CN114453324A - Nozzle assembly for cleaning single wafer and single wafer cleaning machine - Google Patents
Nozzle assembly for cleaning single wafer and single wafer cleaning machine Download PDFInfo
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- CN114453324A CN114453324A CN202210386712.6A CN202210386712A CN114453324A CN 114453324 A CN114453324 A CN 114453324A CN 202210386712 A CN202210386712 A CN 202210386712A CN 114453324 A CN114453324 A CN 114453324A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 233
- 238000005507 spraying Methods 0.000 claims abstract description 33
- 210000003437 trachea Anatomy 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
- 239000003814 drug Substances 0.000 abstract description 47
- 230000000694 effects Effects 0.000 abstract description 14
- 235000012431 wafers Nutrition 0.000 description 69
- 239000007789 gas Substances 0.000 description 47
- 239000002245 particle Substances 0.000 description 36
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- 239000006185 dispersion Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a nozzle assembly for cleaning a single wafer and a single wafer cleaning machine, comprising: the liquid spraying pipe is coaxially sleeved on the airflow pipe of the liquid spraying pipe, the bottom end of the liquid spraying pipe is provided with a cyclone which supports against the airflow pipe, and a liquid separator is coaxially embedded in the cyclone; the liquid distributor is concavely provided with a plurality of liquid guide grooves for uniformly dispersing liquid in the liquid spraying pipe along the ring shape, the cyclone is concavely provided with a plurality of centrifugal air grooves for guiding air in the airflow pipe to be discharged in a swirling direction along the ring shape, and the centrifugal air grooves form air outlets and are provided with guide flow channels for liquid circulation facing the liquid guide grooves so as to guide the air to break the liquid into uniform and smaller atomized liquid drops. Realized through the application that the crushing effect to the liquid medicine is good to promote the cleaning performance of liquid medicine to the wafer, improve the abluent clean degree of wafer.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a nozzle assembly for cleaning a single wafer and a single wafer cleaning machine.
Background
In the process of cleaning and processing a wafer by a single-chip cleaning machine, a liquid medicine is generally sprayed out from a nozzle arranged on a swing arm mechanism to clean the wafer, and the swing arm mechanism is driven by a motor to rotate. In the prior art, the crushing effect on the liquid medicine is poor, so that the cleaning effect of the liquid medicine on the wafer is poor, and the cleaning degree is low.
In view of the above, there is a need for an improved apparatus for cleaning wafers in the prior art to solve the above problems.
Disclosure of Invention
The invention aims to disclose a nozzle assembly for cleaning a single wafer and a single wafer cleaning machine, which are used for solving the defects of a wafer cleaning device in the prior art, in particular for realizing good crushing effect on liquid medicine, improving the cleaning effect of the liquid medicine on the wafer and improving the cleaning degree of the wafer.
In order to achieve the above object, according to a first aspect of the present invention, there is provided a single wafer cleaning nozzle assembly comprising: the liquid spraying pipe is coaxially sleeved on the airflow pipe of the liquid spraying pipe;
the bottom end of the liquid spraying pipe is provided with a cyclone which is propped against the airflow pipe, and a liquid distributor is coaxially embedded in the cyclone;
the liquid distributor is concavely provided with a plurality of liquid guide grooves for uniformly dispersing liquid in the liquid spraying pipe along the annular shape, the cyclone is concavely provided with a plurality of centrifugal gas grooves for guiding the gas in the gas flow pipe to swirl to the discharged gas, the centrifugal gas grooves form gas outlets and face guide flow channels for liquid circulation in the liquid guide grooves so as to guide the gas to break the liquid into even and smaller liquid drops in an atomized shape.
As a further improvement of the present invention, the nozzle assembly comprises: an annular airflow cavity is formed between the liquid spraying pipe and the airflow pipe, a liquid guide pipe is embedded in the top of the liquid spraying pipe, a first channel for liquid to flow is arranged in the liquid guide pipe, the liquid spraying pipe is provided with a second channel communicated with the first channel, a sealing ring positioned at the top of the airflow cavity is formed at the joint of the liquid spraying pipe and the airflow pipe, and the airflow pipe is provided with an air inlet pipe for conveying air into the airflow cavity.
As a further improvement of the present invention, the cyclone comprises: the top block is positioned at the top of the cyclone block, and a plurality of centrifugal air grooves are concavely formed in the top block and the cyclone block along the annular shape.
As a further improvement of the present invention, the centrifugal gas tank comprises: the kicking block is concavely established a plurality of slopes that are and is set up and communicate along the annular the air inlet duct of air current cavity, in order to guide gaseous being in the air current cavity is the whirl and flows, the air inlet duct is kept away from the one end formation face of air current cavity the exit of direction runner to guide gaseous in with the direction runner liquid that flows out break away for even and littleer liquid drop that is the atomizing form.
As a further improvement of the present invention, the liquid distributor includes: embedded in the linking piece of whirl piece, it is the round platform form to link up the piece, link up the piece bottom and set up the bottom block, link up and form the edge between piece and the bottom block, the axial runs through in proper order link up the piece with the straight flow groove of bottom block, link up the piece with the bottom block is along the annular groove and establishes a plurality of liquid guide grooves, the whole parcel of swirler links up the piece and partially encloses to close along vertical direction the bottom block.
As a further improvement of the invention, the liquid guide groove comprises: the connecting block is uniformly and concavely provided with a plurality of liquid guide flow channels for dispersing liquid in the second channel along the annular shape, and the bottom block is uniformly and concavely provided with a plurality of guide flow channels communicated with the liquid guide flow channels along the annular shape;
the liquid guide channel and the guide channel are both linear, liquid forms a roundabout diffusion shape in the liquid guide channel and the guide channel and flows downwards, and the liquid flowing downwards in the guide channel is formed into gas gathered at the gas outlet by the centrifugal gas channel to be dispersed.
In a second aspect, the present invention provides a single wafer washer comprising: the single wafer cleaning nozzle assembly comprises a mounting plate, two groups of motor bases and a driving motor connected with the motor bases are arranged at the top of the mounting plate, two groups of supporting pieces which are coaxial with the driving motor are vertically assembled at the bottom of the mounting plate, the bottom ends of the two groups of supporting pieces are respectively connected with a first rotating base and a second rotating base, a mounting base is arranged at the bottom end of the second rotating base, a first air pipe arranged at the top of the mounting base is arranged in the mounting base, a swing arm assembly is arranged at the bottom end of the first rotating base, and one end, far away from the first rotating base, of the swing arm assembly is provided with the single wafer cleaning nozzle assembly.
As a further improvement of the present invention, the swing arm assembly comprises: the support arm, the support arm top sets up the second trachea of intercommunication intake pipe, the first liquid pipe of intercommunication catheter, first liquid pipe be reverse in the tracheal one side of second forms the second liquid pipe, the support arm is close to nozzle assembly's one end sets up first connecting piece, connects first connecting piece and embedded the second connecting piece of second liquid pipe, first connecting piece sets up the connection nozzle assembly's third connecting piece, the support arm sets up and is used for separating the mounting of second trachea and first liquid pipe and second liquid pipe.
Compared with the prior art, the invention has the beneficial effects that:
the liquid medicine flowing out from the liquid spraying pipe can be uniformly pre-dispersed by the liquid guiding groove, and the gas discharged from the gas flow pipe can be separated into a plurality of air flows flowing in a spiral direction by the centrifugal gas groove, so that the air flows can be contacted with the pre-dispersed liquid medicine when flowing out, the liquid medicine can be conveniently dispersed and broken into uniform and smaller atomized liquid drops, the cleaning effect of the liquid medicine on the wafer is improved, the cleaning degree of the wafer is improved, the air flows can have a lateral blowing effect on the liquid medicine, the lateral contact force of the atomized liquid medicine drops when contacting the surface of the wafer is increased, the cleaning effect on the wafer is further improved, the wafer manufacturing is developed towards the direction of high depth-width ratio at present, the window size is continuously reduced by layers, for example, a more three-dimensional structure forming technology is adopted in the stacking and packaging process, and local interconnection or a replacement grid is increased, the requirement for cleaning is also higher, and the application can form close technical cooperation following the technical development requirement.
Drawings
FIG. 1 is a perspective view of a single wafer cleaning machine including a single wafer cleaning nozzle assembly;
FIG. 2 is a perspective view of the swing arm assembly and the nozzle assembly;
FIG. 3 is a perspective view of a third connecting block and an airflow tube;
FIG. 4 is a perspective view of the airflow tube and bottom block;
FIG. 5 is a perspective view of the cyclone and the liquid distributor;
FIG. 6 is a perspective view of a catheter and an airflow tube;
FIG. 7 is a perspective view of a vortex block and a top block;
FIG. 8 is a perspective view of the engagement block and the bottom block;
FIG. 9 is a cross-sectional view of a catheter and a gas flow tube;
FIG. 10 is a cross-sectional view of an air inlet tube and a gas flow tube;
fig. 11 is an enlarged view of fig. 10 at reference character a.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
It should be understood that in the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present disclosure.
It should be especially noted that, in the embodiments of the present invention, the term "vertical" refers to a vertical direction from the horizontal plane or the horizontal plane.
The embodiment provides a concrete implementation mode of a nozzle assembly for cleaning a single wafer.
Referring to fig. 3-11, an embodiment of a single wafer cleaning nozzle assembly according to the present invention is shown.
Compared with the conventional nozzle for cleaning the wafer by directly spraying liquid, the nozzle assembly (hereinafter referred to as "nozzle assembly 30") for cleaning the single wafer disclosed in this embodiment is characterized in that the liquid sprayed from the nozzle assembly 30 is pre-dispersed and sufficiently broken into uniform and smaller atomized droplets by the air current discharged in the direction of rotation, and a washing flow path is formed from the center of the wafer and uniformly coated in a spiral diverging manner from the inside to the outside, so that the cleaning effect on the surface of the wafer can be improved, the cleaning degree of the wafer can be improved, and the cleaning effect is more excellent. Embodiments of the single wafer cleaning nozzle assembly and the single wafer cleaning machine assembled based on the nozzle assembly disclosed in the present application are described in detail below.
It should be noted that the objects processed by the nozzle assembly for cleaning a single wafer and the gas-liquid mixed spraying method performed by the single wafer cleaning machine disclosed in the present embodiment include, but are not limited to, silicon-based wafers, LED chips, liquid crystal display substrates, silicon nitride wafers, etc., and in the present embodiment, silicon-based wafers (i.e., wafers) are taken as an example for illustration, and those skilled in the art can reasonably select the liquid medicine (or other cleaning liquids), determine the concentration of the liquid medicine, the gas pressure of the gas flow, etc., according to the different objects processed by the single wafer cleaning machine.
Referring to fig. 4 to 11, in the present embodiment, the single wafer cleaning nozzle assembly (hereinafter, simply referred to as "nozzle assembly 30") includes a nozzle assembly 30 having a chemical solution and a liquid having equivalent technical meanings, and the nozzle assembly 30 includes: the liquid spraying pipe 31 is coaxially sleeved on the airflow pipe 32 of the liquid spraying pipe 31, the bottom end of the liquid spraying pipe 31 is provided with a cyclone 38 which supports against the airflow pipe 32, and a liquid distributor 39 is coaxially embedded in the cyclone 38.
The liquid distributor 39 is concavely provided with a plurality of liquid guide grooves 393 for uniformly dispersing the liquid in the liquid spraying pipe 31 along the ring shape, the swirler 38 is concavely provided with a plurality of centrifugal air grooves 383 for guiding the gas in the airflow pipe 32 to be discharged in the swirling direction along the ring shape, the centrifugal air grooves 383 form an air outlet 3832 and face the guide flow passage 3932 for liquid circulation in the liquid guide grooves 393 so as to guide the gas to break the liquid into uniform and smaller atomized liquid drops. It should be noted that the number of the liquid guiding grooves 393 is the same as the number of the centrifugal air grooves 383, and the width dimension of the centrifugal air grooves 383 is larger than the width dimension of the liquid guiding grooves 393, so that the liquid medicine discharged from the liquid guiding grooves 393 can be sufficiently covered by the gas discharged from the centrifugal air grooves 383, and the gas can sufficiently disperse and break the liquid medicine. The gas in the gas flow pipe 32 will blow towards the cyclone 38 during the discharging process, and since the cyclone 38 is annularly recessed with the centrifugal gas grooves 383, the gas will flow in the centrifugal gas grooves 383 in the direction of the arrow 100c in fig. 5, and will be dispersed into a plurality of streams of discharged gas in a swirling direction by the centrifugal gas grooves 383. Meanwhile, when the liquid spraying pipe 31 sprays the liquid medicine, the liquid medicine flows towards the direction of the liquid distributor 39, and the liquid distributor 39 is concavely provided with the plurality of liquid guiding grooves 393 along the ring shape, so that the liquid medicine flows in the liquid guiding grooves 393 when contacting with the liquid distributor 39, and is dispersed into a plurality of liquid flows by the plurality of liquid guiding grooves 393, and finally the liquid medicine is discharged towards the guiding flow channel 3932, so that the pre-dispersion effect of the liquid medicine (or other cleaning liquids) is realized. Meanwhile, the centrifugal air groove 383 forms an air outlet 3832 and is provided with a guide flow channel 3932 facing the liquid guide groove 393 for liquid to flow through, so that a plurality of air flows flowing in a spiral direction can be discharged from the outlet 3832 along the direction of an arrow 100b in fig. 5 and are contacted with the pre-dispersed liquid medicine discharged from the guide flow channel 3932, the air flows can disperse and break the pre-dispersed liquid medicine into uniform and smaller atomized liquid drops, the cleaning effect of the liquid medicine on the wafer is improved when the atomized liquid medicine drops are contacted with the surface of the wafer, and the cleaning degree of the wafer is improved. The diameter of the atomized droplets of the chemical liquid finally formed at the bottom of the nozzle assembly 30 is smaller than the diameter of the droplets of the chemical liquid formed only by the centrifugal air grooves 383. Meanwhile, as a plurality of air flows are discharged in a spiral direction, the air flows can blow the liquid medicine in a lateral direction, so that the lateral contact force of atomized liquid medicine drops when the liquid medicine drops contact the surface of the wafer is increased, a scouring flow path which is uniformly coated from inside to outside and is in a spiral gradually expanding shape is formed from the circle center of the wafer, and the cleaning effect of the wafer is further improved.
Referring to fig. 3 to 11, the nozzle assembly 30 includes: an annular airflow cavity a is formed between the liquid spraying pipe 31 and the airflow pipe 32, a liquid guide pipe 33 is embedded in the top of the liquid spraying pipe 31, a first channel 34 for liquid circulation is arranged in the liquid guide pipe 33, the liquid spraying pipe 31 is provided with a second channel 36 communicated with the first channel 34, a sealing ring 35 positioned at the top of the airflow cavity a is formed at the joint of the liquid spraying pipe 31 and the airflow pipe 32, and the airflow pipe 32 is provided with an air inlet pipe 37 for conveying air into the airflow cavity a. The air inlet pipe 37 can inject air into the air flow cavity a, and the air flow cavity a is annularly arranged, so that the air in the air flow cavity a can uniformly flow towards the direction of the cyclone 38, so that the air is dispersed into a plurality of air flows which are discharged in a swirling direction by the centrifugal air grooves 383. A chemical liquid (or other cleaning liquid) required for wafer cleaning can be injected into the liquid ejecting tube 31 through the liquid guide tube 33, and the chemical liquid can be discharged and ejected by flowing into the second passage 36 through the first passage 34, so that the chemical liquid can be brought into contact with the liquid distributor 39 to be predispersed. Meanwhile, the sealing ring 35 can improve the sealing performance of the joint of the liquid spraying pipe 31 and the airflow pipe 32, and prevent the instability of air pressure caused by the leakage of air in the airflow cavity a.
Referring to fig. 4 to 7 and 9 to 11, the swirler 38 includes: the cyclone block 381 and the top block 382 are abutted against the airflow pipe 32, the top block 382 is positioned at the top of the cyclone block 381, and a plurality of centrifugal air grooves 383 are annularly and concavely arranged on the top block 382 and the cyclone block 381. The cyclone block 381 and the top block 382 are abutted against the airflow pipe 32, so that the sealing performance of the joint between the cyclone block 381 and the top block 382 and the airflow pipe 32 is improved, and the phenomenon that the air in the airflow cavity a leaks from the way outside the centrifugal air groove 383 to cause instability of air pressure is prevented. The centrifugal gas grooves 383 arranged in a ring shape can guide the gas to flow, so that the gas can flow along the direction of the arrow 100c in fig. 5, and the gas is guided to be dispersed into a plurality of gas flows flowing in a spiral direction.
Specifically, referring to fig. 5 and 7, the centrifugal air tank 383 includes: the top block 382 is concavely provided with a plurality of air inlet grooves 3831 which are obliquely arranged along the ring shape and are communicated with the air flow cavity a so as to guide the air in the air flow cavity a to flow out in a spiral direction, and one end of the air inlet grooves 3831, which is far away from the air flow cavity a, forms an outlet 3832 facing the guide flow channel 3932 so as to guide the air to disperse the liquid flowing out in the guide flow channel 3932 into uniform and smaller atomized liquid drops. Can provide the inlet channel that flows for the gas that discharges in the air current cavity a through inlet chute 3831 to with gas dispersion to a plurality of air currents, make a plurality of air currents can flow along arrow 100c direction in figure 7 simultaneously, thereby make the air current can rotate and flow downwards, finally flow through outlet 3832 and discharge, and contact the liquid medicine of circulation in the direction runner 3932, and then break up it into even and littleer liquid drop that is atomizing form.
Referring to fig. 4 to 11, the dispenser 39 includes: the connecting block 391 is embedded in the rotating flow block 381, the connecting block 391 is in a circular truncated cone shape, the bottom end of the connecting block 391 is provided with a bottom block 392, an edge 395 is formed between the connecting block 391 and the bottom block 392, the connecting block 391 and the bottom block 392 axially penetrate through a straight flow groove 394 of the connecting block 391 and the bottom block 392 in sequence, a plurality of liquid guide grooves 393 are concavely arranged along the ring shape of the connecting block 391 and the bottom block 392, and the swirler 38 integrally wraps the connecting block 391 and partially encloses the bottom block 392 along the vertical direction. It should be noted that, the swirler 38 may be completely wrapped around the edge 395, or may partially enclose the bottom block 392, as long as the bottom block 392 is not completely enclosed, and the liquid medicine in the liquid guiding passage 3931 may flow into the guiding passage 3932. In this embodiment, it is preferable that the swirler 38 partially encloses the bottom block 392, so that when the dispersed liquid medicine is guided through the liquid guide passage 3931 and flows into the guide passage 3932, when the liquid medicine flows out of a partial region of the bottom block 392 enclosed by the swirler 38, the pressure carried by the liquid medicine when being sprayed can be released, and the liquid medicine can be dispersed again, so that the gas breaks and disperses the liquid medicine into uniform and smaller atomized liquid drops. When the liquid medicine flows in the second channel 36 along the direction of the arrow 100a in fig. 11, the liquid medicine contacts the liquid separator 39 and flows in the straight-through groove 394 and the liquid guide grooves 393 in the liquid separator 39, so that the liquid medicine is dispersed into a plurality of liquid flows by the liquid guide grooves 393 and the straight-through groove 394, and the liquid medicine is pre-dispersed by the liquid flow so as to be conveniently dispersed and broken into uniform and smaller atomized liquid drops by the air flow.
Specifically, referring to FIG. 8, reservoir 393 comprises: the connecting block 391 is uniformly recessed with a plurality of liquid guiding channels 3931 along a ring shape for dispersing the liquid in the second channel 36, and the bottom block 392 is uniformly recessed with a plurality of guiding channels 3932 along a ring shape for communicating with the liquid guiding channels 3931, wherein the liquid guiding channels 3931 and the guiding channels 3932 are both linear, the liquid in the liquid guiding channels 3931 flows in the guiding channels 3932 in a roundabout and diffusive shape, and finally flows downwards in the guiding channels 3932, so that the liquid can be dispersed by the gas gathered at the gas outlet 3832 of the centrifugal gas tank 383. It should be noted that the circumferential width of the liquid guiding flow passage 3931 may be greater than the circumferential width of the guiding flow passage 3932, and the depth of the liquid guiding flow passage 3931 may also be greater than the depth of the guiding flow passage 3932, as long as the liquid flowing in the liquid guiding flow passage 3931 can flow into the guiding flow passage 3932 in a roundabout manner and flow out downward in the guiding flow passage 3932 in a diffusion manner. In the present embodiment, it is preferable that the width and depth of the liquid guide flow passage 3931 be equal to those of the guide flow passage 3932. When the liquid medicine flows in the liquid guiding groove 393, the liquid guiding flow passage 3931 can guide the liquid medicine, the liquid medicine can flow in the direction of an arrow 100b in fig. 8 and flows into the guiding flow passage 3932 communicated with the liquid guiding flow passage 3931, the guiding flow passage 3932 is obliquely arranged, so that the guiding flow passage 3932 can guide the liquid medicine to be discharged downwards in a rotating mode, the flow direction of the liquid medicine discharged downwards in the rotating mode can be matched with the flow direction of air flow flowing downwards in the rotating mode, the air flow can be in contact with the liquid medicine, and therefore the liquid medicine is scattered by the air flow to be broken into uniform and smaller atomized liquid drops.
Fig. 1 to 2 show an embodiment of a single wafer cleaning machine according to the present invention. Based on the technical solution of the nozzle assembly for cleaning a single wafer disclosed in the foregoing embodiments, the present embodiment also discloses a single wafer cleaning machine.
Referring to fig. 1 and 2, in the present embodiment, the single wafer type cleaning machine includes: the single wafer cleaning nozzle assembly comprises a mounting plate 10, two groups of motor bases 11 are arranged at the top of the mounting plate 10, a driving motor 12 connected with the motor bases 11 is arranged at the bottom of the mounting plate 10, two groups of supporting pieces 17 coaxially arranged with the driving motor 12 are vertically assembled at the bottom of the mounting plate 10, the bottom ends of the two groups of supporting pieces 17 are respectively connected with a first rotating base 13 and a second rotating base 14, a mounting base 15 is arranged at the bottom end of the second rotating base 14, a first air pipe 16 arranged at the top of the mounting base 15 is arranged in the mounting base, a swing arm assembly 20 is arranged at the bottom end of the first rotating base 13, and one end, far away from the first rotating base 13, of the swing arm assembly 20 is provided with the single wafer cleaning nozzle assembly 30. The mounting plate 10 may be a support mechanism such as a plate or a frame, as long as the drive motor 12 and the swing arm assembly 20 can be supported. The connection mode of the motor base 11, the driving motor 12 and the mounting plate 10 may be a connection mode of connecting bolts and nuts, as long as the connection mode of fixing the motor base 11 to the mounting plate 10 and fixing the driving motor 12 to the motor base 11 can be realized. The driving motor 12 is coaxially disposed with the supporting member 17 and the first rotating base 13 from the central axis B of fig. 1, the supporting member 17 is driven by the driving motor 12 to rotate the first rotary base 13 in the direction of arrow G in fig. 1, so that the control swing arm assembly 20 adjusts the cleaning position of the nozzle assembly 30 on the surface of the wafer, meanwhile, the driving motor 12 ', the supporting member 17' and the second rotary base 14 are coaxially disposed from the central axis B 'of fig. 1, the driving motor 12' can drive the supporting member 17 'to rotate the second rotary base 14 along the direction of arrow G' of fig. 1, so that the control mounting seat 15 adjusts the air injection direction of the nozzle (formed at the end of the free end of the first air pipe 16) of the first air pipe 16, the nozzle of the first gas pipe 16 can eject nitrogen (or other reaction gas) to purge the surface of the wafer, so that the nitrogen can dry the surface of the wafer by gas injection or clean the contaminants.
The swing arm assembly 20 includes: the support arm 21, support arm 21 top sets up the second trachea 22 of intercommunication intake pipe 37, the first liquid pipe 23 of intercommunication catheter 33, first liquid pipe 23 is reverse to the one side formation second liquid pipe 24 of second trachea 22, support arm 21 is close to the one end of nozzle assembly 30 and sets up first connecting piece 26, connect first connecting piece 26 and embedded second connecting piece 27 of second liquid pipe 24, first connecting piece 26 sets up the third connecting piece 28 of connecting nozzle assembly 30, support arm 21 sets up the mounting 25 that is used for separating second trachea 22 and first liquid pipe 23 and second liquid pipe 24. Gas is fed through second gas line 22 to gas inlet line 37 to infuse gas into gas flow chamber a. The liquid chemical (or other cleaning liquid) is injected into the liquid guide tube 33 through the first liquid tube 23, so that the liquid guide tube 33 can inject the liquid chemical into the liquid ejecting tube 31, thereby ejecting the liquid chemical. The second liquid pipe 24 is fixed in a limiting way through the second connecting piece 27, the second liquid pipe 24 can be controlled to spray pure water (or other cleaning liquid) to wash the surface of the wafer, and the nozzle assembly 30 can be installed and fixed through the third connecting piece 28. The second air tube 22, the first liquid tube 23 and the second liquid tube 24 are prevented from being randomly crossed by the fixing member 25, and the alignment is maintained.
A nozzle assembly for single wafer cleaning according to an embodiment of the present application is provided to a single wafer cleaning machine for optical particle (contamination) detection using a test wafer.
The product process standard is embodied as follows:
| 4 inch wafer | 6 inch wafer | 8- |
12 inch wafer | |
| Process standard | Particle size of the particles: 0.12 micron; less than or equal to 20 Granule | Particle size of the particles: 0.12 micron; less than or equal to 20 Granule | Particle size of the particles: 0.08 micron; less than or equal to 30 Granule | Particle size of the particles: 0.2 micron; less than or equal to 30 Granule |
| Optical inspection before the present application Measuring range | Particle size of the particles: 0.12 micron; range of 11 to 17 particles | Particle size of the particles: 0.12 micron; range of 10 to 15 particles | Particle size of the particles: 0.08 micron; range of 18 to 27 particles | Particle size of the particles: 0.2 micron; range of 22-28 particles |
| Improved optics of the present application Detection range | Particle size of the particles: 0.12 micron; range of 6 to 9 particles | Particle size of the particles: 0.12 micron; range of 6 to 11 particles | Particle size of the particles: 0.08 micron; range of 12 to 23 particles | Particle size of the particles: 0.2 micron; range of 14 to 25 particles |
Accordingly, the single wafer type wafer cleaning nozzle assembly and the single wafer type cleaning machine are provided, the cleaning effects of wafers with different sizes in the conventional process can be improved, the number of particle detection is reduced to a certain extent compared with the number of particle detection before the particle detection is improved, a friendly clean environment is provided for the subsequent process, and the excellent quality of semiconductors is guaranteed.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A single wafer cleaning nozzle assembly, comprising: a liquid spraying pipe, an airflow pipe coaxially sleeved on the liquid spraying pipe, and is characterized in that,
the bottom end of the liquid spraying pipe is provided with a cyclone which is propped against the airflow pipe, and a liquid distributor is coaxially embedded in the cyclone;
the liquid distributor is concavely provided with a plurality of liquid guide grooves for uniformly dispersing liquid in the liquid spraying pipe along the annular shape, the cyclone is concavely provided with a plurality of centrifugal gas grooves for guiding the gas in the gas flow pipe to swirl to the discharged gas, the centrifugal gas grooves form gas outlets and face guide flow channels for liquid circulation in the liquid guide grooves so as to guide the gas to break the liquid into even and smaller liquid drops in an atomized shape.
2. The single wafer cleaning nozzle assembly as recited in claim 1, wherein the nozzle assembly comprises: an annular airflow cavity is formed between the liquid spraying pipe and the airflow pipe, a liquid guide pipe is embedded in the top of the liquid spraying pipe, a first channel for liquid to flow is arranged in the liquid guide pipe, the liquid spraying pipe is provided with a second channel communicated with the first channel, a sealing ring positioned at the top of the airflow cavity is formed at the joint of the liquid spraying pipe and the airflow pipe, and the airflow pipe is provided with an air inlet pipe for conveying air into the airflow cavity.
3. The nozzle assembly of claim 2, wherein the swirler comprises: the top block is positioned at the top of the cyclone block, and a plurality of centrifugal air grooves are concavely formed in the top block and the cyclone block along the annular shape.
4. The single wafer cleaning nozzle assembly as recited in claim 3, wherein the centrifugal gas groove comprises: the kicking block is concavely established a plurality of slopes that are and is set up and communicate along the annular the air inlet duct of air current cavity, in order to guide gaseous being in the air current cavity is the whirl and flows, the air inlet duct is kept away from the one end formation face of air current cavity the exit of direction runner to guide gaseous in with the direction runner liquid that flows out break away for even and littleer liquid drop that is the atomizing form.
5. The single wafer cleaning nozzle assembly as recited in claim 3, wherein the dispenser comprises: embedded in the linking piece of whirl piece, it is the round platform form to link up the piece, link up the piece bottom and set up the bottom block, link up and form the edge between piece and the bottom block, the axial runs through in proper order link up the piece with the straight flow groove of bottom block, link up the piece with the bottom block is along the annular groove and establishes a plurality of liquid guide grooves, the whole parcel of swirler links up the piece and partially encloses to close along vertical direction the bottom block.
6. The nozzle assembly for cleaning a single wafer as claimed in claim 5, wherein the fluid guide slot comprises: the connecting block is uniformly and concavely provided with a plurality of liquid guide flow channels for dispersing liquid in the second channel along the annular shape, and the bottom block is uniformly and concavely provided with a plurality of guide flow channels communicated with the liquid guide flow channels along the annular shape;
the liquid guide flow channel and the guide flow channel are linear, the liquid forms a roundabout diffusion shape in the liquid guide flow channel and the guide flow channel and flows downwards, and the liquid flowing downwards in the guide flow channel is dispersed by gas gathered at a gas outlet formed by the centrifugal gas groove.
7. A single wafer washer, comprising: the mounting panel, the mounting panel top sets up two sets of motor casings, connects the driving motor of motor casing, the vertical assembly of mounting panel bottom is two sets of with the support piece of the coaxial setting of driving motor, and is two sets of first roating seat and second roating seat are connected respectively to the support piece bottom, second roating seat bottom sets up the mount pad, establishes in the first trachea at mount pad top, first roating seat bottom sets up the swing arm subassembly, the one end that first roating seat was kept away from to the swing arm subassembly sets up the nozzle subassembly for wafer cleaning of monolithic formula as in any one of claims 2 to 6.
8. The single wafer cleaning machine of claim 7, wherein the swing arm assembly comprises: the support arm, the support arm top sets up the second trachea of intercommunication intake pipe, the first liquid pipe of intercommunication catheter, first liquid pipe be reverse in the tracheal one side of second forms the second liquid pipe, the support arm is close to nozzle assembly's one end sets up first connecting piece, connects first connecting piece and embedded the second connecting piece of second liquid pipe, first connecting piece sets up the connection nozzle assembly's third connecting piece, the support arm sets up and is used for separating the mounting of second trachea and first liquid pipe and second liquid pipe.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210386712.6A CN114453324B (en) | 2022-04-14 | 2022-04-14 | Nozzle assembly for cleaning single wafer and single wafer cleaning machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210386712.6A CN114453324B (en) | 2022-04-14 | 2022-04-14 | Nozzle assembly for cleaning single wafer and single wafer cleaning machine |
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| CN114453324B CN114453324B (en) | 2022-06-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6383331B1 (en) * | 1999-04-06 | 2002-05-07 | Sez Semiconductor-Equipment Zubehor Fur Die Halbeiterfertigung Ag | Device for discharging two or more media with media nozzles |
| US20040251319A1 (en) * | 2001-09-10 | 2004-12-16 | Goran Sundholm | Method in a spray head, and spray head |
| JP2004356317A (en) * | 2003-05-28 | 2004-12-16 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JP2012015180A (en) * | 2010-06-29 | 2012-01-19 | Tokyo Electron Ltd | Two-fluid nozzle, substrate processing apparatus, method of generating liquid droplet, and substrate processing method |
| CN102842522A (en) * | 2011-06-21 | 2012-12-26 | 东京毅力科创株式会社 | Two-fluid nozzle and substrate liquid processing apparatus and substrate liquid processing method |
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2022
- 2022-04-14 CN CN202210386712.6A patent/CN114453324B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383331B1 (en) * | 1999-04-06 | 2002-05-07 | Sez Semiconductor-Equipment Zubehor Fur Die Halbeiterfertigung Ag | Device for discharging two or more media with media nozzles |
| US20040251319A1 (en) * | 2001-09-10 | 2004-12-16 | Goran Sundholm | Method in a spray head, and spray head |
| JP2004356317A (en) * | 2003-05-28 | 2004-12-16 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JP2012015180A (en) * | 2010-06-29 | 2012-01-19 | Tokyo Electron Ltd | Two-fluid nozzle, substrate processing apparatus, method of generating liquid droplet, and substrate processing method |
| CN102842522A (en) * | 2011-06-21 | 2012-12-26 | 东京毅力科创株式会社 | Two-fluid nozzle and substrate liquid processing apparatus and substrate liquid processing method |
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| CN114453324B (en) | 2022-06-28 |
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