CN114509110A - Basin-type insulator stress monitoring system based on digital twinning technology - Google Patents
Basin-type insulator stress monitoring system based on digital twinning technology Download PDFInfo
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- CN114509110A CN114509110A CN202210025481.6A CN202210025481A CN114509110A CN 114509110 A CN114509110 A CN 114509110A CN 202210025481 A CN202210025481 A CN 202210025481A CN 114509110 A CN114509110 A CN 114509110A
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- 239000012212 insulator Substances 0.000 title claims abstract description 82
- 238000012544 monitoring process Methods 0.000 title claims abstract description 25
- 238000005516 engineering process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000000835 fiber Substances 0.000 claims abstract description 33
- 238000009826 distribution Methods 0.000 claims abstract description 13
- 230000000007 visual effect Effects 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims description 25
- 229920000647 polyepoxide Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910000746 Structural steel Inorganic materials 0.000 description 1
- 241000135164 Timea Species 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/242—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/16—Investigating or analyzing materials by the use of thermal means by investigating thermal coefficient of expansion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
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- Immunology (AREA)
- Pathology (AREA)
- Moulding By Coating Moulds (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a basin-type insulator stress monitoring system based on a digital twinning technology, which comprises a basin-type insulator mold and an upper computer, wherein a fiber bragg grating sensor is arranged on the inner side surface of the basin-type insulator mold, a thermocouple sensor is arranged on the outer side surface of the basin-type insulator mold, the fiber bragg grating sensor is in signal connection with the upper computer through a fiber demodulator, the thermocouple sensor is in signal connection with the upper computer through a temperature acquisition instrument, a basin-type insulator curing process digital twinning model is arranged in the upper computer, and the basin-type insulator curing process digital twinning model calculates the current curing degree field, temperature field and stress field distribution according to the temperature measured by the thermocouple sensor and performs visual display. The basin-type insulator stress monitoring system based on the digital twinning technology can monitor the stress distribution of the basin-type insulator in the production process in real time.
Description
Technical Field
The invention belongs to the technical field of manufacturing of gas insulated pipeline transmission line equipment, and relates to a basin-type insulator stress monitoring system based on a digital twinning technology.
Background
The basin-type insulator is an important part in a gas pipeline power transmission line and consists of a metal conductor and an epoxy resin basin body. The epoxy resin serves as an insulating and mechanical support in the basin insulator. In the production process of the basin-type insulator, the epoxy resin is combined with the metal conductor part through solidification, and meanwhile, the epoxy resin is converted from a liquid state into an insoluble and infusible solid state. During the epoxy resin curing process, a large amount of residual stress is generated due to the curing shrinkage and cooling shrinkage processes. The existence of the residual stress directly affects the mechanical strength of the epoxy resin insulating material, and further the basin-type insulator can be damaged, and the safety of the gas insulated pipeline transmission line is threatened. Therefore, a system for monitoring residual stress in the epoxy resin and at the interface between the epoxy resin and the metal conductor is needed.
Current monitoring systems require sensors to be placed inside the epoxy or on the surface of the epoxy, both of which are not suitable for basin insulators. Since the sensors arranged inside the epoxy resin can seriously affect its insulating properties, and the thick mold thereof also makes it impossible to arrange the sensors on the surface thereof during the curing process.
Disclosure of Invention
The invention aims to provide a basin-type insulator stress monitoring system based on a digital twinning technology, which can monitor the stress distribution of a basin-type insulator in the production process in real time.
The technical scheme includes that the basin-type insulator stress monitoring system based on the digital twinning technology comprises a basin-type insulator mold and an upper computer, wherein a fiber bragg grating sensor is arranged on the inner side surface of the basin-type insulator mold, a thermocouple sensor is arranged on the outer side surface of the basin-type insulator mold, the fiber bragg grating sensor is in signal connection with the upper computer through a fiber optic demodulator, the thermocouple sensor is in signal connection with the upper computer through a temperature acquisition instrument, a basin-type insulator curing process digital twinning model is installed inside the upper computer, and the basin-type insulator curing process digital twinning model calculates the current curing degree field, the temperature field and the stress field distribution according to the temperature measured by the thermocouple sensor and performs visual display.
The basin-type insulator curing process digital twin model is established through comsol software and comprises a solid heat transfer module and a stress deformation module.
The solid heat transfer module is used for converting the temperature measured by the thermocouple sensor into a temperature field and a curing degree field, and the temperature field and the curing degree field are coupled in two directions.
The temperature field is formed by temperatures of different time points and different space points measured by the thermocouple sensor.
The curing degree field is composed of curing degrees alpha at different temperatures, wherein
α＝(T/To)100％ (1)
Wherein T represents the heat release at different time and different space points in the curing process of the epoxy resin in the basin-type insulator, namely the temperature measured by the thermocouple sensor, and ToIs the total amount of heat released during the curing of the epoxy resin in the basin insulator.
The stress deformation module is used for solving stress field distribution and is in one-way coupling with the solid heat transfer module.
The stress field calculation formula is as follows:
{σ}＝[Q(α,T)]{ε} (2)
ε＝εth+εch (3)
εth＝a(T)(T-Tref) (4)
wherein Q (alpha, T) is a stiffness coefficient at a temperature T, epsilon is a total strain in a resin curing process, epsilonthIs the thermal strain, epsilon, during the curing of the resinchThe curing shrinkage strain during the curing process of the resin, and a (T) is the thermal expansion coefficient/(1/K) at the temperature TrefIs a reference temperature/K, VchIs the rate of volume change, alpha, during the curing of the resingelThe degree of curing at the gel point.
The basin-type insulator mold comprises a mold shell, a cavity and a bottom supporting plate, wherein the bottom supporting plate is located at the bottom of the mold shell, the cavity is located inside the mold shell, and a pouring gate is arranged at the top of the cavity.
The fiber bragg grating sensors on the inner side face of the basin-type insulator mold correspond to the thermocouple sensors one by one, bragg gratings are engraved on the fiber bragg grating sensors, and the center of a grid area of each fiber bragg grating sensor and a measuring point of the thermocouple sensor at the same position are located at the same height.
The fiber optic demodulator is manufactured by MICRON OPTICS Inc. with model number SM130, and the temperature acquisition instrument is manufactured by Wernike electronics Inc. with model number WD-08A.
The method has the advantages that the temperature of the basin-type insulator mold is monitored in real time through the thermocouple sensor, parameters in the basin-type insulator curing process digital twinning model are checked through strain demodulated by the optical fiber demodulator, the current curing degree field, the temperature field and the stress field distribution are calculated through the basin-type insulator curing process digital twinning model, and the stress monitoring in the basin-type insulator production process is realized.
Drawings
FIG. 1 is a schematic structural diagram of a basin-type insulator stress monitoring system based on a digital twinning technology;
fig. 2 is a stress field profile in an embodiment of the invention.
In the figure, 1, a basin-type insulator mold, 2, an upper computer, 3, a fiber bragg grating sensor, 4, a thermocouple sensor, 5, a temperature acquisition instrument, 6, a fiber demodulation instrument, 7, epoxy resin, 11, a mold shell, 12, a cavity, 13, a bottom supporting plate and 14, a pouring gate are arranged.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The invention relates to a digital twin technology-based basin-type insulator stress monitoring system, which refers to fig. 1 and comprises a basin-type insulator mold 1 and an upper computer 2, wherein a plurality of fiber grating sensors 3 and thermocouple sensors 4 are arranged on the inner side surface of the basin-type insulator mold 1, a plurality of thermocouple sensors 4 are also arranged on the outer side surface of the basin-type insulator mold, the fiber grating sensors 3 and the thermocouple sensors 4 on the inner side surface of the basin-type insulator mold 1 are in one-to-one correspondence, the fiber grating sensors 3 are produced by Shenzhen Zhongke sensing, the fiber material and the fiber outer sheath are polyimide polymers, Bragg gratings are engraved on the fiber grating sensors 3, the length of a gate region is 12mm, the bandwidth is 0.182nm, the reflectivity is 90.55%, and the center of the gate region of the fiber grating sensors 3 and the measuring point of the thermocouple sensors 4 at the same position are positioned at the same height.
The fiber grating sensor 3 is in signal connection with the upper computer 2 through the fiber demodulator 6, the thermocouple sensor 4 is in signal connection with the upper computer 2 through the temperature collector 5, the fiber demodulator 6 is produced by MICRON OPTICS company, the model is SM130, the four-channel measurement and demodulation can be realized for the central wavelength of the fiber engraved with the Bragg grating, the wavelength demodulation precision is accurate to six bits behind the decimal point, the measured wavelength range is wide, the fiber demodulator is connected with the upper computer through a network port, the online monitoring and the real-time recording of the fiber wavelength data are realized, and the minimum time step of the measurement is 1 second. The thermocouple sensor 4 is produced by a West Yiwei electromechanical device, the coating layer of the thermoelectric even data transmission line is made of a high-molecular polymer with high-temperature resistance, the thermocouple range is 0-300 ℃, the measurement range is higher than the highest temperature in the curing process of the epoxy resin-based composite material, a certain measurement margin is reserved, and the measurement precision and range can be met. The temperature acquisition instrument 5 is produced by a Werwise electronic company, has the model of WD-08A, has the acquisition temperature range of-40 to 300 ℃, has high interference resistance, can realize simultaneous acquisition of 8 paths of temperature data, has the minimum time step of measurement of 1 second, and is connected with a machine-on position through a serial port. The upper computer 2 is internally provided with a basin-type insulator curing process digital twinning model, the strain demodulated by the optical fiber demodulator 6 is used for checking parameters in the basin-type insulator curing process digital twinning model, and the basin-type insulator curing process digital twinning model calculates the current curing degree field, temperature field and stress field distribution according to the temperature measured by the thermocouple sensor 4 and performs visual display.
The basin-type insulator mold 1 comprises a mold shell 11, a cavity 12 and a bottom supporting plate 13, wherein the bottom supporting plate 13 is located at the bottom of the mold shell 11, the cavity 12 is located inside the mold shell 11, and a pouring gate 14 is arranged at the top of the cavity 12. The mold shell 11 and the bottom plate 13 are both made of steel, such as QS235-A structural steel.
A digital twin model in the basin-type insulator curing process is established through comsol software and comprises a solid heat transfer module and a stress deformation module. The solid heat transfer module is used for converting the temperature measured by the thermocouple sensor 4 into a temperature field and a curing degree field, the temperature field and the curing degree field are coupled in a bidirectional mode, and the stress deformation module is used for solving stress field distribution and is coupled with the solid heat transfer module in a unidirectional mode. The temperature field is formed by the temperatures measured by the thermocouple sensor 4 at different times and at different spatial points.
The curing degree field is composed of curing degrees alpha at different temperatures, wherein
α＝(T/To)100％ (1)
Wherein T represents the heat release at different time and different space points in the curing process of the epoxy resin in the basin-type insulator, namely the temperature measured by the thermocouple sensor 4, and ToThe total heat release amount in the epoxy resin curing process in the basin-type insulator is a constant value and can be determined by thermal analysis methods such as DSC and TGA.
The stress field calculation formula is as follows:
{σ}＝[Q(α,T)]{ε} (2)
ε＝εth+εch (3)
εth＝a(T)(T-Tref) (4)
wherein Q (alpha, T) is a stiffness coefficient at a temperature T, epsilon is a total strain in a resin curing process, epsilonthIs the thermal strain, epsilon, during the curing of the resinchThe curing shrinkage strain during the curing process of the resin, a (T) is the thermal expansion coefficient/(1/K) at the temperature T, and can be obtained by testing the cured epoxy resin by a linear thermal expansion instrument, TrefIs a reference temperature/K, VchIs the rate of volume change, alpha, during the curing of the resingelThe degree of curing at the gel point.
When the basin-type insulator stress monitoring system based on the digital twinning technology is used, a digital twinning model in the basin-type insulator curing process in the system is checked, the fiber bragg grating sensor 3 and the thermocouple sensor 4 on the inner side surface of the basin-type insulator mold 1 are detached after the digital twinning model is checked, then the basin-type insulator is produced by using the system, and the stress distribution of the basin-type insulator is monitored in real time in the production process.
When the digital twin model in the basin-type insulator curing process in the system is checked, the epoxy resin 7 is poured into the cavity 12 through the pouring gate 14, and the fiber bragg grating sensors 3 distributed on the inner side surface of the basin-type insulator mold 1 monitor the strain of the epoxy resin in real time in the epoxy resin curing process to form a strain field epsilon1(ii) a Thermocouple sensors 4 distributed on the inner side surface and the outer side surface of the basin-type insulator mold 1 monitor the temperatures of the basin-type insulator mold 1 and epoxy resin in real time, the temperatures are input into a basin-type insulator curing process digital twin model of an upper computer, and the solid heat transfer module outputs the epoxy resin according to the temperature monitored by the thermocouple sensors 4 in real timeA temperature field and a curing degree field in the process of curing the resin, a stress deformation module outputs stress field distribution in the process of curing the epoxy resin according to the temperature monitored by the thermocouple sensor 4 in real time, and the module outputs a strain field epsilon while outputting the stress field2Will strain the field ε1And strain field ε2Making a comparison if ∈1≠ε2Adjusting parameters of the digital twinning model during the curing process of the basin-type insulator, e.g. adjusting the stiffness matrix of the unit to make epsilon1＝ε2And finishing checking the digital twin model in the curing process of the basin-type insulator in the system.
When the system is used for producing the basin-type insulator, the stress deformation module outputs stress field distribution in the epoxy resin curing process according to the temperature monitored by the thermocouple sensor 4 on the outer side surface of the basin-type insulator mold 1 in real time, so that stress monitoring in the basin-type insulator production process is completed, visual display is carried out, and the obtained stress field distribution diagram is shown in fig. 2.
Claims (10)
1. A basin-type insulator stress monitoring system based on a digital twin technology is characterized by comprising a basin-type insulator mold (1) and an upper computer (2), wherein a fiber grating sensor (3) and a thermocouple sensor (4) are arranged on the inner side surface of the basin-type insulator mold (1), the outer side surface of the basin-type insulator mold is also provided with the thermocouple sensor (4), the fiber grating sensor (3) is in signal connection with the upper computer (2) through a fiber demodulator (6), the thermocouple sensor (4) is in signal connection with the upper computer (2) through a temperature collector (5), a basin-type insulator curing process digital twin model is arranged in the upper computer (2), and the basin-type insulator curing process digital twin model calculates a current curing degree field according to the temperature measured by the thermocouple sensor (4), and distributing the temperature field and the stress field, and performing visual display.
2. The digital twinning technology-based basin insulator stress monitoring system as claimed in claim 1, wherein the digital twinning model of the basin insulator solidification process is established through comsol software and comprises a solid heat transfer module and a stress deformation module.
3. The basin-type insulator stress monitoring system based on the digital twinning technology as claimed in claim 2, wherein the solid heat transfer module is used for converting the temperature measured by the thermocouple sensor (4) into a temperature field and a solidification degree field, and the temperature field and the solidification degree field are bidirectionally coupled.
4. A digital twinning technique based pot insulator stress monitoring system as claimed in claim 3, characterised in that the temperature field is formed by the temperature of different spatial points at different times measured by thermocouple sensor (4).
5. The digital twinning technology-based basin insulator stress monitoring system as claimed in claim 4, wherein the curing degree field is composed of curing degrees a at different temperatures, wherein
α＝(T/To)100％ (1)
In the formula, T represents the heat release quantity of different time and space points in the curing process of the epoxy resin in the basin-type insulator, namely the temperature measured by the thermocouple sensor (4), and ToIs the total amount of heat released during the curing of the epoxy resin in the basin insulator.
6. The basin-type insulator stress monitoring system based on the digital twinning technology as claimed in claim 4, wherein the stress deformation module is used for solving stress field distribution and is unidirectionally coupled with the solid heat transfer module.
7. The digital twinning technology-based basin insulator stress monitoring system as claimed in claim 6, wherein the stress field calculation formula is as follows:
{σ}＝[Q(α,T)]{ε} (2)
ε＝εth+εch (3)
εth＝a(T)(T-Tref) (4)
wherein Q (alpha, T) is a stiffness coefficient at a temperature T, epsilon is a total strain in a resin curing process, epsilonthIs the thermal strain, epsilon, during the curing of the resinchThe curing shrinkage strain during the curing process of the resin, and a (T) is the thermal expansion coefficient/(1/K) at the temperature TrefIs a reference temperature/K, VchIs the rate of volume change, alpha, during the curing of the resingelThe degree of curing at the gel point.
8. The digital twinning technology-based basin insulator stress monitoring system as claimed in claim 1, wherein the basin insulator mold (1) comprises a mold shell (11), a cavity (12) and a bottom supporting plate (13), the bottom supporting plate (13) is located at the bottom of the mold shell (11), the cavity (12) is located inside the mold shell (11), and a sprue (14) is arranged at the top of the cavity (12).
9. The digital twinning technology-based basin-type insulator stress monitoring system as claimed in claim 8, wherein the fiber bragg grating sensors (3) on the inner side surface of the basin-type insulator mold (1) correspond to the thermocouple sensors (4) one by one, bragg gratings are carved on the fiber bragg grating sensors (3), and the center of the grating area of the fiber bragg grating sensors (3) and the measuring point of the thermocouple sensors (4) at the same position are located at the same height.
10. The digital twinning technology-based pot insulator stress monitoring system according to claim 9, wherein the fiber optic demodulator (6) is manufactured by MICRON OPTICS, model number SM130, and the temperature collector (5) is manufactured by virtud electronics, model number WD-08A.
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| CN114509110B (en) | 2023-10-10 |
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