CN114421276A - Axisymmetric semiconductor laser bar beam combining technology and module - Google Patents
Axisymmetric semiconductor laser bar beam combining technology and module Download PDFInfo
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- CN114421276A CN114421276A CN202011101877.1A CN202011101877A CN114421276A CN 114421276 A CN114421276 A CN 114421276A CN 202011101877 A CN202011101877 A CN 202011101877A CN 114421276 A CN114421276 A CN 114421276A
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- optical fiber
- gear
- semiconductor laser
- inner gear
- outer gear
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000005516 engineering process Methods 0.000 title claims description 6
- 239000013307 optical fiber Substances 0.000 claims abstract description 74
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 10
- 238000005253 cladding Methods 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000008602 contraction Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000012536 packaging technology Methods 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
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- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 210000003781 tooth socket Anatomy 0.000 description 1
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Abstract
The invention discloses a semiconductor laser bar packaging technology and a beam combination module adopting an axisymmetric structure, wherein a plurality of axisymmetric semiconductor laser bars are fixed and uniformly distributed around an optical fiber coupler and share the same set of axisymmetric clamps: the beam combining module adopts a cylindrical symmetrical structure which clamps the semiconductor laser bars by the inner gear and the outer gear, the number of teeth is odd Q, the semiconductor laser bars are sleeved and concentric, the semiconductor laser bars are uniformly distributed and clamped between the mutually meshed teeth of the inner gear and the outer gear, and the light emitting surface and the inner surfaces of the inner gear and the outer gear are positioned on the same cylindrical surface; the optical fiber coupler is made of an optical fiber with a diffraction structure etched on the outer surface of a bare optical fiber cladding perpendicular to an optical axis of the optical fiber, and laser is diffracted on the surface of the bare optical fiber and enters the optical fiber; the clamping structure is fan-shaped, and the light emitting surface one end centre gripping of barre is tighter, is favorable to heat-conduction, and the expend with heat and contract with cold deformation of clamping utensil converts the angle displacement of inside and outside gear around the round mandrel into, does not change the irradiation of laser to optic fibre, and compressive stress is alleviated.
Description
Technical Field
The invention relates to a high-power laser technology, mainly relates to a semiconductor laser bar packaging technology and a module, in particular to a diffraction beam combining technology and a module for clamping a semiconductor laser bar based on axial symmetry type internal and external gear meshing.
Background
The semiconductor laser bar is an engineered commercial laser device, and the further beam combination integration of the output beams of the semiconductor laser bar usually adopts a plane stacking series connection structure; in the building block type beam combination structure, the semiconductor laser bars and the clamping metal structure are arranged at intervals in a one-dimensional mode and are fixedly connected in a melting and welding mode, the coefficients of expansion with heat and contraction with cold of the semiconductor laser bars and the clamping metal device are different, approximately half of electric power is output in the mode of heat energy when the semiconductor laser bars work, the local temperature gradient at the semiconductor laser bars in the module is large, and the cooling and heat management level of the module is limited by space factors and the heat conduction speed.
The design concept of the fixed connection has structural stress caused by heat aggregation, so that the internal stress of a semiconductor device is further aggravated, the service life of a semiconductor laser bar is far shorter than that of a single packaged semiconductor laser device, the mass ratio of output laser power beams of the laser bar and the stability of wavelength are limited after a large number of semiconductor laser bars are integrated, the requirements of small beam divergence angle and wavelength stability of remote laser energy transmission cannot be met, and high laser power density cannot be obtained.
In the series circuit mode, after a single light emitting point device in the semiconductor laser bar fails, the total current is shunted to other light emitting points on the semiconductor laser bar, so that the load current on the single light emitting point device is increased, and certain risk exists on the reliability of the whole module system.
Patent application No. 202010728798.7 discloses a semiconductor laser beam combining technique, which is characterized in that on the side wall of a bare fiber, a diffraction grating with a width equal to the laser wavelength is etched perpendicular to the optical axis of the fiber, and laser is coupled to the fiber core of the bare fiber through the diffraction grating and is output from two ends of the bare fiber.
Disclosure of Invention
The invention aims to overcome the limitation of the existing semiconductor laser bar plane stacking string combined beam technology and improve the energy of the combined beam and the stability of performance parameters of the combined beam.
The invention provides a semiconductor laser bar packaging technology adopting an axisymmetric structure, in order to overcome the influence of uneven stress of the existing clamping structure on the stability of output laser, a plurality of semiconductor laser bars are fixed and uniformly distributed around an optical fiber coupler in an axisymmetric mode, each semiconductor laser bar shares the same set of axisymmetric clamp to emit laser to irradiate the optical fiber coupler, the optical fiber coupler is made of optical fibers with diffraction structures, which are etched on the outer surface of a bare optical fiber cladding, the outer surface of the bare optical fiber cladding is vertical to the optical axis of the optical fibers, the laser is diffracted on the surface of the bare optical fibers to enter the optical fibers, the laser deflected in the axial direction of the optical fibers is coupled to enter the fiber cores for transmission, and the laser deflected in the radial direction of the optical fibers is gradually turned to the axial direction of the optical fibers through multiple reflections and diffraction to enter the fiber cores for transmission until all the laser enters the fiber cores and is output by end faces.
The second technical problem to be solved by the invention is to provide a beam combining module 1 based on an axisymmetric structure for integrating, diffracting and coupling an oval laser spot array output by a semiconductor laser bar into an optical fiber, wherein the beam combining module 1 comprises an inner gear 2, an outer gear 3, an optical fiber coupler 4, a semiconductor laser bar 5 and an insulating flange plate 10, the inner gear 2 and the outer gear 3 are both metal gears, the number of teeth of the inner gear 2 and the outer gear 3 is equal and is odd number Q, the inner wall of the inner gear 2 is cylindrical, Q side faces are positioned in clamping grooves in the radial direction of the cylinder, and one end of the outer gear 3, which is cylindrical, is axially provided with Q clamping grooves, the side faces of which are positioned in the radial direction of the cylinder, so that a claw shape is formed; the inner surfaces of the inner gear 2 and the outer gear 3 are equal in diameter and plated with gold, and the inner gear 2 and the outer gear 3 are sleeved with each other concentrically; the semiconductor laser bars 5 are uniformly distributed and clamped between the mutually meshed teeth of the inner gear 2 and the outer gear 3, the light-emitting surfaces are aligned to the circle centers of the cylinders of the inner gear 2 and the outer gear 3, the light-emitting surfaces and the radial inner surfaces of the teeth of the inner gear 2 and the outer gear 3 are positioned on the same cylindrical surface, and the P surface and the N surface of each semiconductor laser bar 5 are respectively adjacent to the meshed tooth surfaces of the inner gear 2 and the outer gear 3 and are fixedly welded by adopting gold-tin solder; the optical fiber coupler 4 is fixedly arranged at the axes of the cylinders of the inner gear 2 and the outer gear 3, and the optical fiber coupler 4 is made of an optical fiber with a diffraction structure etched on the outer surface of a bare optical fiber cladding perpendicular to the optical axis of the optical fiber; the tooth crest part of the inner gear 2 and the tooth space side wall of the outer gear 3 are both right-angle edges without chamfers, and the outer wall of the inner gear 2 is provided with an axial strip-shaped through hole 8, so that the semiconductor laser bar 5 can be conveniently clamped; an insulating flange plate 10 is arranged between the inner gear 2 and the outer gear 3 in the radial direction, and an elastic insulating sheet 7 is arranged between adjacent teeth of the inner gear 2 and the outer gear 3, so that the stress clamped on the semiconductor laser bars 5 is relatively stable during light emitting operation; the inner gear 2 and the outer gear 3 are respectively connected with the positive pole and the negative pole of a direct current source.
The third technical problem to be solved by the present invention is to improve the quality of the laser output beam of the beam combining module 1, one end of the provided optical fiber coupler 4 is total reflection, an end face oblique to the optical axis of the optical fiber is adopted for cutting and plating a high reflection film 11, and the other end of the optical fiber coupler 4 is tapered 6 and is welded with a single mode optical fiber to output a single mode light beam.
The fourth technical problem to be solved by the invention is that in order to improve the cooling capacity of the beam combining module 1, a plurality of cavities 9 for filling cooling liquid are also distributed in the teeth of the inner gear 2 and the outer gear 3, and the micro-deformation of the cavities 9 relieves the thermal expansion and cold contraction stress of the whole beam combining module 1.
The fifth technical problem to be solved by the invention is that in order to expand the laser wavelength range and improve the laser energy, the beam combining module 1 can cascade and connect a plurality of beams in series, and the multi-wavelength beam combining optical fiber output is realized by optical fiber fusion.
The invention has the following advantages:
the invention adopts the packaging structure for symmetrically clamping the semiconductor laser bars in the same axis, so that each semiconductor laser bar in the plurality of semiconductor laser bars has the same loading environment, a large amount of beam combination is convenient, the laser energy is improved, and the high power beam quality ratio is obtained through collimation;
the invention adopts a cylindrical structure that the inner gear and the outer gear are meshed to clamp the semiconductor laser bars, the P surface and the N surface of each semiconductor laser bar are tightly connected with the side surfaces of tooth grooves of the inner gear and the outer gear, so that the semiconductor laser bars are positioned in a fan-shaped clamping structure, one end of the light emitting surface is clamped more tightly, the heat conduction is facilitated, the thermal expansion and cold contraction deformation of the clamping is converted into the angular displacement of the inner gear and the outer gear around a round mandrel, the irradiation of the laser to an optical fiber is not changed, the compressive stress of the semiconductor laser bars is relieved, the laser wavelength output by the semiconductor laser bars is stabilized, and the energy and the wavelength of the laser output by a module are stabilized;
the invention adopts the inner gear and the outer gear which have the same number of teeth and are odd number Q, so that the phenomenon of eye alignment between the clamped semiconductor laser bars is avoided, the damage probability is reduced, and the service life of the semiconductor laser bars is prolonged;
the invention adopts the inner metal gear and the outer metal gear to be respectively connected with the positive pole and the negative pole of the direct current source, so that all the lasers of each semiconductor laser bar in the module are connected in parallel, the influence on the power-on loads of other lasers in the whole module is weakened when a single laser fails, and the reliability of the whole module is effectively improved.
Drawings
FIG. 1 is a cross-sectional view of a semiconductor laser bar beam combining module
FIG. 2 is a semiconductor laser bar beam-combining optical fiber coupler
FIG. 3 semiconductor laser bar beam combining module
Detailed Description
One end of the optical fiber coupler 4 is preferably totally reflected, an end face inclined 45 degrees to an optical axis of the optical fiber is used for cutting and plating a high reflection film 11, the other end of the optical fiber coupler 4 is tapered 6 and is welded with the single-mode optical fiber, and the single-mode light beam is output to improve the quality of the output light beam of the laser of the beam combining module.
Claims (6)
1. The semiconductor laser bar beam combining technology is characterized in that a plurality of semiconductor laser bars are fixed and uniformly distributed around the axis of an optical fiber coupler in an axial symmetry mode, each semiconductor laser bar shares a set of axial symmetry type clamp to emit laser to irradiate the optical fiber coupler, the optical fiber coupler is made of optical fibers with diffraction structures, the outer surface of a bare optical fiber cladding is perpendicular to the optical axis of the optical fibers, the laser is diffracted on the surface of the bare optical fibers and enters the optical fibers, the laser deflected in the axial direction of the optical fibers is coupled and enters a fiber core for transmission, and the laser deflected in the radial direction of the optical fibers is gradually turned to the axial direction of the optical fibers through multiple reflections and diffraction and enters the fiber core for transmission until all the laser enters the fiber core and is output from an end face.
2. A beam combining module [1], comprising: the claw-shaped laser coupler comprises an inner gear [2], an outer gear [3], an optical fiber coupler [4], a plurality of semiconductor laser bars [5] and an insulating flange plate [10], wherein the inner gear [2] and the outer gear [3] are metal gears, the number of teeth of the inner gear [2] and the outer gear [3] is equal and is odd number Q, the inner gear [2] is a cylindrical inner wall and is provided with Q fan-shaped grooves, the side faces of the inner gear are located in the radial direction of the cylinder, one end of the outer gear [3] which is cylindrical is axially provided with Q fan-shaped clamping grooves, and the side faces of the outer gear are located in the radial direction of the cylinder to form a claw shape; the inner surfaces of the inner gear [2] and the outer gear [3] are equal in diameter and plated with gold, and the inner gear [2] and the outer gear [3] are sleeved with each other concentrically; the semiconductor laser bars [5] are uniformly distributed and clamped between the mutually meshed teeth of the inner gear [2] and the outer gear [3], the light-emitting surface is aligned to the circle center of the cylinder of the inner gear [2] and the outer gear [3], the light-emitting surface is positioned on the same cylindrical surface with the inner surfaces of the inner gear [2] and the outer gear [3], the P surface and the N surface of each semiconductor laser bar [5] are respectively adjacent to the meshed tooth surfaces of the inner gear [2] and the outer gear [3], and the semiconductor laser bars are fixedly welded by adopting gold-tin solder; the optical fiber coupler [4] is fixedly arranged at the axes of the inner gear [2] and the outer gear [3] cylinders and is made of optical fibers with diffraction structures etched on the outer surface of a bare optical fiber cladding perpendicular to the optical axis of the optical fibers; the tooth crest part of the inner gear [2] and the tooth space side wall of the outer gear [3] are both right-angle edges without chamfers, and the outer wall of the inner gear [2] is provided with an axial strip-shaped through hole [8] which is convenient for clamping a semiconductor laser bar [5 ]; an insulating flange plate [10] is radially arranged between the inner gear [2] and the outer gear [3], an elastic insulating sheet [7] is arranged between adjacent teeth of the inner gear [2] and the outer gear [3], and the stress clamped on the semiconductor laser bar [5] is relatively stable during light emitting work; the inner gear [2] and the outer gear [3] are respectively connected with the positive pole and the negative pole of the direct current source.
3. The beam combining module [1] according to claim 2, wherein: one end of the optical fiber coupler [4] is totally reflected, the end face inclined to the optical axis of the optical fiber is cut and plated with a high reflection film [11], and the other end of the optical fiber coupler [4] is tapered [6] and is welded with the single-mode optical fiber to output a single-mode light beam.
4. The beam combining module [1] according to claim 2, further comprising a cooling method, wherein a plurality of cavities [9] for filling cooling liquid are distributed in the teeth of the inner gear [2] and the outer gear [3], and the micro deformation of the cavities [9] also relieves the thermal expansion and contraction stress of the whole beam combining module [1 ].
5. The beam combining module [1] according to claim 2, wherein: the beam combining module [1] can be connected in series in a cascading way, and the multi-wavelength beam combining optical fiber output is realized through optical fiber welding.
6. The beam combining technique of claim 1, wherein: the semiconductor laser bars can also be symmetrically and uniformly distributed around the axis of the optical fiber coupler by adopting bars with different laser wavelengths, so that multi-wavelength beam combination is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011101877.1A CN114421276A (en) | 2020-10-09 | 2020-10-09 | Axisymmetric semiconductor laser bar beam combining technology and module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011101877.1A CN114421276A (en) | 2020-10-09 | 2020-10-09 | Axisymmetric semiconductor laser bar beam combining technology and module |
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| Publication Number | Publication Date |
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| CN114421276A true CN114421276A (en) | 2022-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011101877.1A Pending CN114421276A (en) | 2020-10-09 | 2020-10-09 | Axisymmetric semiconductor laser bar beam combining technology and module |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01177001A (en) * | 1987-05-29 | 1989-07-13 | Kokusai Denshin Denwa Co Ltd <Kdd> | Fiber type optical multiplexer/demultiplexer |
| US20050220163A1 (en) * | 2004-03-26 | 2005-10-06 | Kyocera Corporation | External resonator and semiconductor laser module using the same |
| US20050254751A1 (en) * | 2002-12-16 | 2005-11-17 | Toshihiko Ushiro | Optical fiber having diffractive optical film on end and method for manufacturing same |
| KR20060056087A (en) * | 2004-11-19 | 2006-05-24 | 한국전자통신연구원 | Optical fiber having bragg grating and manufacturing method thereof |
| CN107293940A (en) * | 2017-08-16 | 2017-10-24 | 江苏天元激光科技有限公司 | A kind of multi-wavelength high-power semiconductor laser |
| CN110212403A (en) * | 2019-07-13 | 2019-09-06 | 海南师范大学 | A kind of hollow laser light source emitter of semiconductor laser |
-
2020
- 2020-10-09 CN CN202011101877.1A patent/CN114421276A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01177001A (en) * | 1987-05-29 | 1989-07-13 | Kokusai Denshin Denwa Co Ltd <Kdd> | Fiber type optical multiplexer/demultiplexer |
| US20050254751A1 (en) * | 2002-12-16 | 2005-11-17 | Toshihiko Ushiro | Optical fiber having diffractive optical film on end and method for manufacturing same |
| US20050220163A1 (en) * | 2004-03-26 | 2005-10-06 | Kyocera Corporation | External resonator and semiconductor laser module using the same |
| KR20060056087A (en) * | 2004-11-19 | 2006-05-24 | 한국전자통신연구원 | Optical fiber having bragg grating and manufacturing method thereof |
| CN107293940A (en) * | 2017-08-16 | 2017-10-24 | 江苏天元激光科技有限公司 | A kind of multi-wavelength high-power semiconductor laser |
| CN110212403A (en) * | 2019-07-13 | 2019-09-06 | 海南师范大学 | A kind of hollow laser light source emitter of semiconductor laser |
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