CN114501778A - PCB and server for high-speed differential signal coupling transmission - Google Patents

PCB and server for high-speed differential signal coupling transmission Download PDF

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Publication number
CN114501778A
CN114501778A CN202111605628.0A CN202111605628A CN114501778A CN 114501778 A CN114501778 A CN 114501778A CN 202111605628 A CN202111605628 A CN 202111605628A CN 114501778 A CN114501778 A CN 114501778A
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signal
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last
sub
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CN114501778B (en
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杨才坤
慈潭龙
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0245Lay-out of balanced signal pairs, e.g. differential lines or twisted lines

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  • Microelectronics & Electronic Packaging (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
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Abstract

The invention discloses a PCB and a server for high-speed differential signal coupling transmission, wherein the PCB comprises: a first high-speed differential signal line and a second high-speed differential signal line, the first high-speed differential signal line including a first sub-signal line and a second sub-signal line; the first sub-signal line comprises a first main line, a first tail line and a first connecting line, the first tail line is parallel to the first main line, and the first connecting line is connected with the first main line and the first tail line; the second sub-signal line comprises a second main line, a second tail line and a second connecting line, the second tail line is parallel to the second main line, and the second connecting line is connected with the second main line and the second tail line; the first tail line is parallel to the second main line and is positioned between the second main line and the second tail line; and a second high-speed differential signal line symmetrical to the first high-speed differential signal line. On the basis of not hollowing out the adjacent reference planes, the invention ensures the continuity of the transmission impedance of the high-speed signal and avoids signal transmission, thereby improving the transmission quality of the high-speed signal.

Description

PCB and server for high-speed differential signal coupling transmission
Technical Field
The present invention relates to the field of printed circuit boards, and more particularly, to a PCB and a server for high-speed differential signal coupling transmission.
Background
With the rapid development of information technology, electronic products are developing towards higher performance, so that the signal transmission rate on a Printed Circuit Board (PCB) card in the electronic products is faster and faster. The traditional PCB design method is difficult to meet the requirement of high-speed signal transmission performance, and in order to meet the signal integrity of high-speed signal transmission, the PCB design needs to be more precise, so that the continuity of high-speed signal transmission impedance is ensured. Meanwhile, electronic products tend to be miniaturized and low in cost day by day, and great challenges are brought to the design of PCB boards in the electronic products.
With the increasing functions of electronic products, the transmission rate of high-speed differential signals in the PCB card is faster and faster, which further leads to the stricter and more accurate PCB design. Currently, for high-speed differential signal traces such as PCIE and SATA, the TX-side differential signal is usually connected in series with an AC coupling capacitor. The AC coupling capacitor is usually arranged at a receiving end in the whole high-speed link and used for filtering out a direct-current component in a high-speed signal, so that the high-speed signal is symmetrical about an x axis; meanwhile, direct connection and cross connection are separated, and the influence on signal integrity caused by signal transmission of high-speed signals due to transmission impedance discontinuity is avoided. Fig. 1 shows a design diagram of a high-speed differential signal PCIE5.0 transmission signal TX serially connected 0201 capacitor PCB.
As can be seen from fig. 1, in the serially connected AC coupling capacitor region of the high-speed differential signal, due to the increase of the capacitance, the impedance is discontinuous, and the transmission impedance of the high-speed line in this region is reduced, which causes the transmission signal at the AC coupling capacitor end to be reflected, thereby affecting the transmission integrity of the high-speed differential signal, and in severe cases, causing a signal transmission error. In order to reduce the reduction of transmission impedance, the adjacent layers of the pads of the AC coupling capacitor are hollowed out, so that the distance of the high-speed differential signal in the area of the pads of the AC coupling capacitor from the reference plane is increased. However, this design cannot avoid the impedance reduction of the high-speed signal, and the impedance of the AC coupling capacitance region is still discontinuous. In addition, the reference plane of the adjacent layer is hollowed, so that the wiring of the next signal layer needs to avoid the hollowed area, the signal crosstalk caused by no plane isolation of the wiring of different layers is prevented, the area of the wiring area is reduced due to the design, and the wiring difficulty of the PCB design is increased, as shown in FIG. 2.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a PCB and a server for high-speed differential signal coupling transmission, in which the PCB for high-speed differential signal coupling transmission ensures continuity of high-speed signal transmission impedance and avoids signal transmission on the basis of not excavating an adjacent reference plane by changing an AC coupling capacitor connected in series with a high-speed differential signal into high-speed differential wiring coupling transmission, thereby improving transmission quality of the high-speed signal. The AC coupling capacitor is removed, and the cost of the PCB is reduced; meanwhile, the layout area of the device is increased, and the design of the PCB is facilitated. The reference layer of the high-speed transmission signal coupling area is not hollowed, so that the wiring space of the next signal layer is increased, and the signal transmission quality of the signal layer is improved.
In view of the above object, an aspect of the embodiments of the present invention provides a PCB for high-speed differential signal coupling transmission, including the following components: a first high-speed differential signal line including a first sub-signal line and a second sub-signal line;
the first sub-signal line includes a first main line, a first end line, and a first connection line, the first end line being parallel to the first main line, the first connection line connecting the first main line and the first end line;
the second sub signal line includes a second main line, a second end line parallel to the second main line, and a second connection line connecting the second main line and the second end line;
wherein the first end line is parallel to the second main line and the first end line is located between the second main line and the second end line,
a second high-speed differential signal line including a third sub-signal line and a fourth sub-signal line;
the third sub-signal line includes a third main line, a third last line, and a third connection line, the third last line being parallel to the third main line and the first main line, the third connection line connecting the third main line and the third last line;
the fourth sub signal line includes a fourth main line, a fourth last line, and a fourth connection line, the fourth last line being parallel to the fourth main line and the first main line, the fourth connection line connecting the fourth main line and the fourth last line;
wherein the third end line is located between the fourth main line and the fourth end line.
In some embodiments, the first end line is equidistant from the second main line and the second end line, and the third end line is equidistant from the fourth main line and the fourth end line.
In some embodiments, all of the wires in the first high-speed differential signal line and the second high-speed differential signal line have the same width.
In some embodiments, the length of the first last line is equal to the length of the second last line, the length of the third last line is equal to the length of the fourth last line, and the length of the first last line is equal to the length of the third last line.
In some embodiments, the length of the first end line is determined according to a transmission rate of a high speed signal.
In view of the above object, another aspect of the embodiments of the present invention provides a server, including a PCB for high-speed differential signal coupling transmission, where the PCB for high-speed differential signal coupling transmission includes: a first high-speed differential signal line including a first sub-signal line and a second sub-signal line;
the first sub-signal line includes a first main line, a first end line, and a first connection line, the first end line being parallel to the first main line, the first connection line connecting the first main line and the first end line;
the second sub signal line includes a second main line, a second end line parallel to the second main line, and a second connection line connecting the second main line and the second end line;
wherein the first end line is parallel to the second main line and the first end line is located between the second main line and the second end line,
a second high-speed differential signal line including a third sub-signal line and a fourth sub-signal line;
the third sub-signal line includes a third main line, a third last line, and a third connection line, the third last line being parallel to the third main line and the first main line, the third connection line connecting the third main line and the third last line;
the fourth sub-signal line includes a fourth main line, a fourth last line and a fourth connection line, the fourth last line is parallel to the fourth main line and the first main line, and the fourth connection line connects the fourth main line and the fourth last line;
wherein the third end line is located between the fourth main line and the fourth end line.
In some embodiments, the first end line is equidistant from the second main line and the second end line, and the third end line is equidistant from the fourth main line and the fourth end line.
In some embodiments, all of the wires in the first high-speed differential signal line and the second high-speed differential signal line have the same width.
In some embodiments, the length of the first last line is equal to the length of the second last line, the length of the third last line is equal to the length of the fourth last line, and the length of the first last line is equal to the length of the third last line.
In some embodiments, the length of the first end line is determined according to a transmission rate of a high speed signal.
The invention has the following beneficial technical effects: by changing the AC coupling capacitance connected in series with the high-speed differential signal into high-speed differential wiring coupling transmission, on the basis of not hollowing out an adjacent reference plane, the continuity of the transmission impedance of the high-speed signal is ensured, the signal transmission is avoided, and the transmission quality of the high-speed signal is improved. The AC coupling capacitor is removed, and the cost of the PCB is reduced; meanwhile, the layout area of the device is increased, and the design of the PCB is facilitated. The reference layer of the high-speed transmission signal coupling area is not hollowed, so that the wiring space of the next signal layer is increased, and the signal transmission quality of the signal layer is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art reference layer in an AC-coupled capacitor pad area;
FIG. 2 is a schematic diagram of a prior art PCB design with AC coupling capacitor areas;
FIG. 3 is a schematic diagram of a PCB embodiment of the high-speed differential signal coupling transmission of the present invention;
FIG. 4 is a PCB design diagram of the coupling transmission wiring area in the embodiment of the present invention;
fig. 5 is a schematic diagram of a PCB package of a coupling transmission wiring model in an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In view of the above objects, a first aspect of the embodiments of the present invention provides an embodiment of a PCB for high-speed differential signal coupling transmission. Fig. 3 is a schematic diagram of an embodiment of the PCB for high-speed differential signal coupling transmission according to the present invention, and as shown in fig. 3, the PCB for high-speed differential signal coupling transmission includes the following components:
a first high-speed differential signal line 1, the first high-speed differential signal line 1 including a first sub-signal line 2 and a second sub-signal line 3;
the first sub-signal line 2 includes a first main line 21, a first end line 22, and a first connection line 23, the first end line 22 being parallel to the first main line 21, the first connection line 23 connecting the first main line 21 and the first end line 22;
the second sub-signal line 3 includes a second main line 31, a second end line 32, and a second connection line 33, the second end line 32 being parallel to the second main line 31, the second connection line 33 connecting the second main line 31 and the second end line 32;
wherein the first end line 22 is parallel to the second main line 31, and the first end line 22 is located between the second main line 31 and the second end line 32,
a second high-speed differential signal line 4, the second high-speed differential signal line 4 including a third sub-signal line 5 and a fourth sub-signal line 6;
the third sub-signal line 5 includes a third main line 51, a third last line 52, and a third connection line 53, the third last line 52 being parallel to the third main line 51 and the first main line 21, the third connection line 53 connecting the third main line 51 and the third last line 52;
the fourth sub-signal line 6 includes a fourth main line 61, a fourth end line 62, and a fourth connection line 63, the fourth end line 62 being parallel to the fourth main line 61 and the first main line 21, the fourth connection line 63 connecting the fourth main line 61 and the fourth end line 62;
wherein the third last line 52 is located between the fourth main line 61 and the fourth last line 62.
In some embodiments, the first end line 22 is equidistant from the second main line 31 and the second end line 32, and the third end line 52 is equidistant from the fourth main line 61 and the fourth end line 62. The distance between the second main line and the first end line and the distance between the second end line and the first end line are controlled according to 0.1mm if the coupling model is on the surface layer, and the distance between the second main line and the first end line is controlled according to 0.075mm if the coupling model is on the inner layer.
In some embodiments, all the lines in the first high-speed differential signal line 1 and the second high-speed differential signal line 4 have the same width. In a TX sending signal of a high-speed differential signal, a transmission trace is disconnected in a certain area in a transmission link, for example, when the TX sending signal is about to reach a high-speed connector end, the transmission trace is disconnected at the connector end, and the end of the signal is wrapped by two parallel traces with a specific length. The width of the parallel routing is consistent with that of the high-speed differential signal routing.
In some embodiments, the length of the first end line 22 is equal to the length of the second end line 32, the length of the third end line 52 is equal to the length of the fourth end line 62, and the length of the first end line 22 is equal to the length of the third end line 52.
In some embodiments, the length of the first end line 22 is determined according to the transmission rate of the high speed signal. The faster the transmission rate of the high-speed signal is, the greater the coupling strength between the lines is, so that the length of the parallel routing is determined according to the transmission rate of the high-speed signal, and if the transmission rate of the PCIE4.0 is 16GT/s, the length of the first last line is 1 mm; the PCIE5.0 transmission rate is 32GT/s, and the first end line length is 0.7 mm. The length of the first last line is not inversely proportional to the transmission rate of the high speed signal, and a special high speed line simulation is required to determine the length of the first last line.
In the embodiment of the invention, the high-speed signal wiring design mode is similar to that of an AC coupling capacitor, in the high-speed signal transmission process, the high-speed signal is coupled and transmitted to the corresponding wrapping line through the coupling among PCB signal wirings, and the wrapping line forms a high-speed transmission wiring to transmit the signal to the connector end, so that the transmission of the whole TX signal is completed.
In the embodiment of the invention, the high-speed differential signals DP/DN are distributed at equal intervals in the whole process, so that impedance discontinuity of the high-speed differential signals in the transmission process is avoided, and signal integrity distortion caused by signal reflection is avoided.
In the embodiment of the invention, because the DP/DN distance and the wiring width of the high-speed differential signal in the coupling area are not changed, the transmission impedance of the high-speed differential signal is not changed, and therefore, the adjacent reference plane does not need to be hollowed, so that the next layer of signal wiring has larger wiring space, as shown in FIG. 4. Meanwhile, the use of a patch AC coupling capacitor is eliminated by the wiring design, so that the cost of the whole PCB is reduced.
The high-speed differential routing coupling transmission model in the embodiment of the invention can be designed into a PCB packaging form. Subsequently, in the PCB design process, the high-speed differential TX transmit signal may call a package of a coupled transmission wiring model to replace its conventional serial AC coupling capacitor, and the package design is shown in fig. 5. The PCB package of the coupling transmission wiring model is divided into 3 bonding pads, wherein the upper and lower bonding pads on the periphery are bonding pads of an output network after high-speed signal coupling, and the bonding pad wrapped in the middle is a high-speed input signal bonding pad. The length of the bonding pad is 0.3mm, the width of the bonding pad is 0.15mm, and the length and the width of the bonding pad are adjusted according to the line width and the line distance of a high-speed differential distribution line in the actual PCB design; if the package is placed on the surface layer, the distance between the bonding pads is 0.1mm, and if the bonding pads are placed on the inner layer, the distance between the bonding pads is 0.075 mm; meanwhile, the three bonding pads do not need to be provided with solder resisting windows and steel meshes.
According to the embodiment of the invention, the AC coupling capacitor connected in series with the high-speed differential signal is changed into high-speed differential wiring coupling transmission, so that on the basis of not hollowing out an adjacent reference plane, the continuity of the transmission impedance of the high-speed signal is ensured, the signal transmission is avoided, and the transmission quality of the high-speed signal is improved. The AC coupling capacitor is removed, and the cost of the PCB is reduced; meanwhile, the layout area of the device is increased, and the design of the PCB is facilitated. The reference layer of the high-speed transmission signal coupling area is not hollowed, so that the wiring space of the next signal layer is increased, and the signal transmission quality of the signal layer is improved.
In view of the above object, according to a second aspect of the embodiments of the present invention, an embodiment of a server is provided. The server comprises a PCB for high-speed differential signal coupling transmission. The PCB for high-speed differential signal coupling transmission comprises:
a first high-speed differential signal line including a first sub-signal line and a second sub-signal line;
the first sub-signal line includes a first main line, a first end line, and a first connection line, the first end line being parallel to the first main line, the first connection line connecting the first main line and the first end line;
the second sub signal line includes a second main line, a second end line parallel to the second main line, and a second connection line connecting the second main line and the second end line;
wherein the first end line is parallel to the second main line and the first end line is located between the second main line and the second end line,
a second high-speed differential signal line including a third sub-signal line and a fourth sub-signal line;
the third sub-signal line includes a third main line, a third last line, and a third connection line, the third last line being parallel to the third main line and the first main line, the third connection line connecting the third main line and the third last line;
the fourth sub signal line includes a fourth main line, a fourth last line, and a fourth connection line, the fourth last line being parallel to the fourth main line and the first main line, the fourth connection line connecting the fourth main line and the fourth last line;
wherein the third end line is located between the fourth main line and the fourth end line.
In some embodiments, the first end line is equidistant from the second main line and the second end line, and the third end line is equidistant from the fourth main line and the fourth end line.
In some embodiments, all of the wires in the first high-speed differential signal line and the second high-speed differential signal line have the same width.
In some embodiments, the length of the first last line is equal to the length of the second last line, the length of the third last line is equal to the length of the fourth last line, and the length of the first last line is equal to the length of the third last line.
In some embodiments, the length of the first end line is determined according to a transmission rate of a high speed signal.
It should be understood by those skilled in the art that the above description of the PCB for high-speed differential signal coupling transmission is applicable to the server, and for the brevity of the description, the description is omitted here.
The embodiment of the invention has the advantages of easy installation, low working hour cost and increased convenience for system maintenance; the universality is high, and the competitiveness of the product is improved; metal brackets, fan rivets and pull nails are not needed, so that the cost is saved; the fan is not shielded, and the heat dissipation efficiency is improved.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.

Claims (10)

1. A PCB for high-speed differential signal coupling transmission is characterized by comprising the following components:
a first high-speed differential signal line including a first sub-signal line and a second sub-signal line;
the first sub-signal line includes a first main line, a first end line, and a first connection line, the first end line being parallel to the first main line, the first connection line connecting the first main line and the first end line;
the second sub signal line includes a second main line, a second end line parallel to the second main line, and a second connection line connecting the second main line and the second end line;
wherein the first end line is parallel to the second main line and the first end line is located between the second main line and the second end line,
a second high-speed differential signal line including a third sub-signal line and a fourth sub-signal line;
the third sub-signal line includes a third main line, a third last line, and a third connection line, the third last line being parallel to the third main line and the first main line, the third connection line connecting the third main line and the third last line;
the fourth sub signal line includes a fourth main line, a fourth last line, and a fourth connection line, the fourth last line being parallel to the fourth main line and the first main line, the fourth connection line connecting the fourth main line and the fourth last line;
wherein the third end line is located between the fourth main line and the fourth end line.
2. The PCB of claim 1, wherein the first end line is equidistant from the second main line and the second end line, and the third end line is equidistant from the fourth main line and the fourth end line.
3. The PCB of claim 1, wherein all of the first high-speed differential signal lines and the second high-speed differential signal lines are equal in width.
4. The PCB of claim 1, wherein a length of the first last line is equal to a length of the second last line, a length of the third last line is equal to a length of the fourth last line, and a length of the first last line is equal to a length of the third last line.
5. The PCB of claim 4, wherein the length of the first end line is determined according to a transmission rate of a high speed signal.
6. A server, comprising a PCB for high-speed differential signal coupling transmission, the PCB comprising:
a first high-speed differential signal line including a first sub-signal line and a second sub-signal line;
the first sub-signal line includes a first main line, a first end line, and a first connection line, the first end line being parallel to the first main line, the first connection line connecting the first main line and the first end line;
the second sub signal line includes a second main line, a second end line parallel to the second main line, and a second connection line connecting the second main line and the second end line;
wherein the first end line is parallel to the second main line and the first end line is located between the second main line and the second end line,
a second high-speed differential signal line including a third sub-signal line and a fourth sub-signal line;
the third sub-signal line includes a third main line, a third last line, and a third connection line, the third last line being parallel to the third main line and the first main line, the third connection line connecting the third main line and the third last line;
the fourth sub signal line includes a fourth main line, a fourth last line, and a fourth connection line, the fourth last line being parallel to the fourth main line and the first main line, the fourth connection line connecting the fourth main line and the fourth last line;
wherein the third end line is located between the fourth main line and the fourth end line.
7. The server according to claim 6, wherein the first end line is equidistant from the second main line and the second end line, and wherein the third end line is equidistant from the fourth main line and the fourth end line.
8. The server according to claim 6, wherein all of the first high-speed differential signal lines and the second high-speed differential signal lines have equal widths.
9. The server of claim 6, wherein the length of the first last line is equal to the length of the second last line, wherein the length of the third last line is equal to the length of the fourth last line, and wherein the length of the first last line is equal to the length of the third last line.
10. The server according to claim 9, wherein the length of the first end line is determined according to a transmission rate of the high-speed signal.
CN202111605628.0A 2021-12-25 2021-12-25 PCB and server for high-speed differential signal coupling transmission Active CN114501778B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204946008U (en) * 2015-06-26 2016-01-06 深圳市兴森快捷电路科技股份有限公司 A kind of Wiring structure being applied to differential signal impedance and optimizing
CN105323966A (en) * 2015-09-24 2016-02-10 浪潮电子信息产业股份有限公司 Design method for optimizing impedance continuity in interconnection of capacitors and differential through holes
CN105873356A (en) * 2016-04-27 2016-08-17 浪潮电子信息产业股份有限公司 PCB (printed circuit board)
CN109379835A (en) * 2018-10-16 2019-02-22 郑州云海信息技术有限公司 A kind of pcb board high speed signal Via Design method, via structure and a kind of pcb board
CN112738999A (en) * 2020-10-28 2021-04-30 苏州浪潮智能科技有限公司 Differential signal via hole and coupling capacitor impedance continuity design method and PCB

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204946008U (en) * 2015-06-26 2016-01-06 深圳市兴森快捷电路科技股份有限公司 A kind of Wiring structure being applied to differential signal impedance and optimizing
CN105323966A (en) * 2015-09-24 2016-02-10 浪潮电子信息产业股份有限公司 Design method for optimizing impedance continuity in interconnection of capacitors and differential through holes
CN105873356A (en) * 2016-04-27 2016-08-17 浪潮电子信息产业股份有限公司 PCB (printed circuit board)
CN109379835A (en) * 2018-10-16 2019-02-22 郑州云海信息技术有限公司 A kind of pcb board high speed signal Via Design method, via structure and a kind of pcb board
CN112738999A (en) * 2020-10-28 2021-04-30 苏州浪潮智能科技有限公司 Differential signal via hole and coupling capacitor impedance continuity design method and PCB

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