CN114432957A - Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method - Google Patents

Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method Download PDF

Info

Publication number
CN114432957A
CN114432957A CN202011120772.0A CN202011120772A CN114432957A CN 114432957 A CN114432957 A CN 114432957A CN 202011120772 A CN202011120772 A CN 202011120772A CN 114432957 A CN114432957 A CN 114432957A
Authority
CN
China
Prior art keywords
temperature
solution
mixing
liquid supply
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011120772.0A
Other languages
Chinese (zh)
Inventor
姜哲求
胡艳鹏
李琳
卢一泓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Original Assignee
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Microelectronics of CAS, Zhenxin Beijing Semiconductor Co Ltd filed Critical Institute of Microelectronics of CAS
Priority to CN202011120772.0A priority Critical patent/CN114432957A/en
Publication of CN114432957A publication Critical patent/CN114432957A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Abstract

The invention discloses an adjustable mixing device, a control device, an adjustable mixing system and an adjustable mixing method, and relates to the technical field of semiconductor manufacturing to improve the real-time property of temperature change. The adjustable mixing device comprises: the mixing unit and at least two liquid supply units, at least two liquid supply units all communicate with the mixing unit. At least two liquid supply units supply solutions to the mixing unit at different flow rates and/or different temperatures to obtain a mixed solution having a preset temperature in the mixing unit. The invention also provides a control device, an adjustable mixing system and an adjustable mixing method. The adjustable mixing system comprises a control device, an adjustable mixing device and a temperature sensor. The adjustable mixing method is applied to the adjustable mixing system.

Description

Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to an adjustable mixing device, a control device, an adjustable mixing system and an adjustable mixing method.
Background
In a semiconductor manufacturing process, it is necessary to change the temperature of a treating agent (a cleaning agent or an etchant) in real time to perform a process such as cleaning or etching of a semiconductor device using a treating agent having an appropriate temperature.
Conventionally, a temperature adjusting device is generally used to change the temperature of the treating agent as needed, but the temperature adjusting device has a problem that the real-time property of temperature change is poor when adjusting the temperature of the treating agent.
Disclosure of Invention
The invention aims to provide an adjustable mixing device, a control device, an adjustable mixing system and an adjustable mixing method, which can improve the real-time performance of temperature change.
To achieve the above object, the present invention provides an adjustable mixing device. This adjustable mixing arrangement includes: the mixing unit and at least two liquid supply units, at least two liquid supply units all communicate with the mixing unit. At least two liquid supply units supply solutions to the mixing unit at different flow rates and/or different temperatures to obtain a mixed solution having a preset temperature in the mixing unit.
Compared with the prior art, in the adjustable mixing device provided by the invention, at least two liquid supply units are respectively communicated with the mixing unit, and the at least two liquid supply units can provide solutions with different temperatures, and the solutions with different temperatures are mixed in the mixing unit to obtain a mixed solution with a certain temperature.
The adjustable mixing device can adjust the temperature of the mixed solution obtained in the mixing unit in real time by controlling the flow rate of the solution provided by the at least two liquid supply units to the mixing unit under the condition of ensuring that the temperature of the solution provided by the at least two liquid supply units is not changed so as to reach the preset temperature. Based on the temperature, when the adjustable mixing device is applied to cleaning or etching of the semiconductor device, the temperature of the treating agent required for cleaning or etching the semiconductor device can be adjusted in real time according to the actual requirement of the semiconductor device to be cleaned or etched. At this time, under the condition of improving the efficiency of the mixed solution reaching the preset temperature, not only the processing efficiency of the semiconductor device can be improved, but also the quality of the obtained semiconductor device can be optimized.
The invention also provides a control device. The control device includes: the communication unit is used for sending flow control signals to at least two liquid supply units included by the adjustable mixing device, the at least two liquid supply units are used for providing solutions to the mixing unit included by the adjustable mixing device according to the flow control signals, and the flow rates and/or the temperatures of the solutions supplied to the mixing unit by the at least two liquid supply units are different.
Compared with the prior art, in the control device provided by the invention, the communication unit can send flow control signals to at least two liquid supply units included in the adjustable mixing device. The flow rate of the solution supplied to the mixing unit by the liquid supply unit is controlled by the flow rate control signal.
Under the condition that the temperature of the solution provided by the at least two liquid supply units is not changed, the flow of the solution provided by the at least two liquid supply units is respectively controlled through the at least two flow control signals sent by the communication unit, and the temperature of the mixed solution in the mixing unit is adjusted in real time so as to quickly reach the preset temperature. The control device provided by the invention can be used for adjusting the flow of the solution provided by at least two liquid supply units in real time. That is, the efficiency of the mixed solution formed in the mixing unit reaching the preset temperature can be improved while ensuring that the solution flow rate adjustment in the at least two liquid supply units is not delayed.
The invention also provides an adjustable mixing system. The adjustable mixing system comprises a control device, an adjustable mixing device and a temperature sensor, wherein the adjustable mixing device and the temperature sensor are respectively in communication connection with the control device;
the adjustable mixing device is the adjustable mixing device in the technical scheme;
the control device is the control device in the technical scheme;
the temperature sensor is used for acquiring the temperature of the mixed solution in the mixing unit included in the adjustable mixing device.
Compared with the prior art, the beneficial effects of the adjustable mixing system provided by the invention are the same as those of the adjustable mixing device and the control device in the technical scheme, and the detailed description is omitted here.
The invention also provides an adjustable mixing method. The adjustable mixing method comprises the adjustable mixing system in the technical scheme. The adjustable mixing method comprises the following steps:
the temperatures of the solutions in the at least two liquid supply units are obtained.
And controlling at least two liquid supply units to supply the solutions to the mixing unit at different flow rates and/or different temperatures so as to obtain a mixed solution with a preset temperature in the mixing unit.
Compared with the prior art, the beneficial effects of the adjustable mixing method provided by the invention are the same as those of the adjustable mixing system in the technical scheme, and the details are not repeated here.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view showing a structure of a treating agent temperature adjusting apparatus in the prior art;
FIG. 2 is a schematic diagram of a frame of an adjustable mixing apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating an adjustable mixing device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a control device according to an embodiment of the present invention;
FIG. 5 illustrates a block diagram of an adjustable mixing system according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating an adjustable mixing system according to an embodiment of the present invention;
reference numerals:
10 is a liquid supply unit, 101 is a solution output pipeline, 102 is a solution supply device, 103 is a power device, 104 is a flow meter, 105 is a branch, 106 is a temperature adjusting device, and 107 is a filter; 11 is a flow regulating member; 12 is a first liquid supply unit, 121 is a first solution output pipeline, 122 is a first flow regulator, 123 is a first solution supply device, 124 is a first power device, 125 is a first flow meter, 126 is a first branch, 127 is a first temperature adjusting device, and 128 is a first filter; 13 is a second liquid supply unit, 131 is a second solution output pipeline, 132 is a second flow regulating part, 133 is a second solution supply device, 134 is a second power device, 135 is a second flow meter, 136 is a second branch, 137 is a second temperature regulating device, and 138 is a second filter; 14 is a mixing unit; reference numeral 20 denotes a communication unit, 21 denotes a processing unit, and 22 denotes a temperature sensor.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known elements and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various unit schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of the various regions, layers and their relative sizes, positional relationships are shown in the drawings as examples only, and in practice deviations due to manufacturing tolerances or technical limitations are possible, and a person skilled in the art may additionally design regions/layers with different shapes, sizes, relative positions according to the actual needs.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed. In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In recent years, with the miniaturization and high integration of semiconductor devices, the temperature of a treatment agent applied to a cleaning or etching process has more and more prominent influence on the cleaning or etching effect of the semiconductor devices. Fig. 1 is a schematic view showing a structure of a treating agent temperature adjusting apparatus in the prior art. As shown in fig. 1, the treating agent temperature adjusting apparatus includes a liquid supply unit 10 and a flow rate adjusting member 11. The liquid supply unit 10 includes a solution output line 101 and a solution supply device 102, and a power device 103, a filter 107, a temperature adjustment device 106, and a flow meter 104 provided on the solution output line 101 and communicating with the solution supply device 102. The liquid supply unit 10 further comprises a branch 105 communicating the solution outlet line 101 and the solution supply means 102, so that the liquid supply unit 10 forms a circulation means. A flow rate adjusting member 11 is provided at an output end of the solution output line 101 for controlling a flow rate of the solution output from the solution supply device 102.
In manufacturing semiconductor devices, the semiconductor devices are cleaned or etched by using treating agents with different temperatures, and generally, the treating agents with normal temperature or a certain initial temperature are placed in the liquid supply unit 10, and then the treating agents in the liquid supply unit 10 are heated by the temperature adjusting device 106 connected with the liquid supply unit 10 in the temperature adjusting device 106 to reach the temperature required by actual treatment.
However, when a different temperature of the treating agent is required, it is necessary to reset the temperature raising parameter or the temperature lowering parameter of the temperature adjustment device 106, and wait for the temperature adjustment device 106 to raise or lower the temperature of the treating agent to the required preset temperature. Since the temperature of the temperature adjusting device 106 needs a certain time to increase or decrease, the temperature of the treating agent cannot be changed in real time. In addition, in the actual process, some processes need to be switched between different temperatures, at this time, the temperature-increasing parameter or the temperature-decreasing parameter of the temperature adjustment device 106 needs to be frequently set, and much time is consumed to wait for the temperature-increasing or the temperature-decreasing of the temperature adjustment device 106, so that the working efficiency is reduced, and the semiconductor device cannot be efficiently processed.
In order to solve the above problems, embodiments of the present invention provide an adjustable mixing device, a control device, an adjustable mixing system, and an adjustable mixing method. For convenience of description, only the differences between the adjustable mixing device provided by the embodiment of the present invention and the adjustable mixing device in the prior art will be described, and other structures not described may refer to the description in the prior art. Of course, other adjustable mixing devices known in the art can be modified by those skilled in the art based on the description of the embodiments of the present invention given below.
Fig. 2 is a schematic diagram illustrating a framework of an adjustable mixing device according to an embodiment of the present invention. As shown in fig. 2, the adjustable mixing device comprises: a mixing unit 14 and at least two liquid supply units, both of which are in communication with the mixing unit 14. At least two liquid supply units supply solutions to the mixing unit 14 at different flow rates and/or different temperatures to obtain a mixed solution having a preset temperature in the mixing unit 14.
The adjustable mixing device can adjust the temperature of the mixed solution obtained in the mixing unit 14 in real time by controlling the flow rate of the solution provided by the at least two liquid supply units to the mixing unit 14 under the condition of ensuring that the temperature of the solution provided by the at least two liquid supply units is not changed, so as to reach the preset temperature, and realize the real-time change of the temperature of the mixed solution. Moreover, the adjustable mixing device does not need to reset the temperature rise parameter or the temperature fall parameter of the temperature adjusting device 106, and the temperature of the treating agent required by the actual process can be obtained at any time only by changing the flow rates of the solutions supplied in the at least two liquid supply units, without waiting for the temperature rise time or the temperature fall time of the temperature adjusting device 106. The adjustable mixing device can be applied to cleaning or etching of semiconductor devices, and the temperature of a treating agent required for cleaning or etching the semiconductor devices can be adjusted in real time according to the actual requirements of the semiconductor devices to be cleaned or etched. Under the condition of improving the efficiency of the mixed solution reaching the preset temperature, the treatment efficiency of the semiconductor device can be improved, and the quality of the obtained semiconductor device can be optimized.
As a possible implementation, the number of the liquid supply units 10 for supplying the solution to the mixing unit 14 in the adjustable mixing device can be set according to actual conditions. The following description is given by way of example only and is not intended as limiting. In an embodiment of the present invention, the adjustable mixing device may include two liquid supply units, i.e., a first liquid supply unit 12 and a second liquid supply unit 13.
In one example, each liquid supply unit may have a solution output line with a flow regulator for regulating the flow of the solution to the mixing unit 14. Each liquid supply unit may include: the solution supply device is used for containing solution, and the power device, the temperature adjusting device and the flowmeter are arranged on a solution output pipeline of the liquid supply unit. Wherein, the flow rate of the solution supplied to the mixing unit 14 by each liquid supply unit can be a, and a is more than or equal to 0 and less than or equal to 100 percent. The temperature of the solution supplied to the mixing unit 14 by each liquid supply unit may be T, T being 20 ℃ to 180 ℃.
Fig. 3 is a schematic structural diagram illustrating an adjustable mixing device according to an embodiment of the present invention. As shown in fig. 3, a first flow rate adjusting part 122 is disposed on the first solution output pipeline 121 of the first liquid supply unit 12, and the first flow rate adjusting part 122 is used for adjusting a first flow rate of the first solution supplied to the mixing unit 14.
The first liquid supply unit 12 further includes: a first solution supply device 123 for containing a first solution, and a first power device 124, a first temperature adjusting device 127 and a first flow meter 125 which are arranged on a first solution output pipeline 121 of the first liquid supply unit 12.
In one example, as shown in fig. 3, the first solution supply device 123 of the first liquid supply unit 12 contains a first solution, and in this case, the first solution may be a normal temperature or a first solution with a certain initial temperature. It should be understood that the temperature of the first solution in the first solution supply device 123 may be set according to actual conditions as long as normal working use is not affected. The first power device 124 may be a pump. The first temperature adjustment device 127 may have both a temperature raising function and a temperature lowering function. The first solution supplying means 123 is connected in series with the first power means 124, the first temperature adjusting means 127 and the first flow meter 125 through the first solution output line 121, respectively.
As shown in fig. 3, in the actual process, if the temperature of the first solution contained in the first solution supply device 123 is lower than the first temperature T1At this time, the first temperature adjusting device 127 is activated to raise the temperature of the first solution to the first temperature T1. The first temperature T1The value range of the temperature can be more than or equal to T of 20 DEG C1Less than or equal to 180 ℃. Similarly, if the temperature of the first solution contained in the first solution supply device 123 is higher than the first temperature T1At this time, the first temperature adjusting device 127 is activated to lower the temperature of the first solution to the first temperature T1. In an embodiment of the invention, the first temperature T1It may be 20 deg.C, 100 deg.C or 180 deg.C.
As shown in fig. 2 and 3, one end of the first solution output line 121 communicates with the mixing unit 14, and the first solution output line 121 has a first branch 126. One end of the first branch line 126 is connected to the first solution output line 121, and the other end of the first branch line 126 is connected to the first solution supply device 123. At this time, the first solution output line 121, the first branch line 126, the first solution supply device 123, the first power device 124, the first temperature adjustment device 127 and the first flow meter 125 form a circulating device, and since the first temperature adjustment device 127 can also heat the treating agent in the first solution output line 121 and the first branch line 126, it is advantageous to keep the temperature of the treating agent in the first solution supply device 123 constant. Meanwhile, as the circulating device is formed, the concentration of the treating agent can be ensured to be uniform. Of course, if the temperature of the treating agent in the first solution supply device 123 is kept constant, it is also possible to provide thermal sleeves on the first solution output line 121, the first branch line 126 and the first solution supply device 123, as long as the requirements are met, and the description is not provided herein.
As shown in fig. 3, the first liquid supply unit 12 may further include a first filter 128, and the first solution supply device 123 may be connected in series with the first power device 124, the first filter 128, the first temperature adjustment device 127, and the first flow meter 125. In the actual process, the treating agent ejected from the mixing unit 14 can generally be recycled. Illustratively, after the treating agent sprayed from the nozzle of the mixing unit 14 is sprayed on the surface of the substrate for the process treatment, the used treating agent can be recycled, and the particles in the treating agent are filtered by the first filter 128 and other matched structures, so that the treating agent is clean and convenient for later recycling, and the cost is saved.
The second solution output pipeline 131 of the second liquid supply unit 13 is provided with a second flow rate adjusting member 132, and the second flow rate adjusting member 132 is used for adjusting a second flow rate of the second solution supplied to the mixing unit 14. The second liquid supply unit 13 further includes: a second solution supply device 133 for containing a second solution, and a second power device 134, a second temperature adjusting device 137, a second flow meter 135 and a second branch 136 which are arranged on a second solution output pipeline 131 of the second liquid supply unit 13.
As a possible implementation manner, the second liquid supply unit 13 may further include a second filter 138, and in this case, the second solution supply device 133 is connected in series to the second power device 134, the second filter 138, the second temperature adjustment device 137, and the second flow meter 135, respectively.
The first liquid supply unit 12 and the second liquid supply unit 13 may be completely the same or not, and may be set according to actual conditions to meet actual requirements. In the embodiment of the present invention, the first liquid supply unit 12 and the second liquid supply unit 13 are arranged identically, and will not be described herein, and the specific structure is referred to the arrangement mode of the first liquid supply unit 12. In the embodiment of the present invention, the second temperature T2It may be 20 deg.C, 90 deg.C or 180 deg.C.
As shown in FIGS. 2 and 3, since the temperature of the mixed solution is changed in the above-mentioned adjustable mixing device in such a manner that the first temperature T of the first solution is secured1And a second temperature T of the second solution2The first flow rate of the first solution supplied by the first liquid supply unit 12 and the second flow rate of the second solution supplied by the second liquid supply unit 13 are controlled under the same condition. The first flow rate ratio of the first solution may be a1At this time a1The range of (d) may be: a is more than or equal to 01Less than or equal to 100 percent. The second flow ratio of the second solution may be a2At this time a2The range of (a) may be: a is more than or equal to 02Less than or equal to 100 percent. And adjusting the first flow rate of the first solution and the second flow rate of the second solution in real time according to the temperature of the treating agent required by the actual process, so that the temperature of the mixed solution is increased or decreased to reach the actually required temperature.
Fig. 4 is a schematic structural diagram of a control device according to an embodiment of the present invention. As shown in fig. 4, an embodiment of the present invention further provides a control device. The control device includes: a communication unit 20.
As shown in fig. 4, the communication unit 20 may be adapted to send flow control signals to at least two liquid supply units comprised by the adjustable mixing apparatus. The at least two liquid supply units are used for supplying the solution to the mixing unit 14 included in the adjustable mixing device according to the flow control signals, and the flow rate and/or the temperature of the solution supplied to the mixing unit 14 by the at least two liquid supply units are different.
Illustratively, as shown in FIG. 4, the communication unit 20 is configured to send a first flow control signal to the first liquid supply unit 12 included in the adjustable mixing apparatus. The first liquid supply unit 12 is configured to provide a first solution having a first flow rate and a first temperature T to a mixing unit 14 included in the adjustable mixing apparatus according to a first flow rate control signal1. The communication unit 20 is adapted to send a second flow control signal to a second liquid supply unit 13 comprised by the adjustable mixing device. The second liquid supply unit 13 is adapted to supply a second solution having a second flow rate and a second temperature T to a mixing unit 14 comprised in the adjustable mixing device in response to a second flow control signal2Second temperature T2And a first temperature T1Different.
At a first temperature T ensuring the first solution1And a first temperature T of the second solution2Under the condition of no change, the first flow rate of the first solution provided by the first liquid supply unit 12 and the second flow rate of the second solution provided by the second liquid supply unit 13 can be respectively controlled by the first flow rate control signal and the second flow rate control signal sent by the communication unit 20, so as to adjust the temperature of the mixed solution in the mixing unit 14 in real time, so as to quickly reach the preset temperature. The control device provided by the embodiment of the invention can adjust the first flow rate of the first solution provided by the first liquid supply unit 12 and the second flow rate of the second solution provided by the second liquid supply unit 13 in real time. That is, the efficiency of the mixed solution formed in the mixing unit 14 reaching the preset temperature can be improved while ensuring the adjustment of the first and second flow rates without a delay. The flow control signal sent by the communication unit 20 in the control device indirectly controls the temperature of the mixed solution, so that the temperature of the mixed solution can be changed in real time, the requirement on the temperature of a treating agent in an actual process is met, the semiconductor device can be better cleaned or etched, and the working efficiency and the half-life are improvedQuality of the conductor device.
As shown in fig. 4, the communication unit 20 is also used for receiving the current temperature of the mixed solution in the mixing unit 14 sent by the temperature sensor (not shown in fig. 4).
In the embodiment of the present invention, one end of the temperature sensor is connected to the mixing unit 14, and the other end is connected to the control device. The temperature sensor may acquire the current temperature of the mixed solution in the mixing unit 14, and then the temperature sensor may transmit data related to the current temperature of the mixed solution to the communication unit 20 in the control device.
The control device further comprises a processing unit 21. The processing unit 21 is configured to generate a flow control signal according to a temperature difference between a current temperature of the mixed solution and a preset temperature.
In one example, as shown in fig. 4, the processing unit 21 is configured to generate a first flow control signal and a second flow control signal according to a temperature difference between a current temperature and a preset temperature of the mixed solution.
In the actual use process, the communication unit 20 transmits the received current temperature of the mixed solution and the preset temperature required by the actual process to the processing unit 21, and the processing unit 21 calculates the temperature difference between the current temperature and the preset temperature of the mixed solution. Then the processing unit 21 generates a first flow control signal for controlling the first liquid supply unit 12 and a second flow control signal for controlling the second liquid supply unit 13 according to the calculated temperature difference. The first flow control signal and the second flow control signal are both transmitted through the communication unit 20. The communication unit 20 or the processing unit 21 may be a mobile phone, a computer, or a controller CPU.
Fig. 5 is a schematic diagram illustrating a framework of an adjustable mixing system according to an embodiment of the present invention. Fig. 6 is a schematic structural diagram of an adjustable mixing system according to an embodiment of the present invention. As shown in fig. 5 and 6, the embodiment of the present invention also provides an adjustable mixing system. The adjustable mixing system includes a control device, and an adjustable mixing device and a temperature sensor 22, each in communication with the control device. The adjustable mixing device can be the adjustable mixing device of the technical scheme. The control device may be the control device described in the above technical solution. The temperature sensor 22 may be used to acquire the temperature of the mixed solution within the mixing unit 14 included in the adjustable mixing apparatus.
Compared with the prior art, the beneficial effects of the adjustable mixing system provided by the invention are the same as those of the adjustable mixing device and the control device in the technical scheme, and the detailed description is omitted here.
The embodiment of the invention also provides an adjustable mixing method. The above described adjustable mixing system is applied. As shown in fig. 1 to 6, the tunable mixing method includes:
step 101: the temperature of the solution in the at least two liquid supply units is obtained by the adjustable mixing device.
Illustratively, the first temperature T of the first solution in the first liquid supply unit 12 is obtained by an adjustable mixing device1And a second temperature T of the second solution in the second liquid supply unit 132。
Due to the first temperature T1The value range of T is more than or equal to 20 DEG C1Less than or equal to 180 ℃, and the second temperature T2The value range of T is more than or equal to 20 DEG C2Less than or equal to 180 ℃. In an embodiment of the invention, the adjustable mixing device obtains the first temperature T1At a temperature of 20 ℃ and a second temperature T2It was 180 ℃.
Step 102: the control device controls the at least two liquid supply units to supply the solutions to the mixing unit at different flow rates and/or different temperatures so as to obtain a mixed solution with a preset temperature in the mixing unit.
Illustratively, the control device controls a first flow rate of the first solution supplied from the first liquid supply unit 12 to the mixing unit 14 and controls a second flow rate of the second solution supplied from the second liquid supply unit 13 to the mixing unit 14 to obtain a mixed solution having a preset temperature in the mixing unit 14.
Therefore, the adjustable mixing method provided by the embodiment of the invention can be realized, under the condition that the temperature rising parameter or the temperature lowering parameter of the temperature adjusting device is not reset, the temperature of the treating agent required by the actual process can be obtained at any time only by changing the flow rates of the first solution and the second solution, the temperature rising or temperature lowering time of the temperature adjusting device is not required to be waited, the working efficiency is improved, meanwhile, the semiconductor device can be better cleaned, etched and other process treatments, and the quality of the semiconductor device is improved.
In one example, the controlling means controlling the at least two liquid supply units to supply the solutions to the mixing unit at different flow rates and/or different temperatures to obtain a mixed solution having a preset temperature in the mixing unit includes:
step 1021: the temperature sensor 22 acquires the current temperature of the mixed solution in the mixing unit 14.
In the embodiment of the present invention, the temperature sensor 22 may collect data related to the current temperature of the mixed solution in the mixing unit 14, and then transmit the data to the control device, and the processing unit 21 in the control device determines whether the current temperature meets the actual requirement by calculating the temperature difference between the current temperature of the mixed solution and the preset temperature.
Step 1022: the control device respectively controls the flow rates of at least two liquid supply units of the solution supplied to the mixing unit 14 according to the temperature difference between the current temperature and the preset temperature of the mixed solution.
For example, the control device may control the first flow rate of the first solution and the second flow rate of the second solution supplied to the mixing unit 14 according to a temperature difference between the current temperature and the preset temperature of the mixed solution, respectively.
If the current temperature of the mixed solution in the mixing unit 14, which is acquired by the temperature sensor 22, does not meet the actual requirement, the processing unit 21 in the control device generates a first flow control signal for controlling the first liquid supply unit 12 and a second flow control signal for controlling the second liquid supply unit 13 according to the temperature difference. Then the communication unit 20 sends a first flow control signal to the first liquid supply unit 12 included in the adjustable mixing device to control the first solution to have a first flow rate, and sends a second flow control signal to the second liquid supply unit 13 included in the adjustable mixing device to control the second solution to have a second flow rate, respectively.
When the first temperature T of the first solution in the first liquid supply unit 121At 20 ℃, in the second liquid supply unit 13Second temperature T of the solution2At 180 c, if the predetermined temperature of the mixed solution in the mixing unit 14 is 100 c. At this time, the first flow rate of the first solution at 20 ℃ is adjusted to 70% by adjusting the opening and closing of the first flow rate adjuster 122 provided in the first solution output line 121 of the first liquid supply unit 12. The second flow rate adjusting member 132 provided in the second solution output line 131 of the second liquid supply unit 13 is turned on/off so that the second flow rate of the second solution at 180 ℃ is 32%. The first solution having a flow rate ratio of 70% and a temperature of 20 c and the second solution having a flow rate ratio of 32% and a temperature of 180 c are mixed in the mixing unit 14 to form a mixed solution having a preset temperature of 100 c. It should be understood that the preset temperature is set according to actual process conditions. The first solution in the first liquid supply unit 12 and the second solution in the second liquid supply unit 13 may be treating agents having the same concentration, the same composition, and only different temperatures. Since the temperature of the treating agent affects the rate of chemical reaction, in general, the reaction is faster the higher the temperature of the treating agent. Because of the process, the silicon wafers cannot be completely consistent from one wafer to another or in the same wafer, and the surface always has some fluctuation and certain errors. If more high places and less low places on the silicon wafer can be removed, the surface of the silicon wafer can be more flat and uniform, the conditions in the wafer between wafers are more consistent, and the quality of the obtained silicon wafer is better (note: the high places and the low places are relative to the concept). It is desirable that the temperature of the treating agent be adjustable in real time to facilitate the use of different temperatures for different zones where the treating agent has different reaction rates to achieve the desired results. The treatment can not only improve the corrosion rate, but also ensure that the surface of a semiconductor device (such as a silicon wafer) is more uniform and has good consistency.
In one example, the step of separately controlling the flow rates of at least two liquid supply units of the solutions supplied to the mixing unit 14 according to the temperature difference between the current temperature and the preset temperature of the mixed solution comprises the steps of:
for example, in the embodiment of the present invention, when the at least two liquid supply units are the first liquid supply unit 12 and the second liquid supply unit 13, the controlling means respectively controls the first flow rate of the first solution and the second flow rate of the second solution supplied to the mixing unit 14 according to the temperature difference between the current temperature and the preset temperature of the mixed solution includes:
when the current temperature of the mixed solution is higher than the preset temperature, a first current flow ratio of the first solution or the second solution, which is provided to the mixing unit 14 and increases the current temperature of the mixed solution, is adjusted to obtain a first target flow ratio, and at this time, the first target flow ratio is greater than or equal to 0 and less than or equal to the first current flow ratio. And a second current flow ratio of the first solution or the second solution, which is supplied to the mixing unit 14 and lowers the current temperature of the mixed solution, is adjusted to obtain a second target flow ratio, where the second current flow ratio is less than or equal to the second target flow ratio.
For example, if the first solution can lower the current temperature, the second solution can raise the current temperature, i.e., the first temperature of the first solution is 20 ℃ and the second temperature of the second solution is 180 ℃. And when the first current flow rate proportion of the first solution is 70% and the second current flow rate proportion of the second solution is 32%, the current temperature of the mixed solution is 100 ℃.
If the preset temperature is 60 ℃, the first current flow rate ratio of the first solution may be increased to the first target flow rate ratio, or may be maintained unchanged. The second current flow rate ratio of the second solution may be reduced to the second target flow rate ratio or may be maintained.
For example: the first method comprises the following steps: the first flow control signal may control the first current flow rate proportion of the first solution to increase to 85%, and the second flow control signal may control the second current flow rate proportion of the second solution to decrease to 15%, so that the temperature of the mixed solution decreases from 100 ℃ to the preset temperature of 60 ℃.
And the second method comprises the following steps: the first flow control signal may control the first current flow ratio of the first solution to increase to 95%, and the second flow control signal may control the second current flow ratio of the second solution not to become 32% so that the temperature of the mixed solution is decreased from 100 ℃ to the preset temperature of 60 ℃.
And the third is that: the first flow control signal may control the first current flow ratio of the first solution not to become 70%, and the second flow control signal may control the second current flow ratio of the second solution to decrease to 5% so that the temperature of the mixed solution decreases from 100 ℃ to the preset temperature of 60 ℃.
When the current temperature of the mixed solution is lower than the preset temperature, a third current flow ratio of the first solution or the second solution, which is provided to the mixing unit 14 and increases the current temperature of the mixed solution, is adjusted to obtain a third target flow ratio, and at this time, the third current flow ratio is smaller than or equal to the third target flow ratio. And adjusts a fourth current flow rate proportion of the first solution or the second solution, which is supplied to the mixing unit 14 and lowers the current temperature of the mixed solution, to obtain a fourth target flow rate proportion, where the fourth target flow rate proportion is not less than 0 and not more than the fourth current flow rate proportion.
For example, if the first solution can lower the current temperature, the second solution can raise the current temperature, i.e., the first temperature of the first solution is 20 ℃ and the second temperature of the second solution is 180 ℃. And when the third current flow rate proportion of the first solution is 75% and the fourth current flow rate proportion of the second solution is 22%, the current temperature of the mixed solution is 70 ℃.
If the preset temperature is 120 ℃, the third current flow rate ratio of the first solution may be reduced to the third target flow rate ratio, or may be kept unchanged. The fourth current flow ratio of the second solution may be increased to the fourth target flow ratio or may remain unchanged.
For example: the first method comprises the following steps: the first flow control signal may control the third current flow rate proportion of the first solution to be decreased to 60% and the second flow control signal may control the fourth current flow rate proportion of the second solution to be increased to 42% so that the temperature of the mixed solution is increased from 70 ℃ to the preset temperature of 120 ℃.
And the second method comprises the following steps: the first flow control signal may control the third current flow rate proportion of the first solution to be decreased to 45% and the second flow control signal may control the fourth current flow rate proportion of the second solution not to be changed to 22% so that the temperature of the mixed solution is increased from 70 ℃ to the preset temperature of 120 ℃.
And the third is that: the first flow control signal may control the third current flow rate proportion of the first solution not to become 75%, and the second flow control signal may control the fourth current flow rate proportion of the second solution to increase to 50% so that the temperature of the mixed solution increases from 70 ℃ to the preset temperature of 120 ℃.
When the current temperature of the mixed solution is equal to the preset temperature, fifth current flow ratios of the first solution and the second solution, which are respectively supplied to the mixing unit 14, are controlled to be maintained constant.
For example, if the first solution can lower the current temperature, the second solution can raise the current temperature, i.e., the first temperature of the first solution is 20 ℃ and the second temperature of the second solution is 180 ℃. And when the fifth current flow rate proportion of the first solution is 75% and the fifth current flow rate proportion of the second solution is 22%, the current temperature of the mixed solution is 70 ℃.
If it is desired that the preset temperature is maintained at 70 ℃, the first flow control signal may control the fifth current flow ratio of the first solution supplied to the mixing unit 14 to be maintained, and the second flow control signal may control the fifth current flow ratio of the second solution supplied to the mixing unit 14 to be maintained.
Of course, depending on the first temperature T of the first solution1And a second temperature T of the second solution2The control of the first flow rate proportion of the first solution and the control of the second flow rate proportion of the second solution may be set according to actual conditions, based on the difference between the current temperature and the preset temperature of the mixed solution in the mixing unit 14.
In describing exemplary embodiments of the present invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the invention and aiding in the understanding of one or more of the various inventive aspects. However, the method of the present invention should not be construed to reflect the intent: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.

Claims (11)

1. An adjustable mixing device is characterized by comprising a mixing unit and at least two liquid supply units, wherein the at least two liquid supply units are communicated with the mixing unit;
at least two liquid supply units supply solutions to the mixing unit at different flow rates and/or different temperatures to obtain a mixed solution with a preset temperature in the mixing unit.
2. The adjustable mixing device according to claim 1, wherein each liquid supply unit has a solution output line provided with a flow regulator for regulating the flow of the solution supplied to the mixing unit.
3. The adjustable mixing device according to claim 1, wherein the flow rate ratio of the solution supplied to the mixing unit by each liquid supply unit is a, and a is greater than or equal to 0 and less than or equal to 100%.
4. The adjustable mixing device of claim 1, wherein each of said liquid supply units supplies a solution to said mixing unit at a temperature T, T being 20 ℃ T180 ℃.
5. The adjustable mixing apparatus of claim 1, wherein each of the liquid supply units comprises:
a solution supply means for containing the solution;
and the power device, the temperature adjusting device and the flowmeter are arranged on a solution output pipeline of the liquid supply unit.
6. A control device, comprising:
the communication unit is used for sending flow control signals to at least two liquid supply units included in the adjustable mixing device; the at least two liquid supply units are used for supplying the solution to the mixing unit included in the adjustable mixing device according to the flow control signals, and the flow rate and/or the temperature of the solution supplied to the mixing unit by the at least two liquid supply units are different.
7. The control device according to claim 6, wherein the communication unit is further configured to receive a current temperature of the mixed solution in the mixing unit transmitted by a temperature sensor;
the control device further comprises a processing unit, and the processing unit is used for generating the flow control signal according to the temperature difference between the current temperature and the preset temperature of the mixed solution.
8. An adjustable mixing system is characterized by comprising a control device, an adjustable mixing device and a temperature sensor, wherein the adjustable mixing device and the temperature sensor are respectively in communication connection with the control device;
the adjustable mixing device is the adjustable mixing device of any one of claims 1 to 5;
the control device is the control device of claim 6 or 7;
the temperature sensor is used for collecting the temperature of the mixed solution in the mixing unit included by the adjustable mixing device.
9. An adjustable mixing method, characterized by being applied to the adjustable mixing system of claim 8; the adjustable mixing method comprises the following steps:
acquiring the temperature of the solution in at least two liquid supply units;
and controlling at least two liquid supply units to supply solutions to the mixing unit at different flow rates and/or different temperatures so as to obtain a mixed solution with a preset temperature in the mixing unit.
10. The adjustable mixing method according to claim 9, wherein the controlling at least two of the liquid supply units to supply solutions to the mixing unit at different flow rates and/or different temperatures to obtain a mixed solution having a preset temperature in the mixing unit comprises:
acquiring the current temperature of the mixed solution in the mixing unit;
and respectively controlling the flow rates of at least two liquid supply units of the solution supplied to the mixing unit according to the temperature difference between the current temperature and the preset temperature of the mixed solution.
11. The adjustable mixing method of claim 10, wherein said separately controlling the flow rates of at least two of said liquid supply units of said solution provided to said mixing unit based on the temperature difference between the current temperature and the preset temperature of said mixed solution comprises:
when the current temperature of the mixed solution is higher than the preset temperature, adjusting a first current flow proportion of the solution, which is provided for the mixing unit and enables the current temperature of the mixed solution to be increased, so as to obtain a first target flow proportion, wherein the first target flow proportion is greater than or equal to 0 and less than or equal to the first current flow proportion; adjusting a second current flow proportion of the solution, which is provided to the mixing unit and enables the current temperature of the mixed solution to be reduced, so as to obtain a second target flow proportion, wherein the second current flow proportion is less than or equal to the second target flow proportion;
when the current temperature of the mixed solution is lower than the preset temperature, adjusting a third current flow proportion of the solution, which is provided to the mixing unit and enables the current temperature of the mixed solution to be increased, so as to obtain a third target flow proportion, wherein the third current flow proportion is less than or equal to the third target flow proportion; adjusting a fourth current flow proportion of the solution which is provided for the mixing unit and enables the current temperature of the mixed solution to be reduced so as to obtain a fourth target flow proportion, wherein the fourth target flow proportion is greater than or equal to 0 and less than or equal to the fourth current flow proportion;
and when the current temperature of the mixed solution is equal to the preset temperature, respectively controlling a fifth current flow proportion of the solution supplied to the mixing units to be kept unchanged.
CN202011120772.0A 2020-10-19 2020-10-19 Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method Pending CN114432957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011120772.0A CN114432957A (en) 2020-10-19 2020-10-19 Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011120772.0A CN114432957A (en) 2020-10-19 2020-10-19 Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method

Publications (1)

Publication Number Publication Date
CN114432957A true CN114432957A (en) 2022-05-06

Family

ID=81357111

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011120772.0A Pending CN114432957A (en) 2020-10-19 2020-10-19 Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method

Country Status (1)

Country Link
CN (1) CN114432957A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105992915A (en) * 2014-02-12 2016-10-05 松下知识产权经营株式会社 Hot and cold water mixing device
CN107890786A (en) * 2017-12-27 2018-04-10 上海格拉曼国际消防装备有限公司 A kind of more liquid on-line high accuracy hybrid systems
WO2018089658A1 (en) * 2016-11-11 2018-05-17 Mks Instruments, Inc. Systems and method for generating a conductive liquid comprising deionized water with ammonia gas dissolved therein
CN108662785A (en) * 2017-03-31 2018-10-16 芜湖美的厨卫电器制造有限公司 Water-heater system and its control method
CN111214972A (en) * 2020-01-16 2020-06-02 北京北方华创微电子装备有限公司 Liquid medicine proportioning method and liquid medicine proportioning device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105992915A (en) * 2014-02-12 2016-10-05 松下知识产权经营株式会社 Hot and cold water mixing device
WO2018089658A1 (en) * 2016-11-11 2018-05-17 Mks Instruments, Inc. Systems and method for generating a conductive liquid comprising deionized water with ammonia gas dissolved therein
CN108662785A (en) * 2017-03-31 2018-10-16 芜湖美的厨卫电器制造有限公司 Water-heater system and its control method
CN107890786A (en) * 2017-12-27 2018-04-10 上海格拉曼国际消防装备有限公司 A kind of more liquid on-line high accuracy hybrid systems
CN111214972A (en) * 2020-01-16 2020-06-02 北京北方华创微电子装备有限公司 Liquid medicine proportioning method and liquid medicine proportioning device

Similar Documents

Publication Publication Date Title
US8409997B2 (en) Apparatus and method for controlling silicon nitride etching tank
US7976718B2 (en) System and method for selective etching of silicon nitride during substrate processing
WO2003029775B1 (en) Thermoplastic apparatus for conditioning the temperature of a fluid
US20080066864A1 (en) Etch apparatus
CN102057476B (en) Fast substrate support temperature control
CN107636807B (en) Substrate processing system and substrate processing method
TW201505087A (en) Processing system and method for providing a heated etching solution
JP2001023952A (en) Etching method and device
CN101399168B (en) Method for controlling stability in wet chemical bath process
CN114432957A (en) Adjustable mixing device, control device, adjustable mixing system and adjustable mixing method
CN203218224U (en) Fluid supply box and etching device
US7922826B2 (en) Substrate treating apparatus and method
JP2001009443A (en) Pure water heating device and heating method and hot pure water replenishing method
JP2013021198A (en) Chemical liquid temperature control device and method
TWI240763B (en) Liquid phase deposition production method and device
CN213988838U (en) Wet cleaning equipment with concentration self-adjusting function
JP3430611B2 (en) Etching apparatus and treatment method for concentrated phosphoric acid solution
CN109571227B (en) Polishing solution supply system, method and polishing system
CN114733436A (en) Adjustable mixing equipment and adjustable mixing method
JP3739952B2 (en) Substrate processing equipment
CN219934094U (en) Control device for regulating constant flow in heat exchange station
CN117316811A (en) Wafer cleaning device
CN115016572A (en) Temperature control system and method applied to wet etching cleaning machine
JPS6378538A (en) Treater
JP2000223463A (en) Board treating equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20220506