CN210691043U - Multi-spectral digital exposure system for integrally exposing resistance welding circuit - Google Patents
Multi-spectral digital exposure system for integrally exposing resistance welding circuit Download PDFInfo
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- CN210691043U CN210691043U CN201922156450.0U CN201922156450U CN210691043U CN 210691043 U CN210691043 U CN 210691043U CN 201922156450 U CN201922156450 U CN 201922156450U CN 210691043 U CN210691043 U CN 210691043U
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Abstract
The utility model discloses a hinder multispectral digital exposure system of integrative exposure of solder mask circuit, this system includes: a 355nm solid laser for solidifying the surface layer of the solder resist ink by light with the output wavelength of 355 nm; the reflector projects light with the wavelength of 355nm output by the 355nm solid laser onto the digital micro-reflector, performs pattern modulation through the digital micro-reflector, converts a digital signal into an optical signal, and performs imaging on the exposure plate through the wide-spectrum imaging system; and the synchronous controller is used for driving the digital micro-reflector to output an image by triggering the digital micro-reflector driving board according to the position information fed back by the exposure board, and the digital micro-reflector transmits the reversal pulse signal of the micro-mirror lens to the light source control board through the digital micro-reflector driving board. The utility model discloses can solve among the prior art because the laser direct exposure equipment of single wavelength is used to hinder and welds the processing procedure in and the surface gloss degree of hindering that leads to is not enough and adopt the not good problem of a plurality of ultraviolet LED multi-wavelength mixture formation image quality completely.
Description
Technical Field
The utility model discloses the implementation relates to hinder the weld layer to the circuit and carry out digital exposure (or photoetching) technical field, concretely relates to hinder the multispectral digital exposure system of circuit an organic whole exposure.
Background
The photoetching process of the circuit board can be divided into the following steps according to the process procedures: exposing the circuit or character layer and exposing the solder mask layer. The solder mask layer is a solder mask layer on the surface of the printed circuit board and is used for preventing the surface of the circuit board from being oxidized. The conventional exposure process for preparing the solder mask is carried out by irradiating light on the surface of a film by a light source, wherein the light source is a high-pressure mercury lamp or an array LED, and the wavelength of the light source is in the range of 350nm to 410 nm. The solder resist material used in the current industry has a good photosensitive effect in the wavelength range, and then is subjected to good polymerization and curing during exposure to form a protective paint with high glossiness.
With the continuous development of the PCB industry, an exposure method that does not require a film stencil is being widely used to replace the conventional stencil exposure method, which is digital lithography using a laser. In the line process, a large number of single-wavelength laser digital photoetching technologies and related products emerge, and in the solder resist process, LED digital photoetching exposure technologies and equipment exist.
The existing digital photoetching equipment used for line process exposure utilizes laser to directly draw pictures, and a 405nm single-wavelength semiconductor laser is used as a light source. The photosensitive material used in the solder mask process generally requires the use of a mixed wavelength light source in the range of 350nm to 410nm, such as: conventional exposure processes use high-pressure mercury lamps (wavelength range 320nm to 410nm), multi-wavelength mixed LED arrays, and the like. When the single-wavelength laser direct exposure equipment is applied to the solder mask process, the surface of the manufactured solder mask can lose the glossiness, and the use requirement of the current industry on the solder mask cannot be met. In addition to the method of using 405nm single-wavelength semiconductor laser as light source, there is also method of using ultraviolet multi-wavelength LED light source to realize digital exposure, but the multiple LEDs are combined into beams, the optical imaging system is complex in structure, low in light energy utilization rate, short in imaging surface depth, and poor in imaging quality compared with the method of using laser as light source.
It is therefore desirable to have a solution that overcomes or at least alleviates at least one of the above-mentioned drawbacks of the prior art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a hinder multispectral digital exposure system that circuit body was exposed of welding overcomes or alleviates at least one among the above-mentioned defect of prior art at least.
In order to achieve the above object, the utility model provides a hinder multispectral digital exposure system of integrative exposure of solder mask circuit, this system includes:
a 355nm solid laser for solidifying the surface layer of the solder resist ink by light with the output wavelength of 355 nm;
the reflector is used for projecting light with the wavelength of 355nm output by the 355nm solid laser onto the digital micro-reflector, carrying out pattern modulation through the digital micro-reflector, converting a digital signal into an optical signal and imaging on the exposure plate through the wide-spectrum imaging system; in the imaging process, the solder resist ink from the surface layer to the deep layer along the thickness direction of the solder resist ink is positioned in the focal depth range of the spectrum with the wavelength of 355 nm;
and the synchronous controller is used for driving the digital micro-reflector to output an image by triggering the digital micro-reflector driving board according to the position information fed back by the exposure board, and the digital micro-reflector transmits the inversion pulse signal of the micro-mirror to the light source control board through the digital micro-reflector driving board.
Further, the multispectral digital exposure system for solder mask line integral exposure further comprises:
a combined light source; and
the light combining component is used for performing light combining treatment on the light with the wavelength of 355nm output by the 355nm solid-state laser to obtain combined light with a mixed waveband;
the combined light source comprises a first light source outputting light with the wavelength of 405nm and/or a second light source outputting light with the wavelength of 375nm, the deep layer in the solder resist ink can be cured through the spectrum with the wavelength of 405nm, and the middle layer in the solder resist ink can be cured through the spectrum with the wavelength of 375 nm.
Further, in the case where the combined light source includes the first light source, the combined light source further includes one or more of a third light source that outputs light having a wavelength of 365nm, a fourth light source that outputs light having a wavelength of 385nm, and a fifth light source that outputs light having a wavelength of 395nm, the inner intermediate layer of the solder resist ink can be cured by the spectrum of the wavelength of 365nm or 385nm or 395 nm.
Further, in the case that the solder resist ink is a large-volume H-8100 type ink, the combined light source is the first light source and the third light source; and under the condition that the solder resist ink is solar PSR 2000-CE823 type ink, the combined light source is the first light source and the fourth light source.
Further, the first light source is a 405nm semiconductor light source or a 405nm LED light source.
Further, the second light source is a 375nm semiconductor light source or a 375nm LED light source.
Further, the light combination component comprises:
a coupling member for coupling light of 355nm wavelength output from the 355nm solid-state laser and light output from the combined light source;
the light homogenizing piece is used for homogenizing the light output by the coupling piece to obtain approximately parallel output light; and
and the focusing and shaping mirror group is used for shaping the output light of the light homogenizing piece to ensure that the area of a light spot of the focusing and shaping mirror group is not smaller than the working range of the digital micro-reflector.
Further, the number of the light combination assemblies is matched with the total number of the light sources in the 355nm solid-state laser and the combined light source;
the output end of the 355nm solid-state laser is coupled with the input end of the light combining component, the output ends of one or more light sources in the combined light source are respectively coupled with the input end of the light combining component, each light combining component further comprises a spectroscope, and the spectroscope is used for combining the light output by the focusing and shaping lens group in each light combining component into a beam of light and projecting the beam of light onto the reflecting mirror.
Furthermore, the number of the light combining components is one, the output end of the 355nm solid-state laser and the output end of each light source in the combined light source are coupled to the input end of the light combining component at the same time, and the light combining component further comprises a spectroscope, and the spectroscope is used for projecting the light output by the focusing and shaping mirror group in the light combining component onto the reflector.
Further, the coupling piece and the light homogenizing piece in the light combination component are replaced by optical fibers, and the number of the optical fibers is matched with the total number of the light sources in the 355nm solid-state laser and the combined light source;
the output end of the 355nm solid laser is coupled with the input end of one optical fiber, the output ends of one or more light sources in the combined light source are respectively coupled with the input end of one optical fiber, and the light output by each optical fiber is projected to the same focusing and shaping lens group and then output.
The utility model discloses can solve among the prior art because the laser direct exposure equipment of single wavelength is used to hinder and welds the problem that the surface gloss is not enough and adopt a plurality of ultraviolet LED multi-wavelength mixture formation image quality not good problem completely that leads to in the processing procedure.
Drawings
Fig. 1 is a schematic structural diagram of a multispectral digital exposure system for integrally exposing a solder resist circuit according to an embodiment of the present invention;
FIG. 2 is a schematic representation of the multispectral operation of FIG. 1;
FIG. 3 is a focal depth range diagram of the 355nm spectrum of FIG. 1;
FIG. 4 is a schematic structural diagram of a first embodiment of the light combining assembly shown in FIG. 1;
FIG. 5 is a schematic structural diagram of a second embodiment of the light combining assembly shown in FIG. 1;
fig. 6 is a schematic structural diagram of a third embodiment of the light combining assembly in fig. 1.
Detailed Description
In the drawings, the same or similar reference numerals are used to denote the same or similar elements or elements having the same or similar functions. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In the description of the present invention, the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the scope of the present invention.
As shown in fig. 1, fig. 4, fig. 5 and fig. 6, the multispectral digital exposure system for solder mask line integrated exposure provided by the embodiment of the present invention includes a 355nm solid laser, a digital micro-mirror 102, a reflecting mirror 103, a broad spectrum imaging system 104 and a synchronous controller and an exposure board 105, wherein:
the wavelength of the spectrum output by the 355nm solid laser is 355nm, and the surface layer of the solder resist ink is cured through the spectrum with the wavelength of 355 nm.
As shown in fig. 2, the solder resist includes a copper plate and a solder resist ink layer a attached to the copper plate and having a certain thickness, and an arrow B of fig. 2 indicates a thickness direction of the solder resist ink layer a.
The wavelength of the spectrum with the wavelength of 355nm is short, the spectrum can only act on the surface layer of the solder resist ink layer exposed in the external space, at the moment, after the energy of the spectrum with the wavelength of 355nm is absorbed by the corresponding photosensitive material in the solder resist ink, the solidification strength of the spectrum attached to the copper plate is higher, namely, the surface layer of the solder resist ink is solidified through the spectrum with the wavelength of 355nm, and therefore the surface layer of the solder resist ink is not easy to fall off from the copper plate in the subsequent developing process, and the surface glossiness of the solder resist ink is favorably improved.
The reflector 103 is used for projecting the light with the wavelength of 355nm output by the 355nm solid-state laser onto the digital micro-reflector 102, performing pattern modulation through the digital micro-reflector 102, converting a digital signal into an optical signal, and imaging on an exposure plate through the wide-spectrum imaging system 104. In the imaging process, the surface layer of the solder resist ink and the depth layer of the solder resist ink are all located in the focal depth range of the spectrum with the wavelength of 355 nm. In the imaging process, the solder resist ink surface layer and the solder resist ink thickness direction B to the deep layer are all located in the focal depth range of the spectrum with the wavelength of 355 nm. As shown in fig. 3, the depth of focus (DOF) range of the spectrum with the wavelength of 355nm is long, which is still within the depth of focus range of the spectrum with the wavelength of 355nm when the position of the solder resist ink layer is changed for the characteristic of the unevenness of the surface layer of the solder resist ink, so that the analysis effect is better, and the method is further suitable for manufacturing a precise solder resist circuit.
The axial position of the exposure plate (grating ruler scanning exposure plate) 105 is fed back to the motion control platform and the synchronous control plate in a pulse form, in the embodiment, the motion control platform comprises a processor for processing grating feedback signals, the synchronous control plate transmits pulse signals to the digital micro-mirror driving plate, so that the digital micro-mirror driving plate is triggered to control the digital micro-mirror 102 to emit images, the digital micro-mirror 102 feeds back the inversion pulse signals of the micro-mirror to the digital micro-mirror driving plate, and the digital micro-mirror driving plate sends the pulse signals to the light source control plate.
In an embodiment, the multispectral digital exposure system for solder mask line integral exposure further includes a combined light source and a light combining component 101, where the light combining component 101 is configured to combine light output by the 355nm solid-state laser and light output by the combined light source to obtain combined light in a mixed waveband. The combined light source includes a first light source that outputs light having a wavelength of 405nm and/or a second light source that outputs light having a wavelength of 375 nm. In this embodiment, the first light source is a 405nm semiconductor light source or a 405nm LED light source, and the second light source is a 375nm semiconductor light source or a 375nm LED light source.
The spectrum with the wavelength of 405nm has a longer wavelength, can penetrate through the surface of the solder resist ink layer and acts on the inner deep layer of the solder resist ink, at the moment, after the corresponding photosensitive material in the solder resist ink absorbs the energy of the spectrum with the wavelength of 405nm, the solidification strength of the photosensitive material attached to the copper plate is higher, namely, the inner deep layer of the solder resist ink is solidified through the spectrum with the wavelength of 405nm, and therefore the solder resist ink is not easy to fall off from the copper plate in the subsequent developing process, and the surface glossiness of the solder resist ink is favorably improved.
The spectrum with the wavelength of 375nm can penetrate through the surface of the solder resist ink layer and act on the inner middle layer of the solder resist ink, at the moment, after the corresponding photosensitive material in the solder resist ink absorbs the energy of the spectrum output by the auxiliary light source, the solidification strength of the spectrum attached to the copper plate is higher, namely, the spectrum with the wavelength of 375nm can solidify the inner middle layer of the solder resist ink, so that the spectrum is not easy to fall off from the copper plate in the subsequent developing process, and the surface glossiness of the solder resist ink is favorably improved.
In one embodiment, where the combined light source comprises the first light source, the combined light source further comprises one or more of a third light source outputting light having a wavelength of 365nm, a fourth light source outputting light having a wavelength of 385nm and a fifth light source outputting light having a wavelength of 395 nm. In this embodiment, the third light source is a 365nm led light source, the fourth light source is a 375nm led light source, and the fifth light source is a 395nm led light source.
The spectrum with the wavelength of 365nm can penetrate through the surface of the solder resist ink layer and act on the inner middle layer of the solder resist ink, at the moment, after the energy of the spectrum output by the auxiliary light source is absorbed by the corresponding photosensitive material in the solder resist ink, the solidification strength of the spectrum attached to the copper plate is higher, namely, the spectrum with the wavelength of 365nm can solidify the inner middle layer of the solder resist ink, so that the spectrum is not easy to fall off from the copper plate in the subsequent developing process, and the surface glossiness of the solder resist ink is favorably improved.
The spectrum with the wavelength of 385nm can penetrate through the surface of the solder resist ink layer and act on the inner middle layer of the solder resist ink, at the moment, after the energy of the spectrum output by the auxiliary light source is absorbed by the corresponding photosensitive material in the solder resist ink, the solidification strength of the spectrum attached to the copper plate is higher, namely, the spectrum with the wavelength of 385nm can solidify the inner middle layer of the solder resist ink, so that the spectrum is not easy to fall off from the copper plate in the subsequent developing process, and the surface glossiness of the solder resist ink is favorably improved.
The spectrum with the wavelength of 395nm can penetrate through the surface of the solder resist ink layer and act on the inner middle layer of the solder resist ink, at the moment, after the energy of the spectrum output by the auxiliary light source is absorbed by the corresponding photosensitive material in the solder resist ink, the solidification strength of the spectrum attached to the copper plate is higher, namely, the spectrum with the wavelength of 395nm can solidify the inner middle layer of the solder resist ink, so that the spectrum is not easy to fall off from the copper plate in the subsequent developing process, and the surface glossiness of the solder resist ink is favorably improved.
Of course, the combined light source may also include other light sources with output wavelengths in the range of 340nm to 420nm, and the specific selection of which wavelength light source is to be combined is mainly determined according to the characteristics of the solder resist ink itself. By combining UV light with different wavelengths, the realization mode of the UV light can be various forms such as a 355nm solid laser, an LD laser, an LED and the like; two or more ultraviolet light can be used as the light source of the exposure equipment; two or more ultraviolet lights are used as light sources of the equipment, so that the system can be ensured to have small numerical aperture and high imaging quality; the solid laser has high monochromaticity and good exposure performance; the system has a long scene, which is beneficial to ensuring the yield of products; the solid laser has higher energy density than the LED; the advantages enable the imaging quality of the system to meet the requirements of the circuit manufacturing process, enable the equipment to meet the resistance welding manufacturing process and have the circuit production capacity.
In one embodiment, in the case where the solder resist ink is a solar PSR 2000-CE823 type ink, the combined light source is the first light source and the fourth light source.
The 355nm solid laser and the 405nm semiconductor light source (LD) are used independently, and the number of energy grids of the exposure ruler is only 9 under the condition of 700mJ energy according to the energy display of the exposure ruler; the exposure energy is continuously increased to 900mJ, the energy grid of the exposure ruler is improved to a very limited extent, only 9 grids and a half, and meanwhile, the phenomenon of excessive exposure is reflected by the solder resist ink. Aiming at the model number solder resist ink, a 355nm solid laser and a 405nm semiconductor light source are completely reacted, the exposure effect cannot be improved by increasing the two wavelength light sources, and the problem can be improved by increasing other wavelengths.
In one embodiment, when the solder resist ink is a high volume H-8100 (coffee) type ink, the combined light source is the first light source and the third light source.
The exposure energy value of the ink is tested to be 2000mJ by using a 355nm solid laser or a 405nm semiconductor light source (LD) alone; the energy grids of the exposure ruler show 13 grids, the exposure energy is continuously increased to 2500mJ, the energy grids of the exposure ruler show 14 grids, the surface of the solder resist ink is dull, and the glossiness value is 53Gu, and the glossiness is not ideal. Aiming at the fact that the solder resist ink is coffee, the light penetrating power is hindered, and meanwhile the response to light is insensitive, the 365nm wavelength LED light source is added on the basis of the original light path, so that the characteristics of supplementing exposure energy and increasing the surface gloss of the solder resist ink are achieved, under the condition of 1800mJ energy, the energy grids of an exposure ruler are 13 grids, and meanwhile, the gloss value is increased from 53Gu to 75Gu, so that the exposure efficiency is improved, and the surface gloss of the solder resist ink is increased.
In one embodiment, the light combining component 101 comprises a coupler, a light homogenizing element, and a focusing shaping mirror, wherein:
the coupling element is used for coupling the light output by the main light source and the light output by the auxiliary light source, and concentrating different light beams into a beam of light, wherein the beam of light contains light spectrums with different wavelengths.
The light homogenizing piece is used for homogenizing the light output by the coupling piece to obtain approximately parallel output light, and the light intensity of each point on the cross section of the light beam is basically equal.
The focusing and shaping lens group is used for shaping the output light of the light homogenizing piece to enable the light spot of the output light to reach a preset standard, and the shape of the preset standard is as follows: the rectangle is matched with the digital micro-reflector; the area size requirement is as follows: not less than the working range of the digital micro-mirror.
As a first implementation manner of the light combining component 101, the number of the light combining components is adapted to the total number of the light sources of the 355nm solid-state laser and the combined light source. The output end of the 355nm solid-state laser is coupled with the input end of the light combining component, the output ends of one or more light sources in the combined light source are respectively coupled with the input end of the light combining component, each light combining component further comprises a spectroscope, and the spectroscope is used for combining the light output by the focusing and shaping lens group in each light combining component into a beam of light and projecting the beam of light onto the reflecting mirror.
As shown in fig. 4, the light sources are several light sources with different wavelengths, and in the present embodiment, two light sources are preferred, that is, a 355nm solid-state laser 1 and a 405nm LD/LED light source 2. The light combination component 101 comprises a first light combination device for processing the 355nm solid laser 1 and combining the light with the 405nm LD/LED light source 2, the first light combination device comprises a first coupling piece 201 for coupling the 355nm solid laser 1 and a first light homogenizing piece 202 for homogenizing the coupled 355nm solid laser 1 in sequence from a light source path, the 355nm solid laser device comprises a first focusing and shaping lens group 203 for shaping the homogenized 355nm solid laser device 1 into required light spots, a first beam splitter 204 for reflecting and combining the shaped 355nm solid laser device 1, wherein the 355nm solid laser device 1 is optically coupled through a first coupling piece 201, then passes through a first beam homogenizing piece 202, enters a first focusing assembly after being subjected to beam homogenizing treatment by the first beam homogenizing piece 202 to obtain approximately parallel light of the 355nm solid laser device 1, and finally irradiates the first beam splitter 204.
The light combination component 101 further comprises a second light combination device for processing the 405nm LD/LED light source 2 and combining the light with the 355nm solid laser 1, the second light combination device sequentially comprises a second coupling piece 206 for coupling the 405nm LD/LED light source 2, a second light homogenizing piece 207 for homogenizing the coupled 405nm LD/LED light source 2, a second focusing and shaping lens 208 for shaping the homogenized 405nm LD/LED light source 2 into required light spots, a second beam splitter 205 for reflecting and combining the shaped 405nm LD/LED light source 2, the 405nm LD/LED light source 2 is optically coupled through the second coupling piece 206, passes through the second light homogenizing piece 207, enters the second focusing component after being homogenized by the second light homogenizing piece 207 to obtain approximately parallel light of the 405nm LD/LED light source 2, and finally, the light irradiates the second spectroscope 205, the first spectroscope 204 and the second spectroscope 205 irradiate towards the same side, emergent light of the two spectroscopes is perpendicular to incident light, and the two processed light sources are overlapped to form light with different wavelengths to finish the light combination process. The first light homogenizing element 202 and the second light homogenizing element 207 can be selected from a light rod, an eagle eye lens group and the like, the first light homogenizing element 202 and the second light homogenizing element 207 can be set as two same light homogenizing systems, or can be set as different systems for respectively homogenizing light, the first focusing and shaping lens group 203 and the second focusing and shaping lens group 208 can be set as the same focusing and shaping lens group, or can be set as different focusing and shaping lens groups, and the obtained final light combination effect is the same. In this embodiment, the first light combining device and the second light combining device are arranged in parallel, and the irradiation direction of the first beam splitter 204 is directed to the irradiation direction of the second beam splitter 205, and if the incident direction of the 355nm solid-state laser 1 is the same as the light source direction after splitting by the second beam splitter 205, the first beam splitter 204 does not need to be arranged.
As a first implementation manner of 101 of the light combining component, the number of the light combining components is one, the output end of the 355nm solid-state laser and the output end of each light source in the combined light source are coupled to the input end of the light combining component at the same time, and the light combining component further includes a beam splitter, where the beam splitter is configured to project the light output by the focusing and shaping mirror in the light combining component onto the reflecting mirror.
As shown in fig. 5, the difference from the first embodiment is that in this embodiment, the light combining component 101 includes, in order from the light source path, a light splitting filter 300, a third coupling component 301, a third light homogenizing component 302, a third focusing and shaping lens group 303, a third light splitting lens 304, a 355nm solid-state laser 1 and a 405nm LD/LED light source 2, which are combined by the light splitting filter 300 to form a multi-wavelength mixed light source, the light enters a third light homogenizing element 302 after being coupled by a third coupling element 301, the mixed light coming out of the third light homogenizing element 302 forms a complete illumination light spot by a third focusing and shaping mirror group 303, the illumination light spot irradiates a third beam splitter 304, the third beam splitter 304 changing the light propagation route can be selected or rejected as required in the light path process, according to the difference of the light splitting function of the light splitting filter 300, the 355nm solid laser 1 and the 405nm LD/LED light source 2 can also set up light sources with different wavelengths.
As a third implementation manner of the light combining component 101, the coupling component and the light homogenizing component in the light combining component are replaced by optical fibers, and the number of the optical fibers is adapted to the total number of the light sources of the 355nm solid-state laser and the combined light source. The output end of the 355nm solid laser is coupled with the input end of one optical fiber, the output ends of one or more light sources in the combined light source are respectively coupled with the input end of one optical fiber, and the light output by each optical fiber is projected to the same focusing and shaping lens group and then output.
As shown in fig. 6, the difference between the first embodiment and the second embodiment is that in this embodiment, the light combining component 101 includes a first optical fiber, a second optical fiber, and a fourth focusing and shaping lens set 402, the 355nm solid laser 1 is incident into the first optical fiber, the 405nm LD/LED light source 2 is incident into the second optical fiber, the 355nm solid laser 1 and the 405nm LD/LED light source 2 are respectively coupled and combined by optical fibers to complete the processes of light homogenizing and shaping, the optical fiber light outlet 401 is directly processed to form a desired shape, and an ideal illumination spot is formed by the fourth focusing and shaping lens set 402.
Finally, it should be pointed out that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it. Those of ordinary skill in the art will understand that: modifications can be made to the technical solutions described in the foregoing embodiments, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A multi-spectral digital exposure system for integrally exposing a solder resist circuit is characterized by comprising:
a 355nm solid laser for solidifying the surface layer of the solder resist ink by light with the output wavelength of 355 nm;
the reflector is used for projecting light with the wavelength of 355nm output by the 355nm solid laser onto the digital micro-reflector, carrying out pattern modulation through the digital micro-reflector, converting a digital signal into an optical signal and imaging on the exposure plate through the wide-spectrum imaging system; in the imaging process, the solder resist ink from the surface layer to the deep layer along the thickness direction of the solder resist ink is positioned in the focal depth range of the spectrum with the wavelength of 355 nm;
and the synchronous controller is used for driving the digital micro-reflector to output an image by triggering the digital micro-reflector driving board according to the position information fed back by the exposure board, and the digital micro-reflector transmits the inversion pulse signal of the micro-mirror to the light source control board through the digital micro-reflector driving board.
2. The system for multispectral digital exposure of solder mask line integral exposure according to claim 1, further comprising:
a combined light source; and
the light combining component is used for performing light combining treatment on the light with the wavelength of 355nm output by the 355nm solid-state laser and the light output by the combined light source to obtain combined light with a mixed waveband;
the combined light source comprises a first light source outputting light with the wavelength of 405nm and/or a second light source outputting light with the wavelength of 375nm, the deep layer in the solder resist ink can be cured through the spectrum with the wavelength of 405nm, and the middle layer in the solder resist ink can be cured through the spectrum with the wavelength of 375 nm.
3. The system for multispectral digital exposure of solder resist line integral exposure according to claim 2, wherein in the case where the combined light source includes the first light source, the combined light source further includes one or more of a third light source that outputs light with a wavelength of 365nm, a fourth light source that outputs light with a wavelength of 385nm, and a fifth light source that outputs light with a wavelength of 395nm, by which spectrum of 365nm or 385nm or 395nm the inner intermediate layer of the solder resist ink can be cured.
4. The system for multispectral digital exposure of solder mask line integral exposure according to claim 3, wherein in the case where the solder mask ink is a large-capacity H-8100 type ink, the combined light source is the first light source and the third light source; and under the condition that the solder resist ink is solar PSR 2000-CE823 type ink, the combined light source is the first light source and the fourth light source.
5. The system for multispectral digital exposure of solder mask line integral exposure according to claim 2, 3 or 4, wherein the first light source is a 405nm semiconductor light source or a 405nm LED light source.
6. The system for multi-spectral digital exposure for solder mask line integral exposure according to claim 2, 3 or 4, wherein the second light source is a 375nm semiconductor light source or a 375nm LED light source.
7. The system for digital exposure of solder mask line according to claim 2, 3 or 4, wherein the light-combining component comprises:
a coupling member for coupling light of 355nm wavelength output from the 355nm solid-state laser and light output from the combined light source;
the light homogenizing piece is used for homogenizing the light output by the coupling piece to obtain approximately parallel output light; and
and the focusing and shaping mirror group is used for shaping the output light of the light homogenizing piece to ensure that the area of a light spot of the focusing and shaping mirror group is not smaller than the working range of the digital micro-reflector.
8. The system for multispectral digital exposure of solder mask line integral exposure according to claim 7, wherein the number of the light combination components is adapted to the total number of the light sources in the 355nm solid-state laser and the combined light source;
the output end of the 355nm solid-state laser is coupled with the input end of the light combining component, the output ends of one or more light sources in the combined light source are respectively coupled with the input end of the light combining component, each light combining component further comprises a spectroscope, and the spectroscope is used for combining the light output by the focusing and shaping lens group in each light combining component into a beam of light and projecting the beam of light onto the reflecting mirror.
9. The system according to claim 7, wherein the number of the light combining components is one, the output end of the 355nm solid-state laser and the output end of each light source in the combined light source are simultaneously coupled to the input end of the light combining component, and the light combining component further comprises a beam splitter for projecting the light output by the focusing and shaping mirror in the light combining component onto the reflecting mirror.
10. The system for multispectral digital exposure of solder mask line integral exposure according to claim 7, wherein the coupling member and the light homogenizing member in the light combination component are replaced by optical fibers, and the number of the optical fibers is matched with the total number of the light sources in the 355nm solid-state laser and the combined light source;
the output end of the 355nm solid laser is coupled with the input end of one optical fiber, the output ends of one or more light sources in the combined light source are respectively coupled with the input end of one optical fiber, and the light output by each optical fiber is projected to the same focusing and shaping lens group and then output.
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| CN201922156450.0U CN210691043U (en) | 2019-12-05 | 2019-12-05 | Multi-spectral digital exposure system for integrally exposing resistance welding circuit |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110806682A (en) * | 2019-12-05 | 2020-02-18 | 中山新诺科技股份有限公司 | Multi-spectral digital exposure process and system for solder-resisting circuit integrated exposure |
| CN115499970A (en) * | 2021-06-18 | 2022-12-20 | 长春理工大学 | Monochromatic light source based on high-power LED optical fiber coupling output |
-
2019
- 2019-12-05 CN CN201922156450.0U patent/CN210691043U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110806682A (en) * | 2019-12-05 | 2020-02-18 | 中山新诺科技股份有限公司 | Multi-spectral digital exposure process and system for solder-resisting circuit integrated exposure |
| WO2021109393A1 (en) * | 2019-12-05 | 2021-06-10 | 中山新诺科技股份有限公司 | Digital exposure process and system for solder resist line integrated exposure |
| CN110806682B (en) * | 2019-12-05 | 2024-05-28 | 中山新诺科技股份有限公司 | Multispectral digital exposure method and multispectral digital exposure system for integrated exposure of resistance-welding line |
| CN115499970A (en) * | 2021-06-18 | 2022-12-20 | 长春理工大学 | Monochromatic light source based on high-power LED optical fiber coupling output |
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