CN114447012A - Method for manufacturing light-transmitting display module - Google Patents

Method for manufacturing light-transmitting display module Download PDF

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Publication number
CN114447012A
CN114447012A CN202011200179.7A CN202011200179A CN114447012A CN 114447012 A CN114447012 A CN 114447012A CN 202011200179 A CN202011200179 A CN 202011200179A CN 114447012 A CN114447012 A CN 114447012A
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conductive layer
printing
manufacturing
layer
lines
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CN202011200179.7A
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Chinese (zh)
Inventor
李晋棠
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GIO Optoelectronics Corp
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GIO Optoelectronics Corp
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Priority to CN202011200179.7A priority Critical patent/CN114447012A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

The invention discloses a method for manufacturing a light-transmitting display module, which comprises the following steps: preparing a light-transmitting substrate; printing a first conductive pattern layer on the first surface of the light-transmitting substrate; printing a first insulating layer on the first conductive layer; printing a second conductive layer on the first insulating layer; printing a second insulating layer on the second conductive layer; and arranging a plurality of photoelectric components on the first surface of the light-transmitting substrate, wherein partial electrodes of each photoelectric component are electrically connected to the second pad structure of the second conductive layer, and partial electrodes of each photoelectric component are electrically connected to a plurality of second lines of the second conductive layer through a plurality of second windows defined on a plurality of third insulating lines of the second insulating layer.

Description

Method for manufacturing light-transmitting display module
Technical Field
The invention relates to a method for manufacturing a light-transmitting display module, which is different from the traditional process.
Background
Conventional optoelectronic devices are manufactured by using semiconductor processes, wherein the semiconductor processes include photolithography, etching, and the like, and the manufacturing process is complicated, the cost is high, and environmental pollution is also a problem.
Disclosure of Invention
The invention aims to provide a method for manufacturing a light-transmitting display module. Different from the manufacturing process of the traditional photoelectric device, the manufacturing method of the invention has the advantages of simple process, lower cost and environmental protection.
To achieve the above object, a light-transmissive display module according to the present invention at least comprises the following steps: providing a light-transmissive substrate, wherein the light-transmissive substrate defines opposing first and second faces; printing a first conductive layer on a first surface of a light-transmitting substrate, wherein the first conductive layer comprises a plurality of first lines arranged along a first direction, a plurality of first gasket structures and a plurality of leads extending from the first lines; wherein at least a portion of the first pad structure is extended by the first line; printing a first insulation layer on the first conductive layer, wherein the first insulation layer comprises a plurality of first insulation lines arranged along a first direction, a plurality of second insulation lines arranged along a second direction and a plurality of first windows exposing the lead wires, the second direction is vertical to the first direction and forms a plane, and the first insulation lines are overlapped with the first lines; printing a second conductive layer on the first insulating layer, wherein the second conductive layer includes a plurality of second lines and a plurality of second pad structures arranged along a second direction, the second lines overlap the second insulating lines and are electrically connected to the leads through the first windows, and the second pad structures are electrically connected to the first pad structures; printing a second insulating layer on the second conductive layer, wherein the second insulating layer includes a plurality of third insulating lines arranged along a second direction and a plurality of second windows defined on the third insulating lines, and the third insulating lines overlap the second lines; and disposing a plurality of optoelectronic components on the first surface of the light-transmissive substrate, wherein each of the optoelectronic components has a plurality of electrodes, a portion of the electrodes is electrically connected to the second pad structure, and a portion of the electrodes is electrically connected to the second line through the second window.
In some embodiments, in the step of printing the first conductive layer, portions of the first pad structure are independent of the first line.
In some embodiments, before or after the step of disposing the optoelectronic component, further comprising: and forming a plurality of protection units corresponding to the photoelectric assembly on the first surface or/and the second surface of the light-transmitting substrate.
In some embodiments, the protection unit is formed simultaneously in the step of printing the first insulation layer or/and the second insulation layer.
In some embodiments, in the step of printing the second conductive layer, a portion of the second pad structure is independent of the second line.
In some embodiments, in the step of printing the second conductive layer, a portion of the second pad structure overlaps a portion of the first pad structure that is independent or not independent of the second line.
In some embodiments, in the step of printing the second conductive layer, the first conductive layer has a conductivity that is better than a conductivity of the second conductive layer.
In some embodiments, before the step of printing the second insulating layer, the method further comprises: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, a portion of the third pad structures overlaps and is electrically connected to the second line, and a portion of the third pad structures overlaps and is electrically connected to the second pad structures.
In some embodiments, after the step of printing the second insulating layer, the method further comprises: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, a portion of the third pad structures corresponds to the second window and is electrically connected to the second line, and a portion of the third pad structures is stacked and electrically connected to the second pad structures.
In some embodiments, before or after the step of printing the second insulating layer, the method further comprises: and printing a third conductive layer on the second conductive layer, wherein the third conductive layer comprises a plurality of third pad structures, and the third pad structures are overlapped and electrically connected to the second pad structures.
In some embodiments, in the step of disposing the optoelectronic assembly, further comprising: disposing a plurality of conductive members on said electrodes, wherein said electrodes of said optoelectronic component are electrically connected to said second pad structure and said second trace through said conductive members.
In some embodiments, the light-transmissive substrate is a glass substrate.
In some embodiments, in the step of preparing the light-transmitting substrate, the light-transmitting substrate is a flexible substrate carried on a rigid substrate; and further comprising, after the step of disposing the optoelectronic component: the rigid substrate is removed.
In some embodiments, before the step of removing the rigid substrate, further comprising: attaching an optical film to the first surface of the transparent substrate.
In some embodiments, before or after the step of disposing the optoelectronic assembly, further comprising: and laying a protective layer on the first surface or the second surface of the light-transmitting substrate.
In some embodiments, the protective layer is disposed along the first or second side of the transparent substrate.
In some embodiments, the protective layer is disposed along the second surface of the transparent substrate and corresponds to at least the first conductive layer, the first insulating layer, the second conductive layer, or the second insulating layer, or a combination thereof.
In some embodiments, before or after the step of disposing the optoelectronic component, further comprising: and carrying out anti-reflection or/and anti-glare treatment to form the anti-reflection or/and anti-glare layer.
In some embodiments, the anti-reflection or/and anti-glare layer is formed on the first face or/and the second face of the light-transmitting substrate.
In some embodiments, the optoelectronic component is a millimeter or micron optoelectronic chip or optoelectronic package.
As described above, in the method for manufacturing a light-transmitting display module of the present invention, after the first conductive layer, the first insulating layer, the second conductive layer, and the second insulating layer are sequentially formed on the light-transmitting substrate by using a printing process, a plurality of optoelectronic devices are disposed on the light-transmitting substrate, such that a portion of electrodes of each optoelectronic device is electrically connected to the second pad structure (and the first conductive layer) of the second conductive layer, and a portion of electrodes is electrically connected to the second line of the second conductive layer through the second window defined by the second insulating layer. Therefore, the manufacturing method of the light-transmitting display module is different from the traditional manufacturing method by utilizing yellow light, etching and other processes, and has the advantages of simple process, lower cost and environmental protection.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a light-transmitting display module according to an embodiment of the invention.
Fig. 2 to 8C are schematic views illustrating a manufacturing process of a light-transmitting display module according to an embodiment of the invention.
Detailed Description
A method of manufacturing a light transmissive display module according to some embodiments of the present invention will be described below with reference to the accompanying drawings, in which like components are described with like reference numerals.
The term "transparent" used herein only excludes "opaque" and may include "transparent" or "semi-transparent" and other at least partially transparent states, such as a non-hundred percent light transmittance (or aperture ratio) exhibited by the pixel substrate after the circuit layer is disposed, or a haze formed by the pixel substrate due to the material itself.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a light-transmitting display module according to an embodiment of the invention. As shown in fig. 1, the method for manufacturing a light-transmitting display module according to the present invention at least includes the following steps: providing a light-transmissive substrate, wherein the light-transmissive substrate defines opposing first and second faces (step S01); printing a first conductive layer on the first surface of the light-transmitting substrate, wherein the first conductive layer includes a plurality of first lines arranged along a first direction, a plurality of first pad structures, and a plurality of leads extending from the first lines; wherein at least a portion of the first pad structure is extended by the first line (step S02); printing a first insulation layer on the first conductive layer, wherein the first insulation layer includes a plurality of first insulation lines running along the first direction, a plurality of second insulation lines running along a second direction, and a plurality of first windows exposing the lead lines, the second direction is perpendicular to the first direction and forms a plane, and the first insulation lines overlap the first lines (step S03); printing a second conductive layer on the first insulating layer, wherein the second conductive layer includes a plurality of second lines and a plurality of second pad structures arranged along the second direction, the second lines overlap the second insulating lines and are electrically connected to the leads through the first windows, and the second pad structures are electrically connected to the first pad structures (step S04); printing a second insulating layer on the second conductive layer, wherein the second insulating layer includes a plurality of third insulating lines running along the second direction and a plurality of second windows defined on the third insulating lines, and the third insulating lines overlap the second lines (step S05); and disposing a plurality of optoelectronic devices on the first surface of the transparent substrate, wherein each of the optoelectronic devices has a plurality of electrodes, a portion of the electrodes is electrically connected to the second pad structure, and a portion of the electrodes is electrically connected to the second trace through the second window (step S06).
Hereinafter, please refer to fig. 2 to 8C to describe the manufacturing process of the light-transmitting display module in detail. Fig. 2 to 8C are schematic views illustrating a manufacturing process of a light-transmitting display module according to an embodiment of the invention.
First, as shown in fig. 2, a transparent substrate 11 is prepared, wherein the transparent substrate 11 defines a first surface S1 and a second surface S2 opposite to each other (step S01). Here, the first surface S1 is an upper surface of the transparent substrate 11, and the second surface S2 is a lower surface of the transparent substrate 11. In addition, the transparent substrate 11 of the present embodiment further defines a first direction D1 along the vertical direction (extending along the upper and lower sides) in fig. 2 and a second direction D2 along the horizontal direction (extending along the left and right sides), and the first direction D1 is perpendicular to the second direction D2 and forms a plane (the plane is parallel to both the first surface S1 and the second surface S2).
In some embodiments, the transparent substrate 11 may be a rigid substrate or a flexible substrate (flexible substrate). The material of the transparent substrate 11 may be glass, resin, metal, ceramic, or composite material. In some embodiments, the light-transmissive substrate 11 may be, for example, a glass substrate or a Polyimide (PI) substrate. In some embodiments, the light-transmissive substrate 11 may be a transparent substrate or a translucent substrate (e.g., a matte substrate, partially light-transmissive). The transparent substrate has better image definition than the semitransparent substrate, and the material of the transparent substrate is determined according to the requirements of designers.
In some embodiments, if the transparent substrate 11 is a flexible substrate, in order to enable the subsequent components to be smoothly formed on the flexible substrate through the subsequent processes and facilitate the operation of the flexible substrate, the flexible substrate may be carried on a rigid substrate before the subsequent steps, and the rigid substrate may be removed after the step S06 of disposing the optoelectronic component. However, in order to make the flexible substrate (the transparent substrate 11) with the rigid substrate removed have sufficient strength and avoid being damaged in the manufacturing process, an optical film (not shown) may be attached to the first surface S1 of the transparent substrate 11 before the step of removing the rigid substrate, and then the rigid substrate may be removed. The optical film may be, for example, but not limited to, an optical adhesive (OCA). Of course, if the light-transmitting substrate 11 is a rigid substrate, the above-described process is not necessary.
Subsequently, step S02 is performed: the first conductive layer 12 is printed on the first surface S1 of the transparent substrate 11, wherein the first conductive layer 12 includes a plurality of first lines 121 running along the first direction D1 and substantially parallel to each other, a plurality of first pad structures 122, and a plurality of leads 123 extending from the first lines 121. At least part of the first pad structure 122 is extended by the first line 121. The "pad structure" referred to herein may be a conductive pad, or further include a portion extending from the conductive trace (without limitation to the directionality of the conductive trace, for example, a portion extending from the first trace 121 toward the second direction D2). In the present embodiment, the first pad structures 122 are formed by extending the first wires 121 to a single side, and can be used for conducting electricity. In some embodiments, in step S02 of printing first conductive layer 12, there may be a portion of first pad structure 122 that is not extended by first line 121, but is a conductive pad independent of first line 121; the first pad structure 122 printed independently of the first line 121 provides a height, which is beneficial to improving the continuity and smoothness of the subsequent process (printing process). In addition, the lead 123 of the present embodiment is formed by extending the first circuit 121 to at least one side (most of the two sides in the present embodiment), and the lead 123 is beneficial to improving the connectivity of the subsequent conductive material printing, increasing the contact area, and reducing the impedance. In some embodiments, the material of first conductive layer 12 (and/or the subsequent second conductive layer, and/or the third conductive layer) may use a single-layer or multi-layer structure of metal (e.g., aluminum, copper, silver, molybdenum, titanium) or an alloy thereof.
Thereafter, as shown in fig. 3A, step S03 is performed: printing a first insulation layer 13 on the first conductive layer 12, wherein the first insulation layer 13 includes a plurality of first insulation lines 131 running along a first direction D1 and substantially parallel to each other, a plurality of second insulation lines 132 running along a second direction D2 and substantially parallel to each other, and a plurality of first windows w1 exposing the lead lines 123 of the first conductive layer 12, and the first insulation lines 131 are respectively overlapped (or overlapped) on the first lines 121. Here, the first insulating layer 13 may be simply disposed along the first conductive layer 12 and covers the first conductive layer 12. The material of first insulating layer 13 (and/or a subsequent second insulating layer) may be black, white or transparent. The black material can shield light, improve contrast and visual effect of the transparent display module, the white material can improve light reflectivity of the transparent display module, and the transparent material can be used as a protection function or can be extended to the area outside the first conductive layer 12 by matching with other designs to achieve overall protection or more functions. The choice of the insulating material can be determined by the designer's requirements.
Specifically, in first insulating layer 13 of the present embodiment, first insulating line 131 and second insulating line 132 intersect each other at lead 123 in a discontinuous state to form first window w1, so that lead 123 can be exposed. In some embodiments, the second insulating line 132 may partially overlap both ends of the lead line 123, whereby the connectivity or smoothness of printing may be improved. It is worth reminding that the terms "overlap" and "overlap" as used herein may be either complete overlap (coincidence) or partial overlap (coincidence). The complete overlapping (overlapping) means that the upper layer completely covers the lower layer (for example, the layer on the lower side is not visible in the projection direction from the first surface S1 to the second surface S2), and the partial overlapping (overlapping) means that the upper layer cannot completely cover the layer on the lower side (the layer on one side or both sides is visible in the projection direction from the first surface S1 to the second surface S2).
In this embodiment, before the step S06 of disposing the optoelectronic device, a plurality of protection units corresponding to the optoelectronic device may be formed on the first surface S1 or/and the second surface S2 of the transparent substrate 11. As shown in fig. 3B, in the present embodiment, a plurality of protection units 18 corresponding to the optoelectronic devices are formed on the first surface S1 of the transparent substrate 11, so as to protect the optoelectronic devices disposed subsequently. The protection unit 18 may be fabricated on the first insulation layer 13 or the second insulation layer. The protection unit 18 of this embodiment is exemplified by a portion of the first insulation line 131 that is fabricated and covered in the first insulation layer 13. In some embodiments, protection unit 18 may be an insulating layer, and the material of the insulating layer may be the same as or different from that of first insulating layer 13 and/or second insulating layer. When the material of the protection unit 18 is the same as that of the first insulation layer 13 and/or the second insulation layer, the protection unit 18 may be printed at the same time in the process of printing the first insulation layer 13 (step S03) or/and the second insulation layer (step S05). Furthermore, in some embodiments, the protection unit 18 may be performed after the step S06 of disposing the optoelectronic component, and the invention is not limited thereto. In some embodiments, a plurality of protection units 18 corresponding to the optoelectronic device may also be formed on the second surface S2 of the transparent substrate 11, or on the first surface S1 and the second surface S2 at the same time. When the protection unit 18 is formed on the second surface S2 of the transparent substrate 11, the manufacturing steps are not limited to be performed before or after the step S06 of disposing the optoelectronic device. In addition, the protection unit 18 can be made of a colored material to shield the light emitted from the optoelectronic device toward the second surface S2 (lower side) of the transparent substrate 11, for example, when the protection unit 18 is made of a black material, the contrast and visual effect of the transparent display module can be improved; or the protective unit 18 may be made of a white material to improve the light reflectance. It should be noted that the protection unit 18 may not be provided in the present invention, and is not limited herein.
Subsequently, as shown in fig. 4, step S04 is performed again: printing a second conductive layer 14 on the first insulating layer 13, wherein the second conductive layer 14 includes a plurality of second lines 141 and a plurality of second pad structures 142 arranged along the second direction D2 and substantially parallel to each other, the second lines 141 respectively overlap the second insulating lines 132, and the second lines 141 are electrically connected to the leads 123 of the first conductive layer 12 through the first windows w1, respectively, that is, the material of the second lines 141 can be filled into the first windows w1 to be electrically connected to the leads 123. Furthermore, second pad structure 142 of second conductive layer 14 is electrically connected to first pad structure 122 of first conductive layer 12. Here, the second pad structure 142 may completely overlap or partially overlap the first pad structure 122, and this embodiment is exemplified by complete overlapping. As shown in fig. 4, three second pad structures 142 are respectively corresponding to the periphery of each protection unit 18 of the present embodiment, and each second pad structure 142 is electrically connected to each corresponding first pad structure 122 (refer to fig. 3B at the same time).
It is understood that the lead 123 in the first window w1 can be increased in thickness by repeated printing, and the material of the second trace 141 can be electrically connected to the lead 123 in a manner corresponding to but not filling the first window w 1. In some embodiments, in step S04 of printing second conductive layer 14, there may be portions of second pad structure 142 that do not extend from second line 141, but are electrically independent from second line 141; the second pad structures 142 printed on the second lines 141 independently can be used to increase the height, which is beneficial to improving the continuity and smoothness of the subsequent process (printing process); and the independent second pad structures 142 can be respectively stacked on the independent first pad structures 122. In addition, the material of second conductive layer 14 may be selected to be the same as or different from that of first conductive layer 12. It is understood that, in some embodiments, the portion of the second pad structure 142 extending from the second line 141 may not overlap the first pad structure 122 (regardless of whether the first pad structure 122 is electrically independent from the first line 121), or/and the portion of the second pad structure 142 extending from the second line 141 may overlap and be electrically connected to the independent first pad structure 122. Here, in the foregoing embodiment, when the conductivity of first conductive layer 12 is better than that of second conductive layer 14, the overall conductivity of second pad structure 142 and first pad structure 122 (regardless of whether first pad structure 122 and first line 121 are electrically independent) is better than the conductivity of second pad structure 142 alone.
Referring to fig. 5A to 5C, fig. 5B and 5C are schematic cross-sectional views along the cut lines 5B-5B and 5C-5C in fig. 5A, respectively. In this embodiment, after the step S04 of printing the second conductive layer 14 and before the next step S05 of printing the second insulating layer, the manufacturing method of the present invention may further include: printing a third conductive layer 17 on the second conductive layer 14, wherein the third conductive layer 17 includes a plurality of third pad structures 171, a portion of the third pad structures 171 overlaps and is electrically connected to the second lines 141 (fig. 5A and 5B), and a portion of the third pad structures 171 overlaps and is electrically connected to the second pad structures 142 (fig. 5A and 5C). Here, the third pad structure 171 of the third conductive layer 17 is located at the periphery (outside) of the protection unit 18, so that in the step S06 of subsequently disposing the optoelectronic components, the electrode positions corresponding to the optoelectronic components are all thickened, which is favorable for electrical connection of the optoelectronic components.
After the third conductive layer 17 is completed, next, as shown in fig. 6, step S05 is performed again: a second insulating layer 15 is printed on the second conductive layer 14, wherein the second insulating layer 15 includes a plurality of third insulating lines 151 running along the second direction D2 and substantially parallel to each other, and a plurality of second windows w2 defined on the third insulating lines 151, and the third insulating lines 151 respectively overlap the second lines 141. In the present embodiment, each of the second windows w2 corresponds to a position of the third pad structure 171 to expose the third pad structure 171 on the second line 141. It should be noted that, in the process of printing the first insulation layer 13 or the second insulation layer 15, the first insulation line 131 and the second insulation line 132 printed on the first line 121 and the second line 141 respectively may cover two sidewalls of the conductive line, so as to improve protection and insulation effects of the conductive line, or protection and insulation effects of oxidation and the like.
In addition, in the above-mentioned embodiment, the second insulation layer 15 (the third insulation lines 151) printed along the second direction D2 is only laid out, but not limited thereto, in some embodiments, the second insulation layer 15 (for example, the fourth insulation lines not shown in the figures) may also be printed on the first insulation lines 131 laid along the first direction D1, and besides the function of protecting or shielding the first insulation lines 131, the height may also be increased; moreover, if the color of the second insulation layer 15 is different from that of the first insulation layer 13, the second insulation layer 15 arranged along the first direction D1 and the second direction D2 can also maintain the consistency of the color of the insulation layer of the light-transmitting display module.
It is particularly noted that the above-mentioned process of printing the third conductive layer 17 may also be performed after the step S05 of printing the second insulating layer 15. In other words, after the step S05 of printing the second insulating layer 15, the process of printing the third conductive layer 17 is performed. In this embodiment, since the second insulating layer 15 is printed first, the second windows w2 defined on the third insulating lines 151 of the second insulating layer 15 will expose a portion of the second lines 141, and then a portion of the third pad structures 171 printed subsequently will correspond to the second windows w2 and be electrically connected to the second lines 141, and a portion of the third pad structures 171 will be overlapped and electrically connected to the second pad structures 142.
In addition, in some embodiments, the step of printing the third conductive layer 17 on the second conductive layer 14 may be before or after the step of printing the second insulating layer S05, and the third conductive layer 17 includes a plurality of third pad structures 171, and the third pad structures 171 are stacked and electrically connected to the second pad structures 142. In other words, only the third pad structure 171 is printed on the position of the second pad structure 142, and the third pad structure 171 corresponding to the electrode position is not printed on the second wiring 141. It is understood that the third pad structure 171 of the third conductive layer 17 may be increased in thickness by repeated printing, such as printing only on the position of the second pad structure 142, or further printing on the second line 141, or alternatively applying the above two methods.
Finally, as in fig. 7 to 8C, step S06 is performed: disposing a plurality of optoelectronic devices 16 on the first surface S1 of the transparent substrate 11, wherein each of the optoelectronic devices 16 has a plurality of electrodes E (shown in fig. 8B and 8C), a portion of the electrodes E of each of the optoelectronic devices 16 is electrically connected to the second pad structure 142 (fig. 8C), and a portion of the electrodes E of each of the optoelectronic devices 16 is electrically connected to the second line 141 (fig. 8B) through the second window w2, thereby obtaining the transparent display module 1. In some embodiments, the optoelectronic device 16 may be bonded to the protection unit 18 on the first side S1 of the transparent substrate 11 by an adhesive layer (e.g., an adhesive glue, not shown).
In this embodiment, in order to electrically connect the electrode E of the optoelectronic device 16 with the second pad structure 142 (and the first pad structure 122) and the second line 141, respectively, a plurality of conductive elements C may be disposed on the electrode E, as shown in fig. 8B, a part of the electrode E is electrically connected to the second line 141 of the second conductive layer 14 through the conductive elements C and the third pad structure 171; as shown in fig. 8C, a portion of the electrode E is electrically connected to the first pad structure 122 through the conductive member C, the third pad structure 171 and the second pad structure 142. In some embodiments, the conductive component C may include a conductive material, such as copper paste, silver paste, solder paste, or Anisotropic Conductive Paste (ACP), which may be disposed at a through hole in the optoelectronic component 16 or at a side of the optoelectronic component 16 (for example, in this embodiment), so as to electrically connect the electrode E of the optoelectronic component 16 to the second line 141 and the first pad structure 122 (the first line 121) of the second conductive layer 14. In some embodiments, the optoelectronic component 16 is a standard SMD component, and the conductive element C may be located on a side of the optoelectronic component 16 where the electrode E is located toward the transparent substrate 11, for example, between the electrode E of the optoelectronic component 16 and the second pad structure 142 (and the first pad structure 122) and the second line 141. The conductive element C may be a Direct Mount (Direct Mount) through a hole in the surface of the optoelectronic device 16, or the optoelectronic device 16 may be a standard SMD device and may be directly connected (Direct Mount), or a Jumper (Side Jumper) located at the Side of the optoelectronic device 16, or other equivalent electrical connection.
In some embodiments, the optoelectronic component 16 may be a millimeter or micron optoelectronic chip or package. In some embodiments, each optoelectronic component 16 may include, for example, but not limited to, at least one light emitting diode chip (LED chip), milli-light emitting diode chip (Mini LED chip), Micro-light emitting diode chip (Micro LED chip), or at least one package, or an optoelectronic chip or package of an unlimited size in the millimeter, micron, or below. The millimeter-scale package may include a micron-scale chip. In some embodiments, each optoelectronic component 16 may include an optoelectronic chip or package, whereby the optoelectronic component 16 is understood to be a single pixel; alternatively, in some embodiments, each optoelectronic assembly 16 may include a plurality of optoelectronic chips or packages, which may be understood as an optoelectronic assembly 16 including a plurality of pixels. In some embodiments, LEDs, such as red, blue, or green LEDs, Mini LEDs, or Micro LED chips, or other color LEDs, Mini LEDs, or Micro LED chips or packages may be included in the optoelectronic assembly 16. When the three optoelectronic chips or packages on the optoelectronic device 16 are red, blue and green LEDs, Mini LEDs, or Micro LED chips, respectively, a full-color LED, Mini LED, or Micro LED display can be formed. The chip can be a die with horizontal electrodes, or flip-chip electrodes, or vertical electrodes, and is electrically connected to the electrode E by wire bonding or flip-chip bonding.
In some embodiments, before or after the step S06 of disposing the optoelectronic device 16, the method of manufacturing of the present invention may further include: laying a protective layer (not shown) on the first side S1 of the transparent substrate 11, the protective layer being capable of being laid all over along the first side S1 of the transparent substrate 11 to protect the relevant components covered thereby; or further, the positions of the power-guiding structures such as the first conductive layer 12, the second conductive layer 14, etc. are equivalent to the stress neutral layer of the overall structure, so as to further protect the aforementioned power-guiding structures. In some embodiments, before or after the step S06 of disposing the optoelectronic device 16, the method of manufacturing of the present invention may further include: a protective layer (not shown) is disposed on the second surface S2 of the transparent substrate 11 to further balance possible Warpage (warp) of the transparent substrate 11. In some embodiments, the protective layer may be globally laid along the second side S2 of the light-transmissive substrate 11, thereby improving the overall structural strength of the light-transmissive display module; here, the protective layer laid over the entire surface is transparent. In some embodiments, a protection layer may be disposed corresponding to at least first conductive layer 12, first insulating layer 13, second conductive layer 14, or second insulating layer 15, or a combination thereof, so as to balance the stress formed by first conductive layer 12, first insulating layer 13, second conductive layer 14, or second insulating layer 15, or more other layers, or a combination thereof on first side S1 of transparent substrate 11. The protective layer provided on the first surface S1 or the second surface S2 of the light-transmitting substrate 11, or provided locally may be black for contrast, white for reflection, or provided entirely so as to be transparent for blocking light. In addition, the protection layer may be implemented together with the first insulation layer 13, the second insulation layer 15, or other protection layers, or may be implemented independently, which is not limited.
In some embodiments, before or after the step S06 of disposing the optoelectronic device 16, the method of manufacturing of the present invention may further include: an anti-reflection or/and anti-glare treatment is performed to form an anti-reflection or/and anti-glare layer (not shown). Wherein, the anti-reflection or/and anti-glare layer may be formed on the first face S1 or/and the second face S2 of the light-transmitting substrate 11. In some embodiments, the anti-reflection or/and anti-glare treatment may be performed during the step S01 of preparing the transparent substrate 11, and the anti-reflection or/and anti-glare effect may be achieved.
In summary, in the manufacturing method of the transparent display module of the present invention, after the first conductive layer, the first insulating layer, the second conductive layer and the second insulating layer are sequentially formed on the transparent substrate by using a printing process, the plurality of optoelectronic devices are disposed on the transparent substrate, so that a part of electrodes of each of the optoelectronic devices is electrically connected to the second pad structure (and the first conductive layer) of the second conductive layer, and meanwhile, a part of the electrodes is electrically connected to the second line of the second conductive layer through the second window defined by the second insulating layer. Therefore, the manufacturing method of the light-transmitting display module is different from the traditional method for manufacturing by utilizing yellow light, etching and other processes, and has the advantages of simple process, lower cost and environmental protection.
The foregoing is by way of example only, and not limiting. Any equivalent modifications or variations without departing from the spirit and scope of the present invention should be included in the scope of the appended claims.

Claims (20)

1. A method for manufacturing a light-transmitting display module at least comprises the following steps:
providing a light-transmissive substrate, wherein the light-transmissive substrate defines opposing first and second faces;
printing a first conductive layer on the first surface of the light-transmitting substrate, wherein the first conductive layer includes a plurality of first lines arranged along a first direction, a plurality of first pad structures, and a plurality of leads extending from the first lines; wherein at least a portion of the first pad structure is extended by the first line;
printing a first insulation layer on the first conductive layer, wherein the first insulation layer includes a plurality of first insulation lines arranged along the first direction, a plurality of second insulation lines arranged along a second direction, and a plurality of first windows exposing the lead wires, the second direction is perpendicular to the first direction and forms a plane, and the first insulation lines overlap the first lines;
printing a second conductive layer on the first insulating layer, wherein the second conductive layer includes a plurality of second lines and a plurality of second pad structures arranged along the second direction, the second lines overlap the second insulating lines and are electrically connected to the leads through the first windows, and the second pad structures are electrically connected to the first pad structures;
printing a second insulating layer on the second conductive layer, wherein the second insulating layer includes a plurality of third insulating lines arranged along the second direction and a plurality of second windows defined on the third insulating lines, and the third insulating lines overlap the second lines; and
disposing a plurality of optoelectronic devices on the first surface of the light-transmissive substrate, wherein each of the optoelectronic devices has a plurality of electrodes, a portion of the electrodes is electrically connected to the second pad structure, and a portion of the electrodes is electrically connected to the second trace through the second window.
2. A method of manufacturing according to claim 1, wherein, in the step of printing the first conductive layer, portions of the first pad structure are independent of the first lines.
3. The manufacturing method according to claim 1, further comprising, before or after the step of disposing the optoelectronic component:
and forming a plurality of protection units corresponding to the photoelectric assembly on the first surface or/and the second surface of the light-transmitting substrate.
4. The manufacturing method according to claim 3, wherein the protection unit is formed simultaneously in the step of printing the first insulating layer or/and the second insulating layer.
5. A method of manufacturing according to claim 1, wherein in the step of printing the second conductive layer, portions of the second pad structure are independent of the second lines.
6. A method of manufacturing according to claim 2, wherein in the step of printing the second conductive layer, part of the second pad structure overlaps with part of the first pad structure independent or independent of the second line.
7. The manufacturing method according to claim 1, wherein, in the step of printing the second conductive layer, the conductivity of the first conductive layer is better than the conductivity of the second conductive layer.
8. The method of manufacturing according to claim 1, wherein prior to the step of printing the second insulating layer, further comprising:
printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, a portion of the third pad structures overlaps and is electrically connected to the second line, and a portion of the third pad structures overlaps and is electrically connected to the second pad structures.
9. The manufacturing method according to claim 1, further comprising, after the step of printing the second insulating layer:
printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, a portion of the third pad structures corresponds to the second window and is electrically connected to the second line, and a portion of the third pad structures is stacked and electrically connected to the second pad structures.
10. The manufacturing method according to claim 1, wherein before or after the step of printing the second insulation layer, further comprising:
and printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, and the third pad structures are stacked and electrically connected to the second pad structures.
11. The manufacturing method according to claim 1, wherein in the step of providing the optoelectronic component, further comprising:
and laying a plurality of conductive members on the electrodes, wherein the electrodes of the optoelectronic assembly are electrically connected to the second pad structure and the second circuit through the conductive members.
12. The manufacturing method according to claim 1, wherein the light-transmitting substrate is a glass substrate.
13. The manufacturing method according to claim 1, wherein in the step of preparing the light-transmitting substrate, the light-transmitting substrate is a flexible substrate supported on a rigid substrate; and further comprising, after the step of disposing the optoelectronic component:
removing the rigid substrate.
14. The method of manufacturing of claim 13, wherein prior to the step of removing the rigid substrate, further comprising:
attaching an optical film to the first surface of the transparent substrate.
15. The method of manufacturing of claim 1, wherein before or after the step of disposing the optoelectronic component, further comprising:
and laying a protective layer on the first surface or the second surface of the light-transmitting substrate.
16. The manufacturing method according to claim 15, wherein the protective layer is entirely laid along the first face or the second face of the light-transmitting substrate.
17. The method according to claim 15, wherein the protective layer is disposed along the second surface of the transparent substrate and corresponds to at least the first conductive layer, the first insulating layer, the second conductive layer, or the second insulating layer, or a combination thereof.
18. The manufacturing method according to claim 1, further comprising, before or after the step of disposing the optoelectronic component:
and carrying out anti-reflection or/and anti-glare treatment to form the anti-reflection or/and anti-glare layer.
19. A manufacturing method according to claim 18, wherein the anti-reflection or/and anti-glare layer is formed on the first face or/and the second face of the light-transmitting substrate.
20. The method of manufacturing according to claim 1, wherein the optoelectronic component is a millimeter or micrometer scale optoelectronic chip or optoelectronic package.
CN202011200179.7A 2020-10-30 2020-10-30 Method for manufacturing light-transmitting display module Pending CN114447012A (en)

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Application Number Priority Date Filing Date Title
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