CN117059540A - Wafer loading and unloading machine - Google Patents

Wafer loading and unloading machine Download PDF

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Publication number
CN117059540A
CN117059540A CN202311047339.2A CN202311047339A CN117059540A CN 117059540 A CN117059540 A CN 117059540A CN 202311047339 A CN202311047339 A CN 202311047339A CN 117059540 A CN117059540 A CN 117059540A
Authority
CN
China
Prior art keywords
wafer
base
limiting device
placement area
target placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311047339.2A
Other languages
Chinese (zh)
Inventor
闫冰磊
商倪皓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Dingtai Craftsman Core Technology Co ltd
Original Assignee
Shanghai Dingtai Craftsman Core Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Dingtai Craftsman Core Technology Co ltd filed Critical Shanghai Dingtai Craftsman Core Technology Co ltd
Priority to CN202311047339.2A priority Critical patent/CN117059540A/en
Publication of CN117059540A publication Critical patent/CN117059540A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The application discloses a wafer loading and unloading machine, which belongs to the field of semiconductor manufacturing and comprises the following components: the device comprises a base, a first limiting device and a second limiting device; the first limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the width direction of the wafer conveying box; the second limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the length direction of the wafer conveying box. The application fixes a first limiting device for fixing the placement position of the wafer transfer box on the base along the width direction of the wafer transfer box and a second limiting device for fixing the placement position of the wafer transfer box on the base along the length direction of the wafer transfer box on the base of the wafer loading and unloading machine. According to the positions of the first limiting device and the second limiting device, the wafer conveying box can be accurately placed at the correct position of the base, and the wafer loading and unloading machine is prevented from alarming due to the fact that the wafer conveying box is placed at the wrong position manually.

Description

Wafer loading and unloading machine
Technical Field
The application relates to the field of semiconductor manufacturing, in particular to a wafer loading and unloading machine.
Background
In the process of loading and inspecting the machine, the wafer conveying box needs to be manually placed on the base of the machine wafer loading and unloading machine, and the manual placement cannot ensure accurate placement at the correct position, so that deviation of the placement position is easy to cause, and the pressure sensor of the machine wafer loading and unloading machine senses abnormality to cause the alarm of the wafer loading and unloading machine. Therefore, how to improve the accuracy of the placement position, and avoid the alarm of the wafer handler caused by the error of the manual placement position is a technical problem that needs to be solved by those skilled in the art at present.
Disclosure of Invention
The application aims to provide a wafer loading and unloading machine, so that the accuracy of the placement position is improved, and the wafer loading and unloading machine is prevented from alarming due to the fact that the placement position is wrong manually.
In order to achieve the above object, the present application provides a wafer handler including: the device comprises a base, a first limiting device and a second limiting device;
the first limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the width direction of the wafer conveying box;
the second limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the length direction of the wafer conveying box.
Optionally, the wafer handler includes: a plurality of first stop devices and a plurality of second stop devices.
Optionally, the first limiting devices are respectively arranged at two sides of the target placement area on the base along the width direction of the wafer conveying box; and the second limiting device is arranged at one side of the target placement area along the length direction of the wafer conveying box.
Optionally, the distance between the first limiting device and the target placement area is 0-5mm, and the distance does not include the value of the left end.
Optionally, a first inclined plane is arranged on one side, close to the target placement area, of the first limiting device; the first inclined surface faces to the upper side of the target placement area; the width of the surface of the first limiting device, which faces away from the base, is larger than the width of the surface, which is close to the base.
Optionally, the first inclined plane has an inclination angle of 61 ° -65 °, and includes values of both ends.
Optionally, a second inclined plane is arranged on one side, close to the target placement area, of the second limiting device; the second inclined surface is perpendicular to the base and faces the central area of the target placement area.
Optionally, the first limiting device is arranged at one side of the target placement area on the base along the width direction of the wafer transfer box; and the second limiting device is arranged at one side of the target placement area along the length direction of the wafer conveying box.
Optionally, the height of the first limiting device is smaller than the distance between the armrest of the wafer transfer box and the bottom of the wafer transfer box.
Optionally, the first limiting device is fixed on the base through a screw; the second limiting device is fixed on the base through screws.
The application provides a wafer loading and unloading machine, which comprises: the device comprises a base, a first limiting device and a second limiting device; the first limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the width direction of the wafer conveying box; the second limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the length direction of the wafer conveying box.
Obviously, the application fixes the first limiting device for fixing the placement position of the wafer transfer box on the base along the width direction of the wafer transfer box and the second limiting device for fixing the placement position of the wafer transfer box on the base along the length direction of the wafer transfer box on the base of the wafer loader. According to the positions of the first limiting device and the second limiting device, the wafer conveying box can be accurately placed at the correct position of the base, and the wafer loading and unloading machine is prevented from alarming due to the fact that the wafer conveying box is placed at the wrong position manually.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a top view of a base of a wafer handler according to an embodiment of the present application;
FIG. 2 is a front view of a single first stop device according to an embodiment of the present application;
fig. 3 is a top view of a base with a pod according to an embodiment of the present application.
In fig. 1-3, the reference numerals are as follows:
1-a base; 11-an area on the base 1 for placing the wafer cassette 3; 21-a first limiting device; 22-a second limiting device; 3-a wafer transfer box; 31-armrests of the wafer cassette 3; 41-a screw arranged on the first limiting device 21; 42-a screw provided on the second stop 22; d, d 1 The spacing of the first limiting means 21; d, d 11 The distance of the first stop means 21 from the target placement area; θ 1 -an inclination angle of the first incline; l (L) 1 The length of the first stop means 21; d (D) 11 The width of the surface of the first stop means 21 facing away from the base 1; d (D) 12 The width of the surface of the first limiting means 21 close to the base 1; h is a 11 The height of the surface of the first stop means 21 facing away from the target placement area; h is a 12 The height of the surface of the first stop means 21 close to the target placement area; d (D) 2 The width of the second stop 22; l (L) 2 The length of the second stop 22; θ 2 -an inclination angle of the second bevel; d, d 2 The spacing of the second limiting means 21; d (D) 0 The width of the cassette 3; r is R 1 The diameter of the screw 41; r is R 2 The diameter of the screw 42; d, d 3 The spacing of the screw 42 from the surface of the second stop 22 facing away from the target placement area.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The wafer handler provided by the embodiment of the application can comprise: the base 1, the first limiting device 21 and the second limiting device 22;
the first limiting device 21 is fixed on the base 1 and is used for fixing the placement position of the wafer transfer box 3 on the base 1 along the width direction of the wafer transfer box 3;
the second limiting device 22 is fixed on the base 1, and is used for fixing the placement position of the wafer transfer box 3 on the base 1 along the length direction of the wafer transfer box 3.
The specific fixing manner between the first limiting device 21 and the base 1 is not limited in this embodiment, as long as the first limiting device 21 is ensured to be fixed on the base 1, for example, the first limiting device 21 may be fixed on the base 1 by a screw. The present embodiment is not limited to a specific number of screws, as long as the first limiting device 21 is secured to the base 1. The specific position of the screw is not limited in this embodiment, and may be located in the central area of the first limiting device 21, or may be uniformly distributed on the first limiting device 21. The present embodiment is not limited to the specific type of the first limiting device 21, as long as the first limiting device 21 is secured to the base 1 and can be used to secure the placement position of the wafer cassette 3 on the base 1 along the width direction of the wafer cassette 3, for example, the first limiting device 21 may be a 35# high quality carbon structural steel device.
The specific fixing manner between the second limiting device 22 and the base 1 is not limited in this embodiment, as long as the second limiting device 22 is ensured to be fixed on the base 1, for example, the second limiting device 22 may be fixed on the base 1 by a screw. The present embodiment is not limited to a specific number of screws, as long as the second limiting device 22 is secured to the base 1. The specific position of the screw is not limited in this embodiment, and may be located in the central area of the second limiting device 22, or may be uniformly distributed on the second limiting device 22. The embodiment is not limited to the specific type of the second limiting device 22, as long as the second limiting device 22 can be secured to the base 1 and can be used to secure the placement position of the wafer cassette 3 on the base 1 along the length direction of the wafer cassette 3, for example, the second limiting device 22 may be a 35# high quality carbon structural steel device.
The present embodiment is not limited to a specific number of the first limiting devices 21 and the second limiting devices 22, for example, the wafer handler may include a plurality of first limiting devices 21 and a plurality of second limiting devices 22; a first stop 21 and a second stop 22 may also be included; or a first limiting device 21 and a plurality of second limiting devices 22; or a plurality of first limiting means 21 and a second limiting means 22.
When the wafer handler includes a plurality of first limiting devices 21 and a plurality of second limiting devices 22, the embodiment is not limited to specific positions of the first limiting devices 21 and the second limiting devices 22, for example, the target placement area on the base 1 may be provided with the first limiting devices 21 along two sides of the width direction of the wafer transfer box 3; a second limiting device 22 is arranged at one side of the target placement area along the length direction of the wafer conveying box 3; the first limiting device 21 may be disposed on one side of the target placement area on the base 1 along the width direction of the wafer cassette 3; the target placement area is provided with a second stopper 22 along one side of the length direction of the wafer cassette 3. It should be noted that, the former is provided with a limiting device on three sides of the target placement area, respectively, and a semi-enclosed area formed by the limiting devices on the three sides is used for placing the wafer transfer box 3; the latter is provided with limiting means on adjacent sides of the target placement area, respectively.
Further, the plurality of first limiting devices 21 disposed on both sides of the target placement area in the width direction of the wafer cassette 3 in the present embodiment may be symmetrical with respect to the central axis of the target placement area in the length direction of the wafer cassette 3; the plurality of second stoppers 22 provided at one side of the target placement area along the length direction of the wafer cassette 3 may be symmetrical with respect to the central axis of the target placement area along the length direction of the wafer cassette 3.
Further, when the target placement area on the base 1 is provided with the first limiting devices 21 along two sides of the width direction of the wafer transfer box 3, respectively; wafer transfer box with target placement area3 is provided with a second limiting device 22 at one side in the length direction of the wafer cassette 3, in order to reduce the difficulty in placing the wafer cassette 3, to avoid abnormal placement caused by a clearance problem during the placement of the wafer cassette 3, in this embodiment, the distance d between the first limiting device 21 and the target placement area is set 11 May be greater than 0; further, in this embodiment, a first inclined plane may be disposed on a side of the first limiting device 21 near the target placement area; the first inclined surface faces to the upper part of the target placement area; the width D of the surface of the first limiting device 21 facing away from the base 1 11 Greater than the width of the surface adjacent to the base 1.
The specific distance between the first limiting device 21 and the target placement area, such as the distance d between the first limiting device 21 and the target placement area, is not limited in this embodiment 11 May be 0-5mm and does not include the value at the left end. The present embodiment does not limit the inclination angle θ of the first inclined surface 1 For example, the inclination angle theta of the first inclined surface 1 May be 61 deg. -65 deg. and include values at both ends. The present embodiment does not limit the specific length of the first limiting device 21, for example, the length L of the first limiting device 21 1 May be 74mm-76mm and include values at both ends. The present embodiment does not limit the specific width of the surface of the first limiting device 21 facing away from the base 1, for example, the width D of the surface of the first limiting device 21 facing away from the base 1 11 May be 29mm-31mm and include values at both ends. The present embodiment does not limit the specific width of the surface of the first limiting device 21 near the base 1, for example, the width D of the surface of the first limiting device 21 near the base 1 12 May be 39mm-41mm and include values at both ends. The present embodiment does not limit the specific height of the surface of the first stopper 21 facing away from the target placement area, for example, the height h of the surface of the first stopper 21 facing away from the target placement area 11 May be 29mm-31mm and include values at both ends. The present embodiment does not limit the specific height of the surface of the first stopper 21 near the target placement area, for example, the height h of the surface of the first stopper 21 near the target placement area 12 May be 9mm-11mm and include values at both ends.
It should be noted that, the target placement area on the base 1 of the wafer handler refers to an area corresponding to the bottom contour of the wafer cassette 3, but considering that the two sides of the wafer cassette 3 are further provided with the handrails 31, and the distance between the handrails 31 at the two sides is larger than the width of the bottom of the wafer cassette 3, in order to avoid the placement abnormality caused by the influence of the handrails 31 at the two sides of the wafer cassette 3, the height of the first limiting device 21 in this embodiment may be smaller than the distance between the handrails 31 of the wafer cassette 3 and the bottom of the wafer cassette 3. The specific height of the first limiting device 21 is not limited to this embodiment, and the specific height of the first limiting device 21 may be determined according to the distance between the armrest 31 of the actual wafer cassette 3 and the bottom of the wafer cassette 3.
Further, according to the profile of the bottom of the actual wafer cassette 3, a second inclined plane may be disposed on the side of the second limiting device 22 near the target placement area in this embodiment; the second bevel is perpendicular to the base 1 and faces the central area of the target placement area. The present embodiment does not limit the inclination angle θ of the second inclined surface 2 The inclination angle theta of the second inclined surface can be determined according to the contour of the bottom of the actual wafer cassette 3 2 Is a specific angle of (c). In addition, the present embodiment does not limit the specific length of the second limiting device 22, such as the length L of the second limiting device 22 2 May be 89mm-91mm and include values at both ends. The present embodiment does not limit the specific width of the second limiting device 22, such as the width D of the second limiting device 22 2 May be 29mm-31mm and include values at both ends.
Based on the above-described embodiment, the present application fixes the first stopper 21 for fixing the placement position of the wafer cassette 3 on the base 1 in the width direction of the wafer cassette 3 and the second stopper 22 for fixing the placement position of the wafer cassette 3 on the base 1 in the length direction of the wafer cassette 3 on the base 1 of the wafer handler. According to the positions of the first limiting device 21 and the second limiting device 22, the wafer transfer box 3 can be accurately placed at the correct position of the base 1, and the wafer loading and unloading machine alarm caused by the error of the manual placement position is avoided.
Another wafer handler provided by an embodiment of the present application may include: a base 1, a plurality of first limiting devices 21 and a plurality of second limiting devices 22;
the target placement area on the base 1 is respectively provided with a first limiting device 21 along two sides of the width direction of the wafer transfer box 3; distance d between first limiting device 21 and target placement area 11 0-5mm, excluding the left end value; a first inclined plane is arranged on one side of the first limiting device 21, which is close to the target placement area; the first inclined surface faces to the upper part of the target area; the width D of the surface of the first limiting device 21 facing away from the base 1 11 A width greater than the surface close to the base 1; inclination angle theta of first inclined plane 1 May be 61 ° -65 °, and include values at both ends; the first limiting device 21 is fixed on the base 1 and is used for fixing the placement position of the wafer transfer box 3 on the base 1 along the width direction of the wafer transfer box 3;
a second limiting device 22 is arranged at one side of the target placement area along the length direction of the wafer conveying box 3; the second limiting device 22 is fixed on the base 1, and is used for fixing the placement position of the wafer transfer box 3 on the base 1 along the length direction of the wafer transfer box 3.
Based on the above-described embodiment, the present application fixes the first stopper 21 for fixing the placement position of the wafer cassette 3 on the base 1 in the width direction of the wafer cassette 3 and the second stopper 22 for fixing the placement position of the wafer cassette 3 on the base 1 in the length direction of the wafer cassette 3 on the base 1 of the wafer handler. According to the positions of the first limiting device 21 and the second limiting device 22, the wafer transfer box 3 can be accurately placed at the correct position of the base 1, and the wafer loading and unloading machine is prevented from alarming due to the error of the manual placement position; meanwhile, the difficulty in placing the wafer conveying box 3 can be reduced, and the problem that the wafer conveying box 3 is placed abnormally due to the clearance problem in the process of placing the wafer conveying box is avoided.
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a top view of a base of a wafer handler according to an embodiment of the present application; FIG. 2 is a front view of a single first stop device according to an embodiment of the present application; fig. 3 is a top view of a base with a pod according to an embodiment of the present application.
Width D of the pod 3 in the figure 0 Is 388mm, is placed on the surface of the region 11 of the base 1 for placing the wafer cassette 3.
The target placement area (here, the bottom contour of the wafer cassette 3) is provided with one first stopper 21 along both sides of the width direction of the wafer cassette 3, respectively, and the two first stoppers 21 are the same in size and symmetrical with respect to the central axis of the target placement area along the length direction of the wafer cassette 3. The first limiting device 21 is provided with a first inclined plane on one side close to the target placement area, and the first inclined plane faces to the upper side of the target placement area. Length L of first limiting device 21 1 At a height h of 75mm of the surface of the first stop means 21 facing away from the target placement area 11 At a height h of 30mm (lower than the height of the arm rest 31 of the wafer cassette 3) of the surface of the first stopper 21 near the target placement area 12 The width D of the surface of the first limiting device 21 facing away from the base 1 is 10mm 11 The width D of the surface of the first limiting device 21 close to the base 1 is 30mm 12 An inclination angle theta of the first inclined surface of 40mm 1 63 deg.. Distance d between first limiting device 21 and target placement area 11 Is 2mm, i.e. the distance d between the two first limiting devices 21 1 392mm. Diameter R of screw 41 provided on first stopper 21 1 Is 10mm.
Two second limiting devices 22 are arranged on one side of the target placement area along the length direction of the wafer transfer box 3, and the two second limiting devices 22 are identical in size and symmetrical to the central axis of the target placement area along the length direction of the wafer transfer box 3. The second limiting device 22 is provided with a second inclined plane at one side close to the target placement area, and the second inclined plane is perpendicular to the base 1 and faces the central area of the target placement area. Width D of the second limiting device 22 2 Length L of the second limiting device 22 is 30mm 2 An inclination angle theta of the second inclined surface of 90mm 2 45 deg.. Distance d between two second limiting devices 21 2 332mm. Diameter R of screw 42 provided on second stop 22 2 At a distance d of 10mm from the surface of the second stop 22 facing away from the target placement area, the screw 42 3 25mm.
By applying the wafer handler provided by the embodiment of the application, the first limiting device 21 for fixing the placement position of the wafer transfer box 3 on the base 1 along the width direction of the wafer transfer box 3 and the second limiting device 22 for fixing the placement position of the wafer transfer box 3 on the base 1 along the length direction of the wafer transfer box 3 are fixed on the base 1 of the wafer handler. According to the positions of the first limiting device 21 and the second limiting device 22, the wafer transfer box 3 can be accurately placed at the correct position of the base 1, and the wafer loading and unloading machine is prevented from alarming due to the error of the manual placement position; meanwhile, the difficulty in placing the wafer conveying box 3 can be reduced, and the problem that the wafer conveying box 3 is placed abnormally due to the clearance problem in the process of placing the wafer conveying box is avoided.
The principles and embodiments of the present application are described herein with reference to specific examples, where each example is a progressive relationship, and each example is mainly described by differences from other examples, and identical and similar parts of each example are mutually referred to. The above description of the embodiments is only for aiding in the understanding of the method of the present application and its core ideas. It will be apparent to those skilled in the art that various changes and modifications can be made to the present application without departing from the principles of the application, and such changes and modifications fall within the scope of the appended claims.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.

Claims (10)

1. A wafer handler, comprising: the device comprises a base, a first limiting device and a second limiting device;
the first limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the width direction of the wafer conveying box;
the second limiting device is fixed on the base and used for fixing the placement position of the wafer conveying box on the base along the length direction of the wafer conveying box.
2. The wafer handler of claim 1, comprising: a plurality of first stop devices and a plurality of second stop devices.
3. The wafer handler of claim 2, wherein the first limiting devices are provided on both sides of the target placement area on the base in the width direction of the wafer transfer cassette, respectively; and the second limiting device is arranged at one side of the target placement area along the length direction of the wafer conveying box.
4. The wafer handler of claim 3, wherein the first stop is spaced from the target placement area by a distance of 0-5mm and does not include a left end value.
5. The wafer handler of claim 3, wherein a side of the first stop device proximate the target placement area is provided with a first bevel; the first inclined surface faces to the upper side of the target placement area; the width of the surface of the first limiting device, which faces away from the base, is larger than the width of the surface, which is close to the base.
6. The wafer handler of claim 5, wherein the first bevel has a bevel angle of 61 ° -65 ° and includes values for both ends.
7. The wafer handler of claim 3, wherein a second ramp is provided on a side of the second stop device proximate the target placement area; the second inclined surface is perpendicular to the base and faces the central area of the target placement area.
8. The wafer handler of claim 2, wherein the target placement area on the base is provided with the first stop device along one side of the width direction of the wafer cassette; and the second limiting device is arranged at one side of the target placement area along the length direction of the wafer conveying box.
9. The wafer handler of claim 1, wherein a height of the first stop device is less than a spacing of the armrest of the wafer transfer cassette from a bottom of the wafer transfer cassette.
10. The wafer handler of claim 1, wherein the first stop device is secured to the base by a screw; the second limiting device is fixed on the base through screws.
CN202311047339.2A 2023-08-18 2023-08-18 Wafer loading and unloading machine Pending CN117059540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311047339.2A CN117059540A (en) 2023-08-18 2023-08-18 Wafer loading and unloading machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311047339.2A CN117059540A (en) 2023-08-18 2023-08-18 Wafer loading and unloading machine

Publications (1)

Publication Number Publication Date
CN117059540A true CN117059540A (en) 2023-11-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311047339.2A Pending CN117059540A (en) 2023-08-18 2023-08-18 Wafer loading and unloading machine

Country Status (1)

Country Link
CN (1) CN117059540A (en)

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