CN114449743A - Circuit board with package maintenance circuit - Google Patents

Abstract

The invention discloses a circuit board with a package maintenance circuit, comprising: the circuit board is provided with a maintenance circuit layer; on-board circuits are embedded in the circuit board layer, graphite circuits are arranged in the overhaul circuit layer, and a branch circuit of each graphite circuit is provided with a breaking point corresponding to the on-board circuit, so that the graphite circuits are in a broken circuit state; a plurality of electrical appliance accommodating channels are formed in the onboard circuit and the graphite circuit of the circuit board, and elastic clamping pieces are arranged in the electrical appliance accommodating channels and connected to the onboard circuit; the port of the electrical appliance accommodating channel is packaged by soldering and is connected to the graphite circuit; and the outer surface of the maintenance circuit layer is provided with a packaging plate. According to the elastic clamping piece, the elastic clamping piece is additionally arranged in the traditional circuit board plug hole, and then the tail end of the pin is soldered. Whether have the mistake in the aspect of operations such as rosin joint, hourglass welding, reverse insertion promptly, the elastic clamping spare all can the close contact electric part.

Description

Circuit board with package maintenance circuit

Technical Field

The invention relates to the technical field of circuit boards, in particular to a circuit board with a package maintenance circuit.

Background

The circuit board is miniaturized and visualized, plays an important role in the mass production of fixed circuits and the optimization of the layout of electric appliances, the sales volume of the circuit board is often thousands, the circuit board can be subjected to spot inspection when leaving a factory, but various quality problems can be gradually found in the using process of a client, the company usually processes that damaged products are sent back to the company and then sent to a maintenance department for detection, analysis and information collection, at present, when the circuit board is maintained, the appearance is usually observed by manual naked eyes, or an online test protocol is adopted, after various chips on the circuit board are subjected to functional test, the circuit board can give out that the test is passed or the test is not passed, but certain components cannot be accurately analyzed, and the information cannot be collected. In on-line testing, too many factors are affected (disturbed). It is required to take a lot of measures (such as turning off the crystal oscillator, removing the CPU and the programmed chip, adding an isolation interrupt signal, etc.) before the test, which has a very large working pressure on the after-sales service department. At the very least, current test results are sometimes unsatisfactory.

Disclosure of Invention

The invention aims to provide a circuit board with a package maintenance circuit.

In order to achieve the above object, the present invention employs the following:

a circuit board having a package repair circuit, comprising: the circuit board is provided with a maintenance circuit layer; on-board circuits are embedded in the circuit board layer, graphite circuits are arranged in the overhaul circuit layer, and a circuit breaking point is arranged on each branch of each graphite circuit corresponding to the on-board circuits, so that the graphite circuits are in a circuit breaking state; a plurality of electrical appliance accommodating channels are formed in the on-board circuit and the graphite circuit of the circuit board, and elastic clamping pieces are arranged in the electrical appliance accommodating channels and connected to the on-board circuit; the port of the electrical appliance accommodating channel is packaged by soldering and is connected to the graphite circuit; and the outer surface of the maintenance circuit layer is provided with a packaging plate.

Preferably, the elastic clamping piece is annular, two support lugs used for connecting an onboard circuit are arranged on the elastic clamping piece, and the two support lugs are symmetrically arranged at an angle of 180 degrees; a contact probe extends from the elastic clamping piece to the inner circle center direction, and the longitudinal section of the contact probe is V-shaped; and a metal ball is arranged at the end part of the contact probe.

Preferably, the number of the contact probes on each elastic clamping piece is 6, and every two contact probes are separated by 60 degrees.

Preferably, a groove is formed in the overhaul circuit layer corresponding to the on-board circuit, a graphite circuit is laid in the groove, and an isolation film covers the graphite circuit; the branch part of the graphite circuit positioned in the groove is provided with a breaking point which enables the graphite circuit to be in a broken state.

Preferably, the breaking point comprises two end points in a T shape, and the two end points are communicated through a shallow groove.

Preferably, a data mark is arranged at the end point of the disconnection point.

Preferably, a rectangular packaging strip is arranged on the surface of one side, provided with the graphite circuit, of the overhaul circuit layer, a packaging plate is fixedly arranged on the rectangular packaging strip, and a hollow packaging line is formed between the packaging plate and the rectangular packaging strip.

The invention has the following advantages:

1. the complex operation sequence and the detection preparation effect are saved, and the information of the parts of the circuit board which are easy to damage can be effectively collected, so that the follow-up products can be corrected. And can make the customer overhaul alone, the quality problem appears and can in time feed back to, graphite circuit can satisfy normal use in the short time, plays emergent effect.

2. The whole elastic clamping piece is made of copper, the contact probe has strong elasticity, and the metal ball is also made of copper. The design aim at of journal stirrup is pegged graft on the circuit board, connects the board and carries the circuit better, prevents the contact failure problem of elastic clamping spare and board year circuit.

3. According to the elastic clamping piece, the elastic clamping piece is additionally arranged in the traditional circuit board plug hole, and then the tail end of the pin is soldered. Whether have the mistake in the aspect of operations such as rosin joint, hourglass welding, reverse insertion promptly, the elastic clamping spare all can the close contact electric part.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 is a schematic diagram of a circuit board structure with a package repair circuit according to the present invention.

Fig. 2 is an enlarged schematic view of the circuit board disconnection point with the package repair circuit of the present invention.

Fig. 3 is a schematic structural view of the circuit board elastic clamping member with the package repair circuit of the invention.

Fig. 4 is a schematic structural diagram of the circuit board elastic clip with the package repair circuit of the present invention viewed from the bottom.

Fig. 5 is a schematic diagram of a packaged circuit board with a package repair circuit according to the present invention.

Fig. 6 is a schematic diagram of the structure of the circuit board on-board circuit with the package access circuit of the present invention.

In the figures, the various reference numbers are:

the circuit board comprises a circuit board 1, a circuit board 101, an on-board circuit 2, a maintenance circuit layer 201, a groove 3, a graphite circuit 301, a circuit breaking point 302, an end point 302, a shallow groove 303, an electrical appliance accommodating channel 4, an elastic clamping piece 5, a lug 501, a contact probe 502, a metal ball 503, a packaging plate 6, a data mark 7, a rectangular packaging strip 8 and a hollow packaging line 9.

Detailed Description

In order to more clearly illustrate the invention, the invention is further described below in connection with preferred embodiments. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 to 6, the circuit board with the package repair circuit includes: the circuit board comprises a circuit board 1, wherein a maintenance circuit layer 2 is arranged on the circuit board 1; the embedded on-board circuit 101 in 1 layer of circuit board, circuit board and on-board circuit are the same with PCB among the prior art, namely printed circuit board, behind the electronic equipment adopted the printing board, because the uniformity of the printing board of the same kind to avoided the mistake of artifical wiring, and can realize that automatic cartridge or subsides of electronic components and parts, automatic soldering tin, automated inspection, guaranteed electronic equipment's quality.

Particularly, the difference between the present application and the prior art is that the prior art inserts the electric device on the circuit board and solders the pins of the electric device; according to the elastic clamping piece, the elastic clamping piece is additionally arranged in the traditional circuit board plug hole, and then the tail end of the pin is soldered. Whether have the mistake in the aspect of operations such as rosin joint, hourglass welding, reverse insertion promptly, the elastic clamping spare all can the close contact electric part.

Further, be equipped with graphite circuit 3 in overhauing circuit layer 2 to corresponding to board carries circuit 101, obviously, graphite circuit lays through graphite and makes, and graphite is soft, has the greasy sense, can electrically conduct. The chemical property is inactive, the corrosion resistance is realized, and the reaction with acid, alkali and the like is not easy. The graphite circuit is identical to the board circuit, namely, the graphite circuit is equivalent to a circuit with two same functions and is connected with the same electric devices. Its aim at, graphite circuit can collect the circuit board and damage the information as reserve maintenance circuit to play emergent effect.

It is worth mentioning that, adopt graphite as reserve maintenance circuit in this application, because graphite is black, has stronger display capacity to the texture is softer, is convenient for change through external force. It may be replaced by other conductive materials, such as iron sheet and other metals.

A breaking point 301 is arranged on each branch of the graphite circuit 3, so that the graphite circuit 3 is in a breaking state; in daily conditions, the graphite circuit must be in an open circuit state, because the on-board circuit in the circuit board is the main function, the design purpose of the graphite circuit is just to repair the on-board circuit after the on-board circuit is damaged, and the function of collecting data is carried out.

The on-board circuit 101 and the graphite circuit 3 on the circuit board 1 are provided with a plurality of electrical appliance accommodating channels 4, it can be understood that different electrical appliances exist in different circuits, in the application, a test circuit of a time-base integrated circuit is taken as an example, a singlechip with a center area of NE555 is adopted, and the singlechip is provided with two resistors, a capacitor, an indicator light, a 6V voltage power supply, a ground and a switch. The electric appliance accommodating channels respectively correspond to the components, namely pins of the electric appliance are inserted into the electric appliance accommodating channels.

An elastic clamping piece 5 is arranged in the electric appliance accommodating channel 4, so that the elastic clamping piece 5 is connected to the onboard circuit 101; elastic clamping spare is as shown in the figure, and six metal balls that are the annular and distribute can the stitch of butt electrical part, guarantee the intercommunication of board year circuit and electrical part.

The port of the electrical appliance accommodating channel 4 is packaged by soldering and connected to the graphite circuit 3; the graphite circuit and the on-board circuit are respectively connected by the tin soldering and the elastic clamping piece, and the on-board circuit mainly works, so that errors in the operation aspects of insufficient soldering, missing soldering, reverse insertion and the like in the traditional processing technology are avoided. In this application, the function of soldering, in addition to being used for graphite circuitry, also serves to secure the pins of the electrical device.

And the outer surface of the maintenance circuit layer 2 is provided with a packaging plate 6. The surface of one side of the overhaul circuit layer 2, which is provided with the graphite circuit 3, is provided with a rectangular packaging strip 8, a packaging plate 6 is fixedly arranged on the rectangular packaging strip 8, and a hollow packaging line 9 is formed between the packaging plate 6 and the rectangular packaging strip 8.

It should be noted that the rectangular packaging strip is located at the edge of the overhaul circuit layer, and the packaging plate is fixedly connected with the rectangular packaging strip, as shown in the figure, the rectangular packaging strip is designed to be used when an onboard circuit in a circuit board normally works, the overhaul circuit layer does not need to be opened, and when the onboard circuit goes wrong, the packaging plate is disassembled along a hollowed-out packaging line, and a graphite circuit is used for fault detection. That is, the package plate and the rectangular package strip are designed for one time, so that the problems of secondary sale, secondary filling and the like are prevented.

The thickness of the package plate is 1mm, and the thickness of the rectangular package strip is 3mm, that is, the thickness of the inner space is 2 mm.

Further, as shown in the figure, the elastic clamping piece 5 is annular, two support lugs 501 for connecting an onboard circuit are arranged on the elastic clamping piece 5, and the two support lugs 501 are symmetrically arranged at 180 degrees; a contact probe 502 extends from the elastic clamping piece 5 to the inner circle center direction, and the longitudinal section of the contact probe 502 is V-shaped; the end of the contact probe 502 is provided with a metal sphere 503. The whole elastic clamping piece is made of copper, the contact probe has strong elasticity, and the metal ball is also made of copper. The design aim at of journal stirrup is pegged graft on the circuit board, connects the board and carries the circuit better, prevents the contact failure problem of elastic clamping spare and board year circuit.

Further, the number of the contact probes on each elastic clamping piece 5 is 6, and every two contact probes are separated by 60 degrees.

Furthermore, a groove 201 is formed in the overhaul circuit layer 2 corresponding to the on-board circuit 101, a graphite circuit 3 is laid in the groove 201, and an isolation film covers the graphite circuit 3; the branch part of the graphite circuit positioned in the groove is provided with a breaking point which enables the graphite circuit to be in a broken state.

The disconnection point 301 includes two T-shaped end points 302, and the two end points 302 are communicated with each other through a shallow groove 303.

Compare in traditional circuit board, the processing thickness of this application need increase 1mm, and the depth of processing of recess is less than 1mm simultaneously to avoid influencing on-board circuit, it is unusual, the thickness of shallow slot is less than the thickness of recess, does not lay graphite circuit in the shallow slot, when needs use graphite circuit, utilizes graphite pencil or graphite core to scribble in the shallow slot, thereby communicates the breakpoint.

Further, a data mark 7 is arranged at the end point of the breaking point 301.

The working principle of the application is as follows:

when the circuit board damages, the maintenance is more loaded down with trivial details usually, and a circuit board of treating to repair, should at first should carry out the range estimation to it, the magnifying glass of need having the help of when necessary, main observation:

firstly, the quality problem:

1. whether a broken wire exists or not;

2. the component force elements such as a resistor, an electrolytic capacitor, an inductor, a diode, a triode and the like are disconnected;

3. whether the printed board connecting line on the circuit board has fracture, adhesion and the like;

4. whether errors in operation aspects such as cold joint, missing joint, reverse insertion and the like exist;

and secondly, when the situation does not exist, the resistance value between the power supply and the ground of the circuit board is measured by using a universal meter, the resistance value of the circuit board is usually 70-80, if the resistance value is too small, the resistance value is several or more than ten ohms, the situation that components are broken down or partially broken down on the circuit board is indicated, and measures are needed to be taken to find out the broken-down components. Supplying power to the repaired circuit board to measure the temperature of each device on the circuit board;

if the resistance value is normal, a universal meter is used for measuring the force dividing elements such as a diode, a triode, a field effect transistor and a toggle switch on the circuit board, and the purpose is to ensure that the measured elements are normal.

Finding a circuit board in the same batch as the maintained circuit board as a reference, and then performing good and bad comparison test on the two boards by using a double-rod VI curve scanning function, wherein the initial comparison point starts from a port, and then the comparison test is performed from the outside to the inside, particularly the comparison test on the capacitor, so that the defect that whether the electric leakage is difficult to measure by a universal meter on line can be overcome;

based on the detection, when the circuit board is directly produced, the graphite circuit is directly attached to serve as a reference circuit, the graphite circuit is communicated through the workpiece communication shallow grooves such as the graphite pencil, and therefore the circuit damage or the damage of specific electric devices can be easily detected.

Firstly, the shallow grooves are scratched by a graphite pencil to communicate a graphite circuit, and at the moment, if each electric device normally operates, the on-board circuit inside the circuit board has quality problems, disconnection or adhesion (the design in the application cannot have quality problems in the aspects of insufficient soldering and missing soldering)

And secondly, after the graphite circuit is communicated, each electric device cannot normally operate, the electric device has a problem, the marking traces in the shallow groove are erased, and then a graphite pencil is used for communicating the disconnection points one by one to judge the working condition of the electric device one by one.

The complex operation sequence and the detection preparation effect are saved, and the information of the parts of the circuit board which are easy to damage can be effectively collected, so that the follow-up products can be corrected. And can make the customer overhaul alone, the quality problem appears and can in time feed back to, graphite circuit can satisfy normal use in the short time, plays emergent effect.

The production method of the circuit board with the package maintenance circuit comprises the following steps:

the first step is as follows: placing the selected resin body in a mold to form a first plate surface; the first plate surface is rectangular, and a resin system far exceeding the softening point is injected from an injection hole through an injection mold.

The second step is that: curing the resin system in a mold, and processing the resin system on the first plate surface to form an on-board circuit; the processing of the on-board circuit is performed in the same manner as in the prior art, for example by etching.

The third step: heating the mould to a temperature lower than the softening point of the resin system;

the relative molecular mass distribution affects the crystallinity, viscosity, softening point, etc. of the epoxy resin. For example, a resin having the same average relative molecular mass and a wide distribution of relative molecular masses will have a lower softening point. Therefore, the average relative molecular mass and the relative molecular mass distribution are an important property of the epoxy resin.

Epoxy group content the most reactive epoxy group is the most important functional group of the epoxy resin. The content of epoxy groups is directly related to the crosslinking density of the cured product. Thus, it is one of the main factors affecting the properties of the cured product. Therefore, in synthesizing an epoxy resin, the content of an epoxy group is one of the main means for controlling and identifying the quality of the epoxy resin. When epoxy resin is applied, the content of epoxy group is one of the main bases for the formulation design (material selection and proportion) of the epoxy resin curing system.

The epoxy group content is generally expressed by three methods; epoxy equivalent-is defined as the mass (g) of the epoxy resin containing lmol epoxy groups, in g/mol. Epoxy value-is defined as the amount of substance of epoxy groups contained in 100g of epoxy resin, in mol/100 g. The mass fraction of epoxy groups-defined as the mass (g) of epoxy groups contained in 100g of the epoxy resin, in%. The conversion relation of the three is as follows:

the average relative molecular mass of an unbranched bisphenol a-type epoxy resin having an epoxy group as an end group can be roughly estimated from the content of the epoxy group [ epoxy equivalent ] - [ 100 ]/[ epoxy value ] - [ 43 ]/[ mass fraction of epoxy group ]. [ average relative molecular mass ]. apprxeq.2X[ epoxy equivalent ], for the purposes of the present application softening point and setting time, its epoxy equivalent should be greater than 5 g/mol.

When the polymerization degree n of the bisphenol A type epoxy resin is more than 0, the resin contains secondary hydroxyl groups in the molecule. The larger n, the larger the average relative molecular mass and the higher the hydroxyl group content. The hydroxyl groups have a great influence on the curing of the epoxy resin. It can promote the curing reaction of primary amine and epoxy resin and make the ring opening of acid anhydride react with epoxy group, so that the higher the hydroxyl content is, the shorter the gel time is. According to multiple tests, the final result is that the epoxy resin with n being more than or equal to 2 is selected.

The fourth step: continuously adding a resin system into the mould to form a second board surface covering the on-board circuit, and cooling to room temperature to solidify the first board surface and the second board surface into a whole; the temperature of the subsequently added resin system is higher than the softening point temperature, in this application 160 ℃ is chosen, since the temperature of the first panel surface will increase when the added epoxy resin comes into contact with the already solidified first panel surface, and it must be ensured that the temperature of the first panel surface is always below the softening point temperature, i.e. 140 ± 2 ℃, so the temperature of the subsequently added resin system should not be too high.

The fifth step: placing a packaging layer mold in the central area of the second board surface, heating to enable the temperature to be lower than the softening point of the resin system, and continuously adding the resin system into the packaging layer mold to enable a rectangular packaging strip of the packaging layer to be formed on the second board surface;

and a sixth step: punching a node on an on-board circuit on the first board surface and the second board surface by a drilling machine, installing an elastic clamping piece in the hole, connecting the elastic clamping piece to the on-board circuit, inserting pins of an electrical component into the elastic clamping piece, extending the pins out of the second board surface, and soldering the pins on the second board surface;

the seventh step: slotting on the second board surface along the board-mounted circuit path through the engraving machine; and forming a disconnection point on the branch;

eighth step: filling graphite in the groove to form a graphite circuit, and covering a protective film above the graphite circuit;

the ninth step: and placing the packaging plate at the rectangular packaging strip, heating to enable the packaging plate and the rectangular packaging strip to be welded together, and forming a hollow packaging line.

Preferably, the resin system is a crystalline epoxy resin with a softening point of 140 ± 2 ℃.

Preferably, the third step: the mold was heated to 130 c below the softening point of the resin system.

Preferably, the fifth step: placing a packaging layer mold in the center area of the second board surface, wherein the packaging layer mold is provided with an injection molding channel with a rectangular surface, the injection molding channel is internally provided with an injection molding hole, the packaging layer mold is reversely buckled on the second board surface, adding a resin system is carried out through the injection molding hole, the heating temperature is up to 130 ℃, and a rectangular packaging strip of a packaging layer fixedly connected to the second board surface is formed on the second board surface.

Preferably, the sixth step: with first face, second face and rectangle encapsulation strip cooling to room temperature, punch to first face through the drilling machine, overturn 180 with the circuit board, punch corresponding to the trompil on the first face on the second face, form the electrical apparatus and hold the passageway, punch through the probe to carrying circuit along circular path to the board, arrange the elastic clamping spare in the electrical apparatus holds the passageway to the block makes in the perforation department of on-board circuit the elastic clamping spare is connected in on-board circuit, inserts the electrical components stitch in the elastic clamping spare, and makes the stitch stretch out the second face, carries out the soldering to the stitch on the second face.

Preferably, the seventh step: slotting on the second plate surface along the onboard circuit path by using an engraving machine, wherein the depth of the slot is 1 mm; and forming a breaking point on the branch, wherein the breaking point comprises two T-shaped end points which are communicated through a shallow groove.

Preferably, the eighth step: filling graphite in the groove to form a graphite circuit, and covering a protective film above the graphite circuit, wherein the protective film comprises a special treatment layer, an intermediate layer and an adsorption layer; the adsorption layer is made of silica gel, the middle layer is made of polyester film, and the special treatment layer is an HC hardness treatment layer.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.

Claims (7)

1. A circuit board having a package repair circuit, comprising: the circuit board is provided with a maintenance circuit layer; on-board circuits are embedded in the circuit board layer, graphite circuits are arranged in the overhaul circuit layer, and a circuit breaking point is arranged on each branch of each graphite circuit corresponding to the on-board circuits, so that the graphite circuits are in a circuit breaking state; a plurality of electrical appliance accommodating channels are formed in the on-board circuit and the graphite circuit of the circuit board, and elastic clamping pieces are arranged in the electrical appliance accommodating channels and connected to the on-board circuit; the port of the electrical appliance accommodating channel is packaged by soldering and is connected to the graphite circuit; and the outer surface of the maintenance circuit layer is provided with a packaging plate.

2. The circuit board with the package maintenance circuit according to claim 1, wherein the elastic clamping member is ring-shaped, two support lugs for connecting an on-board circuit are arranged on the elastic clamping member, and the two support lugs are symmetrically arranged at 180 degrees; a contact probe extends from the elastic clamping piece to the inner circle center direction, and the longitudinal section of the contact probe is V-shaped; and a metal ball is arranged at the end part of the contact probe.

3. The circuit board with package service circuit of claim 2, wherein the number of contact probes on each of the resilient clips is 6, and every two contact probes are spaced apart by 60 °.

4. The circuit board with the package service circuit as claimed in claim 1, wherein a groove is formed in the service circuit layer corresponding to the on-board circuit, a graphite circuit is laid in the groove, and an isolation film is covered on the graphite circuit; the branch part of the graphite circuit positioned in the groove is provided with a breaking point which enables the graphite circuit to be in a broken state.

5. The circuit board with package service circuitry of claim 4, wherein the disconnection point comprises two terminals having a T-shape, and the two terminals are connected by a shallow slot.

6. The circuit board with package service circuitry of claim 1, wherein data markers are provided at the end points of the disconnection point.

7. The circuit board with an encapsulated service circuit as claimed in claim 1, wherein the side surface of the service circuit layer having the graphite circuit has a rectangular encapsulation strip, and an encapsulation plate is fixed on the rectangular encapsulation strip, and a hollow encapsulation line is formed between the encapsulation plate and the rectangular encapsulation strip.

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