CN114512590A

CN114512590A - LED device

Info

Publication number: CN114512590A
Application number: CN202111680051.XA
Authority: CN
Inventors: 潘利兵; 谢志国; 李正凯; 赵漫; 郑银玲; 梁平霞; 李福海
Original assignee: Foshan NationStar Optoelectronics Co Ltd
Current assignee: Foshan NationStar Optoelectronics Co Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-05-17

Abstract

The invention provides an LED device. The LED device includes a support and a chip, the support includes a lead frame and a molded structure connected with the lead frame, the molded structure includes: a chip placement body defining an avoidance groove; reflecting structure, for the tubular structure who has inside through-hole, inside through-hole with dodge the groove intercommunication, tubular structure encloses and establishes the periphery of placing the main part at the chip, tubular structure's first end forms the opening with inside through-hole intercommunication, tubular structure's second end all places the main part with the chip on whole week and is connected, the circumference lateral wall of inside through-hole forms the plane of reflection that is used for the reflection of light, from tubular structure's second end to first end, the plane of reflection is including a plurality of arcwall faces that connect gradually. The LED device of the technical scheme of the invention has higher light-emitting rate.

Description

LED device

Technical Field

The invention relates to the technical field of illumination, in particular to an LED device.

Background

The LED has the advantages of long service life, low power consumption, high response speed, environmental friendliness and the like, is widely applied to the field of traditional illumination, and is also increasingly applied to emerging fields such as intelligent lamp posts, plant illumination, visible light communication and the like.

With the continuous expansion of the application of the LED products, the market has higher and higher requirements on the lighting effect and the reliability of the LED products. However, the LED device in the prior art cannot effectively reflect the light emitted from the chip, which may affect the light output of the LED device.

Disclosure of Invention

The invention mainly aims to provide an LED device which has high light-emitting rate.

In order to achieve the above object, the present invention provides an LED device including a support and a chip, the support including a lead frame and a mold structure connected to the lead frame, the mold structure including: a chip placement body defining an avoidance groove; reflecting structure, for the tubular structure who has inside through-hole, inside through-hole with dodge the groove intercommunication, tubular structure encloses and establishes the periphery of placing the main part at the chip, tubular structure's first end forms the opening with inside through-hole intercommunication, tubular structure's second end all places the main part with the chip on whole week and is connected, the circumference lateral wall of inside through-hole forms the plane of reflection that is used for the reflection of light, from tubular structure's second end to first end, the plane of reflection is including a plurality of arcwall faces that connect gradually.

Further, a plurality of arcwall faces are including the first arcwall face and the second arcwall face that are connected, and first arcwall face and second arcwall face all set up for the horizontal plane slope, and first arcwall face and second arcwall face all incline towards the direction of keeping away from tubular structure's central line gradually.

Further, the first arc-shaped surface and the horizontal plane form a first included angle C1, and the first included angle C1 satisfies: c1 is more than or equal to 25 degrees and less than or equal to 50 degrees; and/or a second included angle D1 is formed between the second arc-shaped surface and the horizontal plane, and the second included angle D1 satisfies the following condition: d1 is more than or equal to 30 degrees and less than or equal to 45 degrees.

Furthermore, the first arc-shaped surface protrudes towards one side where the central line is located, and the first arc-shaped surface has a first radian which is more than or equal to 10 degrees and less than or equal to 30 degrees; and/or the second arc-shaped surface protrudes towards the direction deviating from the central line, and the second arc-shaped surface has a second radian which is more than or equal to 40 degrees and less than or equal to 80 degrees.

Further, a first included angle C2 is formed between the first arc-shaped surface and the horizontal plane, and along the direction away from the center line, the first included angle C2 increases first and then decreases; a second included angle D2 is formed between the second arc-shaped surface and the horizontal plane, and the second included angle D2 gradually increases along the direction away from the center line.

Further, a plurality of arcwall faces still include the third arcwall face of being connected with the second arcwall face, and the third arcwall face sets up for the horizontal plane slope, and inclines towards the direction of keeping away from tubular structure's central line gradually.

Further, a third included angle E1 is formed between the third arc-shaped surface and the horizontal plane, and the third included angle E1 satisfies: e1 is more than or equal to 30 degrees and less than or equal to 40 degrees; and/or the third arc-shaped surface protrudes towards one side where the central line is positioned, and the third arc-shaped surface has a third radian which is more than or equal to 40 degrees and less than or equal to 80 degrees.

Further, first contained angle C2 has between first arcwall face and the horizontal plane, has second contained angle D2 between second arcwall face and the horizontal plane, has third contained angle E2 between third arcwall face and the horizontal plane, and along the direction of keeping away from the central line, first contained angle C2 increases earlier and then reduces, and second contained angle D2 crescent, third contained angle E2 reduces gradually.

Further, the chip placement body is a stepped structure for mounting a chip.

Further, the width of the avoiding groove is more than or equal to 0.7 time of the width of the chip, and the width of the avoiding groove is less than or equal to 0.9 time of the width of the chip; or the height of the step structure is more than or equal to 0.15 time of the height of the chip and less than or equal to 0.35 time of the height of the chip; or the height of the step structure is more than or equal to 0.03mm and less than or equal to 0.08 mm.

Further, the molding structure further comprises a blocking part extending along the second direction and connected with the chip placement main body, the blocking part is located on one side of the avoiding groove departing from the inner through hole, and the width of one end, close to the inner through hole, of the blocking part is smaller than the width of one end, departing from the inner through hole, of the blocking part.

Further, the lead frame includes: a first lead portion including a first base; the second lead part comprises a second base body arranged at a distance from the first base body, a channel is formed at the distance between the first base body and the second base body, the first lead part and the second lead part are mutually insulated, and a part of the molding structure is filled in the channel; the blocking structure is arranged on one side, facing the channel, of at least one of the first base body and the second base body, in the extending direction of the channel, the blocking structure is located between two opposite end portions of the first base body and/or the second base body, the blocking structure protrudes out of the first base body and/or the second base body, part of the molded structure is located on one side of the lead frame, and the blocking structure is exposed out of the avoiding groove.

Furthermore, the lead frame further comprises a second concave groove, the second concave groove is arranged on one side, away from the channel, of the first substrate and/or the second substrate, the molded structure further comprises a first protrusion connected with the reflecting structure, and the shape and the size of the second concave groove are matched with those of the first protrusion.

Further, the projection of the reflection structure and the chip placement main body in the first plane completely covers the first protrusion to prevent the first protrusion from being exposed from the avoiding groove; or, the projection part of the reflection structure and the chip placement main body in the first plane covers the first protrusion, so that part of the first protrusion is exposed from the avoiding groove.

Furthermore, a through hole is formed in the first base body and/or the second base body, a second protrusion is arranged on one side of the molding structure, and the shape and the size of the second protrusion are matched with those of the through hole.

By applying the technical scheme of the invention, the reflection structure extending along the circumferential direction is arranged and is connected with the chip placement main body in the whole circumferential direction, so that the reflection structure has a larger reflection surface, namely the reflection structure is arranged outside the chip placement main body, and the large-area reflection surface can reflect the light rays emitted by the chip on the chip placement main body, thereby effectively improving the light extraction rate.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view illustrating a holder of an LED device according to a first embodiment of the present invention;

FIG. 2 shows a rear view of the stand of FIG. 1;

fig. 3 is a schematic structural diagram of an LED device according to a first embodiment of the present invention;

FIG. 4 shows a right side view of the stand of FIG. 1;

FIG. 5 shows a schematic diagram of the lead frame of the rack of FIG. 1;

fig. 6 is a schematic structural view showing a holder of an LED device according to a second embodiment of the present invention;

fig. 7 is a schematic structural view showing a holder of an LED device according to a third embodiment of the present invention;

fig. 8 is a schematic structural view showing a holder of an LED device according to a fourth embodiment of the present invention;

fig. 9 is a schematic structural view showing a holder of an LED device according to a fifth embodiment of the present invention;

fig. 10 is a schematic structural view showing a holder of an LED device according to a sixth embodiment of the present invention;

fig. 11 is a schematic structural view showing a holder of an LED device according to a seventh embodiment of the present invention;

fig. 12 is a schematic structural view showing a lead frame of a holder of an LED device according to an eighth embodiment of the present invention;

fig. 13 shows a schematic structural view of a holder of an LED device of embodiment nine of the present invention;

fig. 14 is a schematic structural view showing a holder of an LED device of a tenth embodiment of the present invention; and

fig. 15 shows a schematic structural diagram of an LED device of an embodiment ten of the present invention.

Wherein the figures include the following reference numerals:

1. a chip; 10. a lead frame; 11. a first substrate; 12. a channel; 13. a first recessed groove; 14. indentation; 15. a second recessed groove; 151. a first groove section; 152. a second groove section; 153. a third groove section; 16. a through hole; 17. a second substrate; 20. a first pin; 30. a second pin; 40. a molded structure; 42. a second arc-shaped structure; 43. a third arc-shaped structure; 50. a barrier structure; 51. a first arcuate structure; 52. a first projecting portion; 53. a second projection; 54. a third projecting portion; 61. a chip placement main body; 62. an avoidance groove; 64. a first protrusion; 65. a barrier; 66. a second protrusion; 70. a tubular structure; 71. a first arc-shaped surface; 72. a second arcuate surface; 73. a third arc-shaped surface; 74. an inner through hole; 80. a containing groove; 81. an inclined surface.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

It should be noted that, in the embodiment of the present invention, the LED device includes the lead frame 10, the mold structure 40 located on one side of the lead frame 10, and the chip 1 located on one side of the mold structure 40 facing away from the lead frame 10, and a portion of the lead frame 10 exposed to the mold structure 40 is connected to the chip 1.

In the embodiment of the present invention, the first direction in fig. 2 is perpendicular to the extending direction of the channel 12, and the second direction is parallel to the extending direction of the channel 12.

In the embodiment of the present invention, the lead frame 10 is made of a metal material.

It should be noted that in the embodiment of the present invention, the molding structure 40 is made of a molding compound.

Example one

As shown in fig. 1 and 3, an embodiment of the present invention provides an LED device. The LED device comprises a support and a chip 1, the support comprising a lead frame 10 and a molded structure 40 connected to the lead frame 10. The mold structure 40 includes a chip placement body 61 and a reflective structure. Wherein the chip placement body 61 defines an escape groove 62; the tubular structure 70 of reflection configuration for having inside through-hole 74, inside through-hole 74 communicates with dodging groove 62, tubular structure 70 encloses the periphery of establishing at chip placement main part 61, the first end of tubular structure 70 forms the opening that communicates with inside through-hole 74, the second end of tubular structure 70 all places the main part 61 with the chip on whole week and is connected, the circumference lateral wall of inside through-hole 74 forms the plane of reflection that is used for reflection light, from the second end to the first end of tubular structure 70, the plane of reflection includes a plurality of arcwall faces that connect gradually.

Among the above-mentioned technical scheme, through setting up the reflection configuration who extends along circumference to reflection configuration places the main part 61 with the chip in whole circumference and is connected, can make reflection configuration have great plane of reflection, is the reflection configuration outside the main part 61 is placed to the chip promptly, and the plane of reflection of large tracts of land can reflect the light that the chip that lies in on the main part 61 is placed to the chip sends like this, thereby can improve the light-emitting rate effectively.

In the first embodiment of the present invention, the first end refers to the upper end of the reflection structure in fig. 3, and the reflection structure extends along the circumferential direction, so the first end also extends along the circumferential direction; the second end refers to the lower end of the reflecting structure in fig. 3, i.e., the end of the reflecting structure close to the chip placement body 61, and similarly, the second end also extends in the circumferential direction.

Specifically, the plane of reflection includes a plurality of arcwall faces that link to each other in proper order, and under the same height in fig. 3, for the plane, a plurality of arcwall faces have bigger area, can increase the area of plane of reflection like this effectively to make the plane of reflection reflect the light that chip 1 sent better, and then can improve the light-emitting rate effectively.

As shown in fig. 3, in the first embodiment of the present invention, the plurality of arc-shaped surfaces includes a first arc-shaped surface 71 and a second arc-shaped surface 72 connected to each other, the first arc-shaped surface 71 and the second arc-shaped surface 72 are both disposed obliquely with respect to a horizontal plane, and the first arc-shaped surface 71 and the second arc-shaped surface 72 are both inclined toward a direction gradually away from a center line of the tubular structure 70.

Through the above arrangement, the reflection structure can form the tube-shaped structure 70 with the upward opening, i.e. a bowl-shaped structure is formed, so that the reflection surface can face the chip 1, so that the light emitted by the chip 1 irradiates on the reflection surface, and the reflection surface faces to the upper side of the chip 1, so that the light emitted by the chip 1 is reflected by the reflection surface in the direction away from the chip 1, and thus, the reflection effect of the reflection structure can be effectively improved.

As shown in fig. 3, in the first embodiment of the present invention, the first arc-shaped surface 71 and the horizontal plane have a first included angle C1, and the first included angle C1 satisfies: c1 is more than or equal to 25 degrees and less than or equal to 50 degrees.

Through the above arrangement, the first arc-shaped surface 71 can extend along the direction away from the chip placing body 61, the overall inclination of the reflecting surface is reduced, the area of the reflecting surface in the horizontal direction in fig. 3 is increased, the height of the reflecting surface in the vertical direction in fig. 3 is reduced, and thus the light emitted by the chip 1 can be reflected towards the direction away from the chip 1 by the reflecting surface.

As shown in fig. 3, in the first embodiment of the present invention, the second arc surface 72 has a second included angle D1 with the horizontal plane, and the second included angle D1 satisfies: d1 is more than or equal to 30 degrees and less than or equal to 45 degrees.

With the above arrangement, the second arc-shaped surface 72 can be extended upward in the vertical direction in fig. 3 to form the tubular structure 70, so that the reflected light is prevented from being dispersed all around, and the light extraction rate of the LED device can be improved.

As shown in FIG. 3, in the first embodiment of the present invention, the first arc-shaped surface 71 protrudes toward the side where the center line is located, and the first arc-shaped surface 71 has a first arc degree, which is 10 DEG or more and 30 DEG or less.

Through the above arrangement, under the condition that the overall inclination of the reflection surface is reduced and the first arc-shaped surface 71 extends along the direction away from the chip placing body 61, the area of the first arc-shaped surface 71 is increased, so that the area of the reflection surface can be increased, and the reflection effect of the reflection structure can be effectively improved.

As shown in FIG. 3, in the first embodiment of the present invention, the second arc-shaped surface 72 protrudes away from the center line, and the second arc-shaped surface 72 has a second arc, which is 40 ° ≦ 80 °. Similarly, the second arc-shaped surface 72 can achieve the same effect as the first arc-shaped surface 71, and the description thereof is omitted.

As shown in fig. 3, in the first embodiment of the present invention, a first included angle C2 is formed between the first arc-shaped surface 71 and the horizontal plane, and along the direction away from the center line, the first included angle C2 increases first and then decreases; the second arc-shaped surface 72 and the horizontal plane form a second included angle D2, and the second included angle D2 gradually increases along the direction away from the center line.

Through the setting, can make first arcwall face 71 bulge towards one side at central line place to make second arcwall face 72 bulge towards the direction that deviates from the central line, thereby can increase the area of first arcwall face 71 and second arcwall face 72, and then can increase the area of plane of reflection, can realize improving the purpose of reflection structure's reflection effect like this.

As shown in fig. 3, in the first embodiment of the present invention, the plurality of arc-shaped surfaces further includes a third arc-shaped surface 73 connected to the second arc-shaped surface 72, the third arc-shaped surface 73 is disposed obliquely with respect to the horizontal plane, and the third arc-shaped surface 73 may be inclined in a direction gradually away from the center line of the cylindrical structure 70.

In the above technical solution, the third arc-shaped surface 73 is additionally provided on the basis of the two arc-shaped surfaces, so that the reflection area of the reflection structure can be further increased, and the light-emitting rate of the LED device can be better improved.

As shown in fig. 3, in the first embodiment of the present invention, the third arc-shaped surface 73 has a third included angle E1 with the horizontal plane, and the third included angle E1 satisfies: e1 is more than or equal to 30 degrees and less than or equal to 40 degrees.

Through the arrangement, the area of the reflecting surface in the vertical direction can be increased, and the area of the reflecting surface in the horizontal direction can also be increased, so that a bowl-shaped structure as shown in fig. 3 is formed, light emitted by the chip 1 can be better reflected, and the light extraction rate is improved.

In the first embodiment of the present invention, the first included angle C1 is an included angle between a line connecting two ends of an arc projected on the paper surface of fig. 3 by the first arc surface 71 and a horizontal plane. The second angle D1 and the third angle E1 are the same, and will not be described herein.

As shown in FIG. 3, in the first embodiment of the present invention, the third arc-shaped surface 73 protrudes toward the side where the center line is located, and the third arc-shaped surface 73 has a third arc, 40 ° ≦ 80 °. Similarly, the third arc-shaped surface 73 can achieve the same effect as the first arc-shaped surface 71 and the second arc-shaped surface 72, and the description thereof is omitted.

It should be noted that the first radian, the second radian, and the third radian in the embodiment of the present invention refer to the numerical values of the central angles corresponding to the first arc-shaped surface 71, the second arc-shaped surface 72, and the third arc-shaped surface 73, respectively. For example, the first arc degree refers to the value of the central angle corresponding to the arc line of the first arc-shaped surface 71 on the cross section shown in fig. 3. Similarly, the numerical values of the second radian and the third radian are calculated by the same method as the first radian.

Preferably, as shown in fig. 3, in the first embodiment of the present invention, the reflecting surface includes a first arc-shaped surface 71, a second arc-shaped surface 72 and a third arc-shaped surface 73 which are connected in sequence. Wherein, first contained angle C2 has between first arcwall face 71 and the horizontal plane, second contained angle D2 has between second arcwall face 72 and the horizontal plane, third contained angle E2 has between third arcwall face 73 and the horizontal plane, and along the direction of keeping away from the central line, first contained angle C2 increases earlier and then reduces, and second contained angle D2 crescent, third contained angle E2 reduces gradually.

Through the setting, can make first arcwall face 71 bulge towards one side at central line place, make second arcwall face 72 bulge towards the direction that deviates from the central line, make third arcwall face 73 bulge towards one side at central line place to can increase the area of first arcwall face 71, second arcwall face 72 and third arcwall face 73, and then can increase the area of plane of reflection, can improve reflective structure's reflection effect like this effectively.

It should be noted that, in the first embodiment of the present invention, the first included angle C2 is an included angle between a tangent plane of the first arc-shaped surface 71 and a horizontal plane. For example, the first included angle C2 is the included angle between a tangent line of the first arc-shaped surface 71 at any point of the arc shape on the cross-section shown in fig. 3 and the horizontal plane. The second included angle D2 and the second included angle E2 are the same, and will not be described herein.

As shown in fig. 3 and 4, in the first embodiment of the present invention, the chip placement body 61 is a step structure for mounting a chip.

In the above technical solution, the chip placement main body 61 is configured to have a step structure, so that the bonding height of the chip 1 can be raised, and the area of the bottom metal layer (the upper surface of the lead frame 10) of the chip 1 can be reduced; the bottom of the chip 1 can be close to the molding structure 40, so that the problem that the brightness is reduced because light emitted by four sides of the chip 1 is reflected to the bottom of the chip 1 through the metal layer (the upper surface of the lead frame 10) can be avoided, and the light emission of a product can be improved.

Further, the step structure can position the chip 1, so that the chip 1 is installed at the position of the center of the reflection structure, the distance from the reflection surface to the chip 1 in the circumferential direction is the same, the uniformity of the reflection structure for light reflection can be improved, and the light emitting uniformity of the LED device can be improved.

Further, through setting up the stair structure, can raise chip 1, avoid the tin cream of the unevenness between chip 1 and the lead frame 10 to support chip 1 to can avoid appearing the problem of chip 1 installation unevenness, and then can avoid the light that chip 1 four sides sent to reflect to chip 1 bottom and lead to the problem that luminance reduces through metal level (lead frame 10 upper surface).

As shown in FIGS. 3 and 4, in the first embodiment of the present invention, the width of the avoiding groove 62 is greater than or equal to 0.7 times the width of the chip 1 and less than or equal to 0.9 times the width of the chip 1. Thus, the step structure can support the chip 1, and the avoiding groove 62 can avoid solder paste.

As shown in FIG. 3 and FIG. 4, in the first embodiment of the present invention, the height of the step structure is greater than or equal to 0.15 times the height of the chip 1, and the height of the step structure is less than or equal to 0.35 times the height of the chip 1. Therefore, the phenomenon that the height of the step structure is too low and the solder paste protrudes out of the step structure to cause the chip 1 to be installed unevenly can be avoided, and the phenomenon that the reflecting surface of the reflecting structure cannot be completely utilized to emit light after the height of the step structure is too high and the installation height of the chip 1 is too high can also be avoided.

Preferably, in the first embodiment of the invention, the height of the step structure is less than or equal to 0.03mm and less than or equal to 0.08 mm.

Preferably, in the first embodiment of the present invention, the chip 1 protrudes from the step structure by a distance of 100 μm to 250 μm.

As shown in fig. 1, 2, 3 and 5, in the first embodiment of the present invention, the lead frame 10 includes a first lead portion, a second lead portion and a barrier structure 50. Wherein the first lead portion includes a first base 11; the second lead part comprises a second base body 17 arranged at a distance from the first base body 11, the distance between the first base body 11 and the second base body 17 forms a channel 12, the first lead part and the second lead part are insulated from each other, and part of the molding structure 40 is filled in the channel 12; at least one of the first substrate 11 and the second substrate 17 is provided with a blocking structure 50 on a side facing the channel 12, the blocking structure 50 is located between two oppositely-arranged end portions of the first substrate 11 and/or the second substrate 17 in the extending direction of the channel 12, the blocking structure 50 protrudes out of the first substrate 11 and/or the second substrate 17, a part of the molded structure 40 is located on a side of the lead frame 10, and the blocking structure 50 is exposed out of the relief groove 62.

In the above technical solution, by providing the blocking structure 50, the channel 12 is formed in a "wide-narrow-wide" type, so that a sufficient soldering area can be provided for soldering between the lead frame 10 and the chip 1, and the possibility that flux invades into the chip placement area can also be reduced, thereby avoiding the problem of reduced air tightness caused by thermal deformation of the lead frame 10 during soldering, and thus improving the reliability of the LED device.

As shown in fig. 1, 2, 3 and 5, in the first embodiment of the present invention, a portion of the mold structure 40 is located on one side of the lead frame 10, and the mold structure 40 is provided with an escape groove 62 corresponding to the barrier structure 50, so that the barrier structure 50 is exposed from the escape groove 62.

Through the above arrangement, the avoiding groove 62 can expose the blocking structure 50, so that the chip 1 and the blocking structure 50 can be conveniently welded, and the connection stability of the chip 1 and the lead frame 10 is improved.

It should be noted that, in the first embodiment of the present invention, the channel 12 includes only three groove segments sequentially connected in the second direction, the length of the two opposite ends refers to the maximum length of the two groove segments in the first direction, and the length of the middle portion refers to the length of the middle groove segment in the first direction, so that the middle length of the channel 12 is narrower, and the lengths of the two ends are wider, so as to form the "wide-narrow-wide" pattern in fig. 2.

Preferably, in the first embodiment of the present invention, the blocking structures 50 are disposed on the sides of the two lead portions facing the channel 12, so that the channel 12 is formed in an "i" shape.

Preferably, in the first embodiment of the present invention, the blocking structure 50 may be a rib provided on the protruding lead portion.

In the first embodiment of the present invention, that the blocking structure 50 is disposed on the side of at least one of the first substrate 11 and the second substrate 17 facing the channel 12 means that the blocking structure 50 is disposed on the first substrate 11, or the blocking structure 50 is disposed on the second substrate 17, or both the first substrate 11 and the second substrate 17 are disposed with the blocking structure 50.

As shown in fig. 1, 2 and 5, in the first embodiment of the present invention, the lead frame 10 includes two barrier structures 50, one barrier structure 50 is disposed on each of the first substrate 11 and the second substrate 17, the two barrier structures 50 are arranged in a staggered manner along the extending direction of the channel 12, and the lengths of the two barrier structures 50 are equal along a first direction perpendicular to the extending direction of the channel 12.

In the above technical solution, one blocking structure 50 is respectively disposed on the first substrate 11 and the second substrate 17, and compared with only one blocking structure 50, the connection area between the lead frame 10 and the mold structure 40 can be increased as much as possible, so that the lead frame 10 and the mold structure 40 can be stably combined, and the reliability of the LED device can be improved.

It should be noted that, in the first embodiment of the present invention, the two barrier structures 50 are arranged in a staggered manner: at least one end of the blocking structure 50 on the first substrate 11 is protruded relative to the blocking structure 50 on the second substrate 17 in the extending direction of the channel, that is, one end of the blocking structure 50 on the first substrate 11 may be protruded relative to one end of the blocking structure 50 on the second substrate 17, and the other end of the blocking structure 50 on the second substrate 17 is protruded relative to the other end of the blocking structure 50 on the first substrate 11 in the extending direction of the channel; alternatively, the opposite ends of the barrier structures 50 on the first substrate 11 are each disposed to protrude with respect to the barrier structures 50 on the second substrate 17.

As shown in fig. 1, 2 and 5, in the first embodiment of the present invention, the lead frame 10 includes two barrier structures 50, one barrier structure 50 is disposed on each of the first substrate 11 and the second substrate 17, and the two barrier structures 50 are symmetrically disposed about the channel 12.

Because the two electrodes of the chip 1 are symmetrically arranged, the two barrier structures 50 can be better welded with the two electrodes of the chip 1 through the arrangement, and the arrangement is simple in structure and convenient to process.

As shown in FIG. 1, FIG. 2 and FIG. 5, in the first embodiment of the present invention, the width of the barrier structure 50 is greater than or equal to 0.25 times the width of the first substrate 11 or the second substrate 17, and the width of the barrier structure 50 is less than or equal to 0.5 times the width of the first substrate 11 or the second substrate 17.

In the above technical solution, the width of the barrier structure 50 is greater than or equal to 0.25 times of the width of the first substrate 11 or the second substrate 17, so that a sufficient bonding area between the chip 1 and the lead frame 10 can be ensured; the width of the barrier structure 50 is equal to or less than 0.5 times the width of the first substrate 11 or the second substrate 17, so that the width of the via 12 (i.e., the length of the via 12 in the extending direction thereof) can be prevented from being reduced, and thus, a short circuit between the first lead portion and the second lead portion can be prevented from occurring at the time of soldering.

Preferably, in the first embodiment of the present invention, the width of the barrier structure 50 is equal to 0.3 times the width of the first substrate 11 or the second substrate 17.

It should be noted that, in the first embodiment of the present invention, the width of the blocking structure 50 refers to the length of the blocking structure 50 in the extending direction of the channel 12.

As shown in FIGS. 1, 2 and 5, in the first embodiment of the present invention, the length of the opposite ends of the channel 12 is not less than 0.1 times the sum of the maximum lengths of the first substrate 11, the channel 12 and the second substrate 17 and not more than 0.3 times the sum of the maximum lengths of the first substrate 11, the channel 12 and the second substrate 17.

In the above technical solution, the lengths of the two opposite ends of the channel 12 are greater than or equal to 0.1 times of the sum of the maximum lengths of the first base body 11, the channel 12 and the second base body 17, so that a short circuit between the first lead portion and the second lead portion can be avoided during welding; the lengths of the two opposite ends of the channel 12 are less than or equal to 0.3 times of the sum of the maximum lengths of the first substrate 11 and the second substrate 17 of the channel 12, so that a sufficient contact area between the lead frame 10 and the molded structure 40 can be ensured, a sufficient bonding force between the lead frame 10 and the molded structure 40 can be ensured, the air tightness of the LED device can be improved, the barrier structure 50 is prevented from deforming, and the heat dissipation effect can be improved.

Preferably, in the first embodiment of the present invention, the length of the opposite ends of the channel 12 is equal to 0.15 times the sum of the maximum lengths of the first substrate 11, the channel 12 and the second substrate 17.

As shown in fig. 2 and fig. 5, in the first embodiment of the present invention, the lead frame 10 further includes a first arc-shaped structure 51 located on a side of the first substrate 11 facing the channel 12, at least one side of the blocking structure 50 is provided with the first arc-shaped structure 51 along an extending direction of the channel 12, and the blocking structure 50 is in smooth transition connection with the lead portion through the first arc-shaped structure 51; the lead frame 10 further includes a first arc-shaped structure 51 located on a side of the second substrate 17 facing the channel 12, at least one side of the blocking structure 50 on the second substrate 17 is provided with the first arc-shaped structure 51 along the extending direction of the channel 12, and the blocking structure 50 is in smooth transition connection with the second lead portion through the first arc-shaped structure 51.

With the above arrangement, the concentrated stress at the connection between the barrier structure 50 and the lead portion can be reduced, thereby improving the strength of the lead frame 10.

Further, the coupling force between the lead frame 10 and the mold structure 40 may be increased by providing the first arc-shaped structures 51, so that the connection between the lead frame 10 and the mold structure 40 can be more stable.

Preferably, in the first embodiment of the present invention, the first arc-shaped structure 51 is provided to achieve smooth connection between the first arc-shaped structure 51 and the lead portion. Preferably, the first arc-shaped structure 51 is an arc-shaped chamfer, which facilitates the machining.

Preferably, in the first embodiment of the present invention, the first arc structures 51 are disposed on two opposite sides of the barrier structure 50, so that two opposite ends of the barrier structure 50 can be smoothly connected to the lead portions.

Of course, in an alternative embodiment not shown in the drawings, the first arcuate structure 51 may be provided on only one side of the barrier structure 50.

As shown in fig. 2 and 5, in the first embodiment of the present invention, the lead frame 10 further includes a first recessed groove 13, and at least one side of the first substrate 11 and/or the second substrate 17 is provided with the first recessed groove 13 along the extending direction (i.e., the second direction) of the channel 12.

In the above technical solution, by providing the first recessed groove 13 on at least one side of the first substrate 11 and/or the second substrate 17, the length of the edge of the lead frame 10 can be increased, so that the connection area between the lead frame 10 and the mold structure 40 can be effectively increased, the connection between the lead frame 10 and the mold structure 40 is more stable, and the stability of the LED device is improved.

Further, the thermal deformation of the bulk copper layer during soldering can be reduced by providing the first recessed groove 13, i.e. the thermal deformation of the first substrate and/or the second substrate can be reduced.

Preferably, in the first embodiment of the present invention, the first recessed grooves 13 are formed on two opposite sides of the first substrate 11 and the second substrate 17 along the extending direction (i.e. the second direction) of the channel 12, and the arrangement enables a bonding area between the lead frame 10 and the mold structure 40 to be larger than that of only one first recessed groove 13, so that the LED device is more stable.

In the first embodiment of the present invention, in the extending direction of the channel 12, at least one side of the first substrate 11 and/or the second substrate 17 is provided with the first recessed groove 13, which means that in fig. 2, the upper side and/or the lower side of the first substrate 11 and/or the second substrate 17 is provided with the first recessed groove 13 in the extending direction of the channel 12, that is, at least one side of one of the first substrate 11 and the second substrate 17 is provided with the first recessed groove 13, or at least one side of both the first substrate 11 and the second substrate 17 is provided with the first recessed groove 13.

Of course, in an alternative embodiment not shown in the drawings, the first recessed grooves 13 may be provided only on the upper and lower sides of the first base 11 or the second base 17.

As shown in fig. 1, 2 and 5, in the first embodiment of the present invention, the lead frame 10 further includes a second recessed groove 15, the second recessed groove 15 is disposed on a side of the first substrate 11 and/or the second substrate 17 facing away from the channel 12, the molded structure further includes a first protrusion 64 connected with the reflective structure, and the second recessed groove 15 matches with the first protrusion 64 in shape and size.

With the above arrangement, the inner wall of the second recessed groove 15 and the outer wall of the first protrusion 64 can be better matched, so that the bonding force between the mold structure 40 and the lead frame 10 can be increased, the connection stability between the lead frame 10 and the mold structure can be improved, and the airtightness between the lead frame 10 and the mold structure 40 can be increased.

Preferably, in the first embodiment of the present invention, the first substrate 11 and the second substrate 17 are both provided with the second concave grooves 15, and the first protrusions 64 are both provided in the two second concave grooves 15.

As shown in fig. 2 and 5, in the first embodiment of the present invention, the second recessed groove 15 includes at least two groove segments that are communicated with each other, and the widths of the at least two groove segments decrease in sequence from the direction approaching the channel 12 along the first direction.

Through the arrangement, not only can the connection stability between the lead frame 10 and the molded structure 40 be effectively improved, but also the thermal deformation of a bulk copper layer during welding can be reduced, namely the thermal deformation of the first base body and/or the second base body can be reduced, so that the air tightness between the lead frame 10 and the molded structure 40 is improved.

Specifically, in the first embodiment of the present invention, the ratio of the widths of two adjacent groove segments is between 1 and 2.

As shown in fig. 2 and 5, in the first embodiment of the present invention, the at least two groove segments include a first groove segment 151, a second groove segment 152, and a third groove segment 153 that are sequentially communicated, and widths of the first groove segment 151, the second groove segment 152, and the third groove segment 153 decrease sequentially from a direction approaching the channel 12.

With the above arrangement, not only the connection stability between the lead frame 10 and the mold structure 40 can be effectively increased, but also the connection strength between the leads and the base can be increased, thereby preventing the leads from being deformed.

In the above technical solution, the widths of the first groove segment 151, the second groove segment 152 and the third groove segment 153 are sequentially reduced, so that the lead frame 10 is conveniently processed.

It should be noted that, in the first embodiment of the present invention, the widths of the first groove segment 151, the second groove segment 152, and the third groove segment 153 refer to the lengths of the first groove segment 151, the second groove segment 152, and the third groove segment 153 in the second direction.

Of course, in an alternative embodiment not shown in the figures, it is also possible to provide that the width of the first groove section 151 is greater than the width of the second groove section 152, and that the width of the second groove section 152 is smaller than the width of the third groove section 153.

Preferably, as shown in fig. 1, in the first embodiment of the present invention, the projection of the reflection structure and the chip placement body 61 in the first plane completely covers the first protrusion 64, so as to prevent the first protrusion 64 from being exposed from the relief groove 62.

In the first embodiment of the present invention, the first plane refers to the plane shown in fig. 1, i.e., the paper plane in fig. 1.

As shown in fig. 1 and 3, in the first embodiment of the present invention, the molding structure 40 further includes a blocking member 65 extending along the second direction and connected to the chip placement main body 61, the blocking member 65 is located on a side of the avoiding groove 62 facing away from the inner through hole 74 and is engaged with the channel 12, and in the vertical direction of fig. 3, a width of an end of the blocking member 65 near the inner through hole 74 is smaller than a width of an end of the blocking member 65 facing away from the inner through hole 74.

It should be noted that, in the first embodiment of the present invention, the blocking member 65 includes three blocking sections sequentially connected along the extending direction of the passage 12, and along the extending direction of the passage 12, the width of the blocking section at two ends of the three blocking sections of the blocking member 65 is greater than the width of the blocking section in the middle of the three blocking sections of the blocking member 65, so that the middle width of the blocking member 65 is narrower, and the widths at two ends are wider, that is, a "wide-narrow-wide" pattern capable of cooperating with the passage 12 in fig. 1 can be formed.

Preferably, in the first embodiment of the present invention, blocking member 65 is "I-shaped" so as to better fit into channel 12.

In the above technical solution, by providing the blocking member 65, the blocking member 65 can be matched with the channel 12, so that more connection areas can be provided between the mold structure 40 and the lead frame 10, thereby improving the bonding force between the mold structure 40 and the lead frame 10; further, the plating area between the chip 1 and the lead frame 10 can be reduced, which not only can improve the reliability of high-temperature aging, but also can effectively improve the light-emitting rate of the LED device.

As shown in fig. 2 and 5, in the first embodiment of the present invention, the first substrate 11 and/or the second substrate 17 is provided with a through hole 16, one side of the molding structure 40 is provided with a second protrusion 66, and the second protrusion 66 is matched with the shape and size of the through hole 16.

With the above arrangement, the inner wall of the through-hole 16 may be coupled with the outer wall of the second protrusion 66, so that the coupling force between the lead frame 10 and the mold structure 40 may be improved.

Preferably, in the first embodiment of the present invention, the first substrate 11 and the second substrate 17 are provided with the through holes 16, and the second protrusions 66 are disposed corresponding to the through holes 16, so that the bonding force between the lead frame 10 and the molded structure 40 can be greater.

Of course, in an alternative embodiment not shown in the drawings, the through-hole 16 may also be provided on only one of the first base 11 and the second base 17.

As shown in fig. 2 and 5, in the first embodiment of the present invention, the through hole 16 is a long hole, and the length direction of the through hole 16 forms an angle with the extending direction of the channel 12.

Among the above-mentioned technical scheme, can also reduce the copper layer area of lead frame 10 through setting up rectangular hole to can reduce the inflation of lead frame 10 when welding is heated, thereby increase the gas tightness of support.

Further, the length direction of the through hole 16 is angled with respect to the extending direction of the channel 12, so that the combining force between the through hole 16 and the molding structure 40 in the first direction can be increased, and the combining force between the through hole 16 and the molding structure 40 in the second direction can be increased.

Preferably, as shown in fig. 2, in the first embodiment of the present invention, the length direction of the elongated hole has an angle with the extending direction of the channel 12, and the distance between the upper end of the elongated hole and the center line of the channel 12 is greater than the distance between the lower end of the elongated hole and the center line of the channel 12.

Of course, in an alternative embodiment not shown in the drawings, the through-hole 16 may also be an oval through-hole.

As shown in fig. 2 and 5, in the first embodiment of the present invention, there are a plurality of through holes 16, and the through holes 16 are arranged at intervals along the extending direction of the channel 12.

In the above technical solution, by increasing the number of the through holes 16, the connection area between the lead frame 10 and the mold structure 40 can be increased, so that the bonding force between the lead frame 10 and the mold structure 40 can be improved.

Preferably, as shown in fig. 2 and 5, in the first embodiment of the present invention, the number of the through holes 16 is two in the extending direction of the channel 12. Of course, in alternative embodiments not shown in the drawings, the number of through holes 16 may be three or four, etc.

As shown in fig. 1 and 5, in the first embodiment of the present invention, the lead frame 10 further includes a first protrusion 52 connected to an inner wall surface of the through hole 16, and the first protrusion 52 extends toward an inner side of the through hole 16 to increase a bonding area between the lead frame 10 and the mold structure 40.

In the above technical solution, by providing the first protrusion 52 on the inner wall surface of the through hole 16, a step surface can be formed between the inner wall surface of the through hole 16 and the first protrusion 52, so that the contact area between the through hole 16 and the molded structure 40 can be increased, and the connection area between the lead frame 10 and the molded structure 40 can be increased, thereby effectively improving the connection stability between the lead frame 10 and the molded structure 40.

Preferably, in the first embodiment of the present invention, the first protruding portion 52 includes an annular rib. Therefore, the first protruding part is simple in structure and convenient to process.

Of course, in alternative embodiments, the first projection 52 may also include a plurality of rib segments spaced along the circumferential sidewall of the through-hole.

As shown in fig. 5, in the first embodiment of the present invention, the bracket further includes a second protrusion 53, and the outer peripheral edge of at least one of the first base 11 and the second base 17 is provided with the second protrusion 53.

In the above technical solution, the second protruding portion 53 is disposed on the outer peripheral edge of a portion of the first substrate 11 and/or the second substrate 17, so that the contact area between the lead frame 10 and the mold structure 40 can be increased, and similarly, the second protruding portion 53 can achieve the same effect as the first protruding portion 52, and is not described herein again.

Preferably, in the first embodiment of the present invention, the second protrusion 53 includes an elongated rib, so as to facilitate the processing.

Of course, in alternative embodiments, the second protrusion 53 may also include a plurality of rib segments spaced along the outer peripheral edges of the first and

second bases

11 and 17.

As shown in fig. 1, 3 and 5, the support further comprises a third protrusion 54, and the side of the lead frame 10 facing the channel 12 is provided with the third protrusion 54.

In the above technical solution, by providing the third protruding portion 54 on the side of the lead frame 10 facing the channel 12, a step surface can be formed between the side of the lead frame 10 facing the channel 12 and the third protruding portion 54, so that the contact area between the lead frame 10 and the molded structure 40 can be increased, and thus the connection stability between the lead frame 10 and the molded structure 40 can be effectively improved; further, the airtightness between the lead frame 10 and the molded structure 40 can also be increased by providing the third projections 54.

Preferably, as shown in fig. 1, in the first embodiment of the present invention, the third protrusion 54 includes an elongated rib. This facilitates the processing.

Of course, in the alternative embodiment of the drawings, the third protrusion 54 may also include a plurality of rib segments spaced along the edge of the lead frame 10.

As shown in fig. 1, 2 and 5, in the first embodiment of the present invention, the first lead portion further includes a plurality of first pins 20 protruding from the first base 11, and the second lead portion further includes a plurality of second pins 30 protruding from the second base 17. The extending direction of the first pins 20 and the extending direction of the second pins 30 both form an included angle with the extending direction of the channel 12, the plurality of first pins 20 are located on one side of the first base 11 departing from the channel 12, and the plurality of second pins 30 are located on one side of the second base 17 departing from the channel 12.

In the above technical solution, the plurality of first pins 20 are disposed on one side of the first substrate 11 away from the channel 12, the plurality of second pins 30 are disposed on one side of the second substrate 17 away from the channel 12, and the extending direction of the first pins 20 and the extending direction of the second pins 30 are both disposed at an included angle with the extending direction of the channel 12, so that the plurality of first pins 20 can be disposed on the same side of the first substrate 11, and the plurality of second pins 30 can be disposed on the same side of the second substrate 17, and the first pins 20 and the second pins 30 are disposed on different sides of the lead frame 10, that is, the pins having the same electrical property can be disposed on the same side of the lead frame 10, which can facilitate the technician to perform subsequent testing on the LED device.

Furthermore, the pins with the same electrical property are positioned on the same side of the lead frame 10, and the pins with different electrical properties are positioned on different sides of the lead frame 10, so that technicians can distinguish the anode and the cathode of the electrodes conveniently, and the technicians can weld and repair the LED devices conveniently in the later period.

Furthermore, the area of the side electrode can be reduced through the arrangement, the copper layer on tin is reduced, and the soldering flux is prevented from invading the inside of the bracket at high temperature.

Specifically, as shown in fig. 2, in the first embodiment of the present invention, the bottom surface of the first lead 20 is disposed coplanar with the bottom surface of the first base 11; the bottom surfaces of the second leads 30 are coplanar with the bottom surface of the second base 17, so that the LED device can be more conveniently mounted.

Specifically, in the first embodiment of the present invention, the plurality of first pins 20 and the plurality of second pins 30 are symmetrically disposed about the channel, so that the later detection can be more convenient.

Specifically, in the first embodiment of the present invention, the first lead portion includes two first pins 20, and the two first pins 20 are symmetrically disposed; and the second lead portion includes two second pins 30, and the two second pins 30 are symmetrically disposed. This reduces the offset during welding relative to a single intermediate electrode (conventional electrode).

As shown in fig. 2 and fig. 5, in the first embodiment of the present invention, an included angle a is formed between the extending direction of the first lead 20 and the extending direction of the channel 12, and the included angle a satisfies: a equals 90 ° ± 10 °; or, an included angle B is formed between the extending direction of the second pin 30 and the extending direction of the channel 12, and the included angle B satisfies: b is 90 ° ± 10 °.

Through the above arrangement, the first pins 20 may extend in a direction away from the channel 12, the second pins 30 may extend in a direction away from the channel 12, the plurality of first pins 20 may extend in the same direction, and the plurality of second pins 30 may also extend in the same direction, so that technicians can more conveniently perform subsequent tests on the LED device.

As shown in fig. 3 and 5, in the first embodiment of the present invention, the lead frame 10 further includes a plurality of indentations 14, and the plurality of indentations 14 are disposed at intervals on a surface of the first substrate 11 and/or the second substrate 17 facing the chip 1.

In the above technical solution, by providing a plurality of indentations 14 on the surface of the first substrate 11 and/or the second substrate 17, such that a portion of the molded structure 40 can be filled in the indentations 14, the connection area between the lead frame 10 and the molded structure 40 can be increased, so as to increase the air tightness between the lead frame 10 and the molded structure 40; further, the coupling force between the lead frame 10 and the mold structure 40 can also be effectively improved.

Specifically, in the first embodiment of the present invention, the plurality of indentations 14 are disposed on a side of the first substrate 11 and/or the second substrate 17 facing the chip 1.

Specifically, in the first embodiment of the present invention, a plurality of indentations 14 are provided at intervals along the first direction on the surface of the first substrate 11 and/or the second substrate 17. Of course, in an alternative embodiment not shown in the drawings, a plurality of indentations 14 may also be provided at intervals in the second direction on the surface of the first substrate 11 and/or the second substrate 17.

Specifically, as shown in fig. 3, in the first embodiment of the present invention, the molded structure includes a chip placement body 61 and a reflection structure surrounding the periphery of the chip placement body 61, wherein the chip placement body 61 defines an avoiding groove 62. And indentations 14 are provided at the junction of the reflective structure and the leadframe 10, preferably in the central region between the avoidance slot 62 and the edge of the leadframe 10.

Preferably, in the first embodiment of the present invention, the indentation 14 is a groove, which facilitates the processing. Of course, in an alternative embodiment not shown in the drawings, the indentations 14 may also be ribs, but the ribs are difficult to process.

As shown in fig. 3 and 5, in the first embodiment of the present invention, the indentations 14 extend along the second direction, and in the first direction perpendicular to the extending direction of the channel 12, the indentations 14 are located at one end of the first substrate 11 or the second substrate 17 far from the channel 12.

In the above technical solution, since the connection area between the end of the first substrate 11 or the second substrate 17 far away from the channel 12 and the mold structure 40 is large, the indentation 14 disposed at the end of the first substrate 11 or the second substrate 17 far away from the channel 12 can greatly increase the bonding force between the lead frame 10 and the mold structure 40, reduce the deformation capability of the lead frame 10 at high temperature, and improve the reliability of the lead frame 10.

As shown in fig. 1, fig. 2 and fig. 5, in the first embodiment of the present invention, the lead frame 10 includes two first leads 20, and the two first leads 20 are spaced apart from each other along the extending direction of the channel 12.

In the above technical scheme, by arranging the two first pins 20, the possibility that the soldering flux invades the functional area of the LED device from the pins can be reduced, so that the LED device is prevented from being damaged, and the reliability of the LED device is improved.

Of course, in alternative embodiments not shown in the drawings, the number of first pins 20 may be three or four, etc.

As shown in fig. 1, 2 and 5, in the first embodiment of the present invention, the lead frame 10 includes two second leads 30, and the two second leads 30 are spaced apart from each other along the extending direction of the channel 12.

Of course, in alternative embodiments not shown in the drawings, the number of second pins 30 may be three or four, etc.

As shown in fig. 2, in the first embodiment of the present invention, the molded structure 40 includes a second arc-shaped structure 42 connected to the first lead 20 of the lead frame 10, and at least one side of the first lead 20 is provided with the second arc-shaped structure 42; the molded structure 40 includes a third arc-shaped structure 43 connected to the second lead 30 of the lead frame 10, and at least one side of the second lead 30 is provided with the third arc-shaped structure 43.

With the above arrangement, the concentrated stress at the connection portions of the first leads 20 and the second leads 30 with the mold structures 40, respectively, can be reduced, so that the connection stability between the first leads 20 and the second leads 30 with the mold structures 40, respectively, can be improved; further, the above arrangement facilitates demolding of the molded structure 40.

Preferably, as shown in fig. 2, in the first embodiment of the present invention, the second arc structures 42 are disposed on two opposite sides of the first pin 20.

Of course, in an alternative embodiment not shown in the drawings, the second arc-shaped structure 42 may also be provided on one side of the first leg 20.

Preferably, as shown in fig. 2, in the first embodiment of the present invention, the second pin 30 is provided with third arc structures 43 on two opposite sides.

Of course, in an alternative embodiment not shown in the drawings, a third arc-shaped structure 43 may also be provided on one side of the second leg 30.

As shown in fig. 1 and 3, in the embodiment of the invention, the LED device further includes at least one receiving groove 80 disposed on an inner wall surface of the tubular structure 70 and configured to receive a zener tube, and the receiving groove 80 is communicated with the inner through hole 74.

Through the arrangement, the accommodating groove 80 can be used for accommodating the neat nanotubes, so that the processing personnel can install the neat nanotubes on the molding structure, and the neat nanotubes are connected with the lead frame 10, so that the production efficiency of the LED device can be improved.

Specifically, in the embodiment of the present invention, the receiving groove 80 is a through groove, so that the Zener pipe can be connected to the lead frame 10.

Preferably, in the embodiment of the present invention, there is one accommodation groove 80, one end of the accommodation groove 80 is used for placing the zener diode, and the other end of the accommodation groove 80 is used for wire bonding.

Preferably, in the embodiment of the present invention, the receiving groove 80 is rectangular, and of course, in an alternative embodiment not shown in the drawings, the receiving groove 80 may also be square or other shapes capable of receiving a zener tube.

As shown in fig. 1 and 4, in the embodiment of the invention, the sidewall of the accommodating groove 80 away from the chip placement body 61 is provided with an inclined surface 81, and the inclined surface 81 gradually gets away from the center line of the inner through hole 74 from the second end to the first end of the cylindrical structure 70.

Specifically, the included angle between the inclined surface 81 with the angle of 70 degrees and less than or equal to 80 degrees and the horizontal plane.

With the above arrangement, the inclined surface 81 faces the upper side of the chip 1, so that the inclined surface 81 reflects the light emitted from the chip 1 in a direction away from the chip 1, and thus the reflection effect of the molding structure can be effectively improved, and of course, in an alternative embodiment, the inclined surface 81 may face the chip 1, so that the light emitted from the chip 1 is irradiated onto the inclined surface 81.

As shown in fig. 1 and 4, in the embodiment of the invention, the inclined surface 81 extends from the sidewall of the accommodating groove 80 to the first end of the reflection portion.

Through the above arrangement, the area of the inclined surface 81 can be increased, so that the reflection area of the reflected light can be increased, and the reflection effect of the inclined surface 81 can be improved. Furthermore, the arrangement is favorable for the die bonding and the subsequent routing operation of the Zener tube.

Of course, in alternative embodiments, the molded structure may include a plurality of receiving slots 80, the plurality of receiving slots 80 being spaced circumferentially around the escape slot 62. Thus, a plurality of Zener tubes can be arranged in the plurality of accommodating grooves 80, so that the voltage stabilizing capability and the antistatic capability of the LED device are improved.

Of course, in alternative embodiments, the molding structure may further include two receiving grooves 80, two receiving grooves 80 are symmetrically disposed about the avoiding groove 62 or two receiving grooves 80 are disposed adjacent to each other at intervals along the circumference of the avoiding groove 62.

As shown in fig. 1 and 3, in the embodiment of the invention, the receiving groove 80 and the avoiding groove 62 are disposed at an interval.

Through the above arrangement, the space between the accommodating groove 80 and the avoiding groove 62 is filled by the reflection part, and the reflection part can play a role of reflection, so that the reflection area of the reflection part can be ensured as much as possible under the condition of arranging the accommodating groove 80, and the reflection effect of the reflection part is ensured.

It should be noted that, in the embodiment of the present invention, the spacing arrangement means that the accommodating groove 80 is not communicated with the avoiding groove 62.

In the embodiment of the present invention, the LED device further includes a reflective member covering the accommodating groove 80, and the reflective member is used for reflecting light.

Among the above-mentioned technical scheme, through setting up the reflection part, can increase the reflection area of reflection light to can avoid reducing the problem of light efficiency because of the lead frame 10 extinction that zener and storage tank 80 expose, and then can improve the light-emitting rate of LED device effectively.

Specifically, in the embodiment of the present invention, after the zener is mounted to the receiving groove 80, the reflective member is covered on the receiving groove 80 and the zener, so that the reflective area of the molding structure 40 can be still ensured under the condition of providing the zener.

Specifically, in the embodiment of the present invention, the reflective member covers the entire receiving groove 80, and after the reflective member is filled, the upper surface of the reflective member is almost matched with the original curvature of the reflective surface to form a continuous smooth surface.

Preferably, in an embodiment of the present invention, the reflective member is made of highly reflective powder and colloidal material. Namely, the containing groove 80 is filled with the highly reflective powder and the colloid, and the highly reflective powder and the colloid are covered on the zener tube.

Specifically, the colloidal material may be formed of epoxy resin, silicone gel, or the like. The highly reflective powder may include ceramic powder having high reflectance, for example, ceramic powder such as TiO2, Al2O3, Nb2O5, or ZnO, and may also include, for example, metal powder having high reflectance (for example, metal powder such as Al or Ag).

Example two

As shown in fig. 6, the second embodiment of the present invention is different from the first embodiment in that an angle is formed between the length direction of the elongated hole and the extending direction of the channel 12, and the distance between the lower end of the elongated hole and the center line of the channel 12 is greater than the distance between the upper end of the elongated hole and the center line of the channel 12. This may also increase the connection area between the lead frame 10 and the mold structure 40, so that the coupling force between the lead frame 10 and the mold structure 40 may be improved.

Other structures of the bracket in the second embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

EXAMPLE III

As shown in fig. 7, a difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the through hole 16 is a square through hole with rounded corners, which can also increase the connection area between the lead frame 10 and the mold structure 40, thereby improving the bonding force between the lead frame 10 and the mold structure 40.

Other structures of the bracket in the third embodiment of the invention are the same as those in the first embodiment, and are not described again here.

Example four

As shown in fig. 8, a difference between the fourth embodiment of the present invention and the first embodiment is that in the fourth embodiment, the through hole 16 is a circular through hole, and compared with the long hole, the circular through hole has a simpler structure and is easier to process.

Other structures of the bracket in the fourth embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

EXAMPLE five

As shown in fig. 9, a fifth embodiment of the present invention is different from the first embodiment in that, in the fifth embodiment, the first recessed groove 13 is provided only on one side of the first substrate 11 and the second substrate 17 along the extending direction (i.e., the second direction) of the channel 12, and the first recessed groove 13 is not provided on the other side of the first substrate 11 and the second substrate 17, so that the airtightness between the lead frame 10 and the member to be connected can be effectively increased; further, the bonding force between the lead frame 10 and the member to be connected can be effectively improved.

Other structures of the bracket in the fifth embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

EXAMPLE six

As shown in fig. 10, a sixth embodiment of the present invention is different from the first embodiment in that a blocking structure 50 is disposed on a side of the first substrate 11 or the second substrate 17 facing the channel 12. In this way, it is also possible to realize that the width of the opposite ends of the channel 12 is greater than the width of the middle portion to form a "wide-narrow-wide" pattern, which can provide a sufficient bonding area for bonding between the lead frame 10 and the chip 1, and also reduce the possibility of flux invading the chip placement area, so that the problem of reduced hermeticity caused by thermal deformation of the lead frame 10 during bonding can be avoided, which can improve the reliability of the LED device.

Other structures of the bracket in the sixth embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

EXAMPLE seven

As shown in fig. 11, a seventh embodiment of the present invention is different from the first embodiment in that a through hole 16 is provided in the first base 11 or the second base 17 in the seventh embodiment. In this way, the inner wall of the through hole 16 may be bonded to the mold structure 40, so that the connection area between the lead frame 10 and the mold structure 40 may be increased, and the bonding force between the lead frame 10 and the mold structure 40 may be improved.

Other structures of the bracket in the seventh embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

Example eight

As shown in fig. 12, an eighth embodiment of the present invention is different from the first embodiment in that in the eighth embodiment, the extending direction of the first leads 20 is parallel to the extending direction of the channels 12; the extending direction of the second leads 30 is arranged in parallel with the extending direction of the channels 12. The arrangement is simple in structure and convenient to process.

Other structures of the bracket in the eighth embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

Example nine

As shown in fig. 13, the ninth embodiment of the present invention is different from the first embodiment in that in the ninth embodiment, the second recessed groove 15 includes only the first groove section 151 and the second groove section 152 which are communicated with each other, and the widths of the two groove sections are reduced in order from the direction approaching the passage 12 in the first direction.

Through the arrangement, the plastic flowability of the molding structure 40 during injection molding can be improved, so that the inside of the injection molding of the support is fuller, and the possibility of generating air bubbles is reduced.

Other structures of the bracket in the ninth embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

EXAMPLE ten

As shown in fig. 14 and 15, a tenth embodiment of the present invention is different from the first embodiment in that in the tenth embodiment, the chip placement body 61 is not a stepped structure for mounting the chip 1, the chip 1 is mounted in the avoidance groove 62, and the reflective structure and a projected portion of the chip placement body 61 in the first plane are covered on the first protrusion 64 so that a portion of the first protrusion 64 is exposed from the avoidance groove 62.

The structure is simple, the processing is convenient, and the processing cost can be reduced.

Preferably, in the tenth embodiment of the present invention, the length of the bypass groove 62 is less than 1.2 times of the length of the chip 1, and is greater than the length of the chip 1. Therefore, a certain distance is reserved between the inner wall surface of the avoiding groove 62 and the chip 1, so that the side surface light emitting of the chip 1 is prevented from being influenced by the side wall of the avoiding groove 62, the light emitted by the chip 1 can be reflected by the side wall of the avoiding groove 62, and the light emitting effect can be improved.

As shown in fig. 14 and 15, in a tenth embodiment of the present invention, the depth of the avoiding groove 62 is H, the height of the chip 1 is H, and the depth H satisfies: h is more than or equal to 0.15H and less than or equal to 0.5H. Can make most chip 1 protrusion like this and dodge groove 62 and set up to can avoid influencing the side light-emitting of chip 1 because of dodging groove 62's the degree of depth too deeply, thereby make most light that chip 1 sent reflect through the plane of reflection, and then can improve the light-emitting effect.

Specifically, in the tenth embodiment of the present invention, the exposed length of the first projection 64 in the second direction is 0.2 to 0.6 of the length of the escape groove 62; the exposed length of the first projection 64 in the first direction is 0.3-0.5 of the width of the middle portion of the barrier 65.

Preferably, in the first embodiment of the present invention, the exposed length of the first protrusion 64 in the second direction is 0.36mm, and the exposed length of the first protrusion 64 in the first direction is 0.04 mm.

Other structures of the bracket in the tenth embodiment of the present invention are the same as those in the first embodiment, and are not described herein again.

From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: through setting up the reflection configuration who extends along circumference to reflection configuration places the main part with the chip in whole week and is connected, can make reflection configuration have great plane of reflection like this, is reflection configuration outside the main part is placed to the chip promptly, and like this, the plane of reflection of large tracts of land can reflect the light that the chip that is located the chip and places the main part sent, thereby can improve the light yield effectively.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A LED device, characterized in that it comprises a support and a chip (1), said support comprising a lead frame (10) and a molded structure (40) connected to said lead frame (10), said molded structure (40) comprising:

a chip placement body (61) defining an escape groove (62);

reflecting structure, tubular structure (70) for having inside through-hole (74), inside through-hole (74) with dodge groove (62) intercommunication, tubular structure (70) enclose to be established the periphery that main part (61) were placed to the chip, the first end of tubular structure (70) form with the opening of inside through-hole (74) intercommunication, the second end of tubular structure (70) all with on whole week the chip place main part (61) and connect, the circumference lateral wall of inside through-hole (74) forms the plane of reflection that is used for the reflection ray, from tubular structure's (70) second end to first end, the plane of reflection is including a plurality of arcwalls that connect gradually.

2. The LED device according to claim 1, wherein the plurality of curved surfaces comprises a first curved surface (71) and a second curved surface (72) connected, wherein the first curved surface (71) and the second curved surface (72) are each arranged inclined with respect to a horizontal plane, and wherein the first curved surface (71) and the second curved surface (72) are each inclined in a direction gradually away from a center line of the cylindrical structure (70).

3. The LED device according to claim 2, wherein the first arc-shaped face (71) and the horizontal plane have a first included angle C1, the first included angle C1 satisfies: c1 is more than or equal to 25 degrees and less than or equal to 50 degrees; and/or the second arc-shaped surface (72) and the horizontal plane have a second included angle D1, and the second included angle D1 satisfies the following condition: d1 is more than or equal to 30 degrees and less than or equal to 45 degrees.

4. The LED device according to claim 2, characterized in that the first arc-shaped face (71) is convex towards the side where the center line is located, and the first arc-shaped face (71) has a first arc, 10 ° ≦ 30 °; and/or the second cambered surface (72) is convex towards the direction departing from the central line, and the second cambered surface (72) has a second radian which is more than or equal to 40 degrees and less than or equal to 80 degrees.

5. The LED device according to claim 2, characterized in that the first arc-shaped face (71) has a first angle C2 with the horizontal plane, the first angle C2 increasing and then decreasing in a direction away from the center line; and a second included angle D2 is formed between the second arc-shaped surface (72) and the horizontal plane, and the second included angle D2 gradually increases along the direction far away from the central line.

6. The LED device according to claim 2, wherein the plurality of arcuate surfaces further comprises a third arcuate surface (73) connected to the second arcuate surface (72), the third arcuate surface (73) being inclined with respect to the horizontal plane and being inclined in a direction gradually away from the center line of the cylindrical structure (70).

7. The LED device according to claim 6, wherein the third arc-shaped face (73) has a third included angle E1 with the horizontal plane, the third included angle E1 satisfies: e1 is more than or equal to 30 degrees and less than or equal to 40 degrees; and/or the third arc-shaped surface (73) protrudes towards one side where the central line is located, and the third arc-shaped surface (73) has a third radian which is more than or equal to 40 degrees and less than or equal to 80 degrees.

8. The LED device according to claim 6, wherein the first arc-shaped surface (71) and the horizontal plane have a first included angle C2 therebetween, the second arc-shaped surface (72) and the horizontal plane have a second included angle D2 therebetween, and the third arc-shaped surface (73) and the horizontal plane have a third included angle E2 therebetween, wherein in a direction away from the center line, the first included angle C2 increases and then decreases, the second included angle D2 increases gradually, and the third included angle E2 decreases gradually.

9. The LED device according to any one of claims 1 to 8, characterized in that the chip placement body (61) is a stepped structure for mounting the chip (1).

10. The LED device according to claim 9, wherein the width of the avoiding groove (62) is greater than or equal to 0.7 times the width of the chip (1), and the width of the avoiding groove (62) is less than or equal to 0.9 times the width of the chip (1); or the height of the step structure is more than or equal to 0.15 time of the height of the chip (1) and less than or equal to 0.35 time of the height of the chip (1); or the height of the step structure is less than or equal to 0.03mm and less than or equal to 0.08 mm.

11. The LED device according to any of claims 1 to 8, wherein the molded structure (40) further comprises a blocking member (65) extending along the second direction and connected to the chip placement body (61), the blocking member (65) being located on a side of the avoiding groove (62) facing away from the inner through hole (74), a width of the blocking member (65) near an end of the inner through hole (74) being smaller than a width of the blocking member (65) facing away from the end of the inner through hole (74).

12. LED device according to any of claims 1 to 8, characterized in that the lead frame (10) comprises:

a first lead portion including a first base (11);

a second lead portion comprising a second substrate (17) spaced from the first substrate (11), the space between the first substrate (11) and the second substrate (17) forming a channel (12), the first and second lead portions being insulated from each other, a portion of the molded structure (40) filling the channel (12);

barrier structure (50), first base body (11) with the orientation of at least one in second base body (17) one side of passageway (12) is equipped with barrier structure (50) in the extending direction of passageway (12), barrier structure (50) are located first base body (11) and/or between two tip of the relative setting of second base body (17), barrier structure (50) protrusion in first base body (11) and/or second base body (17), part moulding structure (40) are located one side of lead frame (10), barrier structure (50) are followed it exposes to dodge groove (62).

13. LED device according to claim 12, characterized in that the lead frame (10) further comprises a second recessed groove (15), the second recessed groove (15) being provided at a side of the first body (11) and/or the second body (17) facing away from the channel (12), the molded structure (40) further comprising a first protrusion (64) connected with the reflecting structure, the second recessed groove (15) matching the shape and size of the first protrusion (64).

14. LED device according to claim 13, characterized in that the projection of the reflective structure and the chip placement body (61) in a first plane completely covers the first bump (64) to avoid the first bump (64) to emerge from the avoidance groove (62); or, the projection part of the reflection structure and the chip placement main body (61) in the first plane covers the first bump (64), so that part of the first bump (64) is exposed from the avoiding groove (62).

15. The LED device according to claim 12, characterized in that the first base body (11) and/or the second base body (17) is provided with a through hole (16), one side of the molded structure (40) is provided with a second protrusion (66), and the second protrusion (66) is matched with the shape and size of the through hole (16).