CN114481082A

CN114481082A - Be used for face identification light filter coating equipment

Info

Publication number: CN114481082A
Application number: CN202111649984.2A
Authority: CN
Inventors: 徐旻生; 张永胜; 庄炳河; 张晓鹏; 伍发根; 杨凤鸣
Original assignee: Shenzhen Aozhuo Vacuum Equipment Technology Co ltd
Current assignee: Shenzhen Aozhuo Vacuum Equipment Technology Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-05-13

Abstract

The invention discloses a film coating device for a face recognition optical filter, which comprises a film inlet and outlet chamber, a carrying chamber and a processing chamber, wherein two ends of the film inlet and outlet chamber are respectively provided with a gate valve and connected with atmosphere and the carrying chamber in a vacuum sealing manner; the transverse isolation mechanism is arranged in the middle of the processing chamber; the rough pumping set is connected with the wafer inlet and outlet chamber and the carrying chamber in a vacuum sealing way; the carrying system comprises a guide rail, a substrate frame, a clamping mechanism, a sensor and a power assembly which sequentially penetrate through the production line. The middle part of the processing chamber is provided with the plurality of transverse isolation mechanisms, so that the problem of low atmosphere isolation is solved, the ICP air input is increased, the ICP working atmosphere is more stable, the coating pressure is lower, the film quality is more excellent, the production yield is greatly improved, and the cost is greatly reduced.

Description

Be used for face identification light filter coating equipment

Technical Field

The invention belongs to the technical field of vacuum coating, and particularly relates to coating equipment for a face recognition optical filter.

Background

At present, the key technology of face recognition is a high-quality infrared sensor filter with a face recognition function. The infrared sensor filter adopts optical film system design and equipment coating technology, and the infrared sensor filter is manufactured to realize that the average water vapor transmission rate of 400-960 nm is less than 0.5 percent, the average water vapor transmission rate of 920-960nm is more than 93.5 percent, and the transmission rate of 940nm in the central wave band reaches more than 94 percent. The infrared filter is composed of multiple layers of optical coatings, adopts the interference principle, and has much higher technical difficulty compared with the common absorption filter. The performance of the face recognition filter depends on the absorption coefficient of the film, and the low absorption coefficient depends on the purity of the film quality of the film, so that the control of the coating atmosphere is very important for coating the face recognition filter. However, the currently produced infrared sensor filter equipment has the problems of low atmosphere isolation, small ICP air input, unstable and stable working atmosphere, high required coating pressure and the like. The production yield of the infrared sensor optical filter is closely related to the size of the atmosphere isolation ratio, the uniformity, the coating pressure and the like.

Disclosure of Invention

The invention aims to provide a film coating device for a face recognition optical filter, and aims to solve the problems in the background technology. In order to realize the purpose, the invention adopts the technical scheme that:

a coating device for a face recognition optical filter comprises an in-out film chamber, a carrying chamber and a processing chamber, wherein two ends of the in-out film chamber are respectively provided with a gate valve and connected with atmosphere, and the carrying chamber is in vacuum sealing connection; the transverse isolation mechanism is arranged in the middle of the processing chamber, and the rough pumping pump group is connected with the wafer inlet and outlet chamber and the carrying chamber in a vacuum sealing way; a conveying system: comprises a guide rail, a substrate frame, a clamping mechanism, a sensor and a power assembly which sequentially pass through a production line.

Specifically, the number of the cathode systems is not less than 2, and the cathode systems are uniformly distributed on the cavity wall in the processing chamber; ICP oxidation source quantity is no less than 1, and the vacuum pump is the TMP molecular pump, installs in horizontal isolating mechanism's top, and horizontal isolating mechanism is no less than 2 with the quantity of vacuum pump. The in-out wafer chamber in this embodiment is provided with means for moisture condensation and adsorption of contaminant gases including, but not limited to, cold traps, moisture absorbers.

Detailed design of each important part of the production line:

(1) the first gate valve and the second gate valve are designed by adopting gate valves, so that effective partition is realized, process gas is stabilized, and the gate valve is more durable;

(2) the wafer inlet and outlet chamber and the processing chamber are respectively provided with a vacuum gauge for detecting the atmosphere in the vacuum chamber in real time;

(3) the rotatable umbrella stand can be used for simultaneously placing a plurality of substrate smelting tools, and the cathode system is a cylindrical rotating cathode system, so that the film coating is more uniform.

(4) The rough pump set and the preceding stage set are provided with a plurality of pump machines, and redundancy design is adopted, so that continuous production is guaranteed when partial vacuum pumps break down.

The invention has the beneficial effects that: the middle part of the processing chamber is provided with the plurality of transverse isolation mechanisms, so that the problem of low atmosphere isolation is solved, the ICP air input is increased, the ICP working atmosphere is more stable, the coating pressure is lower, and the film quality is more excellent; according to the invention, a plurality of loading and unloading stations and the wafer inlet and outlet chambers are designed, and the gate valves are arranged at two ends of the wafer inlet and outlet chambers, so that the coated substrate is continuously produced, the production efficiency is improved, and the equipment cost is greatly reduced.

Drawings

FIG. 1 is a schematic diagram of an overall structure provided in an embodiment of the present invention;

FIG. 2 is a schematic process flow diagram provided by an embodiment of the present invention;

FIG. 3 is a diagram of an example of a Sensor proofing spectrum according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

1. a loading and unloading station; 2. a sheet inlet and outlet chamber; 21. a first gate valve; 22. a second gate valve; 23. a rough pumping pump set; 3. a transfer chamber; 31. a vacuum manipulator; 4. a process chamber; 41 a cathode system; 42. an ICP oxidizing source; 43. a TMP molecular pump; 44. a lateral isolation mechanism; 45. a backing pump group; 5. a substrate holder; 51. a substrate; 52. a substrate jig; 53. the umbrella stand can be rotated.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Fig. 1 is a schematic view of an overall structure provided in an embodiment of the present invention, fig. 2 is a schematic view of a process flow provided in an embodiment of the present invention, and fig. 3 is a schematic view of a sample spectrum of a Sensor provided in an embodiment of the present invention. As shown in the overall structure diagram of fig. 1, an embodiment of the present invention provides a film coating apparatus for a human face recognition optical filter, including an in-out sheet chamber 2, a carrying chamber 3 and a process chamber 4, wherein two ends of the in-out sheet chamber 2 are respectively provided with a gate valve and connected with the atmosphere, the carrying chamber 3 is in vacuum sealing connection, the carrying chamber 3 is arranged at one side inside the process chamber 4, a vacuum manipulator 31 is installed inside the carrying chamber 3, and the process chamber 4 is further provided inside with an ICP oxidation source 42, an intake reactive gas system, a heating system, a rotatable umbrella stand 53, a cathode system and a vacuum pump; the transverse isolation mechanism 44 is disposed in the middle of the process chamber 4, and the rough pumping set 23 is connected with the wafer inlet/outlet chamber 2 and the transfer chamber 3 in a vacuum-tight manner.

The number of the cathode systems is not less than 2, and the cathode systems are uniformly distributed on the cavity wall in the processing chamber 4; the number of ICP oxidation sources 42 is not less than 1, the vacuum pump is a TMP molecular pump 43 and is arranged on the side surface of a transverse isolation mechanism 44, and the number of the transverse isolation mechanism 44 and the vacuum pump is not less than 2. The present invention provides for a plurality of sensors including, but not limited to, vacuum gauges, thermometers, photosensors.

The piece chamber 2 is connected with the loading and unloading station 1, the loading and unloading station 1 and the piece chamber 2 are not less than 2, and the inside is provided with a device for condensing water vapor and adsorbing impurity gas, including but not limited to a cold trap and a water vapor absorber.

The first gate valve 21 and the second gate valve 22 are designed by adopting gate valves, so that effective partition is realized, process gas is stabilized, and the valve is more durable; the wafer inlet and outlet chamber 2 and the processing chamber 4 are both provided with a water oxygen detector for detecting the atmosphere in the vacuum cavity in real time; the rotatable umbrella stand 53 can be used for simultaneously placing a plurality of substrate jigs 52, so that the production efficiency is accelerated, and the cathode system 41 is a cylindrical rotating cathode system, so that the film coating is more uniform. The rough pump group 23 and the backing pump group 45 are provided with a plurality of pump machines, and a redundant design is adopted, so that continuous production is ensured when part of vacuum pumps break down.

As shown in the process flow diagram of fig. 2, the cleaned substrate 51 is mounted on the substrate holder 5 at the loading and unloading station 1, the first gate valve 21 of the in-out chamber 2 is opened, and the substrate holder 5 is moved into the in-out chamber 2 by the handling system; after all the substrate frames 5 enter the film inlet and outlet chamber 2, closing the first gate valve 21 and the second gate valve 22, starting the rough pumping pump group 23, and after the vacuum value of the film inlet and outlet chamber 2 reaches a preset value, opening the second gate valve 22, and enabling the substrate frames 5 to enter the conveying chamber 3 which is pumped to the vacuum pressure of 0.2-0.3 Pa; in the transfer chamber 3, the vacuum robot 31 transfers the substrate 51 without coating film to the substrate jig 52 on the rotatable umbrella stand 53, and simultaneously takes down the processed substrate 51 and places it on the substrate stand 5; the substrate 51 without the film coating starts to rotate and feed reaction gas on the rotatable umbrella stand 53, the ICP air input is 140-200 sccm, the ICP oxidation source and cathode system 41 is started, an optical film is deposited on the substrate 51, and the cathode atmosphere is isolated from the ICP ion source atmosphere by the transverse isolation mechanism 44; the processed substrate 51 is transported to the in-out sheet chamber 2 through the substrate holder 5 and further transported to the loading/unloading station 1. The lateral isolation mechanism 44 of the present invention can achieve an atmosphere isolation ratio of greater than 10: 1; the coating uniformity is good: the uniformity is better than +/-0.5 percent; the ICP air input is allowed to be large, the ICP air input can reach 140-200 sccm, and the coating pressure is reduced to 0.2-0.3 Pa.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. As used herein, the terms "vertical," "horizontal," "left," "right," and the like are for illustrative purposes only and do not represent the only embodiments, and as used herein, the terms "upper," "lower," "left," "right," "front," "rear," and the like are used in a positional relationship with reference to the drawings.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The above embodiments are only for illustrating the invention and are not to be construed as limiting the invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, therefore, all equivalent technical solutions also belong to the scope of the invention, and the scope of the invention is defined by the claims.

Claims

1. The utility model provides a be used for face identification light filter filming equipment which characterized in that: the device comprises a wafer inlet and outlet chamber, a carrying chamber and a processing chamber, wherein two ends of the wafer inlet and outlet chamber are respectively provided with a gate valve and are connected with the atmosphere, the carrying chamber is in vacuum seal connection, the carrying chamber is arranged on one side in the processing chamber, a vacuum manipulator is arranged in the carrying chamber, an ICP (inductively coupled plasma) oxidation source, a gas inlet reaction gas system, a heating system, a rotatable umbrella stand, a cathode system and a vacuum pump are further arranged in the processing chamber, the rotatable umbrella stand is arranged in the middle of the processing chamber, and the heating system, the cathode system and the vacuum pump are all arranged on the inner wall of the processing chamber; the transverse isolation mechanism is arranged in the middle of the processing chamber, and the rough pumping pump group is connected with the wafer inlet and outlet chamber and the carrying chamber in a vacuum sealing manner.

2. The coating apparatus of claim 1, wherein: the cathode systems are uniformly distributed on the cavity wall inside the processing chamber; ICP oxidation source quantity is no less than 1, the vacuum pump is the TMP molecular pump, the TMP molecular pump is installed in horizontal isolating mechanism's side, horizontal isolating mechanism is no less than 2 with vacuum pump quantity.

3. The coating apparatus of claim 2, wherein: the TMP molecular pumps are all connected to an external backing pump set.

4. The coating apparatus of claim 2, wherein: the in-out sheet chamber, the carrying chamber and the processing chamber are all provided with sensors, and the sensors include but are not limited to a vacuum gauge, a thermometer and a photoelectric sensor.

5. The coating apparatus of claim 4, wherein: and a gate valve is arranged between the sheet inlet and outlet chamber and the loading and unloading station, and the gate valve is designed by a gate valve.

6. The coating apparatus of claim 5, wherein: the in-out sheet chamber is provided with a device for moisture condensation and impurity gas adsorption, including but not limited to a cold trap and a moisture absorber.

7. The apparatus of any one of claims 1 to 6, wherein: the method comprises the following steps:

(1) mounting the cleaned substrate on a substrate holder at a loading and unloading station, opening a first gate valve of a substrate inlet and outlet chamber, and enabling the substrate holder to enter the substrate inlet and outlet chamber through a carrying system;

(2) when all the substrate frames enter the film inlet and outlet chamber, closing the first gate valve and the second gate valve, starting the roughing pump set, when the vacuum value of the film inlet and outlet chamber measured by the vacuum gauge reaches a preset value, opening the second gate valve, and allowing the substrate frames to enter a conveying chamber with the vacuum pressure of 0.2-0.3 Pa;

(3) in the conveying chamber, the vacuum manipulator conveys the substrate without coating to a substrate jig on the rotatable umbrella stand, and simultaneously takes down the processed substrate and places the processed substrate on the substrate stand;

(4) after the substrate without the film is rotated on the rotatable umbrella stand, the air inlet system, the ICP oxidation source system and the cathode system are sequentially started, so that the optical film is deposited on the substrate, and the cathode atmosphere is isolated from the ICP ion source atmosphere by the transverse isolation mechanism; the processed substrate is transported to the in-out chamber through the substrate holder and then to the loading/unloading station.