CN114488583A - Adhesion chuck and substrate pasting device suitable for same - Google Patents
Adhesion chuck and substrate pasting device suitable for same Download PDFInfo
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- CN114488583A CN114488583A CN202111680327.4A CN202111680327A CN114488583A CN 114488583 A CN114488583 A CN 114488583A CN 202111680327 A CN202111680327 A CN 202111680327A CN 114488583 A CN114488583 A CN 114488583A
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- chuck
- substrate
- bonding
- base plate
- adhesion
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
The invention relates to the technical field of substrates, in particular to an adhesion chuck and a substrate pasting device suitable for the adhesion chuck, wherein the adhesion chuck comprises: the base, the top fixedly connected with base plate chuck one of base, the top of base plate chuck one is provided with first surface plate, the top of first surface plate is provided with base plate chuck two. The substrate sticking device has the advantages of low manufacturing cost and convenience in maintenance, and the substrate sticking chuck and the substrate sticking device suitable for the substrate sticking device have the advantages of good working environment safety and simple structure, and can be used for avoiding the abrasion of the substrate and facilitating later maintenance.
Description
Technical Field
The invention relates to the technical field of substrates, in particular to an adhesion chuck and a substrate pasting device suitable for the adhesion chuck.
Background
As the information-oriented society has been developed, the demand for display devices has been increasing in various forms, and thus, in recent years, various flat display devices such as LCDs, OELDs, and transparent display panels, some of which have been widely used in real life, have been widely used for mobile image display devices due to their characteristics such as excellent image quality, light weight, thin profile, and low power consumption, and have been formed by injecting liquid crystal between a TFT substrate including electrodes and a CF substrate coated with a phosphor, and a sealing material is provided on the outer surface of the substrate to prevent leakage of liquid crystal material, and a spacer material is disposed between the substrates to maintain the space between the substrates; therefore, when manufacturing the LCD, the TFT substrate and the CF substrate must be manufactured separately, and then the liquid crystal material is injected into the space between the TFT substrate and the CF substrate, and the connection process of the two substrates is a process for determining the quality of the LCD; generally, a substrate attaching process is performed by a substrate attaching apparatus composed of an upper chamber and a lower chamber, and then the inside may be formed in a vacuum state; on the other hand, the adhesion of the substrates according to the above-mentioned prior art and these patents is achieved by pressing the array substrate and the color filters against each other with pressure. For this purpose, the substrate adhering device is provided with two electrostatic chucks arranged to face each other up and down, respectively, and adheres the substrates on these electrostatic chucks, then brings them close to each other while keeping the parallelism of the head front scale precise, and then performs adhesion of the two substrates.
Most of the substrate sticking apparatuses are designed to perform a vacuum process during the substrate sticking, and when the first substrate is transferred, the inside of the substrate sticking apparatus is in an atmospheric pressure state, and then the substrate is sucked by a vacuum suction device, and then when the inside of the substrate sticking apparatus is formed into a vacuum state, the substrate is stuck by an electrostatic chuck, that is, the substrate is supported by two different physical forces, but most of the electrostatic chucks of the conventional substrate sticking apparatuses are manufactured in a form of forming a metal pattern on polyimide, thereby having a disadvantage of high manufacturing cost, and secondly, when the substrate is damaged during the process, foreign particles on the substrate may cause damage to the polyimide film coated on the surface of the electrostatic chuck, thereby affecting the manufacturing progress, and in order to solve the above problems, an adhesive chuck and a substrate sticking apparatus using the same, development is urgently needed.
Disclosure of Invention
The invention aims to provide an adhesion chuck and a substrate pasting device suitable for the adhesion chuck, which have the advantages of low manufacturing cost and convenient maintenance, and solve the problems that most of the electrostatic chucks of the existing substrate pasting devices are manufactured in a mode of forming metal patterns on polyimide, so that the manufacturing cost is high, and secondly, when the process is carried out, if the substrate is damaged, foreign particles on the substrate can damage the polyimide film coated on the surface of the electrostatic chuck, so that the manufacturing progress is influenced.
In order to achieve the above purpose, the invention provides the following technical scheme: an adhesion chuck and a substrate attaching apparatus suitable for the same, comprising: the base, the top fixedly connected with base plate chuck of base is first, the top of base plate chuck is first is provided with first surface plate, the top of first surface plate is provided with base plate chuck two, one side of base plate chuck is first runs through and is provided with a plurality of electric lift round pin, the top of electric lift round pin runs through to the top and the fixedly connected with second base plate of base plate chuck two.
The device is characterized in that a first cavity is arranged above the base and comprises a second surface plate positioned above the base, a bonding chuck is arranged at the top of the second surface plate, a unit viscose module is fixedly connected to the bottom of the bonding chuck and comprises a mounting plate fixedly connected with the bonding chuck, two first bonding rubbers symmetrically arranged are fixedly connected to one side of the mounting plate, second bonding rubbers are arranged on two sides of an inner cavity of the mounting plate, a plurality of lifting structures are arranged at the top of the bonding chuck, the bottoms of the lifting structures are fixedly connected with the second bonding rubbers, vacuum chucks are arranged on two sides of the top of the bonding chuck, the bottoms of the vacuum chucks penetrate through the bottom of the second surface plate and are fixedly connected with a first substrate, and lifting units are fixedly connected to four corners of the top of the base, the top of the lifting unit is fixedly connected with the adhesive chuck.
Further, as a preferable aspect of the present invention, the number of the mounting plates is several, and the mounting plates are arranged on the surface of the bonding chuck in a matrix form.
Further, as a preferred aspect of the present invention, cameras are disposed on both sides of the top of the bonding chuck, lighting devices are fixedly connected to both sides of the bottom of the substrate chuck, first through holes adapted to the cameras are formed in both sides of the top of the second surface plate and the bonding chuck, and second through holes adapted to the lighting devices are formed in both sides of the top of the substrate chuck, the first surface plate and the substrate chuck.
Further, as a preferable aspect of the present invention, the shape of the base is convex.
Further, as a preferred mode of the invention, the bottom of one side opposite to the inner cavity of the bonding chuck is provided with a groove, and the two sides of the top of the substrate chuck are provided with inductors matched with the groove in a display mode.
Further, it is preferable that the second substrate and the first substrate have the same structure.
Further, as one preferable aspect of the present invention, the first adhesive rubber and the second adhesive rubber are addition reaction curable silicone rubber compositions containing a small amount of silicon atom-bonded alkenyl organopolysiloxane, organohydrogenpolysiloxane, and obtaining by curing, as a main component, an addition reaction catalyst or the like.
Further, in a preferred aspect of the present invention, the first substrate chuck is an electrostatic chuck for fixing the second substrate by electrostatic force adsorption.
Further, in a preferred aspect of the present invention, a contact area of the second adhesive rubber with the first substrate is larger than a contact area of the first adhesive rubber with the first substrate.
Further, it is preferable in the present invention that at least one of the first adhesive rubber and the second adhesive rubber has a curved periphery in cross section.
The beneficial effects are that the technical scheme of this application possesses following technological effect: the invention achieves the functions of convenient bonding of the substrate and low manufacturing cost by the matched use of the substrate chuck I, the first surface plate, the substrate chuck II, the electric lifting pin, the second substrate, the second surface plate, the unit adhesive module, the lifting structure, the vacuum chuck, the first substrate and the lifting unit, and has the advantages of convenient bonding of the substrate and good working environment safety of the substrate by the arrangement of the adhesive chuck, simple structure, thereby avoiding the abrasion of the substrate and convenient later maintenance, leading the adhesive chuck and the substrate bonding device suitable for the product to have the advantages of low manufacturing cost and convenient maintenance, and in the actual use process, the adhesive rubber can be used for attaching the substrate, thereby reducing the manufacturing cost, and secondly, the environment of the substrate during bonding can form a processing space which has good safety and simple structure, the static chuck that makes be convenient for later maintenance, solved current substrate adhesion device is the form preparation that forms metal pattern on polyimide mostly to there is the drawback that manufacturing cost is high, secondly when technology goes on, if the damaged condition appears in the base plate damage, foreign matter granule on the base plate can lead to the coating to damage at the polyimide film on static chuck surface, thereby influences the problem of manufacturing progress.
It should be understood that all combinations of the foregoing concepts and additional concepts described in greater detail below can be considered as part of the inventive subject matter of this disclosure unless such concepts are mutually inconsistent.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial side view of the present invention;
FIG. 3 is a partial top view of the present invention;
FIG. 4 is a schematic perspective view of a unit adhesive module according to the present invention;
fig. 5 is a schematic perspective view of the mounting plate, the second adhesive rubber and the lifting structure according to the present invention.
In the figures, the meaning of the reference numerals is as follows: 1. a base; 2. a first substrate chuck; 3. a first surface plate; 4. a substrate chuck II; 5. an electric lift pin; 6. a second substrate; 7. a second surface plate; 8. bonding the chuck; 9. a unit adhesive module; 91. mounting a plate; 92. a first adhesive rubber; 93. a second adhesive rubber; 10. a lifting structure; 11. a vacuum chuck; 12. a first substrate; 13. a lifting unit; 14. a camera; 15. an illumination device; 16. a groove; 17. an inductor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and in order to better understand the technical contents of the present invention, specific embodiments will be described below with reference to the accompanying drawings. In this disclosure, aspects of the present invention are described with reference to the accompanying drawings, in which a number of illustrative embodiments are shown. It should be appreciated that the various concepts and embodiments described above, as well as those described in greater detail below, may be implemented in any of numerous ways. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in figures 1 to 5: the embodiment provides an adhesion chuck and be suitable for substrate sticking device of this product, includes: the base 1, base 1's shape is the convex, base 1's top fixedly connected with base plate chuck one 2, and base plate chuck one 2's top is provided with first surface board 3, and first surface board 3's top is provided with base plate chuck two 4, and one side of base plate chuck one 2 is run through and is provided with a plurality of electric lift round pin 5, and electric lift round pin 5's top is run through to base plate chuck two 4's top and fixedly connected with second base plate 6.
The top of base 1 is provided with first cavity, and first cavity includes the second surface board 7 that is located the base 1 top, the top of second surface board 7 is provided with bonding chuck 8, bonding chuck 8's bottom fixedly connected with unit viscose module 9, unit viscose module 9 includes the mounting panel 91 with bonding chuck 8 fixed connection, one side fixedly connected with of mounting panel 91 has the first bonding rubber 92 of two symmetry settings, the both sides of mounting panel 91 inner chamber all are provided with second bonding rubber 93, first bonding rubber 92 and second bonding rubber 93 are the alkenyl organopolysiloxane that contains a small amount of silicon atom bonding, organohydrogenpolysiloxane, and obtain the addition reaction solidification type silicone rubber composition who is main ingredient with addition reaction catalyst etc. through the solidification, the area of contact of second bonding rubber 93 and first base plate 12 is greater than the area of contact of first bonding rubber 92 and first base plate 12, at least one cross section in first bonding rubber 92 or the second bonding rubber 93 is the periphery of curved surface, bonding chuck 8's top is provided with a plurality of and promotes structure 10, promote structure 10's bottom and second bonding rubber 93 fixed connection, the both sides at bonding chuck 8's top are provided with vacuum chuck 11, vacuum chuck 11's bottom is run through to the bottom of second surface board 7 and fixedly connected with first base plate 12, the structure between second base plate 6 and the first base plate 12 is the same, the equal fixedly connected with in four corners at base 1 top promotes unit 13, the top and the bonding chuck 8 fixed connection of promotion unit 13.
Specifically, the number of the mounting plates 91 is several, and the mounting plates 91 are arranged in a matrix on the surface of the adhesive chuck 8.
In this embodiment: through the setting of mounting panel 91 position, aesthetic property when not only having improved mounting panel 91 and arranging has just increased the convenience of later maintenance.
Specifically, the camera 14 is arranged on each of the two sides of the top of the bonding chuck 8, the illuminating device 15 is fixedly connected to each of the two sides of the bottom of the first substrate chuck 2, the first through hole matched with the camera 14 is formed in each of the two sides of the top of the second surface plate 7 and the top of the bonding chuck 8, and the second through hole matched with the illuminating device 15 is formed in each of the two sides of the top of the first substrate chuck 2, the first surface plate 3 and the second substrate chuck 4.
In this embodiment: the use of the camera 14 and the illumination device 15 in cooperation functions to check whether the second substrate 6 and the first substrate 12 are positioned at the correct joint, the position of the second substrate 6 and the first substrate 12 is observed with the camera 14, and the illumination device 15 functions to illuminate the camera 14.
Specifically, the bottom of the opposite side of the inner cavity of the bonding chuck 8 is provided with a groove 16, and the two sides of the top of the first substrate chuck 2 are provided with inductors 17 matched with the groove 16.
In this embodiment: through the cooperation of recess 16 and inductor 17, the in-process that the first chamber was moving down, when inductor 17 touched the inner wall of recess 16, inductor 17 sent the signal to lift unit 13 this moment, and lift unit 13 closes, has played the effect of avoiding bonding chuck 8 excessive downward movement.
Specifically, the substrate chuck one 2 is an electrostatic chuck, which fixes the second substrate 6 by electrostatic force adsorption.
In this embodiment: through the setting of base plate chuck 2, played and be convenient for fix second base plate 6, also be convenient for the later stage to take out the effect to second base plate 6 to the stability of second base plate 6 has been improved.
The working principle and the using process of the invention are as follows:
the method comprises the following steps: the first chamber and the substrate chuck 2 are in a separated state, then the first substrate 12 is placed at a proper position, the first substrate 12 is adsorbed by the vacuum chuck 11 at the moment, the first substrate 12 can be driven to ascend after being adsorbed by the first substrate 12, and the first substrate 12 which is adsorbed by the vacuum chuck 11 and lifted is attached with the first adhesive rubber 92 and the second adhesive rubber 93 which are arranged on the second surface plate 7;
step two: placing the second substrate 6 in place, then activating the motorized lift pins 5, raising and supporting the second substrate 6 with the motorized lift pins 5, after which the motorized lift pins 5 bring the second substrate 6 down to settle the second substrate 6 on the surface of the first surface plate 3, then attaching the substrate chuck one 2 to the substrate chuck two 4 by electrostatic force;
step three: the first chamber is lowered by the lifting unit 13 until a processing space is formed by the close contact of the first chamber and the substrate chuck 2, when the bonding chuck 8 moves downwards, the bonding chuck 8 can drive the second surface plate 7 to move downwards, and the second surface plate 7 drives the first substrate 12 to align with the second substrate 6 through the transmission of the vacuum chuck 11;
step four: after the alignment is completed, the inside of the first chamber and the substrate chuck one 2 is in a vacuum state for the process, in which state the lifting structure 10 is operated to lift the second adhesive rubber 93 to be separated from the first substrate 12, then the adhesive force between the first substrate 12 and the second adhesive rubber 93 disappears, and the second adhesive rubber 93 does not keep it connected by means of the first adhesive rubber 92, the first substrate 12 is dropped to the side of the second substrate 6 and is bonded;
step five: when the second substrate 6 is attached to the first substrate 12, the first chamber and the first substrate chuck 2 are in a standby state, and then nitrogen is supplied between the first chamber and the first substrate chuck 2, so that the second substrate 6 is combined with the first substrate 12 more firmly;
step six: after the above-mentioned process is accomplished, utilize first base plate 12 to drive first cavity and rise, first cavity separates with base plate chuck 2 this moment, takes out the second base plate 6 and the first base plate 12 of laminating to accomplish the laminating technology, can realize low in manufacturing cost's purpose, and this setting through bonding chuck 8 makes the device simple structure, so that the user later stage is to its maintenance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention should be determined by the appended claims.
Claims (10)
1. An adhesion chuck and a substrate attaching apparatus suitable for the same, comprising: base (1), its characterized in that: the base plate lifting device comprises a base plate (1), a first base plate chuck (2) is fixedly connected to the top of the base plate (1), a first surface plate (3) is arranged on the top of the first base plate chuck (2), a second base plate chuck (4) is arranged on the top of the first surface plate (3), a plurality of electric lifting pins (5) penetrate through one side of the first base plate chuck (2), and the top ends of the electric lifting pins (5) penetrate through the top of the second base plate chuck (4) and are fixedly connected with a second base plate (6);
the improved vacuum bonding device is characterized in that a first cavity is arranged above the base (1), the first cavity comprises a second surface plate (7) positioned above the base (1), a bonding chuck (8) is arranged at the top of the second surface plate (7), a unit viscose module (9) is fixedly connected to the bottom of the bonding chuck (8), the unit viscose module (9) comprises a mounting plate (91) fixedly connected with the bonding chuck (8), two first bonding rubbers (92) symmetrically arranged are fixedly connected to one side of the mounting plate (91), second bonding rubbers (93) are arranged on two sides of an inner cavity of the mounting plate (91), a plurality of lifting structures (10) are arranged at the top of the bonding chuck (8), the bottoms of the lifting structures (10) are fixedly connected with the second bonding rubbers (93), vacuum suction cups (11) are arranged on two sides of the top of the bonding chuck (8), the bottom of vacuum chuck (11) runs through to the bottom of second surface board (7) and fixedly connected with first base plate (12), the equal fixedly connected with in four corners at base (1) top promotes unit (13), the top and the bonding chuck (8) fixed connection of promotion unit (13).
2. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: the number of the mounting plates (91) is several, and the mounting plates (91) are arranged on the surface of the bonding chuck (8) in a matrix form.
3. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: both sides at bonding chuck (8) top all are provided with camera (14), the equal fixedly connected with lighting device (15) in both sides of base plate chuck (2) bottom, the through-hole one with camera (14) looks adaptation is all seted up to the both sides at second surface plate (7) and bonding chuck (8) top, the through-hole two with lighting device (15) looks adaptation is all seted up to the both sides at base plate chuck one (2), first surface plate (3) and base plate chuck two (4) top.
4. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: the base (1) is convex in shape.
5. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: the bottom of one side opposite to the inner cavity of the bonding chuck (8) is provided with a groove (16), and two sides of the top of the substrate chuck (2) are provided with inductors (17) matched with the groove (16) in a display mode.
6. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: the second substrate (6) and the first substrate (12) are identical in construction.
7. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: the first adhesive rubber (92) and the second adhesive rubber (93) are addition reaction curable silicone rubber compositions which contain a small amount of silicon atom-bonded alkenyl organopolysiloxane, organohydrogenpolysiloxane, and which are obtained by curing with an addition reaction catalyst or the like as a main component.
8. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: the substrate chuck I (2) is an electrostatic chuck, and the second substrate (6) is fixed through electrostatic force adsorption.
9. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: the contact area of the second adhesive rubber (93) with the first substrate (12) is larger than the contact area of the first adhesive rubber (92) with the first substrate (12).
10. The adhesion chuck and the substrate attaching apparatus using the same as claimed in claim 1, wherein: at least one of the first bonding rubber (92) or the second bonding rubber (93) has a curved periphery in cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111680327.4A CN114488583A (en) | 2021-12-30 | 2021-12-30 | Adhesion chuck and substrate pasting device suitable for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111680327.4A CN114488583A (en) | 2021-12-30 | 2021-12-30 | Adhesion chuck and substrate pasting device suitable for same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114488583A true CN114488583A (en) | 2022-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111680327.4A Pending CN114488583A (en) | 2021-12-30 | 2021-12-30 | Adhesion chuck and substrate pasting device suitable for same |
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| Country | Link |
|---|---|
| CN (1) | CN114488583A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116387227A (en) * | 2023-06-01 | 2023-07-04 | 苏州赛肯智能科技有限公司 | Four-side positioning grabbing mechanism |
-
2021
- 2021-12-30 CN CN202111680327.4A patent/CN114488583A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116387227A (en) * | 2023-06-01 | 2023-07-04 | 苏州赛肯智能科技有限公司 | Four-side positioning grabbing mechanism |
| CN116387227B (en) * | 2023-06-01 | 2023-08-11 | 苏州赛肯智能科技有限公司 | Four-side positioning grabbing mechanism |
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