CN218435973U - Production and processing system of conductive film - Google Patents

Abstract

The utility model discloses a conductive film's production and processing system in the production and processing technology field of conductive film, including one or more electroplating unit, the film passes in by electroplating unit, and electroplating unit includes the plating bath, is equipped with plating solution, one or more electroplating device in the plating bath, and electroplating device includes centre gripping in one or more conductive roller group of the film left and right sides, is located the blue group of one or more titanium of both sides about the film, and conductive roller group connects external power source's negative pole, the positive pole of the blue group connection external power source of titanium. The utility model discloses the film centre gripping is between left conducting roller set and the conducting roller set on right side to make the film middle part not contact with the conducting roller, guarantee that film middle part electroplating process does not receive the influence of conducting roller copper facing or crystallization, after the film on back phase excision left and right sides limit, whole film product whole copper facing effect is better.

Description

Production and processing system of conductive film

Technical Field

The utility model relates to a conductive film's production and processing technology field, specific theory relates to a conductive film's production and processing system.

Background

The conductive film is a film having a conductive function. The conductive film is a composite film, the surface of which is a metal layer and the interior of which is a polymer material layer. The conductive film has the advantages of light weight, good conductivity and the like, and is widely applied to the fields of lithium ion batteries and the like.

When the conductive film is prepared in the prior art, generally, the high polymer material is subjected to vacuum plating and then subjected to water plating to produce the conductive film, but in the water plating process, because a negative power supply is connected to the conductive roller, the plating solution can be brought to the conductive roller by the film, so that a layer of metal is plated on the conductive roller, and because the metal and the conductive roller have insufficient adhesive force, the metal can be attached to the produced film, so that the metal cannot be plated on the place where the metal film is attached as required, the metal film subsequently falls off, the thickness and the color of the metal on the film are different, and the product quality is influenced. In addition, because the conduction roller is electrified to generate heat, plating solution on the conduction roller can volatilize and crystallize, and crystallized solute can pierce through the film and form holes in the film, so that the product is scrapped.

There is therefore a need for an electroplating system that can affect the quality of conductive film production by eliminating the problem of copper plating of conductive rollers.

Disclosure of Invention

In order to overcome the not enough of current technique, the utility model provides an it punctures the film because of easily producing the metal crystallization on the conducting roller, influences the defect of film production quality because of easily copper-plating on the conducting roller among the current electroplating system to have solved, provides a conducting film's production system, can eliminate the influence of crystallization or copper-plating to the film on the conducting roller, guarantees the production quality of film.

The utility model discloses technical scheme as follows:

a production and processing system of a conductive film comprises one or more electroplating units, wherein the film passes through the electroplating units, and is characterized in that the electroplating units comprise electroplating baths, electroplating baths and one or more electroplating devices are arranged in the electroplating baths,

the electroplating device comprises one or more conductive roller groups clamped at the left side and the right side of the film and one or more titanium blue groups positioned at the upper side and the lower side of the film, wherein the conductive roller groups are connected with the negative pole of an external power supply, and the titanium blue groups are connected with the positive pole of the external power supply.

According to above-mentioned scheme the utility model discloses, its characterized in that, the conducting roller group is including the last conducting roller that is located the film upside, the lower conducting roller that is located the film downside, go up the conducting roller with conducting roller one-to-one down, just the film by go up the conducting roller with pass down between the conducting roller.

Furthermore, the lower conductive roller is arranged on the inner wall of the electroplating bath through the lower bearing plate on one corresponding side, the upper conductive roller is arranged on the electroplating bath through the upper bearing plate on one corresponding side, and the upper bearing plate can slide up and down along the electroplating bath.

According to the utility model discloses of above-mentioned scheme, its characterized in that, the blue group of titanium is including the last titanium blue that is located the film upside, the lower titanium blue that is located the film downside.

Further, the lower titanium blue is fixed at the bottom of the electroplating bath, and the left side and the right side of the upper titanium blue are arranged at the left side and the right side of the electroplating bath.

Furthermore, the left end and the right end of the upper titanium blue are hung on the groove edge of the electroplating groove;

or, convex bosses are arranged on the left inner part and the right inner part of the electroplating bath, and the left end and the right end of the upper titanium blue are hung on the bosses.

According to the above scheme the utility model discloses, its characterized in that still includes the unwinding device that is located the system front end, is located the coiling mechanism of system rear end.

Furthermore, the front end of the winding device is provided with a trimming device, and the trimming device is used for cutting the left side edge and the right side edge of the film.

According to the above scheme the utility model discloses, its characterized in that, be equipped with into liquid in the plating bath and cross the roller set, the film passes it crosses the roller set and gets into to go into liquid electroplating device.

According to the above scheme the utility model discloses, its characterized in that, be equipped with out the liquid in the plating bath and cross the roller set, the film passes go out behind the liquid cross the roller set by the plating bath is worn out.

According to the above scheme the utility model discloses, its beneficial effect lies in, the utility model discloses the left and right sides in the plating bath sets up the conducting roller group for the film centre gripping is between the conducting roller group on left conducting roller group and right side, and make the film middle part not contact with the conducting roller, guarantees that film middle part electroplating process does not receive the influence of conducting roller copper facing or crystallization, and behind the film on back phase excision left and right sides limit, whole film product whole copper facing effect is better. In addition, the utility model discloses saved the washing to the conducting roller, erodeed isotructure, whole electroplating device is more succinct, and production, processing cost are lower.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of each electroplating unit of the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 2;

fig. 4 is a top view of the present invention;

FIG. 5 is a top view of each electroplating cell of the present invention;

fig. 6 is a schematic structural view of the upper titanium blue/lower titanium blue of the present invention.

In the figures, the various reference numbers are:

110-unwinding roller; 120-a first cambered flattening roll;

210-an electroplating bath;

220-electroplating device;

221 a-a first scaffold; 221 b-a second scaffold; 222-a plating assembly;

2211 a-first driver; 2212 a-second driver;

2221 a-first lower carrier plate; 2221 b-a second lower carrier plate; 2222 a-first upper carrier plate; 2222 b-second upper carrier plate; 2223 a-first lower conductive roller; 2223 b-a second lower conductive roller; 2224 a-first upper conductive roller; 2224b — second upper conductive roller; 2225-lower titanium blue; 2226-Titan blue;

231-first passing roller; 232-second passing roller;

241-a third roller; 242-fourth pass roller;

250-a turning roll;

260-discharging liquid and passing through a roller;

310-a wind-up roll; 320-a second cambered flattening roll;

400-film.

Detailed Description

The invention is further described below with reference to the drawings and the embodiments:

in the traditional conductive film electroplating process, a film is contacted with the whole conductive roller to realize electrification, the conductive roller is easy to generate copper plating or crystallization in the working process, and the phenomena of film perforation, wrinkle and the like can be caused in the contact process of the conductive roller and the film. The whole film product is easy to break after the film is perforated and wrinkled. Therefore, the existing film electroplating product can not solve the problems of copper plating and crystallization of the conductive roller, and the film product is easy to break, thereby affecting the yield of the film product.

As shown in fig. 1 to 6, the present invention provides a system for producing and processing conductive film, which solves the most serious defects of perforation and corrugation in the coating industry. The production and processing system of the conductive film comprises an unreeling device located at the front end of the system, a reeling device located at the rear end of the system, and one or more electroplating units located between the unreeling device and the reeling device, wherein the unreeling device is used for unreeling the film, the unreeled film passes through the electroplating units and is electroplated, and the reeling device is used for reeling the electroplated film.

Preferably, the production processing system of the conductive film comprises 3 electroplating units. The number of the electroplating units should not be too large so as not to affect the tension of the film between the electroplating units.

The utility model provides an unwinding device is including unreeling roller 110 and first arc nip roll 120, and first arc nip roll 120 is located unreel roller 110 and first electroplates between the unit, and film 400 unreels by unreeling roller 110, and the front end of film 400 gets into first electroplating unit after walking around first arc nip roll 120, and first arc nip roll 120 is used for flattening the film 400 after unreeling, and then makes the film tension that gets into in the electroplating unit balanced.

The utility model provides a coiling mechanism includes wind-up roll 310 and second arc nip roll 320, and second arc nip roll 320 is located between last electroplating unit and wind-up roll 310, winds on wind-up roll 310 after second arc nip roll 320 is walked around to the film 400 of electroplating the unit via last, and second arc nip roll 320 is used for flattening to the film 400 after electroplating, and then guarantees that the terminal film tension of this production and processing system is balanced.

The electroplating unit of the utility model comprises an electroplating bath 210, wherein the electroplating bath 210 is internally provided with electroplating solution and one or more electroplating devices 220, the electroplating solution plays a role of electroplating media in the electroplating process, and the electroplating devices 220 are used for realizing the basis of electroplating. The electroplating device 220 includes one or more conductive roller sets clamped at the left and right sides of the film 400, and one or more titanium blue sets positioned at the upper and lower sides of the film 400, wherein the conductive roller sets are arranged in parallel with the titanium blue sets. The conductive roller group is connected with the negative electrode of an external power supply, the conductive roller group is in contact with the film to enable the film to form an electroplating cathode, the titanium blue group is connected with the positive electrode of the external power supply to serve as an electroplating anode, and the conductive liquid serves as an electroplating medium to enable copper ions in the conductive liquid to be electroplated on the film. The utility model discloses an in the electroplating process carry out the centre gripping to the left and right sides limit of film, realized the function of film negative electricity, avoid whole film and conductor roll contact simultaneously, prevent that conductor roll surface copper facing or formation crystallization from influencing the quality of film main part.

In this embodiment, each electroplating unit includes 3 electroplating devices to achieve good electroplating effect without affecting the tension of the film at each position in the electroplating unit.

The conductive roller group includes an upper conductive roller positioned on the upper side of the film 400 and a lower conductive roller positioned on the lower side of the film 400, the upper conductive roller and the lower conductive roller correspond to each other one by one, and the film 400 passes between the upper conductive roller and the lower conductive roller. The upper conductive roller and the lower conductive roller are both arranged in the electroplating bath 210 and clamped at the left side and the right side of the film 400, the film can be dotted through the conductive rollers, and the production quality of the middle part of the film cannot be influenced.

In the present invention, the upper conductive roller includes a first upper conductive roller 2224a and a second upper conductive roller 2224b, and the lower conductive roller includes a first upper conductive roller 2223a and a second upper conductive roller 2223b. The first upper conductive rollers 2224a and the first lower conductive rollers 2223aa are in one-to-one correspondence and are sandwiched between the upper and lower surfaces of the right side of the advancing direction of the film 400, and the second upper conductive rollers 2224b and the second lower conductive rollers 2223b are in one-to-one correspondence and are sandwiched between the upper and lower surfaces of the left side of the advancing direction of the film 400.

The lower conductive roller is disposed on the inner wall of the plating bath 210 through the lower bearing plate corresponding to one side, the upper conductive roller is disposed on the plating bath 210 through the upper bearing plate corresponding to one side, and the upper bearing plate can slide up and down along the plating bath 210. A support is fixed on the electroplating bath 210, the upper bearing plate is connected with the support through a driver (not shown in the figure, the same below) which drives the upper bearing plate to slide up and down along the support, the upper bearing plate is controlled to lift through the driver, and then the lifting of the upper conductive roller is realized, so that the film can be conveniently laid before electroplating on the film, and the film inserting operation is convenient.

Specifically, the first lower conductive roller 2223a is disposed on the inner wall of the plating tank 210 (the right side of the advancing direction of the film 400) through the first lower support plate 2221a, and the second lower conductive roller 2223b is disposed on the inner wall of the plating tank 210 (the left side of the advancing direction of the film 400) through the second lower support plate 2221 b. The first upper bearing plate 2222a (first upper conductive roller 2224 b) is disposed on the first support 221a by a driver, the first support 221a is located at the right side of the advancing direction of the film 400, and the driver drives the first upper bearing plate 2222a to slide up and down along the first support 221 a; the second upper bearing plate 2222b (the second upper conductive roller 2224 b) is disposed on the second support 221b by a driver, the second support 221b is located at the left side of the advancing direction of the film 400, and the driver drives the second upper bearing plate 2222b to slide up and down along the second support 221 b.

Preferably, the driver of each side all includes first driver and second driver, and wherein first driver is used for driving loading board oscilaltion to the realization is inserted the membrane operation, and the second driver is used for finely tuning the loading board position, realizes that the clamping force of film is stable, guarantees the atress balance of film. In the embodiment shown in fig. 3 and 5, the driver located at the right side of the film advancing direction includes a first driver 2211a and a second driver 2212a, the first driver 2211a is used for driving the first upper loading plate 2222a to move up and down, and the second driver 2212a is used for driving the first upper loading plate 2222a to perform fine adjustment.

In order to realize the synchronous movement of the first upper bearing plate 2222a and the second upper bearing plate 2222b, the first driver connected to the first upper bearing plate 2222a and the first driver connected to the second upper bearing plate 2222b may be synchronously driven to realize the synchronous lifting of the first upper conductive roller 2224a and the second upper conductive roller 2224b on the upper side of the film, and the second driver connected to the first upper bearing plate 2222a and the second driver connected to the second upper bearing plate 2222b are respectively connected to different control lines to realize the independent adjustment of the first upper conductive roller 2224a and the second upper conductive roller 2224 b.

The lower conductive roller and the lower bearing plate in the embodiment are detachably connected, and the upper conductive roller and the upper bearing plate are detachably connected, so that the whole electroplating system can be assembled and adjusted as required.

As shown in fig. 6, the middle ti blue group of the present invention can be used as an anode in an electroplating process after being connected to a positive electrode of an external power supply, and includes an upper ti blue 2226 located on an upper side of the thin film 400 and a lower ti blue 2225 located on a lower side of the thin film 400, in a preferred embodiment, the upper ti blue 2226 corresponds to the lower ti blue 2225 one to one, so as to ensure that the upper and lower surfaces of the thin film are uniformly electroplated. The left end and the right end of the groove-shaped structure of the upper titanium blue 2226 are provided with hanging lugs extending outwards, the hanging lugs are used for fixing the upper titanium blue 2226, the structure of the lower titanium blue 2225 can be the same as that of the upper titanium blue 2226, or can be a groove-shaped structure without hanging lugs, and copper balls are contained in the groove-shaped structures of the upper titanium blue 2226 and the lower titanium blue 2225.

Specifically, the lower titanium blue 2225 is fixed to the bottom of the plating tank 210, and may be formed by fixing a single layer of titanium blue, or by fixing a plurality of titanium blues side by side, so that the formed lower titanium blue 2225 is laid on the lower side of the thin film. The arrangement direction of the upper titan blue 2226 can be selected according to the requirement, i.e. the length direction of the upper titan blue 2226 can be parallel to the orientation of the thin film (as shown in fig. 4 and 5), or can be perpendicular to the orientation of the thin film (i.e. perpendicular to the two side walls of the electroplating bath 210). If the length direction of the upper ti blue 2226 is perpendicular to the film direction, the left and right sides of the upper ti blue 2226 are disposed on the left and right sides of the plating tank 210, so that the upper ti blue 2226 is parallel to the conductive roller on the wall of the plating tank 210: the left and right ends of the upper titanium blue 2226 are hung on the groove edge of the electroplating groove 210; alternatively, the plating tank 210 may be provided with protruding bosses (not shown) on the left and right inner portions thereof, and the left and right ends of the upper titanium blue 2226 may be hooked on the bosses.

The arrangement direction of the lower titanium blue 2225 is the same as that of the upper titanium blue 2226, and it is also possible to make the arrangement direction of the lower titanium blue 2225 perpendicular to that of the upper titanium blue 2226. In the embodiment shown in fig. 4 and 5, the upper titanium blue 2226 and the lower titanium blue 2225 are arranged in the same direction, and are in one-to-one correspondence.

In this embodiment, a solution inlet roller set is disposed in the plating tank 210 (the solution inlet roller set is located at the solution inlet end of the plating tank 210), and the thin film 400 passes through the solution inlet roller set and enters the plating apparatus 220. Specifically, the liquid inlet roller group comprises a first roller 231 and a second roller 232, and the first roller 231 corresponds to the second roller 232 in position, so that the tension of the liquid inlet film 400 can be adjusted.

In this embodiment, a liquid outlet roller set is disposed in the plating tank 210 (the liquid outlet roller set is located at the liquid outlet end of the plating tank 210), and the film 400 passes through the liquid outlet roller set and then passes out of the plating tank 210. Specifically, the liquid outlet roller group comprises a third roller 241 and a fourth roller 242, and the third roller 241 corresponds to the fourth roller 242 in position, so that the tension of the liquid outlet film 400 can be adjusted.

Preferably, the liquid outlet end of the electroplating tank 210 is further provided with a turning roller 250 and a liquid outlet roller 260, the turning roller 250 and the liquid outlet roller 260 are positioned at the rear side of the liquid outlet roller group, and the turning roller 250 can further adjust the tension of the film 400 at the liquid outlet end, so that the tension of the film 400 between two electroplating units is prevented from influencing each other, and the tension between the last electroplating unit and a subsequent winding device is also prevented from influencing each other.

In a specific embodiment, the front end of the winding device is provided with an edge cutter, and the edge cutter is used for cutting the left side edge and the right side edge of the film; in another embodiment, the edge of the rolled film can be cut after the rolling device finishes rolling. The main body part of the film can be reserved by cutting off the left side edge and the right side edge of the film, so that the whole film product is qualified in quality.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.

The above exemplary description of the present invention is made in conjunction with the accompanying drawings, and it is obvious that the present invention is not limited by the above manner, and various improvements made by the method concept and technical solution of the present invention or by directly applying the concept and technical solution of the present invention to other occasions without improvement are all within the protection scope of the present invention.

Claims (7)

1. A production and processing system of conductive films comprises one or more electroplating units, wherein the films pass through the electroplating units, and is characterized in that the electroplating units comprise electroplating baths, electroplating baths and one or more electroplating devices are arranged in the electroplating baths,

the electroplating device comprises one or more conductive roller groups clamped at the left side and the right side of the film and one or more titanium blue groups positioned at the upper side and the lower side of the film, the conductive roller groups are connected with the negative pole of an external power supply, the titanium blue groups are connected with the positive pole of the external power supply, the conductive roller groups comprise an upper conductive roller positioned at the upper side of the film and a lower conductive roller positioned at the lower side of the film, the upper conductive roller and the lower conductive roller are in one-to-one correspondence, and the film passes through the space between the upper conductive roller and the lower conductive roller;

the production and processing system of the conductive film further comprises an unreeling device located at the front end of the system and a reeling device located at the rear end of the system, wherein an edge cutter is arranged at the front end of the reeling device and used for cutting the left side edge and the right side edge of the film.

2. The system of claim 1, wherein the lower conductive roller is disposed on the inner wall of the electroplating bath through a lower supporting plate on one side, the upper conductive roller is disposed on the electroplating bath through an upper supporting plate on the other side, and the upper supporting plate can slide up and down along the electroplating bath.

3. The conductive film production and processing system as claimed in claim 1, wherein said group of titanium blues comprises an upper titanium blue on an upper side of the film and a lower titanium blue on a lower side of the film.

4. The system for manufacturing an electroconductive thin film according to claim 3, wherein the lower titanium blue is fixed to the bottom of the electroplating bath, and the left and right sides of the upper titanium blue are disposed on the left and right sides of the electroplating bath.

5. The system for manufacturing an electroconductive film according to claim 4, wherein the left and right ends of the upper titanium blue are hung on the groove edge of the electroplating groove;

or, convex bosses are arranged on the left inner part and the right inner part of the electroplating bath, and the left end and the right end of the upper titanium blue are hung on the bosses.

6. The system of claim 1, wherein a set of inlet flow rollers is disposed in the electroplating bath, and the film passes through the set of inlet flow rollers and into the electroplating apparatus.

7. The system for producing and processing a conductive film according to claim 1, wherein a liquid outlet roller set is arranged in the electroplating bath, and the film passes through the liquid outlet roller set and then passes out of the electroplating bath.

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