CN211427367U - Fingerprint identification device and electronic equipment - Google Patents
Fingerprint identification device and electronic equipment Download PDFInfo
- Publication number
- CN211427367U CN211427367U CN202020182193.8U CN202020182193U CN211427367U CN 211427367 U CN211427367 U CN 211427367U CN 202020182193 U CN202020182193 U CN 202020182193U CN 211427367 U CN211427367 U CN 211427367U
- Authority
- CN
- China
- Prior art keywords
- fingerprint
- layer
- light
- blocking layer
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The embodiment of the application discloses fingerprint identification device and electronic equipment is favorable to the development and the application of fingerprint identification device who has the layer structure that is in the light, and can reduce fingerprint identification device's rete structure's quantity and simplify technology. This fingerprint identification device is applicable to the electronic equipment that has the display screen, fingerprint identification device is used for setting up the below of display screen, fingerprint identification device includes: the light blocking layer, the filter layer and the fingerprint sensor chip; the light blocking layer is arranged on the upper surface of the filter layer in a film coating mode, a first small hole array is arranged on the light blocking layer, and the first small hole array is used for guiding optical signals returned by fingers above the display screen to the fingerprint sensor chip; the fingerprint sensor chip is arranged below the filter layer and used for receiving optical signals returned by the finger, and the optical signals are used for fingerprint identification.
Description
Technical Field
The embodiment of the application relates to the field of fingerprint identification, and more particularly relates to a fingerprint identification device and an electronic device.
Background
With the coming of the full screen age of mobile phones, the application of the fingerprint under the screen is more and more extensive, wherein the optical fingerprint under the screen is the most popular.
The optical fingerprint identification device can be provided with the aperture array including the layer that is in the light, on the layer that is in the light, the aperture array is used for leading the light signal of returning through the finger of display screen top to the fingerprint sensor chip, and the fingerprint sensor chip can carry out fingerprint identification according to this light signal. In addition, the non-perforated area on the light blocking layer is used for absorbing light signals, so that the light signals in the non-perforated area are prevented from leaking to the fingerprint sensor chip, and the fingerprint detection performance of the fingerprint sensor chip is prevented from being influenced.
The current light-blocking layer is mainly manufactured by coating a Black Matrix (BM) photoresist, and the fingerprint identification device has a very high requirement on the optical absorption performance of the light-blocking layer material, so that relatively few materials capable of simultaneously meeting the coating operation mode and extremely causing optical characteristics exist in the current market, which limits the development and application of the fingerprint identification device with the light-blocking layer structure to a certain extent.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a fingerprint identification device and electronic equipment, and is favorable for development and application of the fingerprint identification device with a light blocking layer structure.
In a first aspect, a fingerprint identification device is provided, which is suitable for an electronic device having a display screen, and is configured to be disposed below the display screen, where the fingerprint identification device includes: the light blocking layer, the filter layer and the fingerprint sensor chip; the light blocking layer is arranged on the upper surface of the filter layer in a film coating mode, a first small hole array is arranged on the light blocking layer, and the first small hole array is used for guiding optical signals returned by fingers above the display screen to the fingerprint sensor chip; the fingerprint sensor chip is arranged below the filter layer and used for receiving optical signals returned by the finger, and the optical signals are used for fingerprint identification.
Based on the technical scheme provided by the embodiment of the application, the light blocking layer is not manufactured in a mode of coating the BM light resistor but in a film coating mode, and the optical effect equal to that of the BM light resistor can be realized through the matching of the film thickness and the structure of a specific type of material, so that the material selection can be enriched to a certain extent, the preparation way is widened, and the development and the application of a fingerprint identification device are facilitated. In addition, because the light blocking layer is manufactured in a film coating mode, the light blocking layer can be directly coated on the filter layer in the film coating mode, and an additional contact layer is not required to be added on the filter layer to ensure the adhesion force or the flatness between the film layers, so that the number of the film layer structures of the optical path can be reduced, and the process can be simplified.
In some possible implementations, the filter layer is disposed on the upper surface of the fingerprint sensor chip by a plating method.
In some possible implementations, the light blocking layer has a thickness of 0.5-5 μm.
In some possible implementation manners, the fingerprint sensor further includes an optically transparent medium layer disposed above the light blocking layer, and configured to adjust an optical path from the optical signal returned by the finger to the fingerprint sensor chip.
In some possible implementations, the optical device further includes a micro-lens array disposed above the light blocking layer for guiding the optical signal returned by the finger to the aperture array.
In some possible implementations, the fingerprint sensor chip includes a sensing array having a plurality of sensing units, the sensing array is configured to receive the optical signal for fingerprint identification; the fingerprint sensor chip further comprises a metal pattern layer, the metal pattern layer is arranged above the sensing array, a second small hole array is arranged on the metal pattern layer, and the second small hole array is used for guiding the optical signals to the sensing array.
In some possible implementations, a center of a first microlens of the microlens array, a center of a first aperture of the first aperture array, a center of a second aperture of the second aperture array, and a center of a first sensing element of the plurality of sensing elements are located on a straight line.
In some possible implementations, the light blocking layer is made of at least one of the following materials: metals, non-metallic compounds, and metal oxides.
In some possible implementations, the metal includes at least one of: chromium, copper, nano silver, the non-metallic compound comprises silicon dioxide and/or silicon nitride, and the metal oxide comprises titanium oxide and/or niobium oxide.
In some possible implementation manners, the reflectivity and the transmittance of the non-opening area of the light blocking layer to the optical signal under the wave band of 400nm to 1200nm are both less than 0.1%.
In some possible implementations, the aperture array on the light blocking layer is formed by etching after exposure and development or stripping process after exposure and development.
In some possible implementations, the filter layer is configured to filter optical signals in infrared and red bands.
In some possible implementations, the optical transparent medium layer has a transmittance of greater than 98% for optical signals in the visible light band.
In some possible implementations, the optically transparent medium layer is disposed on the upper surface of the light blocking layer by coating.
In some possible implementations, the optically transparent medium layer is disposed on the upper surface of the light blocking layer by a plating method.
In some possible implementations, the optically transparent dielectric layer is made of at least one of the following materials: silicon nitride, silicon dioxide, and silicon oxynitride.
In a second aspect, an electronic device is provided, comprising: a display screen, and the fingerprint identification device of the first aspect and any possible implementation thereof.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device used in an embodiment of the present application.
Fig. 2 is another schematic structural diagram of an electronic device used in an embodiment of the present application.
Fig. 3 is a schematic structural view of a fingerprint recognition device based on a light-blocking layer manufactured by a coating method.
Fig. 4 is a schematic structural diagram of a fingerprint identification device manufactured by adopting a film coating method according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a fingerprint identification device manufactured by adopting a film coating method according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of a fingerprint identification device including a plurality of light blocking layers according to an embodiment of the present application.
Fig. 7 is a schematic block diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
With the development of the times and the progress of science and technology, the screen occupation ratio of the screens of electronic products is higher and higher, and the full screen becomes the development trend of a plurality of electronic products. To accommodate the trend of such full-screen displays, light sensing devices such as fingerprint recognition, front cameras, etc. in electronic products are also placed under the screen. The most applied technology is the optical fingerprint identification technology under the screen, and because of the particularity of the optical fingerprint device under the screen, the light with the fingerprint signal is required to be capable of transmitting the fingerprint sensor under the screen, so that the fingerprint signal is obtained.
Taking optical fingerprint identification under a screen as an example, the fingerprint identification process is described in detail.
It should be understood that the embodiments of the present application can be applied to optical fingerprint systems, including but not limited to optical fingerprint identification systems and medical diagnostic products based on optical fingerprint imaging, and the embodiments of the present application are only described by way of example, but should not be construed as limiting the embodiments of the present application, and the embodiments of the present application are also applicable to other systems using optical imaging technology, etc.
As a common application scenario, the optical fingerprint system provided in the embodiment of the present application may be applied to portable or mobile computing devices such as smart phones, tablet computers, and game devices, and other electronic devices such as electronic databases, automobiles, and Automated Teller Machines (ATMs), but the embodiment of the present application is not limited thereto, and the embodiment of the present application may be applied to other mobile terminals or other electronic devices having display screens; more specifically, in the above electronic device, the fingerprint recognition device may be embodied as an optical fingerprint device, which may be disposed in a partial area or an entire area below the display screen, thereby forming an Under-screen (Under-display) optical fingerprint system. Alternatively, the fingerprint identification device may be partially or completely integrated into a display screen of the electronic device, so as to form an In-display (In-display) optical fingerprint system.
Fig. 1 and fig. 2 are two schematic structural diagrams of an electronic device to which the embodiment of the present application is applicable, where fig. 1 is a top view and fig. 2 is a side view. The electronic device 10 includes a display screen 120 and an optical fingerprinting device 130, wherein the optical fingerprinting device 130 is arranged in a local area below the display screen 120. The optical fingerprint device 130 comprises an optical fingerprint sensor, which comprises a sensing array 133 having a plurality of optical sensing units 131, and the area where the sensing array is located or the sensing area thereof is the fingerprint detection area 103 corresponding to the optical fingerprint device 130. As shown in fig. 1, the fingerprint detection area 103 is located in a display area of the display screen 120. In an alternative embodiment, the optical fingerprint device 130 may be disposed at other positions, such as the side of the display screen 120 or the edge opaque region of the electronic device 10, and the optical path is designed to guide the optical signal of at least a part of the display area of the display screen 120 to the optical fingerprint device 130, so that the fingerprint detection area 103 is actually located in the display area of the display screen 120.
It should be appreciated that the area of the fingerprint sensing area 103 may be different from the area of the sensing array of the optical fingerprint device 130, for example, by the design of optical path such as lens imaging, reflective folded optical path design or other optical path design such as light converging or reflecting, the area of the fingerprint sensing area 103 corresponding to the optical fingerprint device 130 may be larger than the area of the sensing array of the optical fingerprint device 130. In other alternative implementations, if light path guidance is performed by, for example, light collimation, the fingerprint sensing area 103 corresponding to the optical fingerprint device 130 may also be designed to substantially correspond to the area of the sensing array of the optical fingerprint device 130.
Therefore, when the user needs to unlock or otherwise verify the fingerprint of the electronic device, the user only needs to press the finger on the fingerprint detection area 103 of the display screen 120, so as to input the fingerprint. Since fingerprint detection can be implemented in the screen, the electronic device 10 with the above structure does not need to reserve a space on the front surface thereof to set a fingerprint key (such as a Home key), so that a full-screen scheme can be adopted, that is, the display area of the display screen 120 can be substantially extended to the front surface of the whole electronic device 10.
As an alternative implementation, as shown in fig. 2, the optical fingerprint device 130 includes a light detection portion 134 and an optical assembly 132, where the light detection portion 134 includes a sensing array, a reading circuit electrically connected to the sensing array, and other auxiliary circuits, which can be fabricated on a chip (Die) through a semiconductor process, such as an optical imaging chip or an optical fingerprint sensor, where the sensing array is specifically a Photo detector (Photo detector) array, which includes a plurality of Photo detectors distributed in an array, and the Photo detectors can be used as the optical sensing units; the optical assembly 132 may be disposed above the sensing array of the light detecting portion 134, and may specifically include a Filter layer (Filter) for filtering ambient light penetrating through the finger, a light guiding layer or a light path guiding structure for guiding light returning from the finger to the sensing array for optical detection, and other optical elements.
In particular implementations, the optical assembly 132 may be packaged with the same optical fingerprint component as the light detection portion 134. For example, the optical component 132 may be packaged in the same optical fingerprint chip as the optical detection portion 134, or the optical component 132 may be disposed outside the chip where the optical detection portion 134 is located, such as attaching the optical component 132 on the chip, or integrating some components of the optical component 132 into the chip.
For example, the light guide layer of the optical component 132 may be specifically a Collimator (collimater) layer fabricated on a semiconductor silicon wafer, and the light guide layer has a plurality of collimating units or a micro-hole array, where the collimating units may be specifically small holes, and in reflected light reflected from a finger, light perpendicularly incident to the collimating units may pass through and be received by optical sensing units below the collimating units, and light with an excessively large incident angle is attenuated by multiple reflections inside the collimating units, so that each optical sensing unit can basically only receive reflected light reflected from fingerprint lines directly above the optical sensing unit, and the sensing array can detect a fingerprint image of the finger.
In another embodiment, the light guiding layer or the light path guiding structure may also be an optical Lens (Lens) layer having one or more Lens units, such as a Lens group consisting of one or more aspheric lenses, and the optical component 132 may include a Lens for converging the reflected light reflected from the finger to the sensing array of the light detecting portion 134 therebelow, so that the sensing array may be imaged based on the reflected light to obtain the fingerprint image of the finger. Optionally, the optical lens layer may further form a pinhole in the optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to enlarge the field of view of the optical fingerprint device, so as to improve the fingerprint imaging effect of the optical fingerprint device 130.
In other embodiments, the light guide layer or the light path guiding structure may also specifically adopt a Micro-Lens (Micro-Lens) layer, the Micro-Lens layer has a Micro-Lens array formed by a plurality of Micro-lenses, which may be formed above the sensing array of the light detecting portion 134 through a semiconductor growth process or other processes, and each Micro-Lens may respectively correspond to one of the sensing units of the sensing array. And another optical film layer, such as a dielectric layer or a passivation layer, may be further formed between the microlens layer and the sensing unit, and more specifically, a light blocking layer having micro holes may be further included between the microlens layer and the sensing unit, where the micro holes are formed between the corresponding microlenses and the sensing unit, and the light blocking layer may block optical interference between the adjacent microlenses and the sensing unit, and enable light corresponding to the sensing unit to be converged inside the micro holes through the microlenses and transmitted to the sensing unit through the micro holes for optical fingerprint imaging. It should be understood that several implementations of the above-described optical path directing structure may be used alone or in combination, for example, a microlens layer may be further disposed below the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the microlens layer, the specific stack structure or optical path thereof may need to be adjusted according to actual needs.
Optionally, in some embodiments, the optical fingerprint device 130 may include only one optical fingerprint sensor, where the area of the fingerprint detection area 103 of the optical fingerprint device 130 is small and the location is fixed, so that a user needs to press a finger to a specific location of the fingerprint detection area 103 when performing a fingerprint input, otherwise the optical fingerprint device 130 may not acquire a fingerprint image and the user experience is poor.
In other alternative embodiments, the optical fingerprint device 130 may specifically include a plurality of optical fingerprint sensors; the plurality of optical fingerprint sensors may be disposed side by side below the display screen 120 in a splicing manner, and sensing areas of the plurality of optical fingerprint sensors jointly form the fingerprint detection area 103 corresponding to the optical fingerprint device 130. That is to say, the fingerprint detection area 103 corresponding to the optical fingerprint device 130 may include a plurality of sub-areas, each sub-area corresponding to the sensing area of one of the optical fingerprint sensors, respectively, so that the fingerprint detection area 103 of the optical fingerprint module 130 may be extended to the main area of the lower half portion of the display screen, that is, to the area that the finger presses conventionally, thereby implementing the blind-touch type fingerprint input operation. Alternatively, when the number of optical fingerprint sensors is sufficient, the fingerprint detection area 130 may also be extended to half or even the entire display area, thereby enabling half-screen or full-screen fingerprint detection.
It should be appreciated that in particular implementations, the electronic device 10 also includes a transparent cover plate 110, alternatively referred to as a transparent protective cover plate 110, and the cover plate 110 may be a glass cover plate or a sapphire cover plate that is positioned over the display screen 120 and covers the front face of the electronic device 10. Because, in the embodiment of the present application, the pressing of the finger on the display screen 120 actually means pressing the cover plate 110 above the display screen 120 or covering the surface of the protective layer covering the cover plate 110.
It should be understood that the display screen 120 in the embodiment of the present application may be a display screen having a self-Light Emitting display unit, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. Taking an OLED display screen as an example, the optical fingerprint device 130 may use the display unit (i.e., OLED light source) of the OLED display screen 120 located in the fingerprint detection area 103 as an excitation light source for optical fingerprint detection. When the finger 140 is pressed against the fingerprint detection area 103, the display 120 emits a beam of light 111 toward the target finger 140 above the fingerprint detection area 103, and the light 111 is reflected at the surface of the finger 140 to form reflected light or scattered light by scattering inside the finger 140.
It should be understood that the above-described reflected light and scattered light are collectively referred to as reflected light for convenience of description. Because ridges (ridges) and valleys (valley) of the fingerprint have different light reflection capacities, reflected light 151 from ridges 141 and peaks 152 from valleys 142 of the fingerprint have different light intensities, and after passing through the optical assembly 132, the reflected light is received by the sensing array 134 in the optical fingerprint device 130 and converted into corresponding electric signals, i.e., fingerprint detection signals; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that an optical fingerprint identification function is realized in the electronic device 10.
With the coming of the full screen age of mobile phones, the application of the fingerprint under the screen is more and more extensive, wherein the optical fingerprint under the screen is the most popular. Based on a large amount of engineering technology research and development, the performance of the current optical fingerprint scheme applied to the OLED screen still has a certain performance difference with the performance of the traditional capacitive optical fingerprint, so that the performance of the optical fingerprint under the screen is further improved urgently.
The OLED screen is self-luminous, the thickness of the screen is thin, the whole screen structure is made of light-transmitting materials, and the characteristics of the three points determine that the OLED screen can be matched with optical fingerprints under the screen. However, due to the fact that a device structure exists in the OLED screen, part of lines of the device are made of non-light-transmitting materials, most of light is shielded when the light penetrates through the OLED screen, and signals actually penetrating through the OLED screen and reaching an optical chip collecting area under the screen are very weak.
The optical fingerprint chip under the screen of the present industry volume production mainly has two schemes. One is to use the imaging principle of the through hole and the small hole, and the small hole can guide the light signal reflected by the finger to the sensor chip below the display screen so as to carry out fingerprint identification. Theoretically, the smaller the pore diameter of the pores, the higher the resolution. However, in actual industrial production, the size of the small hole cannot be further reduced, thereby limiting the improvement of the resolution. Meanwhile, the small hole only allows the optical signal in the vertical direction to enter, so that the imaging signal is limited, and the sufficient optical signal cannot be provided to the acquisition area of the sensor chip. The other method utilizes an optical lens for imaging, the mode is similar to the principle of camera imaging, and a spherical or aspherical lens is utilized for condensing light so as to improve the imaging resolution. In addition, because the lens has the function of converging light rays, compared with a pinhole imaging mode, the lens imaging can guide more optical signals to reach the sensor chip.
The optical fingerprint technology under the screen generally adopts light of the screen as a light source, light emitted by the screen irradiates a finger contacting the screen, the finger reflects the light to carry fingerprint information of the finger, and the light carrying a fingerprint signal enters an optical sensor, so that a fingerprint image is obtained.
Most of the existing fingerprint identification devices adopt a microlens-pinhole structure, that is, the fingerprint identification device may include a microlens array and a light blocking layer, the microlens array may be disposed above the light blocking layer, and the light blocking layer is provided with a pinhole array. The micro lens array is used for converging the optical signals reflected by the finger to the small hole array, and the small hole array can guide the received optical signals to the fingerprint sensor chip below the light blocking layer. The fingerprint sensor can carry out fingerprint identification according to the received optical signal.
The micro lens has a function of converging light, so that the resolution of an image generated by the fingerprint sensor chip can be improved. The small hole array has the function of screening optical signals, for example, the small hole array does not allow interference optical signals with large angles to pass through, and only allows optical signals within a desired specific angle range to pass through, so as to improve the fingerprint identification effect.
A fingerprint recognition device based on a microlens-aperture structure is described below with reference to fig. 3.
The fingerprint recognition device may include a fingerprint sensor chip 200, and the fingerprint sensor chip 200 may include a sensing array having a plurality of sensing elements 209, which may be used to receive light signals returned from a finger for fingerprint recognition. In addition, a metal pattern layer 201 can be further disposed on the fingerprint sensor chip 200, and the metal pattern layer 201 is located above the sensing array. The metal pattern layer 201 is provided with a second aperture array 210, and the second aperture array 210 includes a plurality of apertures, and is used for guiding the optical signal returned by the finger to the sensing array.
It can be understood that the metal pattern layer 201 is a circuit layer inside the fingerprint sensor chip 200, and the metal pattern layer 201 is equivalent to a light blocking layer inside the fingerprint sensor chip 200, and can screen optical signals returned by a finger and guide the optical signals at a specific angle to the sensing array.
The second small hole array 210 in the metal pattern layer 201 may correspond to a plurality of sensing units in the fingerprint sensor chip one to one, and one small hole in the second small hole array 210 corresponds to one sensing unit in the plurality of sensing units, and the small hole can guide an optical signal returned by a finger to the corresponding sensing unit.
The fingerprint identification device further includes a filter layer 202, the filter layer 202 may be deposited on the upper surface of the fingerprint sensor chip 200 by a coating (sputtering or evaporation), the filter layer 202 may be made of an inorganic coating material, and the filter layer 202 may be used to filter optical signals in red and infrared bands.
The fingerprint identification device may further include a light-blocking layer 204, and a first aperture array 208 may be disposed on the light-blocking layer 204, where the first aperture array 208 includes a plurality of apertures. The first aperture array 208 may be formed by opening the light blocking layer 204 according to the position of the metal pattern layer 201 or the positions of the sensing units. The position of the first small hole array 208 is required to match the position of the second small hole array 210 in the metal pattern layer 201 and the positions of the plurality of sensing units, that is, the first small hole array 208 formed after the opening has a corresponding relationship with the sensing array of the fingerprint sensor chip 200.
Since the adhesion between the light-blocking layer and the inorganic coating layer material is too poor, an adhesion contact layer 203 may be disposed between the light-blocking layer 204 and the filter layer 202 to improve the adhesive strength between the light-blocking layer 204 and the filter layer 202.
In addition, since the filter layer 202 may only partially cover the fingerprint sensor chip 200, in order to avoid the topography of the patterned edge from affecting the coating operation of the black matrix photoresist, an adhesion contact layer 203 may be added between the filter layer 202 and the light blocking layer 204, and the adhesion contact layer 203 may also serve to planarize the surface of the filter layer 202.
The adhesion contact layer 203 may be a transparent organic glue layer, and the adhesion contact layer 203 may be disposed on the upper surface of the filter layer 202 by coating.
The light blocking layer 204 may be disposed on the upper surface of the adhesion contact layer 203 by coating, and then the first aperture array 208 may be formed by opening an aperture on the light blocking layer 204 by an etching process after exposure and development.
The open area on the light blocking layer 204 can allow optical signals to pass through; while the non-open areas on the light blocking layer 204 can act to absorb the light signal, i.e., block the light signal from passing through. The embodiment of the application has strict requirements on the light absorption effect of the non-opening area, for example, in the wavelength range of 600-1100 nm, the OD value of the non-opening area is more than or equal to 3, that is, the transmittance is less than 0.1%.
The fingerprint recognition device may further comprise a transparent optical path layer 205, and the transparent optical path layer 205 is used for adjusting the optical path of the optical signal returned by the finger to the fingerprint sensor chip. The transparent optical path layer 205 has a good light transmission characteristic, for example, the transmittance of the transparent optical path layer 205 to the optical signal in the visible light band is greater than 98%, so as to ensure that the optical signal returned by the finger does not have too much loss after passing through the transparent optical path layer 205. The thickness of the transparent optical path layer 205 can be set according to actual needs, for example, the thickness of the transparent optical path layer 205 can be 5 to 15 μm.
The fingerprint identification device can also comprise a micro lens array 207, and the micro lens array 207 can play a role in converging light rays, so that the resolution of a fingerprint image generated by the fingerprint sensor chip can be improved.
The fingerprint recognition device may further include a contact layer 206, and the contact layer 206 is disposed between the microlens array 207 and the transparent light path layer 205, and is used for planarizing the surface of the transparent light path layer 205 and improving the adhesive strength between the microlens array 207 and the transparent light path layer 205.
The thickness and the size of the opening of each optical path layer can be set according to actual requirements, and the embodiment of the application is not specifically limited to this.
In the fingerprint identification process, the optical signals of the red light wave band and the infrared light wave band can influence the fingerprint identification performance. For example, when fingerprint recognition is performed in outdoor sunlight, because the transmittance of a finger to red light and infrared light is high, red light and infrared light in sunlight can directly penetrate through the finger to reach a fingerprint sensor chip, so that visible light carrying a fingerprint signal is annihilated in background noise of the red light and the infrared light, and the optical fingerprint sensor under the screen fails. Therefore, in practical use, the light blocking layer 204 and the filter layer 202 can absorb and cut off the light signals in the red and infrared light bands to eliminate the influence of the red and infrared light on fingerprint detection.
In general, the filter layer 202 may cover all or part of the fingerprint sensor chip 200, and the light blocking layer 204 may be patterned to have openings. The effects of both may be specified as follows: the optical signal passing through the opening region of the light blocking layer 204 may be filtered by the filter layer 202 to filter red light and infrared light in the optical signal passing through the opening region, that is, the fingerprint sensor chip below the light blocking layer 204 may only receive a small amount of red light for anti-counterfeit synthesis, and the red light and infrared light interfering with the fingerprint signal may hardly reach the fingerprint sensor chip. The optical signal reaching the non-hole area on the light blocking layer 204 is directly absorbed by the black glue layer, and even if some red light and infrared light can pass through the non-hole area, they are filtered by the filter layer 202 under the light blocking layer 204.
The red light in the embodiment of the application can be an optical signal with the wavelength between 622nm and 770nm, and the infrared light can be an optical signal with the wavelength between 770nm and 1 mm.
In the above structure, if the light signal received by the non-perforated area of the light-blocking layer 204 leaks to the fingerprint sensor chip 200, the detection performance of the fingerprint sensor chip 200 will be affected, and therefore the performance requirements of the light-blocking layer of the fingerprint identification device based on the microlens-pinhole structure are relatively strict.
At present, the light blocking layer is manufactured in a coating mode, and then a small hole array is manufactured on the light blocking layer through an exposure, development and etching process.
The material used for coating is black light-absorbing material, and the selected black light-absorbing material needs to satisfy certain optical characteristics, such as Optical Density (OD) value of the black light-absorbing material is greater than or equal to 3 in the wavelength range of 600 nm-1100 nm, and the transmittance of the black light-absorbing material to light is less than 0.1.
However, the current black light absorbing materials that can satisfy the above optical characteristics have fewer resources, which limits the development and application of fingerprint recognition devices based on microlens-pinhole structures to some extent.
Based on this, the embodiment of the application provides a fingerprint identification device, can help fingerprint identification device's development and application.
As shown in fig. 4, the fingerprint recognition device is applicable to an electronic apparatus having a display screen, and the fingerprint recognition device may be disposed below the display screen. The fingerprint identification device can comprise a light-blocking layer 304, a filter layer 302 and a fingerprint sensor chip 300, wherein the light-blocking layer 304 is arranged on the upper surface of the filter layer 302 in a coating mode, a first small hole array 308 is arranged on the light-blocking layer 304, and the first small hole array 308 comprises a plurality of small holes. The first aperture array 308 is used to direct light signals returned by a finger above the display screen to the fingerprint sensor chip 300.
The coating method may include sputtering, evaporation, or the like.
The fingerprint sensor chip 300 may be used to receive an optical signal returned by a finger, which may be used for fingerprint recognition. Specifically, the fingerprint sensor chip 300 may include a sensing array 309 having a plurality of sensing elements, and the sensing array 309 may be configured to receive a light signal returned from the finger passing through the first aperture array 308 for fingerprint recognition.
The fingerprint sensor chip 300 may further have a metal pattern layer 301 disposed thereon, wherein the metal pattern layer 301 is disposed above the sensing array 309. The metal pattern layer 301 is provided with a second aperture array 310, and the second aperture array 310 includes a plurality of apertures. The second array of apertures 310 may be used to direct optical signals returned by the finger to the sensing array 309.
It is understood that the metal pattern layer 301 is a wiring layer inside the fingerprint sensor chip 300. The metal pattern layer 301 may be equivalent to a light blocking layer inside the fingerprint sensor chip 300, and may be configured to screen an optical signal returned by a finger and guide the optical signal at a specific angle to the sensing array.
The second array of small holes 310 in the metal pattern layer 301 corresponds to the sensing array 309 in the fingerprint sensor chip 300, and one small hole in the second array of small holes 310 corresponds to one sensing element in the sensing array 309, and the one small hole can guide the optical signal returned by the finger to the corresponding one sensing element.
The light blocking layer 304 may be disposed on the upper surface of the filter layer 302 by plating, which may omit the contact layer 203 in fig. 3 for planarization and promoting film adhesion, thereby reducing the number of optical path film structures and simplifying the process.
The non-perforated area of the light-blocking layer 304 has a strong absorption effect on the optical signals of a specific waveband, for example, the reflectivity and the transmittance of the non-perforated area of the light-blocking layer 304 on the optical signals under the waveband of 400nm to 1200nm are both less than 0.1%, that is, the OD value is greater than or equal to 3, the light-blocking layer formed by the coating can realize the same optical absorption effect as the black matrix photoresist shown in fig. 3, so that most of the optical signals under the waveband of 400nm to 1200nm reaching the non-perforated area can be absorbed by the non-perforated area.
The material used for the light blocking layer 304 is not specifically limited in the embodiment of the present application, for example, the light blocking layer may be made of at least one of the following materials: metals, non-metallic compounds, and metal oxides.
The non-metallic compound may include, for example, a non-metallic oxide and/or nitride.
The metal may, for example, comprise at least one of: chromium (Cr), copper (Cu), nano silver (Ag); the non-metal oxide may be, for example, silicon dioxide (SiO)2) (ii) a The nitride may be, for example, silicon nitride (SiN)X) (ii) a The metal oxide may include, for example, titanium oxide (TiO)2) And/or niobium oxide (Nb)2O5)。
The light blocking layer 304 may be made of two or more materials, and may be a micro-nano laminated structure formed by overlapping and depositing the materials.
The light blocking layer 304 is not manufactured by coating the BM light resistor, but is manufactured by adopting a film coating method, and the optical effect equal to that of the BM light resistor can be realized by matching the film thickness and the structure of a specific type of material, so that the material selection can be enriched to a certain extent, the preparation way can be widened, the development and the application of a fingerprint identification device can be facilitated, and the capacity bottleneck can be relieved.
In addition, since the light blocking layer 304 is formed by plating, the light blocking layer 304 can be directly plated on the filter layer 302 by plating, without adding an additional contact layer on the filter layer 302 to ensure adhesion or flatness between the layers, thereby reducing the number of optical path film structures and simplifying the process.
The formation process of the light blocking layer 304 is described below, but the embodiment of the present application is not limited thereto, and the light blocking layer capable of achieving the same light absorption effect is within the protection scope of the present application.
The light-blocking layer 304 can be a sandwich-like structure, and during the fabrication process, a 300-nm silver or copper nano-film can be deposited on the bottom layer, and then a 100-nm and 200-nm thick SiO dielectric isolation layer can be deposited2Or TiO2And finally, depositing a relatively thin silver film with the thickness of 10-50nm on the top layer, wherein the silver film has a surface nano-particle island structure, and the optical total absorption effect is realized by utilizing the electronic coupling of the micro-nano structure and the incident light wave.
The thickness of the light blocking layer 304 may be, for example, 0.5 to 5 μm, and preferably, the thickness of the light blocking layer 304 is 0.5 to 3 μm.
The first aperture array 308 of the light blocking layer 304 may be formed by a process such as an etching after exposure and development (beol off) process or a lift off (lift off) process.
The optical filter layer in the fingerprint identification device can be used for filtering the optical signals in the non-target wave bands to prevent the optical signals in the non-target wave bands from influencing fingerprint identification. The optical signal of the target mark segment may be, for example, an optical signal for fingerprint detection, the optical signal of the non-target wavelength band may be, for example, an optical signal of red light and an optical signal of infrared wavelength band, and the filter layer may be used to filter the optical signal of red light and infrared wavelength band.
The embodiment of the present application does not specifically limit the setting manner of the filter layer. The filter layer can be directly arranged on the surface of the fingerprint sensor chip in a film coating mode, or the filter layer can be combined with other transparent carriers to form an optical filter, and then the optical filter is arranged on the surface of the fingerprint sensor chip.
Preferably, the filter layer can be arranged on the upper surface of the fingerprint sensor chip in a coating mode, and in this case, the fingerprint sensor chip can be used for performing fingerprint identification according to received optical signals and can also be used as a substrate for bearing the filter layer to form an optical filter together with the filter layer.
The filter layer can be arranged between the fingerprint sensor chip and the light blocking layer and also can be arranged above the light blocking layer, under the condition, the light blocking layer can be arranged on the upper surface of the fingerprint sensor chip in a film coating mode, or a medium layer can be additionally arranged between the light blocking layer and the fingerprint sensor chip, and the light blocking layer can be arranged on the surface of the medium layer in a film coating mode.
The fingerprint recognition device may further comprise an optically transparent medium layer 305, and the optically transparent medium layer 305 may be disposed above the light blocking layer 304 for adjusting the optical path of the optical signal returned by the finger to the fingerprint sensor chip.
The optically transparent medium layer 305 has a good light transmittance, for example, the transmittance of the optically transparent medium layer 305 to the optical signal in the visible light band is greater than 98%.
Because the optical path from the optical signal returned by the finger to the fingerprint sensor chip can affect the detection performance of the fingerprint sensor chip, the size of the optical path can be adjusted through the optical transparent medium layer 305 in the embodiment of the application, so that the fingerprint sensor chip has better detection performance. The larger the thickness of the optical transparent medium layer is, the longer the optical path is; the smaller the thickness of the optically transparent dielectric layer, the shorter the optical path length.
The thickness of the optically transparent medium layer 305 in the embodiment of the present application may be, for example, 5 to 15 μm.
In addition, the light blocking layer 304 has a non-planar surface after the opening patterning process, and the optically transparent medium layer 305 can also serve to planarize the optical path stack structure. A contact layer 306 can be added between the microlens array 307 and the optically transparent structure 305, and the contact layer 306 has a certain adhesion effect and can improve the bonding strength between the optically transparent medium layer 305 and the microlens array 307.
The contact layer 306 may be a film material and a thickness as required, and the contact layer 306 may be a resin-based organic layer.
Alternatively, the optically transparent medium layer 305 may be disposed on the upper surface of the light blocking layer 304 by coating or plating.
The process for coating and manufacturing the optical transparent medium layer is mature, the operation is convenient, and the surface of the optical transparent medium layer formed by the coating mode is flat, so that the optical transparent medium layer 305 can be manufactured by the coating mode.
In addition, since the light-blocking layer 304 is formed by a plating method, the optically transparent medium layer can also be formed by a plating method from the viewpoint of process integration and synchronous implementation, as shown in fig. 5, the optically transparent medium layer 305' in fig. 5 is formed by a plating method.
The inorganic oxide layer may be selected because of the relatively high requirement of optical transparency of the optically transparent dielectric layer 305'. For example, the optically transparent dielectric layer can be made of at least one of the following materials: silicon nitride, silicon dioxide, silicon oxynitride, and the like.
Because the surface of the optically transparent dielectric layer 305 ' manufactured in a plating manner is uneven, the embodiment of the application can planarize the surface of the optically transparent dielectric layer 305 ' through the contact layer 306 '.
In the structure of the fingerprint identification device, there is a corresponding relationship among the microlens array 307, the first aperture array 308 in the light blocking layer 304, the second aperture array 310 in the metal pattern layer 301, and the sensing array 309 in the fingerprint sensor chip 300. The optical center of the first microlens in the microlens array 307, the center of the first aperture in the first aperture array 308, and the center of the second aperture in the second aperture array 310 correspond to the center of the first sensing unit in the sensing array 309, that is, the optical center of the first microlens, the center of the first aperture, the center of the second aperture, and the center of the first sensing unit are located on or approximately located on a straight line, which ensures that the first sensing unit can receive the optical signal returned by the finger for fingerprint identification.
The straight lines of the four centers may be perpendicular to the surface of the fingerprint sensor chip or inclined with respect to the surface of the fingerprint sensor chip, which is not specifically limited in the embodiment of the present application.
Fig. 4 and 5 are only described by taking an example that one light blocking layer is included outside the fingerprint sensor chip, and the embodiment of the present application is not limited thereto.
If the fingerprint recognition device includes a plurality of light-blocking layers, the apertures of the apertures located on the light-blocking layer of the upper layer may be larger than the apertures of the apertures located on the light-blocking layer of the lower layer.
The above is described with the structure that the fingerprint identification device includes the microlens-aperture, but the embodiments of the present application are not limited thereto, and the fingerprint identification device may include only the aperture array, not the microlens array, and is described below with reference to fig. 6.
As shown in fig. 6, the fingerprint identification device may include a plurality of light-blocking layers, such as a first light-blocking layer 410 and a second light-blocking layer 420, and the first light-blocking layer 410 and the second light-blocking layer 420 may be formed by using the above-described coating method.
The first light blocking layer 410 may be formed to have the small hole 411 by an etching after exposure and development or a lift-off process after exposure and development, and the second light blocking layer 420 may be formed to have the small hole 421 by an etching after exposure and development or a lift-off process after exposure and development.
The diameter of the small hole 411 of the first light-blocking layer 410 is larger than the diameter of the small hole 421 of the second light-blocking layer 420, so as to achieve the purpose of screening optical signals.
The center of the aperture 411 of the first light-blocking layer 410, the center of the aperture 421 of the second light-blocking layer 420, and the center of the sensing element 461 in the sensing array 460 are located on a straight line, so that the sensing array 461 can receive an optical signal returned by a finger passing through the light-blocking layer.
A first dielectric layer 430 may be disposed between first light-blocking layer 410 and second light-blocking layer 420, and first dielectric layer 430 is used to define a distance between first light-blocking layer 410 and second light-blocking layer 420, which is related to the angular range of light signals that can be received by the sensing array. In this case, the first dielectric layer 410 may be disposed on the upper surface of the first dielectric layer 430 by a plating method.
The fingerprint identification device may further include a filter layer 450, where the filter layer 450 is used to filter out optical signals in non-target wavelength bands. Alternatively, the second light-blocking layer 420 may be provided over the filter layer 450 by plating a film.
The filter layer 450 may be disposed over the fingerprint sensor chip 400. The fingerprint sensor chip 400 may include a sensing array 460 having a plurality of sensing units 461, the sensing array 460 being used for receiving light signals returned by the finger passing through the light blocking layer for fingerprint identification.
Optionally, referring to the above description, the fingerprint sensor chip 400 may further include a metal pattern layer 440, and the metal pattern layer 440 is provided with an aperture 441, where the aperture 441 is used for screening the optical signal returned by the finger. The metal pattern layer 440 may also be equivalent to a light blocking layer, in which case the fingerprint identification apparatus includes 3 light blocking layers, and the 3 light blocking layers collectively screen the optical signal returned by the finger.
Alternatively, the center of the aperture 411 on the first light-blocking layer 410, the center of the aperture 421 on the second light-blocking layer 420, the center of the aperture 441 in the metal pattern layer 440, and the center of the sensing element 461 in the sensing array 460 are located on a straight line, so that the sensing array 461 can receive an optical signal returned by a finger passing through the light-blocking layer and the metal pattern layer.
Alternatively, the aperture of aperture 421 may be smaller than the aperture of aperture 411 and larger than the aperture of aperture 441.
The microlens array in the embodiment of the present application may be used to guide vertical light and also to guide oblique light, which is not particularly limited in the embodiment of the present application.
The microlenses in the embodiments of the present application may be circular lenses, or the microlenses may be polygonal lenses, such as square lenses or hexagonal lenses.
Optionally, the optical path layer in the embodiment of the present application may further include other structures, for example, may include an array of collimating holes.
Fig. 7 is a schematic block diagram of an electronic device provided in an embodiment of the present application. The electronic device 700 comprises a display 710 and a fingerprint recognition arrangement 720. The fingerprint recognition device 720 may be disposed below the display screen 710 to perform fingerprint recognition on a finger above the display screen 710.
The display screen 710 may be any of the display screens described above, and the display screen 710 may be, for example, a self-emitting display screen, such as an OLED screen.
The fingerprint recognition device 720 can be any one of the fingerprint recognition devices described above, and for simplicity, the description thereof is omitted here.
It should be noted that the sensor chip in the embodiment of the present application may also be referred to as a fingerprint sensor.
It is to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application.
For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the embodiments of the present application.
If implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially implemented or make a contribution to the prior art, or may be implemented in the form of a software product stored in a storage medium and including several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: u disk, removable hard disk, read only memory, random access memory, magnetic or optical disk, etc. for storing program codes.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described apparatuses, devices and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed electronic device, apparatus and method may be implemented in other ways.
For example, the division of a unit or a module or a component in the above-described device embodiments is only one logical function division, and there may be other divisions in actual implementation, for example, a plurality of units or modules or components may be combined or may be integrated into another system, or some units or modules or components may be omitted, or not executed.
Also for example, the units/modules/components described above as separate/display components may or may not be physically separate, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the units/modules/components can be selected according to actual needs to achieve the purposes of the embodiments of the present application.
Finally, it should be noted that the above shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The above description is only a specific implementation of the embodiments of the present application, but the scope of the embodiments of the present application is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the embodiments of the present application, and all the changes or substitutions should be covered by the scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the protection scope of the claims.
Claims (17)
1. A fingerprint identification device is suitable for an electronic device with a display screen, and is characterized in that the fingerprint identification device is used for being arranged below the display screen and comprises: the light blocking layer, the filter layer and the fingerprint sensor chip;
the light blocking layer is arranged on the upper surface of the filter layer in a film coating mode, a first small hole array is arranged on the light blocking layer, and the first small hole array is used for guiding optical signals returned by fingers above the display screen to the fingerprint sensor chip;
the fingerprint sensor chip is arranged below the filter layer and used for receiving optical signals returned by the finger, and the optical signals are used for fingerprint identification.
2. The fingerprint identification device of claim 1, wherein the filter layer is disposed on an upper surface of the fingerprint sensor chip by coating.
3. The fingerprint recognition device of claim 1, wherein the light blocking layer has a thickness of 0.5-5 μm.
4. The fingerprint recognition device according to claim 1, further comprising an optically transparent medium layer disposed above the light blocking layer for adjusting an optical path of the light signal returned by the finger to the fingerprint sensor chip.
5. The fingerprint recognition device according to any one of claims 1-4, further comprising a micro-lens array disposed above the light blocking layer for directing the light signal returned by the finger to the aperture array.
6. The fingerprint recognition device according to claim 5, wherein the fingerprint sensor chip comprises a sensing array having a plurality of sensing units, the sensing array is configured to receive the light signal for fingerprint recognition;
the fingerprint sensor chip further comprises a metal pattern layer, the metal pattern layer is arranged above the sensing array, a second small hole array is arranged on the metal pattern layer, and the second small hole array is used for guiding the optical signals to the sensing array.
7. The fingerprint recognition device of claim 6, wherein a center of a first microlens of the microlens array, a center of a first aperture of the first aperture array, a center of a second aperture of the second aperture array, and a center of a first sensing element of the plurality of sensing elements are located on a straight line.
8. The fingerprint recognition device according to any one of claims 1-4, wherein the light blocking layer is made of at least one of the following materials: metals, non-metallic compounds, and metal oxides.
9. The fingerprint recognition device of claim 8, wherein the metal comprises at least one of: chromium, copper, nano silver, the non-metallic compound comprises silicon dioxide and/or silicon nitride, and the metal oxide comprises titanium oxide and/or niobium oxide.
10. The fingerprint identification device according to any one of claims 1-4, wherein the non-perforated area of the light blocking layer has a reflectivity and a transmittance of less than 0.1% for optical signals in the wavelength range of 400nm to 1200 nm.
11. The fingerprint identification device according to any one of claims 1-4, wherein the array of apertures in the light blocking layer is formed by a post-exposure-development etching or post-exposure-development lift-off process.
12. The fingerprint recognition device of any one of claims 1-4, wherein the filter layer is configured to filter out optical signals in the infrared and red bands.
13. The fingerprint recognition device of claim 4, wherein the optically transparent dielectric layer has a transmittance of greater than 98% for optical signals in the visible light band.
14. The fingerprint identification device according to claim 4 or 13, wherein the optically transparent medium layer is disposed on the upper surface of the light blocking layer by coating.
15. The fingerprint identification device according to claim 4 or 13, wherein the optically transparent medium layer is disposed on the upper surface of the light blocking layer by coating.
16. The fingerprint recognition device of claim 15, wherein the optically transparent dielectric layer is made of at least one of the following materials: silicon nitride, silicon dioxide, and silicon oxynitride.
17. An electronic device, comprising:
a display screen;
and a fingerprint recognition device as claimed in any one of claims 1 to 16, said fingerprint recognition device being disposed below said display screen.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021653414.1U CN213659462U (en) | 2020-02-17 | 2020-02-17 | Fingerprint identification device and electronic equipment |
| CN202020182193.8U CN211427367U (en) | 2020-02-17 | 2020-02-17 | Fingerprint identification device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020182193.8U CN211427367U (en) | 2020-02-17 | 2020-02-17 | Fingerprint identification device and electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021653414.1U Division CN213659462U (en) | 2020-02-17 | 2020-02-17 | Fingerprint identification device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211427367U true CN211427367U (en) | 2020-09-04 |
Family
ID=72254682
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020182193.8U Active CN211427367U (en) | 2020-02-17 | 2020-02-17 | Fingerprint identification device and electronic equipment |
| CN202021653414.1U Active CN213659462U (en) | 2020-02-17 | 2020-02-17 | Fingerprint identification device and electronic equipment |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021653414.1U Active CN213659462U (en) | 2020-02-17 | 2020-02-17 | Fingerprint identification device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN211427367U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112163501A (en) * | 2020-09-23 | 2021-01-01 | 华天慧创科技（西安）有限公司 | Fingerprint identification device and identification method under ultrathin optical screen and electronic equipment thereof |
| CN112603302A (en) * | 2020-12-25 | 2021-04-06 | 北京思比科微电子技术股份有限公司 | Method for detecting blood oxygen concentration by using optical fingerprint identification chip under screen |
| CN113065445A (en) * | 2021-03-26 | 2021-07-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN114556452A (en) * | 2021-02-05 | 2022-05-27 | 深圳市汇顶科技股份有限公司 | Chip packaging structure and electronic equipment |
| WO2022198681A1 (en) * | 2021-03-26 | 2022-09-29 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
-
2020
- 2020-02-17 CN CN202020182193.8U patent/CN211427367U/en active Active
- 2020-02-17 CN CN202021653414.1U patent/CN213659462U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112163501A (en) * | 2020-09-23 | 2021-01-01 | 华天慧创科技（西安）有限公司 | Fingerprint identification device and identification method under ultrathin optical screen and electronic equipment thereof |
| CN112603302A (en) * | 2020-12-25 | 2021-04-06 | 北京思比科微电子技术股份有限公司 | Method for detecting blood oxygen concentration by using optical fingerprint identification chip under screen |
| CN114556452A (en) * | 2021-02-05 | 2022-05-27 | 深圳市汇顶科技股份有限公司 | Chip packaging structure and electronic equipment |
| CN114556452B (en) * | 2021-02-05 | 2023-05-02 | 深圳市汇顶科技股份有限公司 | Chip packaging structure and electronic equipment |
| CN113065445A (en) * | 2021-03-26 | 2021-07-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| WO2022198681A1 (en) * | 2021-03-26 | 2022-09-29 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
| US11816920B2 (en) | 2021-03-26 | 2023-11-14 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification apparatus and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN213659462U (en) | 2021-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211427367U (en) | Fingerprint identification device and electronic equipment | |
| CN110088768B (en) | Fingerprint recognition device and electronic equipment under screen | |
| CN210038821U (en) | Optical fingerprint identification device and electronic equipment | |
| CN111164608B (en) | Fingerprint identification device and electronic equipment | |
| CN111095277B (en) | Optical fingerprint device and electronic equipment | |
| WO2021077259A1 (en) | Fingerprint recognition method, fingerprint recognition device and electronic apparatus | |
| CN212433783U (en) | Optical fingerprint device and electronic equipment | |
| CN210295125U (en) | Fingerprint detection device and electronic equipment | |
| CN111598068B (en) | Fingerprint identification device and electronic equipment | |
| CN111133444A (en) | Fingerprint identification device and electronic equipment | |
| CN210864756U (en) | Optical fingerprint device and electronic equipment | |
| CN111108509B (en) | Fingerprint detection device and electronic equipment | |
| CN210605742U (en) | Fingerprint identification device and electronic equipment | |
| WO2021007730A1 (en) | Fingerprint detection apparatus and electronic device | |
| CN111095278B (en) | Fingerprint identification device and electronic equipment | |
| CN210181631U (en) | Fingerprint identification device and electronic equipment | |
| CN211742126U (en) | Fingerprint detection device and electronic equipment | |
| CN113065445B (en) | Fingerprint identification device and electronic equipment | |
| US11783619B2 (en) | Fingerprint identification apparatus and electronic device | |
| WO2022041145A1 (en) | Fingerprint recognition apparatus and electronic device | |
| CN213211040U (en) | Fingerprint identification device and electronic equipment | |
| CN210864753U (en) | Fingerprint identification device and electronic equipment | |
| CN210052171U (en) | Optical fingerprint device and electronic equipment | |
| CN215068277U (en) | Fingerprint identification device and electronic equipment | |
| US11816920B2 (en) | Fingerprint identification apparatus and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |