CN114438451A - Fingerprint-proof microcrystalline glass assembly, preparation method thereof, shell assembly and electronic equipment - Google Patents
Fingerprint-proof microcrystalline glass assembly, preparation method thereof, shell assembly and electronic equipment Download PDFInfo
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- CN114438451A CN114438451A CN202210088358.9A CN202210088358A CN114438451A CN 114438451 A CN114438451 A CN 114438451A CN 202210088358 A CN202210088358 A CN 202210088358A CN 114438451 A CN114438451 A CN 114438451A
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- 239000011521 glass Substances 0.000 title claims abstract description 71
- 238000002360 preparation method Methods 0.000 title abstract description 6
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims abstract description 116
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 32
- 230000003666 anti-fingerprint Effects 0.000 claims abstract description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 14
- 235000012239 silicon dioxide Nutrition 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 150000002500 ions Chemical class 0.000 claims description 9
- 238000001771 vacuum deposition Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 15
- 230000001070 adhesive effect Effects 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 99
- 239000012459 cleaning agent Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 210000002268 wool Anatomy 0.000 description 3
- 229910019020 PtO2 Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000037452 priming Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surface Treatment Of Glass (AREA)
- Laminated Bodies (AREA)
Abstract
The application provides an anti-fingerprint microcrystalline glass component, a preparation method of the anti-fingerprint microcrystalline glass component, a shell component and electronic equipment. Prevent fingerprint microcrystalline glass subassembly includes: a glass-ceramic substrate; the lanthanum oxide film layer is arranged on one surface of the microcrystalline glass substrate; the dielectric layer is arranged on the surface of the lanthanum oxide film layer far away from the microcrystalline glass substrate; and the AF film is arranged on the surface of the dielectric layer far away from the microcrystalline glass substrate. Therefore, the lanthanum oxide film layer is arranged between the microcrystalline glass substrate and the dielectric layer, so that the adhesive force of the dielectric layer can be greatly improved, the binding force between the dielectric layer and the microcrystalline glass substrate is improved, and the adhesive force and the friction resistance of the AF film layer are further improved.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to an anti-fingerprint microcrystalline glass component, a preparation method of the anti-fingerprint microcrystalline glass component, a shell component and electronic equipment.
Background
Before forming an AF Film (Anti-Fingerprint Film) on a common glass surface, a silicon dioxide underlayer is usually formed on the surface of a glass substrate to enhance the adhesion of the AF Film. However, if the glass ceramics is used as the base material, the effect of improving the adhesion of the AF film by adopting the silicon dioxide priming is greatly weakened.
Disclosure of Invention
The present application is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present application is to provide a fingerprint-proof glass ceramic component, in which an adhesion force of a membrane layer structure is strong and a friction resistance is good.
In one aspect, the present application provides an anti-fingerprint microcrystalline glass assembly. This prevent fingerprint microcrystalline glass subassembly includes: a glass-ceramic substrate; a lanthanum oxide film layer disposed on one surface of the microcrystalline glass substrate; the dielectric layer is arranged on the surface of the lanthanum oxide film layer far away from the microcrystalline glass substrate; and the AF film is arranged on the surface of the dielectric layer far away from the microcrystalline glass substrate. Therefore, the lanthanum oxide film layer is arranged between the microcrystalline glass substrate and the dielectric layer, so that the adhesive force of the dielectric layer can be greatly improved, the binding force between the dielectric layer and the microcrystalline glass substrate is improved, and the adhesive force and the friction resistance of the AF film layer are further improved.
In another aspect, the present application provides a method of making the aforementioned anti-fingerprint glass ceramic assembly. The method for preparing the anti-fingerprint microcrystalline glass component comprises the following steps: forming a lanthanum oxide film layer on one surface of the microcrystalline glass substrate; forming a dielectric layer on the surface of the lanthanum oxide film layer far away from the microcrystalline glass substrate; and forming an AF film on the surface of the dielectric layer far away from the microcrystalline glass substrate. Therefore, the adhesive force of the dielectric layer can be greatly improved, the binding force between the dielectric layer and the glass ceramic substrate is improved, and the adhesive force and the friction resistance of the AF film layer are further improved by forming the dielectric layer after forming the lanthanum oxide film layer on the surface of the glass ceramic substrate in advance.
In yet another aspect, the present application provides a housing assembly. The shell assembly comprises the anti-fingerprint microcrystalline glass assembly. Therefore, the shell assembly has good friction resistance and structural stability. As will be appreciated by those skilled in the art, the housing assembly has all the features and advantages of the anti-fingerprint glass ceramic assembly described above, and will not be described in further detail herein.
In yet another aspect, the present application provides an electronic device. The electronic device includes: the housing assembly described above; the display screen assembly is connected with the shell assembly, and an installation space is defined between the display screen assembly and the shell assembly; and the mainboard is arranged in the installation space and is electrically connected with the display screen assembly. Therefore, the shell assembly of the electronic equipment has good friction resistance and structural stability, and further improves the comprehensive performance of the electronic equipment. As will be appreciated by those skilled in the art, the housing assembly has all the features and advantages of the anti-fingerprint glass ceramic assembly described above, and will not be described in further detail herein.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an anti-fingerprint microcrystalline glass component in one embodiment of the present application;
FIG. 2 is a flow chart of a method for preparing an anti-fingerprint microcrystalline glass component in another embodiment of the present application;
fig. 3 is a schematic structural diagram of an electronic device in another embodiment of the present application.
Detailed Description
The scheme of the present application will be explained with reference to examples. It will be understood by those skilled in the art that the following examples are illustrative of the present application only and should not be taken as limiting the scope of the present application. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
The present application is described below with reference to specific examples, which are intended to be illustrative only and not to be limiting in any way.
In one aspect of the application, the application provides an anti-fingerprint glass ceramic assembly. According to an embodiment of the present application, referring to fig. 1, a fingerprint prevention glass ceramic assembly includes: a glass ceramics base material 10; a lanthanum oxide film layer 20, the lanthanum oxide film layer 20 being provided on one surface of the microcrystalline glass substrate 10; the dielectric layer 30, the dielectric layer 30 is arranged on the surface of the lanthanum oxide film layer 20 far away from the microcrystalline glass substrate 10; and an AF film 40, wherein the AF film 40 is arranged on the surface of the dielectric layer 30 far away from the microcrystalline glass substrate 10. Therefore, the lanthanum oxide film layer is arranged between the microcrystalline glass substrate and the dielectric layer, so that the adhesive force of the dielectric layer can be greatly improved, the binding force between the dielectric layer and the microcrystalline glass substrate is improved, and further, the adhesive force and the friction resistance of the AF film layer are improved, so that the requirement of the glass assembly on the friction resistance of fingerprint oil is met, and the service life of the AF film is prolonged.
The inventor finds that the structural characteristics of the microcrystalline glass are different from those of the conventional glass, so that the sub-surface layer of the microcrystalline glass is denser, the mode of increasing AF adhesion force by priming a common dielectric layer (such as silicon dioxide) fails, and the steel wool friction is difficult to reach more than 3K times. In view of the above technical problems, the inventors found that a lanthanum oxide film layer can be disposed between a microcrystalline glass substrate and a dielectric layer, and the dielectric layer has excellent adhesion on the lanthanum oxide film layer, thereby greatly enhancing the bonding force between the microcrystalline glass substrate and the dielectric layer.
According to an embodiment of the present application, the thickness of the lanthanum oxide film layer is less than 10 nm, such as 9 nm, 8nm, 7nm, 6 nm, 5nm, 4nm, 3nm, 2nm or 1 nm. Therefore, the lanthanum oxide film with uniform thickness can be formed on the surface of the microcrystalline glass substrate, the lanthanum oxide film with the thickness has better adhesive force to the microcrystalline glass substrate, the cost is lower, and meanwhile, the good binding force between the dielectric layer and the lanthanum oxide film can be ensured.
According to the embodiment of the application, lanthanum oxide in the lanthanum oxide film layer is white orthorhombic, and the purity is more than 99.9%. Therefore, the adhesive force of the lanthanum oxide film layer on the surface of the glass-ceramic substrate can be further improved. Wherein, the lanthanum oxide film layer can contain trace CeO2、PtO2Equivalent oxide impurities, so that the above-mentioned impurity content is less, and Ce, Pt and lanthanum are homologous elements, and are partially similar in property, so that trace quantity of CeO2、PtO2The impurities have little influence on the overall performance of the lanthanum oxide film.
According to the embodiment of the application, the dielectric layer is made of silicon dioxide, so that the dielectric layer made of the silicon dioxide has good adhesive force on the surface of the lanthanum oxide film layer, good bonding force between the dielectric layer and the lanthanum oxide film layer and good bonding force between the dielectric layer and the AF film can be effectively guaranteed, the friction resistance of the AF film is further improved, and the stability of the whole structure of the anti-fingerprint glass-ceramic assembly is improved.
Further, the thickness of the dielectric layer is less than 10 nm, for example, the thickness of the dielectric layer is 9 nm, 8nm, 7nm, 6 nm, 5nm, 4nm, 3nm, 2nm or 1 nm. Therefore, the uniformity of the thickness of the dielectric layer can be ensured, and the good bonding performance between the AF film and the dielectric layer can be ensured.
Furthermore, the thickness of the AF film is 10-20 nanometers, for example, the thickness of the AF film is 10 nanometers, 11 nanometers, 12 nanometers, 13 nanometers, 14 nanometers, 15 nanometers, 16 nanometers, 17 nanometers/18 nanometers, 19 nanometers or 20 nanometers, and the AF film with the thickness has good fingerprint resistance.
In another aspect of the present application, the present application provides a method for preparing the anti-fingerprint glass ceramic component. In one embodiment, referring to fig. 2, a method of making an anti-fingerprint microcrystalline glass assembly comprises:
s100: a lanthanum oxide film layer is formed on one surface of a glass-ceramic substrate.
According to the embodiment of the application, before the lanthanum oxide film layer is formed, the surface of the microcrystalline glass substrate can be cleaned in advance by using an alkaline cleaning agent, and the pH of the alkaline cleaning agent is less than 9. Therefore, the cleaning agent can clean and remove stains on the microcrystalline glass substrate, and the alkaline cleaning agent has a pH value less than 9 and is weak in alkalinity, and cannot react with the microcrystalline glass substrate to influence the performance of the microcrystalline glass substrate. Further, after the microcrystalline glass substrate is cleaned by the alkaline cleaning agent, deionized water can be further utilized for washing for 3-5 times, so that the residual alkaline cleaning agent can be washed cleanly.
According to the embodiment of the application, the lanthanum oxide film layer can be formed by a vacuum coating method, wherein the vacuum coating satisfies at least one of the following conditions: the plating rate is 0.07-0.3 nm/s (such as 0.07nm/s, 0.1nm/s, 0.13nm/s, 0.15nm/s, 0.18nm/s, 0.2nm/s, 0.23nm/s, 0.25nm/s, 0.28nm/s, 0.3 nm/s); the current is 150-170 mA (for example, the current is 150mA, 155mA, 160mA, 165mA, 170 mA). Under the conditions, the lanthanum oxide film with excellent performance can be effectively prepared.
Furthermore, the surface of the lanthanum oxide film layer is subjected to ion cleaning after the lanthanum oxide film layer is formed, so that the lanthanum oxide film layer can be cleaned to remove stains, the surface of the lanthanum oxide film layer can be ensured to have sufficient activity, and the bonding force between a subsequently formed dielectric layer and the lanthanum oxide film layer can be improved. After ion cleaning, the water drop angle (namely the contact angle) of the surface of the lanthanum oxide film layer is less than 15 degrees. Therefore, the surface of the lanthanum oxide film layer has higher wettability, and the forming effect of the dielectric layer and the adhesive force of the dielectric layer to the surface of the lanthanum oxide film layer during the subsequent preparation of the dielectric layer are improved.
The specific means of ion cleaning has no special requirements, and those skilled in the art can flexibly select the specific means according to actual conditions as long as the cleaning requirements can be met. In some embodiments, the ion cleaning may be an argon plasma cleaning or the like.
S200: and forming a dielectric layer on the surface of the lanthanum oxide film layer far away from the microcrystalline glass substrate.
According to the embodiment of the invention, the dielectric layer can be formed by a vacuum coating method, wherein the vacuum coating satisfies at least one of the following conditions: the coating rate is 0.13-0.15 nm/s (such as 0.13nm/s, 0.135nm/s, 0.14nm/s, 0.145nm/s, 0.15 nm/s); the current is 150-170 mA (for example, the current is 150mA, 155mA, 160mA, 165mA, 170 mA). Under the conditions, the dielectric layer made of materials such as silicon dioxide and the like with excellent performance can be effectively prepared.
Furthermore, the surface of the dielectric layer is subjected to ion cleaning after the dielectric layer is formed, so that the cleaning can be performed to remove stains, the surface of the dielectric layer can be ensured to have sufficient activity, and the binding force between the subsequently formed AF film and the dielectric layer can be further improved. Wherein, after the ion cleaning, the water drop angle on the surface of the dielectric layer is less than 15 degrees. Therefore, the surface of the dielectric layer has higher wettability, and the forming effect of the AF film in the subsequent preparation of the AF film and the adhesive force of the AF film to the surface of the dielectric layer are improved. The specific means of ion cleaning has no special requirements, and those skilled in the art can flexibly select the specific means according to actual conditions as long as the cleaning requirements can be met. In some embodiments, the ion cleaning may be an argon plasma cleaning or the like.
S300: and forming an AF film on the surface of the dielectric layer far away from the microcrystalline glass substrate.
In the above step, a specific method for forming the AF film may be an evaporation coating method, wherein the coating rate in the formation of the AF film by the evaporation coating is 0.3 to 0.5nm/s (e.g., 0.3nm/s, 0.35nm/s, 0.4nm/s, 0.45nm/s, 0.5 nm/s). Thus, an AF film excellent in fingerprint preventing performance can be formed.
According to the embodiment of the application, in the method for preparing the fingerprint-resistant glass-ceramic assembly, the dielectric layer is formed after the lanthanum oxide film layer is formed on the surface of the glass-ceramic substrate in advance, so that the adhesive force of the dielectric layer can be greatly improved, the binding force between the dielectric layer and the glass-ceramic substrate is improved, the adhesive force and the friction resistance of the AF film layer are further improved, the requirement of the glass assembly on the friction resistance of fingerprint oil is met, and the service life of the AF film is prolonged.
In yet another aspect of the present application, a housing assembly is provided. According to the embodiment of the application, the shell assembly comprises the anti-fingerprint glass ceramic assembly. Therefore, the shell assembly has good friction resistance and structural stability. As will be appreciated by those skilled in the art, the housing assembly has all the features and advantages of the anti-fingerprint glass ceramic assembly described above, and will not be described in further detail herein.
According to the embodiment of the application, in addition to the above-mentioned anti-fingerprint microcrystalline glass assembly, a person skilled in the art may flexibly set other layer structures according to actual requirements for the housing assembly, for example, one or more of structures such as a UV texture layer, a color layer, a film coating layer, and a primer coating layer may be further provided on one side of the microcrystalline glass substrate away from the AF film.
In yet another aspect of the present application, an electronic device is provided. According to an embodiment of the present application, referring to fig. 3, an electronic device includes: the housing assembly 100 described above; the display screen assembly 200, the display screen assembly 200 is connected with the shell assembly 100, and an installation space is defined between the display screen assembly 200 and the shell assembly 100; and a main board (not shown in the figure) disposed in the mounting space and electrically connected to the display screen assembly. Therefore, the shell assembly of the electronic equipment has good friction resistance and structural stability, and further improves the comprehensive performance of the electronic equipment. As will be appreciated by those skilled in the art, the housing assembly has all the features and advantages of the anti-fingerprint glass ceramic assembly described above, and will not be described in further detail herein.
Examples
Example 1
Referring to fig. 1, the fingerprint-resistant glass ceramic assembly includes: a glass ceramics base material 10; a lanthanum oxide film layer 20, the lanthanum oxide film layer 20 being provided on one surface of the microcrystalline glass substrate 10; the silicon dioxide dielectric layer 30 is arranged on the surface of the lanthanum oxide film layer 20 far away from the microcrystalline glass substrate 10; and an AF film 40, wherein the AF film 40 is arranged on the surface of the silicon dioxide dielectric layer 30 far away from the microcrystalline glass substrate 10. Wherein the thickness of the lanthanum oxide film layer is 8nm, the lanthanum oxide in the lanthanum oxide film layer is a white orthorhombic system, and the purity is more than 99.9 percent; the thickness of the silicon dioxide dielectric layer is 8nm, and the thickness of the AF film is 12 nm.
Comparative example 1
Prevent fingerprint microcrystalline glass subassembly includes: a glass-ceramic substrate; the silicon dioxide dielectric layer is arranged on one surface of the microcrystalline glass substrate; and the AF film is arranged on the surface of the silicon dioxide dielectric layer far away from the microcrystalline glass substrate. Wherein the thickness of the silicon dioxide dielectric layer is 8nm, and the thickness of the AF film is 12 nm.
The anti-fingerprint glass ceramic components in the example 1 and the comparative example 1 are respectively subjected to a steel wool friction test under the following test conditions: applying 1Kg load by using special steel wool (model 0000#), testing the area of a pressure head by 2 x 2cm, and rubbing 10000 cycles (one round trip is used as one cycle) on the surface of the sample at the speed of 40 circles/min and the stroke of 30-40 mm. The test results are: the water drop angle of the anti-fingerprint microcrystalline glass component in the example 1 is 107 degrees, which shows that the anti-fingerprint microcrystalline glass component has better wear resistance; the water drop angle of the anti-fingerprint microcrystalline glass component in the comparative example 1 is 65 degrees, which indicates that the anti-fingerprint microcrystalline glass component is poor in wear resistance and not in accordance with the use requirement.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (12)
1. An anti-fingerprint microcrystalline glass component is characterized in that,
a glass-ceramic substrate;
a lanthanum oxide film layer disposed on one surface of the microcrystalline glass substrate;
the dielectric layer is arranged on the surface of the lanthanum oxide film layer far away from the microcrystalline glass substrate; and
and the AF film is arranged on the surface of the dielectric layer far away from the microcrystalline glass substrate.
2. The anti-fingerprint microcrystalline glass assembly of claim 1, wherein the lanthanum oxide film layer has a thickness of less than 10 nanometers.
3. The fingerprint resistant microcrystalline glass assembly of claim 1 wherein the lanthanum oxide film layer comprises lanthanum oxide in a white orthorhombic system with a purity greater than 99.9%.
4. The fingerprint resistant glass ceramic assembly as claimed in any one of claims 1 to 3, wherein the fingerprint resistant glass ceramic assembly further satisfies at least one of the following conditions:
the dielectric layer is made of silicon dioxide;
the thickness of the dielectric layer is less than 10 nanometers;
the thickness of the AF film is 10-20 nanometers.
5. A method for preparing the anti-fingerprint glass ceramic component as claimed in any one of claims 1 to 4, wherein the method comprises the following steps:
forming a lanthanum oxide film layer on one surface of the microcrystalline glass substrate;
forming a dielectric layer on the surface of the lanthanum oxide film layer far away from the microcrystalline glass substrate;
and forming an AF film on the surface of the dielectric layer far away from the microcrystalline glass substrate.
6. The method of claim 5, wherein the lanthanum oxide film layer is formed by a vacuum coating method, wherein the vacuum coating satisfies at least one of the following conditions:
the coating rate is 0.07-0.3 nm/s;
the current is 150-170 mA.
7. The method as claimed in claim 5 or 6, wherein the surface of the lanthanum oxide film layer is subjected to ion cleaning after the lanthanum oxide film layer is formed, so that the water drop angle of the surface of the lanthanum oxide film layer is less than 15 °.
8. The method of claim 5, wherein the dielectric layer is formed by a vacuum coating method, wherein the vacuum coating satisfies at least one of the following conditions:
the coating rate is 0.13-0.15 nm/s;
the current is 150-170 mA.
9. The method according to claim 5 or 8, wherein the surface of the dielectric layer is ion-cleaned after the dielectric layer is formed such that a water drop angle of the surface of the dielectric layer is less than 15 °.
10. The method according to claim 5, wherein the surface of the glass-ceramic substrate is previously cleaned with an alkaline cleaner having a pH of less than 9 before the lanthanum oxide film layer is formed.
11. A housing component, characterized by comprising the anti-fingerprint glass-ceramic component as claimed in any one of claims 1 to 4.
12. An electronic device, comprising:
the housing assembly of claim 11;
the display screen assembly is connected with the shell assembly, and an installation space is defined between the display screen assembly and the shell assembly; and
the mainboard is arranged in the installation space and electrically connected with the display screen assembly.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210088358.9A CN114438451A (en) | 2022-01-25 | 2022-01-25 | Fingerprint-proof microcrystalline glass assembly, preparation method thereof, shell assembly and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210088358.9A CN114438451A (en) | 2022-01-25 | 2022-01-25 | Fingerprint-proof microcrystalline glass assembly, preparation method thereof, shell assembly and electronic equipment |
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| CN114438451A true CN114438451A (en) | 2022-05-06 |
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| US20120135199A1 (en) * | 2009-05-20 | 2012-05-31 | Hoya Corporation | Glass material for press molding, method for manufacturing optical glass element employing same, and optical glass element |
| KR20180018929A (en) * | 2016-08-11 | 2018-02-22 | 주식회사 하스 | Glass-ceramics or Lithium silicate glass for Metal alloy overlaying materials and preparation method thereof |
| CN112694258A (en) * | 2021-01-29 | 2021-04-23 | 重庆鑫景特种玻璃有限公司 | Coated glass-ceramic with improved hydrophobicity and oleophobicity and preparation method and application thereof |
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| US20100136869A1 (en) * | 2008-12-02 | 2010-06-03 | Canon Kabushiki Kaisha | Method of fabricating electron-emitting device and method of manufacturing image display apparatus |
| US20120135199A1 (en) * | 2009-05-20 | 2012-05-31 | Hoya Corporation | Glass material for press molding, method for manufacturing optical glass element employing same, and optical glass element |
| KR20180018929A (en) * | 2016-08-11 | 2018-02-22 | 주식회사 하스 | Glass-ceramics or Lithium silicate glass for Metal alloy overlaying materials and preparation method thereof |
| CN112694258A (en) * | 2021-01-29 | 2021-04-23 | 重庆鑫景特种玻璃有限公司 | Coated glass-ceramic with improved hydrophobicity and oleophobicity and preparation method and application thereof |
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