CN114527626A - PCB hinders and welds exposure equipment and light source unit thereof - Google Patents
PCB hinders and welds exposure equipment and light source unit thereof Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 52
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- 238000005286 illumination Methods 0.000 claims abstract description 16
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- 238000005265 energy consumption Methods 0.000 abstract description 8
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The application relates to a PCB solder mask exposure device and a light source unit thereof, which comprises a light output device, a focusing device and an illuminating device, wherein light emitted by the light output device sequentially passes through the focusing device and the illuminating device and then is irradiated to a substrate to be exposed through a projection unit of the PCB solder mask exposure device; the optical output device is used for outputting an initial optical signal; the focusing device is used for receiving the initial optical signal, carrying out convergence collimation processing and outputting a converged optical signal; the lighting device is used for receiving the converged optical signals, performing uniform light shaping processing and outputting the uniform light shaped optical signals; and the optical signal after the uniform light shaping is used for completing the exposure of the PCB solder mask of the substrate to be exposed. Originally, the scattered light is changed into available energy to a great extent, and the obtained light signal with the light spot area conforming to the working range of the projection unit is irradiated onto the substrate to be exposed, so that the solder mask layer is promoted to finish polymerization and solidification, the required exposure time and power consumption are greatly reduced, and the resource waste in illumination and energy consumption is reduced.
Description
Technical Field
The application relates to the technical field of exposure of digital photoetching, in particular to a PCB solder mask exposure device and a light source unit thereof.
Background
In recent years, Printed Circuit Boards (PCBs) have played a critical role in the development of internet technology and the arrival of the intelligent information era. The current PCB boards are based on hundreds of millions of transistors and countless integrated components fabricated using lithographic projection technology, which includes two main aspects of photocopying and etching processes. The optical copying process is to transfer and project required pattern information onto silicon chip substrate with the help of photoresist under the action of light output by the exposure system, and the pattern information is divided into line or character layer exposure and solder mask layer exposure according to the process.
In the traditional exposure process of the solder mask, an ultraviolet light source is irradiated on a substrate through a film mask plate or a digital reflection mode to complete exposure, and the light source generally adopts a high-pressure mercury lamp or an array LED lamp bank. The wavelength of the ultraviolet light source is generally 350nm-410nm, so that the adopted solder resist material has a good photosensitive effect, and further good polymerization and solidification are carried out during exposure, and a layer of protective paint with high glossiness is formed on the circuit board. Among them, the high-pressure mercury lamp is used less and less because of the problems of fast attenuation of the light source, limited service life, certain pollution and the like. At present, an array LED lamp bank is frequently used, but because the light source of the LED lamp bank is relatively divergent, the required exposure time and power consumption are greatly increased when the LED lamp bank is directly used for irradiation exposure, and great resource waste is caused.
Disclosure of Invention
On the basis, the PCB solder mask exposure equipment and the light source unit thereof are needed to be provided aiming at the problem that the light source of the traditional array LED lamp bank is relatively divergent to cause great resource waste.
A light source unit of a PCB solder mask exposure apparatus, comprising: the light emitted by the light output device sequentially passes through the focusing device and the illuminating device and then is irradiated onto a substrate to be exposed through a projection unit of the PCB solder mask exposure equipment;
the optical output device is used for outputting an initial optical signal; the focusing device is used for receiving the initial optical signal, carrying out convergence collimation treatment and outputting a converged optical signal; the lighting device is used for receiving the converged optical signals, performing dodging shaping processing and outputting dodged and shaped optical signals; and the optical signal after the light homogenizing and shaping is used for completing the exposure of the PCB solder mask of the substrate to be exposed.
In one embodiment, the focusing device includes a first coupling lens and a second coupling lens, and the initial optical signal output by the optical output device sequentially passes through the first coupling lens and the second coupling lens, and then outputs the converged optical signal to the illumination device.
In one embodiment, the first coupling lens is a plano-convex lens and the second coupling lens is a convex lens.
In one embodiment, the illumination device includes a coupling element, a light homogenizing element and a focusing and shaping element, and the converged light signal output by the focusing device passes through the coupling element, the light homogenizing element and the focusing and shaping element in sequence, and then the light signal after the light homogenizing and shaping is output to the projection unit.
In one embodiment, the optical output device includes more than two optical output sub-modules, and the light of different wavelengths output by each optical output sub-module constitutes the initial optical signal.
In one embodiment, the light output device further includes a chassis, each light output sub-module is a circular LED array, and each light output sub-module is concentrically attached to the chassis.
In one embodiment, each of the light output sub-modules is a circular LED array, the number of the focusing devices is the same as the number of the light output sub-modules, and light output by one of the light output sub-modules is converged and collimated by one of the focusing devices to output a converged light signal.
In one embodiment, the light output device further comprises a light source controller, and the light source controller is connected with each light output submodule.
In one embodiment, the PCB solder mask exposure equipment comprises a projection unit and the light source unit, wherein the light signal output by the light source unit after dodging and shaping is irradiated onto a substrate to be exposed through the projection unit;
and the projection unit is used for receiving the light signal after the uniform light shaping and carrying out image modulation, outputting the modulated light signal and projecting the modulated light signal onto a substrate to be exposed, and completing the exposure of a PCB solder mask of the substrate to be exposed.
In one embodiment, the projection unit includes a spatial light modulator, a digital micro-mirror and a wide-spectrum imaging device, the spatial light modulator is connected to the digital micro-mirror, and the uniform light shaped optical signal output by the light source unit is irradiated onto the substrate to be exposed through the digital micro-mirror and the wide-spectrum imaging device in sequence.
Above-mentioned PCB hinders and welds exposure equipment and light source unit thereof, light source unit assembles and collimates the very big partial light intensity of the initial light signal of light output device output through focusing device, form the light signal of little divergence angle, carry out dodging and plastic through lighting device again, the light signal that obtains the facula area and accords with projection unit working range shines to treating the exposure base plate on, make it up the solder mask to accept to expose and accomplish polymerization solidification, light source unit will originally disperse the light of the great degree become usable energy, make required exposure time length and consumption greatly reduced, the wasting of resources on illumination and the energy consumption has been reduced.
Drawings
FIG. 1 is a block diagram of a PCB solder mask exposure apparatus in an embodiment;
FIG. 2 is a schematic view of a focusing assembly according to an embodiment;
FIG. 3 is a schematic diagram of an exposure of an embodiment of a PCB solder mask exposure apparatus;
FIG. 4 is a schematic diagram of exposure of a PCB solder mask exposure apparatus in another embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first resistance may be referred to as a second resistance, and similarly, a second resistance may be referred to as a first resistance, without departing from the scope of the present application. The first resistance and the second resistance are both resistances, but they are not the same resistance.
It is to be understood that "connection" in the following embodiments is to be understood as "electrical connection", "communication connection", and the like if the connected circuits, modules, units, and the like have communication of electrical signals or data with each other.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
In recent years, PCB boards have played a critical role in the development of internet technology and the arrival of the intelligent information age. The current PCB boards are based on hundreds of millions of transistors and countless integrated components fabricated using lithographic projection technology, which includes two main aspects of photocopying and etching processes. The optical copying process is to transfer and project required pattern information onto silicon chip substrate with the help of photoresist under the action of light output by the exposure system, and the pattern information is divided into line or character layer exposure and solder mask layer exposure according to the process.
In the traditional exposure process of the solder mask, the surface of the PCB is provided with a solder mask layer for preventing the circuit pattern from being oxidized and the electronic components from being short-circuited, and an ultraviolet light source can be irradiated on a substrate with photoresist through a film mask plate or a digital reflection mode for exposure. The ultraviolet light source for irradiation in the exposure system generally adopts a high-pressure mercury lamp or an array LED lamp group, and the wavelength generally selects 350nm-410nm, so that the adopted solder resist material has a good photosensitive effect, and further good polymerization and solidification are carried out during exposure, and a layer of protective paint with high glossiness is formed on the circuit board. Among them, the high-pressure mercury lamp is used less and less because of the problems of fast attenuation of the light source, limited service life, certain pollution and the like. At present, an array LED lamp bank is frequently used, but because the light source of the LED lamp bank is relatively divergent, the required exposure time and power consumption are greatly increased when the LED lamp bank is directly used for irradiation exposure, and great resource waste is caused.
Therefore, aiming at the problems of illumination resource waste and large power consumption caused by adopting the traditional array LED lamp group as the light source of the exposure system, the light source unit 10 of the PCB solder mask exposure equipment is provided. In one embodiment, as shown in fig. 1, the light source unit 10 includes a light output device 110, a focusing device 120 and an illuminating device 130, and light emitted from the light output device 110 passes through the focusing device 120 and the illuminating device 130 in sequence and then is irradiated onto a substrate to be exposed through the projection unit 20 of the PCB solder mask exposure apparatus; the optical output device 110 is used for outputting an initial optical signal; the focusing device 120 is configured to receive the initial optical signal, perform convergence and collimation processing, and output a converged optical signal; the lighting device 130 is configured to receive the converged optical signal, perform light homogenizing and shaping processing, and output a light signal after light homogenizing and shaping; and the optical signal after the dodging and shaping is used for completing the exposure of the PCB solder mask of the substrate to be exposed.
The solder resist material adopted by the solder resist layer is solder resist ink with photosensitive property, and can be polymerized and cured under the irradiation of ultraviolet light output by the light source unit 10, so that a protective layer is formed on the circuit and the element of the substrate, and the protective layer is not easy to fall off in the subsequent etching process, thereby being beneficial to improving the surface glossiness of the circuit board. However, in the exposure process of the solder mask layer, the ultraviolet spectrums with different wavelengths have different curing effects on the solder mask ink. For example, a shorter wavelength 355nm spectrum can only act on the surface layer of the solder resist ink layer exposed in the external space, while a spectrum with a wavelength of 405nm can penetrate the surface of the solder resist ink layer and act on the inner deep layer of the solder resist ink. Therefore, in the present embodiment, the initial optical signal output by the optical output device 110 is a multiband optical signal composed of spectra with two or more wavelengths. The specific choice of the wavelength is not unique, and can be determined according to the characteristics of the solder mask layer of the substrate to be exposed actually, for example, 365nm, 375nm, 385nm, 405nm, etc., without being limited thereto.
Correspondingly, the light output device 110 is a light source device capable of outputting spectra with two or more wavelengths, and is capable of generating spectra with different wavelengths and outputting the spectra according to the exposure requirement of the substrate to be exposed. In the embodiment of the present application, the optical signal of the optical output device 110 is emitted by an array LED lamp set light source. In addition, the light spectrums with different wavelengths may be respectively emitted by a plurality of light sources in a plurality of modules and then combined, or a plurality of light sources may be combined into one module and then output, which is not limited herein.
Specifically, because the optical signal that light output device 110 sent is comparatively dispersed, when being directly used for waiting to expose the solder mask of base plate to expose, the required exposure time of solidification completion and energy consumption are all great, consequently, receive the initial optical signal that light output device 110 sent through burnt device 120, and assemble the collimation to it, the output light intensity is the more concentrated light signal of assembling after, can greatly reduce the required exposure time of solder mask solidification completion and energy consumption, reach the purpose that reduces energy consumption such as illumination and electric quantity. The focusing device 120 may be formed by coupling lenses according to an optical principle, or may be formed by a focusing lens or other devices. In addition, since the converged optical signal output by the focusing device 120 is subjected to convergence and collimation processing, the converged optical signal is an initial optical signal with a reduced beam diameter, and it can be understood that the wavelength information of the included optical signal is consistent with the initial optical signal, and also belongs to a multiband optical signal.
Further, although the collected optical signals have been subjected to preliminary collimation, the optical signals of different wavelength bands need to be subjected to coupling processing. In order to achieve the best exposure efficiency, before outputting the optical signal to the projection unit 20 of the PCB solder mask exposure apparatus and irradiating the optical signal to the substrate to be exposed, the optical signal needs to be homogenized to obtain an approximately parallel light beam, and then the homogenized optical signal is shaped, so that the light spot area of the converged optical signal finally output by the illumination device 130 is not larger than the working range of the projection unit 20. Correspondingly, the illumination device 130 may be implemented by a coupling component, a light homogenizing component and a focusing and shaping component, wherein the coupling component, the light homogenizing component and the focusing and shaping component sequentially receive the light signals and correspondingly process the light signals, and then output the light signals after the light homogenizing and shaping. The optical signal after the uniform light shaping is projected to the substrate to be exposed through the projection unit 20, so that the PCB solder mask of the substrate to be exposed receives exposure, and polymerization curing is obtained.
Above-mentioned PCB hinders light source unit of welding exposure equipment, through the focus device with the very big partial light intensity of the initial light signal of light output device output assemble and the collimation, form the light signal of little divergence angle, carry out dodging and plastic through lighting device again, the light signal that obtains the facula area and accords with projection unit working range shines to treating the exposure base plate on, make it up the solder mask to accept to expose and accomplish polymerization solidification, light source unit will originally become usable energy with the light of divergence to the very big degree, make the long and consumption greatly reduced of required exposure, the wasting of resources on illumination and the energy consumption has been reduced.
In one embodiment, as shown in fig. 2, the focusing device 120 includes a first coupling lens 121 and a second coupling lens 122, and the initial optical signal output by the optical output device 110 sequentially passes through the first coupling lens 121 and the second coupling lens 122, and then outputs the converged optical signal to the illumination device 130.
Specifically, the focusing device 120 is configured to receive a relatively divergent optical signal emitted by the optical output device 110, and converge the light intensity diverged therein as much as possible to obtain usable energy for exposing the solder mask of the substrate to be exposed. The first coupling lens 121 is configured to receive an initial optical signal output by the optical output device 110, converge the initial optical signal, and transmit the converged initial optical signal to the second coupling lens 122, and the second coupling lens 122 is configured to further focus and collimate the optical signal converged by the first coupling lens 121, and then output the optical signal to the lighting device 130.
Further, the focusing device 120 of the present embodiment is composed of two coupling lenses, and the first coupling lens 121 and the second coupling lens 122 may use the same coupling lens or different coupling lenses.
In one embodiment, as shown in fig. 2, the first coupling lens 121 is a plano-convex lens and the second coupling lens 122 is a convex lens.
Specifically, the convex edge of the plano-convex lens of the first coupling lens 121 is used for receiving the initial optical signal emitted by the optical output device 110, and the initial optical signal is refracted and converged by the lens and then output to the second coupling lens 122 through the flat edge thereof. The parameters of the plano-convex lens, such as diameter, curvature and focal length, are not fixed, and need to be selected according to the specification of the light output device 110. For example, in order to converge the originally divergent original light signal as much as possible, the plano-convex lens may have a larger diameter and curvature, and it can be understood that when the area of the plano-convex lens is larger than that of the light output device 110, the best effect of converging the light intensity can be achieved. In addition, in order to obtain a finer light beam focusing energy, the focal length of the plano-convex lens can be selected to be smaller, so that the area of the light spot collimated by the second coupling lens 122 is smaller than the area of the coupling component of the illumination device 130, and all the light beams can be processed by the coupling component, thereby increasing the available energy to the greatest extent. For example, assuming that the initial light signal output by the light output device 110 includes spectra of 405nm, 385nm and 365nm of 30W, a plano-convex lens with a diameter of 56mm and a focal length of 100mm and a convex lens with a diameter of 100mm are selected to be combined, and the output collimated light spot area is smaller than the area of the coupling element of the lighting device 130, all light beams can be processed by the coupling element, and the available energy is increased to the maximum extent.
It can be understood that the optical signal output after passing through the plano-convex lens diverges after converging to the focal point of the plano-convex lens. Further, by making the convex lens of the second coupling lens 122 receive the optical signal output by the plano-convex lens, the divergence angle of the optical signal is reduced, and the light spot area is smaller than the area of the coupling member of the illumination device 130. The converged optical signal output by the second coupling lens 122 may be an approximately parallel light beam or a light beam with a small divergence angle.
In this embodiment, the coupling lens group structure of the focusing device 120 receives the initial optical signal emitted by the optical output device 110, and performs convergence and collimation processing on the initial optical signal, so as to output a converged optical signal with concentrated light intensity, thereby greatly reducing exposure time and energy consumption required for completing the curing of the solder resist layer, and achieving the purpose of reducing energy consumption such as illumination and electric quantity.
In one embodiment, as shown in fig. 1, the illumination device 130 includes a coupling component, a light homogenizing component, and a focusing and shaping component, and the focused light signal output by the focusing device 120 passes through the coupling component, the light homogenizing component, and the focusing and shaping component in sequence, and then outputs the light signal after being homogenized and shaped to the projection unit 20.
Specifically, the converged optical signal output by the second coupling lens 122 is output to a coupling element, and the coupling element performs coupling processing on the multiband optical signal contained therein to obtain a coupled optical signal. The dodging piece is used for receiving the coupled optical signals output by the coupling piece, and dodging the coupled optical signals into approximately parallel light beams to obtain dodged optical signals. The focusing shaping element is used for receiving the homogenized optical signal output by the homogenizing element, and shaping the optical signal until the spot area is not larger than the working range required by the subsequent projection unit 20 to obtain the homogenized and shaped optical signal. It is understood that the present embodiment does not limit the specific components of the coupling element, the light homogenizing element and the focusing shaping element, and those skilled in the art can select them according to actual needs. For example, the coupling element may be a coupling lens, the light homogenizing element may be an optical rod, an eagle lens, or the like, and the focusing and shaping element may be a focusing and shaping lens group.
In one embodiment, the optical output device 110 includes more than two optical output sub-modules, and the light of different wavelengths output by each optical output sub-module constitutes the initial optical signal. It will be appreciated that in order to output optical signals including different wavelengths such that complete polymerization and curing of the solder resist ink of the solder mask layer is achieved, the optical output device 110 of the present application uses light of different wavelengths output by more than two optical output sub-modules.
In one embodiment, the light output device 110 further comprises a chassis, each light output sub-module is a circular LED array, and each light output sub-module is concentrically attached to the chassis. Specifically, as shown in fig. 3, the LED arrays for outputting light with different wavelengths are arranged in a circular ring shape, and are concentrically fitted on a chassis (not shown) to form an integral light output device 110. It can be understood that the LED array is comprised of LED beads. For example, 365nm LED lamp beads, 385nm LED lamp beads and 405nm LED lamp beads are sequentially arranged from inside to outside in fig. 3, so that ultraviolet light with wavelengths of 365nm, 385nm and 405nm can be emitted simultaneously. In the embodiment, the LED arrays with various wavelengths are arranged in a circular ring shape, which is beneficial to more complete exposure after uniform light output. In addition, the light output device adopts the design mode of an integral module, so that the integral space of the exposure equipment is saved while the multiband light signal output is realized, and the equipment looks simpler and more compact. For example, suppose that the substrate to be exposed requires 405nm, 385nm and 365nm LED light sources of 30W each. According to the size and power analysis of the current market LED, the size of a single LED light source is 4mm × 3.14, the maximum power is 0.6W, the number of required LED light beads is 30/6 ═ 50, and the area occupied by a single wavelength light source is 0.4 × 3.14 ═ 50 ═ 25.12cm2The total area occupied by the three-wavelength light source is 75.6cm2And when the circular ring design is adopted, more space can be saved compared with single equipment.
In another embodiment, as shown in fig. 4, each light output sub-module may be a circular LED array, the number of the focusing devices 120 is the same as the number of the light output sub-modules, and the light output by one light output sub-module is converged and collimated by one focusing device 120, so as to output a converged light signal. It can be understood that the light signals with different wavelengths are separately output and then respectively matched with a focusing device to converge the light intensity, so that more light energy can be converged. And the setting mode has lower maintenance and cost for equipment, and can more conveniently increase and decrease light sources with different wave bands without damaging the original structure.
In one embodiment, the light output device 110 further comprises a light source controller, which is connected to each light output sub-module. Specifically, the light source controller may correspondingly control the working state of the light output sub-module and the intensity of the output light signal according to the wavelength band and the power required by the substrate to be exposed. For example, when the substrate to be exposed requires 405nm, 385nm and 365nm LED light sources of 30W each, the light output sub-modules may be turned on to output the spectrum of 405nm, 385nm and 365nm wavelengths, and the intensity may be adjusted to output 30W.
In addition, in other embodiments, the light source controller may further be configured to adjust a distance between the first coupling lens 121 and the second coupling lens 122, so that the spot area of the homogenized and shaped light signal output by the light source unit 110 is not larger than the working range of the projection unit 20, and the optimal degree of exposure is achieved. Movable devices can be added on the first coupling lens 121 and the second coupling lens 122, the movable devices are connected with the light source controller and feed back the distance between the first coupling lens 121 and the second coupling lens 122 to the light source controller, and the light source controller correspondingly adjusts the distance, so that the area of the light spot of the light signal output by the light source unit 110 after the uniform light shaping is changed, and the requirements of exposure equipment are matched. The moving mode of the movable device is not exclusive and can be manually adjusted in a manual mode or automatically adjusted according to a moving signal of the light source controller.
In one embodiment, as shown in fig. 1, a PCB solder mask exposure apparatus is provided, which includes a projection unit 20 and a light source unit 10, wherein a homogenized and shaped light signal output by the light source unit 10 is irradiated onto a substrate to be exposed through the projection unit 20; the projection unit 20 is configured to receive the homogenized and shaped optical signal, perform image modulation, output the modulated optical signal, and project the modulated optical signal onto a substrate to be exposed, thereby completing exposure of a PCB solder mask of the substrate to be exposed.
Specifically, the light source unit 10 outputs an initial light signal including multiple wavelengths through the light output device, receives the initial light signal through the focusing device, performs convergence collimation processing on the initial light signal, converges and collects originally divergent light, improves the light intensity utilization rate, and outputs a converged light signal. The converged optical signals are subjected to coupling, light homogenizing and shaping treatment by the lighting device, multiband optical signals are coupled to form a beam of approximately parallel light, and the uniformly-homogenized and shaped optical signals are output and used for completing exposure of a PCB solder mask of a substrate to be exposed.
Further, the projection unit 20 is a device containing the graphic information to be engraved on the substrate to be exposed, and may be implemented by a photoresist and a mask plate on which the graphic information is pre-set, or may be implemented by a digital image scanning system based on a Digital Micromirror Device (DMD).
In one embodiment, as shown in fig. 3 and 4, the projection unit 20 includes a spatial light modulator (not shown), a digital micro-mirror 220 and a wide-spectrum imaging device 230, the spatial light modulator is connected to the digital micro-mirror 220, and the uniform-light shaped optical signal output by the light source unit 10 is sequentially irradiated onto the substrate to be exposed through the digital micro-mirror 220 and the wide-spectrum imaging device 230.
The wide-spectrum imaging device 230 is a combined lens capable of realizing high transmittance and low damage with a spectrum having a wavelength of 300-450nm, and the selection of the actual hardware is not unique, and can be selected according to the relevant size range of the target image in the spatial light modulator, so as to complete exposure on the substrate to be exposed.
Specifically, the spot area of the homogenized and shaped optical signal output by the light source unit 10 is not larger than the working range of the projection unit 20, that is, the projection area of the light source unit 10 completely covers the incident surfaces of all the sub-units in the Digital Micromirror (DMD)220, each sub-unit in the digital micromirror 220 reflects the sub-beam projected onto the projection surface of the incident optical signal to a preset position, and further decomposes the optical signal emitted by the light source unit 10 into a plurality of sub-beams. The spatial light modulator includes pattern information to be engraved on the substrate to be exposed, and can control the on/off of a plurality of subunits in the digital micro-mirror 220 according to the pattern information to be engraved, the subunits in an open state reflect the sub-beams to the wide-spectrum imaging device 230, and then the sub-beams are projected to the substrate to be exposed through the wide-spectrum imaging device 230, so as to form a corresponding exposure pattern on the substrate to be exposed.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A light source unit of a PCB solder mask exposure apparatus, comprising: the light emitted by the light output device sequentially passes through the focusing device and the illuminating device and then is irradiated onto a substrate to be exposed through a projection unit of the PCB solder mask exposure equipment;
the optical output device is used for outputting an initial optical signal; the focusing device is used for receiving the initial optical signal, carrying out convergence collimation treatment and outputting a converged optical signal; the lighting device is used for receiving the converged optical signals, performing dodging shaping processing and outputting dodged and shaped optical signals; and the optical signal after the light homogenizing and shaping is used for completing the exposure of the PCB solder mask of the substrate to be exposed.
2. The light source unit according to claim 1, wherein the focusing device comprises a first coupling lens and a second coupling lens, and the initial optical signal output by the optical output device sequentially passes through the first coupling lens and the second coupling lens, and then outputs the converged optical signal to the illumination device.
3. The light source unit according to claim 2, wherein the first coupling lens is a plano-convex lens, and the second coupling lens is a convex lens.
4. The light source unit according to claim 1, wherein the illumination device comprises a coupling element, a light homogenizing element and a focusing and shaping element, and the focused light signal output by the focusing device passes through the coupling element, the light homogenizing element and the focusing and shaping element in sequence, and then the light signal after the light homogenizing and shaping is output to the projection unit.
5. The light source unit according to any one of claims 1-4, wherein the light output device comprises more than two light output sub-modules, and light of different wavelengths output by each light output sub-module constitutes the initial light signal.
6. The light source unit of claim 5, wherein the light output device further comprises a chassis, each of the light output sub-modules is a circular ring-shaped LED array, and each of the light output sub-modules is concentrically attached to the chassis.
7. The light source unit according to claim 5, wherein each of the light output sub-modules is a circular LED array, the number of the focusing devices is the same as the number of the light output sub-modules, and light output by one of the light output sub-modules is converged and collimated by one of the focusing devices to output a converged light signal.
8. A light source unit according to claim 6 or 7, wherein the light output device further comprises a light source controller connected to each of the light output sub-modules.
9. A PCB solder mask exposure device is characterized by comprising a projection unit and the light source unit of any one of claims 1 to 8, wherein the light signal output by the light source unit after dodging and shaping is irradiated onto a substrate to be exposed through the projection unit;
and the projection unit is used for receiving the light signal after the uniform light shaping and carrying out image modulation, outputting the modulated light signal and projecting the modulated light signal onto a substrate to be exposed, and completing the exposure of a PCB solder mask of the substrate to be exposed.
10. The PCB solder mask exposure apparatus of claim 9, wherein the projection unit comprises a spatial light modulator, a digital micro-mirror and a broad-spectrum imaging device, the spatial light modulator is connected with the digital micro-mirror, and the light signal output by the light source unit after the light homogenizing and shaping passes through the digital micro-mirror and the broad-spectrum imaging device in sequence and is irradiated onto the substrate to be exposed.
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| CN202210202432.5A CN114527626A (en) | 2022-03-02 | 2022-03-02 | PCB hinders and welds exposure equipment and light source unit thereof |
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| CN202210202432.5A CN114527626A (en) | 2022-03-02 | 2022-03-02 | PCB hinders and welds exposure equipment and light source unit thereof |
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