CN214378429U

CN214378429U - Display module

Info

Publication number: CN214378429U
Application number: CN202120107939.3U
Authority: CN
Inventors: 李刚; 钟伟荣; 刘运筹
Original assignee: Shenzhen Dadao Semiconductor Co ltd
Current assignee: Shenzhen Dadao Semiconductor Co ltd
Priority date: 2021-01-14
Filing date: 2021-01-14
Publication date: 2021-10-08
Anticipated expiration: 2031-01-14

Abstract

The utility model discloses a display module, which comprises a circuit board with a first surface and a second surface which are opposite, a first conductive circuit arranged on the first surface of the circuit board, a light-emitting chip, a matte layer and a first black ink layer; the light-emitting chip is in conductive connection with the first conductive circuit; the matte layer wraps the surface and the exposed side face of the light-emitting chip on the first surface; the first black ink layer is located on the matte layer, and the first black ink layer is provided with at least one first opening corresponding to the upper part of the light-emitting chip, and the matte layer located above the light-emitting chip is exposed. The utility model discloses a display module assembly, through the cooperation setting of inferior photosphere, black layer of china ink and luminescence chip, solved the inherent contradiction between the high luminousness of light-emitting surface and the high black degree of non-light-emitting surface to promote contrast and luminance by a wide margin, further reduce display module assembly's consumption, processing is simple, with low costs, good reliability.

Description

Display module

Technical Field

The utility model relates to a display module assembly technical field especially relates to a display module assembly.

Background

The RGB display module based on the semiconductor light-emitting element is widely applied to the field of indoor and outdoor display. With the reduction of the pixel size and the pixel pitch, the miniLED-based high-definition ultra-fine pitch display module is one of the keys for realizing 8K ultra-high resolution, medium and large-size televisions and displays.

A conventional display module structure is shown in fig. 1, and includes a substrate 11, a light emitting device 12 disposed on the substrate 11, wherein the light emitting device 12 generally includes a support 121, a light emitting chip 122 and a light transmissive layer 123. To realize an RGB display, each light emitting element 12 typically includes at least a red chip, a blue chip, and a green chip. As can be seen from fig. 1, since each light emitting element 12 has the holder 121, miniaturization of the light emitting element 12 is greatly limited. Even if the size of the light emitting elements 12 can be made small, for example, 1mmx1mm, each light emitting element 12 includes at least four external connection pads because each light emitting element 12 includes at least one red chip, one blue chip, and one green chip. Since the size of the light emitting element 12 is too small and the size of the pad is limited, the strength of reflow soldering of the light emitting element 12 to the substrate 11 is low, and the flatness and pitch are not easily controlled. Thousands of light emitting elements 12 which are closely arranged and reflow-soldered on the substrate 11 are easily detached by external force such as collision, vibration, extrusion, etc., resulting in poor display effect, cumbersome repair work, and high cost.

To solve the problem of miniaturization of the light emitting device, another conventional display module is shown in fig. 2, and includes a substrate 21, a light emitting chip 22, and a light transmissive layer 23. As shown in fig. 2, the light emitting chip 22 replaces the light emitting element 12 in fig. 1, since the light emitting chip 22 itself has no support, the size can be minimized, the light transmitting layer 23 can not only protect the gold wires, but also play a role in moisture protection, dust protection, and collision prevention, and the light emitting chip 22 is not easily damaged by external force.

When the display module of fig. 2 is used for RGB display, the reflectivity of the non-light-emitting surface must be reduced in order to improve the contrast or contrast of the displayed image. Ideally, the non-light-emitting surface is completely blackened. Based on the structure shown in fig. 2, in order to improve the contrast or contrast of the displayed image, it is a common practice to dope a colorant into the light-transmitting layer 23 to increase the degree of black of the light-transmitting layer 23, and at the same time, since the incorporation of the colorant also greatly reduces the light transmittance of the light-transmitting layer 23, approximately 40% of the light emitted from the light-emitting chip 22 is absorbed by the light-transmitting layer 23. Under the same power density, the brightness of the display module is greatly reduced. If the brightness is increased by increasing the power density, it will bring much burden to the power configuration, the driving choice, the heat conduction and the heat dissipation design, and will increase the cost. As can be seen from fig. 2, there is an irreconcilable conflict between the increase of the degree of blackness of the non-light-exit surface and the increase of the light transmittance of the light-transmissive layer. The higher the degree of black, the lower the light transmittance; alternatively, the higher the light transmittance, the lower the degree of ink-black. From the display effect, the higher the contrast or contrast, the greater the brightness sacrifice; alternatively, the higher the brightness, the lower the contrast or contrast.

Therefore, the above-mentioned display module structure has inherent defects and shortcomings, and cannot solve the contradiction between the high transmittance of the light-emitting surface and the high black level of the non-light-emitting surface, and also cannot solve the contradiction between the brightness improvement and the contrast or contrast increase.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in providing a solve the inherent contradiction between the high black degree of light-emitting surface high luminousness and non-light-emitting surface, promote the display module assembly of contrast and luminance.

The utility model provides a technical scheme that its technical problem adopted is: the display module comprises a circuit board, a first conductive circuit, a light emitting chip, a matte layer and a first black ink layer, wherein the circuit board is provided with a first surface and a second surface which are opposite to each other;

the light-emitting chip is in conductive connection with the first conductive circuit; the matte layer wraps the surface and the exposed side face of the light-emitting chip on the first surface;

the first black ink layer is located on the matte layer, and the first black ink layer is provided with at least one first opening corresponding to the upper part of the light-emitting chip, and the matte layer located above the light-emitting chip is exposed.

Preferably, the display module further comprises a second ink black layer;

the second ink black layer is arranged between the first surface and the matte layer, at least one second opening is formed in the second ink black layer, and the light-emitting chip is located in the second opening.

Preferably, an inner wall surface of the second opening is attached to a side surface of the corresponding light emitting chip; alternatively, the first and second electrodes may be,

and a gap is reserved between the inner wall surface of the second opening and the side surface of the corresponding light-emitting chip, and the matte layer fills the gap.

Preferably, the second ink black layer is made of one or more of silica gel, epoxy resin, photosensitive ink and photosensitive glue; one or more of diffusion powder, matte powder and coloring powder are doped in the silica gel or the epoxy resin.

Preferably, the display module further comprises a second conductive circuit arranged on the second surface of the circuit board, and a conductive channel arranged in the circuit board and penetrating through the first surface and the second surface; the second conductive circuit is conductively connected to the first conductive circuit through the conductive via.

Preferably, the display module further comprises an auxiliary circuit board and/or an electronic device which are in conductive connection with the second conductive circuit.

The utility model provides another display module, which comprises a circuit board with a first surface and a second surface which are opposite, a first conductive circuit arranged on the first surface of the circuit board, a light-emitting chip, a matte layer and an ink black layer;

the ink black layer is arranged between the first surface and the matte layer, at least one opening is formed in the ink black layer, and the light-emitting chip is located in the opening.

Preferably, the inner wall surface of the opening is attached to the side surface of the corresponding light emitting chip; alternatively, the first and second electrodes may be,

and gaps are reserved between the inner wall surfaces of the openings and the corresponding side surfaces of the light-emitting chips, and the sub-optical layers fill the gaps.

The utility model discloses a display module assembly, through the cooperation setting of inferior photosphere, black layer of china ink and luminescence chip, solved the inherent contradiction between the high luminousness of light-emitting surface and the high black degree of non-light-emitting surface to promote contrast and luminance by a wide margin, further reduce display module assembly's consumption, processing is simple, with low costs, good reliability.

The utility model discloses a display module's manufacturing method flow is short, simple process, low in manufacturing cost, is applicable to big large tracts of land industrialization production in batches.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

FIG. 1 and FIG. 2 are schematic cross-sectional views of two display modules in the prior art;

fig. 3 is a schematic cross-sectional view of a display module according to a first embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a display module according to a second embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a display module according to a third embodiment of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 3, the display module according to the first embodiment of the present invention may include a circuit board 30, a first conductive circuit 31, a second conductive circuit 32, a light emitting chip 33, a matte layer 34, and a first black layer 35.

The wiring board 30 has opposing first and second surfaces. A first conductive circuit 31 is disposed on the first surface and a second conductive circuit 32 is disposed on the second surface and is conductively coupled to the first conductive circuit 31. Alternatively, the circuit board 30 is provided with a conductive path 300 penetrating through the first surface and the second surface, and the second conductive circuit 32 is electrically connected to the first conductive circuit 31 through the conductive path 300.

The wiring board 30 may be, but is not limited to, a ceramic-based wiring board, a glass-based wiring board, or a conventional PCB board. The first conductive circuit 31 and the second conductive circuit 32 may be formed of a single-layer or multi-layer wiring, respectively.

The light emitting chip 33 is disposed on the first surface of the circuit board 30 and electrically connected to the first conductive circuit 31, and the connection manner may be, but is not limited to, one or more combinations of laser welding, reflow soldering, thermal compression soldering, and metal bonding wire. The light emitting chip 33 may be one or more. The light emitting chip 33 may be, but is not limited to, one or more combinations of a flip chip, a face-up chip, and a vertical chip.

The matte layer 34 wraps the surface and the exposed side of the light emitting chip 33 on the first surface of the wiring board 30. The sub-optical layer 34 may also cover a part or all of the first surface on which the light emitting chip 33 is not disposed. The upper surface of the matte layer 34 facing away from the wiring board 30 may be a flat surface (not shown) or a concave-convex surface (as shown in fig. 3). The concave-convex surface is formed by wrapping the light-emitting chip 33 by the sub-optical layer 34.

The matte layer 34 is made of epoxy resin or silica gel, is partially transparent, and is doped with one or more of matte powder, diffusion powder and coloring powder. The matte layer 34 is typically formed by a mask spray, spray or stamp process.

The first ink black layer 35 is disposed on the first surface of the wiring board 30 and forms at least one first opening 350, and the first opening 350 corresponds to above the light emitting chip 33, exposing the sub-optical layer 34 above the light emitting chip 33. One first opening 350 may correspond to above one or more light emitting chips 33.

The first black ink layer 35 is black ink, is a bright surface or a matte surface, and is made of one or a combination of silica gel, epoxy resin, photosensitive ink and photosensitive glue; in the case of silica gel or epoxy resin, one or more of a diffusing powder, a matte powder and a coloring powder are mixed therein.

Referring to fig. 3, the first ink black layer 35 is opaque black, and the degree of the ink black of the first ink black layer 35 does not affect the degree of the light transmission of the light emitted from the light emitting chip 33 through the matte layer 34 above the first ink black layer, because the first opening 350 is left. Meanwhile, the matte layer 34 exposed by the first opening 350 has the light transmittance adjusted without affecting the black level of the first black layer 35, so that the contradiction between the black level and the light transmittance can be well solved. From the viewpoint of display effect, the contrast or contrast can be improved by increasing the degree of black of the first black layer 35 without sacrificing brightness, and the brightness can also be improved by increasing the light transmittance of the matte layer 34 without sacrificing contrast or contrast.

The display module of the present embodiment further includes an auxiliary circuit board 310 and/or an electronic device 320 electrically connected to the second conductive circuit 32, as required. For a display module in which the auxiliary circuit board 310 and the electronic device 320 are both disposed, the electronic device 320 may be disposed on the auxiliary circuit board 310 and electrically connected to the second conductive circuit 32 through the auxiliary circuit board 310.

The method for manufacturing a display module of the first embodiment may include the following steps:

s1, disposing the first conductive circuit 31 on the first surface of the circuit board 30, disposing the second conductive circuit 32 on the second surface of the circuit board 30, disposing the conductive via 300 penetrating the first surface and the second surface on the circuit board 30, and electrically connecting the first conductive circuit 31 and the second conductive circuit 32 with the conductive via 300, respectively.

S2, disposing the light emitting chip 33 on the first surface of the wiring board 30, and electrically connecting the light emitting chip 33 with the first conductive circuit 31.

S3, disposing the matte layer 34 on the first surface of the circuit board 30, wherein the matte layer 34 covers the surface and the exposed side of the light emitting chip 33, and the matte layer 34 covers a part or all of the first surface where the light emitting chip 33 is not disposed.

S4, disposing a first black ink layer 35 on the first surface of the circuit board 30, forming at least one first opening 350 on the first black ink layer 35, wherein the first opening 350 corresponds to the top of the light emitting chip 33, and exposing the matte layer 34 above the light emitting chip 33.

S5, disposing the electronic device 320 on the second surface of the wiring board 30, and electrically connecting the electronic device 320 with the second conductive circuit 32; and/or, at least one auxiliary circuit board 310 is arranged on the second surface of the circuit board 30, and the auxiliary circuit board 310 is electrically connected with the second conductive circuit 32. The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary wiring board 310.

Specifically, in the first embodiment, step S4 includes:

s4.1, disposing a first black ink layer 35 on the first surface of the circuit board, and disposing the first black ink layer 35 by printing or spin-coating photosensitive ink or photosensitive glue.

And S4.2, arranging a mask on the surface of the first ink black layer 35.

And S4.3, exposing and curing the first ink black layer 35 which is not covered by the mask.

S4.4, removing the mask.

And S4.5, developing and removing the first ink black layer 35 covered by the mask to form a first opening 350, and exposing the matte layer 34 positioned above the light-emitting chip 33.

S4.6, the first ink black layer 35 is thermally cured.

In the second embodiment, step S4 includes:

And S4.2, arranging a mask on the surface of the first ink black layer 35.

S4.3, exposing the first black layer 35 uncovered by the mask.

S4.4, removing the mask.

And S4.5, developing and removing the first ink black layer 35 uncovered by the mask to form a first opening 350, and exposing the matte layer 34 positioned above the light-emitting chip 33.

S4.6, the first ink black layer 35 is thermally cured.

In the third embodiment, step S4 includes:

and S4.1, arranging a mask on the first surface of the circuit board, wherein the opening of the mask corresponds to the first surface without the light-emitting chip 33.

And S4.2, arranging a first ink black layer 35 on the mask, and arranging the first ink black layer 35 by generally adopting a method of printing or spraying epoxy resin or silica gel, wherein the silica gel or the epoxy resin is mixed with one or more of diffusion powder, matte powder and coloring powder.

S4.3, removing the mask or pre-curing, and removing the mask to form the first black ink layer 35 with the first opening 350.

S4.4, curing the first ink black layer 35.

As shown in fig. 4, the display module according to the second embodiment of the present invention may include a circuit board 30, a first conductive circuit 31, a second conductive circuit 32, a light emitting chip 33, a matte layer 34, a first black layer 35, and a second black layer 36.

The second embodiment adds a second ink black layer 36 as compared with the first embodiment. The specific arrangement of the circuit board 30, the first conductive circuit 31, the second conductive circuit 32, the light emitting chip 33, the matte layer 34 and the first black ink layer 35 can refer to the first embodiment, and will not be described herein again.

In the present embodiment, the second ink black layer 36 is provided between the first surface of the wiring board 30 and the matte layer 34. For the first surface portion not covered with the matte layer 34, the second ink black layer 36 may also be simultaneously provided between the first ink black layer 35 and the first surface.

The second ink black layer 36 has at least one second opening 360, and the light emitting chip 33 is located in the second opening 360; one second opening 360 may have one or more light emitting chips 33.

The inner wall surface of the second opening 360 is attached to or spaced apart from the side surface of the corresponding light emitting chip 33. For voids to remain, the matte layer 34 fills the voids.

The matte layer 34 wraps the surface and the exposed side of the light-emitting chip 33 on the first surface, covering part or all of the surface of the second ink black layer 36. Further, the matte layer 34 may also cover a part or all of the exposed first surface of the wiring board 30 where the light-emitting chip 33 is not provided and where it is not covered with the second ink black layer 36.

The second black layer 36 is black and is made of one or more of silica gel, epoxy resin, photosensitive ink, and photosensitive glue. Wherein, the silica gel or the epoxy resin is mixed with one or more of diffusion powder, matte powder and coloring powder.

In this embodiment, the second ink black layer 36 can reduce or prevent light channeling between the light emitting chips 33, reduce the light guiding effect of the matte layer 34, and improve the display effect.

The method for manufacturing a display module according to the second embodiment may include the following steps:

Step S2 further includes the steps of:

and S2.1, arranging a second ink black layer 36 on the first surface of the circuit board 30, wherein the second ink black layer 36 is provided with at least one second opening 360, and the light-emitting chip 33 is arranged in the second opening 360.

The inner wall surface of the second opening 360 is attached to the exposed side surface of the corresponding light emitting chip 33 or a gap is left.

In particular, in the first embodiment, step S2.1 comprises:

s2.1.1, disposing the second black ink layer 36 on the first surface of the circuit board 30, the second black ink layer 36 can be disposed by dispensing and naturally leveling silica gel or epoxy resin, which is doped with one or more of diffusing powder, matte powder and coloring powder.

S2.1.2, the second black ink layer 36 is cured by heating under vacuum or non-vacuum conditions.

In a second embodiment, step S2.1 comprises:

s2.1.1, a mask is arranged on the first surface of the circuit board 30, and the first surface of the light emitting chip 33 is exposed at the opening of the mask.

S2.1.2, disposing the second black ink layer 36 on the mask, the second black ink layer 36 can be disposed by printing or spraying a silicone or epoxy resin, which is doped with one or more of a diffusing powder, a matte powder, and a coloring powder.

S2.1.3, removing the mask or pre-curing the mask, forming a second black ink layer 36 on the first surface where the light emitting chip 33 is not disposed, and forming a second opening 360 at the position where the light emitting chip 33 is disposed such that the light emitting chip 33 is located in the second opening 360.

The second opening 360 exposes the surface of the light emitting chip 33, or exposes the surface of the light emitting chip 33 and a gap formed between the light emitting chip 33 and the second ink black layer 36.

S2.1.4, under vacuum or non-vacuum conditions, the second ink black layer 36 is cured.

In a third embodiment, step S2.1 comprises:

s2.1.1, disposing the second black ink layer 36 on the first surface of the wiring board 30, the second black ink layer 36 is typically disposed by printing or spin coating a photosensitive ink or photoresist.

S2.1.2, a mask is provided on the surface of the second ink black layer 36.

The mask opening corresponds to above the second ink black layer 36 where the light emitting chip 33 is not disposed.

S2.1.3, the second black ink layer 36 not covered by the mask is cured by exposure.

S2.1.4, removing the mask.

S2.1.5, the second ink layer 36 covered by the mask is removed by development to form a second opening 360, and the light emitting chip 33 disposed in the second opening 360 is exposed.

The surface of the light emitting chip 33, or the surface of the light emitting chip 33 and the gap formed between the light emitting chip 33 and the second ink black layer 36 are exposed within the second opening 360.

S2.1.6, thermally curing the second ink black layer 36.

In a fourth embodiment, step S2.1 comprises:

S2.1.2, a mask is provided on the surface of the second ink black layer 36.

The mask opening corresponds above the light emitting chip 33 and the second ink black layer 36.

S2.1.3, exposing the second black layer of ink 36 not covered by the mask.

S2.1.4, removing the mask.

S2.1.5, the second ink layer 36 uncovered by the mask is removed by development, and a second opening 360 is formed to expose the light emitting chip 33 disposed in the second opening 360.

S2.1.6, thermally curing the second ink black layer 36.

Alternatively, the light emitting chip 33 may be disposed on the first surface of the wiring board 30 first, and then the second ink black layer 36 may be disposed; alternatively, the second ink black layer 36 may be disposed on the first surface of the wiring board 30, and the light emitting chip 33 may be disposed on the first surface of the wiring board 30 and in the second opening 360 of the second ink black layer 36. An appropriate embodiment is selected by the order in which the light emitting chip 33 and the second ink black layer 36 are disposed.

And S3, arranging a matte layer 34 on the first surface of the circuit board 30, wherein the matte layer 34 wraps the surface and the exposed side surface of the light-emitting chip 33.

The matte layer 34 is disposed above the second ink black layer 36, covering a part or all of the surface of the second ink black layer 36. When a gap is left between the inner wall surface of the second opening 360 of the second ink black layer 36 and the side surface of the corresponding light emitting chip 33, the matte layer 34 fills the gap. The matte layer 34 also covers a part or all of the exposed first surface of the wiring board 30 where the light-emitting chip 33 is not provided and which is not covered with the second ink black layer 36.

The specific arrangement of the first ink black layer 35 can refer to the arrangement of the first embodiment, and is not described herein again.

S5, disposing the electronic device 320 on the second surface of the wiring board 30, and electrically connecting the electronic device with the second conductive circuit 32; and/or, at least one auxiliary circuit board 310 is arranged on the second surface of the circuit board 30, and the auxiliary circuit board 310 is electrically connected with the second conductive circuit 32. The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary wiring board 310.

As shown in fig. 5, the display module according to the third embodiment of the present invention includes a circuit board 30, a first conductive circuit 31, a second conductive circuit 32, a light emitting chip 33, a matte layer 34, and an ink black layer 37.

The wiring board 30 may be, but is not limited to, a ceramic based wiring board, a glass based wiring board, or a conventional PCB board. The first conductive circuit 31 and the second conductive circuit 32 may be formed of a single-layer or multi-layer wiring, respectively.

The matte layer 34 wraps the surface and the exposed side of the light emitting chip 33 on the first surface of the wiring board 30. The upper surface of the matte layer 34 away from the circuit board 30 may be a flat surface or a concave-convex surface; the concave-convex surface is formed by wrapping the light-emitting chip 33 by the sub-optical layer 34.

The ink black layer 37 is disposed between the first surface of the wiring board 30 and the matte layer 34, the ink black layer 37 is provided with at least one opening 370, the light emitting chip 33 is located in the opening 370, and one or more light emitting chips 33 may be located in one opening 370. The black ink layer 37 is black ink and is made of one or a combination of silica gel, epoxy resin, photosensitive ink and photosensitive glue; the silica gel or the epoxy resin is doped with one or more of diffusion powder, matte powder and coloring powder.

The inner wall surface of the opening 370 is attached to the exposed side surface of the corresponding light emitting chip 33 or a gap is left; for voids to remain, the matte layer 34 fills the voids.

The matte layer 34 wraps the surface and the exposed side faces of the light-emitting chip 33 on the first surface, covering part or all of the surface of the ink black layer 37. Further, the matte layer 34 may cover a part or all of the exposed first surface of the wiring board 30 where the light-emitting chip 33 is not provided and where it is not covered with the black ink layer 37.

The existence of the black ink layer 37 can reduce or stop the light channeling between the light emitting chips 33, reduce the light guiding effect of the matte layer 34, and improve the display effect, more importantly, the existence of the black ink layer 37 can improve the black ink degree of the matte layer 34 area which does not cover the light emitting chips 33, and from the display effect, the contrast or contrast can be improved by improving the black ink degree of the black ink layer 37 without sacrificing the brightness, and the brightness can also be improved by improving the light transmittance of the matte layer 34 without sacrificing the contrast or contrast, so that the contradiction between the high light transmittance of the light emitting surface and the high black ink degree of the non-light emitting surface is solved, and the contradiction improvement between the improvement of the brightness and the increase of the contrast or contrast is solved.

The display module of the present embodiment may further include an auxiliary circuit board 310 and/or an electronic device 320 electrically connected to the second conductive circuit 32. For a display module in which the auxiliary circuit board 310 and the electronic device 320 are both disposed, the electronic device 320 may be disposed on the auxiliary circuit board 310 and electrically connected to the second conductive circuit 32 through the auxiliary circuit board 310.

The method for manufacturing a display module according to the third embodiment may include the following steps:

s1, disposing the first conductive circuit 31 on the first surface of the circuit board 30, disposing the conductive via 300 on the circuit board 30 through the first surface and the second surface thereof, disposing the second conductive circuit 32 on the second surface, and electrically connecting the first conductive circuit 31 and the second conductive circuit 32 with the conductive via 300, respectively.

S3, disposing the ink black layer 37 on the first surface of the wiring board 30, the ink black layer 37 being disposed with at least one opening 370, the light emitting chip 33 being disposed within the opening 370.

The inner wall surface of the opening 370 is bonded to the exposed side surface of the corresponding light emitting chip 33 or a gap is left.

Specifically, in the first embodiment, step S3 includes:

s3.1, disposing the black layer 37 on the first surface of the circuit board 30, and disposing the black layer 37 by dispensing and adding a natural leveling silica gel or epoxy resin, wherein the silica gel or epoxy resin is doped with one or more of a diffusion powder, a matte powder, and a coloring powder.

And S3.2, heating and curing the ink black layer 37 under the vacuum or non-vacuum condition.

In the second embodiment, step S3 includes:

and S3.1, arranging a mask on the first surface of the circuit board 30, wherein the exposed part of the mask opening is not provided with the first surface of the light-emitting chip 33.

And S3.2, arranging an ink black layer 37 on the mask, wherein the ink black layer 37 can be arranged by adopting a method of printing or spraying silica gel or epoxy resin, and the silica gel or the epoxy resin is doped with one or more of diffusion powder, matte powder and coloring powder.

S3.3, removing the mask or removing the mask after pre-curing, forming an ink black layer 37 having an opening 370 on the first surface, the light emitting chip 33 being disposed within the opening 370.

And S3.4, curing the ink black layer 37 under the vacuum or non-vacuum condition.

In the third embodiment, step S3 includes:

s3.1, disposing an ink black layer 37 on the first surface of the wiring board 30, and disposing the ink black layer 37 by printing or spin-coating photosensitive ink or photosensitive glue.

And S3.2, arranging a mask on the surface of the black layer 37.

The mask opening corresponds to above the ink black layer 37 where the light emitting chip 33 is not disposed.

And S3.3, exposing and curing the ink black layer 37 which is not covered by the mask.

S3.4, removing the mask.

And S3.5, developing and removing the ink black layer 37 covered by the mask to form an opening 370, and exposing the light-emitting chip 33 arranged in the opening 370.

The surface of the light emitting chip 33, or the surface of the light emitting chip 33 and the gap formed between the light emitting chip 33 and the ink black layer 37 are exposed within the opening 370.

S2.1.6, heat curable ink black layer 37.

In the fourth embodiment, step S3 includes:

And S3.2, arranging a mask on the surface of the black layer 37.

The mask opening corresponds to above the light emitting chip 33 and the ink black layer 37.

S3.3, exposing the ink black layer 37 not covered by the mask.

S3.4, removing the mask.

And S3.5, developing and removing the black ink layer 37 which is not covered by the mask to form an opening 370, and exposing the light-emitting chip 33 arranged in the opening 370.

S3.6, thermal curing of the black ink layer 37.

Alternatively, the light emitting chip 33 may be disposed on the first surface of the wiring board 30 first, and then the black layer 37 may be disposed; alternatively, the ink black layer 37 may be disposed on the first surface of the wiring board 30, and the light emitting chip 33 may be disposed on the first surface of the wiring board 30 and in the opening 370 of the ink black layer 37. An appropriate embodiment is selected by the order of the arrangement of the light emitting chip 33 and the ink black layer 37.

And S4, arranging a matte layer 34 on the first surface of the circuit board 30, wherein the matte layer 34 wraps the surface and the exposed side surface of the light-emitting chip 33.

The matte layer 34 is disposed above the ink black layer 37, covering a part or all of the surface of the ink black layer 37. When a gap is left between the inner wall surface of the opening 370 of the ink black layer 37 and the side surface of the corresponding light emitting chip 33, the matte layer 34 fills the gap. The matte layer 34 also covers a part or all of the exposed first surface of the wiring board 30 where the light-emitting chip 33 is not provided and which is not covered with the ink black layer 37.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A display module is characterized by comprising a circuit board, a first conductive circuit, a light emitting chip, a matte layer and a first ink black layer, wherein the circuit board is provided with a first surface and a second surface which are opposite to each other;

2. The display module of claim 1, further comprising a second ink black layer;

3. The display module assembly according to claim 2, wherein an inner wall surface of the second opening is attached to a side surface of the corresponding light emitting chip; alternatively, the first and second electrodes may be,

4. The display module according to any one of claims 1-3, further comprising a second conductive circuit disposed on the second surface of the circuit board, a conductive via disposed within the circuit board and extending through the first and second surfaces; the second conductive circuit is conductively connected to the first conductive circuit through the conductive via.

5. The display module of claim 4, further comprising an auxiliary circuit board and/or an electronic device in conductive connection with the second conductive circuit.

6. A display module is characterized by comprising a circuit board with a first surface and a second surface which are opposite, a first conductive circuit arranged on the first surface of the circuit board, a light-emitting chip, a sub-light layer and an ink black layer;

7. The display module assembly according to claim 6, wherein the inner wall surface of the opening is attached to the corresponding side surface of the light emitting chip; alternatively, the first and second electrodes may be,

8. The display module according to any one of claims 6-7, further comprising a second conductive circuit disposed on the second surface of the circuit board, a conductive via disposed within the circuit board and extending through the first and second surfaces; the second conductive circuit is conductively connected to the first conductive circuit through the conductive via.

9. The display module of claim 8, further comprising an auxiliary circuit board and/or an electronic device in conductive connection with the second conductive circuit.