CN114415566A - Modular power electronic device platform - Google Patents

Modular power electronic device platform Download PDF

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Publication number
CN114415566A
CN114415566A CN202210055975.9A CN202210055975A CN114415566A CN 114415566 A CN114415566 A CN 114415566A CN 202210055975 A CN202210055975 A CN 202210055975A CN 114415566 A CN114415566 A CN 114415566A
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circuit
signal
module
power
signals
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杜思行
刘进军
李聪
邓智峰
陈海宇
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Xian Jiaotong University
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Xian Jiaotong University
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Priority to CN202210055975.9A priority Critical patent/CN114415566A/en
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/04Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0423Input/output
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0247Electrical details of casings, e.g. terminals, passages for cables or wiring
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/25Pc structure of the system
    • G05B2219/25257Microcontroller

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Inverter Devices (AREA)

Abstract

The invention discloses a modular power electronic device platform, which comprises a power module, a multi-channel sampling and conditioning module, a signal adapter plate and a controller module, wherein the power module is connected with the multi-channel sampling and conditioning module; the power module is connected with and acquires a target sampling signal through the multi-channel sampling and conditioning module and feeds the target sampling signal back to the controller module; a control signal sent by the controller module is sent to the power module through the signal adapter plate; the weak current interface of the power module is connected with the signal adapter plate, and the controller module is interacted with the power module through the signal adapter plate. The invention can enhance the modularization, reusability, reliability, usability and flexibility of the power electronic device platform.

Description

Modular power electronic device platform
Technical Field
The invention belongs to the technical field of power electronic devices, and relates to a modular power electronic device platform.
Background
The conventional power electronic device platform is usually directed at a single fixed topology, such as a common three-phase inverter experiment platform, is a fixed topology formed by three-phase six-switch tubes and can only be used in a three-phase inversion occasion; for the power electronic device platform with the novel topology, the switching device directly forms the structure of the novel topology, and the power electronic device platform cannot be used in other topologies. The experimental device is often built by designing a power part, a weak current control part and a power device driving, sampling and controlling part from beginning to end according to the topology type, and the device for one fixed topology cannot be used in other topologies, so that the device cost is greatly increased. In addition, in a separately designed power electronic experiment platform, how to design a circuit capable of stably driving a power device, a weak current control circuit capable of generating a reliable weak current signal, and how to optimize main power loop wiring to improve platform performance are often considered. When the protection logic (overvoltage protection, overcurrent protection, overheat protection, etc.) does not take the bit into consideration, the platform designed separately is often burnt due to uncertain factors during the experiment, and the experiment process and the cost control are affected. In addition, the independently designed platform sampling and conditioning circuit is often only suitable for the working condition and the range of the platform, is fixedly welded on the independently designed platform, and cannot be reused on other power electronic platforms. Because the sensors used for sampling and conditioning are expensive, a large waste of resources is caused.
In summary, the current common power electronic device platform is usually directed to a single topology and cannot be reused to other topologies; the design threshold required by the stable and reliable operation of the device is higher, and the platform cannot be successfully designed once; the workload for designing the device is large, and the device cannot be used for carrying out experiments and verifying the conception quickly. And finally, the time cost and the material cost are higher.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a modular power electronic device platform which can enhance the modularization, reusability, reliability, usability and flexibility of the power electronic device platform.
The purpose of the invention is realized by the following technical scheme:
a modular power electronic device platform comprises a power module, a multi-channel sampling and conditioning module, a signal adapter plate and a controller module;
the power module is connected with and acquires a target sampling signal through the multi-channel sampling and conditioning module and feeds the target sampling signal back to the controller module; a control signal sent by the controller module is sent to the power module through the signal adapter plate;
the weak current interface of the power module is connected with the signal adapter plate, and the controller module is interacted with the power module through the signal adapter plate.
As a further improvement of the invention, the power module comprises a strong electric power circuit, a driving chip and a matching circuit, a dead zone generating circuit and a matching circuit, a protection logic circuit and a matching circuit, and a temperature control fan driving circuit;
the high-voltage power circuit comprises two switching devices, wherein the two switching devices are respectively connected with a diode in parallel in a reverse direction and then connected in series in a forward direction to form a half bridge, and a plurality of decoupling capacitors are connected in parallel between a drain electrode or a collector electrode of the first switching device and a source electrode or an emitter electrode of the second switching device; the drain electrode or the collector electrode of the first switching device is connected with the first current sensor in series, and a DC + port is led out after the first switching device is connected with the first current sensor in series and is used for external wiring of the power module; the source or emitter of the second switching device and the second current sensor are connected in series, and after the series connection, the DC-port is used for external wiring of the power module; the AC port is led out from the midpoint of the connection of the first switching device and the second switching device to be used as an external wiring of the power module; the first current sensor and the second current sensor are both connected with the protection logic circuit and the matching circuit;
the single-path PWM signal is connected with the dead zone generating circuit and the matching circuit to generate two paths of complementary PWM signals with dead zones and then connected with the driving chip and the matching circuit to enable the output of the driving chip and the matching circuit to be used as the driving signals of an upper switching device and a lower switching device of a half bridge of the high-power circuit; the two-way PWM control signal is connected to the signal input end of the driving chip and the supporting circuit, and directly generates the driving signals of the upper and lower switching devices of the half-bridge;
the module blocking signal, the protection logic circuit and the matching circuit are connected to jointly determine the level value of the enabling signal, and the enabling signal is directly used as the enabling end input of the driving chip and the matching circuit; the protection logic circuit and the matching circuit are connected with the temperature control fan driving circuit to drive the heat dissipation fan.
As a further improvement of the invention, thermistors are arranged beside the first switching device and the second switching device and are connected with the protection logic circuit and the matching circuit in parallel.
As a further improvement of the invention, the driving chip and the matching circuit comprise a driving chip and two isolated power supply modules thereof, and the input end of the driving chip is used for filtering two PWM signals transmitted by the dead zone generating circuit and the matching circuit through an RC filter formed by two resistance capacitors; the two isolated power supply modules respectively supply power to the driving circuits of the upper and lower switching tubes of the half bridge, the isolated driving chip obtains voltage and current required by driving signals from the two isolated power supply modules, and PWM signals for driving are generated according to input weak current PWM signals.
As a further improvement of the invention, the dead zone generating circuit and the matching circuit comprise a NOT gate logic chip and an RCD delay circuit; after passing through the two RCD delay circuits, the single-path PWM half-bridge control signal respectively generates rising edge delay and falling edge delay, the signals generating the falling edge delay are subjected to phase reversal, and the signals delayed by the rising edge are kept in the same phase, so that two paths of complementary PWM signals with dead zones are formed; the single/double-path PWM switching signal is connected with the multi-path selector and then connected with the driving chip and the matching circuit.
As a further improvement of the present invention, the protection logic circuit and the supporting circuit include and gate logic, a flip-flop, a comparator, an operational amplifier, and a maximum selection circuit; an overcurrent signal generated by the current sensor is used as the input of AND gate logic after being filtered by RC; the thermistor attached to the switching device converts a thermal signal of the switching device into a voltage signal through a voltage division circuit, the two paths of voltage signals are used as the input of an operational amplifier, and after passing through a maximum value selection circuit formed by the operational amplifier and a diode, the voltage signal of the thermistor with the highest temperature is used as the input of a comparator; the comparator compares the voltage signal with an over-temperature protection threshold voltage to generate a protection pulse; the protection pulse signal is used as the other path of input of the AND gate logic; and after the trigger detects the edge of the protection pulse, the trigger outputs the locking level of the driving chip to lock the driving chip.
As a further improvement of the invention, the temperature-controlled fan driving circuit comprises a comparator, a trigger and a two-stage triode; voltage signals formed by the two paths of thermistors pass through a comparator to generate fan closing signals serving as setting signals and zero clearing signals of the trigger, so that the trigger outputs high level or low level serving as the input of the two-stage triode driving circuit; the first stage of the two-stage triode driving circuit consists of a low-power NPN type triode and a current-limiting resistor, wherein the base electrode of the NPN type triode is connected to the output of the trigger, and the collector electrode of the NPN type triode is connected to the base electrode of the next stage of triode; the collector is connected with a pull-up resistor; the triode of the next stage is an NPN type triode, a collector is connected with the negative electrode of the fan interface, and the positive electrode of the fan interface is connected to a fan power supply through a current-limiting resistor; and the two ends of the fan interface are connected with the diodes in an anti-parallel mode.
As a further improvement of the invention, the multi-channel sampling and conditioning module comprises a voltage and current Hall sensor, an operational amplifier and a matched circuit, an absolute value calculating circuit, a comparison and logic circuit and an overvoltage and overcurrent comparison value generating circuit;
the voltage and current Hall sensor, the operational amplifier and a matching circuit are sequentially connected with the absolute value calculating circuit, and the operational amplifier and the matching circuit are used for outputting a zoomed voltage and current weak current signal; the absolute value calculating circuit and the overvoltage and overcurrent comparison value generating circuit are both connected with the comparison and logic circuit and are used for outputting overvoltage and overcurrent signals.
As a further improvement of the invention, the signal adapter plate comprises an optocoupler chip, a zero clearing key and a matching circuit; the multi-path PWM signals input from the controller module flow into the primary side of the optical coupler chip, and form PWM signals input into a single power module after passing through the isolation of the optical coupler chip and a matched resistance-capacitance filter circuit; the output signal of the zero clearing key is used as a trigger reset signal of all power modules connected with the signal adapter plate, and the reset signal and the PWM signal are isolated on the signal adapter plate and then connected to a weak current side interface of the power modules through a cable with an anti-interference effect.
As a further improvement of the invention, the controller module comprises an ADC conditioning circuit, an ADC board, an FPGA board, a DSP board, an SRAM and FLASH chip, a matching circuit thereof and an external interaction interface;
the ADC conditioning circuit comprises an operational amplifier with an isolation function and a matching circuit, and is used for isolating an externally input voltage signal and then taking the voltage signal as the input of the operational amplifier, so that the output voltage range of the operational amplifier is matched with the input voltage range of the ADC board and the DSP board;
the ADC board comprises an ADC chip and a matched circuit, and an analog voltage signal output by the ADC conditioning circuit is converted into a digital signal through the ADC chip, so that the FPGA board and the DSP board can read an input voltage signal value;
the SRAM, FLASH chip and the matching circuit thereof are connected with the FPGA board and the DSP board, and the FPGA board and the DSP board are used as digital signal processors and are connected with an external interactive interface.
Compared with the prior art, the invention has the following beneficial effects:
the invention relates to a flexibly assembled power electronic device based on a standard half-bridge module and an experimental platform, which consists of a power module, a multi-channel sampling and conditioning module, a signal adapter plate and a controller module. The power module part of the invention is based on half-bridge topology, the sampling and conditioning module part is taken out separately to be made into a multi-channel sampling and conditioning module integrating multiple channels of isolated sampling and operational amplifier conditioning, and the multi-channel sampling and conditioning module can be flexibly connected into a circuit according to the topology control requirement to realize isolated sampling, fixed transformation ratio (directly matched with the transformation ratio of an oscilloscope channel), individual protection threshold value of each channel, multi-channel protection summary and the like. The controller may also use a third party controller. The output of the sampling and conditioning part is connected to a sampling interface of the controller, and the switch control signal output by the controller is connected to the power module through the signal adapter plate module designed by the invention, so that the closed-loop control of the building system can be realized. The modularization, the reusability, the reliability, the usability and the flexibility of the power electronic device platform can be enhanced.
Furthermore, the control part of the invention can be flexibly replaced, and an FPGA or DSP based controller can be used. When higher control requirements exist, the controller module which is designed by the invention and is combined by the FPGA and the DSP can be used as a top layer controller, a single FPGA/DSP controller is used as a valve controller of a middle layer, and the small-scale low-cost FPGA/DSP is used as a bottom layer controller which is directly related to a single power sub-module.
Furthermore, the invention can be used in the power electronic device platform with higher requirements on flexibility and reusability. The modular design ensures that the circuit can be combined at will when facing various complex topologies, and the half-bridge topology is a basic component of a plurality of complex topologies and is multiplexed in different topologies, thereby greatly saving the cost of elements and circuits. The power module with reliable protection logic can timely protect power devices with overcurrent and overtemperature in the use process, greatly reduces the threshold of new topology construction, and saves the time cost spent in hardware circuit debugging in the experiment. The power module can generate two paths of reliable complementary driving signals through a hardware dead zone circuit only by one path of weak current PWM signal, does not need to manually add dead zone time outside through software, does not need to worry about the condition of short circuit caused by direct connection of two switching devices, and is very convenient to use. When the requirements of different power grades are met, the power modules of different power grades can be used, and the power grade of the platform can be quickly improved by replacing the power modules.
Furthermore, the multichannel sampling and conditioning module integrates the multichannel isolated voltage and current sampling channels together, can be flexibly connected according to topological requirements, samples current and voltage signals, and realizes the reusability of sensor elements and the flexibility of signal sampling. The multichannel sampling and conditioning module also provides the individualized protection threshold value of each channel and the function of multichannel protection summary, ensures that the multichannel sampling and conditioning module can also play a role in protection besides the hardware protection of the power module 1, and greatly enhances the reliability of the platform.
Furthermore, the controller module can freely select controller resources according to actual engineering requirements, waste of the controller resources is reduced, a multi-level control architecture can be realized by combining topology, and implementation flexibility of a control system is enhanced. The multi-channel sampling and conditioning module and the power sub-module are protected to form hardware protection logic, the controller forms software protection logic according to the sampling value of the multi-channel sampling and conditioning module, and finally a strict cascade protection system is formed, so that the reliability of the device is greatly enhanced. Finally, the whole device is completely modularized, and the flexibility, the reusability, the modularization, the usability and the economy are greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is an overall block diagram of a modular power electronics platform of the present invention;
FIG. 2 is a power module block diagram of the present invention;
FIG. 3 is a block diagram of the multi-channel sampling and conditioning module of the present invention;
FIG. 4 is a block diagram of the controller module of the present invention;
FIG. 5 is a pictorial diagram of one embodiment of a power module of the present invention;
FIG. 6 is a pictorial diagram of another embodiment of a power module of the present invention;
FIG. 7 is a pictorial diagram of one embodiment of a multi-channel sampling and conditioning module of the present invention;
FIG. 8 is a pictorial representation of one embodiment of a signal patch panel of the present invention;
FIG. 9 is a pictorial diagram of one embodiment of a controller module of the present invention.
Detailed Description
In order to make the objects and technical solutions of the present invention clearer and easier to understand. The present invention will be described in further detail with reference to the following drawings and examples, wherein the specific examples are provided for illustrative purposes only and are not intended to limit the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention without making creative efforts, fall within the scope of the invention.
As shown in fig. 1, the present invention relates to a modular power electronic device platform, which is a flexible assembly type power electronic device based on a standard half-bridge module and an experimental platform. The device consists of a power module 1, a multi-channel sampling and conditioning module 2, a signal adapter plate 3 and a controller module 4. The modularization, the reusability, the reliability, the usability and the flexibility of the power electronic device platform can be enhanced.
The following description of the specific structure with reference to fig. 2 to 4 is as follows:
the power module 1 comprises a strong current power circuit 11, a driving chip and a matching circuit 12, a dead zone generating circuit and a matching circuit 13, a protection logic circuit and a matching circuit 14, and a temperature control fan driving circuit 15; the strong power circuit 11 of the power module 1 includes switching devices S1 and S2 connected in a half-bridge form, the half-bridge midpoint is led out, and diodes D1 and D2 are connected in anti-parallel to the two ends of the switching devices S1 and S2, respectively. And a high-voltage decoupling capacitor is connected between the drain of the S1 and the source of the S2 in parallel to ensure the voltage quality. When topologies with different current and voltage grade requirements are met, the types of the switch devices and the diodes in the strong electric power circuit 11 are different, the wiring line width and the spacing on the PCB are adjusted, but the large framework is unchanged, and finally a series of strong electric power circuits 11 with different voltage and current grades are formed; the driving chip and the matching circuit 12 of the power module 1 comprise an isolation driving chip and a matching circuit thereof, and the matching circuit comprises two isolation power supply circuits, two input filter circuits and two driving resistors. The two weak current driving signals flow into the weak current side of the driving chip after passing through the two input filter circuits, and the driving chip acquires voltage and current required by driving from the two isolated power supply circuits to generate driving signals meeting the requirements of the power switch device; the dead zone generating circuit and the matching circuit 13 of the power module 1 include a logic chip with schmitt trigger characteristics, a multiplexer and a matching circuit thereof. The single-path PWM weak current signal passes through a logic chip containing Schmidt trigger characteristics to form two complementary PWM signals, the matching circuit is a two-path resistance-capacitance circuit, and through resistance value and capacitance value difference, the delays of the two complementary PWM signals on a rising edge and a falling edge are inconsistent, so that a PWM dead zone effect is generated. In addition, whether two paths of complementary PWM signals which are generated by the module and are provided with dead zones are used or not can be freely selected through the multi-path selector, or two paths of PWM signals which are input from the outside of the module are directly used for driving two paths of switching devices.
The protection logic circuit and matching circuit 14 of the power module 1 includes a comparator chip and its matching circuit, an operational amplifier and a maximum value selection circuit, two thermistor circuits, a trigger chip and its matching circuit, and an and gate chip and its matching circuit. The two paths of current sensors generate falling edge signals when the current reaches a protection value according to a current protection value set by a matching circuit, the two paths of overcurrent signals and over-temperature signals pass through an AND gate, the output of a trigger is lowered after being captured by the trigger, the two paths of overcurrent signals and the over-temperature signals pass through the other path of AND gate, whether a driving chip is locked or not is determined together with an active locking signal outside a module, and a reset end of the trigger determines whether the protection signal of the module is cleared or not through an external interface. The overtemperature protection is realized by converting a thermal signal into the change of a resistance value and the change of a voltage division on the thermistor through two thermistors which are pressed by two switching devices, then forming a function of selecting a maximum value through an operational amplifier and a maximum value selection circuit, taking one of two paths of overtemperature protection with the highest temperature as a protection reference signal to be compared with a protection set voltage, and when the protection reference signal is greater than a threshold value of the temperature protection, generating a falling edge signal by a comparator, and capturing the falling edge signal by a trigger after passing through an AND gate to become a part of protection logic. The comparator of the part also has the function of generating a temperature control fan starting and stopping signal, when the temperature sensed by the thermistor is higher than the fan starting temperature, the comparator generates a fan starting signal, and when the sensed temperature is lower than the fan stopping temperature, the comparator generates a fan stopping signal.
The temperature control fan driving circuit 15 of the power module 1 comprises another trigger and a two-stage triode, a fan start-stop signal generated by the comparator is used as the input of a setting and zero clearing signal of the trigger, the trigger is controlled to generate a driving signal of the first-stage triode, the first-stage triode drives the second-stage triode again, the driving capability of the fan start-stop signal is amplified, and finally the output of the second-stage triode is used for driving the fan.
The multi-channel sampling and conditioning module 2 comprises a voltage and current hall sensor 21, an operational amplifier and supporting circuit 22, an absolute value calculating circuit 23, a comparison and logic circuit 24 and an overvoltage and overcurrent comparison value generating circuit 25.
The signal adapter plate 3 comprises a high-speed optical coupler chip, a zero clearing key and a matching circuit. The multipath PWM signals input from the controller module 4 flow into the primary side of the optical coupler chip, the PWM signals input into the single power module 1 are formed after the isolation of the optical coupler chip and the matched resistance-capacitance filter circuit, the signals are isolated from the signals generated by the controller module 4, and the situation that the power module 1 has a problem is guaranteed, and the controller part cannot be influenced. The output signal of the zero clearing key is used as a trigger reset signal of all the power modules 1 connected with the signal adapter plate, and the reset signal and the PWM signal are isolated on the signal adapter plate and then are connected to a weak current side interface of the power modules 1 through a cable with an anti-interference effect;
the controller module 4 includes an ADC conditioning circuit 41, an ADC board 42, an FPGA board 43, and a DSP board 44. The ADC conditioning circuit 41 includes an operational amplifier and a supporting circuit with an isolation function, and isolates an externally input voltage signal to be used as an input of the operational amplifier, so that an output voltage range of the operational amplifier matches an input voltage range of the ADC board 42. The ADC board 42 is composed of an ADC chip and a supporting circuit, and the analog voltage signal output by the ADC conditioning circuit 41 is converted into a digital signal by the ADC chip, so that the FPGA board 43 and the DSP board 44 can read the voltage signal value input to the module.
The FPGA board 43 and the DSP board 44, as digital signal processors of the controller module 4, may be used individually or jointly, and when used individually, the FPGA board 43 or the DSP board 44 independently completes the communication with the ADC board 42, the restoration of the sensor voltage signal, the implementation of the digital controller, the generation of the PWM signal, the implementation of the communication protocol, and other functions that can be implemented by the digital controller. When the FPGA and the DSP are used jointly, the FPGA is responsible for signal throughput tasks such as PWM signal generation, communication protocol realization and the like, and the DSP is responsible for digital signal processing tasks such as digital controller realization and the like. Output signals of the FPGA and the DSP pass through the signal adapter plate to realize the control of elements such as a lower layer controller or the power module 1 and a relay existing in a circuit.
In addition, the form of the controller module 4 can be flexibly selected according to digital signal processing resources required by engineering, when the controller resources required by the engineering are less, the form of a single FPGA/DSP can be adopted as the controller, when the controller resources required by the engineering are more, the form of combining the FPGA and the DSP can be used, when the engineering scale is very large and a multi-level control system is required, the form of combining the FPGA and the DSP can be used in a top-layer controller to communicate with a middle-layer controller, a single FPGA controller with a larger scale is used in the middle-layer controller to communicate with a bottom-layer controller, and a single FPGA controller with a smaller scale is used in the bottom-layer controller to directly communicate with a single power module 1.
Finally, for the whole power electronic device platform system, the power circuit part is spliced in a building block mode through power modules 1 with different power grades to form converter power parts with different topological types; the controller part forms controller modules 4 with different resource specifications and different control levels through various FPGA/DSP board cards; the power circuit is flexibly connected with the multi-channel sampling and conditioning module 2 to obtain a target sampling signal and feed the target sampling signal back to the controller module 4; the control signal sent by the controller module 4 is sent to the power module 1 through the signal adapter board.
The present invention will be described in detail with reference to the following embodiments.
Examples
Referring to fig. 1, a modular power electronic device platform according to the present invention includes: the device comprises a power module 1, a multi-channel sampling and conditioning module 2, a signal adapter plate 3 and a controller module 4.
The power module 1 is composed of five parts, namely a strong power circuit 11, a driving chip and a matching circuit 12, a dead zone generating circuit and a matching circuit 13, a protection logic circuit and a matching circuit 14, and a temperature control fan driving circuit 15. The weak current interface of the power module 1 is connected with the signal adapter plate 3, the controller module 4 realizes interaction with the power module 1 through the signal adapter plate 3, and the interactive signal comprises a control signal and a state feedback signal of the power module 1.
The control signals include single/dual PWM signals, single/dual PWM switching signals and module locking signals. The PWM signal may be one or two, and the multiplexer determines whether the power module 1 uses the single-path PWM signal or the two-path PWM signal in cooperation with the single-path and two-path PWM switching signal. If the PWM control signal is a single-path PWM control signal, the PWM signal is connected to a dead zone generating circuit and a matching circuit 13 in the power module 1 to generate two paths of complementary PWM signals with dead zones, and then the two paths of complementary PWM signals are connected to a driving circuit to enable the output of the driving circuit to be used as driving signals of an upper switching device and a lower switching device of a half bridge, and if the selected PWM signal is a double-path input signal, the two paths of complementary PWM signals are directly connected to the signal input end of the driving circuit to directly generate the driving signals of the upper switching device and the lower switching device of the half bridge. The module blocking signal, the protection logic circuit inside the module and the matching circuit 14 jointly determine the level value of the enabling signal, and the enabling signal is directly used as the enabling end input of the driving chip, so that the safety of the module in an abnormal state is ensured. The state feedback signal of the power module 1 comprises a fault indication signal of the power module 1, and is fed back to the controller module 4 through the signal adapter plate 3, so that the controller module 4 can respond quickly. The strong electric interfaces of the power modules 1 are connected with each other at will to form a target power topology, and the strong electric power circuit 11 of the power module 1 realizes mode switching according to the respective PWM driving signals of the upper and lower switching devices, thereby realizing the mode switching of the whole power topology and realizing the function of the target switching converter. The power module 1 can be adjusted according to the voltage and power grade of the target topology, the structures of the power modules 1 with different voltage and power grades are completely consistent, and the differences only lie in the model change of a switch device and a diode in the strong electric power circuit 11, the selection of the voltage withstanding value of a decoupling capacitor, the line width of PCB wiring and the strong and weak electric isolation distance. The specific connection mode of the internal parts of the module is described in the following for the description of fig. 2.
The multi-channel sampling and conditioning module 2 is composed of five parts, namely a voltage and current Hall sensor 21, an operational amplifier and supporting circuit 22, an absolute value calculating circuit 23, a comparison and logic circuit 24 and an overvoltage and overcurrent comparison value generating circuit 25. The inputs of the voltage and current Hall sensors 21 of the multiple channels are all connected to the main power loop, the ports are designed to be pluggable, and the isolated voltage and current measurement can be carried out by accessing different positions of the strong power loop according to different topologies. The output signal of the module comprises a scaled voltage and current weak current signal and an overvoltage and overcurrent protection signal, and the two signals are both connected to an analog signal input port of the controller module 4. The specific connection of the internal parts of the module is described below with reference to fig. 3.
The signal adapter plate 3 is composed of an optical coupler, an RC filter, a logic gate circuit and a reset switch. The input of the optical coupler and the RC filter is connected to the weak current control signal output end of the controller module 4, after the signal is isolated by the optical coupler, the output of the auxiliary side of the optical coupler is used as the control signal of the power module 1 and is connected to the weak current control port of the power module 1. The state logic signal fed back by the power module 1 is used as the input of the signal adapter plate 3 logic gate circuit, the general state logic signal of all the power modules 1 is generated after the AND logic, and the state logic signal is transmitted back to the controller module 4 after the optical coupling isolation. The fault reset inputs of the power modules 1 are connected to the reset switch output of the signal transfer board 3 in a gathering manner, and the total fault reset is performed on the power modules 1 by generating low level through the pressing of the switch key.
The controller module 4 is composed of six parts, namely an ADC conditioning circuit 41, an ADC board 42, an FPGA board 43, a DSP board 44, an SRAM and FLASH chip and a matching circuit 45 thereof, and an external interaction interface 46.
The input of the ADC conditioning circuit 41 is connected to the output of the multi-channel sampling and conditioning module 2, and the signal is a voltage signal, and is processed by the ADC conditioning circuit 41 to become an input of analog-to-digital conversion. The FPGA board 43 and the DSP board 44 on the controller module 4 can freely select models according to the degree of demand of the engineering on the digital controller resource, wherein the FPGA board 43 and the DSP board 44 can also be selectively plugged and unplugged, only the FPGA board 43/the DSP board 44 is reserved, and the controller module 4 can still work normally. The external interface 46 of the controller module 4 is connected to the signal patch panel 3 or a subordinate controller, communicates with the subordinate controller directly or communicates with the power module 1 via the signal patch panel 3, and transmits a control signal to the subordinate controller or the signal patch panel 3.
The external interface 46 of the controller module 4 is also designed with a part of interfaces driven by optical coupling and having an isolation function, and the part of interfaces can be directly used for driving the relay. The specific connection of the internal parts of the controller module 4 is described below with reference to fig. 4.
The detailed design structure of the power module 1 part of the present invention is shown in fig. 2.
The power module 1 partially includes: a strong electric power circuit 11, a driving chip and a matching circuit 12, a dead zone generating circuit and a matching circuit 13, a protection logic circuit and a matching circuit 14 and a temperature control fan driving circuit 15.
The strong power circuit 11 is formed by two switching devices connected in series in the forward direction after being connected in parallel with diodes in the reverse direction, and the switching devices or the diodes can be elements based on silicon or other semiconductor materials. In this way the semiconductor device forms a half bridge, with several decoupling capacitors CDC1, CDC2, … …, CDCn connected in parallel between the drain (or collector) of S1 and the source (or emitter) of S2. The drain (or collector) of the S1 and the source (or emitter) of the S2 are respectively connected with the current sensor CS1 and the current sensor CS2 in series, and after the series connection, DC + and DC-ports are respectively led out for external wiring of the module power part. The AC port is then taken from the midpoint of the S1 and S2 connections as external wiring for the power portion of the module.
The driving chip and the matching circuit 12 are composed of a driving chip and two isolated power supply modules thereof, the input end of the driving chip filters two PWM signals transmitted from the dead zone generating circuit and the matching circuit 13 through an RC filter composed of two resistance capacitors, and the interference of the strong power circuit 11 to the signal part is reduced. The two isolated power supply modules respectively supply power to the driving circuits of the upper and lower switching tubes S1 and S2 of the half bridge, the isolated driving chip obtains voltage and current required by driving signals from the two isolated power supply modules, PWM signals used for driving are generated according to input weak current PWM signals, the driving chip needs to have an isolation function, and the strong current side and the weak current side of the driving chip are isolated.
The dead zone generating circuit and the matching circuit 13 are composed of a nor/nor gate logic chip with schmitt trigger characteristics and an RCD delay circuit. The single-path PWM half-bridge control signal respectively generates rising edge delay and falling edge delay after passing through the two paths of RCD networks, the signals generating the falling edge delay are subjected to phase reversal, and the signals delayed by the rising edge are kept in the same phase, so that two paths of complementary PWM signals with dead zones are formed. Wherein the signal of the PWM2 is determined by a single/double PWM switching signal and a multiplexer by using PWM generated by a dead zone circuit or directly using an externally input PWM signal. The two signals of PWM1 and PWM2 become the input of the driving chip and the matching circuit 12.
The protection logic circuit and support circuit 14 is composed of and gate logic, a flip-flop, a comparator, an operational amplifier, and a maximum selection circuit. The overcurrent signals generated by the current sensors CS1 and CS2 are input to and gate logic after being RC filtered. Thermistors TR1 and TR2 attached to the switching device convert the thermal signal of the switching device into a voltage signal through a voltage division circuit. The two voltage signals are used as the input of an operational amplifier, and after passing through a maximum value selection circuit formed by the operational amplifier and a diode, the voltage signal of the thermistor with the highest temperature is used as the input of a comparator. The comparator compares the voltage signal with an over-temperature protection threshold voltage to generate a protection pulse. The protection pulse signal is used as the other input of the AND gate logic. And after the trigger detects the edge of the protection pulse, the trigger outputs the locking level of the driving chip to lock the driving chip, so that the protection function is realized.
The temperature-controlled fan driving circuit 15 includes a comparator, a flip-flop, and a two-stage transistor. The voltage signals formed by the two thermistors are compared with a fan starting threshold value and a fan stopping threshold value through a comparator, when the temperature detected by the thermistors is higher than the fan starting threshold value, the comparator generates a fan starting signal, and when the temperature detected by the thermistors is lower than the fan stopping threshold value, the comparator generates a fan stopping signal. The two paths of signals are used as a setting signal and a zero clearing signal of the trigger, so that the trigger outputs high level or low level as the input of the two-stage triode driving circuit. The first stage of the two-stage triode driving circuit consists of a low-power NPN type triode and a current-limiting resistor, wherein the base electrode of the triode is connected to the output of the trigger, and the collector electrode of the triode is connected to the base electrode of the next stage of triode. The collector is also connected with a pull-up resistor. The triode at the next stage is an NPN type triode, a collector is connected with the negative electrode of the fan interface, and the positive electrode of the fan interface is connected to a fan power supply through a current-limiting resistor. And the two ends of the fan interface are connected with the diodes in an anti-parallel mode.
The detailed design structure diagram of the multichannel sampling and conditioning module 2 part of the present invention is shown in fig. 3. The multi-channel sampling and conditioning module 2 comprises a voltage and current hall sensor 21, an operational amplifier and supporting circuit 22, an absolute value calculating circuit 23, a comparison and logic circuit 24 and an overvoltage and overcurrent comparison value generating circuit 25.
The voltage and current hall sensor 21 is composed of a voltage hall sensor, a current hall sensor and a matched sampling resistor. The voltage and current sampling interfaces of the multi-channel are connected to a strong power main loop, strong voltage and current signals are converted into weak current signals which are isolated from strong power and have fixed transformation ratio by the Hall sensor, the output end of the Hall sensor is connected to the two ends of the matched sampling resistor, and the weak current signals flow through the matched sampling resistor to form voltage signals which are used as the input of the rear stage.
The operational amplifier and the matching circuit 22 are composed of an operational amplifier and a feedback resistor network, the input end of the operational amplifier and the feedback resistor network is connected to two ends of a matching sampling resistor of the voltage-current hall sensor 21, and the converted voltage-current sampling signal is scaled by a proper proportion to become an analog signal output to the controller module 4 and the absolute value calculating circuit 23. The feedback resistance network adopts an adjustable resistor to facilitate the adjustment and correction of the zoom value.
The absolute value calculating circuit 23 is composed of two stages of operational amplifiers and a resistor-diode network, the analog signal output terminal of the preceding stage is connected to the input terminal of the first stage of operational amplifier and the resistor-diode network, and only the signal with negative level is inverted by the level selection inverter composed of the operational amplifier and the resistor-diode network, and the signal with positive level is not inverted under the action of the diode. The output of the first stage operational amplifier is then coupled to the input of a second stage operational amplifier, which forms a follower with its feedback resistor, the output of the second stage operational amplifier being coupled to the reference value input of the compare and logic circuit 24.
The comparison and logic circuit 24 is composed of a multi-path comparator and a subsequent and gate logic, the input of the comparator is connected to the analog signal output processed by the absolute value calculation circuit 23, and the comparison value input of the comparator is connected to the output port of the over-voltage and over-current comparison value generation circuit 25. The comparator compares the analog signal after the absolute value processing with the freely set over-voltage over-current comparison value, and the multi-path compared signal forms a single-path comparison signal through AND gate logic, and the single-path comparison signal is used as a total protection logic signal and is output to the digital communication port of the controller module 4.
The over-voltage and over-current comparison value generation circuit 25 is composed of an operational amplifier and an adjustable resistor, a fixed voltage reference value is used as the input of the operational amplifier, the fixed voltage reference value is zoomed through the operational amplifier and the adjustable feedback resistor together, the adjustable feedback resistors of different channels can be set individually, and therefore an individualized comparison value is generated. The output of the op-amp is connected to the comparator as the compare value input of the comparator in the compare and logic circuit 24.
A detailed design block diagram of the portion of the controller module 4 of the present invention is shown in fig. 4. The controller module 4 comprises an ADC conditioning circuit 41, an ADC board 42, an FPGA board 43, a DSP board 44, an SRAM and FLASH chip and its supporting circuit 45, and an external interaction interface 46.
The ADC conditioning circuit 41 is composed of an isolation operational amplifier, a common operational amplifier and a feedback resistor, an external analog signal is connected to the isolation operational amplifier through an interface, the isolation operational amplifier isolates the analog signal into an output signal, the isolated output signal is connected to the input of the common operational amplifier, the common operational amplifier conditions the signal into two parts by scaling, the voltage range of one part of the signal is suitable for the input voltage range of the ADC board 42, and the voltage range of the other part of the signal is suitable for the input voltage range of the DSP board 44 with the ADC pin, and outputs the two analog signals. The ADC board 42 is composed of an analog-to-digital conversion chip and a supporting circuit, and the output of the ADC conditioning circuit 41 is connected to the analog signal input terminal of the analog-to-digital conversion chip through capacitive filtering, and becomes a digital signal output after analog-to-digital conversion, and is connected to the pin of the FPGA in the FPGA board 43. The types of the partial analog-to-digital conversion chips can be freely selected according to the requirements on conversion rate and conversion precision. The FPGA board 43 is composed of an FPGA chip and an external matching circuit, the digital signal output by the ADC board 42 is connected to part of pins of the FPGA chip, and the rest pins of the FPGA chip are also connected to an external interactive interface 46, an SRAM and FLASH chip and a matching circuit 45 thereof, and a DSP board 44. The FPGA board 43 can freely select and match control boards based on FPGA chips of different models according to the requirements of engineering on FPGA logic resources, the FPGA board 43 can also be selected not to be inserted into the controller module 4, and the rest parts of the controller module 4 work normally. The DSP board 44 is composed of a DSP chip and an external supporting circuit, the analog signal output by the ADC conditioning circuit 41 is connected to a pin of the DSP chip having an ADC sampling function, and the rest pins of the DSP chip are respectively connected to the SRAM and FLASH chips and their supporting circuits 45, the FPGA board 43, and the external interaction interface 46 according to their fixing functions.
The SRAM and FLASH chips and their matching circuit 45 are composed of SRAM chip, FLASH chip and matching circuit, the data interaction interface, address control interface and function control interface of the two chips are all connected to arbitrary interface of FPGA chip on FPGA board 43 and related interface (XINTF) of external memory of DSP chip on DSP board 44 at the same time, form the buffer area for data storage or interaction of FPGA chip and DSP chip.
An external interactive interface 46, which comprises an isolated interface and a non-isolated interface, wherein the isolated interface mainly comprises an optocoupler chip and a supporting circuit and is divided into an isolated input and an isolated output, the isolated input is that a signal input from the outside is connected to an input pin on the primary side of the optocoupler chip, an output pin on the secondary side of the optocoupler chip is connected to a pin on a DSP chip on a DSP board 44 or a pin on an FPGA chip on an FPGA board 43, the isolated output is that a digital signal output from the DSP chip or the FPGA chip is connected to an input pin on the primary side of the optocoupler chip, and an output pin on the secondary side of the optocoupler chip is connected to the outside; the non-isolated interface is directly connected to the pins of the DSP chip or the FPGA chip and is directly connected with external digital signals.
A physical representation of one embodiment of the power module 1 of the present invention is shown in fig. 5. The three strong electrical interfaces on the left side of the power module of fig. 5 correspond to the DC +, DC-and AC interfaces of fig. 2. The right interface of the power module of fig. 5 is a weak current interface, corresponding to the weak current signal input in fig. 2.
A physical representation of another embodiment of the power module 1 of the present invention is shown in fig. 6. The three strong electrical interfaces on the left side of the power module of fig. 6 correspond to the DC +, DC-and AC interfaces of fig. 2. The two interfaces on the right side of the power module in fig. 6 are both weak current interfaces, which correspond to the weak current signal input in fig. 2.
A pictorial representation of one embodiment of the multi-channel sampling and conditioning module of the present invention is shown in fig. 7. The upper multi-path strong electrical interface of the module of fig. 7 can be connected to the power main circuit to obtain the voltage and current signals connected to the power main circuit as described in fig. 3. The multipath weak current interface at the lower end of the module in fig. 7 is the scaled voltage and current weak current signal and the overvoltage and overcurrent signal shown in fig. 3.
A physical representation of one embodiment of the signal patch panel 3 of the present invention is shown in fig. 8. The left interface in fig. 8 is connected to the controller module 4. The multi-path interface in the middle of the signal adapter board in fig. 8 is used for connecting with the weak current interface of the power module 1.
A physical representation of one embodiment of the controller module 4 of the present invention is shown in fig. 9. The upper port of the controller module 4 in fig. 9 corresponds to the analog signal input in fig. 4. The peripheral interface of the other three sides of the controller module 4 in fig. 9 is used to connect the signal adapting board 3. The PCB board inserted on the controller module corresponds to the FPGA board and the DSP board in the attached figure 4.
The invention relates to a flexible assembly type power electronic device based on a standard half-bridge module and an experimental platform. The half-bridge topology is a sub-topology of most power electronic topologies. Various forms of power electronic topologies, such as full-bridge topology, MMC topology, DAB topology, etc., can be formed by one or several half-bridge topologies through various combinations of connections. The power module is partially based on a half-bridge topology, and a driving circuit, a hardware protection logic, a dead zone generating circuit and a temperature control fan driving circuit are integrated on the power module. The sampling and conditioning module part is taken out separately to be made into a multi-channel sampling conditioning module integrating isolation sampling and operational amplifier conditioning, and the multi-channel sampling conditioning module can be flexibly connected into a circuit according to the topological control requirement, so that isolation sampling, fixed transformation ratio (directly matched with the transformation ratio of an oscilloscope channel), individual protection threshold values of all channels, multi-channel protection summary and the like are realized. The control part of the invention can be flexibly replaced and can use a controller based on FPGA or DSP. When higher control requirements exist, the controller module which is designed by the invention and is combined by the FPGA and the DSP can be used as a top layer controller, a single FPGA/DSP controller is used as a valve controller of a middle layer, and the small-scale low-cost FPGA/DSP is used as a bottom layer controller which is directly related to a single power sub-module. The controller may also use a third party controller. The output of the sampling and conditioning part is connected to a sampling interface of the controller, and the switch control signal output by the controller is connected to the power module through the signal adapter plate module designed by the invention, so that the closed-loop control of the building system can be realized.
In conclusion, the invention can ensure the reusability of the topological component and reduce the material cost. The invention integrates reliable drive circuit design, reliable weak current circuit design, reliable sampling conditioning circuit and fast response protection logic, only needs to combine power module at will according to topology when in use, and selects controller with different resources at will according to control requirement, and then connects power module, sampling and conditioning module, signal transfer board and controller, thus greatly reducing device design threshold. In addition, the controller part designed by the invention can flexibly form various levels and control forms of various digital resources with the rest parts, and is very flexible. Finally, the invention can be combined at will, is convenient to use, can quickly form a novel topology, verifies the experimental conception, saves the time cost, or can be spliced in a building block mode, and quickly forms a new converter for commercial popularization and application.
The above embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention, and all simple modifications, changes and equivalent structural changes made to the above embodiments according to the technical spirit of the present invention still fall within the protection scope of the technical solution of the present invention.
Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can make modifications and equivalents to the specific embodiments of the present invention without departing from the spirit and scope of the present invention, which is set forth in the following claims.

Claims (10)

1. A modular power electronic device platform is characterized by comprising a power module (1), a multi-channel sampling and conditioning module (2), a signal adapter plate (3) and a controller module (4);
the power module (1) is connected with the multi-channel sampling and conditioning module (2) to obtain a target sampling signal, and the target sampling signal is fed back to the controller module (4); a control signal sent by the controller module (4) is sent to the power module (1) through the signal transfer board (3);
the weak current interface of the power module (1) is connected with the signal adapter plate (3), and the controller module (4) is interacted with the power module (1) through the signal adapter plate (3).
2. The modular power electronic platform of claim 1,
the power module (1) comprises a strong current power circuit (11), a driving chip and a matching circuit (12), a dead zone generating circuit and a matching circuit (13), a protection logic circuit and a matching circuit (14) and a temperature control fan driving circuit (15);
the high-voltage power circuit (11) comprises two switching devices, wherein the two switching devices are respectively connected with diodes in parallel in an opposite direction and then are connected in series in a forward direction to form a half bridge, and a plurality of decoupling capacitors are connected in parallel between a drain electrode or a collector electrode of a first switching device and a source electrode or an emitter electrode of a second switching device; the drain electrode or the collector electrode of the first switching device is connected with the first current sensor in series, and a DC + port is led out after the first switching device is connected with the first current sensor in series and is used for external wiring of the power module (1); the source or emitter of the second switching device and the second current sensor are connected in series, after which the DC-port is used for external wiring of the power module (1); the AC port is led out from the midpoint of the connection of the first switching device and the second switching device to be used as an external wiring of the power module (1); the first current sensor and the second current sensor are both connected with the protection logic circuit and the matching circuit (14);
the single-path PWM signal is connected with a dead zone generating circuit and a matching circuit (13) to generate two paths of complementary PWM signals with dead zones and then connected with a driving chip and the matching circuit (12), so that the output of the driving chip and the matching circuit (12) is used as the driving signals of an upper switching device and a lower switching device of a half bridge of a strong power circuit (11); the two-way PWM control signal is connected to the signal input end of the driving chip and the supporting circuit (12) and directly generates the driving signals of the upper and lower switching devices of the half bridge;
the module blocking signal is connected with the protection logic circuit and the matching circuit (14) to jointly determine the level value of the enabling signal, and the enabling signal is directly used as the enabling end input of the driving chip and the matching circuit (12); the protection logic circuit and the matching circuit (14) are connected with a temperature control fan driving circuit (15) to drive the heat dissipation fan.
3. The modular power electronic platform of claim 2,
thermistors are arranged beside the first switch device and the second switch device and are connected with the protection logic circuit and the matching circuit (14) in parallel.
4. The modular power electronic platform of claim 2,
the driving chip and the matching circuit (12) comprise a driving chip and two paths of isolated power supply modules thereof, and the input end of the driving chip is used for filtering two paths of PWM signals transmitted by the dead zone generating circuit and the matching circuit (13) through an RC filter formed by two resistance capacitors; the two isolated power supply modules respectively supply power to the driving circuits of the upper and lower switching tubes of the half bridge, the isolated driving chip obtains voltage and current required by driving signals from the two isolated power supply modules, and PWM signals for driving are generated according to input weak current PWM signals.
5. The modular power electronic platform of claim 2,
the dead zone generating circuit and the matched circuit (13) comprise a NOT gate logic chip and an RCD delay circuit; after passing through the two RCD delay circuits, the single-path PWM half-bridge control signal respectively generates rising edge delay and falling edge delay, the signals generating the falling edge delay are subjected to phase reversal, and the signals delayed by the rising edge are kept in the same phase, so that two paths of complementary PWM signals with dead zones are formed; the single/double-path PWM switching signal is connected with the multiplexer and then connected with the driving chip and the matching circuit (12).
6. The modular power electronic platform of claim 2,
the protection logic circuit and the matching circuit (14) comprise AND gate logic, a trigger, a comparator, an operational amplifier and a maximum value selection circuit; an overcurrent signal generated by the current sensor is used as the input of AND gate logic after being filtered by RC; the thermistor attached to the switching device converts a thermal signal of the switching device into a voltage signal through a voltage division circuit, the two paths of voltage signals are used as the input of an operational amplifier, and after passing through a maximum value selection circuit formed by the operational amplifier and a diode, the voltage signal of the thermistor with the highest temperature is used as the input of a comparator; the comparator compares the voltage signal with an over-temperature protection threshold voltage to generate a protection pulse; the protection pulse signal is used as the other path of input of the AND gate logic; and after the trigger detects the edge of the protection pulse, the trigger outputs the locking level of the driving chip to lock the driving chip.
7. The modular power electronic platform of claim 2,
the temperature control fan driving circuit (15) comprises a comparator, a trigger and a two-stage triode; voltage signals formed by the two paths of thermistors pass through a comparator to generate fan closing signals serving as setting signals and zero clearing signals of the trigger, so that the trigger outputs high level or low level serving as the input of the two-stage triode driving circuit; the first stage of the two-stage triode driving circuit consists of a low-power NPN type triode and a current-limiting resistor, wherein the base electrode of the NPN type triode is connected to the output of the trigger, and the collector electrode of the NPN type triode is connected to the base electrode of the next stage of triode; the collector is connected with a pull-up resistor; the triode of the next stage is an NPN type triode, a collector is connected with the negative electrode of the fan interface, and the positive electrode of the fan interface is connected to a fan power supply through a current-limiting resistor; and the two ends of the fan interface are connected with the diodes in an anti-parallel mode.
8. The modular power electronic platform of claim 1,
the multichannel sampling and conditioning module (2) comprises a voltage and current Hall sensor (21), an operational amplifier and a matching circuit (22), an absolute value calculating circuit (23), a comparison and logic circuit (24) and an overvoltage and overcurrent comparison value generating circuit (25);
the voltage and current Hall sensor (21), the operational amplifier and the matched circuit (22) and the absolute value calculation circuit (23) are sequentially connected, and the operational amplifier and the matched circuit (22) are used for outputting the zoomed voltage and current weak current signals; the absolute value calculating circuit (23) and the overvoltage and overcurrent comparison value generating circuit (25) are both connected with the comparison and logic circuit (24) and are used for outputting overvoltage and overcurrent signals.
9. The modular power electronic platform of claim 1,
the signal adapter plate (3) comprises an optocoupler chip, a zero clearing key and a matching circuit; the multi-path PWM signals input from the controller module (4) flow into the primary side of the optical coupler chip, and form PWM signals input to the single power module (1) after the isolation of the optical coupler chip and a matched resistance-capacitance filter circuit; the output signal of the zero clearing key is used as a trigger reset signal of all the power modules (1) connected with the signal transfer board, and the reset signal and the PWM signal are isolated on the signal transfer board and then connected to a weak current side interface of the power modules (1) through a cable with an anti-interference effect.
10. The modular power electronic platform of claim 1,
the controller module (4) comprises an ADC conditioning circuit (41), an ADC board (42), an FPGA board (43), a DSP board (44), an SRAM and FLASH chip and a matching circuit (45) thereof, and an external interaction interface (46);
the ADC conditioning circuit (41) comprises an operational amplifier with an isolation function and a matching circuit, and is used for isolating an externally input voltage signal and then taking the voltage signal as the input of the operational amplifier, so that the output voltage range of the operational amplifier is matched with the input voltage range of the ADC board (42) and the DSP board (44);
the ADC board (42) comprises an ADC chip and a matched circuit, and an analog voltage signal output by the ADC conditioning circuit (41) is converted into a digital signal through the ADC chip, so that the FPGA board (43) and the DSP board (44) can read an input voltage signal value;
the SRAM, FLASH chip and the matching circuit (45) thereof are connected with the FPGA board (43) and the DSP board (44), and the FPGA board (43) and the DSP board (44) are used as digital signal processors and are connected with an external interactive interface (46).
CN202210055975.9A 2022-01-18 2022-01-18 Modular power electronic device platform Pending CN114415566A (en)

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CN114780161A (en) * 2022-06-13 2022-07-22 深圳市乐目通讯有限公司 Device capable of adapting to multiple electronic components and electronic product capable of replacing electronic components
CN115480117A (en) * 2022-09-20 2022-12-16 西安交通大学 General power electronic moving die experiment cabinet

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