CN114421445A - Chip for preventing reverse connection of power supply - Google Patents
Chip for preventing reverse connection of power supply Download PDFInfo
- Publication number
- CN114421445A CN114421445A CN202111041437.6A CN202111041437A CN114421445A CN 114421445 A CN114421445 A CN 114421445A CN 202111041437 A CN202111041437 A CN 202111041437A CN 114421445 A CN114421445 A CN 114421445A
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- chip
- power supply
- diode
- pin
- bridge circuit
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- 239000000758 substrate Substances 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H11/00—Emergency protective circuit arrangements for preventing the switching-on in case an undesired electric working condition might result
- H02H11/002—Emergency protective circuit arrangements for preventing the switching-on in case an undesired electric working condition might result in case of inverted polarity or connection; with switching for obtaining correct connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
Abstract
The invention discloses a chip for preventing reverse connection of power supplies, which is characterized in that: the chip comprises a first chip pin and a second chip pin, and the first chip pin and the second chip pin can be interchangeably connected with a power supply positive terminal and a power supply negative terminal; the chip also comprises a power supply direction maintaining circuit and other chip circuits; and the power supply direction maintaining circuit is used for always ensuring that the power supply of the other chip circuits is kept in a positive connection state. The chip with the function of preventing the reverse connection of the power supply can be realized without depending on any circuit outside the chip.
Description
Technical Field
The invention belongs to the field of chips, and particularly relates to a chip for preventing reverse connection of a power supply.
Background
In the field of chips, when a chip company delivers a chip to a user, the user must distinguish the positive pin and the negative pin of the power supply of the chip in the process of testing and using the chip so as to avoid the chip from being burnt down due to the fact that the power supply of the chip is connected.
There is a need in the art for a chip with power-supply-reversal-prevention function without relying on any circuit outside the chip.
Disclosure of Invention
In view of this, the present invention provides a chip for preventing reverse connection of power supplies, which is characterized in that:
the chip comprises a first chip pin and a second chip pin, and the first chip pin and the second chip pin can be interchangeably connected with a power supply positive terminal and a power supply negative terminal;
the chip also comprises a power supply direction maintaining circuit and other chip circuits;
and the power supply direction maintaining circuit is used for always ensuring that the power supply of the other chip circuits is kept in a positive connection state.
Preferably, the first and second liquid crystal materials are,
the power supply direction maintaining circuit includes a bridge circuit.
Preferably, the first and second liquid crystal materials are,
the bridge circuit comprises four diodes, and the four diodes form a full bridge circuit.
Preferably, the first and second liquid crystal materials are,
in the bridge circuit, the cathode of the first diode is connected with the anode of the second diode, and the first diode and the second diode are both connected to a first chip pin.
Preferably, the first and second liquid crystal materials are,
in the bridge circuit, the cathode of the third diode is connected with the anode of the fourth diode and both are connected to the pin of the second chip.
Preferably, the first and second liquid crystal materials are,
in the bridge circuit, the anode of the first diode and the anode of the third diode are connected and are both connected to the power supply negative terminal of the other chip circuit.
Preferably, the first and second liquid crystal materials are,
in the bridge circuit, the cathode of the second diode is connected with the cathode of the fourth diode, and the cathodes of the second diode and the fourth diode are both connected to the power supply positive terminals of the other chip circuits.
Preferably, the first and second liquid crystal materials are,
the chip is MCU or other chips.
The invention has the following technical effects:
through the scheme, the novel chip is realized, and no matter how the chip is connected in the positive and reverse directions, the situation that the chip is damaged due to the fact that the power supply of the chip is connected in the reverse direction can not be caused.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of the internal structure of a chip in one embodiment of the invention;
FIG. 2 is a schematic diagram of a prior art structure for preventing reverse connection of power supplies;
fig. 3 is a schematic diagram of the internal structure of a chip in one embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 3 of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, in one embodiment, the invention discloses a chip for preventing reverse connection of power supply, which is characterized in that:
the chip comprises a first and a second chip pin VaAnd VbThe first chip pin and the second chip pin can be interchangeably connected with a power supply positive terminal and a power supply negative terminal;
the chip also comprises a power supply direction maintaining circuit and other chip circuits;
and the power supply direction maintaining circuit is used for always ensuring that the power supply of the other chip circuits is kept in a positive connection state.
It can be understood that, in this embodiment, the power supply direction maintaining circuit is directly added inside the chip, and when the power supply direction maintaining circuit is connected to the other chip circuits inside, the power supply direction maintaining circuit always ensures that the power supply of the other chip circuits is kept in a positive connection state.
For comparison, referring to the prior art shown in fig. 2, for the MCU chip, an external diode is connected between the MCU and the power supply, and the power supply is protected by the protection of the MCU after being connected in reverse without conducting the circuit by the unidirectional conduction characteristic of the diode. This obviously leads to the MCU chip being unable to work under the condition of reverse connection and having to be powered up again correctly, which not only takes time but also has poor user experience. The above embodiments disclosed in the present invention solve the above problems in the prior art.
In another embodiment of the present invention, the substrate is,
the power supply direction maintaining circuit is positioned as close to the whole edge of the chip as possible, and meanwhile, overlong wiring is prevented.
This is because, with this embodiment, the power supply direction maintaining circuit requires a large withstand voltage capability due to direct connection with the power supply input. Such withstand voltage capability puts requirements on chip design. For this reason, further, it is recommended to enlarge the area of the power supply direction maintaining circuit.
In addition, since the wiring inside the power supply direction maintaining circuit itself also needs to have a large withstand voltage capability in the chip, in consideration of the fact that the wiring inside itself occupies a certain area of the entire power supply direction maintaining circuit, it is necessary to prevent an excessively long wiring inside itself and an excessively long wiring between the power supply direction maintaining circuit and other internal circuits in the chip in order to balance the area and withstand voltage. Therefore, even if the power supply direction maintaining circuit generates heat during operation, the power supply direction maintaining circuit is located close to the edge of the entire chip, and thus the influence on other areas of the chip is not large.
In another embodiment of the present invention, the substrate is,
the chip comprises an isolation layer to reduce the influence of the power supply direction maintaining circuit on other circuits of the chip.
In another embodiment of the present invention, the substrate is,
the power supply direction maintaining circuit includes a bridge circuit.
Referring to fig. 3, in another embodiment,
the bridge circuit comprises four diodes D1-D4, which form a full bridge circuit.
In another embodiment of the present invention, the substrate is,
in the bridge circuit, the cathode of the first diode is connected with the anode of the second diode, and the first diode and the second diode are both connected to a first chip pin.
In another embodiment of the present invention, the substrate is,
the bridge circuit is formed by two or four MOS tubes. Typically, four MOS transistors form a full bridge circuit.
This is because the MOS transistor has a smaller internal resistance than the diode (note that, particularly, the NMOS transistor), thereby reducing the requirement for withstand voltage and contributing to reduction in heat generation of the bridge circuit. In combination with the foregoing embodiments, this embodiment helps to further improve the overall heat generation of the chip, and optimize the position of the power supply direction maintaining circuit, which can be closer to other internal circuits of the chip, thereby helping to further reduce the surface area and volume of the whole chip.
In another embodiment of the present invention, the substrate is,
in the bridge circuit, the cathode of the third diode is connected with the anode of the fourth diode and both are connected to the pin of the second chip.
In another embodiment of the present invention, the substrate is,
in the bridge circuit, the anode of the first diode and the anode of the third diode are connected and are both connected to the power supply negative terminal of the other chip circuit.
In another embodiment of the present invention, the substrate is,
in the bridge circuit, the cathode of the second diode is connected with the cathode of the fourth diode, and the cathodes of the second diode and the fourth diode are both connected to the power supply positive terminals of the other chip circuits.
In another embodiment of the present invention, the substrate is,
the chip is MCU or other chips.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. A chip for preventing reverse connection of power supplies is characterized in that:
the chip comprises a first chip pin and a second chip pin, and the first chip pin and the second chip pin can be interchangeably connected with a power supply positive terminal and a power supply negative terminal;
the chip also comprises a power supply direction maintaining circuit and other chip circuits;
and the power supply direction maintaining circuit is used for always ensuring that the power supply of the other chip circuits is kept in a positive connection state.
2. The chip of claim 1, wherein, preferably,
the power supply direction maintaining circuit includes a bridge circuit.
3. The chip of claim 2, wherein,
the bridge circuit comprises four diodes, and the four diodes form a full bridge circuit.
4. The chip of claim 3, wherein,
in the bridge circuit, the cathode of the first diode is connected with the anode of the second diode, and the first diode and the second diode are both connected to a first chip pin.
5. The chip of claim 3, wherein,
in the bridge circuit, the cathode of the third diode is connected with the anode of the fourth diode and both are connected to the pin of the second chip.
6. The chip of claim 3, wherein,
in the bridge circuit, the anode of the first diode and the anode of the third diode are connected and are both connected to the power supply negative terminal of the other chip circuit.
7. The chip of claim 3, wherein,
in the bridge circuit, the cathode of the second diode is connected with the cathode of the fourth diode, and the cathodes of the second diode and the fourth diode are both connected to the power supply positive terminals of the other chip circuits.
8. The chip of claim 1, wherein,
the chip is MCU or other chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041437.6A CN114421445B (en) | 2021-09-06 | 2021-09-06 | Chip capable of preventing reverse connection of power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041437.6A CN114421445B (en) | 2021-09-06 | 2021-09-06 | Chip capable of preventing reverse connection of power supply |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114421445A true CN114421445A (en) | 2022-04-29 |
| CN114421445B CN114421445B (en) | 2024-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111041437.6A Active CN114421445B (en) | 2021-09-06 | 2021-09-06 | Chip capable of preventing reverse connection of power supply |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002027759A (en) * | 2000-07-07 | 2002-01-25 | Seiko Instruments Inc | Electronic commentator device |
| US20110199029A1 (en) * | 2010-02-12 | 2011-08-18 | Chip Goal Electronics Corporation, Roc | Bi-Direction Driver IC and Method for Bi-Directionally Driving an Object |
| CN205213072U (en) * | 2015-12-02 | 2016-05-04 | 上海航空电器有限公司 | Light emitting diode (LED) bulb |
| US20170187183A1 (en) * | 2015-08-07 | 2017-06-29 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Chip and electronic device |
| CN207150167U (en) * | 2017-07-27 | 2018-03-27 | 绍兴光大芯业微电子有限公司 | Applied to the reverse-connection protection circuit in unicoil fans drive chip |
| CN207743891U (en) * | 2018-01-08 | 2018-08-17 | 深圳市微电能科技有限公司 | A kind of power supply circuit of MCU chip |
| CN211744117U (en) * | 2020-01-19 | 2020-10-23 | 深圳市北美通科技有限公司 | Charging circuit compatible with quick charging mode and common charging mode |
| CN112993964A (en) * | 2021-03-17 | 2021-06-18 | 无锡十顶电子科技有限公司 | Electrostatic protection circuit for buzzer driving chip power supply |
-
2021
- 2021-09-06 CN CN202111041437.6A patent/CN114421445B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002027759A (en) * | 2000-07-07 | 2002-01-25 | Seiko Instruments Inc | Electronic commentator device |
| US20110199029A1 (en) * | 2010-02-12 | 2011-08-18 | Chip Goal Electronics Corporation, Roc | Bi-Direction Driver IC and Method for Bi-Directionally Driving an Object |
| US20170187183A1 (en) * | 2015-08-07 | 2017-06-29 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Chip and electronic device |
| CN205213072U (en) * | 2015-12-02 | 2016-05-04 | 上海航空电器有限公司 | Light emitting diode (LED) bulb |
| CN207150167U (en) * | 2017-07-27 | 2018-03-27 | 绍兴光大芯业微电子有限公司 | Applied to the reverse-connection protection circuit in unicoil fans drive chip |
| CN207743891U (en) * | 2018-01-08 | 2018-08-17 | 深圳市微电能科技有限公司 | A kind of power supply circuit of MCU chip |
| CN211744117U (en) * | 2020-01-19 | 2020-10-23 | 深圳市北美通科技有限公司 | Charging circuit compatible with quick charging mode and common charging mode |
| CN112993964A (en) * | 2021-03-17 | 2021-06-18 | 无锡十顶电子科技有限公司 | Electrostatic protection circuit for buzzer driving chip power supply |
Non-Patent Citations (3)
| Title |
|---|
| 张鑫: "基于可重构的工业以太网监控节点设计", 《新型工业化》, vol. 7, no. 4, pages 178 - 179 * |
| 王水平等: "《开关电源原理与应用设计实验教程》", 28 February 2019, 西安电子科技大学出版社, pages: 124 * |
| 金燕等: "《模拟电子技术实验与课程设计》", 华中科技大学出版社, pages: 192 * |
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| Publication number | Publication date |
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| CN114421445B (en) | 2024-02-23 |
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