CN114536996A - Substrate baking device - Google Patents

Substrate baking device Download PDF

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Publication number
CN114536996A
CN114536996A CN202210134301.8A CN202210134301A CN114536996A CN 114536996 A CN114536996 A CN 114536996A CN 202210134301 A CN202210134301 A CN 202210134301A CN 114536996 A CN114536996 A CN 114536996A
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CN
China
Prior art keywords
substrate
corner
heating
limiting surface
corner fitting
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Granted
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CN202210134301.8A
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Chinese (zh)
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CN114536996B (en
Inventor
袁熙
王世洪
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202210134301.8A priority Critical patent/CN114536996B/en
Publication of CN114536996A publication Critical patent/CN114536996A/en
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Publication of CN114536996B publication Critical patent/CN114536996B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • B41J11/002Curing or drying the ink on the copy materials, e.g. by heating or irradiating
    • B41J11/0024Curing or drying the ink on the copy materials, e.g. by heating or irradiating using conduction means, e.g. by using a heated platen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The invention discloses a substrate baking device, which relates to the technical field of display surface processing technology. In the middle of the heating process, even if the base plate is heated because of the condition of being heated is different and when making its bight appear the trend of perk because of appearing on the both sides surface, under fixed establishment's effect, bight also can be fixed in the orientation of perpendicular to heating surface by the relatively warm table, and then avoided appearing bight and appear perk, the bad problem of being heated, improved the effect of toasting of base plate.

Description

Substrate baking device
Technical Field
The invention relates to the technical field of display surface processing technologies, in particular to a substrate baking device.
Background
Organic Light Emitting Diodes (OLEDs) have attracted attention in the display field due to their advantages of self-luminescence, no need of backlight, high contrast, fast response speed, good flexibility, simple process, etc. Meanwhile, the conventional organic light emitting diode display panel generally adopts an inkjet printing process. Since inkjet printing can precisely control droplets and has the advantages of low material cost and low equipment cost, inkjet printing is considered as a technology with a large development space in the preparation technology of large-size OLED panels.
In detail, ink jet printing is a method for preparing a thin film by a solution process. Filling an ink material required for preparing the OLED into an ink box, and driving liquid drops into pixels through a nozzle of an ink gun; then drying to remove the solvent in the ink to form the film. The effect of the drying process determines the flatness of the film surface, and generally, the substrate needs to be baked to make the solvent more sufficiently volatilized, and a hot plate is usually selected to bake and heat the substrate.
When the substrate is conveyed to the hot plate, the lower surface of the substrate is in direct contact with the hot plate, the hot plate and the glass have temperature gradient difference to carry out heat exchange through heat conduction, the upper surface of the substrate is heated in a heat radiation mode, and the heat transfer speed of the lower surface is higher than that of the upper surface, so that the temperature of the lower surface of the substrate is higher. This results in a higher expansion rate of the lower surface, which in turn causes the substrate to bend upwards in a form of tilting four corners, which are poorly heated, and thus the baking effect of the substrate is affected.
Disclosure of Invention
To sum up, the technical problem that this application will solve is: provided is a substrate baking apparatus capable of improving the baking effect of a substrate.
The scheme adopted by the application to solve the technical problems is as follows:
in a first aspect, the present application provides a substrate baking apparatus, comprising:
the heating table is provided with a heating surface for bearing the heating surface of the substrate;
the fixing mechanism is used for limiting the relative displacement of at least one corner of the substrate and the heating table in the direction vertical to the heating surface when the heating surface bears the substrate.
Optionally, in some embodiments of this application, the fixing mechanism includes at least one corner fitting piece, the corner fitting piece is connected on the heating platform, the corner fitting piece is formed with a first limiting surface and a second limiting surface that are sequentially arranged in a direction perpendicular to the heating surface, and the first limiting surface and the second limiting surface are arranged opposite to each other to form a bayonet matched with the corner.
Optionally, in some embodiments of the present application, the corner fitting further includes a side limiting surface disposed between the first limiting surface and the second limiting surface, and the side limiting surface is configured to contact with the sidewall of the corner when the substrate is carried by the heating surface.
Optionally, in this application part of embodiments, the bight has first lateral wall and second lateral wall that links to each other and be the setting of first contained angle, the spacing face of side is including the spacing face of first side and the spacing face of second side that link to each other and be the setting of second contained angle, the spacing face of first side with the boundary profile that the spacing face of second side formed be used for with the first lateral wall with the boundary profile that the second lateral wall formed contacts, wherein, the second contained angle is configured to be greater than the first contained angle.
Optionally, in some embodiments of the present application, the second included angle is 0.1 ° to 0.5 ° greater than the first included angle.
Optionally, in some embodiments of the present application, the number of the corner fittings in the fixing mechanism is multiple, and there are at least two corner fittings for fitting with the corners on two sides of the substrate in the diagonal direction respectively.
Optionally, in some embodiments of the present application, the corner fitting pieces respectively used for fitting with the corners on two sides of the substrate in the diagonal direction are a first corner fitting piece and a second corner fitting piece, respectively, one of the first corner fitting piece and the second corner fitting piece has an elastic contact portion, and the elastic contact portion defines a side limiting surface thereof.
Optionally, in some embodiments of the present application, the corner fittings respectively used for matching with the corners on two sides of the substrate in the diagonal direction are a first corner fitting part and a second corner fitting part, and at least one of the first corner fitting part and the second corner fitting part is movably connected to the heating platform, so that the first corner fitting part and the second corner fitting part can move towards each other or move away from each other along the heating surface.
Optionally, in some embodiments of the present application, one of the first and second angle-fitting members is fixedly connected to the heating stage, and the other one of the first and second angle-fitting members is movably connected to the heating stage; the fixing mechanism at least comprises two groups of angle position matching pieces which respectively act on two corners of the substrate in different diagonal directions, and one of the two groups of angle position matching pieces and the heating platform which are fixed with each other are respectively used for matching with the two corners on the same side of the substrate.
Optionally, in some embodiments of the present application, the first limiting surface is located on a side of the second limiting surface close to the heating stage, and the corner fitting is further formed with a heated portion, where the heated portion extends to the heating surface and is in heat-conduction contact with the heating surface, so that heat of the heating surface is transferred to the second limiting surface.
Due to the adoption of the technical scheme, the application at least comprises the following beneficial effects:
this application has mainly set up fixed establishment on the basis of warm table, and wherein, fixed establishment is used for bearing at the hot side when on the base plate, restrict at least a bight of base plate with the warm table is at the perpendicular to relative displacement on the hot side. In the middle of the heating process, even if the base plate is heated because the condition of being heated appears differently and makes its bight appear when the trend of perk, under fixed establishment's effect, bight also can be fixed in the direction of perpendicular to heating surface by the relatively warm table, and then avoided appearing bight and appeared perk, the bad problem of being heated, improved the effect of toasting of base plate.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required in the embodiments are briefly described below. The drawings in the following description are only some embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic view of a substrate baking apparatus perpendicular to a heating plane in an embodiment 1 of the present invention;
fig. 2 is a schematic diagram of a substrate structure suitable for the substrate baking apparatus in embodiment 1 of the present invention;
FIG. 3 is a schematic view of a further detailed structure of a substrate baking apparatus perpendicular to a heating plane in example 1 of the present invention;
FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 1;
FIG. 5 is an enlarged partial view of FIG. 4 at A;
fig. 6 is a schematic view of the engagement between the side limiting surface and the corner sidewall in embodiment 1 of the present invention.
Description of reference numerals:
10-heating table, 11-heating surface, 12-chute;
20-an angle fitting piece, 20 a-a first angle fitting piece, 20 b-a second angle fitting piece, 21-a first limiting surface, 22-a second limiting surface, 23-a side limiting surface, 23 a-a first side limiting surface, 23 b-a second side limiting surface and 24-a bayonet;
30-substrate, 31-corner, 32-heated surface, 33-back-heated surface, 34 a-first sidewall, 34 b-second sidewall.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments, not all embodiments, of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a unique orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or including indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles disclosed herein.
Example 1
The main body of the present embodiment is a substrate baking apparatus, which is applied to a baking process of the substrate 30 after the substrate 30 is deposited by solution deposition. It should be noted that the substrate 30 baking apparatus provided in this embodiment may be used in a baking process performed after the solution deposition method of the substrate 30, and may also be used in other baking processes.
Referring to fig. 1, fig. 3 and fig. 4, in the present embodiment, the baking apparatus for a substrate 30 includes:
a heating stage 10, wherein a heating surface 11 for bearing a heating surface 32 of a substrate 30 is formed on the heating stage 10;
a fixing mechanism for limiting the relative displacement between at least one corner 31 of the substrate 30 and the heating stage 10 in the direction perpendicular to the heating surface 11 when the substrate 30 is carried on the heating surface 11.
The heating stage 10 mainly means a member for heating the substrate 30, and has a heat source and a heating surface 11 formed thereon, and the heating surface 11 serves as a heating member for heating the substrate 30 placed thereon, thereby implementing a baking process. The fixing mechanism is used for fixing the corner 31 of the substrate 30, so that the situation that the corresponding corner 31 of the substrate 30 is tilted due to the fact that the heating conditions of the heating surface 32 and the back heating surface 33 are inconsistent is avoided, and the uniformity of the film quality of the substrate 30 is further guaranteed.
Here, referring to fig. 2, the corner 31 mainly refers to a sharp corner portion on the outer contour of the substrate 30, and the substrate 30 has four corners 31 as a rectangular plate-shaped member or a substantially rectangular plate-shaped member.
Further, the fixing mechanism may be in contact with only the backside 33 of the substrate 30. For example, in another embodiment, the securing mechanism is adapted to bear on the substrate 30 above the backside hot surface 33 at the corner 31 when the substrate 30 is carried by the heated surface 11. In this embodiment, referring to fig. 1, fig. 4 and fig. 5, the fixing mechanism includes at least one corner fitting piece 20, the corner fitting piece 20 is connected to the heating platform 10, the corner fitting piece 20 is formed with a first limiting surface 21 and a second limiting surface 22 sequentially arranged in a direction perpendicular to the heating surface 11, and the first limiting surface 21 and the second limiting surface 22 are arranged opposite to each other to form a bayonet 24 adapted to the corner 31.
Here, when the corner 31 of the substrate 30 is inserted into the bayonet 24, the first limiting surface 21 and the second limiting surface 22 respectively contact with the heated surface 32 and the back-heated surface 33 at the corner 31 of the substrate 30, so as to clamp the corner 31 of the substrate 30, and counteract the internal stress which is generated when the substrate 30 is heated unevenly and makes the corner 31 of the substrate have a tendency of tilting upwards. Here, the heated surface 32 refers to a surface of the substrate 30 which is expected to be in direct contact with the heated surface 11, and the back-heated surface 33 refers to a surface of the substrate 30 which faces away from the heated surface 32.
It should be noted here that in the present embodiment, the first limiting surface 21 and the heating surface 11 are kept flush, and the second limiting surface 22 is slightly higher than the first limiting surface 21, that is, the first limiting surface 21 is disposed on the side of the second limiting surface 22 close to the heating surface 11, but this should not be construed as a limitation on the arrangement position of the first limiting surface 21 and the second limiting surface 22, and the position of the first limiting surface 21 can be modified by an implementer without affecting the purpose of the invention.
The first and second stopper surfaces 21 and 22 can restrict the movement of the corner 31 of the substrate 30 relative to the heating stage 10 in the direction perpendicular to the heating surface 11. The practitioner may further adjust the shape of the corner fitting 20 such that the sidewalls of the corner 31 are also interfered with within the notches 24 formed in the corner fitting 20, such that relative movement of the entire base plate 30 along the heating surface 11 is limited when there are multiple corner fittings 20.
For example, as shown in fig. 5, in the present embodiment, the corner fitting 20 further includes a side limiting surface 23 disposed between the first limiting surface 21 and the second limiting surface 22, and the side limiting surface 23 is configured to contact with the sidewall of the corner 31 when the substrate 30 is carried by the heating surface 11.
Referring to fig. 6, in the present embodiment, the corner portion 31 has a first side wall 34a and a second side wall 34b connected to each other and disposed at a first included angle, the side limiting surface 23 includes a first side limiting surface 23a and a second side limiting surface 23b connected to each other and disposed at a second included angle, and a boundary profile formed by the first side limiting surface 23a and the second side limiting surface 23b is used for contacting a boundary profile formed by the first side wall 34a and the second side wall 34 b. In this arrangement, when the plurality of corner fittings 20 are present, the relative movement of the entire substrate 30 on the heating surface 11 can be restricted. Here, the boundary contour is not necessarily a straight line as shown in the present embodiment, and may be another shape such as an arc surface.
Wherein the first angle and the second angle may be equal. However, in the case that the first included angle and the second included angle are equal, the first sidewall 34a and the second sidewall 34b slightly expand when the substrate 30 is heated, which may cause the first sidewall 34a and the second sidewall 34b to press the first side limiting surface 23a and the second side limiting surface 23b, and when the pressing is severe, the baking quality of the substrate 30 may be affected.
Therefore, in the present embodiment, the second angle is configured to be larger than the first angle, and it is desirable that: the second included angle is 0.1-0.5 degrees larger than the first included angle. Therefore, when the substrate 30 is heated and slightly expands, the first side wall 34a and the second side wall 34b of the corner portion 31 and the corresponding first side limiting surface 23a and the second side limiting surface 23b are prevented from being squeezed, and the baking quality of the substrate 30 is improved. Meanwhile, when the second included angle is within the above range, the first side limiting surface 23a and the first side wall 34a, and the second side limiting surface 23b and the second side wall 34b will contact each other only when the substrate 30 is greatly expanded. Therefore, the side limiting surface 23 in the corner fitting piece 20 can be in contact with the corner part 31 in a large area, the stability of fixing the corner part 31 is improved, and the phenomenon that the corner fitting piece and the corner part are extruded to a large degree can be avoided.
As described above for the case of a single corner fitting 20. As described above, when a plurality of corner fittings 20 are used, the entire substrate 30 can be restricted from moving in the direction perpendicular to the heating surface 11 with respect to the heating stage 10. In detail, in the present embodiment, the number of the corner fittings 20 in the fixing mechanism is plural, and there are at least two corner fittings 20 for fitting with the corner portions 31 on both sides of the base plate 30 in the diagonal direction, respectively.
It is understood that, as for the two side edge-limiting surfaces 23 as described above, if both are in rigid contact with the corner 31 of the substrate 30, the manufacturing accuracy of both will be more demanding, so please refer to fig. 4, in this embodiment, the corner fittings 20 respectively used for fitting with the corner 31 of the substrate 30 at two opposite corners are the first corner fitting 20a and the second corner fitting 20b, respectively, one of the first corner fitting 20a and the second corner fitting 20b has a resilient contact portion, and the resilient contact portion defines the side edge-limiting surface 23. That is, due to the elastic contact portion, the two side corner fittings 20 arranged along the diagonal direction of the substrate 30 may have a slightly variable pitch in the diagonal direction of the substrate 30, thereby reducing the requirement for the manufacturing accuracy of the two. Here, the elastic contact portion is not limited to be made of an organic material, and a metal material having a large elastic modulus such as mild steel may be used.
With the arrangement of the first and second angle fittings 20a, 20b, if the first and second angle fittings 20a, 20b are arranged to be fixed with the heating stage 10, it is only possible to adapt the fixing mechanism to one size of the base plate 30. The length-to-width ratios of the different substrates 30 are generally the same, and the sizes of the different substrates 30 are generally different in the diagonal direction. Therefore, referring to fig. 4 again, the direction indicated by the arrow is the relative movement direction of the two corner fittings 20 in the diagonal direction, and at least one of the first corner fitting 20a and the second corner fitting 20b is movably connected to the heating platform 10, so that the first corner fitting 20a and the second corner fitting 20b can move towards or away from each other along the heating surface 11, and thus the first corner fitting 20a and the second corner fitting 20b can be adapted to substrates 30 with different diagonal dimensions. With regard to the movable connection, the practitioner may form a sliding groove 12 on the heating surface 11 for sliding engagement with the corner fitting 20, as shown in the present embodiment, to allow the two to be slidably connected. Of course, the implementer can select a specific connection mode according to actual situations without affecting the purpose of the invention. It should be noted here that the chute 12 is omitted from fig. 1 for the sake of convenience of illustration.
More specifically, for the four corner fittings 20 of the present embodiment, in order to facilitate the substrate 30 to be clamped into the corresponding bayonet 24, in the present embodiment, one of the first corner fitting 20a and the second corner fitting 20b is fixedly connected to the heating platform 10, and the other one is movably connected to the heating platform 10; the fixing mechanism at least comprises two groups of angle matching pieces 20 which respectively act on two corners 31 of the substrate 30 in different diagonal directions, and one of the two groups of angle matching pieces 20 and one of the heating platforms 10 which are fixed with each other are respectively used for matching with the two corners 31 on the same side of the substrate 30.
This arrangement facilitates the practitioner to snap the corner 31 of the base plate 30 into the corresponding notch 24. In detail, the practitioner can first snap two corners 31 of one side (e.g. the right side in fig. 4) of the substrate 30 into the corresponding notches 24 of the corner fittings 20, and then move the remaining corner fittings 20 so that the notches 24 of the other two corner fittings 20 are engaged with the two corners 31 of the other side of the substrate 30, thereby conveniently mounting the substrate 30 on the heating surface 11.
Of course, the first limiting surface 21 and the second limiting surface 22 may be configured to adjust the distance therebetween by an operator, so as to facilitate the installation of the base plate 30, but this may increase the structural complexity of the corner fitting 20, and it is not easy to control the dimensional accuracy of the opening, which may result in the corner fitting 20 easily leaving an impression on the base plate 30.
In addition, the reason why the corner 31 of the substrate 30 is lifted up is: the heated surface 32 and the back-heated surface 33 of the substrate 30 are heated differently, the heated surface 32 is in direct contact with the heated surface 11, heat conduction occurs between the heated surface and the heated surface, and the back-heated surface 33 is heated by heat radiation.
To further solve the above-mentioned defects, in the present embodiment, the corner fitting 20 is further formed with a heat receiving portion (not shown) extending to the heating surface 11 and in heat-conductive contact with the heating surface 11, so that the heat of the heating surface 11 is transferred to the second limiting surface 22. The heat receiving unit can be made of copper or other materials with good heat conduction effect, and is mainly used for realizing heat conduction contact between the second limiting surface 22 and the heating surface 11, so that heat of the heating surface 11 is transferred to the second limiting surface 22 and then transferred to the back heating surface 33 at the corner 31 of the substrate 30, and further the local back heating surface 33 of the substrate 30 is also in heat conduction contact, thereby improving the heating condition of the back heating surface 33 of the substrate 30. On the basis, the operator can raise the area of the second limiting surface 22 as much as possible. It is desirable that the ratio of the area of the portion of the back heating surface 33 of the substrate 30 contacted by the second stopper surface 22 to the area of the back heating surface 33 of the substrate 30 is 5% to 10%. Therefore, the heating condition of the back heating surface 33 of the substrate 30 is improved, and the influence of the second limiting surface 22 on the baking of the back heating surface 33 of the substrate 30 can be avoided.
Here, in the present embodiment, the shape of the heat receiving unit is not limited, and the heat receiving unit may be a sheet shape that is stuck to the heating surface 11, or may be another shape.
Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered merely illustrative and not restrictive of the broad application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.
Also, this application uses specific language to describe embodiments of the application. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the present application is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.
Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.
Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows for a variation of + -%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.
For each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, the entire contents of which are hereby incorporated by reference into this application, except for application history documents that are inconsistent with or conflict with the contents of this application, and except for documents that are currently or later become incorporated into this application as though fully set forth in the claims below. It is noted that the descriptions, definitions and/or use of terms in this application shall control if they are inconsistent or contrary to the present disclosure.

Claims (10)

1. A substrate baking apparatus, comprising:
the heating table is provided with a heating surface for bearing the heating surface of the substrate;
the fixing mechanism is used for limiting the relative displacement of at least one corner of the substrate and the heating table in the direction vertical to the heating surface when the heating surface bears the substrate.
2. The substrate baking apparatus as claimed in claim 1, wherein the fixing mechanism comprises at least one corner fitting member, the corner fitting member is connected to the heating stage, the corner fitting member is formed with a first limiting surface and a second limiting surface which are sequentially arranged in a direction perpendicular to the heating surface, and the first limiting surface and the second limiting surface are arranged opposite to each other to form a bayonet which is adapted to the corner.
3. The substrate baking apparatus of claim 2 wherein the corner fitting further comprises a side limiting surface disposed between the first limiting surface and the second limiting surface, the side limiting surface being shaped to contact the sidewall of the corner when the heating surface bears the substrate.
4. The substrate baking apparatus of claim 3, wherein the corner portion has a first side wall and a second side wall connected to each other and disposed at a first included angle, the side limiting surface comprises a first side limiting surface and a second side limiting surface connected to each other and disposed at a second included angle, and an interface profile formed by the first side limiting surface and the second side limiting surface is used for contacting with an interface profile formed by the first side wall and the second side wall, wherein the second included angle is configured to be larger than the first included angle.
5. The substrate baking apparatus of claim 4 wherein the second included angle is 0.1 ° to 0.5 ° greater than the first included angle.
6. The substrate baking apparatus as claimed in claim 3, wherein the number of the corner fitting members in the fixing mechanism is plural, and at least two of the corner fitting members are respectively provided for fitting with the corners on both sides of the substrate in the diagonal direction.
7. The substrate baking apparatus as claimed in claim 6, wherein the corner fittings for engaging with the corners of the substrate at two opposite sides in the diagonal direction are a first corner fitting and a second corner fitting, respectively, one of the first corner fitting and the second corner fitting has a resilient contact portion, and the resilient contact portion defines a side limiting surface.
8. The substrate baking apparatus as claimed in any one of claims 6 or 7, wherein the corner fittings for respectively fitting the corners of both sides of the substrate in the diagonal direction are a first corner fitting and a second corner fitting, respectively, at least one of the first corner fitting and the second corner fitting being movably connected to the heating stage so that the first corner fitting and the second corner fitting can move toward or away from each other along the heating surface.
9. The substrate baking apparatus of claim 8, wherein one of the first and second angular engagement members is fixedly attached to the heating stage and the other one is movably attached to the heating stage; the fixing mechanism at least comprises two groups of angle position matching pieces which respectively act on two corners of the substrate in different diagonal directions, and one of the two groups of angle position matching pieces and the heating platform which are fixed with each other are respectively used for matching with the two corners on the same side of the substrate.
10. The substrate baking apparatus of claim 2, wherein the first position-limiting surface is located on a side of the second position-limiting surface close to the heating stage, and the corner fitting member further forms a heat receiving portion extending to the heating surface and in heat-conductive contact with the heating surface, so that heat of the heating surface is transferred to the second position-limiting surface.
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