CN114481080A - Vacuum plating and water plating integrated equipment and production method of ultrathin copper foil - Google Patents
Vacuum plating and water plating integrated equipment and production method of ultrathin copper foil Download PDFInfo
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- CN114481080A CN114481080A CN202111602155.9A CN202111602155A CN114481080A CN 114481080 A CN114481080 A CN 114481080A CN 202111602155 A CN202111602155 A CN 202111602155A CN 114481080 A CN114481080 A CN 114481080A
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- 238000007747 plating Methods 0.000 title claims abstract description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 239000011889 copper foil Substances 0.000 title claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 78
- 238000001704 evaporation Methods 0.000 claims description 101
- 230000008020 evaporation Effects 0.000 claims description 100
- 238000004804 winding Methods 0.000 claims description 94
- 230000007704 transition Effects 0.000 claims description 23
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 20
- 239000010936 titanium Substances 0.000 claims description 20
- 229910052719 titanium Inorganic materials 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 claims description 9
- 238000007738 vacuum evaporation Methods 0.000 claims description 9
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 15
- 239000010408 film Substances 0.000 description 82
- 239000010409 thin film Substances 0.000 description 9
- 238000009834 vaporization Methods 0.000 description 6
- 230000008016 vaporization Effects 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The embodiment of the invention provides vacuum plating and water plating integrated equipment and a production method of an ultrathin copper foil. According to the embodiment of the invention, the evaporated film does not need to be transported to electroplating equipment for electroplating, so that the time and labor consumption of transportation can be avoided, and the problem that the moisture in the air is adsorbed on the film in the transportation process to influence the product quality can be avoided.
Description
Technical Field
The invention relates to the technical field of ultrathin copper foil preparation, in particular to vacuum plating and water plating integrated equipment and a production method of an ultrathin copper foil.
Background
The production process technology of the ultrathin copper foil belongs to the manufacturing technology with high fineness, high specialization degree and high control standard of each link, along with the development of high integration and miniaturization of electronic products, the printed board develops towards the direction of multilayering and high integration, and the line width and the distance of a printed circuit pattern also develop towards the direction of micronization more and more, so that higher requirements are put forward on the reliability of the circuit board. For example, in fine circuits, a thin copper foil is required to have higher stripping performance and effectively reduce or avoid the phenomenon of 'side etching' generated when the circuit is etched, so that the strippable ultrathin copper foil can be widely applied to high-grade, multi-layer, thin and high-density printed circuit boards, and particularly, the wide application of lithium ion batteries in recent years provides a wide market space for the development of the ultrathin copper foil.
The ultrathin copper foil serves as a carrier of a negative active substance and a collector and transmitter of negative electron current in the lithium battery, and the thinner the copper foil is, the greater the effect of improving the energy of the battery is. Taking a lithium battery with the energy density of 260wh/kg as an example, the total mass of a battery core corresponding to 1kwh of electricity is about 3.85kg, the weight of the copper foil is about 0.58kg according to the weight percentage of 15% of the main current 8 μm copper foil, if the thickness of the copper foil is reduced to 6 μm, under the condition that the total area is not changed, the weight of the copper foil is reduced by 25%, and the converted energy density can be increased to 287wh/kg by superposing a 50% porosity copper foil technology, and more electric energy is carried compared with the energy carried by the 8 μm copper foil. However, because the copper foil with the thickness of less than 6 microns is difficult in the process, the thickness of the ultrathin copper foil products of domestic production enterprises is mainly 6-9 microns, the tensile strength can be 300-450MPa, the elongation is more than 3%, and the rough surface profile Rz is less than 2 microns. In the prior art, the equipment for preparing the ultrathin copper foil is prepared by separating an evaporation device and an electroplating device, the transportation consumes time and labor, and the moisture in the air can be adsorbed on a film easily in the transportation process, so that the quality of the product is affected.
Disclosure of Invention
In view of the above, an object of the embodiments of the present invention is to provide an integrated vacuum plating and water plating apparatus and a method for producing an ultra-thin copper foil, so as to solve the problems of time and labor consumption during transportation and the influence on product quality due to the adsorption of moisture in the air on the film during transportation in the prior art.
In order to achieve the above object, in a first aspect, the present invention provides an integrated vacuum plating and water plating apparatus, including a vacuum chamber, a winding device, and an electroplating device, wherein the winding device is configured to wind a thin film, the vacuum chamber is configured to perform vacuum evaporation on the thin film in the winding device, and the electroplating device is configured to electroplate the thin film after the vacuum evaporation.
In some possible embodiments, a transition device is further included between the winding device and the electroplating device, and is used for guiding the film in the winding device to the electroplating device to electroplate the film.
In some possible embodiments, the winding device comprises: the device comprises an evaporation rack, a first evaporation unit, a first steering unit and a first winding and unwinding unit, wherein the first evaporation unit, the first steering unit and the first winding and unwinding unit are arranged on the front side of the evaporation rack; wherein,
the first evaporation unit includes: the first evaporation source, the second evaporation source, the third evaporation source and the fourth evaporation source are sequentially arranged in the middle of the evaporation rack from bottom to top;
the first steering unit includes: the first steering roller, the second steering roller and the third steering roller are sequentially arranged on the evaporation rack from bottom to top and are positioned on the left side and the right side of the first evaporation unit;
first receipts unreel unit includes: first unwinding roller and first wind-up roll, follow supreme setting up in on the coating by vaporization frame, and be located same one side of first coating by vaporization unit.
In some possible embodiments, the first turning roller and the third turning roller are arranged on the left side of the first evaporation unit, and the second turning roller is arranged on the right side of the first evaporation unit;
the first unwinding roller and the first winding roller are arranged on the right side of the first evaporation unit, and the second steering roller is located between the first unwinding roller and the first winding roller.
In some possible embodiments, the winding device further includes: the second winding and unwinding unit, the second evaporation coating unit and the second steering unit are arranged on the rear side of the evaporation coating frame and are symmetrically arranged with the first winding and unwinding unit, the first evaporation coating unit and the first steering unit respectively.
In some possible embodiments, the transition device includes a transition frame, and a first roller disposed on the transition frame, through which the film on the winding device is guided to the electroplating device.
In some possible embodiments, the electroplating device includes an electroplating bath, a first electroplating column is disposed in the electroplating bath, a first titanium blue column and a second titanium blue column are sequentially disposed on the electroplating column from bottom to top, a first conductive roller is disposed between the first titanium blue column and the second titanium blue column, a second roller is disposed on a first side of the electroplating bath, and a winding unit is disposed on a second side of the electroplating bath.
In some possible embodiments, a first nip roller and a second nip roller are disposed between the take-up unit and the plating bath, the first nip roller and the second nip roller being in rolling contact;
and a drying box is arranged between the first flattening roller and the second flattening roller and the winding unit.
In some possible embodiments, the electroplating device further comprises a second electroplating column, a second conductive roller is arranged on the second electroplating column, and the installation height of the second conductive roller in the vertical direction is the same as that of the first flattening roller;
the transition device also comprises a first extrusion roller which is arranged on the transition frame and is in rolling contact with the first passing roller.
In a second aspect, the present invention provides a method for producing an ultra-thin copper foil, the method being based on any one of the vacuum plating and water plating integrated apparatuses described in the first aspect, the method comprising the steps of:
winding the film by a winding device;
putting the wound winding device into a vacuum chamber, and performing evaporation on the film;
and taking out the winding device after vapor deposition, and electroplating the film after vapor deposition by using an electroplating device.
The vacuum plating and water plating integrated equipment provided by the embodiment of the invention comprises a vacuum cavity, a winding device and an electroplating device, wherein the winding device is used for winding a film, the vacuum cavity is used for performing vacuum evaporation on the film in the winding device, and the electroplating device is used for electroplating the evaporated film. According to the embodiment of the invention, the evaporated film does not need to be transported to electroplating equipment for electroplating, so that the time and labor consumption of transportation can be avoided, and the problem that the moisture in the air is adsorbed on the film in the transportation process to influence the product quality can be avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a block diagram of a vacuum plating and water plating integrated apparatus provided in an embodiment of the present invention;
FIG. 2 is a front view of a winding assembly provided in accordance with an embodiment of the present invention;
FIG. 3 is a side view of a transition device provided by an embodiment of the present invention;
FIG. 4 is a front view of an electroplating apparatus according to an embodiment of the present invention;
FIG. 5 is a front view of an integrated vacuum plating and water plating apparatus provided in an embodiment of the present invention;
FIG. 6 is a flow chart of a vacuum evaporation method according to an embodiment of the present invention;
fig. 7 is a flowchart of a method for manufacturing an ultra-thin copper foil according to an embodiment of the present invention.
The reference numbers illustrate:
1. a vacuum chamber; 2. a winding device; 3. an electroplating device; 4. a transition device; 10. an evaporation rack; 101. a first evaporation source; 102. a second evaporation source; 103. a third evaporation source; 104. a fourth evaporation source; 105. a first steering roller; 106. a second turning roll; 107. a third turning roll; 108. a first unwinding roller; 109. a first wind-up roll; 20. a transition frame; 201. a first roller; 202. a first squeeze roll; 30. an electroplating bath; 301. a first plated post; 302. a first titanium blue column; 303. a second titanium blue pillar; 304. a first conductive roller; 305. a second roller; 306. a winding unit; 307. a first nip roll; 308. a second nip roll; 309. a drying box; 310. a second plated post; 311. a second conductive roller.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
As shown in fig. 1 to 5, an integrated vacuum plating and water plating apparatus according to an embodiment of the present invention includes a vacuum chamber 1, a winding device 2, and a plating device 3, where the winding device 2 is used to wind a film, the vacuum chamber 1 is used to perform vacuum evaporation on the film in the winding device 2, and the plating device 3 is used to plate the film after vacuum evaporation. Specifically, the original film is mounted on a winding device 2 to be wound, the winding device 2 is placed in a vacuum chamber 1 after winding to perform vacuum evaporation on the film, the vacuum chamber 1 is opened after evaporation to take out the winding device 2, a window is provided in the winding device 2, the window in the winding device 2 is opened, the film after evaporation is pulled out, and electroplating is performed by an electroplating device 3. According to the embodiment of the invention, the evaporated film does not need to be transported to electroplating equipment for electroplating, so that the time and labor consumption of transportation can be avoided, and the problem that the moisture in the air is adsorbed on the film in the transportation process to influence the product quality can be avoided.
In some embodiments, in order to better introduce the evaporated film into the electroplating device 3 from the winding device 2, a transition device 4 may be further included between the winding device 2 and the electroplating device 3, so as to introduce the film in the winding device 2 into the electroplating device 3 to electroplate the film, by setting the transition device 4, the tension of the film can be better controlled, so that the film can be smoothly introduced into an electroplating bath to be electroplated, thereby avoiding wrinkles or deformation, in addition, by setting the transition device 4, the distance between the winding device 2 and the electroplating device 3 can be smaller, and the time for exposing the film in the air is too long in the process of avoiding the evaporated film from being subjected to the electroplating device 3, thereby avoiding the film from being oxidized, and improving the electroplating quality.
In some embodiments, the winding device 2 includes an evaporation rack 10, and a first evaporation unit, a first steering unit and a first winding and unwinding unit disposed on the front side of the evaporation rack 10, wherein the first evaporation unit includes a first evaporation source 101, a second evaporation source 102, a third evaporation source 103 and a fourth evaporation source 104, and is sequentially disposed at the middle position of the evaporation rack 10 from bottom to top; the first turning unit comprises a first turning roller 105, a second turning roller 106 and a third turning roller 107 which are sequentially arranged on the evaporation frame 10 from bottom to top and are positioned at the left side and the right side of the first evaporation unit; first receipts unreel unit includes: the first unwinding roller 108 and the first winding roller 109 are disposed on the evaporation rack 10 from bottom to top and located on the same side of the first evaporation unit.
In the embodiment of the invention, only one evaporation rack 10, and a plurality of evaporation sources and turning rollers arranged on the evaporation rack 10 are used, so that double-sided multiple evaporation of films can be carried out in a relatively small chamber, and the utilization rate of space is greatly improved; in addition, through setting up a plurality of steering rolls, be convenient for adjust the distance of film in the coating by vaporization source top, enable the film and be in the coating by vaporization distance of a preferred in the top of coating by vaporization source, be convenient for the coating by vaporization of film.
In some embodiments, the first turning roller 105 and the third turning roller 107 are disposed on the left side of the first evaporation unit, and the second turning roller 106 is disposed on the right side of the first evaporation unit; the first unwinding roller 108 and the first winding roller 109 are disposed on the right side of the first evaporation unit, and the second turning roller 106 is located between the first unwinding roller 108 and the first winding roller 109.
In the embodiment of the invention, a plurality of steering rollers, a plurality of winding rollers and a plurality of unwinding rollers are detachably connected with the evaporation rack 10, and the positions of the steering rollers, the winding rollers and the unwinding rollers can be flexibly adjusted.
In some embodiments, a second winding and unwinding unit, a second evaporation unit, and a second steering unit are further disposed at the rear side of the evaporation rack 10, and the second winding and unwinding unit, the second evaporation unit, and the second steering unit are respectively disposed symmetrically to the first winding and unwinding unit, the first evaporation unit, and the first steering unit. According to the embodiment of the invention, the winding parts can be respectively arranged at the front side and the rear side of the evaporation rack 10, two rolls of films can be evaporated at the same time, the vacuum space is saved, and the evaporation efficiency can be greatly improved.
In some embodiments, the transition device 4 includes a transition frame 20, and a first passing roller 201 disposed on the transition frame 20, the film on the winding device 2 is guided into the electroplating device 3 through the first passing roller 201, the film can be guided into the electroplating device 3 at a certain angle through the arrangement of the first passing roller 201, the tension of the film can be better controlled, and wrinkles or deformation of the film can be avoided, in addition, in order to make the film more flat, a first pressing roller 202 can be disposed below the first passing roller 201, the first pressing roller 202 is in rolling contact with the first passing roller 201, the film passes between the first pressing roller 202 and the first passing roller 201, and a pressing force is given to the film through the first pressing roller 202, so that not only the metal material evaporated on the film is made more flat, but also the flatness of the film can be further improved.
In some embodiments, the electroplating apparatus 3 includes an electroplating bath 30, a first electroplating column 301 is disposed in the plating solution of the electroplating bath 30, a first titanium blue column 302 and a second titanium blue column 303 are sequentially disposed on the electroplating column 301 from bottom to top, a first conductive roller 304 is disposed between the first titanium blue column 302 and the second titanium blue column 303, a second roller 305 is disposed on a first side of the electroplating bath 30, and a winding unit 306 is disposed on a second side of the electroplating bath 30. The thin film passes through between the first titanium blue column 302 and the second titanium blue column 303 through the guidance of the first conductive roller 304, the cathode of the thin film is provided by the first conductive roller 304, the anode of the thin film is provided by the first titanium blue column 302 and the second titanium blue column 303, so that the thin film, the first titanium blue column 302 and the second titanium blue column 303 and the plating solution form a plating circulation loop, and the plated thin film is further plated.
In some embodiments, a first nip roller 307 and a second nip roller 308 are provided between the take-up unit 306 and the plating tank 30, the first nip roller 307 and the second nip roller 308 being in rolling contact; the film is flattened by the arrangement of the first flattening roller 307 and the second flattening roller 308, so that the electroplated film can enter the rolling unit more smoothly.
In some embodiments, a drying box 309 is disposed between the first and second flattening rollers 307 and 308 and the winding unit 306, and dries the film before winding, so as to prevent the plating material from falling off and improve the plating quality of the film.
In some embodiments, the electroplating apparatus 3 further includes a second electroplating column 310, a second conductive roller 311 is disposed on the second electroplating column 310, and the installation height of the second conductive roller 311 in the vertical direction is the same as that of the first flattening roller 307. The cathode in the electroplating process can be further increased by arranging the second conductive roller 311, the film electroplating efficiency is improved, in addition, the film can be guided by arranging the second conductive roller 311 on the second electroplating column 310, so that the film can smoothly enter the rolling unit 306, and wrinkles or deformation in the rolling process can be avoided.
As shown in fig. 6, an embodiment of the present invention provides a method for thin film evaporation, which includes:
s61, mounting a first film to be evaporated on a first unwinding roller 108, and unwinding the film through the first unwinding roller 108;
s62, guiding the first roll of film to be evaporated by the first turning roll 105, the second turning roll 106 and the third turning roll 107, so that the first roll of film passes through the first evaporation source 101, the second evaporation source 102, the third evaporation source 103 and the fourth evaporation source 104 in sequence for double-sided evaporation. Specifically, a first evaporation source 101 performs first evaporation on a first surface of a first roll of film, a second evaporation source 102 performs first evaporation on a second surface of the first roll of film, a third evaporation source 103 performs second evaporation on the first surface of the first roll of film, and a fourth evaporation source 104 performs second evaporation on the second surface of the first roll of film;
s63, the first winding roller 109 winds the first film after evaporation.
In the embodiment of the invention, the double-sided repeated evaporation of the film can be realized by fewer winding parts, so that the utilization rate of the cavity space is improved, and the evaporation quality can be improved.
In some embodiments, a second roll of film can be simultaneously evaporated through a second winding and unwinding unit, a second evaporation unit and a second steering unit on the rear side of the evaporation rack 10, so that the evaporation efficiency of the film is greatly improved.
As shown in fig. 7, an embodiment of the present invention provides a method for producing an ultra-thin copper foil, which is based on the above-mentioned vacuum plating and water plating integrated apparatus, and the method comprises the following steps:
s71, winding the film by the winding device 1;
s71, placing the wound winding device 2 in the vacuum chamber 1, and performing vapor deposition on the film;
s71, the film after vapor deposition is taken out of the winding device 2 and plated by the plating device 3.
Specifically, the original film is mounted on the winding device 2 to be wound, the vacuum chamber 1 is opened, the winding device 2 after winding is placed in the vacuum chamber 1 to perform vacuum evaporation on the film, specifically, the evaporation method is as described above, the vacuum chamber 1 is opened after evaporation to take out the winding device 2, the winding device 2 is provided with a window, the window on the winding device 2 is opened, the film after evaporation is pulled out from the window on the winding device 2, the film after evaporation is guided into the electroplating device 3 through the first turning roller 201 in the transition device 4 to be electroplated, and the film after electroplating is wound through the winding unit 306.
In some embodiments, the film can be flattened before being rolled, the film is dried after being flattened, and the dried film is rolled, so that the production quality of the film is improved. According to the embodiment of the invention, the evaporated film does not need to be transported to electroplating equipment for electroplating, so that the time and labor consumption of transportation can be avoided, and the problem that the moisture in the air is adsorbed on the film in the transportation process to influence the product quality can be avoided.
The embodiment of the invention has the following beneficial effects:
1. according to the embodiment of the invention, the evaporated film is not required to be transported to electroplating equipment for electroplating, so that the time and labor consumption of transportation can be avoided, and the problem that the moisture in the air is adsorbed on the film in the transportation process to influence the product quality can be avoided;
2. the winding device provided by the embodiment of the invention has small occupied space, can perform evaporation on two sides of the film, and improves the evaporation quality of the film;
3. the embodiment of the invention can shorten the distance between the winding device and the electroplating device by arranging the transition device, reduce the time of the film in the air and avoid the oxidation of the film.
In the description of the embodiments of the present invention, it should be noted that the terms "upper, lower, inner and outer" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus should not be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted, connected" and the like are to be understood broadly, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. The vacuum plating and water plating integrated equipment is characterized by comprising a vacuum cavity (1), a winding device (2) and an electroplating device (3), wherein the winding device (2) is used for winding a film, the vacuum cavity (1) is used for performing vacuum evaporation on the film in the winding device (2), and the electroplating device (3) is used for electroplating the film subjected to vacuum evaporation.
2. The integrated vacuum plating and water plating equipment as recited in claim 1, characterized in that a transition device (4) is further included between the winding device (2) and the electroplating device (3) for guiding the film in the winding device (2) to the electroplating device (3) to electroplate the film.
3. The integrated vacuum plating and water plating equipment as recited in claim 2, wherein the winding device (2) comprises: the device comprises an evaporation rack (10), and a first evaporation unit, a first steering unit and a first winding and unwinding unit which are arranged on the front side of the evaporation rack (10); wherein,
the first evaporation unit includes: the evaporation device comprises a first evaporation source (101), a second evaporation source (102), a third evaporation source (103) and a fourth evaporation source (104), which are sequentially arranged in the middle of the evaporation rack (10) from bottom to top;
the first steering unit includes: a first steering roller (105), a second steering roller (106) and a third steering roller (107) are sequentially arranged on the evaporation rack (10) from bottom to top and are positioned at the left side and the right side of the first evaporation unit;
first receipts unreel unit includes: and the first unwinding roller (108) and the first winding roller (109) are arranged on the evaporation rack (10) from bottom to top and are positioned on the same side of the first evaporation unit.
4. The vacuum plating and water plating integrated equipment as recited in claim 3,
the first turning roller (105) and the third turning roller (107) are arranged on the left side of the first evaporation unit, and the second turning roller (106) is arranged on the right side of the first evaporation unit;
the first unwinding roller (108) and the first winding roller (109) are arranged on the right side of the first evaporation unit, and the second turning roller (106) is located between the first unwinding roller (108) and the first winding roller (109).
5. The integrated vacuum plating and water plating equipment as recited in claim 4, wherein the winding device (2) further comprises: the second winding and unwinding unit, the second evaporation coating unit and the second steering unit are arranged on the rear side of the evaporation coating frame (10) and are respectively arranged symmetrically to the first winding and unwinding unit, the first evaporation coating unit and the first steering unit.
6. The vacuum plating and water plating integrated equipment as recited in claim 5,
the transition device (4) comprises a transition frame (20) and a first roller (201) arranged on the transition frame (20), and the film on the winding device (2) is guided into the electroplating device (3) through the first roller (201).
7. The vacuum plating and water plating integrated equipment as recited in claim 6,
the electroplating device (3) comprises an electroplating bath (30), wherein a first electroplating column (301) is arranged in the electroplating bath (30), a first titanium blue column (302) and a second titanium blue column (303) are sequentially arranged on the first electroplating column (301) from bottom to top, a first conductive roller (304) is arranged between the first titanium blue column (302) and the second titanium blue column (303), a second roller (305) is arranged on the first side of the electroplating bath (30), and a winding unit (306) is arranged on the second side of the electroplating bath (30).
8. The vacuum plating and water plating integrated equipment according to claim 7, wherein a first flattening roller (307) and a second flattening roller (308) are arranged between the winding unit (306) and the plating bath (30), and the first flattening roller (307) and the second flattening roller (308) are in rolling contact;
a drying box (309) is arranged between the first and second flattening rollers (307, 308) and the winding unit (306).
9. The vacuum plating and water plating integrated equipment according to claim 8, wherein the electroplating device (3) further comprises a second electroplating column (310), a second conductive roller (311) is arranged on the second electroplating column (310), and the installation height of the second conductive roller (311) in the vertical direction is the same as that of the first flattening roller (307);
the transition device (4) further comprises a first extrusion roller (202) which is arranged on the transition frame (20) and is in rolling contact with the first passing roller (201).
10. A method for producing an ultra-thin copper foil, which is based on the integrated vacuum plating and water plating apparatus of any one of claims 1 to 9, comprising the steps of:
winding the film by a winding device (2);
placing the wound winding device (2) into a vacuum chamber (1) and performing evaporation on the film;
the winding device (2) after vapor deposition is taken out, and the film after vapor deposition is electroplated by the electroplating device (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111602155.9A CN114481080A (en) | 2021-12-24 | 2021-12-24 | Vacuum plating and water plating integrated equipment and production method of ultrathin copper foil |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111602155.9A CN114481080A (en) | 2021-12-24 | 2021-12-24 | Vacuum plating and water plating integrated equipment and production method of ultrathin copper foil |
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| CN114481080A true CN114481080A (en) | 2022-05-13 |
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| CN202111602155.9A Pending CN114481080A (en) | 2021-12-24 | 2021-12-24 | Vacuum plating and water plating integrated equipment and production method of ultrathin copper foil |
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