CN114536996B - Substrate baking device - Google Patents
Substrate baking device Download PDFInfo
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- CN114536996B CN114536996B CN202210134301.8A CN202210134301A CN114536996B CN 114536996 B CN114536996 B CN 114536996B CN 202210134301 A CN202210134301 A CN 202210134301A CN 114536996 B CN114536996 B CN 114536996B
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- fitting
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- 239000000758 substrate Substances 0.000 title claims abstract description 102
- 238000010438 heat treatment Methods 0.000 claims abstract description 106
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 11
- 230000013011 mating Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000007641 inkjet printing Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0024—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using conduction means, e.g. by using a heated platen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses a substrate baking device, which relates to the technical field of display surface manufacturing processes. In the heating process, even if the base plate is heated differently on the two side surfaces so that the corner part of the base plate has a tilting trend, under the action of the fixing mechanism, the corner part can be kept fixed relative to the heating table in the direction perpendicular to the heating surface, so that the problems of tilting and poor heating of the corner part are avoided, and the baking effect of the base plate is improved.
Description
Technical Field
The invention relates to the technical field of display surface manufacturing processes, in particular to a substrate baking device.
Background
Organic light emitting diodes (Organic Light Emitting Diode, OLED) have received attention in the display field because of their advantages of self-luminescence, no backlight source, high contrast, fast reaction speed, good flexibility, simpler process, etc. Meanwhile, the conventional organic light emitting diode display panel generally adopts an inkjet printing process. Since the ink jet printing can precisely control the liquid drops and has the advantages of low material cost, low equipment cost and the like, the ink jet printing is considered as a technology with a large development space in the large-size OLED panel manufacturing technology.
In detail, the inkjet printing is a method for preparing a thin film by a solution method. Filling ink materials required for preparing the OLED into an ink box, and driving liquid drops into pixels through nozzles of an ink-jet head; and drying to remove the solvent in the ink, thus forming a film. The effect of the drying process determines the flatness of the film surface, and in general, the substrate needs to be baked to volatilize the solvent more sufficiently, and a hot plate is generally selected to bake and heat the substrate.
When the substrate is conveyed onto the hot plate, the lower surface of the substrate is in direct contact with the hot plate, the temperature gradient difference exists between the hot plate and the glass, heat exchange is carried out through heat conduction, the upper surface of the substrate is heated in a heat radiation mode, and the heat transfer speed of the lower surface is higher than that of the upper surface, so that the temperature of the lower surface of the substrate is higher. This results in a higher expansion rate of the lower surface, and thus the substrate is bent upward, in the form of a four-sided corner tilting, and the corner is poorly heated, which affects the baking effect of the substrate.
Disclosure of Invention
In summary, the technical problem to be solved in the present application is: provided is a substrate baking device capable of improving the baking effect of a substrate.
The scheme adopted by the application for solving the technical problems is as follows:
in a first aspect, the present application provides a substrate baking apparatus comprising:
the heating table is provided with a heating surface for bearing the heating surface of the substrate;
and the fixing mechanism is used for limiting the relative displacement of at least one corner of the substrate and the heating table in the direction perpendicular to the heating surface when the heating surface bears the substrate.
Optionally, in some embodiments of the present application, the fixing mechanism includes at least one angular position mating member, where the angular position mating member is connected to the heating table, and the angular position mating member is formed with a first limiting surface and a second limiting surface that are sequentially set in a direction perpendicular to the heating surface, and the first limiting surface and the second limiting surface are set opposite to each other, so as to form a bayonet matched with the angular portion.
Optionally, in some embodiments of the present application, the corner fitting further includes a side limit surface disposed between the first limit surface and the second limit surface, and the side limit surface is configured to contact a sidewall of the corner when the heating surface carries the substrate.
Optionally, in some embodiments of the present application, the corner portion has a first side wall and a second side wall that are connected to each other and are disposed at a first included angle, the side limit faces include a first side limit face and a second side limit face that are connected to each other and are disposed at a second included angle, and a boundary profile formed by the first side limit face and the second side limit face is used for contacting with the boundary profile formed by the first side wall and the second side wall, where the second included angle is configured to be greater than the first included angle.
Optionally, in some embodiments of the present application, the second included angle is 0.1 ° to 0.5 ° greater than the first included angle.
Optionally, in some embodiments of the present application, the number of the corner matching pieces in the fixing mechanism is plural, and at least two corner matching pieces are respectively used for matching with the corners on two sides in the diagonal direction of the substrate.
Optionally, in some embodiments of the present application, the corner matching pieces respectively used for matching with the corners on two sides of the substrate in a diagonal direction are a first corner matching piece and a second corner matching piece, where one of the first corner matching piece and the second corner matching piece has an elastic contact portion, and the elastic contact portion defines a side limit surface thereof.
Optionally, in some embodiments of the present application, the corner matching pieces respectively used for matching with the corners on two sides of the substrate in a diagonal direction are a first corner matching piece and a second corner matching piece, where at least one of the first corner matching piece and the second corner matching piece is movably connected to the heating table, so that the first corner matching piece and the second corner matching piece can move towards each other or move away from each other along the heating surface.
Optionally, in some embodiments of the present application, one of the first angular mating member and the second angular mating member is fixedly connected to the heating table, and the other is movably connected to the heating table; the fixing mechanism at least comprises two groups of corner matching pieces which respectively act on two corners of the substrate in different diagonal directions, and one of the two groups of corner matching pieces and the heating table, which are mutually fixed, is respectively used for matching with the two corners of the same side of the substrate.
Optionally, in some embodiments of the present application, the first limiting surface is located on a side, close to the heating table, of the second limiting surface, and the angular position matching piece is further formed with a heated portion, where the heated portion extends onto the heating surface and is in thermal conduction contact with the heating surface, so that heat of the heating surface is transferred to the second limiting surface.
Due to the adoption of the technical scheme, the application at least comprises the following beneficial effects:
the fixing mechanism is mainly arranged on the basis of the heating table, and is used for limiting relative displacement of at least one corner of the substrate and the heating table perpendicular to the heating surface when the heating surface bears the substrate. In the heating process, even if the base plate is heated differently on the two side surfaces so that the corner part of the base plate has a tilting trend, under the action of the fixing mechanism, the corner part can be kept fixed relative to the heating table in the direction perpendicular to the heating surface, so that the problems of tilting and poor heating of the corner part are avoided, and the baking effect of the base plate is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following description will simply refer to the drawings that are required to be used in the embodiments. The drawings in the following description are only some of the embodiments of the present application and other drawings may be derived from these drawings by those skilled in the art without the exercise of inventive faculty.
FIG. 1 is a schematic view of a substrate baking apparatus perpendicular to a heating surface in embodiment 1 according to the present invention;
FIG. 2 is a schematic view of a substrate structure of a substrate baking apparatus according to embodiment 1 of the present invention;
FIG. 3 is a schematic view showing a further refinement of the substrate baking apparatus according to embodiment 1 of the present invention;
FIG. 4 is a schematic cross-sectional view taken at A-A of FIG. 1;
FIG. 5 is an enlarged partial schematic view of FIG. 4 at A;
fig. 6 is a schematic view illustrating the cooperation between the side limiting surface and the corner side wall in embodiment 1 according to the present invention.
Reference numerals illustrate:
10-heating table, 11-heating surface, 12-chute;
20-angle matching piece, 20 a-first angle matching piece, 20 b-second angle matching piece, 21-first limit surface, 22-second limit surface, 23-side limit surface, 23 a-first side limit surface, 23 b-second side limit surface and 24-bayonet;
30-substrate, 31-corner, 32-heated face, 33-back-heated face, 34 a-first sidewall, 34 b-second sidewall.
Detailed Description
Technical solutions in the embodiments of the present application will be clearly and comprehensively described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a unique orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or the inclusion of a number of indicated features. Thus, a feature defining "a first" or "a second" may include, either explicitly or implicitly, one or more features. In the description of the present invention, the meaning of "a plurality" is two or more unless explicitly defined otherwise.
In the application, the term "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for purposes of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes have not been described in detail so as not to obscure the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles disclosed herein.
Example 1
The main body of the present embodiment is a substrate baking apparatus, which is applied to a baking process performed on a substrate 30 after the deposition of the substrate 30 by solution deposition. It should be noted that, the baking apparatus for the substrate 30 provided in this embodiment may be used for a baking process performed after the solution deposition method of the substrate 30, and may also be used for other baking processes.
Referring to fig. 1, 3 and 4, in the present embodiment, the substrate 30 baking apparatus includes:
a heating stage 10, wherein a heating surface 11 for carrying a heating surface 32 of the substrate 30 is formed on the heating stage 10;
and the fixing mechanism is used for limiting the relative displacement of at least one corner 31 of the substrate 30 and the heating table 10 in the direction vertical to the heating surface 11 when the heating surface 11 bears the substrate 30.
The heating table 10 is mainly used for heating the substrate 30, and is provided with a heat source and a heating surface 11, wherein the heating surface 11 is used as a heating component for heating the substrate 30 placed thereon, thereby realizing a baking process. The fixing mechanism is used for fixing the corner 31 of the substrate 30, so as to avoid the tilting of the corresponding corner 31 caused by inconsistent heating conditions of the heating surface 32 and the back surface 33 of the substrate 30, and further ensure the uniformity of the film quality of the substrate 30.
Here, referring to fig. 2, the corner 31 mainly refers to a sharp corner on the outer contour of the substrate 30, and the substrate 30 is a rectangular plate-shaped member or a substantially rectangular plate-shaped member, which has four corners 31.
Further, with the above-described fixing mechanism, it may be in contact with only the back surface 33 of the substrate 30. For example, in another embodiment, when the heating surface 11 carries the substrate 30, the fixing mechanism is used to bear on the back surface 33 of the substrate 30 at the corner 31. In this embodiment, referring to fig. 1, 4 and 5, the fixing mechanism includes at least one angular matching member 20, the angular matching member 20 is connected to the heating table 10, the angular matching member 20 is formed with a first limiting surface 21 and a second limiting surface 22 sequentially arranged in a direction perpendicular to the heating surface 11, and the first limiting surface 21 and the second limiting surface 22 are opposite to each other to form a bayonet 24 adapted to the corner 31.
When the corner 31 of the substrate 30 is inserted into the bayonet 24, the first limiting surface 21 and the second limiting surface 22 respectively contact with the heating surface 32 and the back heating surface 33 at the corner 31 of the substrate 30, so as to clamp the corner 31 of the substrate 30, and counteract the internal stress of the corner 31 with a tilting tendency under the uneven heating condition of the substrate 30. Here, the heating surface 32 refers to the surface of the substrate 30 that is expected to be in direct contact with the heating surface 11, and the back surface 33 refers to the surface of the substrate 30 facing away from the heating surface 32.
It should be noted that, in the present embodiment, the first limiting surface 21 and the heating surface 11 are kept flush, and the second limiting surface 22 is slightly higher than the first limiting surface 21, that is, the first limiting surface 21 is disposed on the side of the second limiting surface 22 close to the heating surface 11, but this should not be construed as limiting the arrangement positions of the first limiting surface 21 and the second limiting surface 22, and the position of the first limiting surface 21 may be changed by an operator without affecting the purpose of the present invention.
By providing the first stopper surface 21 and the second stopper surface 22, the movement of the corner 31 of the substrate 30 with respect to the heating table 10 in the direction perpendicular to the heating surface 11 can be restricted. The practitioner can further adjust the shape of the corner fittings 20 such that the side walls of the corners 31 are also abutted within the bayonets 24 formed in the corner fittings 20 so that the relative movement of the entire base 30 along the heating surface 11 can be limited when multiple corner fittings 20 are present.
For example, as shown in fig. 5, in the present embodiment, the corner fitting 20 further includes a side limit surface 23 disposed between the first limit surface 21 and the second limit surface 22, and the side limit surface 23 is shaped to contact with a sidewall of the corner 31 when the heating surface 11 carries the substrate 30.
Referring to fig. 6, in the present embodiment, the corner 31 has a first side wall 34a and a second side wall 34b connected to each other and disposed at a first included angle, the side limit surface 23 includes a first side limit surface 23a and a second side limit surface 23b connected to each other and disposed at a second included angle, and a boundary profile formed by the first side limit surface 23a and the second side limit surface 23b is used to contact with the boundary profile formed by the first side wall 34a and the second side wall 34 b. So configured, when there are a plurality of angular fittings 20, the relative movement of the entire substrate 30 on the heating surface 11 can be restrained. It should be noted that the above-mentioned boundary contour is not necessarily a straight line in the present embodiment, and may be another shape such as an arc surface.
Wherein the first angle and the second angle may be equal. However, in the case where the first angle and the second angle are equal, the first side wall 34a and the second side wall 34b slightly expand when the substrate 30 is heated as described above, which causes the first side wall 34a and the second side wall 34b to press the first side limit surface 23a and the second side limit surface 23b, and when the pressing is severe, the baking quality of the substrate 30 may be affected.
Therefore, in the present embodiment, the second included angle is configured to be larger than the first included angle, desirably: the second included angle is 0.1 DEG to 0.5 DEG greater than the first included angle. In this way, the substrate 30 can be prevented from being squeezed between the first side wall 34a and the second side wall 34b of the corner 31 and the corresponding first side limit surface 23a and second side limit surface 23b when heated and slightly expanded, and the baking quality of the substrate 30 is improved. Meanwhile, when the second included angle is within the above range, the first side limiting surface 23a and the first side wall 34a, and the second side limiting surface 23b and the second side wall 34b are contacted when the substrate 30 is greatly expanded. Therefore, the side limit surface 23 in the angular position matching piece 20 can be contacted with the corner 31 in a large area, the fixing stability of the corner 31 is improved, and the two parts can be prevented from being extruded to a large extent.
As described above for the case of a single angular fitting 20. As described in the foregoing, when a plurality of corner fittings 20 are used, the movement of the entire substrate 30 with respect to the heating table 10 in the direction perpendicular to the heating surface 11 can be restricted. In detail, in the present embodiment, the number of the corner fittings 20 in the fixing mechanism is plural, and at least two corner fittings 20 are respectively provided for mating with the corner portions 31 on both sides in the diagonal direction of the base plate 30.
It will be appreciated that, for the two side limit faces 23 described above, if both are in rigid contact with the corner 31 of the base plate 30, there is a higher requirement on the manufacturing accuracy of both, so referring to fig. 4, in this embodiment, the corner fittings 20 for respectively mating with the corner 31 on two sides of the base plate 30 in the diagonal direction are respectively the first corner fitting 20a and the second corner fitting 20b, one of the first corner fitting 20a and the second corner fitting 20b has an elastic contact portion, and the elastic contact portion thereof defines the side limit face 23 thereof. That is, due to the existence of the elastic contact portion, the spacing between the two side corner fittings 20 disposed along the diagonal direction of the substrate 30 may be slightly varied in the diagonal direction of the substrate 30, thereby reducing the requirements for the manufacturing accuracy of both. The elastic contact portion is not necessarily limited to being made of an organic material, and may be made of a metal material having a large elastic modulus, such as mild steel.
With the arrangement of the first corner fittings 20a and the second corner fittings 20b, if the first corner fittings 20a and the second corner fittings 20 are arranged to be fixed with the heating table 10, it is only possible to adapt the fixing mechanism to a substrate 30 of one size. The aspect ratios of the different substrates 30 are generally uniform, and the different substrates 30 are generally different in dimension in the diagonal direction. Therefore, referring to fig. 4 again, the direction indicated by the arrow in the drawing is the relative moving direction of the corner fittings 20 on both sides in the diagonal direction, at least one of the first corner fitting 20a and the second corner fitting 20b is movably connected to the heating table 10, so that the first corner fitting 20a and the second corner fitting 20b can move toward each other or away from each other along the heating surface 11, and thus the first corner fitting 20a and the second corner fitting 20b can adapt to the substrates 30 with different diagonal dimensions. With respect to the articulation, the practitioner can form a sliding groove 12 on the heating surface 11 in sliding engagement with the angular fitting 20, as shown in the present embodiment, so as to allow the sliding connection of the two. Of course, the implementation personnel can select a specific connection mode according to actual situations without affecting the purpose of the invention. It should be noted that, for convenience of illustration, the chute 12 is omitted in fig. 1.
More specifically, for the four corner matching pieces 20 in the present embodiment, in order to facilitate the substrate 30 to be snapped into the corresponding bayonets 24, in the present embodiment, one of the first corner matching piece 20a and the second corner matching piece 20b is fixedly connected to the heating table 10, and the other is movably connected to the heating table 10; the fixing mechanism at least comprises two groups of corner matching pieces 20 which respectively act on two corners 31 of the base plate 30 in different diagonal directions, and one of the two groups of corner matching pieces 20 and the heating table 10 which are mutually fixed is respectively used for matching with the two corners 31 on the same side of the base plate 30.
This arrangement facilitates the practitioner to engage the corners 31 of the base plate 30 into the corresponding bayonets 24. In detail, the practitioner may first insert two corners 31 on one side (e.g., the right side in fig. 4) of the substrate 30 into the bayonets 24 of the corresponding corner fittings 20, and then move the remaining corner fittings 20, so that the bayonets 24 of the other two corner fittings 20 are engaged with the two corners 31 on the other side of the substrate 30, thereby conveniently mounting the substrate 30 on the heating surface 11.
Of course, the first limiting surface 21 and the second limiting surface 22 may be disposed by an operator to adjust the distance therebetween, so as to facilitate the installation of the base plate 30, but this may increase the structural complexity of the angular fitting 20, and may not easily control the dimensional accuracy of the bayonet, which may result in the angular fitting 20 easily leaving an indentation on the base plate 30.
In addition, the reason why the corner 31 of the substrate 30 is lifted is that: the heating conditions of the heating surface 32 and the back surface 33 of the substrate 30 are inconsistent, the heating surface 32 is in direct contact with the heating surface 11, heat conduction occurs between the heating surface 32 and the back surface 33, and the back surface 33 is heated by heat radiation.
To further solve the above-mentioned drawbacks, in the present embodiment, the corner fitting 20 is further formed with a heat receiving portion (not shown), which extends onto the heating surface 11 and is in thermal conduction contact with the heating surface 11, so that the heat of the heating surface 11 is transferred to the second limiting surface 22. The heat receiving portion may be made of copper with better heat conduction effect, and is mainly used for implementing heat conduction contact between the second limiting surface 22 and the heating surface 11, so that heat of the heating surface 11 is transferred to the second limiting surface 22 and then transferred to the back surface 33 at the corner 31 of the substrate 30, and further, the local back surface 33 of the substrate 30 is also in heat conduction contact, so that the heating condition of the back surface 33 of the substrate 30 is improved. On this basis, the practitioner can raise the area of the second limiting surface 22 as much as possible. Desirably, the ratio of the area of the back surface 33 of the substrate 30 to the area of the back surface 33 of the substrate 30 at the portion where the back surface 33 is contacted by the second stopper surface 22 is 5% to 10%. Thus, the heating condition of the back surface 33 of the substrate 30 is improved, and meanwhile, the influence of the second limiting surface 22 on the baking of the back surface 33 of the substrate 30 can be avoided.
In the present embodiment, the shape of the heat receiving unit is not limited, and may be a sheet shape that is bonded to the heating surface 11, or may be another shape, and the present application is not limited thereto.
While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations of the present application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this application, and are therefore within the spirit and scope of the exemplary embodiments of this application.
Meanwhile, the present application uses specific words to describe embodiments of the present application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present application. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present application may be combined as suitable.
Likewise, it should be noted that in order to simplify the presentation disclosed herein and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are presented in the claims are required for the subject application. Indeed, less than all of the features of a single embodiment disclosed above.
In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments are modified in some examples by the modifier "about," approximately, "or" substantially. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for ±% variation. Accordingly, in some embodiments, numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and parameters set forth herein are approximations that may be employed in some embodiments to confirm the breadth of the range, in particular embodiments, the setting of such numerical values is as precise as possible.
For each patent, patent application publication, and other material, such as articles, books, specifications, publications, documents, etc., cited in this application, the entire contents of which are hereby incorporated by reference into this application, except for the application history documents which are inconsistent or conflict with the contents of this application, and for documents which have limited the broadest scope of the claims of this application (currently or hereafter attached to this application). It is noted that the descriptions, definitions, and/or terms used in the subject matter of this application are subject to the use of descriptions, definitions, and/or terms in case of inconsistent or conflicting disclosure.
Claims (8)
1. A substrate baking apparatus, comprising:
the heating table is provided with a heating surface for bearing the heating surface of the substrate;
the fixing mechanism is used for limiting relative displacement of at least one corner of the substrate and the heating table in the direction perpendicular to the heating surface when the heating surface bears the substrate, the corner is a sharp corner part on the outer contour of the substrate, the fixing mechanism comprises at least one corner matching piece, the corner matching piece is connected to the heating table, the corner matching piece is provided with a first limiting surface and a second limiting surface which are sequentially arranged in the direction perpendicular to the heating surface, the first limiting surface and the second limiting surface are opposite to each other to form a bayonet, the bayonet is matched with the corner, the first limiting surface is positioned on one side of the second limiting surface close to the heating table, and the corner matching piece is further provided with a heating part which extends to the heating surface and is in heat conduction contact with the heating surface, so that heat of the heating surface is transferred to the second limiting surface.
2. The substrate baking apparatus of claim 1, wherein the corner fitting further comprises a side stop surface disposed between the first stop surface and the second stop surface, the side stop surface being shaped to contact a sidewall of the corner portion when the heating surface carries the substrate.
3. The substrate baking apparatus of claim 2, wherein the corner has a first sidewall and a second sidewall connected to each other and disposed at a first included angle, the side limiting surfaces include a first side limiting surface and a second side limiting surface connected to each other and disposed at a second included angle, the first side limiting surface and the second side limiting surface form an interface profile for contacting the interface profile formed by the first sidewall and the second sidewall, and wherein the second included angle is configured to be greater than the first included angle.
4. The substrate baking apparatus of claim 3, wherein the second included angle is greater than the first included angle by 0.5 °.
5. The substrate baking apparatus according to claim 2, wherein the number of the corner fittings in the fixing mechanism is plural, and at least two of the corner fittings are provided for fitting with the corners on both sides in the diagonal direction of the substrate, respectively.
6. The substrate baking apparatus according to claim 5, wherein the corner fittings for respectively engaging with the corners on both sides in the diagonal direction of the substrate are a first corner fitting and a second corner fitting, respectively, one of the first corner fitting and the second corner fitting having an elastic contact portion, and the elastic contact portion defines a side limit surface thereof.
7. The substrate baking apparatus according to any of claims 5 or 6, wherein the corner fittings for respectively engaging the corners on both sides in the diagonal direction of the substrate are a first corner fitting and a second corner fitting, respectively, at least one of the first corner fitting and the second corner fitting being movably connected to a heating stage so that the first corner fitting and the second corner fitting can be moved toward each other or away from each other along the heating surface.
8. The substrate baking apparatus according to claim 7, wherein one of the first corner fitting member and the second corner fitting member is fixedly connected to the heating stage, and the other is movably connected to the heating stage; the fixing mechanism at least comprises two groups of corner matching pieces which respectively act on two corners of the substrate in different diagonal directions, and one of the two groups of corner matching pieces and the heating table, which are mutually fixed, is respectively used for matching with the two corners of the same side of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210134301.8A CN114536996B (en) | 2022-02-14 | 2022-02-14 | Substrate baking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210134301.8A CN114536996B (en) | 2022-02-14 | 2022-02-14 | Substrate baking device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114536996A CN114536996A (en) | 2022-05-27 |
| CN114536996B true CN114536996B (en) | 2024-03-22 |
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| JP2015174761A (en) * | 2014-03-18 | 2015-10-05 | 日本電気硝子株式会社 | Holding jig of plate glass |
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| CN110923672A (en) * | 2019-12-17 | 2020-03-27 | Tcl华星光电技术有限公司 | Heating device and chemical vapor deposition equipment |
| CN113380642A (en) * | 2021-04-29 | 2021-09-10 | 厦门通富微电子有限公司 | Processing method of chip on film packaging device |
| CN215115941U (en) * | 2021-06-22 | 2021-12-10 | 湖南腾远智能设备有限公司 | Positioning mechanism |
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| JPH04191375A (en) * | 1990-11-27 | 1992-07-09 | Toshiba Corp | Substrate heating device |
| JPH10213793A (en) * | 1997-01-31 | 1998-08-11 | Sharp Corp | Substrate heating device |
| WO2010104001A1 (en) * | 2009-03-10 | 2010-09-16 | 日本電気株式会社 | Method for manufacturing electronic device and apparatus for manufacturing electronic device |
| JP2015056506A (en) * | 2013-09-11 | 2015-03-23 | 株式会社タムラ製作所 | Warpage suppression device for base plate |
| JP2015174761A (en) * | 2014-03-18 | 2015-10-05 | 日本電気硝子株式会社 | Holding jig of plate glass |
| CN208099669U (en) * | 2018-03-28 | 2018-11-16 | 西安理工大学 | A kind of cooling device for replating forming |
| CN110079758A (en) * | 2018-04-17 | 2019-08-02 | 广东聚华印刷显示技术有限公司 | The baking method of apparatus for baking and electroluminescent device substrate |
| CN110923672A (en) * | 2019-12-17 | 2020-03-27 | Tcl华星光电技术有限公司 | Heating device and chemical vapor deposition equipment |
| CN113380642A (en) * | 2021-04-29 | 2021-09-10 | 厦门通富微电子有限公司 | Processing method of chip on film packaging device |
| CN215115941U (en) * | 2021-06-22 | 2021-12-10 | 湖南腾远智能设备有限公司 | Positioning mechanism |
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| CN114536996A (en) | 2022-05-27 |
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