CN114473813A - Intelligent polishing device and method for sapphire with special-shaped structure - Google Patents
Intelligent polishing device and method for sapphire with special-shaped structure Download PDFInfo
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- CN114473813A CN114473813A CN202210100330.2A CN202210100330A CN114473813A CN 114473813 A CN114473813 A CN 114473813A CN 202210100330 A CN202210100330 A CN 202210100330A CN 114473813 A CN114473813 A CN 114473813A
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- 238000005498 polishing Methods 0.000 title claims abstract description 138
- 239000010980 sapphire Substances 0.000 title claims abstract description 75
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000006073 displacement reaction Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 19
- 238000003754 machining Methods 0.000 claims description 17
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- 230000007306 turnover Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 18
- 230000009471 action Effects 0.000 abstract description 5
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
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- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Abstract
An automatic polishing device and method for special-shaped sapphire utilize the squeezing action of a grinding head to enable grinding paste to generate micro-cutting action on micro-bulges on each surface of the special-shaped sapphire, and materials are removed. The device comprises a polishing system, a precise displacement system, a clamping system and a clamping system. The polishing system can accurately adjust the position and the angle of the grinding head, and meets the polishing requirement of a complex structure; the precision displacement system can drive the clamping system and the workpiece to move in a horizontal plane, and can adjust displacement according to polishing force data acquired by the polishing system, so that the polishing force is constant, and the processing quality is uniform; the clamping system is responsible for positioning and clamping workpieces, and different clamps are selected according to the structural characteristics of the special-shaped sapphire; the clamping system can realize the work of dismounting, turning over and the like of the workpiece. The invention has the advantages of uniform processing quality, wide application range, high automation degree and small environmental pollution, and can realize high-quality polishing of various complicated structures of the special-shaped sapphire.
Description
Technical Field
The invention belongs to the field of precision/ultra-precision machining, relates to a precision polishing device and method for sapphire, and particularly relates to an intelligent polishing device and method for sapphire with a special-shaped structure.
Background
Sapphire belongs to corundum group minerals, the main component of the sapphire is alumina, the Mohs hardness is 9, the sapphire is second to diamond, and the sapphire has good wear resistance, thermal permeability and dielectric property, so that the sapphire is widely applied to the fields of optics, communication, electronic equipment, national defense and the like. Among them, the sapphire with a special-shaped structure is widely used as an optical element, a mechanical structural member and the like of various high-strength windows in the civil and military fields, a microwave tube medium, ultrasonic conduction, a waveguide laser cavity, a precision instrument bearing, a crucible material, a balance knife edge and the like.
The sapphire processing process involves cutting, rough grinding, finish grinding, polishing and other processes. Polishing is the last step of sapphire processing, and is also the most important step, and the processing quality of the polishing directly influences the service performance of a sapphire workpiece. However, since sapphire itself is extremely hard and has good corrosion resistance, it poses a great difficulty to the polishing process. In addition, for the special-shaped structure sapphire with the structures of tiny blind holes, steps, chamfers, inclined planes, cambered surfaces and the like, the relative positions of the grinding head and each surface of the special-shaped structure sapphire must be strictly ensured during polishing, so that the uniformity of the surface quality after processing is ensured, and higher requirements are provided for the special-shaped structure sapphire polishing device.
Granted patent for invention (CN 106625275A), patent name: a polishing method and a polishing apparatus for 3D sapphire. The patent provides a 3D sapphire polishing method and a device, wherein the device sprays a rubber ball or a ceramic ball with diamond micro powder adhered to the surface through a spray gun, impacts the surface of a sapphire part, and polishes the rough surface of the part by utilizing the impact force of the sapphire part. The method and the device have the defects that the position and the force of the spray head are difficult to accurately control, the polishing precision is difficult to ensure, the surface quality is uneven, and the service performance of the sapphire is seriously influenced. In addition, the polishing force is extremely small, the number of the balls is limited, the polishing efficiency is low, and the sapphire with the special-shaped structure cannot be polished.
Granted patent for invention (CN 111716229A), patent name: an automatic polishing device for sapphire precision machining. This patent provides an automatic burnishing device is used in sapphire precision finishing, and the device retrains by the position of polishing sapphire through spacing clamp splice, telescopic link isotructure, guarantees that it does not take place the displacement on polishing dish. However, the device is only limited to polishing a simple plane, and cannot meet the polishing requirement of the sapphire with a complex structure and a special-shaped structure.
Granted utility model patent (CN 212471012U), patent name: a sapphire surface polishing device for a watch. This patent provides a wrist-watch sapphire surface finish device, and the device has set up telescopic link and universal joint, and the universal joint bottom is equipped with the fixed rod, and the fixed rod is used for gluing the sapphire that needs the polishing, can carry out the burnishing and polishing of multi-angle to the sapphire. The device has the defect that the device cannot polish the sapphire special-shaped structures such as tiny blind holes, steps, cambered surfaces and the like. In addition, the device needs polishing solution to be cleaned in real time in the processing process, and is easy to pollute the environment.
Aiming at the problems that the existing device and method are poor in polishing precision, low in polishing efficiency, easy to pollute the environment in the polishing process and incapable of automatically polishing the sapphire with a special-shaped structure, an effective solution is not available at present. Therefore, the development of the special-shaped structure sapphire intelligent polishing device and method has very important significance.
Disclosure of Invention
Aiming at the problems that the conventional special-shaped structure sapphire is poor in polishing precision and low in polishing efficiency and cannot be automatically polished, the invention provides the intelligent special-shaped structure sapphire polishing device and method which are controllable in polishing force, high in polishing precision, wide in application range and high in processing efficiency.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides an intelligent burnishing device of dysmorphism structure sapphire, burnishing device includes polishing system, accurate displacement system, clamping system, presss from both sides and gets system and bottom plate.
The polishing system comprises a grinding head 8, a tool holder 7, a spindle 6, a spindle seat 4, a vertical linear guide rail 3, a vertical sliding plate 2, an annular rail 1, an annular rail base 9 and a binocular recognition module 28. The binocular recognition module 28 is mounted on the main shaft 6, can be matched with the annular track 1 to recognize workpieces at multiple angles before machining, recognizes different structures on the workpieces, uploads recognition information to the control end, and plans an optimal polishing sequence and polishing track according to different structures of the workpieces so as to improve machining efficiency. The grinding heads 8 are arranged on the main shaft 6 through the tool shank 7, and when different surfaces are polished, the corresponding grinding heads 8 are quickly replaced through rotating the tool shank 7. The spindle 6 is arranged on the spindle seat 4, the force sensor 5 is arranged between the spindle and the spindle seat, acting force between the spindle and the spindle seat can be measured, real-time dynamic data of polishing force can be obtained, the real-time dynamic data of the polishing force is fed back to the precision displacement system to adjust the position of the grinding head 8, the polishing force between the grinding head 8 and a machining surface can be kept within a certain range, and therefore a good machining effect is achieved. The spindle seat 4 is matched with the front surface of the vertical sliding plate 2 through the vertical linear guide rail 3, so that the linear movement of the spindle seat 4 in the radius direction of the annular track 1 can be realized. The annular track 1 and the vertical sliding plate 2 are coupled with each other at the reverse side, so that the vertical sliding plate 2 can move along the annular track 1 in a vertical plane. Two ends of the annular track 1 are fixedly connected with the upper ends of the annular track bases 9 respectively, and the bottoms of the two annular track bases 9 are fixed on the bottom plate. Because the turning radius of the annular track 1 is far larger than the size of the grinding head 8, when the vertical sliding plate 2 moves on the annular track 1 for a certain distance, the grinding head 8 can deflect in a small angle in space. Therefore, the position precision of the grinding head 8 is high, the grinding head 8 can be tightly attached to the structures such as the micro blind holes, the steps, the chamfers, the inclined planes and the cambered surfaces on the workpiece 16, and the smooth operation of the whole polishing process is ensured.
The precise displacement system comprises a working table top 19, a bolt 21, a table top base 20, an upper sliding plate 22, an upper linear guide rail 23, a lower sliding plate 24, a lower linear guide rail 25 and a displacement structure base 26. The working table 19 is arranged above the table base 20, and the working table 19 can rotate to drive the clamping system to rotate. The table top base 20 is connected with the upper sliding plate 22 through a bolt 21. The upper slide plate 22 and the lower slide plate 24 are engaged by an upper linear guide 23, and the upper slide plate 22 can linearly move on the lower slide plate 24. The lower slide plate 24 and the displacement structure base 26 are matched through a lower linear guide rail 25, and the lower slide plate 24 can move linearly on the displacement structure base 26. During the machining process, the workpiece 16 can rotate and move in the horizontal plane by the rotation of the table top and the movement of the upper and lower sliding plates 22, 24 through the operation of corresponding machining programs.
The clamping system comprises a four-jaw chuck 17 and a vice 27. The workpiece 16 is mounted on a four-jaw chuck 17 for positioning and clamping purposes. The four-jaw chuck 17 is installed on the table board through the bolts 18, and when other sapphire workpieces with special-shaped structures are processed, the four-jaw chuck 17 can be detached and replaced by other universal fixtures such as a vice 27. Therefore, the device is suitable for sapphire workpieces with various structures and has better universality.
The clamping system comprises a manipulator 15, a manipulator control rod 14, a manipulator base 13, a clamping mechanism table-board 12 and a clamping mechanism base 11. The manipulator 15 is mounted at one end of the manipulator control rod 14 and can grip the workpiece 16. The manipulator control rod 14 extends through the manipulator base 13 and is rotatable about its axis to effect the turning of the workpiece 16. The manipulator base 13 is arranged on the table top 12 of the clamping mechanism and can rotate along with the rotation of the table top. The gripping mechanism table-board 12 is positioned above the gripping mechanism base 11, and the gripping mechanism base 11 is arranged on the bottom board 10. The clamping mechanism can realize the operations of dismounting, mounting, turning over and the like of the workpiece 16.
An intelligent polishing method for sapphire with a special-shaped structure comprises the following steps:
first, a workpiece 16 is mounted on a four-jaw chuck 17 by a gripping system robot 15;
secondly, starting the binocular recognition module 28, performing multi-angle recognition on the workpiece by matching with the annular track 1, recognizing different structures on the workpiece, uploading recognition information to a control end, and planning an optimal polishing sequence and polishing track according to the different structures of the workpiece;
thirdly, coating the surface of the workpiece 16 with abrasive paste;
and finally, the polishing system and the precise displacement system are cooperatively matched according to a planned polishing route to drive the grinding head 8 and the workpiece 16 to move relatively, and the abrasive particles in the grinding paste generate a micro-cutting effect on the micro-protrusions on each surface of the workpiece 16 under the extrusion action of the grinding head 8 so as to realize the removal of materials. Meanwhile, a force sensor 5 on the polishing system collects real-time dynamic data of the polishing force and feeds the data back to the precision displacement system, and the control of the polishing force is realized through the real-time regulation and control of the precision displacement system, so that the high-quality polishing of each surface of the special-shaped structure sapphire is realized.
The working principle of the invention is as follows: identifying different structures of the workpiece through a binocular identification module, planning an optimal polishing sequence and a polishing track, and then coating grinding paste on the surface of the special-shaped sapphire; mounting the workpiece 16 on the clamping system by the clamping system; the grinding head 8 and the workpiece 16 are driven to move relatively by the polishing system and the precise displacement system, and abrasive particles in the grinding paste generate micro-cutting action on micro-protrusions on each surface of the special-shaped sapphire under the extrusion action of the grinding head 8 so as to remove materials; meanwhile, a closed-loop system formed based on the polishing system and the precise displacement system can monitor and adjust the polishing force in real time so as to realize high-quality polishing of each surface of the special-shaped sapphire.
The technical conception of the invention is as follows:
based on the binocular recognition module, the workpiece is recognized in all directions and multiple angles, and the optimal polishing sequence and polishing track are planned according to the recognized different structures. Based on the annular track polishing system, the position precision of the grinding head is improved, and good contact between the grinding head and each surface of a workpiece is guaranteed, so that the processing requirements on the surfaces of a small blind hole, a step, a chamfer, an inclined plane, an arc surface and the like of the special-shaped structure sapphire are met. The closed loop system formed based on the polishing system and the precise displacement system can monitor and adjust the polishing force in real time, thereby ensuring the processing quality of each surface. The method can effectively solve the problems faced by polishing the sapphire with the special-shaped structure, and can achieve the purposes of high quality, high efficiency and low cost.
The invention has the beneficial effects that: (1) the invention provides an intelligent polishing device and method for sapphire with a special-shaped structure, and effectively solves the problems that the sapphire with the special-shaped structure is poor in polishing precision and low in polishing efficiency, the environment is easily polluted in the polishing process, and automatic polishing cannot be realized. (2) The device is based on binocular recognition module, can rationally plan optimum polishing order and polishing orbit to improve machining efficiency. (3) The device is based on annular track polishing system, can guarantee that the bistrique has higher position precision to guarantee the processingquality of each structure. (4) The device is based on the closed-loop control system, monitors and adjusts the polishing force in real time, and can ensure that the surface quality of each structure is uniform after polishing. (5) The device realizes automatic clamping and turnover of the workpiece through the clamping system, has high automation degree and saves manpower resources.
Drawings
FIG. 1 is a schematic diagram of an overall apparatus for polishing sapphire with a special-shaped structure according to the present invention.
Figure 2 is a partially schematic view of a polishing system of the invention.
FIG. 3 is a schematic view of the precision displacement system and clamping system apparatus of the present invention.
FIG. 4 is a schematic view of the processing of the polished sapphire flat, chamfered structure of the present invention.
FIG. 5 is a schematic view of the processing of polished sapphire circular hole and step structure according to the present invention.
FIG. 6 is a schematic view of the processing of the polished sapphire cambered surface structure of the present invention.
FIG. 7 is a schematic diagram of the present invention for processing a polished sapphire trench structure.
In the figure: 1, an annular track; 2, standing a sliding plate; 3, vertical linear guide rails; 4, a spindle seat; 5 a force sensor; 6, a main shaft; 7, a knife handle; 8, grinding a head; 9, a circular rail base; 10 a bottom plate; 11 a gripping mechanism base; 12 a gripping mechanism table; 13 a manipulator base; 14 a robot control lever; 15 a manipulator; 16 a workpiece; 17 a four-jaw chuck; 18 bolts; 19 a work table surface; 20 a table-board base; 21, a bolt; 22 an upper slide plate; 23, linear guide rails; 24, a lower sliding plate; 25 lower linear guide rails; 26 displacement structure base; 27 a vice; 28 binocular recognition module.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1 to 3, the intelligent polishing device for the sapphire with the special-shaped structure comprises a polishing system, a precise displacement system, a clamping system and a bottom plate.
The polishing system comprises a grinding head 8, a tool shank 7, a spindle 6, a spindle seat 4, a vertical linear guide rail 3, a vertical sliding plate 2, an annular rail 1, an annular rail base 9 and a binocular recognition module 28. The binocular recognition module 28 is mounted on the main shaft 6, can be matched with the annular track 1 to recognize workpieces at multiple angles before machining, recognizes different structures on the workpieces, uploads recognition information to the control end, and plans an optimal polishing sequence and polishing track according to different structures of the workpieces so as to improve machining efficiency. The grinding heads 8 are arranged on the main shaft 6 through the tool shank 7, and when different surfaces are polished, the corresponding grinding heads 8 are quickly replaced through rotating the tool shank 7. The spindle 6 is arranged on the spindle seat 4, the force sensor 5 between the spindle and the spindle seat can measure acting force between the spindle and the spindle seat, and after real-time dynamic data of polishing force is obtained, the real-time dynamic data of the polishing force is fed back to the precision displacement system to adjust the position of the grinding head 8, so that the polishing force between the grinding head 8 and a machining surface can be kept within a certain range. The spindle base 4 can move on the vertical sliding plate 2 along the straight line of the radius direction of the annular track 1. The vertical sliding plate 2 is movable along the endless track 1 in a vertical plane. When the vertical sliding plate 2 moves a certain distance on the annular track 1, the grinding head 8 can deflect slightly in space. The grinding head 8 is closely attached to the structures such as the tiny blind holes, steps, chamfers, inclined planes, cambered surfaces and the like on the workpiece 16, so that the smooth operation of the whole polishing process is ensured.
The precise displacement system comprises a working table top 19, a table top base 20, an upper sliding plate 22, an upper linear guide rail 23, a lower sliding plate 24, a lower linear guide rail 25 and a displacement structure base 26. The working table 19 can rotate, so that the clamping system is driven to rotate. The upper slide plate 22 is linearly movable on the lower slide plate 24. The lower slide plate 24 is linearly movable on the moving structure base. During the machining process, the rotation and the movement of the workpiece 16 in the horizontal plane can be realized through the rotation of the working table top 19 and the movement of the upper sliding plate 22 and the lower sliding plate 24 by running corresponding machining programs.
The clamping system comprises a four-jaw chuck 17 and a vice 27. The workpiece 16 is mounted on a four-jaw chuck 17 for positioning and clamping purposes. The four-jaw chuck 17 is installed on the table board through the bolts 18, and when other sapphire workpieces with special-shaped structures are processed, the four-jaw chuck 17 can be detached and replaced by other universal fixtures such as a vice 27.
The clamping system comprises a manipulator 15, a manipulator control rod 14, a manipulator base 13, a clamping mechanism table-board 12 and a clamping mechanism base 11. The manipulator 15 is mounted at one end of the manipulator control rod 14 and can grip the workpiece 16. The manipulator control rod 14 extends through the manipulator base 13 and is rotatable about its axis to effect the turning of the workpiece 16. The manipulator 15 can rotate along with the rotation of the table top. The clamping mechanism can realize the operations of dismounting, mounting, turning over and the like of the workpiece 16.
Example 1:
aiming at the intelligent polishing device and method for the special-shaped sapphire based on the annular track polishing system, when the plane and the chamfer structure of the upper surface of the special-shaped sapphire are polished, the processing steps are as follows:
the method comprises the following steps:
1) the starting device runs the corresponding program, and the robot 15 holds the workpiece 16 and mounts it to the vise 27. The vice 27 is mounted on the work bench 19 through bolts 18;
2) the binocular vision module 28 is matched with the annular track 1 to recognize the workpieces at multiple angles, recognize different structures on the workpieces, upload recognition information to a control end, and plan an optimal polishing sequence and polishing tracks according to the different structures of the workpieces;
3) applying an abrasive paste to the surface of the workpiece 16;
4) the main shaft 6 starts to rotate, the vertical sliding plate 2 moves on the annular track 1,
5) polishing the upper surface plane and the chamfer structure of the sapphire with the special-shaped structure according to the planned optimal polishing sequence and polishing track;
6) and after polishing is finished, retracting the cutter and stopping the main shaft 6.
Example 2:
aiming at the intelligent polishing device and method for the special-shaped sapphire based on the annular track polishing system, when the special-shaped sapphire central circular hole and the step structure are polished, the processing steps are as follows:
the method comprises the following steps:
1) the starting device runs a corresponding program, and the robot 15 holds the workpiece 16 and mounts it to the four-jaw chuck 17.
The four-jaw chuck 17 is arranged on a working table surface 19 through bolts 18;
2) the binocular vision module 28 is matched with the annular track 1 to recognize the workpieces at multiple angles, recognize different structures on the workpieces, upload recognition information to a control end, and plan an optimal polishing sequence and polishing tracks according to the different structures of the workpieces;
3) applying an abrasive paste to the surface of the workpiece 16;
4) the main shaft 6 starts to rotate, the vertical sliding plate 2 moves on the annular track 1,
5) polishing the central circular hole and the step structure on the special-shaped structure sapphire according to the planned optimal polishing sequence and polishing track;
6) and (5) withdrawing the cutter after polishing is finished, and stopping the main shaft 6.
Example 3:
aiming at the intelligent polishing device and method for the special-shaped sapphire based on the annular track polishing system, when the special-shaped sapphire cambered surface structure is polished, the processing steps are as follows:
the method comprises the following steps:
1) the starting device runs the corresponding program, and the robot 15 holds the workpiece 16 and mounts it with its upper surface facing downward to the vise 27. The vice 27 is mounted on the work bench 19 through bolts 18;
2) the binocular vision module 28 is matched with the annular track 1 to recognize the workpieces at multiple angles, recognize different structures on the workpieces, upload recognition information to a control end, and plan an optimal polishing sequence and polishing tracks according to the different structures of the workpieces;
3) applying an abrasive paste to the surface of the workpiece 16;
4) the main shaft 6 starts to rotate, the vertical sliding plate 2 moves on the annular track 1,
5) polishing the sapphire cambered surface structure with the special-shaped structure according to the planned optimal polishing sequence and polishing track;
6) and (5) withdrawing the cutter after polishing is finished, and stopping the main shaft 6.
Example 4:
aiming at the intelligent polishing device and method for the special-shaped sapphire based on the polishing system of the circular track 1, when the special-shaped sapphire groove structure is polished, the processing steps are as follows:
the method comprises the following steps:
1) the starting device runs a corresponding program, and the robot 15 holds the workpiece 16 and mounts it with its upper surface facing downward on the four-jaw chuck 17. The four-jaw chuck 17 is arranged on a working table surface 19 through bolts 18;
2) the binocular vision module 28 is matched with the annular track 1 to recognize the workpieces at multiple angles, recognize different structures on the workpieces, upload recognition information to a control end, and plan an optimal polishing sequence and polishing tracks according to the different structures of the workpieces;
3) applying an abrasive paste to the surface of the workpiece 16;
4) the main shaft 6 starts to rotate, the vertical sliding plate 2 moves on the annular track 1,
5) polishing the special-shaped structure sapphire groove structure according to the planned optimal polishing sequence and polishing track;
6) and (5) withdrawing the cutter after polishing is finished, and stopping the main shaft 6.
The above-mentioned embodiments only express the embodiments of the present invention, but not should be understood as the limitation of the scope of the invention patent, it should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the concept of the present invention, and these all fall into the protection scope of the present invention.
Claims (2)
1. The intelligent polishing device for the sapphire with the special-shaped structure is characterized by comprising a polishing system, a precise displacement system, a clamping system and a bottom plate;
the polishing system comprises a grinding head (8), a tool handle (7), a spindle (6), a spindle seat (4), a vertical linear guide rail (3), a vertical sliding plate (2), an annular rail (1), an annular rail base (9) and a binocular recognition module (28); the binocular recognition module (28) is arranged on the main shaft (6) and is used for matching with the annular track (1) to recognize workpieces in multiple angles before machining, recognizing different structures on the workpieces, uploading recognition information to the control end, and planning an optimal polishing sequence and polishing track according to the different structures of the workpieces; the grinding heads (8) are arranged on the main shaft (6) through the tool shank (7), and when different surfaces are polished, the corresponding grinding heads (8) are quickly replaced by rotating the tool shank (7); the spindle (6) is arranged on the spindle seat (4), the force sensor (5) is arranged between the spindle and the spindle seat and used for obtaining real-time dynamic data of polishing force, and the polishing force between the grinding head (8) and a machined surface is kept within a certain range by feeding the real-time dynamic data of the polishing force back to the precision displacement system to adjust the position of the grinding head (8); the spindle seat (4) is matched with the front surface of the vertical sliding plate (2) through a vertical linear guide rail (3) and used for realizing the linear movement of the spindle seat (4) in the radius direction of the annular track (1); the reverse surfaces of the annular track (1) and the vertical sliding plate (2) are mutually coupled and used for realizing that the vertical sliding plate (2) moves along the annular track (1) in a vertical plane; two ends of the annular track (1) are fixedly connected with the upper ends of the annular track bases (9) respectively, and the bottoms of the two annular track bases (9) are fixed on the bottom plate; the turning radius of the annular track (1) is larger than the size of the grinding head (8), so that when the vertical sliding plate (2) moves on the annular track (1) for a certain distance, the grinding head (8) can deflect in a small angle in space, and the grinding head (8) is tightly attached to a structure on a workpiece (16);
the precise displacement system comprises a working table top (19), a table top base (20), an upper sliding plate (22), an upper linear guide rail (23), a lower sliding plate (24), a lower linear guide rail (25) and a displacement structure base (26); the working table top (19) is arranged above the table top base (20), and the working table top (19) can rotate to drive the clamping system to rotate; the table-board base (20) is connected with the upper sliding plate (22) through a bolt (21); the upper sliding plate (22) is matched with the lower sliding plate (24) through an upper linear guide rail (23), and the upper sliding plate (22) can linearly move on the lower sliding plate (24); the lower sliding plate (24) is matched with the displacement structure base (26) through a lower linear guide rail (25), and the lower sliding plate (24) can linearly move on the displacement structure base (26); in the machining process, the workpiece (16) can rotate and move in the horizontal plane through the rotation of the table top and the movement of the upper sliding plate (22) and the lower sliding plate (24) by operating corresponding machining programs;
the clamping system comprises a four-jaw chuck (17) and a vice (27); the workpiece (16) is arranged on the four-jaw chuck (17) to realize the purposes of positioning and clamping; the four-jaw chuck (17) is arranged on the table board, and when other sapphire workpieces with special-shaped structures are processed, the four-jaw chuck (17) can be detached and replaced by a vice (27) or other universal fixtures;
the clamping system comprises a manipulator (15), a manipulator control rod (14), a manipulator base (13), a clamping mechanism table-board (12) and a clamping mechanism base (11); the manipulator (15) is arranged at one end of a manipulator control rod (14) and is used for clamping a workpiece (16); the manipulator control rod (14) penetrates through the manipulator base (13) and can rotate around the axis of the manipulator base to turn over the workpiece (16); the manipulator base (13) is arranged on the table top (12) of the clamping mechanism and can rotate along with the rotation of the table top; the table-board (12) of the clamping mechanism is positioned above the base (11) of the clamping mechanism, and the base (11) of the clamping mechanism is arranged on the bottom plate (10); the clamping mechanism can realize the dismounting and turnover of the workpiece (16).
2. The intelligent polishing method for the sapphire with the special-shaped structure, which is realized based on the polishing device as claimed in claim 1, is characterized by comprising the following steps:
firstly, a workpiece (16) is arranged on a four-jaw chuck (17) through a clamping system manipulator (15);
secondly, starting a binocular recognition module (28), performing multi-angle recognition on the workpiece by matching with the annular track (1), recognizing different structures on the workpiece, uploading recognition information to a control end, and planning an optimal polishing sequence and a polishing track according to the different structures of the workpiece;
thirdly, coating the surface of the workpiece (16) with grinding paste;
finally, the polishing system and the precise displacement system are cooperatively matched according to a planned polishing route to drive the grinding head (8) and the workpiece (16) to move relatively, and abrasive particles in the grinding paste generate a micro-cutting effect on micro-protrusions on each surface of the workpiece (16) under the extrusion effect of the grinding head (8), so that the purpose of removing materials is realized; meanwhile, a force sensor (5) on the polishing system collects real-time dynamic data of the polishing force and feeds the data back to the precision displacement system, and the control of the polishing force is realized through the real-time regulation and control of the precision displacement system, so that the high-quality polishing of each surface of the special-shaped structure sapphire is realized.
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