CN114556452A

CN114556452A - Chip packaging structure and electronic equipment

Info

Publication number: CN114556452A
Application number: CN202180005446.1A
Authority: CN
Inventors: 龙启博; 武艳伟
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2022-05-27
Anticipated expiration: 2041-02-05
Also published as: WO2022165775A1; CN114556452B

Abstract

The embodiment of the application provides a chip packaging structure and electronic equipment, and the chip packaging structure comprises: the fingerprint sensor chip is used for receiving a fingerprint optical signal returned by a human finger above the display screen, and the fingerprint optical signal is used for detecting fingerprint information of the finger; the electronic device comprises an ambient light sensor chip, a light sensor chip and a light sensor, wherein the ambient light sensor chip is used for receiving an ambient light signal of the electronic device, and the ambient light signal is used for detecting the intensity of ambient light of the electronic device; the fingerprint sensor chip and the ambient light sensor chip are packaged on the circuit board; and the blocking structure is arranged between the fingerprint sensor chip and the environment light sensor chip and used for preventing light crosstalk between the fingerprint sensor chip and the environment light sensor chip.

Description

Chip packaging structure and electronic equipment

Technical Field

The embodiment of the application relates to the field of chip packaging, in particular to a chip packaging structure and electronic equipment.

Background

With the development of mobile communication devices, ambient light sensors have become standard sensors for electronic devices. However, the distribution and installation size of the current ambient light sensors in the electronic devices are not favorable for the development of the electronic devices toward the direction of light and thin.

Disclosure of Invention

The embodiment of the application provides a chip packaging structure and electronic equipment, which are beneficial to development of electronic equipment towards the direction of light and thin.

In a first aspect, a chip package structure is provided, which is suitable for an electronic device having a display screen and is fixedly disposed below the display screen, and includes: the fingerprint sensor chip is used for receiving a fingerprint optical signal returned by a human finger above the display screen, and the fingerprint optical signal is used for detecting fingerprint information of the finger; the electronic device comprises an ambient light sensor chip, a light sensor chip and a light sensor, wherein the ambient light sensor chip is used for receiving an ambient light signal of the electronic device, and the ambient light signal is used for detecting the intensity of ambient light of the electronic device; the fingerprint sensor chip and the ambient light sensor chip are packaged on the circuit board; and the blocking structure is arranged between the fingerprint sensor chip and the environment light sensor chip and used for preventing light crosstalk between the fingerprint sensor chip and the environment light sensor chip.

Through with fingerprint sensor chip and ambient light sensor chip encapsulation together, need not solitary ambient light detection module to can play saving electronic equipment space, reduce electronic equipment's complete machine structural design's the degree of difficulty, be favorable to electronic equipment towards the development of frivolous direction, can reduce electronic equipment's cost simultaneously.

Meanwhile, the blocking structure is arranged between the fingerprint sensor chip and the ambient light sensor chip, so that light crosstalk between the fingerprint sensor chip and the ambient light sensor chip, especially light crosstalk under strong light can be prevented, and the detection performance can be improved.

In one possible implementation, the chip package structure further includes: the stiffening plate is arranged below the circuit board; the upper surface of the circuit board extends downwards and penetrates through the circuit board to form two windows, and the fingerprint sensor chip and the ambient light sensor chip are fixedly arranged in the two windows respectively.

Through setting up two windowing at the circuit board to with fingerprint sensor chip and the fixed two recesses that set up in the circuit board of environment light sensor chip, thereby can further attenuate chip packaging structure's thickness, with the space of practicing thrift shared electronic equipment.

In a possible implementation, the lower surface of the luminescent layer of this display screen is provided with the protective layer, and this protective layer is provided with a windowing, and this windowing setting is aimed at to this fingerprint sensor chip and this environment light sensor chip receive the light signal who sees through this display screen through this windowing, should separate the cotton layer of this circuit board and bubble that keeps off the structure from the bottom up includes in proper order, and this bubble is fixed in the lower surface of this luminescent layer on the cotton layer.

Adopt the display screen to open a window, increase the thickness on chip package structure's the cotton layer of bubble and form and separate the fender structure, both can guarantee to separate and keep off the effect, can reduce the processing cost of display screen again.

In a possible implementation, the lower surface of the luminescent layer of this display screen is provided with the protective layer, and this protective layer is provided with two windowing, and these two windowing settings are aimed at respectively to this fingerprint sensor chip and this environment light sensor chip receive the optical signal who sees through this display screen through windowing that corresponds, should separate and keep off the structure from the bottom up and include this circuit board and the cotton layer of bubble in proper order, and this cotton layer of bubble is fixed in the lower surface of this protective layer.

Two windows are opened by the display screen, so that the protective layer of the display screen and the foam in the chip packaging structure form a blocking structure together, the blocking effect can be guaranteed, and the cost of the chip packaging structure does not need to be increased.

In a possible embodiment, the fingerprint sensor chip and the ambient light sensor chip have a common component arrangement region and/or the fingerprint sensor chip and the ambient light sensor chip share a connector.

Compared with the scheme of independently setting the ambient light sensor chip, the chip packaging structure of the embodiment of the application can further reduce the process cost by sharing the connector or the component arrangement area, thereby being more beneficial to the whole machine design of the electronic equipment and the light and thin development of the electronic equipment.

In one possible implementation, the chip package structure further includes: and the shading layer is formed on the upper surface of the edge area of the fingerprint sensor chip and the upper surface of the edge area of the ambient light sensor chip respectively, wherein the shading layer does not shade the sensing area of the fingerprint sensor chip and the sensing area of the ambient light sensor chip, and the shading layer is used for preventing the edge area of the fingerprint sensor chip from causing light crosstalk to the sensing area of the fingerprint sensor chip and preventing the edge area of the ambient light sensor chip from causing light crosstalk to the sensing area of the ambient light sensor chip.

The light shielding layer is arranged in the edge area of the upper surface of the chip, so that light crosstalk of the edge area to the sensing area is reduced, and the detection performance can be further improved.

In one possible implementation, the chip package structure further includes: the fingerprint driving chip is used for matching the fingerprint sensor chip to carry out fingerprint identification; wherein, the fingerprint driving chip is packaged on the circuit board.

The fingerprint driving chip and the fingerprint sensor chip are packaged on the same circuit board, so that the space occupied by the electronic equipment can be saved, and the development of the electronic equipment towards the direction of lightness and thinness is facilitated.

In one possible implementation, the fingerprint sensor chip further includes a fingerprint driving circuit.

The fingerprint driving function and the fingerprint detection function are integrated in one chip, so that the size of the chip packaging structure can be further reduced, the chip packaging structure is simpler, and the reliability is higher.

In one possible implementation, the chip package structure further includes: the light path layer is arranged above the fingerprint sensor chip; the fingerprint sensor chip is used for receiving fingerprint optical signals which are returned by a human finger above the display screen and guided by the light path layer.

In one possible implementation, the chip package structure further includes: and the optical filter is arranged above the ambient light sensor chip and is used for transmitting the wave band corresponding to the pixels in the ambient light sensor chip in the ambient light.

In one possible implementation, the width of the baffle structure is in the range of 0.2-25 mm.

The width range of the blocking structure is set between 0.2 mm and 25mm, so that materials can be reduced as far as possible under the condition of preventing light crosstalk, and therefore the cost of the electronic equipment is reduced, and the design difficulty of the whole electronic equipment is reduced.

In a possible implementation, the width of the baffle structure is in the range of 0.6-5 mm.

The width range of the blocking structure is set to be 0.6-5mm, so that the cost can be reduced as far as possible under the condition of preventing light crosstalk, and the performance of the electronic equipment is improved.

In a second aspect, a chip package structure is provided, which is suitable for an electronic device having a display screen and disposed below the display screen, the chip package structure including: the fingerprint sensor chip is used for receiving a fingerprint optical signal returned by a human finger above the display screen, and the fingerprint optical signal is used for detecting fingerprint information of the finger; the electronic device comprises an ambient light sensor chip, a light sensor chip and a light sensor, wherein the ambient light sensor chip is used for receiving an ambient light signal of the electronic device, and the ambient light signal is used for detecting the intensity of ambient light of the electronic device; the fingerprint sensor chip and the ambient light sensor chip are packaged on the circuit board; the distance between the fingerprint sensor chip and the ambient light sensor chip is greater than or equal to a preset value, so that light crosstalk does not occur between the fingerprint sensor chip and the ambient light sensor chip.

By increasing a feasible distance between the fingerprint sensor chip and the ambient light sensor chip, further, crosstalk influence can be filtered through an algorithm, so that the cost of a chip packaging structure can be reduced while the detection performance is ensured.

In one possible implementation, the preset value is determined based on at least one of the following parameters: the size of the photosensitive area of the fingerprint sensor chip and the size of the photosensitive area of the ambient light sensor chip, the distance between the field angle FOV required by the fingerprint sensor chip and the FOV required by the ambient light sensor chip, the safety distance between the avoidance FOV of the fingerprint sensor chip and the avoidance FOV of the ambient light sensor chip, and the distance from the display screen to the upper surface of the fingerprint sensor chip and the distance from the display screen to the upper surface of the ambient light sensor chip.

In a possible implementation, the preset value is 0.4-25 mm.

By setting the preset value between 0.4 mm and 25mm, the size of the chip packaging structure can be reduced as much as possible under the condition of preventing light crosstalk.

In one possible implementation, the chip package structure further includes: the stiffening plate is arranged below the circuit board; the upper surface downwardly extending of this circuit board and link up this circuit board in order to form two windows, this fingerprint sensor chip and this environment light sensor chip fixed respectively set up in these two windows.

In a third aspect, an electronic device is provided, including: a display screen; the chip package structure according to the first aspect or any one of the possible implementation manners of the first aspect, wherein the chip package structure is fixedly disposed below the display screen.

In a possible implementation manner, the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer, and the chip packaging structure is aligned to the window so that the fingerprint sensor chip and the ambient light sensor chip receive an optical signal penetrating through the display screen through the window.

In one possible implementation, the electronic device further includes: the upper surface of the middle frame extends downwards to form a groove, and the chip packaging structure is fixedly arranged in the groove of the middle frame.

In a fourth aspect, an electronic device is provided, comprising: a display screen; the chip package structure according to the second aspect or any one of the possible implementations of the second aspect, wherein the chip package structure is fixedly disposed below the display screen.

Drawings

Fig. 1 shows a schematic diagram of an electronic device according to an embodiment of the present application.

Fig. 2 shows a schematic structural diagram of a chip package structure according to an embodiment of the present application.

Fig. 3 shows a schematic diagram of crosstalk paths between chips in an embodiment of the present application.

Fig. 4 shows a schematic diagram of crosstalk paths between chips in an embodiment of the present application.

Fig. 5 shows another schematic structural diagram of the chip package structure according to the embodiment of the present application.

Fig. 6 shows a further schematic structural diagram of the chip package structure of the embodiment of the present application.

Fig. 7 shows a further schematic structural diagram of the chip package structure of the embodiment of the present application.

Fig. 8 is a schematic structural diagram of a chip package structure according to an embodiment of the present application.

Fig. 9 illustrates a top view of the chip package structure shown in fig. 8.

Fig. 10 illustrates a top view of the chip package structure shown in fig. 5.

Fig. 11 illustrates a top view of the chip package structure shown in fig. 6.

Fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

As a common application scenario, the technical solution of the embodiment of the present application may be applied to a smart phone, a tablet computer, and other electronic devices with a display screen, and more specifically, in the electronic devices, the chip package structure may be disposed in a local area below the display screen.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity. It should be understood that the thickness, length, width and other dimensions of the various components in the embodiments of the present application and the overall thickness, length, width and other dimensions of the integrated device shown in the drawings are only exemplary and should not constitute any limitation to the present application.

With the development of mobile communication devices, fingerprint Sensors and Ambient Light Sensors (ALS) have become Sensors for electronic device standards. With the advent of the full screen age, fingerprint sensors and ambient light sensors need to be disposed below a display screen to achieve underscreen fingerprint identification and ambient light detection.

The fingerprint sensor is a fingerprint sensor chip with an optical sensing array, wherein the optical sensing array comprises a plurality of optical sensing units, and each optical sensing unit can specifically comprise a light detector or a photoelectric sensor. Alternatively, the fingerprint sensor may include a Photo detector array (or referred to as a Photo detector array, a Photo sensor array) including a plurality of Photo detectors distributed in an array. Specifically, the fingerprint sensor is used for receiving fingerprint light signals returned by a human finger above the display screen so as to detect fingerprint information of the finger.

The ambient light sensor may particularly be a light sensor, for example, the light sensor includes, but is not limited to, at least one photodiode. Specifically, the ambient light sensor is used for receiving an ambient light signal after passing through the display screen so as to detect the intensity of ambient light.

Generally, the module (e.g., the optical fingerprint module) where the fingerprint sensor is located is distributed in the area under the screen of the lower half of the electronic device, such as the area 101 shown in fig. 1, and the module (e.g., the ambient light detection module) where the ambient light sensor is located is mainly distributed in the upper half of the electronic device, such as "bang", the narrow slit between the middle frame and the display screen, and the area under the screen above the display area 104, such as the

areas

102 and 103 shown in fig. 1. Because the current ambient light detection module adopts a Land Grid Array (LGA) packaging mode or a Quad Flat No-leads (QFN) packaging mode, which is thicker in the thickness direction and generally larger than 0.5mm, the application of the ambient light detection module between a middle frame and a display screen is limited, in addition, when the whole electronic device is designed, the arrangement of larger elements such as a camera, a mainboard, a loudspeaker and a vibration motor can be considered preferentially, so that the arrangement of an ambient light sensor is limited, and the development of the electronic device towards the direction of lightness and thinness is not facilitated.

Therefore, the embodiment of the application provides a chip packaging structure, which packages a fingerprint sensor chip and an ambient light sensor chip together, so that the space of electronic equipment can be saved, the difficulty of the structural design of the whole electronic equipment is reduced, the development of the electronic equipment towards the direction of lightness and thinness is facilitated, and the cost of the electronic equipment can be reduced.

The chip packaging structure provided by the embodiment of the application is suitable for electronic equipment with a display screen, and particularly, the chip packaging structure can be arranged below the display screen. Alternatively, the display screen may be a self-luminous display screen employing display units having self-luminous properties as display pixels. For example, the display screen may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. In addition, the display screen can be specifically a touch display screen, which not only can display images, but also can detect touch or pressing operation of a user, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the electronic device may include a Touch sensor, which may be embodied as a Touch Panel (TP), which may be disposed on a surface of the display screen, or may be partially or entirely integrated within the display screen 120, thereby forming the Touch display screen.

Fig. 2 shows a schematic block diagram of a chip package structure provided in an embodiment of the present application. Specifically, as shown in fig. 2, the chip package structure includes:

a fingerprint sensor chip 201, configured to receive a fingerprint optical signal returned by a human finger above the display screen 210, where the fingerprint optical signal is used to detect fingerprint information of the finger;

an ambient light sensor chip 202, configured to receive an ambient light signal of the electronic device, where the ambient light signal is used to detect an ambient light intensity of the electronic device;

the circuit board 203, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are packaged on the circuit board 203;

in the embodiment of the present application, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are unpackaged bare chips (die), or may also be referred to as bare wafers, and both are packaged on the circuit board 203, that is, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are electrically connected to the circuit board 203. For example, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may be electrically connected to the circuit board 203 by gold wires 209. In other words, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may enable typical interconnection and signal transmission with other peripheral circuits or other elements in the electronic device through the circuit board 203.

If the fingerprint sensor chip 201 and the ambient light sensor chip 202 are packaged together, light cross-talk may occur between the fingerprint sensor chip 201 and the ambient light sensor chip 202. For example, an optical signal reflected by the surface of the fingerprint sensor chip 201 may be received by the ambient light sensor chip 202, thereby affecting the detection of ambient light. Similarly, light signals reflected by the surface of the ambient light sensor chip 202 may be received by the fingerprint sensor chip 201, thereby affecting fingerprint imaging.

As shown in fig. 3, when the fingerprint sensor chip 201 does not operate and the environmental sensor chip 202 operates, the light signal P1 incident on the surface of the fingerprint sensor chip 201 is reflected to the display screen 210, the light signal P2 reflected again by the display screen 210 is incident on the photosensitive area of the environmental light sensor chip 202, and when the environmental light sensor chip 202 performs the environmental light intensity detection of the electronic device based on the light signal directly incident on the photosensitive area through the display screen 210, the light signal P2 interferes with the environmental light detection.

As shown in fig. 3, when the ambient light sensor chip 202 does not operate and the fingerprint sensor chip 201 operates, the light signal P3 incident on the surface of the ambient light sensor chip 202 is reflected to the display screen 210, and the light signal P4 reflected again by the display screen 210 is incident on the photosensitive area of the fingerprint sensor chip 201, and when the fingerprint sensor chip 201 performs fingerprint detection based on the fingerprint light signal returned by the human finger above the display screen 210, the light signal P4 may interfere with the fingerprint detection.

Therefore, the chip package structure provided by the embodiment of the present application further includes: and the blocking structure 204 is arranged between the fingerprint sensor chip 201 and the ambient light sensor chip 202 and is used for preventing light crosstalk between the fingerprint sensor chip 201 and the ambient light sensor chip 202.

In an embodiment, the Circuit board 203 may be a Flexible Circuit board (FPC), and further, the chip package structure may further include: the stiffener 205 and the circuit board 203 may be fixedly disposed above the stiffener 205, for example, a lower surface of the circuit board 203 is fixed to an upper surface of the stiffener 205 by a double-sided tape.

Alternatively, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may be fixedly disposed on the upper surface of the circuit board 203, for example, the lower surfaces of the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively fixed on the upper surface of the circuit board 203 by a glue layer.

Optionally, the circuit board 203 may be further provided with a window, for example, an upper surface of the circuit board 203 extends downward and penetrates through the circuit board 203 to form two windows, and the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively fixed in two grooves of the circuit board 203. That is, the fingerprint sensor chip 201 and the ambient light sensor chip are respectively fixed on the upper surface of the reinforcing plate 205, and the circuit board 203 is respectively disposed around the fingerprint sensor chip 201 and the ambient light sensor chip 202, for example, the fingerprint sensor chip 201 and the ambient light sensor chip are fixed on the upper surface of the reinforcing plate 205 by Die Attach Film (DAF).

In another embodiment, the circuit board 203 may be a substrate. For example, the substrate may include, in order from top to bottom, a first cover layer, a first conductive layer, a substrate layer, a second conductive layer, and a second cover layer, an upper surface of the substrate extends downward in a first region and penetrates through the first cover layer and the first conductive layer to form two grooves, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may be respectively and fixedly disposed in the two grooves, the upper surface of the substrate extends downward in a second region and penetrates through the first cover layer to form a pad of the substrate, and the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively connected to the pad to achieve electrical connection.

Alternatively, the number of the pads of the substrate may be one, and is disposed between the fingerprint sensor chip 201 and the ambient light sensor chip 202. Alternatively, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may be provided with corresponding pads, respectively.

In another embodiment, the Circuit Board 203 may also be a Printed Circuit Board (PCB) or other type of Circuit Board.

Through windowing the circuit board or windowing part of the substrate layer, the fingerprint sensor chip and the ambient light sensor chip are arranged in the windowing, so that the thickness of the chip packaging structure can be reduced, and the thickness of the electronic equipment can be further saved.

The chip package structure provided by the present application will be described in detail below with reference to fig. 5 to 8 by taking the example that the chip package structure includes a circuit board and a stiffener.

Optionally, in this embodiment of the present application, the chip package structure further includes: and an optical path layer 230.

An optical path layer 230 may be disposed above the fingerprint sensor chip 201, and the fingerprint sensor chip 201 is configured to receive a fingerprint light signal returned by a human finger above the display screen 210 and guided through the optical path layer 230.

Optionally, the optical path layer 230 includes a lens layer 233 and an optical path guiding layer 232, the lens layer 233 is used for converging the optical signal returned by the human finger above the display screen to the optical path guiding layer 232, and the optical path guiding layer 232 guides the optical signal converged by the lens layer 233 to the fingerprint sensor chip 201.

The lens layer 233 may have a microlens array formed of a plurality of microlenses, which may be formed over the sensing array of the fingerprint sensor chip 201 through a semiconductor growth process or other processes, and each microlens may correspond to one or more sensing elements of the sensing array, respectively. Other optical film layers, such as a dielectric layer or a passivation layer, may be further formed between the lens layer 233 and the sensing units, and more particularly, a light blocking layer (e.g., a light path guiding layer 232) having micro holes formed between the corresponding microlenses and the sensing units may be further included between the lens layer 233 and the sensing units, and the light blocking layer may block optical interference between adjacent sensing units and allow light to be converged into the micro holes through the microlenses and transmitted to the sensing units corresponding to the microlenses through the micro holes for optical fingerprint imaging.

Optionally, the optical path layer 230 may also be a collimater (collimater) layer with a high aspect ratio via array. The optical collimator layer can be specifically a collimator layer made of a semiconductor silicon wafer and provided with a plurality of collimating units or micropores, the collimating units can be specifically small holes, in reflected light reflected back from a finger, light rays perpendicularly incident to the collimating units can penetrate through and be received by a sensor chip below the collimating units, light rays with overlarge incident angles are attenuated in the collimating units through multiple reflections, and therefore the sensor chip can only receive the reflected light reflected back by fingerprint lines right above the sensor chip basically, image resolution can be effectively improved, and fingerprint identification effect is further improved.

It should be noted that several implementations of the above optical path layer may be used alone or in combination, for example, a lens layer may be further disposed below the optical collimator layer. Of course, when the collimator layer is used in combination with the lens layer, its specific stack structure or optical path may need to be adjusted according to actual needs.

Optionally, the chip package structure may further include a first filter, and the first filter may be disposed above the fingerprint sensor chip 201, for example, the first filter may be disposed on an upper surface of the fingerprint sensor chip 201. For another example, the first filter may also be disposed between the fingerprint sensor chip 201 and the optical path layer 230, or may be disposed inside or above the optical path layer, which is not particularly limited in this application.

Optionally, the chip package structure may further include a second filter 234, which may be disposed above the ambient light sensor chip 202, for example, the second filter may be disposed on the upper surface of the ambient light sensor chip 202.

In the embodiment of the present application, the first optical filter is used to reduce the undesired ambient light in the fingerprint sensing to improve the optical sensing of the received light signal by the fingerprint sensor chip 201. The first filter may be specifically configured to filter out light of a particular wavelength, such as near infrared light and a portion of red light. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm, and if one or more optical filters or optical filter layers are designed to filter light with a wavelength from 580nm to infrared, the effect of ambient light on the optical detection in fingerprint sensing can be greatly reduced. In particular implementations, the optical filter may include one or more optical filters, which may be configured, for example, as bandpass filters, to allow transmission of light emitted by the OLED screen while blocking other light components, such as infrared light in sunlight.

The second filter 234 is used for transmitting a wavelength band corresponding to a pixel included in the ambient light sensor chip 202 in the ambient light. For example, if the ambient light sensor chip includes infrared light pixels, the second filter 234 is used to filter out visible light in the ambient light and transmit infrared light in the ambient light; if the ambient light sensor chip includes visible light pixels such as red light pixels, blue light pixels, and green light pixels, the second filter 234 may be used to filter out infrared light from the ambient light and transmit visible light from the ambient light.

The optical filter may be implemented, for example, as an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. For example, the first filter may be a coating designed directly on the lens layer 233 to avoid newton's rings in the fingerprint image acquired by the fingerprint sensor chip 201. Optionally, in addition, the light entrance surface of the optical filter may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectivity of the light entrance surface of the optical filter is lower than a first threshold, for example, 1%, thereby ensuring that the fingerprint sensor chip 201 and the ambient light sensor chip 202 can receive sufficient optical signals, and further improving the fingerprint identification effect and the ambient light detection effect.

Optionally, other optical path structures may also be included for the ambient light sensor chip 202 in the embodiment of the present application. For example, including optical path layers applied in the fingerprint sensor chip 201. The embodiments of the present application do not limit this.

Optionally, in this embodiment of the present application, the chip package structure further includes: a first foam layer 206. The first foam layer 206 may be fixedly disposed on the upper surface of the circuit board 203. For example, the first foam layer 206 may be fixedly disposed on the upper surface of the circuit board 203 by a fixing adhesive. Alternatively, the fixing glue may be a double-sided glue. In other alternative embodiments, the first foam layer 206 and the securing gel may be combined into one layer. For example, during the process of manufacturing the first foam layer 206, a glue layer may be formed on the lower surface of the first foam layer 206 at the same time.

Further, when the first foam layer 206 is fixed on the upper surface of the circuit board through the double-sided tape, the first foam layer 206 may further have two windows, and the two windows of the first foam layer 206 may be respectively aligned with the two windows of the circuit board 203. Thus, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may receive the light signal transmitted through the display screen 210. Further, the window size of the two windows of the first foam layer 206 may be smaller than or equal to the window size of the two windows of the circuit board 203. For example, the window sizes of the two windows of the first foam layer 206 may be respectively smaller than the window sizes of the windows corresponding to the circuit board 203, and respectively greater than or equal to the size of the light inlet surface of the fingerprint sensor chip 201 and the size of the light inlet surface of the ambient light sensor chip 202 located in the two windows of the circuit board 203.

Optionally, in this embodiment of the present application, the chip package structure further includes: a light-shielding layer 208.

Optionally, the light shielding layer 208 may be formed on at least upper surfaces of edge regions of the fingerprint sensor chip 201 and the ambient light sensor chip 202, respectively, where the light shielding layer 208 partially shields the edge regions of the fingerprint sensor chip 201 and the ambient light sensor chip 202 and does not shield the sensing regions of the fingerprint sensor chip 201 and the ambient light sensor chip 202, and the light shielding layer 208 is used to prevent the edge region of the fingerprint sensor chip 201 from causing optical crosstalk to the sensing region of the fingerprint sensor chip 201 and the edge region of the ambient light sensor chip 202 from causing optical crosstalk to the sensing region of the ambient light sensor chip 202. Specifically, the light shielding layer 208 is used to prevent the non-sensing area of the fingerprint sensor chip 201 from causing light crosstalk to the sensing area of the fingerprint sensor chip 201 and the non-sensing area of the ambient light sensor chip 202 from causing light crosstalk to the sensing area of the ambient light sensor chip 202.

Optionally, the light shielding layer 208 may partially wrap the edge region of the optical filter, so that the optical filter and the light shielding layer can completely filter out the optical signals in the non-target wavelength bands and transmit the optical signals in the target wavelength bands required by the fingerprint sensor chip 201 and the ambient light sensor chip 202.

Of course, in other alternative embodiments, a filter may be used instead of the light-shielding layer 208.

Alternatively, the light-shielding layer 208 may be ink, or may be another light-shielding material.

Optionally, in an embodiment of the present application, the chip package structure further includes: the gold wire 209, the fingerprint sensor chip 201, and the ambient light sensor chip 202 are connected to the circuit board 203 by the gold wire 209.

Alternatively, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may be fixedly mounted in two windows of the circuit board 203 by means of a fixing glue. The fixing glue includes, but is not limited to, thermosetting glue. The fixing glue can fix the fingerprint sensor chip 201 and the ambient light sensor chip 202, and can also be used for packaging a gold wire 209.

It should be noted that, the gold wire used for electrical connection between the ambient light sensor chip and the circuit board is not illustrated in the drawings, that is, the drawings are only used for schematically illustrating the technical solution of the present application and are not limited.

Alternatively, the circuit board 203 and the reinforcing plate 205 may be sandwiched by a glue layer 241, for example, the glue layer 241 may be a double-sided tape.

In the embodiment of the present application, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are packaged together, so that the assembly process can be effectively reduced, and the thickness of the chip package structure can be reduced, especially for the ambient light sensor chip, the thicknesses of the stacked layers in the chip package structure at positions a-A, B-B, C-C and D-D will be schematically described below with reference to fig. 5-8 and table 1.

TABLE 1

Wherein, the thickness is not described, and can be adjusted according to the requirements of customers and actual production.

Optionally, in this embodiment of the application, taking the display screen 210 as an OLED screen as an example, the display screen 210 may be a soft screen or a hard screen. When a finger is placed above the bright-screen OLED screen, the finger will reflect light emitted by the OLED screen, the reflected light needs to penetrate through the OLED screen to reach the fingerprint sensor chip 201, or the ambient light needs to penetrate through the OLED screen to reach the ambient light sensor chip 202, because a protective layer is arranged below the light emitting layer of the OLED screen, the protective layer is made of a light-tight material, in order to guide the reflected light and the ambient light to the fingerprint sensor chip 201 and the ambient light sensor chip 202 respectively, windows need to be arranged at the installation positions of the fingerprint sensor chip 201 and the ambient light sensor chip 202 by the protective layer, so that the reflected light and the ambient light can reach the fingerprint sensor chip 201 and the ambient light sensor chip 202 respectively.

Optionally, since the fingerprint sensor chip 201 and the ambient light sensor chip 202 in the embodiment of the present application are packaged on the same circuit board 203, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may have a common component layout area, for example, an area for placing passive components such as a capacitor, a resistor, and an inductor. Optionally, the fingerprint sensor chip 201 and the ambient light sensor chip 202 may also have the same connector. For example, a connector may be disposed at one end of the circuit board 203, and the connector 294 may be used for connecting with an external device or other components (e.g., a motherboard) of the electronic apparatus, so as to realize communication with the external device or other components of the electronic apparatus. For example, the connector 294 may be used to connect a processor of the electronic device, so that the processor of the electronic device receives fingerprint information detected by the fingerprint sensor chip 201 and performs fingerprint identification based on the processed fingerprint information.

Compared with the scheme of independently setting the environmental light sensor chip, the chip packaging structure provided by the embodiment of the application can further reduce the process cost, thereby being more beneficial to the whole machine design of the electronic equipment and the light and thin development of the electronic equipment.

Fig. 5 is a schematic structural diagram illustrating a chip package structure according to an embodiment of the present application.

Alternatively, as shown in fig. 5, the protective layer is provided with a window, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are aligned with the window, the blocking structure 204 may be fixed on the upper surface of the reinforcing plate 205, and the blocking structure 204 sequentially includes, from bottom to top, a circuit board 203 and a foam layer, and the foam layer is fixed on the lower surface of the light emitting layer of the display screen 210.

Optionally, the foam layer in the blocking structure 204 may be formed by extending the first foam layer 206 upward to the lower surface of the light emitting layer, or a second foam layer may be further disposed on the upper surface of the first foam layer 206, as shown in fig. 5 as a second foam layer 231, and optionally, the second foam layer 231 may not be a foam material, and may be a light blocking material made of other materials such as rubber.

Fig. 6 is a schematic structural diagram illustrating another chip package structure according to an embodiment of the present application.

Optionally, as shown in fig. 6, the protective layer is provided with two windows, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively aligned with the two windows, the blocking structure 204 may be fixed on the upper surface of the reinforcing plate 205, and the blocking structure 204 sequentially includes, from bottom to top, a circuit board 203 and a first foam layer, which is fixed on the lower surface of the protective layer of the display screen 210.

Through set up between fingerprint sensor chip and environment light sensor chip and separate fender structure, can prevent the light between fingerprint sensor chip and the environment light sensor chip and crosstalk to can improve the detection performance.

Optionally, as shown in fig. 5 and 6, the chip package structure further includes: and the fingerprint driving chip 207 is used for matching with the fingerprint sensor chip 201 to perform fingerprint identification. The fingerprint driving chip 207 is also packaged on the circuit board 203.

The fingerprint driving chip 207 may be disposed in the same window as the fingerprint sensor chip 201, for example, the fingerprint driving chip 207 may be fixedly disposed on the upper surface of the stiffener 205 and electrically connected to the circuit board 203 through a gold wire 209, so that the fingerprint driving chip 207 is connected to the fingerprint sensor chip 201.

Alternatively, as shown in fig. 7, the chip package structure may not include the fingerprint driver chip 207, and the fingerprint driver circuit is integrated in the fingerprint sensor chip 201, in other words, the fingerprint sensor chip 201 may implement both the fingerprint driving function and the fingerprint identification function.

Optionally, in the embodiment of the present application, the width of the baffle structure 204 ranges from 0.2 mm to 25mm, and further, the width of the baffle structure ranges from 0.6 mm to 5 mm.

The width range of the blocking structure is set within a certain range, so that the cost can be reduced as far as possible under the condition of preventing light crosstalk, and the performance of the electronic equipment is improved.

Fig. 8 is a schematic structural diagram illustrating another chip package structure according to an embodiment of the present application.

In the chip package structure shown in fig. 8, the blocking structure 204 is not included, but the distance between the fingerprint sensor chip 201 and the ambient light sensor chip 202 is designed to be greater than or equal to a preset value, so that no light crosstalk occurs between the fingerprint sensor chip 201 and the ambient light sensor chip 202.

Alternatively, the preset value may be determined based on at least one of the parameters shown in fig. 3 and 4: the photosensitive area of fingerprint sensor chip with the photosensitive area's of ambient light sensor chip size A, the required angle of vision (FOV) of fingerprint sensor chip with the required FOV's of ambient light sensor chip distance C, the dodging FOV of fingerprint sensor chip with the ambient light sensor chip dodge FOV's safe distance B, the display screen arrives the upper surface of fingerprint sensor chip and the display screen arrives the distance D of the upper surface of ambient light sensor chip.

Optionally, the preset value ranges between 0.4-25mm, for example, the preset value is 4.28.

The light crosstalk between the ambient light sensor chip and the fingerprint sensor chip, the crosstalk illuminance and the total illuminance after passing through the screen are in a certain percentage, and the closer the distance between the chips is, the larger the proportion is. In the view of the path, the crosstalk is most easily generated by the large-angle light of the light rays penetrating through the window edge of the display screen, the reflecting distance of the light rays passing through the surface of the chip is longer, and the crosstalk of the light rays between the chips is smaller as the distance between the chips is longer as shown by the angle formed by the light path.

The chip package structure shown in fig. 8 may not add the blocking structure 204, and may further filter the crosstalk influence through an algorithm by adding a feasible distance between the fingerprint sensor chip 201 and the ambient light sensor chip 202, so that the cost of the chip package structure may be reduced while the detection performance is ensured.

Fig. 9 is a top view of the chip package structure shown in fig. 8, fig. 10 is a top view of the chip package structure shown in fig. 5, and fig. 11 is a top view of the chip package structure shown in fig. 6. Alternatively, as shown in fig. 9 and 10, the width of the barrier structure 204 between the fingerprint sensor chip 201 and the ambient light sensor chip 202 is 2 mm. Optionally, the limiting foam width of the baffle structure 204 is at least 0.8 mm. Alternatively, as shown in fig. 9-11, the distance between the fingerprint sensor chip 201 and the ambient light sensor chip 202 is 4.28.

Alternatively, the side length of the chip package structure may be in the range of 10-50mm, for example, as shown in fig. 9-11, the chip package structure is 22.98mm long and 13.78mm wide.

It should be noted that the above dimensions are only schematic illustrations, and the above dimensions can be adjusted when in different application environments.

In addition, the baffle structure in the embodiment of the present application is not limited to the shape shown in the drawings, and the top view of the baffle structure may be a circle or a square, for example.

Optionally, the chip package structure provided by the embodiment of the present application may be placed at any position below the display screen. And the placing position between the chip is also not limited, for example, the photosensitive area of the fingerprint sensor chip can be placed at the central position of the display screen, and the fingerprint driving chip and the ambient light sensor chip can be placed at any side of the fingerprint sensor chip. The different positional relationships have minimal impact on performance, mainly due to the size of the chip package and the structural environment that is limited by the overall application.

Optionally, an embodiment of the present application further provides an electronic device, including a display screen 210 and the chip packaging structure provided in the foregoing various embodiments, where the chip packaging structure is fixedly disposed below the display screen 210.

Optionally, the electronic device further includes a middle frame 220, wherein the chip package structure is fixed between the display screen 210 and the middle frame 220.

Fig. 12 and 13 show schematic structural diagrams of an electronic device of an embodiment of the present application.

As shown in fig. 12, the chip package structure is fixed to the lower surface of the display screen 210 by a fixing adhesive. For example, the upper surface of the foam layer 206 in the chip package structure is fixedly bonded to the lower surface of the display screen.

As shown in fig. 13, the chip package structure is further fixed on the upper surface of the middle frame 220 by a fixing adhesive. For example, the stiffener 205 in the chip package structure is fixedly attached to the upper surface of the middle frame 220 of the electronic device. Optionally, a groove is formed in the upper surface of the middle frame 220 in a downward extending manner, and the lower surface of the chip package structure is fixed in the groove of the middle frame 220.

Through being fixed in the center recess with chip package structure, can practice thrift electronic equipment's space to be favorable to electronic equipment to develop towards frivolous direction.

Because the chip packaging structure provided by the embodiment of the application is thinner and lighter, when the chip packaging structure is required to be arranged in the groove of the middle frame, the situation that the groove depth of the middle frame is too large and the strength of the middle frame is reduced is avoided.

Optionally, as shown in fig. 12 and 13, the display screen 210 further includes a light emitting layer 211 and a protective layer, wherein the light emitting layer 211 includes a transparent cover plate and a display panel, and the protective layer may include a buffer layer 212 and a copper layer 214, that is, the display screen 210 includes a transparent cover plate, a display panel, a buffer layer and a copper layer in sequence from top to bottom, wherein the buffer layer 212 and the copper layer 214 may be fixed by a glue 213. The display screen 210 is provided with a window penetrating the buffer layer 330 and the copper layer 340. Alternatively, the display screen may be an OLED organic light emitting panel manufactured by Low Temperature Polysilicon (LTPS) technology, which has an ultra-thin thickness, a light weight, and Low power consumption, and may be used to provide a relatively clear image. The middle frame 220 may be used to carry or support various devices or components in the electronic apparatus 300. The devices or components include, but are not limited to, a battery, a camera, an antenna, a motherboard, and the display screen.

The buffer layer 212 may also be referred to as a screen print layer or an embossing layer, which may carry graphics that may be used as indicia such as a trademark logo. The buffer layer 212 may be a black sheet layer or a printed layer for shielding light. For example, the cushioning layer 212 may be a layered structure formed from a foam material. The copper layer 214 may also be referred to as a heat sink layer (which serves to reduce the temperature of the display) or a radiation protective layer. The buffer layer 212 and the copper layer 214 may be integrated into a rear panel of the display screen, or the copper layer 214 is referred to as a rear panel of the display screen.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A chip package structure, adapted to an electronic device having a display screen and fixedly disposed below the display screen, the chip package structure comprising:

the fingerprint sensor chip is used for receiving a fingerprint optical signal returned by a human finger above the display screen, and the fingerprint optical signal is used for detecting fingerprint information of the finger;

the electronic device comprises an ambient light sensor chip, a light source module and a light source module, wherein the ambient light sensor chip is used for receiving an ambient light signal of the electronic device, and the ambient light signal is used for detecting the intensity of ambient light of the electronic device;

the circuit board is packaged with the fingerprint sensor chip and the ambient light sensor chip;

and the blocking structure is arranged between the fingerprint sensor chip and the environment light sensor chip and used for preventing the fingerprint sensor chip and the environment light sensor chip from light crosstalk.

2. The chip package structure according to claim 1, further comprising:

the reinforcing plate is arranged below the circuit board;

the upper surface downwardly extending of circuit board link up the circuit board is in order to form two windowing, the fingerprint sensor chip with environment light sensor chip respectively fixed set up in two windowing.

3. The chip packaging structure of claim 2, wherein a protective layer is disposed on a lower surface of a light emitting layer of the display screen, the protective layer is provided with a window, the fingerprint sensor chip and the ambient light sensor chip are aligned to the window, so that the fingerprint sensor chip and the ambient light sensor chip receive and transmit the optical signal of the display screen through the window, the barrier structure sequentially comprises the circuit board and the foam layer from bottom to top, and the foam layer is fixed on the lower surface of the light emitting layer.

4. The chip packaging structure according to claim 2, wherein a protective layer is disposed on a lower surface of a light emitting layer of the display screen, the protective layer is provided with two windows, the fingerprint sensor chip and the ambient light sensor chip are respectively aligned with the two window settings, so that the fingerprint sensor chip and the ambient light sensor chip receive and transmit the optical signal of the display screen through the corresponding windows, the barrier structure sequentially comprises the circuit board and the foam layer from bottom to top, and the foam layer is fixed on the lower surface of the protective layer.

5. The chip package structure according to claim 1, wherein the fingerprint sensor chip and the ambient light sensor chip have a common component arrangement area, and/or the fingerprint sensor chip and the ambient light sensor chip share a connector.

6. The chip package structure according to claim 1, further comprising:

the light shading layer is formed on the upper surface of the edge area of the fingerprint sensor chip and the upper surface of the edge area of the ambient light sensor chip respectively, the light shading layer does not shade the sensing area of the fingerprint sensor chip and the sensing area of the ambient light sensor chip, and the light shading layer is used for preventing the edge area of the fingerprint sensor chip from causing light crosstalk to the sensing area of the fingerprint sensor chip and preventing the edge area of the ambient light sensor chip from causing light crosstalk to the sensing area of the ambient light sensor chip.

7. The chip package structure according to claim 1, further comprising:

the fingerprint driving chip is used for matching with the fingerprint sensor chip to carry out fingerprint identification;

the fingerprint driving chip is packaged on the circuit board.

8. The chip package structure of claim 1, wherein the fingerprint sensor chip further comprises a fingerprint driving circuit.

9. The chip package structure according to claim 1, further comprising:

the light path layer is arranged above the fingerprint sensor chip;

the fingerprint sensor chip is used for receiving fingerprint optical signals which are returned by a human finger above the display screen and guided by the light path layer.

10. The chip package structure according to claim 1, further comprising:

and the optical filter is arranged above the ambient light sensor chip and is used for transmitting a wave band corresponding to the pixels in the ambient light sensor chip in the ambient light.

11. The chip package structure according to claim 1, wherein the width of the barrier structure is in a range of 0.2-25 mm.

12. The chip package structure according to claim 11, wherein the width of the blocking structure is in a range of 0.6-5 mm.

13. A chip package structure, adapted to an electronic device having a display screen and disposed below the display screen, the chip package structure comprising:

the distance between the fingerprint sensor chip and the ambient light sensor chip is larger than or equal to a preset value, so that light crosstalk does not occur between the fingerprint sensor chip and the ambient light sensor chip.

14. The chip package structure according to claim 13, wherein the preset value is determined based on at least one of the following parameters: the size of the photosensitive area of the fingerprint sensor chip and the size of the photosensitive area of the ambient light sensor chip, the distance between the field angle FOV required by the fingerprint sensor chip and the FOV required by the ambient light sensor chip, the safety distance between the avoidance FOV of the fingerprint sensor chip and the avoidance FOV of the ambient light sensor chip, and the distance from the display screen to the upper surface of the fingerprint sensor chip and the distance from the display screen to the upper surface of the ambient light sensor chip.

15. The chip package structure according to claim 13, wherein the predetermined value is in a range of 0.4-25 mm.

16. The chip package structure according to claim 13, further comprising:

the reinforcing plate is arranged below the circuit board;

17. The chip package structure according to claim 13, wherein the fingerprint sensor chip and the ambient light sensor chip have a common component layout area, and/or the fingerprint sensor chip and the ambient light sensor chip share a connector.

18. The chip package structure according to claim 13, further comprising:

19. The chip package structure according to claim 13, further comprising:

the fingerprint driving chip is packaged on the circuit board.

20. The chip package structure of claim 13, wherein the fingerprint sensor chip further comprises a fingerprint driver circuit.

21. An electronic device, comprising:

a display screen;

the chip package structure according to any one of claims 1 to 12, being fixedly disposed below the display screen.

22. The electronic device of claim 21, wherein the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer, and the chip packaging structure is aligned with the window so that the fingerprint sensor chip and the ambient light sensor chip receive the optical signal penetrating through the display screen through the window.

23. The electronic device of claim 21 or 22, further comprising:

the upper surface downwardly extending of center is formed with the recess, chip packaging structure fixed set up in the recess of center.

24. An electronic device, comprising:

a display screen;

the chip packaging structure according to any one of claims 13 to 20, disposed below the display screen.

25. The electronic device of claim 24, wherein the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer, and the chip packaging structure is aligned with the window so that the fingerprint sensor chip and the ambient light sensor chip receive the optical signal transmitted through the display screen through the window.

26. The electronic device of claim 24 or 25, further comprising: