CN114472132A

CN114472132A - Component separation apparatus and method for separating components from waste circuit board

Info

Publication number: CN114472132A
Application number: CN202011166627.6A
Authority: CN
Inventors: 简桓祺; 张振辉; 李岳峰
Original assignee: Solar Applied Material Technology Corp
Current assignee: Solar Applied Material Technology Corp
Priority date: 2020-10-27
Filing date: 2020-10-27
Publication date: 2022-05-13

Abstract

The invention relates to a component separation device and a waste circuit board component separation method, wherein the component separation device is mainly characterized in that an inclined and rotatable roller device, a heating system capable of heating the roller device and an air extractor capable of extracting waste gas in the shell are arranged in the shell, the waste circuit board component separation method comprises the steps of sequentially executing a heating step, a feeding step and a separation and screening step, after the heating system heats the rotating roller device to a preset temperature, the waste circuit board is fed, soldering tin on the waste circuit board is melted, and meanwhile, electronic components and a circuit board body of the waste circuit board are automatically separated and screened in the rolling process of the roller, so that the component separation device is suitable for various types of waste circuit boards, can automatically separate the components in a large quantity and continuously, further reduces the operation cost and improves the operation efficiency.

Description

Component separation apparatus and method for separating components from waste circuit board

Technical Field

The invention relates to a component separation device and a waste circuit board component separation method, in particular to a component separation device and a waste circuit board component separation method which can automatically separate electronic components and a circuit board body of a waste circuit board so as to be beneficial to a subsequent precious metal recovery process.

Background

With the development of science and technology, electronic products have become a part of people's lives, and under the continuous evolution of thinking and demand of people, the demand of people for electronic products is increasing, and manufacturers of various electronic products continuously push out new products, so that the product cycle of electronic products is shortened and the elimination speed of electronic products is faster and faster, and a large amount of electronic wastes produced by people gradually become an international environmental protection issue.

The circuit board inside the electronic waste contains a large amount of precious metals, and if the circuit board cannot be properly recycled, environmental pollution and resource waste may be caused, however, the circuit board is provided with various electronic elements, and each electronic element and the circuit board body are different in recycling and processing modes.

Therefore, in order to improve the precious metal recovery efficiency of the circuit board, a pretreatment operation of separating the electronic component from the circuit board body must be performed to facilitate the subsequent precious metal recovery operation, wherein the pretreatment methods adopted nowadays can be classified into the following methods:

1. wet separation method: the wet separation method is mainly to immerse the circuit board in the chemical and peel off the soldering tin for soldering the electronic component by the chemical, so that the electronic component can fall off from the circuit board body, however, after the electronic component and the circuit board body are separated by the wet separation method, extra waste water is easily generated, and part of the electronic component with larger area such as BGA (ball grid array package) is soldered on the circuit board body by surface paste soldering, and the soldering tin is distributed between the electronic component and the circuit board body in a sheet shape, so when the circuit board is immersed in the chemical, the chemical is difficult to permeate and the stripping effect is poor.

2. Mechanical scraping method: the mechanical scraping method mainly uses a mechanical device to scrape the electronic components on the surface of the circuit board, so as to separate the electronic components from the circuit board body, however, since the mechanical device carries out scraping operation in a physical manner, the surface of the circuit board body or the electronic components are easily abraded or damaged in the scraping operation process, thereby generating a large amount of dust and requiring much operation time.

3. Manual separation method: the manual separation method is mainly to remove the electronic components on the circuit board by manual means, but the manual separation method can reduce the generation of pollutants by separating the circuit board body and the electronic components, but the labor cost and the time cost are high, the operation efficiency is poor, and the separation operation of the circuit board body and the electronic components of a large amount of waste circuit boards is difficult to process.

The problem that the separation and disassembly of electronic components on the circuit board are difficult to break through exists in the prior art; therefore, how to adapt to various circuit boards and electronic components and reduce environmental pollution, and achieve the objectives of reducing cost and improving separation efficiency, is an important issue that recycling manufacturers are urgently required to overcome.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the prior pretreatment method of circuit board is difficult to be applied to various circuit boards and electronic components of different types, and has problems of high cost or low efficiency.

The technical solution of the invention is as follows: to solve the above-mentioned technical problem, there is provided a component separation apparatus, the component separation apparatus defining a front end and a rear end, the component separation apparatus comprising:

a shell, a convection cavity is formed in the shell, a material collecting port and a material outlet which are communicated with the convection cavity are formed at the bottom of the shell, the material collecting port is positioned at the middle section of the shell, and the material outlet is positioned at the rear section of the shell;

the roller device comprises a hollow roller, a turbulence structure and a roller driving mechanism, wherein the roller is rotatably arranged in the shell, the roller sequentially forms a feeding hole, a plurality of sieve holes and at least one blanking hole from front to back, the sieve holes are positioned above the material collecting hole, the blanking hole is positioned above the material outlet, the pore diameter of the sieve hole is smaller than that of the blanking hole, the central shaft of the roller is downwards inclined from the front end to the rear end, the turbulence structure is arranged at the periphery of the roller, and the roller driving mechanism is arranged on the shell and can drive the roller to rotate; and

and the heating system is arranged on the shell and extends into the convection cavity, and can heat the roller device and the convection cavity.

In the component separation apparatus as described above, the drum of the drum device is disposed in the casing so as to be inclined downward from front to rear.

According to the element separating device, the bottom of the shell is provided with a plurality of adjusting foot frames, and the adjusting foot frames can be used for adjusting the height of the front end of the shell and the height of the rear end of the shell.

As above, the spoiler structure comprises a plurality of spoiler blades, and the plurality of spoiler blades are arranged around the periphery of the roller at intervals.

As above element separation equipment, a heat preservation layer is formed inside the shell, the heat preservation layer surrounds the convection cavity, a plurality of temperature measurement units are distributed on the shell, the temperature measurement units respectively pass through the heat preservation layer and extend into the convection cavity, and the temperature inside the convection cavity can be respectively measured by the measurement units.

The component separating apparatus described above includes a collecting bucket and a conveying device, the collecting bucket is disposed below the material collecting port of the housing, and the conveying device is disposed below the material outlet of the housing.

The component separation apparatus as described above, comprising an air extracting device which is provided in the housing and which is capable of extracting exhaust gas generated inside the housing.

The component separation device comprises a material collecting port, a material discharging port and a material feeding port, wherein the material collecting port, the material discharging port and the material feeding port are respectively provided with a valve capable of being controlled to open and close, the air extracting device comprises an air extracting cover and an exhaust pipe, the air extracting cover is positioned above the material feeding port of the roller, and the exhaust pipe is connected with the shell and communicated with the convection cavity.

In order to solve the above technical problem, there is provided a method for separating components from a waste circuit board, the method being performed by using the component separation apparatus, the method comprising:

a heating step, starting a roller driving mechanism of the roller device to drive the roller to rotate at a preset rotating speed, and simultaneously heating the roller and the convection cavity through the heating system and maintaining the roller and the convection cavity at a preset temperature;

a feeding step, namely feeding the waste circuit board into the roller from the feeding port; and

separating and screening, in rotation, the soldering tin of the waste circuit board in the roller is heated and melted, so that the electronic element and the circuit board body of the waste circuit board are separated in the rolling process and move along with the gravity along the inclined inner wall surface of the roller towards the rear end of the roller, the electronic element passes through the sieve holes of the roller and is discharged from the material collecting port, and the circuit board body passes through the material falling holes of the roller and is discharged from the material discharging port.

In the above method for separating waste circuit board components, in the heating step, the preset rotation speed of the drum is 1rpm to 10rpm, and the preset temperature is 230 ℃ to 270 ℃.

The method for separating the waste circuit board components comprises an air-extracting step, wherein the air-extracting step is to use an air-extracting device to extract air from the convection cavity inside the housing.

The component separation equipment is mainly used for separating electronic components of the waste circuit board from a circuit board body, wherein the heating system is used for heating the convection cavity of the shell and the roller of the roller device, when the waste circuit board is thrown into the roller, soldering tin on the waste circuit board is heated and melted, the electronic components of the waste circuit board and the circuit board body are separated in the rolling and mutual collision processes and move towards the rear end of the roller along the inclined inner wall surface of the roller along with gravity, the electronic components with smaller volume can pass through the sieve holes of the roller and fall out of the material collection port, and the circuit board body with larger volume passes through the material falling holes of the roller and falls out of the material discharge port.

In addition, the turbulence structure of the roller device can disturb the air in the convection cavity in the rotating process of the roller, so that the heat convection in the convection cavity is promoted, the heating efficiency of the heating system can be effectively improved, and the uniform heating effect can be achieved.

Among them, the element separating apparatus of the present invention has the following advantages:

1. the method can be suitable for various types of waste circuit boards: the component separation equipment provided by the invention mainly utilizes the heating system to melt the soldering tin of the waste circuit board in a heating mode, and enables the electronic components of the waste circuit board and the circuit board body to mutually collide and be separated without the soldering tin fixation in a mode of rolling the waste circuit board in the roller, so that the component separation equipment provided by the invention can be suitable for various types of waste circuit boards.

2. Low cost and high operating efficiency: because the central shaft of the roller is downwards inclined from the front end to the rear end and is matched with the sieve pores and the blanking pores on the roller, when the waste circuit board can move towards the rear of the roller along the inner wall surface of the roller under the influence of gravity in the overturning process of the roller, and the electronic components and the circuit board bodies are screened by the sieve pores and the blanking pores according to the volume, the component separation equipment does not need additional manpower and a device to push the waste circuit board in the roller, can enable the waste circuit board to automatically move towards the rear end of the roller in the rotating process of the roller and simultaneously complete the classification and screening actions of the electronic components and the circuit board bodies, not only can effectively reduce the operation cost, but also can effectively improve the operation efficiency.

In addition, the element separation equipment can further utilize the air extraction device to extract the waste gas generated in the shell and convey the waste gas to external waste gas treatment equipment, so that the waste gas generated by heating the waste circuit board in the operation process can be effectively prevented from leaking, and the environmental pollution is further reduced.

Drawings

FIG. 1 is a schematic side sectional view of a component separation apparatus according to a preferred embodiment of the present invention.

Fig. 2 is a schematic top plan view of the component separation apparatus of the present invention.

Fig. 3 is a schematic end view in cross section of the element separating apparatus of the present invention.

Fig. 4 is a schematic end view in section of the arrangement of the conveying means of the component separation apparatus of the present invention.

FIG. 5 is a schematic sectional side view of a conveying device and a collecting barrel of the component separating apparatus of the present invention.

Fig. 6 is a flow chart of the waste circuit board element separating method of the present invention.

Detailed Description

The technical means adopted by the invention to achieve the predetermined purpose is further described below by combining the drawings and the preferred embodiments of the invention.

Referring to fig. 1 to 3, a preferred embodiment of the device for separating components of the present invention, which defines a front end and a rear end, includes a housing 10, a roller assembly 20, and a heating system 30.

As shown in fig. 1 to 3, a convection chamber 11 is formed inside the housing 10, a material collecting port 12 and a material discharging port 13 communicating with the convection chamber 11 are formed at the bottom of the housing 10, the material collecting port 12 is located at the middle section of the housing 10, and the material discharging port 13 is located at the rear section of the housing 10; the shell 10 is internally provided with a heat insulation layer 14, the heat insulation layer 14 surrounds the convection cavity 11, a plurality of temperature measurement units 15 are distributed on the shell 10, the temperature measurement units 15 respectively pass through the heat insulation layer 14 and extend into the convection cavity 11, and the temperature inside the convection cavity 11 can be respectively measured by the measurement units.

As shown in fig. 1 to 3, the roller device 20 includes a hollow roller 21, a turbulent flow structure 22 and a roller driving mechanism 23, the drum 21 is rotatably disposed in the housing 10, the drum 21 sequentially forms a feeding port 211, a plurality of screen holes 212 and at least one blanking hole 213 from front to back, the plurality of screen holes 212 are positioned above the material collecting port 12, the blanking holes 213 are positioned above the material outlet 13, the diameter of the sieve hole 212 is smaller than that of the blanking hole 213, the central axis of the drum 21 is inclined downward from the front end to the rear end, the spoiler structure 22 is disposed at the periphery of the roller 21, the roller driving mechanism 23 is disposed at the housing 10 and can drive the roller 21 to rotate, wherein, the spoiler structure 22 comprises a plurality of spoiler blades 221, and the plurality of spoiler blades 221 are arranged around the periphery of the drum 21 at intervals.

As shown in fig. 1, a plurality of adjusting feet 16 can be further disposed at the bottom of the housing 10, and the adjusting feet 16 can be used to adjust the height of the front end of the housing 10 and the height of the rear end of the housing 10.

In addition, the roller 21 of the roller device 20 can be arranged in the housing 10 in a downward inclined manner directly from front to back, so that the roller 21 is in an inclined state; or, the drum 21 can be horizontally disposed in the housing 10, and the front end of the entire housing 10 is higher than the rear end thereof by adjusting the plurality of adjusting feet 16 at the bottom of the housing 10, so that the drum 21 is inclined; in the preferred embodiment of the element separating apparatus of the present invention, the central axis of the drum 21 forms an angle of 0.5 ° to 1 ° with a horizontal plane.

As shown in fig. 1 to 3, the heating system 30 is disposed in the housing 10 and extends into the convection chamber 11, and the heating system 30 can heat the roller device 20 and the convection chamber 11; wherein, the heating system 30 comprises a plurality of electric heating tubes 31, the plurality of electric heating tubes 31 extend into the convection chamber 11 and are respectively located at two opposite sides of the drum 21.

Further, as shown in fig. 1 to 3, the component separation apparatus includes an air extraction device 40, the air extraction device 40 is disposed in the housing 10 and can extract the exhaust gas generated inside the housing 10; the material collecting port 12, the material discharging port 13 and the material feeding port 211 are respectively provided with a valve 50 capable of being controlled to open and close, the air extracting device 40 comprises an air extracting cover 41 and an air exhaust pipe 42, the air extracting cover 41 is located above the material feeding port 211 of the roller 21, and the air exhaust pipe 42 is connected with the shell 10 and communicated with the convection cavity 11.

In addition, as shown in fig. 4 and 5, the component separation apparatus can further include a collecting barrel 60 and a conveying device 70, wherein the collecting barrel 60 is disposed below the material collecting port 12 of the housing 10, and the conveying device 70 is disposed below the material outlet 13 of the housing 10.

Referring to fig. 6, the present invention provides a method for separating waste circuit board components, which is performed by using the above-mentioned component separation apparatus, and the method for separating waste circuit board components includes a heating step S1, a feeding step S2, and a separation and screening step S3.

As shown in fig. 1 and fig. 6, in the heating step S1, the operator can start the roller driving mechanism 23 of the roller device 20 to drive the roller 21 to rotate at a predetermined rotation speed, and heat and maintain the roller 21 and the convection chamber 11 to a predetermined temperature through the heating system 30; the preset rotating speed of the roller 21 is 1 rpm-10 rpm, and the preset temperature is 230-270 ℃.

As shown in fig. 1 and 6, in the feeding step S2, the operator can feed the waste circuit boards from the feeding port 211 into the drum 21, and the component separation apparatus performs a separation and sorting step S3; as shown in fig. 1 and 6, in the separating and screening step S3, the solder of the waste circuit board in the rotating drum 21 is heated and melted, so that the electronic components of the waste circuit board are separated from the circuit board body in the tumbling process, and move along the inner wall of the inclined drum 21 toward the rear end of the drum 21 along with gravity, the electronic components pass through the screen holes 212 of the drum 21 and drop out from the collecting port 12, and the circuit board body passes through the blanking holes 213 of the drum 21 and drops out from the discharging port 13.

In addition, the method for separating the waste circuit board components can further include an air-extracting step, wherein the air-extracting step uses an air-extracting device 40 to extract air from the convection cavity 11 inside the housing 10.

As shown in fig. 2 and 3, the component separation apparatus can measure the temperature of each region of the convection chamber 11 by connecting to an external controller and matching with the plurality of temperature measurement units distributed in the housing 10; as shown in fig. 1, fig. 2, fig. 3, and fig. 6, in the heating step S1, the rotation of the drum 21 not only enables the heating system 30 to uniformly heat the drum 21, but also disturbs the air inside the convection cavity 11 by the spoiler blades 221 of the spoiler structure 22, so as to promote the heat convection inside the convection cavity 11, effectively improve the heating efficiency of the heating system 30, and achieve the effect of uniform heating.

In addition, as shown in fig. 4 and 5, the component separating apparatus can place the collecting barrel 60 below the collecting port 12, and the conveying device 70 is disposed below the discharging port 13, so that when separated electronic components fall from the collecting port 12 through the sieve holes 212, the electronic components can be collected in the collecting barrel 60 for subsequent sorting and recycling; when the separated circuit board body passes through the blanking hole 213 and drops from the discharge hole 13, the circuit board body can be conveyed to the subsequent recycling operation by the conveying device 70.

The component separation device mainly melts the soldering tin on the waste circuit board in a heating mode, and enables the electronic components of the waste circuit board and the circuit board body to mutually collide and be separated without the soldering tin in a rolling mode of the waste circuit board in the roller 21, so that the component separation device can be suitable for various types of waste circuit boards.

In addition, since the central axis of the drum 21 is inclined downward from the front end to the rear end, and is matched with the screen holes 212 and the blanking holes 213 on the drum 21, when the waste circuit boards are turned over by the drum 21, the waste circuit boards can move along the inner wall surface of the drum 21 toward the rear of the drum 21 under the influence of gravity, and the electronic components and the circuit board bodies are screened by the screen holes 212 and the blanking holes 213 according to the size, so that the component separation equipment of the invention can automatically move toward the rear end of the drum 21 and simultaneously complete the classification and screening actions of the electronic components and the circuit board bodies without extra manpower and devices for pushing the waste circuit boards inside the drum 21 during the rotation of the drum 21.

Therefore, the component separation equipment can automatically perform separation and screening operation, can be applied to the separation operation of the electronic components and the circuit board body of the waste circuit board in a large quantity and continuously, not only can effectively reduce the operation cost, but also can effectively improve the operation efficiency.

In addition, as shown in fig. 1, the valve 50 disposed on the housing 10 can prevent the exhaust gas from escaping, and the air extractor 40 can extract the exhaust gas generated during the separation and screening steps at the material inlet 211 and inside the convection chamber 11 and deliver the exhaust gas to an external exhaust gas treatment device, so as to effectively prevent the exhaust gas generated by the waste circuit board heated during the operation process from leaking when the valve 50 is opened, thereby reducing the environmental pollution.

In summary, the component separation apparatus of the present invention mainly uses the structural design of the heating system 30 and the roller device 20 to melt the solder on the waste circuit board by heating, so as to automatically separate and screen the electronic components and the circuit board body on the waste circuit board during the rolling process in the roller 21, thereby enabling the component separation apparatus of the present invention to be suitable for various types of waste circuit boards, and to automatically separate and screen the electronic components and the circuit board body of the waste circuit board in a large amount and continuously, thereby effectively reducing the operation cost and effectively improving the operation efficiency.

Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A component separation apparatus defining a front end and a rear end, the component separation apparatus comprising:

2. The component separation apparatus according to claim 1, wherein the drum of the drum means is disposed inside the casing obliquely downward from front to back.

3. The element separation apparatus of claim 1 wherein the bottom of the housing is provided with a plurality of adjustment feet that can be used to adjust the height of the front end of the housing and the height of the rear end of the housing.

4. The element separation apparatus of claim 2 wherein the bottom of the housing is provided with a plurality of adjustment feet that can be used to adjust the height of the front end of the housing and the height of the rear end of the housing.

5. The component separation apparatus of any one of claims 1 to 4, wherein the spoiler structure comprises a plurality of spoiler blades spaced around the outer periphery of the drum.

6. The element separation device according to any one of claims 1 to 4, wherein a heat insulation layer is formed inside the housing, the heat insulation layer surrounds the convection cavity, a plurality of temperature measurement units are distributed on the housing, the temperature measurement units respectively pass through the heat insulation layer and extend into the convection cavity, and the measurement units can respectively measure the temperature inside the convection cavity.

7. A component separation apparatus according to any one of claims 1 to 4, comprising a collection vessel disposed below the collection opening of the housing and a conveyor device disposed below the discharge opening of the housing.

8. The component separation apparatus according to any one of claims 1 to 4, comprising an air-extracting device which is provided in the casing and which is capable of extracting exhaust gas generated inside the casing.

9. The component separating apparatus according to claim 8, wherein the material collecting port, the material discharging port and the material feeding port are respectively provided with a valve capable of being controlled to open and close, the air extracting device comprises an air extracting cover and an air exhaust pipe, the air extracting cover is located above the material feeding port of the roller, and the air exhaust pipe is connected with the housing and communicated with the convection chamber.

10. A waste circuit board component separation method performed using the component separation apparatus according to any one of claims 1 to 7, the waste circuit board component separation method comprising:

11. The method for separating waste circuit board components as claimed in claim 10, wherein the predetermined rotation speed of the drum is 1rpm to 10rpm and the predetermined temperature is 230 ℃ to 270 ℃ in the heating step.

12. The method as claimed in claim 10 or 11, wherein the method comprises a step of evacuating the convection chamber inside the housing by using an air-evacuating device.