CN114473719B - Microstructure polishing method based on local shear thickening - Google Patents
Microstructure polishing method based on local shear thickening Download PDFInfo
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- CN114473719B CN114473719B CN202210158952.0A CN202210158952A CN114473719B CN 114473719 B CN114473719 B CN 114473719B CN 202210158952 A CN202210158952 A CN 202210158952A CN 114473719 B CN114473719 B CN 114473719B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The application discloses a microstructure polishing method based on local shear thickening, which comprises the following steps: arranging the micro-structure surface of the part and the cutter at intervals; adding polishing solution to coat the surfaces of the cutter and the microstructure; wherein the polishing solution is a non-Newtonian fluid with a shear thickening effect; the part is controlled to rotate, and under the relative shearing motion of the cutter and the surface of the microstructure, the local polishing solution filled in the cutter head can generate a shearing thickening effect, so that an elastic elastomer is formed at the cutter head to serve as a polishing head, and local polishing is realized; the cutter is controlled to run according to the polishing track, so that the polishing of the surface of the whole microstructure is realized, the polished surface of the part is obtained, the polishing mode is flexible, the polished surface can be obtained while the shape and the feature of the microstructure are not damaged, the size of a shear thickening area can be controlled by controlling the radius of the cutter head and the rotating speed of the part, so that the local polishing is realized, and the shape-preserving processing of the part is realized.
Description
Technical Field
The application relates to the field of mechanical manufacturing, in particular to a microstructure polishing method based on local shear thickening.
Background
The complex optical free-form surface is any non-rotation symmetrical surface and is widely applied to different fields due to a plurality of excellent characteristics. Among them, the optical element with the functional surface of complex micro-nano (nano to hundreds of micron-scale) structure is more concerned by researchers due to the attractive development prospect. At present, the ultra-precision cutting method based on the tool servo technology is the mainstream means of the surface processing. However, as the requirement for the surface quality of the microstructure in high-performance optical applications is continuously increased, the surface of the microstructure machined by turning is difficult to meet the requirement for the working performance of an optical system, and a subsequent polishing process is urgently needed to improve the surface quality of the microstructure.
To achieve polishing of free-form surfaces, domestic and foreign researchers have proposed a variety of polishing methods, which can be roughly classified into contact polishing and non-contact polishing according to the mode of action of a polishing tool and a workpiece. The contact polishing mainly comprises polishing methods such as air bag polishing, stress disc polishing, small grinding and polishing disc polishing and the like, wherein in the polishing method, a polishing tool is directly contacted with a workpiece to drive abrasive particles in polishing liquid to carry out micro-cutting on the abrasive particles and the workpiece so as to achieve the purpose of polishing, and meanwhile, the contact pressure and the residence time of the polishing head are controlled to realize the selective removal of a polishing surface. Because the polishing tool is in direct contact with the processed curved surface, the size of the characteristic dimension of the polished structure depends on the size of the polishing tool, the method is generally suitable for polishing macroscopic free curved surfaces, and when the size characteristic of the processed surface reaches tens of microns to hundreds of microns, conformal polishing is difficult to realize by the method. The non-contact polishing mainly comprises polishing methods such as external electromagnetic field auxiliary polishing (such as magnetorheological polishing, electrorheological polishing), shear thickening polishing and the like. In the polishing method, the polishing tool is not directly contacted with the polished surface, the special polishing solution in the gap between the polishing tool and the polished surface is used for polishing, and the selective removal of the polished surface is realized by controlling the residence time and the rheological state of the special polishing solution. In the polishing method, the polishing solution is in direct contact with the workpiece, and although the polishing solution can be well matched with the curved surface to be processed, the stress distribution is still difficult to control to be in a micron order by the conventional polishing means, so that the conformal polishing of the microstructure is difficult to realize. In addition, high-energy beam polishing techniques such as ion beam polishing and laser polishing are available, and although the smoothness of the microstructure surface can be greatly improved by the methods, the surface accuracy is difficult to modify efficiently, and the methods are expensive and very low in efficiency. Overall, there is still a lack of efficient, low-cost deterministic polishing methods for complex optical surfaces with microstructures.
Disclosure of Invention
The invention provides a microstructure polishing method based on local shear thickening, which aims to solve the problem that a high-precision microstructure surface is difficult to obtain in a polishing mode in the related technology.
To solve the above problems, the present application is performed in the following manner:
a microstructure polishing method based on local shear thickening comprises the following steps:
sequentially arranging the part and the cutter along a second direction, and enabling the microstructure surface of the part and the cutter head of the cutter to be arranged at intervals;
setting polishing parameters; wherein the polishing parameters include: polishing track of the tool;
performing a polishing process, the polishing process comprising:
adding polishing liquid to coat the cutter and the surface of the microstructure; wherein the polishing solution is a non-Newtonian fluid with a shear thickening effect;
the part is controlled to rotate, so that the cutter and the surface of the microstructure are subjected to relative shearing movement, the local polishing solution filled in the cutter head generates a shearing thickening effect, and an elastic elastomer is formed at the cutter head to serve as a polishing head, so that local polishing is realized;
and under the condition that the local polishing solution of the tool bit is in a shear thickening state, controlling the tool to run according to a polishing track so as to polish the surface of the whole microstructure.
Furthermore, the cutter is a turning tool;
before the part and the cutter are sequentially arranged along the second direction and the microstructure surface of the part and the cutter are arranged at intervals, the microstructure polishing method further comprises the following steps:
sequentially arranging the part and the cutter along a second direction, and setting cutting parameters; wherein the cutting parameters include: the cutting path of the tool;
performing a cutting process; the cutting process comprises: controlling the part to rotate, and enabling the cutter to cut the part along the cutting track to obtain the microstructure surface of the part;
the polishing parameters further include: a theoretical clearance value; the theoretical clearance value is a constant, and the polishing track is generated by moving the theoretical clearance value along the direction away from the part and towards the second direction along the cutting track.
Further, the cutting trajectory and the polishing trajectory are determined in the following manner:
the instantaneous rotation angle value of the part is obtained,
acquiring a first coordinate value of the cutter along a first direction when the cutter rotates at the instant angle value, wherein the first direction and a second direction form an included angle;
generating a second cutting coordinate value and a second polishing coordinate value of the tool in a second direction based on the first coordinate value and the instantaneous rotation angle value; wherein the second buffing coordinate value = the second cutting coordinate value + the theoretical clearance value;
generating a cutting trajectory based on the first and second cutting coordinate values, and generating a polishing trajectory based on the first and second polishing coordinate values.
Further, the cutting parameters further include: and setting the radius of the tool bit of the tool.
Further, the polishing parameters further include: polishing speed of the part.
Further, a theoretical gap value is set based on the material of the part and the concentration of the polishing liquid.
Further, the polishing fluid includes abrasive particles, deionized water, and a shear thickening phase.
Further, the microstructure polishing method further includes:
and judging whether the surface polishing degree of the part after polishing reaches a preset polishing degree, if not, returning to the polishing process, and if so, stopping polishing.
A part is processed by adopting a microstructure polishing method.
The invention has the following beneficial effects:
the microstructure polishing method based on the local shear thickening is carried out according to the following steps: arranging the micro-structure surface of the part and the cutter at intervals; adding polishing liquid to coat the cutter and the surface of the microstructure; wherein the polishing solution is a non-Newtonian fluid with a shear thickening effect; the part is controlled to rotate, and under the relative shearing motion of the cutter and the microstructure surface, the local polishing solution filled in the cutter head can generate a shearing thickening effect, so that an elastic elastomer is formed at the cutter head to serve as a polishing head, and local polishing is realized; and controlling the cutter to run according to the polishing track Q, further polishing the surface of the whole microstructure, and obtaining the polished surface of the part.
The polishing liquid can be effectively attached to the cutter by utilizing the shear thickening effect so as to be used as a polishing head, and the polishing mode by utilizing the shear thickening effect of the polishing liquid can ensure that the polishing liquid and the surface of the microstructure and the surface of the cutter have higher matching degree, realize flexible polishing and further realize shape-preserving processing. The flexible polishing mode is particularly suitable for polishing the surface of the microstructure so as to obtain the surface of the microstructure with high precision without damaging the appearance characteristics of the part.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a general schematic of a part being processed by the polishing method of the present invention;
FIG. 2 is an enlarged schematic view at I of FIG. 1 in the polishing method of the present invention;
FIG. 3 is an enlarged schematic view at II of FIG. 2 in the polishing method of the present invention.
Reference numerals:
100-machine tool, 110-main shaft, 120-nozzle,
200-parts, 210-microstructured surface,
300-cutter, 400-polishing solution,
X-first coordinate value, Z-second polishing coordinate value,
L-instantaneous polishing width, P-instantaneous pressure, G-instantaneous clearance value, R-tool bit radius and theta-instantaneous rotation angle value.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 to 3, the present application provides a microstructure polishing method based on local shear thickening, the microstructure polishing method is mainly used for polishing a microstructure surface 210, the microstructure surface 210 is a microstructure feature having a specific shape existing on a part surface, the microstructure surface 210 can enable the part surface to have some specific physical and chemical functions, such as superhydrophobicity, drag reduction, stealth, and the like, and the microstructure surface 210 can enable the part 200 to have a wide application prospect in the fields of optics, aviation, aerospace, and the like.
Taking an optical component as an example, in order to improve the quality of the microstructure surface 210 of the optical component, the quality of the microstructure surface 210 is usually required to be polished, however, when the precision of the microstructure surface 210 reaches tens to hundreds of micrometers, the existing related polishing technology is difficult to achieve conformal polishing, difficult to efficiently correct the surface type precision, and further difficult to obtain a high-precision microstructure surface 210 component. To solve the technical problem, the following detailed description is provided:
the microstructure polishing method based on local shear thickening comprises the following steps:
first, the part 200 and the tool 300 are sequentially positioned in a second direction with the microstructured surface 210 of the part 200 spaced from the tool 300. In this step, the microstructured surface 210 of the part 200 is typically cut or the like, and the part 200 may be clamped to a polishing apparatus, such as a spindle of a polishing machine or the like, in which case the part 200 may be clamped to the spindle 110 of the machine tool 100, and the second direction may be the axial direction of the spindle of the machine tool 100, typically the axial direction of the spindle of the machine tool 100 coincides with the axial direction of the part 200. And tool 300 may also be clamped to machine tool 100.
Then, setting polishing parameters; wherein the polishing parameters include: the polishing trajectory of the tool 300 is denoted as Q here. The polishing track Q is a feed path of the cutter 300 in the polishing process, the polishing track Q is obtained by calculation according to the geometric morphology of the microstructure surface 210, the motion of the polishing track Q is usually executed through a fast cutter 300 servo system (FTS), and the fast cutter 300 servo system (FTS) is suitable for processing curved lenses, mirror surfaces and the like, has high precision and fast response speed, and is widely applied to optical element processing.
Then, a polishing process is performed, the polishing process including the steps of:
adding the polishing solution 400 to coat the cutting tool 300 and the microstructure surface 210 with the polishing solution 400; the polishing liquid 400 is a non-Newtonian fluid having a shear thickening effect.
The control part 200 rotates, and under the relative shearing motion of the cutter 300 and the microstructure surface 210, the local polishing solution 400 filled at the tool bit of the cutter 300 generates a shear thickening effect, so that an elastic body with elasticity is formed at the tool bit to act as a polishing head, and local polishing is realized. The shear thickening effect of non-Newtonian fluids, shear thickening also known as dilatancy, is used herein to refer to the behavior of non-Newtonian fluids in which the viscosity of the system exhibits an order of magnitude increase with increasing shear rate or shear stress. When the spindle 110 of the machine tool 100 drives the part 200 to rotate, the rotation speed of the part 200 is the polishing speed in the polishing process, the rotation speed of the part 200 can reach a higher speed, generally 100 to 2000r/min, and under the high-speed shearing relative motion of the cutter 300 and the microstructure surface 210, the local polishing solution 400 filled in the cutter head generates a shearing thickening effect so as to be in a shearing thickening state, thereby realizing the local polishing of the microstructure surface 210.
It should be noted here that not all the slurry 400 is thickened, and only the slurry 400 existing at a local position of the cutter head exhibits a thickening effect, and therefore the shear rate is high here. Meanwhile, the smaller the clearance of the microstructured surface 210 from the tool tip, the higher the relative velocity, and the greater the shear rate. While the closer the radiused edge of the tool tip is to the edge, i.e., further from the microstructured surface 210, the greater the clearance, the lower the shear rate, and the less the shear rate is to a certain degree, the absence of a thickening effect. Therefore, the polishing area can be adjusted by adjusting the radius of the tool bit 300 and the rotating speed of the part 200
And under the condition that the local polishing solution 400 of the tool bit is in a shear thickening state, controlling the tool 300 to run according to the polishing track Q, so that the whole microstructure surface 210 is polished, and the polished surface of the part 200 is obtained. Since the polishing solution 400 is in a shear-thickening state at this time, the polishing solution can be effectively attached to the cutter 300, so that the cutter 300 serves as a carrier for the polishing solution 400 to control the polishing solution 400 coated on the tool bit to form a shape consistent with the tool bit, thereby enabling the polishing solution 400 to serve as a polishing head.
It can be seen that, by using the shear thickening effect of the polishing solution 400 to polish, the polishing solution 400 and the microstructure surface 210, and the polishing solution 400 and the surface of the tool 300 have a high matching degree, so as to achieve flexible polishing; in addition, the range of the shear thickening region can be controlled by controlling the radius of the tool bit, and then the shear thickening region of the polishing head to the microstructure surface 210 is controlled, so that local polishing is realized, and conformal machining is realized. This approach is particularly useful for polishing the microstructured surface 210 to obtain a highly accurate microstructured surface 210 without damaging the topographical features of the part 200.
Further, in the present application, since the polishing of the part 200 is implemented on the machine tool 100, the tool 300 may be set as a turning tool.
Meanwhile, before the above-mentioned steps of sequentially arranging the part 200 and the tool 300 in the second direction and arranging the microstructured surface 210 of the part 200 and the tool 300 at a distance, the microstructure polishing method of the present application further includes:
sequentially arranging the part 200 and the cutter 300 along a second direction, and setting cutting parameters; wherein the cutting parameters include: the cutting path of the tool 300 is referred to as "Q" herein. The cutting path is calculated based on the geometry of the surface 210 of the microstructure to be machined, and the motion of the tool 300 can be controlled by a fast tool 300 servo (FTS), on which the tool 300 can be clamped.
Performing a cutting process; the cutting process comprises: the spindle 110 of the machine tool 100 controls the part 200 to rotate and the tool 300 cuts the part 200 along a cutting trajectory Q' to obtain the microstructured surface 210 of the part 200. Specifically, the part 200 is rotated by the spindle 110, and the tool 300 is fed according to a predetermined cutting trajectory Q', so as to cut off the surface material of the part, thereby obtaining the microstructured surface 210. Here, the cutting locus Q ' may be equivalent to a generatrix of the microstructure surface 210, for example, the cutting locus Q ' is a straight line perpendicular to the direction of the main axis 110, so that the microstructure surface 210 is a plane, for example, the cutting locus Q ' is an inclined straight line, so that the microstructure surface 210 is a conical surface or a circular table surface, for example, the cutting locus is an arc line, so that the microstructure surface 210 is a spherical surface, the cutting locus may also be an arbitrary irregular curve, so that the microstructure surface 210 is a surface of revolution generated according to the irregular curve, and details thereof are not described here. It should be noted that during the process of cutting the part 200, the cutting fluid may be sprayed through the nozzle 120 of the machine tool 100 to reduce the temperature and remove the residual chips, which will not be described in detail herein. It should be noted that the nozzles 120 spray the cutting fluid when the cutting process is performed, and the polishing fluid 400 can be sprayed by different nozzles 120 when the polishing process is performed, or can be sprayed by the same nozzle 120, which is not described in detail herein.
The polishing parameters further include: theoretical gap value, here denoted as G 0 (ii) a Theoretical clearance value G 0 Constant, the polishing trace Q is the theoretical clearance value G of the cutting trace Q' moving in the second direction (i.e. the direction of the spindle 110) and in the direction away from the part 200 0 And this generation is also performed by the fast tool 300 servo system.
As can be seen, in the above-mentioned microstructure polishing method, the cutting tool 300 plays a cutting role in the cutting process, and the cutting tool 300 is used as a polishing head in cooperation with the polishing liquid 400 in the polishing process, so that the reuse of the cutting tool 300 is realized. In the conversion process of the cutting process and the polishing process, the part 200 does not need to be transferred, specifically, the part 200 does not need to be transferred from the cutting machine tool 100 to a polishing machine or other equipment, so that errors caused by secondary clamping and the like of the part 200 can be avoided, the processing consistency is ensured, the polishing precision of the part 200 can be improved, and the method is more suitable for polishing the microstructure surface 210 of the part 200 and is easy to realize conformal processing.
Meanwhile, the above process is equivalent to that after the tool 300 cuts the part 200 according to the set cutting path (i.e. the cutting path Q'), the part 200 is shifted backwards by a certain distance (i.e. the theoretical clearance value G) relative to the part 200 0 ) And further follows a cutting trajectory Q'The equidistant path runs a single pass (i.e., polishing trace Q). Therefore, in the polishing process, the microstructure surface 210 of the part 200 and the polishing track Q keep good consistency and matching degree, the operation of the process is completely guaranteed by the precision of a servo system (FTS) of the fast tool 300, the interference of human factors and the like is avoided, and the effective polishing of the microstructure surface 210 is further guaranteed.
The concentration of the polishing solution 400 is determined by the mixture ratio of the components. Generally, polishing fluid 400 can include abrasive particles, deionized water, and a shear thickening phase, where the addition of the shear thickening phase can render polishing fluid 400 a non-Newtonian fluid and have a shear thickening effect, such as where the shear thickening phase is starch, or where the shear thickening phase is a combination of silica and polyethylene glycol, and the like. The abrasive particles, the deionized water and the starch are 5 wt%, 45 wt% and 50 wt% based on the weight ratio.
Still further, the cutting trajectory Q' may be determined in the following manner:
the instantaneous rotation angle value of the part 200, here denoted as θ, is obtained. The instantaneous rotation angle value θ is an angle at which the spindle 110 of the machine tool 100 drives the part 200 to rotate after a certain time.
When the instantaneous rotation angle value θ is obtained, a first coordinate value of the tool 300 along a first direction is obtained, where the first coordinate value is denoted as X, and the first direction and the second direction form an included angle with each other. As described above, the second direction is an axial direction of the part 200 (also an axial direction of the main shaft 110), and the first direction may be a radial direction of the part 200, and the first direction and the second direction may be perpendicular to each other.
Based on the first coordinate value X and the instantaneous rotation angle value θ, a second cutting coordinate value of the tool 300 in the second direction is generated, where the second cutting coordinate value is denoted as Z'.
The cutting trajectory Q' of the tool 300 is generated in the above manner as explained below:
as described above, the instantaneous rotation angle value of the part 200 is θ, the first coordinate value is X, and the second cutting coordinate value is Z ', the cutting coordinate point H' = (X, Z ') of the tool 300 on the cutting trajectory Q'.
Where the instantaneous rotation angle value θ, the first coordinate value X, and the second cutting coordinate value Z ' have a one-to-one correspondence relationship, for example, when the instantaneous rotation angle value θ =1 ° of the part 200, the first coordinate value X =10, and the second cutting coordinate value Z ' =0, then the cutting coordinate point H ' = (10,0), and when the instantaneous rotation angle value θ =2 ° of the part 200, the first coordinate value X =9.8, and the second cutting coordinate value Z ' = -0.1, then the cutting coordinate point H ' = (9.8, -0.1), and so on.
It should be understood that the foregoing is by way of example only. When the microstructure surface 210 cut by the tool 300 is a regular surface, there may be a specific functional relationship between the instantaneous rotation angle θ, the first coordinate value X and the second cutting coordinate value Z', such as: x (θ) =5 × θ, Z' (X) =0.1 × X (θ).
When the microstructure surface 210 cut by the tool 300 is an irregular surface, it cannot be expressed by a specific functional relation, and the cutting track can be generated by a CAM (computer Aided Manufacturing) method. Specifically, common software such as UG, MASTERCAM, and the like can be selected to establish the part 200 model; then, based on the part 200 model, cutting coordinate points H 'corresponding to the respective instantaneous rotation angle values θ are generated in the three-dimensional software, and in the case where the number of cutting coordinate points H' is sufficiently large, the plurality of cutting coordinate points H 'can be fitted into a cutting trajectory Q' of the tool 300, which may be referred to as Q '= { X, Z' }, that is, the cutting trajectory Q 'is a set of points of the plurality of cutting coordinate points H', in other words, the cutting trajectory Q 'is generated based on the first coordinate value X and the second cutting coordinate value Z'.
It should be understood that, the generation of the plurality of cutting coordinate points H 'through three-dimensional software simulation modeling and the fitting of the plurality of cutting coordinate points H' into the cutting trajectory Q 'are CAM (computer Aided Manufacturing) means commonly used in machining, and those skilled in the art can select appropriate software to perform simulation modeling according to the relevant expressions and generate a tool path (i.e., the cutting trajectory Q') required by machining, which will not be described in detail herein.
On the basis of the generation of the cutting path Q', a polishing path Q can be generated, which can be determined in the following manner:
first, as described above, the instantaneous rotation angle value θ of the part 200 is acquired, and the first coordinate value X of the tool 300 in the first direction at the instantaneous rotation angle value θ is acquired.
Then, a second polishing coordinate value of the tool 300 in the second direction is generated based on the first coordinate value X and the instantaneous rotation angle value θ, where the second polishing coordinate value is denoted as Z. The polishing coordinate point H = (X, Z) of the tool 300 on the polishing locus Q.
As can be seen from the above, the polishing trace Q and the cutting trace Q 'are maintained at the same distance, i.e., the distance between the polishing trace Q and the cutting trace Q' is constant at the theoretical clearance value G 0 。
Thus, the instantaneous rotation angle value theta, the first coordinate value X and the second polishing coordinate value Z are in one-to-one correspondence, and the second polishing coordinate value Z = Z' + G 0 That is, in the case where the instantaneous rotation angle value theta is identical to the first coordinate value X, the interval between the second cut coordinate value Z 'and the second finish coordinate value Z' is always maintained at the theoretical clearance value G 0 I.e., polishing coordinate point H = (X, Z) = (X, Z' + G) 0 ). And polishing track Q = { X, Z } = { X, Z' + G 0 I.e., the polishing locus Q is a point set of a plurality of polishing coordinate points H, in other words, the polishing locus Q is generated based on the first coordinate value X and the second polishing coordinate value Z.
In summary, the instantaneous rotation angle θ, the first coordinate value X, the second cutting coordinate value Z' and the second polishing coordinate value Z all maintain a one-to-one relationship, for example, set as the theoretical clearance value G 0＝ 1, at the instant rotation angle value θ =1 ° of the part 200, the first coordinate value X =10, and the second cutting coordinate value Z '=0, and the second finishing coordinate value Z = Z' + G 0 =1, when the instantaneous rotation angle value θ =1 °, the cutting coordinate point H' = (10,0), and the polishing coordinate point H = (10,1); and the instantaneous rotation angle value θ =2 ° of the part 200, the first coordinate value X =9.8, and the second cutting coordinate value Z '= -0.1, and the second finishing coordinate value Z = Z' + G 0 =0.9, thenWhen the instantaneous rotation angle value θ =2 °, the cutting coordinate point H '= (9.8, -0.1), and the polishing coordinate point H = (9.8,0.9) ·.. It can be seen that, when the part 200 rotates through the same angle regardless of the polishing process or the cutting process, the cutting position of the tool 300 with respect to the part 200 and the polishing position of the tool 300 with respect to the part 200 are matched with each other, specifically, the cutting position and the polishing position are kept equal in the first direction (both are the first coordinate value X), and the polishing position are kept equidistant in the second direction (the second polishing coordinate value Z — the second cutting coordinate value Z' = the theoretical clearance value G0), which can further improve the precision of the polishing of the part 200. Generally speaking, as a result of practical experience, the theoretical gap value G0 is between tens of microns and hundreds of microns, and the above-mentioned values are omitted from the measurement units, for example, when the concentration of starch in the polishing solution 400 is 50%, the theoretical gap value G0 has a good polishing effect at 30-50 microns, and will not be described in detail herein.
Further, the cutting parameters further include: the edge radius of the cutter 300 is set, and here, the edge radius of the cutter 300 is represented as R, and the edge radius R is constant, and can be determined by sharpening the cutter 300 or the like.
By adjusting the tool tip radius R, the size of the shear-thickening region generated by the slurry 400 at the tool tip can be adjusted, specifically, the instantaneous gap between the microstructured surface 210 and the tool 300 during polishing of the microstructured surface 210 is denoted as G, and the instantaneous pressure of the tool 300 against the microstructured surface 210 is denoted as P.
Wherein the instantaneous clearance value G is the actual spacing between the microstructured surface 210 and the tool 300 as the polishing progresses, since the spacing between the cutting trajectory Q' and the polishing trajectory Q is the theoretical clearance value G 0 Ideally then, the spacing between the microstructured surface 210 and the tool 300 should also be maintained at the theoretical clearance value G during the polishing of the part 200 0 While the spacing between the microstructured surface 210 and the tool 300 remains constant, the tool 300 maintains a constant theoretical pressure P on the microstructured surface 210 at a constant pressure value 0 。
However, in the actual cutting process, the polishing track needs to be adjusted according to the characteristics of the microstructure surface 210 to ensure that over-polishing or under-polishing does not occur, theoreticallyGap value G 0 Real-time adjustment is required, which notes the instantaneous gap value as G.
Since the instantaneous pressure P generally increases as the instantaneous clearance value G decreases, the theoretical clearance value G can be adjusted 0 The instantaneous clearance value G is controlled to control the instantaneous pressure P based on the tool tip radius R and the instantaneous clearance value G, thereby adjusting the desired finish of the part 200. While the smaller the tool tip radius R, the smaller the polished area.
It should be noted here that the theoretical pressure P can be determined experimentally 0 Theoretical clearance value G 0 And will not be described in detail herein.
Further, the polishing parameters further include: the polishing rotational speed of the part 200, here denoted as V, is constant and the rotational speed V of the part 200 may be set in the control system of the machine tool 100 by setting the rotational speed of the spindle 110.
As described above, ideally, the spacing between the microstructured surface 210 and the tool 300 should be maintained at the theoretical clearance value G during polishing of the part 200 0 By adjusting the theoretical gap value G 0 And the polishing speed V can adjust the polishing width L of the part 200 0 And further adjusting the size of the polishing area in the polishing process.
As described above, if the instantaneous gap value G changes with time, the instantaneous polishing width L also changes with time, and generally speaking, the smaller the instantaneous gap value G, the larger the polishing rotational speed V, and the larger the instantaneous polishing width L. In conclusion, the theoretical clearance value G is adjusted 0 And the polishing speed V can adjust the instantaneous polishing width L, thereby adjusting the size of the polishing area of the microstructured surface 210 to achieve micron-scale localized polishing of the microstructured surface 210 of the part 200.
Still further, the microstructure polishing method based on local shear thickening further comprises:
and judging whether the surface polishing degree of the part 200 after polishing reaches a preset polishing degree, if not, returning to the polishing process, and if so, stopping polishing. In this step, the surface of the part may be polished cyclically, repeatedly, until a predetermined polishing level is reached.
The part 200 referred to in this application may be an optical part including, but not limited to, an optical lens, an optical mold, and the like.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (6)
1. A microstructure polishing method based on local shear thickening is characterized by comprising the following steps:
sequentially arranging a part and a cutter along a second direction, and enabling the microstructure surface of the part and a cutter head of the cutter to be arranged at intervals, wherein the second direction is the axial direction of the part;
setting polishing parameters; wherein the polishing parameters include: a polishing trajectory of the tool;
performing a polishing process, the polishing process comprising:
adding polishing solution to coat the surfaces of the cutter and the microstructure with the polishing solution; wherein the polishing solution is a non-Newtonian fluid with a shear thickening effect;
controlling the part to rotate, wherein under the relative shearing motion of the cutter and the surface of the microstructure, the local polishing solution filled in the cutter head of the cutter can generate a shearing thickening effect, so that an elastic elastomer is formed at the cutter head to serve as a polishing head, and the local polishing of the surface of the microstructure is realized;
under the condition that the polishing solution is in a shear thickening state, controlling the cutter to run according to the polishing track, polishing the whole microstructure surface, and obtaining the polished surface of the part;
the cutter is a turning tool;
before the step of sequentially arranging the part and the cutter along the second direction and arranging the microstructure surface of the part and the cutter at intervals, the microstructure polishing method further comprises the following steps:
sequentially arranging the part and the cutter along a second direction, and setting cutting parameters; wherein the cutting parameters include: a cutting trajectory of the tool;
performing a cutting process; the cutting process includes: controlling the part to rotate, and enabling the cutter to cut the part along the cutting track to obtain the microstructure surface of the part;
the polishing parameters further include: a theoretical clearance value; the theoretical clearance value is a constant, and the polishing track is generated by moving the theoretical clearance value to the second direction along the cutting track and in the direction away from the part;
the cutting track and the polishing track are determined in the following way:
obtaining the instantaneous rotation angle value of the part,
acquiring a first coordinate value of the cutter along a first direction when the instantaneous rotation angle value is obtained, wherein the first direction and the second direction form an included angle with each other, and the first direction is the radial direction of the part;
generating a second cutting coordinate value and a second polishing coordinate value of the tool in the second direction based on the first coordinate value and the instantaneous rotation angle value; the second buffing coordinate value = the second cut coordinate value + the theoretical clearance value;
generating the cutting trajectory based on the first and second cutting coordinate values, and generating the polishing trajectory based on the first and second polishing coordinate values.
2. A microstructure polishing method according to claim 1, characterized in that:
the cutting parameters further include: and setting the radius of the tool bit of the tool.
3. A microstructure polishing method according to claim 1, characterized in that:
the polishing parameters further include: a polishing rotational speed of the part.
4. A microstructure polishing method according to claim 1, characterized in that: the theoretical gap value is set based on the material of the part and the concentration of the polishing liquid.
5. A microstructure polishing method according to claim 1, characterized in that: the polishing solution includes abrasive particles, deionized water, and a shear thickening phase.
6. A microstructure polishing method according to claim 1, characterized in that: the microstructure polishing method further includes:
and judging whether the surface polishing degree of the part after polishing reaches a preset polishing degree, if not, returning to the polishing process, and if so, stopping polishing.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011036974A (en) * | 2009-08-17 | 2011-02-24 | Olympus Corp | Polishing method and polishing device |
| CN102717325A (en) * | 2012-06-08 | 2012-10-10 | 浙江工业大学 | Ultra-precise curved surface finishing method based on non-Newtonian fluid shear thickening effect |
| CN103331685A (en) * | 2013-07-01 | 2013-10-02 | 浙江工业大学 | Machining device based on non-Newtonian fluid shear thickening mechanism polishing method |
| CN108311960A (en) * | 2018-03-21 | 2018-07-24 | 大连理工大学 | A kind of burnishing device and method of freeform optics surface |
| CN111515874A (en) * | 2020-03-12 | 2020-08-11 | 浙江工业大学 | Efficient ultra-precision polishing method based on shear expansion effect |
| CN111716158A (en) * | 2020-06-03 | 2020-09-29 | 大连理工大学 | Method and device for polishing inner surface |
| CN114012512A (en) * | 2021-10-29 | 2022-02-08 | 哈尔滨工业大学 | Small ball head magnetorheological polishing method based on joint assistance of laser heating, water bath heating and chemical action |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013016779A1 (en) * | 2011-08-03 | 2013-02-07 | The University Of Sydney | Methods, systems and compositions for polishing |
| TWI593834B (en) * | 2015-08-18 | 2017-08-01 | 昆山納諾新材料科技有限公司 | Polishing system based on the non-newton fluid and polishing method thereof |
| CN112123023A (en) * | 2020-08-03 | 2020-12-25 | 浙江工业大学 | Stepwise grinding-polishing processing method based on non-Newtonian fluid shear rheological effect |
-
2022
- 2022-02-21 CN CN202210158952.0A patent/CN114473719B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011036974A (en) * | 2009-08-17 | 2011-02-24 | Olympus Corp | Polishing method and polishing device |
| CN102717325A (en) * | 2012-06-08 | 2012-10-10 | 浙江工业大学 | Ultra-precise curved surface finishing method based on non-Newtonian fluid shear thickening effect |
| CN103331685A (en) * | 2013-07-01 | 2013-10-02 | 浙江工业大学 | Machining device based on non-Newtonian fluid shear thickening mechanism polishing method |
| CN108311960A (en) * | 2018-03-21 | 2018-07-24 | 大连理工大学 | A kind of burnishing device and method of freeform optics surface |
| CN111515874A (en) * | 2020-03-12 | 2020-08-11 | 浙江工业大学 | Efficient ultra-precision polishing method based on shear expansion effect |
| CN111716158A (en) * | 2020-06-03 | 2020-09-29 | 大连理工大学 | Method and device for polishing inner surface |
| CN114012512A (en) * | 2021-10-29 | 2022-02-08 | 哈尔滨工业大学 | Small ball head magnetorheological polishing method based on joint assistance of laser heating, water bath heating and chemical action |
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