CN114554826A - Novel copper foil laminating equipment and laminating process for PCB lamination - Google Patents
Novel copper foil laminating equipment and laminating process for PCB lamination Download PDFInfo
- Publication number
- CN114554826A CN114554826A CN202210159352.6A CN202210159352A CN114554826A CN 114554826 A CN114554826 A CN 114554826A CN 202210159352 A CN202210159352 A CN 202210159352A CN 114554826 A CN114554826 A CN 114554826A
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- copper foil
- steel plate
- laminating
- conveyor
- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F1/00—Preventing the formation of electrostatic charges
- H05F1/02—Preventing the formation of electrostatic charges by surface treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses novel PCB (printed circuit board) lamination copper foil laminating equipment which comprises PCB lamination copper foil laminating equipment, wherein the PCB lamination copper foil laminating equipment is sequentially provided with a steel plate conveyor, a copper foil laminating machine, a suction crane transplanter, a lifting conveyor and a double-layer conveyor according to the laminating step, an electrostatic generator and a rubber coating roller are arranged in the copper foil laminating machine, the end part of the electrostatic generator is over against the downward steel plate conveyor, the left side of the rubber coating roller is also provided with a cutter, and a copper foil body is laminated on the rubber coating roller. According to the invention, plasma static electricity is sprayed on the surface of the steel plate before the copper foil is rolled, the purpose of absorbing the copper foil can be achieved through the plasma static electricity, the copper foil is compressed and tiled through the rubber covered roller, negative pressure is started on a subsequent steel plate conveyor, the copper foil and the steel plate are further attached, the problem of copper wrinkle accompanying the process is solved, the yield of products is improved, manual use is reduced, and real full-automatic production is promoted.
Description
Technical Field
The invention relates to the technical field of PCB lamination processes, in particular to novel PCB lamination copper foil lamination equipment and a lamination process.
Background
In the PCB manufacturing process, the pressing is used as one of important processes, and plays an important role in products. The pressing process mainly has the effects that the copper foil, the adhesive and the substrate are laminated together, a plurality of products are simultaneously fed into a press at one time after the copper foil, the adhesive and the substrate are spaced by steel plates, and then the products are produced by the press. The industry has formed a complete set of mature process lines for many years.
However, the existing PCB manufacturing process has the following problems during use:
(1) in the process flow, the copper foil is carried after being subjected to vacuum adsorption through a sucker, the copper foil is very easy to adsorb copper wrinkles by the sucker due to the thickness characteristic of 0.035mm of the copper foil, and then when the sheet is laid on a steel plate, the copper wrinkles are formed at the positions which are not laid flat (attached by a hollow package) to cause product rejection;
(2) in actual production, a customer needs to configure certain personnel, pay attention to the production of equipment all the time, and once copper wrinkles are found, active intervention is needed to manually flatten the copper foil. Under the condition, the full-automatic production line is changed into a semi-automatic production line, the production efficiency is influenced, and the personnel expenditure is increased. For this reason, a corresponding technical scheme needs to be designed to solve the existing technical problems.
Disclosure of Invention
The invention aims to provide novel copper foil laminating equipment and a laminating process for PCB lamination, which solve the technical problem that in the process flow, due to the fact that the copper foil is carried after being cut into pieces and vacuum-absorbed by a sucking disc, the copper foil is easy to absorb copper wrinkles by the sucking disc due to the thickness characteristic of 0.035mm of the copper foil, and then when a sheet is flatly laid on a steel plate, the copper wrinkles are formed at the positions where the sheet is not flatly laid (the hollow package is attached), so that the product is scrapped.
In order to achieve the purpose, the invention provides the following technical scheme: novel copper foil coincide equipment of PCB pressfitting, including PCB pressfitting copper foil coincide equipment, PCB pressfitting copper foil coincide equipment has set gradually steel sheet conveyer, copper foil clad can machine according to the coincide step, has inhaled and has hung transplanter, elevating conveyor and double-deck conveyer, be provided with electrostatic generator and rubber covered roll in the copper foil clad can machine, the tip of electrostatic generator is just to the steel sheet conveyer who transfers, the left side of rubber covered roll still is provided with the cut-off knife, the pressure of rubber covered roll is covered there is the copper foil body, inhale and hang the transplanter branch and be equipped with a plurality of groups and install in one side of steel sheet conveyer.
As a preferable mode of the invention, the copper foil body is positioned at the upper right corner of the rubber covered roller, and the lower end of the copper foil body extends to the lower part of the rubber covered roller.
As a preferred mode of the invention, the specific copper foil laminating process comprises the following steps:
the method comprises the following steps: and (3) steel plate conveying and positioning treatment: conveying the steel plate from right to left, and starting operation after the steel plate enters the copper foil plate covering machine through the steel plate conveyor and is positioned;
step two: electrostatic spraying of a steel plate and rolling treatment of a copper foil: plasma static electricity is uniformly sprayed on the steel plate in the advancing process of the steel plate, after the copper foil is unfolded, the steel plate with the static particles is pressed and covered by a rubber covered roll through a copper foil covering machine, and if a cut copper foil stacking mode is adopted, the copper foil on a copper foil storage pallet or a copper foil storage box is transferred to the steel plate;
step three: steel plate spacing adjustment treatment: the distance between every two steel plates is adjusted by a servo to ensure the distance to be consistent, after the steel plates are attached with copper foils with specified length, the steel plates stop waiting, a cutter separates the copper foils by utilizing the distance between the steel plates, the front plate finishes copper coating, the front plate advances to enter a steel plate conveyor, and the back plate continues to coat copper;
step four: copper foil negative pressure adjustment attaching treatment: after the steel plate enters the steel plate conveyor, opening negative pressure on the steel plate conveyor, and further attaching the copper foil and the steel plate;
step five: copper foil laminating post-treatment: the copper-clad steel plate is stacked on the steel plate by the process of the electromagnetic board stack , or by the combination of a steel plate conveyor and a suction-hanging transfer machine, or the combination of a person and a suction-hanging transfer machine, and finally, the stacked product is transferred to the bottom plate of the lifting conveyor, thus completing the stacking process.
Compared with the prior art, the invention has the following beneficial effects:
1. the PCB laminating equipment is optimized, plasma static electricity is sprayed on the surface of the steel plate before the copper foil is rolled, the purpose of absorbing the copper foil can be achieved through the plasma static electricity, the copper foil is compressed and tiled through the rubber covered roller, negative pressure is started on a subsequent steel plate conveyor, the copper foil and the steel plate are further attached, the problem of copper wrinkle accompanying the process is solved, the yield of products is improved, manual use is reduced, and real full-automatic production is promoted.
2. The layout of the modular working station designed by the invention is more flexible and changeable, and can be modified according to the change of a customer product at any time.
Drawings
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a schematic view of the copper foil attachment of the present invention.
In the figure, 1, a steel plate conveyor; 2. a copper foil cladding machine; 3. sucking and hoisting the transplanter; 4. a lifting conveyor; 5. a double-deck conveyor; 6. an electrostatic generator; 7. wrapping a rubber roller; 8. a cutter; 9. a copper foil body.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the novel PCB pressfitting copper foil laminating equipment comprises PCB pressfitting copper foil laminating equipment, wherein the PCB pressfitting copper foil laminating equipment is sequentially provided with a steel plate conveyor 1, a copper foil covering machine 2, a suction crane transplanter 3, a lifting conveyor 4 and a double-layer conveyor 5 according to the laminating step, an electrostatic generator 6 and a rubber covered roller 7 are arranged in the copper foil covering machine 2, the end part of the electrostatic generator 6 is just opposite to the downward steel plate conveyor 1, the left side of the rubber covered roller 7 is also provided with a cutter 8, the rubber covered roller 7 is covered with a copper foil body 9, the suction crane transplanter 3 is provided with a plurality of groups and is arranged on one side of the steel plate conveyor 1, plasma static electricity is sprayed on the surface of a steel plate before the copper foil is rolled, the purpose of absorbing the copper foil can be achieved through the plasma static electricity, the copper foil is compressed through the rubber covered roller 7, and negative pressure is opened on the subsequent steel plate conveyor 1, the copper foil and the steel plate are further attached, the problem of copper wrinkle accompanying the process is solved, the yield of products is improved, manual use is reduced, and real full-automatic production is promoted.
Further improved, as shown in fig. 2: the copper foil body 9 is positioned at the upper right corner of the rubber covered roller 7, and the lower end of the copper foil body extends to the lower part of the rubber covered roller 7.
The copper foil laminating process specifically comprises the following steps:
the method comprises the following steps: and (3) steel plate conveying and positioning treatment: conveying the steel plate from right to left, and starting operation after positioning when the steel plate enters the copper foil clad plate machine 2 through the steel plate conveyor 1;
step two: electrostatic spraying of steel plates and rolling treatment of copper foils: plasma static electricity is uniformly sprayed on the steel plate in the advancing process of the steel plate, after the copper foil is unfolded, the steel plate with the static particles is pressed and covered by a rubber covered roll 7 through a copper foil covering machine 2, and if a cut copper foil stacking mode is adopted, the copper foil on a copper foil storage pallet or a copper foil storage box is transferred to the steel plate;
step three: steel plate spacing adjustment treatment: the distance between every two steel plates is adjusted by a servo to ensure the distance to be consistent, after the steel plates are attached with copper foils with specified size lengths, the steel plates stop waiting, the cutting knife 8 separates the copper foils by utilizing the distance between the steel plates, the front plate finishes copper coating, the steel plates advance to enter the steel plate conveyor 1, and the back plate continues to coat copper;
step four: copper foil negative pressure adjustment attaching treatment: after the steel plate enters the steel plate conveyor 1, opening negative pressure on the steel plate conveyor 1, and further attaching the copper foil and the steel plate;
step five: copper foil laminating post-treatment: the copper-clad steel plate is just like an assembly line process, materials such as adhesive, substrates and the like are overlapped on the steel plate by utilizing the combination of the steel plate conveyor 1 and the suction-hoisting transfer machine 3, and finally, the overlapped product is transferred to a bottom plate of the lifting conveyor 4, so that the overlapping process is completed.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
- Novel copper foil laminating equipment of PCB pressfitting, including PCB pressfitting copper foil laminating equipment, its characterized in that: the PCB pressfitting copper foil laminating equipment is sequentially provided with a steel plate conveyor (1), a copper foil laminating machine (2), a suction hoisting transplanter (3), a lifting conveyor (4) and a double-layer conveyor (5) according to the laminating step, an electrostatic generator (6) and a rubber covered roller (7) are arranged in the copper foil laminating machine (2), the end of the electrostatic generator (6) is opposite to the lowered steel plate conveyor (1), a cutter (8) is further arranged on the left side of the rubber covered roller (7), a copper foil body (9) is covered on the rubber covered roller (7), and the suction hoisting transplanter (3) is provided with a plurality of groups and is arranged on one side of the steel plate conveyor (1).
- 2. The PCB lamination novel copper foil laminating device of claim 1, wherein: the copper foil body (9) is positioned at the upper right corner of the rubber covered roller (7) and the lower end of the copper foil body extends to the lower part of the rubber covered roller (7).
- 3. The laminating process of the novel PCB laminating copper foil laminating equipment according to claim 1, wherein the laminating process comprises the following steps: the copper foil laminating process specifically comprises the following steps:the method comprises the following steps: and (3) steel plate conveying and positioning treatment: conveying the steel plate from right to left, and starting operation after the steel plate enters a copper foil clad plate machine (2) through a steel plate conveyor (1) and is positioned;step two: electrostatic spraying of a steel plate and rolling treatment of a copper foil: plasma static electricity is uniformly sprayed on the steel plate in the advancing process of the steel plate, after the copper foil is unfolded, the steel plate with the static particles is pressed and covered by a rubber covered roll (7) through a copper foil covering machine (2), and if a cut copper foil stacking mode is adopted, the copper foil on a copper foil storage pallet or a copper foil storage box is transferred to the steel plate;step three: steel plate spacing adjustment treatment: the distance between every two steel plates is adjusted by a servo to ensure the distance to be consistent, after the steel plates are attached with copper foils with specified size lengths, the steel plates stop waiting, a cutter (8) separates the copper foils by utilizing the distance between the steel plates, the copper clad is finished by the front plate, the front plate enters a steel plate conveyor (1) in advance, and the copper clad is continuously carried out by the rear plate;step four: copper foil negative pressure adjustment attaching treatment: after the steel plate enters the steel plate conveyor (1), opening negative pressure on the steel plate conveyor (1) and further attaching the copper foil and the steel plate;step five: copper foil laminating post-treatment: the copper-clad steel plate is just like an assembly line process, materials such as adhesive, a substrate and the like are overlapped on the steel plate by utilizing the combination of the steel plate conveyor (1) and the suction and lifting transfer machine (3), and finally, the overlapped product is transferred to a bottom plate of the lifting conveyor (4), so that the overlapping process is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210159352.6A CN114554826A (en) | 2022-02-21 | 2022-02-21 | Novel copper foil laminating equipment and laminating process for PCB lamination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210159352.6A CN114554826A (en) | 2022-02-21 | 2022-02-21 | Novel copper foil laminating equipment and laminating process for PCB lamination |
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| Publication Number | Publication Date |
|---|---|
| CN114554826A true CN114554826A (en) | 2022-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210159352.6A Pending CN114554826A (en) | 2022-02-21 | 2022-02-21 | Novel copper foil laminating equipment and laminating process for PCB lamination |
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| CN (1) | CN114554826A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116788755A (en) * | 2023-06-28 | 2023-09-22 | 广东盈华电子材料有限公司 | Pressing device for backlight plate production |
-
2022
- 2022-02-21 CN CN202210159352.6A patent/CN114554826A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116788755A (en) * | 2023-06-28 | 2023-09-22 | 广东盈华电子材料有限公司 | Pressing device for backlight plate production |
| CN116788755B (en) * | 2023-06-28 | 2023-12-22 | 广东盈华电子材料有限公司 | Pressing device for backlight plate production |
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