CN114556574A - 固态成像装置和固态成像装置的制造方法 - Google Patents

固态成像装置和固态成像装置的制造方法 Download PDF

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Publication number
CN114556574A
CN114556574A CN202080071698.XA CN202080071698A CN114556574A CN 114556574 A CN114556574 A CN 114556574A CN 202080071698 A CN202080071698 A CN 202080071698A CN 114556574 A CN114556574 A CN 114556574A
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Prior art keywords
photoelectric conversion
electrode
film
solid
imaging device
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Pending
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CN202080071698.XA
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English (en)
Chinese (zh)
Inventor
定荣正大
村田贤一
古闲史彦
八木岩
平田晋太郎
富樫秀晃
齐藤阳介
藤井宣年
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Sony Semiconductor Solutions Corp
Sony Group Corp
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Sony Semiconductor Solutions Corp
Sony Group Corp
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Publication of CN114556574A publication Critical patent/CN114556574A/zh
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    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
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    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
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    • H10K39/00Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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    • H01L27/144Devices controlled by radiation
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    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN202080071698.XA 2019-11-20 2020-11-12 固态成像装置和固态成像装置的制造方法 Pending CN114556574A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019209438 2019-11-20
JP2019-209438 2019-11-20
PCT/JP2020/042266 WO2021100605A1 (ja) 2019-11-20 2020-11-12 固体撮像装置および固体撮像装置の製造方法

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CN114556574A true CN114556574A (zh) 2022-05-27

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US (1) US20220415969A1 (ja)
JP (1) JPWO2021100605A1 (ja)
CN (1) CN114556574A (ja)
WO (1) WO2021100605A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013055252A (ja) * 2011-09-05 2013-03-21 Sony Corp 固体撮像素子および製造方法、並びに電子機器
WO2014027588A1 (ja) * 2012-08-14 2014-02-20 ソニー株式会社 固体撮像装置および電子機器
JP2017098513A (ja) * 2015-11-27 2017-06-01 株式会社ニコン 撮像素子、撮像装置および焦点調節装置
TWI770159B (zh) * 2017-04-21 2022-07-11 日商索尼股份有限公司 攝像元件、積層型攝像元件及固體攝像裝置

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JPWO2021100605A1 (ja) 2021-05-27
WO2021100605A1 (ja) 2021-05-27

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