CN202368027U - Full-automatic laminating device for metal substrate - Google Patents
Full-automatic laminating device for metal substrate Download PDFInfo
- Publication number
- CN202368027U CN202368027U CN2011205592727U CN201120559272U CN202368027U CN 202368027 U CN202368027 U CN 202368027U CN 2011205592727 U CN2011205592727 U CN 2011205592727U CN 201120559272 U CN201120559272 U CN 201120559272U CN 202368027 U CN202368027 U CN 202368027U
- Authority
- CN
- China
- Prior art keywords
- laminator
- material sucking
- full
- metal substrate
- conveyer frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a full-automatic laminating device for a metal substrate. The full-automatic laminating device comprises a laminator, a first material sucking device, a second material sucking device and an inductive cutting device, wherein the laminator comprises a front end transfer frame, a rear end transfer frame and a laminating mechanism; the first material sucking device is arranged at a starting point of the front end transfer frame; the inductive cutting device and the second material sucking device are arranged at a terminal point of the rear end transfer frame in sequence; the first material sucking device and the second material sucking device are material suckers with a plurality of vacuum material sucking heads; and the inductive cutting device is a laser thickness measuring and cut starting device. The laminator is improved, so that a copper-clad plate is fully automatically produced, and plates are not required to be manually lifted to the laminator one by one for laminating and cutting and then manually carried down from the laminator; and therefore, human factor interference is reduced, the quality problems of scratch, oxidation and the like of the plates are hardly caused, and the production efficiency and the product quality are greatly improved.
Description
Technical field
The utility model relates to film sticking apparatus, relates in particular to the full-automatic film sticking apparatus of metal substrate.
Background technology
At present, be semiautomatic plant entirely at copper-clad plate production field metal substrate pasting protective film, mainly be artificial many sheet material lifted laminator, carry out pad pasting and sanction film, carry sheet material off laminator in manual work.Too many like this interference from human factor causes quality problems such as sheet material scratches, oxidation easily, reduces production efficiency simultaneously greatly.
The utility model content
In view of this, be necessary to provide the metal substrate that can reduce human factor full-automatic film sticking apparatus.
The utility model is to realize like this; The full-automatic film sticking apparatus of metal substrate; It comprises laminator; Said laminator comprise front end conveyer frames, rear end conveyer frames and be fixed on said front end conveyer frames and said rear end conveyer frames between pad pasting mechanism, wherein, the induction cutting means and the second suction device that the full-automatic film sticking apparatus of said metal substrate also comprises the first suction device that is installed in said front end conveyer frames starting point and is installed in said rear end conveyer frames terminal point; Said first suction device and the said second suction device are the Material sucking machine that has some vacuum intake heads, and said induction cutting means adds the startup cutting means for the thickness measurement with laser device.
The full-automatic film sticking apparatus of the metal substrate that the utility model provides through laminator is made improvement, is realized full-automation thereby make copper-clad plate produce; No longer sheet material lifted laminator through artificial many; Carry out pad pasting and cut out film, manual work is carried sheet material off laminator again, has therefore reduced interference from human factor; Be difficult for causing quality problems such as sheet material scratches, oxidation, greatly improve production efficiency and product quality.
Description of drawings
The structural representation of the full-automatic film sticking apparatus of metal substrate that Fig. 1 provides for the utility model preferred embodiments.
Symbol description
| |
10 |
| The |
20 |
| The |
30 |
| The induction cutting means | 40 |
| The front |
12 |
| The rear |
14 |
| |
16 |
The specific embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
See also Fig. 1, the structural representation of the full-automatic film sticking apparatus of metal substrate that provides for the utility model preferred embodiments.The full-automatic film sticking apparatus of metal substrate comprises the first suction device 20, laminator 10, the second suction device 30 and induction cutting means 40.
The first suction device 20 is installed on front end conveyer frames 14 starting points, and the induction cutting means 40 and the second suction device 30 are installed on rear end conveyer frames 14 terminal points successively.The first suction device 20 and the second suction device 30 are the Material sucking machine that has some vacuum intake heads, and induction cutting means 40 adds the startup cutting means for the thickness measurement with laser device.
When the full-automatic film sticking apparatus of metal substrate uses, follow following steps:
Start the full-automatic film sticking apparatus of said metal substrate, promptly open laminator 10, induction cutting means 40, the first suction device 20 and the second suction device 30;
The first suction device 20 is drawn metal substrate to the front end conveyer frames 12 of laminator 10;
Said metal substrate is conveyed into pad pasting mechanism 16 pad pastings by front end conveyer frames 12, the metal substrate behind the formation pad pasting;
Said metal substrate behind the pad pasting is sent to induction cutting means 40 by rear end conveyer frames 14 and cuts and form finished product;
By the second suction device 30 the metal substrate undercarriage that said finished product promptly posts film is piled up again.
Wherein, when the thickness measurement with laser device of induction cutting means 40 was sensed the thickness significant change, the cutting means of induction cutting means 40 can cut action.
In sum, the full-automatic film sticking apparatus of said metal substrate is through making improvement to laminator; Thereby it is full-automatic to make that copper-clad plate produce to realize, no longer through artificial many sheet material is lifted laminator, carries out pad pasting and sanction film; Manual work is carried sheet material off laminator again; Therefore reduce interference from human factor, be difficult for causing quality problems such as sheet material scratches, oxidation, greatly improve production efficiency and product quality.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (1)
1. the full-automatic film sticking apparatus of metal substrate; It comprises laminator; Said laminator comprise front end conveyer frames, rear end conveyer frames and be fixed on said front end conveyer frames and said rear end conveyer frames between pad pasting mechanism; It is characterized in that; The induction cutting means and the second suction device that the full-automatic film sticking apparatus of said metal substrate also comprises the first suction device that is installed in said front end conveyer frames starting point and is installed in said rear end conveyer frames terminal point, said first suction device and the said second suction device are the Material sucking machine that has some vacuum intake heads, and said induction cutting means adds the startup cutting means for the thickness measurement with laser device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205592727U CN202368027U (en) | 2011-12-29 | 2011-12-29 | Full-automatic laminating device for metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205592727U CN202368027U (en) | 2011-12-29 | 2011-12-29 | Full-automatic laminating device for metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202368027U true CN202368027U (en) | 2012-08-08 |
Family
ID=46591747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205592727U Expired - Fee Related CN202368027U (en) | 2011-12-29 | 2011-12-29 | Full-automatic laminating device for metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202368027U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490433A (en) * | 2011-12-29 | 2012-06-13 | 铜陵浩荣电子科技有限公司 | Metal substrate automatic filming apparatus and application method thereof |
| CN102874598A (en) * | 2012-09-06 | 2013-01-16 | 东莞市五株电子科技有限公司 | Arranging method for base plate |
-
2011
- 2011-12-29 CN CN2011205592727U patent/CN202368027U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490433A (en) * | 2011-12-29 | 2012-06-13 | 铜陵浩荣电子科技有限公司 | Metal substrate automatic filming apparatus and application method thereof |
| CN102874598A (en) * | 2012-09-06 | 2013-01-16 | 东莞市五株电子科技有限公司 | Arranging method for base plate |
| CN102874598B (en) * | 2012-09-06 | 2016-04-20 | 东莞市威力固电路板设备有限公司 | Substrate put-on method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120808 Termination date: 20151229 |
|
| EXPY | Termination of patent right or utility model |