CN114496845A - Adaptive variable pitch wafer scanning system and method - Google Patents
Adaptive variable pitch wafer scanning system and method Download PDFInfo
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- CN114496845A CN114496845A CN202111663766.4A CN202111663766A CN114496845A CN 114496845 A CN114496845 A CN 114496845A CN 202111663766 A CN202111663766 A CN 202111663766A CN 114496845 A CN114496845 A CN 114496845A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to a self-adaptive variable-spacing wafer scanning system and a method, wherein the system comprises a base, a wafer scanning transmitting end arranged on the base and a wafer scanning receiving end corresponding to the wafer scanning transmitting end, wherein the wafer scanning transmitting end and the wafer scanning receiving end form a group of wafer scanning modules; a plurality of groups of wafer scanning modules are movably arranged on the base; the distance between the wafer scanning modules is adjustable. During scanning, according to the size information of the wafers to be scanned acquired through the acquisition unit, the distance between the corresponding wafer scanning modules is confirmed through the size, the motor is controlled to rotate through the PLC control unit, the distance between the wafer scanning modules is adjusted through the motor drive, and the wafers of the corresponding specifications are scanned. The self-adaptive variable-spacing wafer scanning system and method can realize the adjustment of the positions among the sensors, meet the requirements of wafer scanning of different specifications, ensure the scanning efficiency and simultaneously improve the compatibility of wafer scanning.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a self-adaptive variable-pitch wafer scanning system and a self-adaptive variable-pitch wafer scanning method.
Background
In the wafer processing process, when the wafer box is placed on the equipment, the distribution condition of the wafer in the wafer box needs to be acquired, generally, a sensor is adopted to scan the wafer in the wafer box, and generally, the wafer processing method has two forms:
one form is to use scanning sensors with specification spacing to scan the distribution of wafers in a wafer box, for example, the invention patent with application number CN202010997692.7 discloses a wafer scanning and wafer scanning method, which adopts a set of scanning components consisting of a plurality of photoelectric emitting ends arranged on one side and a plurality of photoelectric receiving ends correspondingly arranged on the other side, wherein one photoelectric emitting end and one photoelectric receiving end are respectively arranged on two sides of one wafer box to form staggered scanning.
Another form is to use a single sensor to scan the wafer piece by piece in one direction, and the prior art, for example, the utility model with application number CN202023178211.4 discloses a wafer positioning device based on an acceleration sensor, the wafer scanning sensor moves up and down along one side of the wafer box to scan the wafer.
However, the two scanning technologies have the problem of poor compatibility, and with the appearance of an elastic production line, the thicknesses of front and rear wafers may be different, the scanning sensors with the specification spacing cannot meet the requirement of the thickness change of the wafers, and the scanning efficiency is low when a single sensor moves.
Disclosure of Invention
In order to solve the technical problems, the invention provides a self-adaptive variable-pitch wafer scanning system and a method, which can be adjusted according to the thickness change of a wafer and meet the scanning requirements of wafers and wafer boxes with different specifications.
The technical purpose of the invention is realized by the following technical scheme:
the invention provides a self-adaptive variable-spacing wafer scanning system, which comprises a base, a wafer scanning transmitting end and a wafer scanning receiving end, wherein the wafer scanning transmitting end is arranged on the base; a plurality of groups of wafer scanning modules are movably arranged on the base; the distance between the wafer scanning modules is adjustable.
Furthermore, the wafer scanning emission end comprises a sensor emission end bracket and a sensor emission end, and the sensor emission end is arranged on the sensor emission end bracket; the wafer scanning receiving end comprises a sensor receiving end support and sensor receiving ends, the sensor receiving ends are installed on the sensor receiving end support, and the sensor transmitting ends correspond to the sensor receiving ends one to one; the sensor transmitting end bracket and the sensor receiving end bracket are respectively movably arranged on one side of the base; the base is a lifting base.
Furthermore, the two sides of the base are respectively provided with a screw rod used for installing a sensor transmitting end bracket and a sensor receiving end bracket, and the sensor transmitting end bracket and the sensor receiving end bracket are respectively sleeved outside the screw rods; one end of the screw rod is provided with a screw rod supporting seat, and the other end of the screw rod is provided with a power device for driving the screw rod to rotate; springs are respectively arranged between the sensor transmitting end brackets and between the sensor receiving end brackets, and the springs are sleeved on the screw rod; the lead screw is also provided with a push block for pushing the sensor transmitting end support and the sensor receiving end support to move relative to the lead screw, the push block is in threaded fit with the lead screw, and the side surface of the push block is also provided with a limiting device for limiting the rotation of the push block.
Further, the pushing block is arranged at one end close to the screw rod connected with the power device.
Furthermore, two ends of a spring between the sensor transmitting end brackets are respectively connected with the sensor transmitting end brackets, and two ends of a spring between the sensor receiving end brackets are respectively connected with the sensor receiving end brackets.
Further, a bearing is arranged on the screw rod supporting seat, and the screw rod is installed on the screw rod supporting seat through the bearing.
Further, the power device is a motor.
The invention also provides a self-adaptive variable-spacing wafer scanning method, which comprises the following steps:
step 4, after the motor rotates, the PLC control unit outputs signals to control the lifting base to ascend to the position of the wafer box, and after the ascending is finished, all the sensor transmitting ends transmit signals to the corresponding sensor receiving ends;
and 6, the PLC control unit sends the map data to a computer, and the computer displays the map image of the wafer.
Furthermore, the acquisition unit is a scanning gun or a pressure sensor, and the acquisition unit acquires the size information of the wafer to provide a basis for adjusting the distance between the wafer modules.
Compared with the prior art, the invention has the beneficial effects that:
1. compared with a unidirectional piece-by-piece scanning technology, the wafer scanning can be finished at one time without the need of piece-by-piece scanning of the sensor, so that the scanning efficiency is greatly improved;
2. compared with the existing scanning system with the specification spacing, the invention can realize the adjustment of the positions among the sensors and meet the requirements of scanning wafers with different specifications; the wafer scanning compatibility is improved while the scanning efficiency is ensured.
Drawings
FIG. 1 is a schematic diagram of an adaptive variable pitch wafer scanning system according to the present invention.
Fig. 2 is a schematic structural diagram of a push block in the embodiment of the present invention.
In the figure, 1, a sensor transmitting end; 2. a sensor transmitting end support; 3. a sensor receiving end; 4. a sensor receiving end bracket; 5. the transmitting terminal controls the motor; 6. the receiving end controls the motor; 7. a screw rod; 8. a screw rod; 9. a push block; 10. a spring; 11. a screw rod supporting seat; 12. a bearing; 13. a base; 14. and a limiting plate.
Detailed Description
The technical solution of the present invention is further described below with reference to specific embodiments:
the embodiment provides a self-adaptive variable-pitch wafer scanning system, which can be adjusted according to the size specification of a wafer, and improves the scanning compatibility, as shown in fig. 1, the system includes a base 13, a wafer scanning transmitting end arranged on the base 13, and a wafer scanning receiving end corresponding to the wafer scanning transmitting end, wherein one wafer scanning transmitting end and one wafer scanning receiving end form a group of wafer scanning modules; a plurality of groups of wafer scanning modules are movably arranged on the base 13; the distance between the wafer scanning modules is adjustable. The requirements of scanning wafers with different sizes are met by adjusting the distance between the wafer scanning modules.
Specifically, the wafer scanning emission end comprises a sensor emission end support 2 and a sensor emission end 1, and the sensor emission end 1 is installed on the sensor emission end support 2; the wafer scanning receiving end comprises a sensor receiving end support 4 and a sensor receiving end 3, the sensor receiving end 3 is installed on the sensor receiving end support 4, and the sensor transmitting ends 1 correspond to the sensor receiving ends 3 one by one; the sensor transmitting end bracket 2 and the sensor receiving end bracket 4 are respectively and movably arranged on one side of the base 13; the base 13 is a lifting base, the wafer scanning module is sent to the wafer box scanning position through the lifting base, the wafer in the wafer box is scanned, and the base can be lifted through a hydraulic device, an electric device and a pneumatic device.
A screw rod 7 for mounting a sensor transmitting end support 2 is arranged on one side of the upper end of a base 13, a screw rod 8 for mounting a sensor receiving end support 4 is arranged on the other side of the base 13, the sensor transmitting end support 2 is sleeved outside the screw rod 7, and the sensor receiving end support 4 is sleeved outside the screw rod 8; a lead screw supporting seat 11 is installed at one end of the lead screw 7 and one end of the lead screw 8, the lead screw 7 and the lead screw 8 are respectively installed on the lead screw supporting seat 11 through a bearing, a power device used for driving the lead screw to rotate is arranged at the other end of the lead screw, the power device is a motor, specifically, one end of the lead screw 7 is connected with the transmitting end control motor 5, and one end of the lead screw 8 is connected with the receiving end control motor 6; springs 10 are respectively arranged between the sensor transmitting end brackets 2 and between the sensor receiving end brackets 4, and the springs 10 are sleeved on the screw rods 7 and 8; the lead screw 7 and the lead screw 8 are respectively provided with a push block 9 for pushing the sensor transmitting end support and the sensor receiving end support to move relative to the lead screw, the push block 9 is in threaded fit with the lead screw 7 and the lead screw 8, and the side surface of the push block 9 is also provided with a limiting device for limiting the rotation of the push block 9.
The ejector pad 9 is like the square, and the middle part is equipped with the screw hole of cooperation lead screw 7 and 8, and stop device is like setting up the limiting plate 14 in the ejector pad bottom, and as shown in fig. 2, limiting plate 14 is parallel with the bottom surface of ejector pad 9, and lead screw 7 and 8 rotation in-process, limiting plate 14 can block ejector pad 9 and take place the rotation, guarantees that ejector pad 9 removes relative lead screw 7 and lead screw 8 under the rotation of lead screw.
The ejector pad 9 is close to the one end installation that the power device is connected to the lead screw, and when ejector pad 9 removed towards lead screw supporting seat 11's direction, promote the sensor transmitting terminal support 2 and the sensor receiving terminal support 4 of the ejector pad that 9 is closest to, corresponding sensor transmitting terminal support 2 promotes adjacent sensor transmitting terminal support 2 through the spring, and sensor receiving terminal support 4 promotes adjacent sensor receiving terminal support 4 through the spring, and this process spring 10 is compressed by the equivalent.
When the push block 9 moves towards one end of the power device, the distance between the sensor transmitting end supports 2 and the distance between the sensor receiving end supports 4 are increased under the action of the spring 10, and the scanning of the wafers with larger specifications is realized.
Before the springs 10 are compressed, two ends of the spring 10 on one screw rod are contacted with the sensor receiving end bracket 2, and two ends of the spring 10 on the other screw rod are contacted with the sensor transmitting end bracket 4; alternatively, two ends of the spring 10 between the sensor transmitting end brackets 2 are respectively connected with the sensor transmitting end brackets 2, and two ends of the spring 10 between the sensor receiving end brackets 4 are respectively connected with the sensor receiving end brackets 4.
The embodiment also provides a self-adaptive variable-pitch wafer scanning method, which comprises the following steps:
And 4, after the motor rotates, the PLC control unit outputs signals to control the lifting base to ascend to the position of the wafer box, and after the ascending is finished, all the sensor transmitting ends emit photoelectric signals towards the corresponding sensor receiving ends.
And 5, receiving the photoelectric signal from the sensor transmitting end by the sensor receiving end, and transmitting the received photoelectric signal back to the PLC control unit, wherein the PLC control unit integrates the signal and summarizes the wafer map data.
And 6, the PLC control unit sends the map data to the HMI computer, and the HMI computer displays the map image of the wafer.
The present invention is further explained and not limited by the embodiments, and those skilled in the art can make various modifications as necessary after reading the present specification, but all the embodiments are protected by the patent law within the scope of the claims.
Claims (9)
1. The self-adaptive variable-spacing wafer scanning system is characterized by comprising a base, wafer scanning transmitting ends arranged on the base and wafer scanning receiving ends corresponding to the wafer scanning transmitting ends, wherein one wafer scanning transmitting end and one wafer scanning receiving end form a group of wafer scanning modules; a plurality of groups of wafer scanning modules are movably arranged on the base; the distance between the wafer scanning modules is adjustable.
2. The adaptive variable pitch wafer scanning system of claim 1, wherein the wafer scanning launch tip comprises a sensor launch tip holder, a sensor launch tip, the sensor launch tip being mounted on the sensor launch tip holder; the wafer scanning receiving end comprises a sensor receiving end support and sensor receiving ends, the sensor receiving ends are installed on the sensor receiving end support, and the sensor transmitting ends correspond to the sensor receiving ends one to one; the sensor transmitting end bracket and the sensor receiving end bracket are respectively movably arranged on one side of the base; the base is a lifting base.
3. The adaptive variable-pitch wafer scanning system according to claim 2, wherein lead screws for mounting the sensor transmitting end bracket and the sensor receiving end bracket are respectively arranged on two sides of the base, and the sensor transmitting end bracket and the sensor receiving end bracket are respectively sleeved outside the lead screws; one end of the screw rod is provided with a screw rod supporting seat, and the other end of the screw rod is provided with a power device for driving the screw rod to rotate; springs are respectively arranged between the sensor transmitting end brackets and between the sensor receiving end brackets, and the springs are sleeved on the screw rod; the sensor transmission end support and the sensor receiving end support are arranged on the lead screw, the lead screw is provided with a push block used for pushing the sensor transmission end support and the sensor receiving end support to move relative to the lead screw, the push block is in threaded fit with the lead screw, and the side face of the push block is further provided with a limiting device used for limiting the push block to rotate.
4. The adaptive variable pitch wafer scanning system of claim 3, wherein the push block is disposed near an end of the lead screw that is coupled to the motive power device.
5. The adaptive variable pitch wafer scanning system of claim 3, wherein two ends of the spring between the sensor emitter brackets are connected to the sensor emitter brackets, respectively, and two ends of the spring between the sensor receiver brackets are connected to the sensor receiver brackets, respectively.
6. The adaptive variable pitch wafer scanning system of claim 3, wherein a bearing is disposed on the lead screw support, and the lead screw is mounted on the lead screw support via the bearing.
7. The adaptive variable pitch wafer scanning system of any of claims 3-6, wherein the motive device is a motor.
8. The self-adaptive variable-spacing wafer scanning method is characterized by comprising the following steps of:
step 1, the wafer is sent to an adaptive variable pitch wafer scanning system, wherein the adaptive variable pitch wafer scanning system is as claimed in claim 7;
step 2, collecting a wafer size signal through a collecting unit, transmitting the collected wafer size signal to a PLC control unit, determining the rotation quantity of a motor according to the wafer size signal by the PLC control unit, and controlling the motor to rotate;
step 3, the motor drives the screw rod to rotate, the push block moves close to or far away from the screw rod supporting seat along the screw rod, and the distance between the wafer modules is adjusted;
step 4, after the motor rotates, the PLC control unit outputs signals to control the lifting base to ascend to the position of the wafer box, and after the ascending is finished, all the sensor transmitting ends transmit signals to the corresponding sensor receiving ends;
step 5, the sensor receiving end receives a signal from the sensor transmitting end and transmits the received signal back to the PLC control unit, and the PLC control unit integrates the signal and summarizes wafer map data;
and 6, the PLC control unit sends the map data to a computer, and the computer displays the map image of the wafer.
9. The adaptive variable pitch wafer scanning method of claim 8, wherein the collection unit is a scanning gun or a pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111663766.4A CN114496845A (en) | 2021-12-30 | 2021-12-30 | Adaptive variable pitch wafer scanning system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111663766.4A CN114496845A (en) | 2021-12-30 | 2021-12-30 | Adaptive variable pitch wafer scanning system and method |
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| Publication Number | Publication Date |
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| CN114496845A true CN114496845A (en) | 2022-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111663766.4A Pending CN114496845A (en) | 2021-12-30 | 2021-12-30 | Adaptive variable pitch wafer scanning system and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313945A (en) * | 2023-05-24 | 2023-06-23 | 北京锐洁机器人科技有限公司 | Multi-size compatible wafer scanning device and wafer scanning method |
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2021
- 2021-12-30 CN CN202111663766.4A patent/CN114496845A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313945A (en) * | 2023-05-24 | 2023-06-23 | 北京锐洁机器人科技有限公司 | Multi-size compatible wafer scanning device and wafer scanning method |
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