basket provided by the invention are the same as those described in the first aspect or any possible implementation manner of the first aspect, and are not described herein again.
In a third aspect, the present invention further provides a tab system, comprising: the silicon wafer inserting machine comprises a wafer inserting machine, a flower basket and a device for determining the position of the silicon wafer inserting basket. The flower basket is arranged on the wafer inserting machine, and the silicon wafer basket entering position determining device is in communication connection with the wafer inserting machine and the flower basket.
Compared with the prior art, the beneficial effects of the silicon wafer inserting system provided by the invention are the same as the beneficial effects of the method for determining the position of the silicon wafer inserting basket described in the first aspect or any possible implementation manner of the first aspect, and the description is omitted here.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a flow chart of a method for determining a silicon wafer loading position according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a blade system according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a tab system according to an embodiment of the present invention;
FIG. 4 is a side view of a schematic structural diagram of a tab system according to an embodiment of the present invention;
FIG. 5 is a front view of a schematic construction of a tab system according to an embodiment of the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 5;
fig. 7 is a schematic hardware structure diagram of a device for determining a position of a silicon wafer entering a basket according to an embodiment of the present invention.
Reference numerals:
10-standard silicon chip, 11-basket-entering conveying plate,
12-a base, 121-a positioning reference plane,
13-a fixed assembly, 14-a conveyor motor,
15-plate shaft, 16-guide component,
161-first guide plate, 162-second guide plate,
17-a motor, 21-a basket toothed bar,
211-a first basket toothed bar, 212-a second basket toothed bar,
213-third basket toothed bar, 221-root of basket,
23-U-shaped plate.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
FIG. 1 illustrates a flow chart of a method for determining the position of a silicon wafer entering a basket according to an embodiment of the present invention. Fig. 2 to fig. 5 illustrate schematic structural diagrams of the tab system provided by the embodiment of the invention. The method for determining the position of the silicon wafer in the basket can be applied to a wafer inserting system, wherein the wafer inserting system comprises a wafer inserting machine and a flower basket, the flower basket is arranged on the wafer inserting machine, and the wafer inserting machine is used for inserting the silicon wafer into the flower basket.
Referring to fig. 1 to 5, a method for determining a position of a silicon wafer in a basket according to an embodiment of the present invention includes:
s101, mounting a flower basket on a base 12 of the inserting machine, wherein the center position of the flower basket is overlapped with the center position of the base 12.
When the silicon wafer inserting machine is implemented specifically, the central position of the base 12 of the silicon wafer inserting machine and the central position of the flower basket need to be confirmed firstly, under the condition that the central position of the flower basket coincides with the central position of the base 12 of the silicon wafer inserting machine, the area where the flower basket is located at the moment is the position where the flower basket needs to be fixed, the flower basket is clamped in the area by the fixing component 13 on the side face of the base 12 of the silicon wafer inserting machine, the flower basket can be fixed on the base 12 of the silicon wafer inserting machine, the phenomenon that the flower basket shakes or shifts when a silicon wafer is inserted into the flower basket is avoided, and the silicon wafer can be enabled to enter the flower basket in a proper transverse position.
S102, when the tooth socket on the uppermost layer of the flower basket is located at the bottom of the flower basket, the lower end face position of the tooth socket on the uppermost layer of the flower basket is adjusted to the first position by using the standard silicon wafer 10. The first position is that the lower end face of the uppermost tooth groove of the flower basket and a basket entering conveying plate 11 of the sheet inserting machine are positioned on the same plane.
As shown in fig. 2 to 5, the wafer inserting machine includes a basket-in conveying plate 11, the basket-in conveying plate 11 is used for inserting silicon wafers into the flower basket, and a conveying plane of the basket-in conveying plate 11 is parallel to a horizontal plane. The conveying driving assembly comprises a conveying motor 14 and a plate shaft 15 which are positioned on the side surface of the basket entering conveying plate 11 and are used for driving the standard silicon wafers 10 to move towards the basket of flowers.
For example, when the uppermost spline of the basket is located at the bottom of the basket, adjusting the lower end surface position of the uppermost spline of the basket to the first position using the standard silicon wafer 10 includes: placing a standard silicon wafer 10 on a basket-entering conveying plate 11; and adjusting the position of the lower end surface of the tooth socket on the uppermost layer of the flower basket by using the standard silicon wafer 10, and determining the position of the lower end surface of the tooth socket on the uppermost layer of the flower basket as a first position when the standard silicon wafer 10 enters the tooth socket on the uppermost layer of the flower basket in the horizontal direction.
In specific implementation, a piece of standard silicon wafer 10 is placed on the adjusted basket entering conveying plate 11, and the position of the lower end face of the uppermost tooth socket of the flower basket is adjusted to be overlapped with the conveying plane of the basket entering conveying plate 11. Meanwhile, the enabling of the transmission motor 14 is cancelled, the plate shaft 15 is rotated manually, and the standard silicon wafer 10 is moved towards the flower basket, so that the standard silicon wafer 10 can smoothly enter the tooth socket on the uppermost layer of the flower basket. If the standard silicon wafer 10 cannot smoothly enter the flower basket at this time, the position of the lower end face of the tooth socket on the uppermost layer of the flower basket needs to be finely adjusted to move up and down until the standard silicon wafer 10 can smoothly enter the tooth socket on the uppermost layer of the flower basket, and the position of the lower end face of the tooth socket on the uppermost layer of the flower basket at this time is determined to be the first position.
In addition, when the position of the lower end surface of the tooth socket on the uppermost layer of the flower basket is finely adjusted, the moving speed of the lower end surface of the tooth socket on the uppermost layer of the flower basket can be reduced, the lower end surface of the tooth socket on the uppermost layer of the flower basket can be more finely operated, and the adjustment of the lower end surface of the tooth socket on the uppermost layer of the flower basket to a required position is facilitated.
Based on this, the conveying plane of going into basket conveying board 11 is parallel with the horizontal plane, when standard silicon chip 10 was placed on going into basket conveying board 11, the lower terminal surface position of the superiors 'tooth's socket of adjustment basket of flowers for standard silicon chip 10 can directly get into the superiors 'tooth's socket of basket of flowers with the horizontal direction, can avoid the silicon chip to produce colliding with at the in-process that gets into the basket of flowers, lead to the faceted pebble damage of silicon chip, thereby cause quality abnormal phenomena such as piece or card, the yield of silicon chip has been improved.
S103, when the tooth socket of the lowest layer of the flower basket is located at the bottom of the flower basket, the lower end face position of the tooth socket of the lowest layer of the flower basket is adjusted by using the standard silicon wafer 10, so that the lower end face position of the tooth socket of the uppermost layer of the flower basket is adjusted to the second position. When the lower end face of the tooth socket on the uppermost layer of the flower basket is located to the second position, the lower end face of the tooth socket on the lowermost layer of the flower basket and the basket entering conveying plate 11 of the sheet inserting machine are located on the same plane.
For example, when the lowest tooth grooves of the basket are located at the bottom of the basket, adjusting the lower end surface positions of the lowest tooth grooves of the basket using the standard silicon wafer 10 to adjust the lower end surface positions of the uppermost tooth grooves of the basket to the second position includes: a standard silicon wafer 10 is placed on the basket entry transfer plate 11. And adjusting the position of the lower end face of the lowest tooth socket of the flower basket by using the standard silicon wafer 10, and determining the position of the lower end face of the uppermost tooth socket of the flower basket as a second position when the standard silicon wafer 10 enters the lowest tooth socket of the flower basket in the horizontal direction.
In specific implementation, a second piece of standard silicon wafer 10 is placed on the basket entering conveying plate 11, and the position of the lower end face of the tooth socket at the lowest layer of the flower basket is adjusted to be overlapped with the conveying plane of the basket entering conveying plate 11. And manually rotating the plate shaft 15 to move the standard silicon wafer 10 towards the basket, so that the standard silicon wafer 10 can smoothly enter the tooth socket at the lowest layer of the basket. If the standard silicon wafer 10 cannot smoothly enter the flower basket at this time, the position of the lower end face of the lowest tooth socket of the flower basket needs to be finely adjusted to move up and down until the standard silicon wafer 10 can smoothly enter the uppermost tooth socket of the flower basket, and the position of the lower end face of the uppermost tooth socket of the flower basket is determined to be the second position at this time.
Similarly, when the position of the lower end face of the tooth socket of the lowermost layer of the basket is finely adjusted, the moving speed of the lower end face of the tooth socket of the lowermost layer of the basket can be reduced, so that the lower end face of the tooth socket of the lowermost layer of the basket can be more finely operated, and the lower end face of the tooth socket of the lowermost layer of the basket can be favorably adjusted to a required position.
Based on this, go into basket conveying board 11's transfer plane and horizontal plane parallel, place into basket conveying board 11 on standard silicon chip 10, the lower terminal surface position of the lower floor's tooth's socket of adjustment basket of flowers for standard silicon chip 10 can directly get into the lower floor's tooth's socket of basket of flowers with the horizontal direction in, avoid the silicon chip to collide with in-process that gets into the basket of flowers and produce, lead to the faceted pebble damage of silicon chip, thereby cause quality abnormal phenomena such as piece or card, the yield of silicon chip has been improved.
And S104, determining the position of each layer of tooth grooves before the silicon wafer enters the basket based on the first position, the second position and the number of tooth grooves of the basket.
In specific implementation, the overall height of the spline of the basket can be calculated according to the first position and the second position. After the number of the silicon wafers to be loaded is set, the positions of the lower end faces of the tooth sockets of other layers can be equally divided according to set data, and the lower end face of each layer of tooth socket can be adjusted to a corresponding position to determine the position of each layer of tooth socket before the actual silicon wafers are put into the basket. Based on the above, the embodiment of the invention can determine the position of each layer of tooth groove before the silicon wafer enters the basket under the condition of ensuring that the silicon wafer smoothly enters the basket, thereby saving the debugging time of the position of each layer of tooth groove and improving the efficiency of the silicon wafer entering the basket.
By adopting the technical scheme, the embodiment of the invention can install the flower basket at the central position of the base 12 of the wafer inserting machine, so that the central position of the flower basket is superposed with the central position of the base 12, and the silicon wafer can be ensured to enter the flower basket at a proper transverse position.
When the tooth socket on the uppermost layer of the flower basket is positioned at the bottom of the flower basket, the lower end face position of the tooth socket on the uppermost layer of the flower basket is adjusted to the first position by using the standard silicon wafer 10. The first position is that the lower end face of the uppermost tooth groove of the flower basket and a basket entering conveying plate 11 of the sheet inserting machine are positioned on the same plane. When the lowest layer tooth socket of the flower basket is positioned at the bottom of the flower basket, the lower end face position of the lowest layer tooth socket of the flower basket is adjusted by using the standard silicon wafer 10 so as to adjust the lower end face position of the uppermost layer tooth socket of the flower basket to a second position. When the lower end face of the tooth socket on the uppermost layer of the flower basket is located to the second position, the lower end face of the tooth socket on the lowermost layer of the flower basket and the basket entering conveying plate 11 of the slice inserting machine are located on the same plane. And then, determining the position of each layer of tooth grooves before the silicon wafers enter the basket based on the first position, the second position and the number of the tooth grooves. It should be understood that, the first position is the lower end face position of the uppermost tooth socket of the basket when the basket starts to insert silicon wafers, and the second position is the lower end face position of the uppermost tooth socket of the basket when the basket starts to insert the last silicon wafer, and since the heights of all the tooth sockets in the basket are the same, the position of each tooth socket can be determined according to the first position and the number of the tooth sockets in the basket. Based on this, the embodiment of the invention can determine the position of each layer of tooth grooves of the flower basket before the actual silicon wafer enters the flower basket by using the standard silicon wafer 10, so as to ensure that the actual silicon wafer can enter the flower basket at an accurate position.
Moreover, the lower end face of the uppermost tooth socket of the flower basket at the first position and the basket entering conveying plate 11 of the sheet inserting machine are located on the same plane, and when the lower end face of the uppermost tooth socket of the flower basket is located to the second position, the lower end face of the lowermost tooth socket of the flower basket and the basket entering conveying plate 11 of the sheet inserting machine are located on the same plane. Therefore, the embodiment of the invention can avoid the phenomenon that the edge surface of the silicon wafer is damaged due to the collision between the silicon wafer and the teeth of the basket due to the inaccurate position of the silicon wafer entering the basket, so that the abnormal quality phenomena of fragments, cards and the like are caused, and the yield of the silicon wafer is improved. In addition, because the position of each layer of tooth groove is determined before the silicon wafers are put into the basket, the debugging time of the tooth grooves of the flower basket can be saved to a certain extent, the basket putting speed of the silicon wafers is increased, and the efficiency of the whole production process is further improved. Therefore, the method for determining the basket entering position provided by the embodiment of the invention can solve the problem that the yield of the silicon wafers is influenced because the basket entering position is inaccurate, and the quality abnormity such as edge surface damage, fragments and cards is easily generated when the silicon wafers enter the basket.
Note that, in step S101: install the basket of flowers on insert machine's base 12, wherein, before the central point of basket of flowers put and the central point of base 12 puts the coincidence, still need carry out the adjustment of horizontal direction to the frame of income basket conveying board 11, base 12 and basket of flowers promptly U template 23, use instruments such as level bar, spirit level and interior hexagonal spanner to calibrate the levelness of these several parts, in order to reduce the position error in the height, when making follow-up silicon chip go into the basket, can not be because of going into basket conveying board 11, the U template 23 horizontal plane of base 12 and basket of flowers is uneven, and then lead to the silicon chip to go into the basket position and produce bigger deviation.
In one possible implementation, as shown in fig. 2 to 5, the wafer inserting machine comprises a guide assembly 16 connected to one side of the base 12, wherein the guide assembly 16 is used for guiding the silicon wafers to be put into the basket. In step S101: after the flower basket is installed on the base 12 of the wafer inserting machine, the method for determining the position of the silicon wafer entering the basket further comprises the following steps: the positioning reference surface 121 is set on the base 12 of the sheet inserting machine in accordance with the center position of the basket and the size of the outer frame of the basket. The position of the guide assembly 16 is determined using the positioning reference surface 121.
In practical application, the width d of the outer frame of the flower basket, that is, the U-shaped plate 23 is measured, and after the fixing assembly 13 fixes the flower basket on the base 12, the center line of the flower basket parallel to the silicon wafer basket entering direction is shifted 1/2d to the side away from the fixing assembly 13, and the plane where the center line is perpendicular to the base 12 is the positioning reference plane 121. After the positioning reference surface 121 is determined, the installation position of the guide assembly 16 is determined based on the positioning reference surface 121, and finally, the guide assembly 16 is installed at the measured fixing position.
Adopt under the condition of above-mentioned technical scheme, according to the central point of basket of flowers puts and the size of the frame of basket of flowers, fix a position reference face 121 in one side position of basket of flowers, utilize the reference face to confirm the position of direction subassembly 16, when making direction subassembly 16 treat the silicon chip of income basket to lead to, can let the silicon chip directly get into the basket of flowers along the direction of direction subassembly 16, avoid the guide position to lead to the fact the silicon chip to collide with the basket of flowers frame production inadequately, lead to the faceted pebble damage of silicon chip, thereby cause quality abnormal phenomena such as piece or card.
In some embodiments, as shown in fig. 2, 3, and 5, the guide assembly 16 includes a first guide plate 161 and a second guide plate 162 that are oppositely disposed. Determining the position of the guide assembly 16 using the positioning reference surface 121 includes: the distance of the surface of the first guide plate 161 facing the second guide plate 162 with respect to the positioning reference surface 121 is determined by the distance between the positioning reference surface 121 and the root 221 of the basket, and the difference between the width of the silicon wafer and the width of the tooth space of the basket. The position of the first guide plate 161 is determined by the positioning reference surface 121 and the distance of the surface of the first guide plate facing the second guide plate 162 side from the positioning reference surface 121. The position of the second guide plate 162 is determined using the width of the silicon wafer, and the position of the first guide plate 161.
In practice, as shown in fig. 5 and 6, the distance between the positioning reference surface 121 and the root 221 of the basket is measured as L1Measuring the difference between the width of the silicon chip and the width of the corresponding layer tooth space as E, and calculating L21/3E, the distance L between the position of the surface of the first guide plate 161 facing the second guide plate 162 and the positioning reference surface 121 is determined to be L1+L2。
In the above embodiment, the width of the silicon wafer is the length of the edge of the silicon wafer perpendicular to the moving direction of the silicon wafer into the basket, and the width of the tooth socket is the distance between the tooth roots of the same layer of baskets on the opposite basket toothed bars 21, i.e. the distance between the tooth roots on two sides in the same layer of tooth sockets of the second basket toothed bar 212 and the third basket toothed bar 213.
The side of the silicon wafer close to the first guide bar is set as the first side of the silicon wafer, and the side of the silicon wafer close to the second guide plate 162 is set as the second side of the silicon wafer. It can be understood that when the silicon wafer enters the basket along the first guide plate 161, the friction between the first side of the silicon wafer and the root 221 of the basket can be avoided due to the distance of 1/3E between the first side of the silicon wafer and the root 221 of the basket, and at the same time, the distance of 2/3E between the second side of the silicon wafer and the corresponding root 221 of the basket can accommodate tolerance fluctuation and other deviations of the silicon wafer while avoiding the friction between the first side of the silicon wafer and the root of the basket.
Based on this, the distance between the positioning reference plane 121 and the root of the basket and the difference between the width of the silicon wafer and the width of the tooth space of the basket can be used to determine the distance between the first guide plate 161 and the positioning reference plane 121 facing the surface of the second guide plate 162, then the mounting position of the first guide plate 161 can be determined by using the positioning reference plane 121 and the distance between the positioning reference plane 121 and the surface of the first guide plate 161 facing the second guide plate 162, finally, the mounting position of the second guide plate 162 is determined by using the mounting position of the first guide plate 161 and the width of the silicon wafer, so that when the guide assembly 16 guides the silicon wafer to be placed into the basket, the allowance can be left on the side close to the second guide plate 162 by using the first guide plate 161 as a reference, the tolerance rate of the wafer inserting machine is improved, and when tolerance fluctuation of the silicon wafer product production is encountered, the collision between the silicon chip and the flower basket can be avoided, so that the edge surface of the silicon chip is damaged, and the abnormal phenomena of fragments or cards and the like can be avoided.
In one possible implementation, in step S104: the method for determining the position of the silicon wafer entering the basket before the silicon wafer enters the basket and after the position of each layer of tooth grooves is determined based on the first position, the second position and the number of tooth grooves of the basket, further comprises the following steps: and before the actual silicon wafer enters the corresponding layer of tooth grooves of the basket, adjusting the position of the upper end surface of the corresponding layer of tooth grooves by using the thickness of the standard silicon wafer 10 and the thickness of the actual silicon wafer.
Based on this, the position of the upper end face of the tooth socket of the corresponding layer is adjusted by utilizing the difference between the thickness of the standard silicon wafer 10 and the thickness of the actual silicon wafer, so that the height of the tooth socket of the corresponding layer can be adapted to the thicknesses of the silicon wafers with different specifications, the silicon wafers with different specifications can smoothly enter the tooth socket of the basket, and the silicon wafers are further prevented from colliding with the teeth of the basket.
In some examples, before the actual silicon wafer enters the corresponding layer tooth socket of the basket, the position of the upper end face of the corresponding layer tooth socket is adjusted by using the thickness of the standard silicon wafer 10 and the thickness of the actual silicon wafer, and the formula is satisfied, wherein B is a- (H- (a ═ B —)1-H2) C, wherein: b is the position of the upper end surface of the corresponding layer of tooth socket before the actual silicon wafer enters the basket, A is the position of the upper end surface of the corresponding layer of tooth socket after the standard silicon wafer 10 enters the basket, and H1Is the thickness of a standard silicon wafer 10, H2C is the unit pulse value of the motor 17 for driving the flower basket to lift and fall.
The thickness is the height of the standard silicon wafer 10 and the actual silicon wafer in the vertical direction when the silicon wafers are horizontally placed. Because the silicon chip of actual production has product tolerance fluctuation, consequently also can have the deviation with between the thickness of standard silicon chip 10, adjust the position of the up end of corresponding layer tooth's socket, be the thickness that satisfies actual silicon chip that can be better for the thickness of tooth's socket layer, avoid because the existence of deviation, the tooth's socket that leads to holding standard silicon chip 10 can not hold actual silicon chip for actual silicon chip gets into the basket unsmooth.
In the present embodiment, C in the above equation may be 0.001 as the unit pulse value of the motor 17 for driving the basket to ascend and descend, and therefore, when B is adjusted, B ═ a — (H) may be used in the above equation1-H2)/2*0.001. The unit pulse value is related to the motor 17 for driving the basket to lift and lower, and is not limited herein.
Based on the above, when the position of the upper end face of the tooth socket of the corresponding layer is adjusted, the adjusted position can be refined according to the formula, so that the adjusted tooth socket can adapt to the thicknesses of silicon wafers with different specifications, the silicon wafers with different specifications can smoothly enter the tooth socket of the basket, and the silicon wafers are further prevented from colliding with the teeth of the basket when entering the basket. In addition, the positions of the teeth of the flower basket can be set in advance by calculating and adjusting the positions of the upper end surfaces of the tooth grooves of the corresponding layers before the actual silicon wafers enter the basket, so that the silicon wafers can smoothly enter the flower basket, the adjustment time of the teeth of the flower basket can be shortened, and the basket entering speed of the silicon wafers is improved.
As shown in fig. 2-4, in some embodiments, at step S102: when the tooth socket on the uppermost layer of the flower basket is positioned at the bottom of the flower basket, the method for determining the position of the silicon wafer entering the basket further comprises the following steps of adjusting the position of the lower end face of the tooth socket on the uppermost layer of the flower basket to a first position by using a standard silicon wafer 10: the fixing position of the basket entering conveying plate 11 is determined by the distance between two adjacent basket toothed bars 21 of the baskets in the conveying direction of the silicon wafers.
In specific implementation, the distance between two adjacent basket toothed bars 21 of the basket, i.e. the distance d between the first basket toothed bar 211 and the second basket toothed bar 212, is determined, so as to determine the distance L that the front end of the basket-entering conveying plate 11 extends into the basket3. As can be seen from fig. 2 and 4, the first basket teeth bar 211 and the second basket teeth bar 212 are disposed along the silicon wafer transferring direction. In order to prevent the silicon chip from scraping or colliding due to the falling of the front end of the silicon chip when the silicon chip enters the flower basket through the basket conveying plate 11, the distance L from the front end of the basket conveying plate 11 to the inside of the flower basket is3The formula needs to be satisfied: 1/3d < L3< 3/4 d. Preferably, L3＝2/3d。
Based on this, utilize the distance between two basket of flowers ratchets 21 that the basket of flowers is adjacent to be set up, confirm to go into basket conveying board 11 and stretch into the inside distance of basket of flowers, just can avoid the silicon chip when getting into basket conveying board 11 entering basket of flowers inside, the silicon chip front end whereabouts causes the scraping or collides with.
Referring to fig. 7, the actions performed by the silicon wafer basket position determining apparatus may be stored as computer instructions in the memory 320 of the silicon wafer basket position determining apparatus, and the computer instructions stored in the memory 320 may be executed by the processor 310.
The silicon wafer basket entry position determining apparatus 300 includes a processor 310 and a communication interface 330, the communication interface 330 being coupled to the processor 310, the processor 310 being configured to execute a computer program or instructions. The silicon wafer basket entering position determining device 300 can be communicated with the wafer inserting machine and the motor 17 for driving the flower basket to ascend and descend through the communication interface 330.
As shown in fig. 7, the processor 310 may be a general-purpose Central Processing Unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more ics for controlling the execution of programs according to the present invention. The communication interface 330 may be one or more. The communication interface 330 may use any transceiver or the like for communicating with other devices or communication networks.
As shown in fig. 7, the silicon wafer basket position determining apparatus 300 may further include a communication line 340. Communication link 340 may include a path to communicate information between the aforementioned components.
Optionally, as shown in fig. 7, the silicon wafer basket position determining apparatus 300 may further include a memory 320. The memory 320 is used to store computer instructions for performing aspects of the present invention and is controlled for execution by the processor 310. Processor 310 is operative to execute computer instructions stored in memory 320.
As shown in fig. 7, the memory 320 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a Random Access Memory (RAM) or other types of dynamic storage devices that can store information and instructions, an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compact disc, laser disc, optical disc, digital versatile disc, blu-ray disc, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer, but is not limited to such. The memory 320 may be separate and coupled to the processor 310 via a communication line 340. The memory 320 may also be integrated with the processor 310.
Optionally, the computer instructions in the embodiment of the present invention may also be referred to as application program codes, which is not specifically limited in the embodiment of the present invention.
In particular implementations, as one embodiment, processor 310 may include one or more CPUs, such as CPU0 and CPU1 in fig. 7, as shown in fig. 7.
In one embodiment, as shown in fig. 7, the silicon wafer basket entering position determining apparatus 300 may comprise a plurality of processors 310, such as the processor 310 and the processor 350 in fig. 7. Each of these processors may be a single core processor or a multi-core processor.
The embodiment of the invention also provides a computer readable storage medium. The computer readable storage medium stores instructions that, when executed, implement the functions performed by the silicon wafer basket position determining apparatus in the above embodiments.
The embodiment of the invention also provides a chip, which is applied to a wafer inserting system, and comprises at least one processor and a communication interface, wherein the communication interface is coupled with the at least one processor, and the processor is used for executing instructions so as to realize the functions executed by the device for determining the position of the silicon wafer entering the basket in the embodiment.
In the above embodiments, all or part of the implementation may be realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer programs or instructions. The procedures or functions of the embodiments of the invention are performed in whole or in part when the computer program or instructions are loaded and executed on a computer. The computer may be a general purpose computer, a special purpose computer, a computer network, a terminal, user equipment, or other programmable device. The computer program or instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer program or instructions may be transmitted from one website site, computer, server, or data center to another website site, computer, server, or data center by wire or wirelessly. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that integrates one or more available media. The available media may be magnetic media, such as floppy disks, hard disks, magnetic tape; or optical media such as Digital Video Disks (DVDs); it may also be a semiconductor medium, such as a Solid State Drive (SSD).
An embodiment of the present invention further provides a sheet insertion system, including: the silicon wafer inserting machine comprises a wafer inserting machine, a flower basket and a device for determining the position of the silicon wafer inserting basket. The flower basket is arranged on the wafer inserting machine, and the determining equipment for the position of the silicon wafer entering the flower basket is in communication connection with the wafer inserting machine and the flower basket.
Compared with the prior art, the beneficial effects of the silicon wafer inserting system provided by the embodiment of the invention are the same as those of the silicon wafer basket entering position determining method, and the detailed description is omitted here.
While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
While the invention has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the invention. Accordingly, the specification and figures are merely exemplary of the invention as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such modifications and variations.

Claims (10)

1. The method for determining the silicon wafer basket entering position is applied to a wafer inserting system, the wafer inserting system comprises a wafer inserting machine and a flower basket, the flower basket is arranged on the wafer inserting machine, and the wafer inserting machine is used for inserting a silicon wafer into the flower basket, and is characterized in that the method for determining the silicon wafer basket entering position comprises the following steps:
the flower basket is mounted on a base of the sheet inserting machine, wherein the center position of the flower basket is superposed with the center position of the base;
when the tooth socket on the uppermost layer of the flower basket is positioned at the bottom of the flower basket, the position of the lower end surface of the tooth socket on the uppermost layer of the flower basket is adjusted to a first position by using a standard silicon wafer; the lower end face of the uppermost tooth socket of the flower basket and a basket entering conveying plate of the sheet inserting machine are located on the same plane in the first position;
when the tooth socket at the lowest layer of the flower basket is positioned at the bottom of the flower basket, the lower end surface position of the tooth socket at the lowest layer of the flower basket is adjusted by utilizing the standard silicon wafer so as to adjust the lower end surface position of the tooth socket at the uppermost layer of the flower basket to a second position; when the lower end surface of the tooth socket on the uppermost layer of the flower basket is located at a second position, the lower end surface of the tooth socket on the lowermost layer of the flower basket and a basket feeding conveying plate of the sheet inserting machine are located on the same plane;
And determining the position of each layer of tooth socket before the silicon wafers enter the basket based on the first position, the second position and the tooth socket number of the basket.
2. The method for determining the silicon wafer basket-entering position according to claim 1, wherein the basket-entering conveying plate is used for inserting the silicon wafers into the flower basket, and a conveying plane of the basket-entering conveying plate is parallel to a horizontal plane;
when the superiors 'tooth's socket of basket of flowers is located when the bottom of basket of flowers, utilize standard silicon chip, the adjustment the lower terminal surface position to the first position of the superiors 'tooth's socket of basket of flowers includes:
placing the standard silicon wafer on the basket entering conveying plate;
and adjusting the position of the lower end face of the tooth socket on the uppermost layer of the flower basket by using the standard silicon wafer, and determining the position of the lower end face of the tooth socket on the uppermost layer of the flower basket as a first position when the standard silicon wafer enters the tooth socket on the uppermost layer of the flower basket in the horizontal direction.
3. The method for determining the silicon wafer basket entering position according to claim 2, wherein the adjusting the lower end surface position of the lowest tooth socket of the basket to the second position by using the standard silicon wafer when the lowest tooth socket of the basket is located at the bottom of the basket comprises:
Placing the standard silicon wafer on the basket entering conveying plate;
and adjusting the position of the lower end face of the tooth socket at the lowest layer of the flower basket by using the standard silicon wafer, and determining the position of the lower end face of the tooth socket at the uppermost layer of the flower basket as a second position when the standard silicon wafer enters the tooth socket at the lowest layer of the flower basket in the horizontal direction.
4. The method for determining the position of the silicon wafer to be placed into the basket according to claim 1, wherein the wafer inserting machine comprises a guide assembly connected with one side of the base, and the guide assembly is used for guiding the silicon wafer to be placed into the basket;
after the flower basket is installed on the base of the wafer inserting machine, the method for determining the position of the silicon wafer entering the basket further comprises the following steps:
setting a positioning reference surface on a base of the sheet inserting machine according to the central position of the flower basket and the size of the outer frame of the flower basket;
and determining the position of the guide assembly by using the positioning datum plane.
5. The method for determining the position of the silicon wafer in the basket according to claim 4, wherein the guide assembly comprises a first guide plate and a second guide plate which are oppositely arranged;
the determining the position of the guide assembly using the positioning reference surface comprises:
Determining the distance between the surface of the first guide plate facing to one side of the second guide plate and the positioning reference surface by utilizing the distance between the positioning reference surface and the tooth root of the flower basket and the difference between the width of the silicon chip and the width of the tooth groove of the flower basket;
determining the position of the first guide plate by utilizing a positioning reference surface and the distance between the surface of the first guide plate facing to the second guide plate and the positioning reference surface;
and determining the position of the second guide plate by using the width of the silicon chip and the position of the first guide plate.
6. The method for determining the position of the silicon wafer into the basket according to any one of claims 1 to 5,
after determining the position of each layer of tooth slots before the silicon wafer enters the basket and after determining the position of each layer of tooth slots based on the first position, the second position and the number of tooth slots of the basket, the method for determining the position of the silicon wafer entering the basket further comprises the following steps:
and before the actual silicon wafer enters the corresponding layer of tooth grooves of the flower basket, adjusting the position of the upper end face of the corresponding layer of tooth grooves by utilizing the thickness of the standard silicon wafer and the thickness of the actual silicon wafer.
7. The method for determining the silicon wafer basket entering position according to claim 6, wherein before an actual silicon wafer enters the corresponding layer tooth socket of the basket, the position of the upper end face of the corresponding layer tooth socket is adjusted by using the thickness of the standard silicon wafer and the thickness of the actual silicon wafer to satisfy the following formula,
B＝A-(H1-H2)/2*C
Wherein: b is the position of the upper end surface of the corresponding layer of tooth socket before the actual silicon wafer enters the basket, A is the position of the upper end surface of the corresponding layer of tooth socket after the standard silicon wafer enters the basket,H1is the thickness of a standard silicon wafer, H2C is the unit pulse value of a motor for driving the flower basket to lift.
8. The method for determining the silicon wafer basket entering position according to claim 1, wherein when the uppermost tooth socket of the basket is located at the bottom of the basket, the method for determining the silicon wafer basket entering position further comprises the following steps of, before adjusting the lower end surface position of the uppermost tooth socket of the basket to the first position by using a standard silicon wafer:
and determining the fixed position of the basket entering conveying plate by utilizing the distance between two adjacent basket toothed bars of the baskets along the conveying direction of the silicon wafers.
9. An apparatus for determining the position of a silicon wafer in a basket, comprising a processor and a communication interface, the communication interface being coupled to the processor, the processor being configured to run a computer program or instructions to implement the method of determining the position of a silicon wafer in a basket according to any one of claims 1 to 8.
10. A tab system, comprising: a wafer inserting machine, a flower basket and the silicon wafer basket-entering position determining device of claim 9; the flower basket is arranged on the sheet inserting machine; and the silicon wafer basket entering position determining equipment is in communication connection with the wafer inserting machine and the flower basket.
CN202210102511.9A 2022-01-27 2022-01-27 Method, equipment and inserting sheet system for determining silicon wafer basket entering position Active CN114566454B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204441260U (en) * 2015-02-09 2015-07-01 张家港市超声电气有限公司 Silicon chip vignette systems
CN106848001A (en) * 2017-03-24 2017-06-13 张家港市德昶自动化科技有限公司 A kind of full-automatic inserting piece device
CN112103232A (en) * 2020-08-24 2020-12-18 昆明鼎承启鑫科技有限公司 Positioning device for silicon wafer insertion flower basket
CN212648200U (en) * 2020-08-17 2021-03-02 浙江泓芯半导体有限公司 Diamond quartz boat capable of automatically inserting sheet
CN213958979U (en) * 2020-12-03 2021-08-13 宣城睿晖宣晟企业管理中心合伙企业(有限合伙) Side support rod of flower basket and flower basket

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204441260U (en) * 2015-02-09 2015-07-01 张家港市超声电气有限公司 Silicon chip vignette systems
CN106848001A (en) * 2017-03-24 2017-06-13 张家港市德昶自动化科技有限公司 A kind of full-automatic inserting piece device
CN212648200U (en) * 2020-08-17 2021-03-02 浙江泓芯半导体有限公司 Diamond quartz boat capable of automatically inserting sheet
CN112103232A (en) * 2020-08-24 2020-12-18 昆明鼎承启鑫科技有限公司 Positioning device for silicon wafer insertion flower basket
CN213958979U (en) * 2020-12-03 2021-08-13 宣城睿晖宣晟企业管理中心合伙企业(有限合伙) Side support rod of flower basket and flower basket

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