CN211237594U - RGB chip and LED display screen - Google Patents
RGB chip and LED display screen Download PDFInfo
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- CN211237594U CN211237594U CN201921671418.XU CN201921671418U CN211237594U CN 211237594 U CN211237594 U CN 211237594U CN 201921671418 U CN201921671418 U CN 201921671418U CN 211237594 U CN211237594 U CN 211237594U
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Abstract
The utility model relates to the technical field of MicroLED screens, and provides an RGB chip and an LED display screen, wherein the RGB chip comprises a substrate and RGB chips of different grades arranged on the substrate; the heights of the different levels of RGB chips are different. An LED display screen includes a plurality of RGB chips. The position of the RGB chip is not deviated, the mounting precision is high, and the precision of the RGB chip is high.
Description
Technical Field
The utility model relates to a micro LED screen technical field, more specifically say, relate to a RGB chip and LED display screen.
Background
At present, the RGB mounting technology is the same as the thickness of three chips. In general, the three RGB chips are on three different wafers, so that when the first chip is placed, the substrate is empty at this time, and the placement has no effect. When the second chip is placed, because the first chip is already placed, the placing again may affect the position where the first chip is placed, such as position deviation, and the connection requirement between the chip and the substrate cannot be met.
The existing RGB LED display screen has the problems of position deviation and low installation precision in the installation process.
The above disadvantages need to be improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a RGB chip and LED display screen to there is offset and the low technical problem of installation accuracy in the RGB LED display screen who exists among the solution prior art in the installation.
In order to achieve the above object, the utility model adopts the following technical scheme: an RGB chip and an LED display screen are provided.
An RGB chip comprises a substrate and RGB chips of different levels arranged on the substrate;
the heights of the different levels of RGB chips are different.
In one embodiment, the different levels of RGB chips include an R chip, a G chip, and a B chip;
the heights of the R chip, the G chip and the B chip are different.
In one embodiment, the RGB chip includes a chip body and a substrate, the chip bodies of different levels have the same height, and the substrates of the chips of different levels have different heights.
In one embodiment, the height of the RGB chip is no greater than 0.5 mm.
In one embodiment, the R chip is any one of low, medium, and high in height;
the chip G and the chip B are respectively at another two heights.
In one embodiment, the height of the substrate is three different levels of height, low, medium and high, respectively.
In one embodiment, the low-height substrate and the chip body form a low-height chip;
the substrate with the medium height and the chip body form a chip with the medium height;
the substrate with the same height and the chip body form a chip with the same height.
An object of the utility model is to provide a LED display screen, it is a plurality of including the RGB chip.
The utility model provides a pair of RGB chip and LED display screen's beneficial effect lies in at least:
(1) the position of the RGB chip provided by the embodiment is not deviated, the mounting precision is high, and the precision of the RGB chip is high.
(2) The LED display screen provided by the embodiment has high chip precision.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an RGB chip provided by an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1-a chip body;
11-R chip;
12-G chip;
13-B chip;
2-a substrate;
21-low substrate;
22-middle substrate;
23-high substrate;
3-substrate.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1, an RGB chip includes a substrate 3 and RGB chips of different levels disposed on the substrate 3;
the heights of the different levels of RGB chips are different.
The RGB chips of different levels comprise an R chip 11, a G chip 12 and a B chip 13;
the R chip 11, the G chip 12 and the B chip 13 are different in height.
The RGB chip comprises a chip body 1 and a substrate 2, wherein the heights of the chip bodies 1 in different levels are the same, and the heights of the substrates 2 of the chips in different levels are different.
Wherein, the height of the RGB chip is not more than 0.5 mm.
Wherein, the R chip 11 has any one of a low height, a medium height and a high height;
the G chip 12 and the B chip 13 have two different heights.
The height of the substrate is three different levels of low height, medium height and high height.
Wherein, the substrate with low height and the chip body form a chip with low height;
the substrate with medium height and the chip body form a chip with medium height;
the medium-height substrate and the chip body form a medium-height chip.
An LED display screen comprises a plurality of RGB chips.
The application of the RGB chip is described in detail below:
referring to fig. 1, an RGB chip includes a substrate 3 and RGB chips of different levels disposed on the substrate 3;
the heights of the different levels of RGB chips are different.
The RGB chip provided in this embodiment includes a substrate 3 and RGB chips of different levels, and the levels of the RGB chips are distinguished according to the heights of the RGB chips. The RGB chips of different levels are arranged on the substrate 3, the RGB chips of different levels have different heights, and the RGB chips of the same level on the substrate 3 are not contacted. Specifically, one grade of RGB chips are mounted on the substrate 3, and another grade of RGB chips are mounted, and since the heights of the two grades of RGB chips are different, when the second grade of RGB chips are mounted, the mounted first RGB chips do not interfere with each other, when the second grade of RGB chips are mounted, the third grade of RGB chips can be mounted, the heights of the third grade of RGB chips are different from those of the first two grades of RGB chips, and the first grade of RGB chips and the second grade of RGB chips do not interfere with the mounting of the third grade of RGB chips. The RGB chip that this implementation provided can guarantee that the RGB chip position does not squint in the installation, and the installation accuracy is high, and the precision of RGB chip is high. Specifically, in the mounting process, the RGB chips of the same level may be mounted on the substrate 3 first, and the mounting may be performed by mounting all the RGB chips of the level on the substrate 3 at once or in batches. After the RGB chip of the first level is installed, the RGB chip of the other level is installed again because the height of the RGB chips of the two levels is different and interference does not occur in the installation process. Specifically, in the mounting process, the RGB chip having the lowest level is mounted on the substrate 3, and then the chip having the higher level than the RGB chip having the lowest level is attached to the RGB chip having the lowest level, and when the RGB chip is not mounted on the substrate 3, the substrate 3 is empty, and the position of the mounted RGB chip is not affected. In the RGB chip mounting process of this example, not only the low-level chips but also the high-level chips may be mounted first, as long as the chips of different levels are mounted on the substrate 3, respectively. The RGB chip of this example is not only limited to RGB chip, still can extend to other chips, as long as the chip possesses different differences in height, and the installation of being convenient for possesses the protective scope of this application. The substrate 3 includes a PCB, glass, FPC, and the like.
The beneficial effect that so set up lies in:
the position of the RGB chip provided by the embodiment is not deviated, the mounting precision is high, and the precision of the RGB chip is high.
The RGB chip mounting method comprises the following steps:
s1, taking out the RGB chips on the wafer, adjusting the RGB chips to the RGB chips with different levels while taking out the RGB chips from the wafer, wherein the RGB chips with different levels have different heights;
s2, mounting RGB chips on the substrate 3, and mounting different-level chips on the substrate 3, respectively.
Wherein, the substrate 3 is provided with RGB chips;
the chips of the same level can be mounted on the substrate 3;
mounting the other level of chips on the substrate 3;
finally, other levels of chips are mounted on the substrate 3.
The chip mounting method provided by the embodiment can ensure that the RGB chip does not generate position offset, and has high mounting precision.
Further, the RGB chips of different levels include an R chip 11, a G chip 12, and a B chip 13;
the R chip 11, the G chip 12 and the B chip 13 are different in height.
The height of the R chip 11 of the RGB chip provided in this embodiment may be any one of a low height, a medium height, or a high height, and similarly, the height of the G chip 12 may be any one of a low height, a medium height, or a high height, and the height of the B chip 14 may be any one of a low height, a medium height, or a high height, as long as the heights of the R chip 11, the G chip 12, and the B chip 13 are different. In the mounting process of the RGB chip, it is not limited to mount the R chip 11, the G chip 12, and the B chip 13 first, as long as the R chip 11, the G chip 12, and the B chip 14 are mounted separately. Similarly, the R chip 11, the G chip 12, and the B chip 13 may be mounted on the substrate at one time or in a batch manner. Preferably, all of the R chip 11, the G chip 12, and the B chip 13 are mounted first, and then the other chip is mounted.
Further, the RGB chip includes a chip body 1 and a substrate 2, the chip bodies 1 of different levels have the same height, and the substrates 2 of the chips of different levels have different heights.
The RGB chip provided by this embodiment includes a chip body 1 and a substrate 2, the chip body 1 has the same height, and the substrates 2 of the RGB chips of different levels have different heights. Specifically, the chip body 1 of the present embodiment may include an R chip body, a G chip body, and a B chip body, and the substrates of different levels are mounted at the bottom of the RGB chip, so that the RGB chip is divided into different levels, and when the RGB chip is mounted, the low-level RGB chip with a low height is mounted first, and then the RGB chips of different levels with other heights are mounted.
The chip body 1 provided by the embodiment can be taken out from different wafer wafers, the manufacturing cost is reduced, the substrates 2 with different specifications are mounted at the bottom of the chip body 1, and the wafer processing device is simple in mounting, convenient to operate, low in cost and high in processing speed.
The RGB chip mounting method provided in this embodiment may be:
s1, taking out the RGB chips on the wafer, and adjusting the RGB chips to the RGB chips with different levels while taking out the RGB chips from the wafer;
s2, respectively mounting RGB chips of different levels on the substrate 3, wherein the chips of the same level can be mounted on the substrate 3 firstly; mounting the other level of chips on the substrate 3; finally, other levels of chips are mounted on the substrate 3.
The beneficial effect that so set up lies in:
the substrate 2 of the RGB chip provided in this embodiment is a substrate 2 of different levels with different heights, and is simple to mount, convenient to operate, low in cost, and fast in processing speed.
Further, the height of the RGB chip is not more than 0.5 mm.
The height of the RGB chip provided in this embodiment is not more than 0.5 mm.
In one embodiment, the R chip is any one of low, medium, and high in height; the chip G and the chip B have the other two heights respectively.
In one embodiment, the height of the substrate is three different levels of low height, medium height and high height, and the low-height substrate and the chip body form a low-height chip; the substrate with medium height and the chip body form a chip with medium height; the substrate with high height and the chip body form a high-height chip.
The RGB chip provided in this embodiment has 3 levels, which are respectively a low-level chip, a medium-level chip and a high-level chip.
Specifically, in one embodiment, the chip bodies 1 are the same, the levels of the substrates 2 are different, the substrates 2 are divided into 3 levels, namely, a low substrate 21 with a low height, a medium substrate 22 with a medium height, and a high substrate 23 with a high height, the low substrate 21 and the chip body 1 constitute a low-height chip, the medium substrate 22 and the chip body 1 constitute a medium-height chip, and the high substrate 23 and the chip body 1 constitute a high-height chip. For RGB chips of different levels, the substrates 2 of different levels are mounted on the chip body 1, and the method is simple and convenient to operate, high in efficiency and low in cost.
Specifically, in another embodiment, the height of the low substrate is 0, there is a height difference between the medium substrate and the low substrate, and there is a height difference between the high substrate and the medium substrate. Specifically, the height of the low substrate is 0mm, the height of the medium substrate is 0.1mm, and the height of the high substrate is 0.2 mm.
An embodiment is provided in which the height of the low substrate is 0.1mm, the height difference is provided between the medium substrate and the low substrate, and the height difference is provided between the high substrate and the medium substrate. Specifically, the height of the low substrate is 0.1mm, the height of the medium substrate is 0.2mm, and the height of the high substrate is 0.3 mm. It is emphasized that the heights between the different levels of the substrate provided by the two embodiments are not limited to incremental relationships, as long as the two levels of the substrate have a height difference. Preferably, the thickness of the chip body is in the range of 0.1-0.15mm, and the height of the RGB chip is not more than 0.5 mm. The above embodiments only provide two preferred solutions, specifically the heights of the substrates of different levels, which can be adjusted according to actual conditions.
The beneficial effect that so set up lies in:
the RGB chip that this embodiment provided is provided with the RGB chip of 3 different specifications, and the chip mounting is simple, convenient operation, and is with low costs, and the installation effectiveness is high, and installation error rate is low.
Referring to fig. 1, an LED display screen includes a plurality of RGB chips.
The LED display screen that this embodiment provided includes a plurality of RGB chip, and the installation accuracy of RGB chip is high.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. An RGB chip, characterized by: the RGB chip comprises a substrate and RGB chips of different levels arranged on the substrate;
the heights of the RGB chips in different levels are different;
the RGB chips of different levels comprise an R chip, a G chip and a B chip;
the heights of the R chip, the G chip and the B chip are different.
2. The RGB chip of claim 1, wherein: the RGB chip comprises a chip body and a substrate, wherein the heights of the chip bodies in different levels are the same, and the heights of the substrates of the chips in different levels are different.
3. The RGB chip of claim 1, wherein: the height of the RGB chip is not more than 0.5 mm.
4. The RGB chip of claim 1, wherein: the R chip is any one of low height, medium height and high height, and the G chip and the B chip are respectively of the other two heights.
5. The RGB chip of claim 2, wherein: the height of the substrate is three heights, namely low height, medium height and high height.
6. The RGB chip of claim 5, wherein: the substrate with low height and the chip body form a chip with low height;
the substrate with the medium height and the chip body form a chip with the medium height;
the substrate with the same height and the chip body form a chip with the same height.
7. An LED display screen, its characterized in that: comprising a plurality of RGB chips according to any of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921671418.XU CN211237594U (en) | 2019-10-08 | 2019-10-08 | RGB chip and LED display screen |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921671418.XU CN211237594U (en) | 2019-10-08 | 2019-10-08 | RGB chip and LED display screen |
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| Publication Number | Publication Date |
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| CN211237594U true CN211237594U (en) | 2020-08-11 |
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| CN201921671418.XU Active CN211237594U (en) | 2019-10-08 | 2019-10-08 | RGB chip and LED display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112634768A (en) * | 2019-10-08 | 2021-04-09 | 北京易美新创科技有限公司 | RGB chip, chip installation method and LED display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112634768A (en) * | 2019-10-08 | 2021-04-09 | 北京易美新创科技有限公司 | RGB chip, chip installation method and LED display screen |
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