CN114412738A

CN114412738A - Shape memory alloy actuator and method thereof

Info

Publication number: CN114412738A
Application number: CN202110709901.8A
Authority: CN
Inventors: M·A·米勒; N·K·贝宁; D·E·迈尔斯; M·W·戴维斯; R·N·鲁日奇卡; Z·A·波科尔诺斯基; 坂本康史
Original assignee: Hutchinson Technology Inc
Current assignee: Hutchinson Technology Inc
Priority date: 2020-10-12
Filing date: 2021-06-25
Publication date: 2022-04-29
Also published as: KR20220048456A; GB2600825A; TW202225557A; CN216342609U; JP2022063865A; GB202114527D0; GB2600825B

Abstract

SMA actuators and related methods are described. One embodiment of an actuator comprises: a base; a plurality of tilting arms; and at least a first shape memory alloy wire coupled with a pair of the plurality of buckling arms. Another embodiment of an actuator includes a base and at least one piezoelectric bimorph actuator including a shape memory alloy material. The piezoelectric bimorph actuator is attached to the base.

Description

Shape memory alloy actuator and method thereof

Cross Reference to Related Applications

This application claims priority to and from united states patent application No. 17/207,530 filed on 3/19/2021 and united states provisional patent application No. 63/090,569 filed on 12/10/2020, the disclosures of which are incorporated herein by reference in their entireties.

Technical Field

Embodiments of the invention relate to the field of shape memory alloy systems. In particular, embodiments of the present invention relate to the field of shape memory alloy actuators and methods related thereto.

Background

Shape memory alloy ("SMA") systems have a movable component or structure that can be used, for example, in conjunction with a camera lens element as an autofocus actuator. These systems may be surrounded by a structure such as a shield. The movable assembly is supported by a bearing portion, such as a plurality of balls, for movement on the support assembly. The flexure element formed of a metal such as phosphor bronze or stainless steel has a movable plate and respective flexures. A flexure extends between the movable plate and the fixed support assembly and acts as a spring to enable movement of the movable assembly relative to the fixed support assembly. The balls allow the movable assembly to move with little resistance. The movable and support assemblies are coupled by four Shape Memory Alloy (SMA) wires extending between the assemblies. One end of each SMA wire is attached to the support member and the opposite end is attached to the movable member. The suspension is driven by applying an electrical drive signal to the SMA wire. However, these types of systems suffer from system complexities that result in bulky systems requiring large footprints and large height clearances. Additionally, existing systems fail to provide a high Z range of travel with a compact, low profile footprint.

Disclosure of Invention

SMA actuators and related methods are described. One embodiment of an actuator comprises: a base; a plurality of tilting arms; and at least a first shape memory alloy wire coupled with a pair of the plurality of buckling arms. Another embodiment of an actuator includes a base, and at least one piezoelectric bimorph actuator including a shape memory alloy material. The piezoelectric bimorph actuator is attached to a base.

Other features and advantages of embodiments of the present invention will become apparent from the accompanying drawings and the following detailed description.

Drawings

Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:

fig. 1a shows a lens assembly including an SMA actuator configured as a warp actuator according to an embodiment;

fig. 1b shows an SMA actuator according to an embodiment;

fig. 2 shows an SMA actuator according to an embodiment;

FIG. 3 illustrates an exploded view of an autofocus assembly including an SMA wire actuator, according to an embodiment;

FIG. 4 illustrates an autofocus assembly including an SMA actuator according to an embodiment;

FIG. 5 shows an SMA actuator according to an embodiment that includes a sensor;

fig. 6 shows top and side views of an SMA actuator configured as a warp actuator fitted with a lens carrier according to an embodiment;

fig. 7 shows a side view of a portion of an SMA actuator according to an embodiment;

FIG. 8 illustrates various views of an embodiment of a warp actuator;

FIG. 9 illustrates a piezoelectric bimorph actuator with a lens carrier according to an embodiment;

FIG. 10 shows a cross-sectional view of an autofocus assembly including an SMA actuator according to an embodiment;

11a-c illustrate views of a piezoelectric bimorph actuator according to some embodiments;

FIG. 12 illustrates a view of an embodiment of a piezoelectric bimorph actuator, according to an embodiment;

FIG. 13 illustrates an end pad cross-section of a piezoelectric bimorph actuator according to an embodiment;

FIG. 14 illustrates a cross-section of an intermediate power pad of a piezoelectric bimorph actuator, according to an embodiment;

fig. 15 shows an exploded view of an SMA actuator comprising two warp actuators according to an embodiment;

fig. 16 shows an SMA actuator comprising two warp actuators according to an embodiment;

fig. 17 shows a side view of an SMA actuator comprising two warp actuators according to an embodiment;

fig. 18 shows a side view of an SMA actuator comprising two warp actuators according to an embodiment;

fig. 19 shows an exploded view of an assembly including an SMA actuator including two warped actuators, according to an embodiment;

fig. 20 shows an SMA actuator comprising two warp actuators according to an embodiment;

fig. 21 shows an SMA actuator comprising two warp actuators according to an embodiment;

fig. 22 shows an SMA actuator comprising two warp actuators according to an embodiment;

fig. 23 shows an SMA actuator including two warp actuators and a coupler, according to an embodiment;

fig. 24 shows an exploded view of an SMA system comprising an SMA actuator comprising a warp actuator with a laminated suspension according to an embodiment;

fig. 25 shows an SMA system comprising an SMA actuator comprising a warp actuator 2402 with a laminated suspension according to an embodiment;

FIG. 26 illustrates a warp actuator including stacked hangers, according to an embodiment;

fig. 27 shows a stacked suspension of SMA actuators according to an embodiment;

figure 28 shows a laminated crimp connection of an SMA actuator according to an embodiment;

FIG. 29 shows an SMA actuator including a warp actuator with a stack hanger;

fig. 30 shows an exploded view of an SMA system including an SMA actuator including a warp actuator, according to an embodiment;

fig. 31 shows an SMA system including an SMA actuator including a warp actuator, according to an embodiment;

fig. 32 shows an SMA actuator comprising a warped actuator according to an embodiment;

fig. 33 shows a double yoke capture joint of a pair of toggle arms of an SMA actuator according to an embodiment;

figure 34 shows a resistance weld crimp for an SMA actuator for attaching an SMA wire to a warp type actuator according to an embodiment;

FIG. 35 shows an SMA actuator including a warped actuator with a double yoke capture joint;

FIG. 36 shows an SMA piezoelectric bimorph liquid lens according to an embodiment;

fig. 37 shows an SMA piezoelectric bimorph liquid lens according to an embodiment in perspective view;

fig. 38 shows a cross-sectional view and a bottom view of an SMA piezoelectric bimorph liquid lens according to an embodiment;

fig. 39 shows an SMA system comprising an SMA actuator with a piezoelectric bimorph actuator, according to an embodiment;

figure 40 shows an SMA actuator with a piezoelectric bimorph actuator according to an embodiment;

FIG. 41 illustrates the positions of bond pads and the lengths of wires used to extend SMA wires beyond the length of a piezoelectric bimorph actuator of the piezoelectric bimorph actuator;

fig. 42 shows an exploded view of an SMA system comprising a piezoelectric bimorph actuator according to an embodiment;

fig. 43 shows an exploded view of a sub-portion of an SMA actuator according to an embodiment;

fig. 44 shows a sub-portion of an SMA actuator according to an embodiment;

FIG. 45 illustrates a five axis sensor shift system in accordance with embodiments;

FIG. 46 illustrates an exploded view of a five axis sensor shifting system in accordance with embodiments;

fig. 47 shows an SMA actuator according to an embodiment comprising a piezoelectric bimorph actuator integrated into the circuit for all motions.

Fig. 48 shows an SMA actuator according to an embodiment comprising a piezoelectric bimorph actuator integrated into the circuit for all motions.

FIG. 49 shows a cross-section of a five axis sensor displacement system according to an embodiment;

figure 50 illustrates an SMA actuator including a piezoelectric bimorph actuator according to an embodiment;

fig. 51 shows a top view of an SMA actuator including a piezoelectric bimorph actuator moving an image sensor at different x and y positions according to an embodiment;

FIG. 52 illustrates an SMA actuator including a piezoelectric bimorph actuator configured as a cassette piezoelectric bimorph autofocus device, according to an embodiment;

figure 53 shows an SMA actuator including a piezoelectric bimorph actuator according to an embodiment;

figure 54 illustrates an SMA actuator including a piezoelectric bimorph actuator according to an embodiment;

figure 55 shows an SMA actuator including a piezoelectric bimorph actuator according to an embodiment;

fig. 56 shows an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 57 shows an exploded view of an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a biaxial lens-displacement OIS, according to an embodiment;

fig. 58 shows a cross-section of an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a biaxial lens-displacement OIS, according to an embodiment;

FIG. 59 illustrates a cartridge piezoelectric bimorph actuator according to an embodiment;

fig. 60 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 61 shows an exploded view of an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 62 illustrates a cross-section of an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

FIG. 63 illustrates a cartridge piezoelectric bimorph actuator according to an embodiment;

fig. 64 shows an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 65 shows an exploded view of an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 66 shows an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 67 shows an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 68 shows an SMA system comprising an SMA actuator comprising a piezoelectric bimorph actuator, according to an embodiment;

fig. 69 shows an exploded view of an SMA comprising an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 70 shows a cross-section of an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a three-axis sensor displacement OIS device, according to an embodiment;

FIG. 71 illustrates a cartridge piezoelectric bimorph actuator component according to an embodiment;

FIG. 72 shows a flexible sensor circuit for an SMA system according to an embodiment;

fig. 73 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 74 shows an exploded view of an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 75 shows a cross-section of an SMA system including an SMA actuator according to an embodiment;

FIG. 76 illustrates a cartridge piezoelectric bimorph actuator according to an embodiment;

FIG. 77 shows a flexible sensor circuit for an SMA system according to an embodiment;

fig. 78 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 79 illustrates an exploded view of an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 80 shows a cross-section of an SMA system including an SMA actuator according to an embodiment;

FIG. 81 illustrates a cartridge piezoelectric bimorph actuator according to an embodiment;

FIG. 82 illustrates a flexible sensor circuit for an SMA system according to an embodiment;

fig. 83 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

fig. 84 shows an exploded view of an SMA system including an SMA actuator according to an embodiment;

fig. 85 shows a cross-section of an SMA system including an SMA actuator including a piezoelectric bimorph actuator, according to an embodiment;

FIG. 86 illustrates a cassette piezoelectric bimorph actuator for an SMA system according to an embodiment;

FIG. 87 shows a flexible sensor circuit for an SMA system according to an embodiment;

fig. 88 illustrates exemplary dimensions of a piezoelectric bimorph actuator of an SMA actuator according to an embodiment;

figure 89 illustrates a first view of a piezoelectric bimorph actuator, according to one embodiment;

figure 90 illustrates a second view of an exemplary piezoelectric bimorph actuator, in accordance with an embodiment;

FIG. 91 illustrates a perspective view of an exemplary piezoelectric bimorph actuator, in accordance with an embodiment;

figure 92 illustrates SMA wires in an example piezoelectric bimorph actuator, according to an embodiment;

fig. 93 illustrates a current path of an exemplary piezoelectric bimorph actuator 9310 according to an embodiment;

FIG. 94 illustrates an exemplary piezoelectric bimorph actuator including a single unsecured load point end, in accordance with an embodiment; and

fig. 95 illustrates an exemplary piezoelectric bimorph actuator including a single unsecured load point end, in accordance with an embodiment.

Detailed Description

Embodiments of SMA actuators are described herein that include a compact footprint and provide high actuation heights, e.g., motion in the positive z-axis direction (z-direction) (referred to herein as z-stroke). Embodiments of SMA actuators include SMA warp actuators and SMA piezoelectric bimorph actuators. SMA actuators can be used in many applications, including but not limited to use in lens assemblies as autofocus actuators, microfluidic pumps, sensor displacement, optical image stabilization, optical zoom assemblies to mechanically impact two surfaces to create a vibratory sensation common to haptic feedback sensors and devices, and in other systems using actuators. For example, embodiments of the actuators described herein may be used as haptic feedback actuators for use in cell phones or wearable devices that are configured to provide an alert, notification, warning, response to a touch area or press a button to a user. In addition, more than one SMA actuator may be used in the system to achieve a greater stroke.

For the various embodiments, the SMA actuator has a z-stroke greater than 0.4 millimeters. Additionally, for the various embodiments, the height of the SMA actuator in the z-direction is 2.2 millimeters or less when the SMA actuator is in its initial, non-actuated position. Various embodiments of SMA actuators configured as autofocus actuators in a lens assembly may have footprints as small as only 3 millimeters larger than the inner diameter ("ID") of the lens. According to various embodiments, an SMA actuator may have a wider footprint in one direction to accommodate components including, but not limited to, sensors, wires, traces, and connectors. According to some embodiments, the footprint of the SMA actuator is 0.5 mm longer in one direction, e.g., the length of the SMA actuator is 0.5 mm greater than the width.

Fig. 1a shows a lens assembly including an SMA actuator configured as a warp actuator according to an embodiment. Fig. 1b illustrates an SMA actuator configured as a warp actuator, according to an embodiment. The warped actuator 102 is coupled with the base 101. As shown in fig. 1b, the SMA wires 100 are attached to the warp actuators 102 such that when the SMA wires 100 are actuated and contracted, this causes the warp actuators 102 to warp, which results in at least an intermediate portion 104 of each warp actuator 102 moving in the z-stroke direction, e.g., the positive z-direction, as indicated by arrow 108. According to some embodiments, the SMA wire 100 is actuated when current is supplied to one end of the wire through a wire retainer, such as a crimp structure 106. Due to the inherent electrical resistance of the SMA material from which the SMA wire 100 is made, an electrical current flows through the SMA wire 100 and heats it. The other side of the SMA wire 100 has a wire retainer, such as a crimp structure 106, that is connected to the SMA wire 100 to complete the circuit to ground. Heating the SMA wire 100 to a sufficient temperature causes the unique material properties to change from martensite to austenite crystal structure, which results in a change in the length of the wire. Changing the current changes the temperature and thus the length of the wire, which is used to actuate and deactuate the actuator to control at least the movement of the actuator in the z direction. Those skilled in the art will appreciate that other techniques may be used to provide current to the SMA wire.

Fig. 2 illustrates an SMA actuator configured as an SMA piezoelectric bimorph actuator according to an embodiment. As shown in fig. 2, the SMA actuator includes a piezoelectric bimorph actuator 202 coupled to a base 204. The piezoelectric bimorph actuator 202 includes SMA strips. The piezo bimorph actuator 202 is configured to move at least the unsecured end of the piezo bimorph actuator 202 in the z-stroke direction 208 when the SMA ribbon 206 contracts.

Fig. 3 illustrates an exploded view of an autofocus assembly including an SMA actuator according to an embodiment. As shown, the SMA actuator 302 is configured as a warp actuator 302 according to embodiments described herein. The autofocus assembly also includes an optical image stabilizer ("OIS") 304, a lens holder 306 configured to hold one or more optical lenses using techniques including those known in the art, a return spring 308, a vertical sliding bearing 310, and a guide cap 312. Lens carrier 306 is configured to slide against vertical slide bearing 310 as warp actuator 302 moves in the z stroke direction (e.g., positive z-axis direction) when the SMA wire is actuated and pulls and warps warp actuator 302 using techniques including those known in the art. The return spring 308 is configured to exert a force on the lens carrier 306 in a direction opposite the z-stroke direction using techniques including those known in the art. According to various embodiments, the return spring 308 is configured to move the lens carrier 306 in a direction opposite to the z-stroke direction when the tension in the SMA wire is reduced as the SMA wire is deactuated. When the tension in the SMA wire drops to an initial value, the lens carriage 306 moves to a minimum height in the z-stroke direction. Figure 4 illustrates an autofocus assembly including an SMA wire actuator according to the embodiment shown in figure 3.

Fig. 5 shows an SMA wire actuator according to an embodiment comprising a sensor. For the various embodiments, the sensor 502 is configured to measure the movement of the SMA actuator in the z-direction, or the movement of the component that the SMA actuator is moving, using techniques including those known in the art. The SMA actuator includes one or more warp actuators 506 configured to be actuated using one or more SMA wires 508 similar to those described herein. For example, in the autofocus assembly described with reference to fig. 4, the sensor is configured to determine an amount of movement of the lens holder 306 from the initial position along the z-direction 504 using techniques including those known in the art. According to some embodiments, the sensor is a tunneling magneto-resistive ("TMR") sensor.

Fig. 6 shows top and side views of an SMA actuator 602 configured as a warp actuator fitted with a lens carrier 604 according to an embodiment. Fig. 7 shows a side view of a portion of an SMA actuator 602 according to the embodiment shown in fig. 6. According to the embodiment shown in fig. 7, the SMA actuator 602 includes a slide base 702. According to an embodiment, the slide base 702 is formed from a metal, such as stainless steel, using techniques including those known in the art. However, those skilled in the art will appreciate that other materials may be used to form the slide base 702. Additionally, according to some embodiments, the slide base 702 has a spring arm 612 coupled with the SMA actuator 602. According to various embodiments, spring arm 612 is configured to serve two functions. The first function is to help push an object (e.g., lens bracket 604) into the vertical sliding surface of the guide cover. For this example, the spring arm 612 preloads the lens carrier 604 against the surface to ensure that the lens does not tilt during actuation. For some embodiments, vertical sliding surface 708 is configured to mate with a guide cover. The second function of the spring arm 612 is to help pull the SMA actuator 602 back down, e.g., in the negative z-direction, after the SMA wire 608 moves the SMA actuator 602 in the z-stroke direction (positive z-direction). Thus, when the SMA wire 608 is actuated, it contracts to move the SMA actuator 602 in the z-stroke direction, and the spring arm 612 is configured to move the SMA actuator 602 in the opposite direction to the z-stroke direction when the SMA wire 608 is deactuated.

The SMA actuator 602 also includes a warped actuator 710. For the various embodiments, the warp actuator 710 is formed from a metal, such as stainless steel. In addition, the buckle actuator 710 includes a buckle arm 610 and one or more wire retainers 606. According to the embodiment shown in fig. 6 and 7, the warp-type actuator 710 includes four wire retainers 606. Each of the four wire retainers 606 is configured to receive an end of an SMA wire 608 and retain the end of the SMA wire 608 such that the SMA wire 608 is secured to the warp-type actuator 710. For the various embodiments, the four wire retainers 606 are crimps configured to grip over a portion of the SMA wire 608 to secure the wire to the crimps. Those skilled in the art will appreciate that SMA wires 608 may be secured to the wire retainer 606 using techniques known in the art, including, but not limited to: adhesive, welding and mechanical fastening. Smart memory alloy ("SMA") wires 608 extend between a pair of wire retainers 606 such that a buckling arm 610 of a buckling actuator 710 is configured to move when the SMA wires 608 are actuated, which causes the pair of wire retainers 606 to be pulled closer to each other. According to various embodiments, when current is applied to the SMA wire 608, the SMA wire 608 is electrically actuated to move the warp arm 610 and control the position of the warp arm 610. When the current is removed or the current is below a threshold value, the SMA wire 608 is deactuated. This causes the pair of wire retainers 606 to move apart and the cocking arm 610 to move in the opposite direction as when the SMA wire 608 is actuated. According to various embodiments, the cocking arm 610 is configured to have an initial angle of 5 degrees with respect to the slide base 702 when the SMA wire is deactuated in its initial position. Also, according to various embodiments, the toggle arm 610 is configured to have an angle of 10 to 12 degrees with respect to the slide base 702 at full stroke or when the SMA wire is fully actuated.

According to the embodiment shown in fig. 6 and 7, the SMA actuator 602 further comprises a sliding support 706 configured between the sliding base 702 and the wire retainer 606. The sliding support 706 is configured to minimize any friction between the sliding base 702 and the buckling arm 610 and/or the wire retainer 606. For some embodiments, the sliding support is fixed to the sliding support 706. According to various embodiments, the sliding bearing is formed from polyoxymethylene ("POM"). One skilled in the art will appreciate that other structures may be used to reduce any friction between the warp actuator and the base.

According to various embodiments, slide base 702 is configured to couple with an assembly base 704, such as an autofocus base for an autofocus assembly. According to some embodiments, the actuator base 704 includes an etched pad plate. Such etched pads may be used to provide clearance for the wires and crimps when the SMA actuator 602 is part of an assembly such as an autofocus assembly.

Fig. 8 illustrates various views of an embodiment of a warp actuator 802 with respect to the x-axis, y-axis, and z-axis. As oriented in fig. 8, the warp arm 804 is configured to move along the z-axis when the SMA wire is actuated and deactuated as described herein. According to the embodiment shown in fig. 8, the rocker arms 804 are coupled to each other by an intermediate portion, such as a hanger (hammock) portion 806. According to various embodiments, the hanger portion 806 is configured to rest on a portion of an object on which the warp actuator acts to provide support thereto, such as a lens carrier that is moved by the warp actuator using techniques including those described herein. According to some embodiments, the hanger portion 806 is configured to provide lateral rigidity to the warp actuator during actuation. For other embodiments, the warp actuator does not include the hanger portion 806. According to these embodiments, the tilting arm is configured to act on the object to move it. For example, the warp arm is configured to act directly on features of the lens carrier to push it upward.

Fig. 9 illustrates an SMA actuator configured as an SMA piezoelectric bimorph actuator according to an embodiment. SMA piezoelectric bimorph actuators include piezoelectric bimorph actuator 902, which includes those piezoelectric bimorph actuators described herein. According to the embodiment shown in fig. 9, one end 906 of each of the piezoelectric bimorph actuators 902 is fixed to a base 908. According to some embodiments, the end 906 is welded to the base 908. However, those skilled in the art will appreciate that other techniques may be used to secure the end 906 to the base 908. Fig. 9 also shows a lens carrier 904 arranged such that the piezoelectric bimorph actuator 902 is configured to curl in the z-direction and lift the carrier 904 in the z-direction when actuated. For some embodiments, a return spring is used to push the piezoelectric bimorph actuator 902 back to the initial position. The return spring may be configured as described herein to help push the piezoelectric bimorph actuator down to its initial, deactuated position. Because of the small footprint of the piezoelectric bimorph actuator, SMA actuators having a smaller footprint than existing actuator technologies can be manufactured.

Figure 10 illustrates a cross-sectional view of an autofocus assembly including an SMA actuator that includes a position sensor, such as a TMR sensor, according to an embodiment. Autofocus assembly 1002 includes a position sensor 1004 attached to a movable spring 1006, and a magnet 1008 attached to a lens carrier 1010 of the autofocus assembly that includes an SMA actuator, such as those described herein. Position sensor 1004 is configured to determine an amount of movement of lens carriage 1010 from an initial position in z-direction 1005 based on a distance of magnet 1008 from position sensor 1004 using techniques including those known in the art. According to some embodiments, the position sensor 1004 is electrically coupled with a controller or processor (e.g., a central processing unit) using a plurality of electrical traces on the spring arm of the movable spring 1006 of the optical image stabilization assembly.

Figures 11a-c illustrate views of a piezoelectric bimorph actuator according to some embodiments. According to various embodiments, piezo bimorph actuator 1102 includes a beam 1104 and one or more SMA materials 1106, such as SMA ribbon 1106b (e.g., as shown in the perspective view of a piezo bimorph actuator including SMA ribbon according to the embodiment of fig. 11 b) or SMA wire 1106a (e.g., as shown in the cross-section of a piezo bimorph actuator including SMA wire according to the embodiment of fig. 11 a). The SMA material 1106 is secured to the beam 1104 using techniques including those described herein. According to some embodiments, the SMA material 1106 is secured to the beam 1104 using a bond film material 1108. For the various embodiments, the ends of the SMA material 1106 are electrically and mechanically coupled with contacts 1110, the contacts 1110 being configured to supply electrical current to the SMA material 1106 using techniques including those known in the art. According to various embodiments, the contacts 1110 (e.g., as shown in fig. 11a and 11 b) are gold plated copper pads. According to an embodiment, a piezoelectric bimorph actuator 1102 having a length of about 1 millimeter is configured to produce a large stroke, and a 50 millinewton ("mN") thrust is used as part of the lens assembly, as shown, for example, in fig. 11 c. According to some embodiments, using a piezoelectric bimorph actuator 1102 having a length greater than 1 millimeter will produce a greater stroke and less force than a piezoelectric bimorph actuator 1102 having a length of 1 millimeter. For an embodiment, piezoelectric bimorph actuator 1102 includes a 20 micron thick SMA material 1106, a 20 micron thick insulator (e.g., polyimide insulator) 1112, and a 30 micron thick stainless steel beam 1104 or base metal (base layer metal). Various embodiments include a second insulator 1114 disposed between the contact layer including contacts 1110 and the SMA material 1106. According to some embodiments, the second insulator 1114 is configured to insulate the SMA material 1106 from portions of the contact layer not used as contacts 1110. For some embodiments, the second insulator 1114 is a blanket layer, such as a polyimide insulator. Those skilled in the art will appreciate that other dimensions and materials may be used to meet the desired design characteristics.

Figure 12 illustrates a view of an embodiment of a piezoelectric bimorph actuator, according to an embodiment. The embodiment shown in fig. 12 includes an intermediate feed 1204 for applying power. Power is supplied at the center of the SMA material 1202 (wire or ribbon), such as the SMA materials described herein. The ends of the SMA material 1202 are grounded to the beam 1206 or base metal at the end pads 1203 to serve as a return path. End pad 1203 is electrically isolated from the rest of contact layer 1214. According to an embodiment, the beam 1206 or base metal provides more rapid cooling of the SMA material 1202 (e.g., SMA wire) along its entire length in close proximity to the SMA material 1202 when the current is turned off (i.e., the piezoelectric bimorph actuator is deactuated). As a result, faster wire deactuation and actuator response time. The heat distribution of the SMA wires or ribbons is improved. For example, the heat distribution is more uniform, so that a higher total current can be reliably transmitted to the wire. Without uniform heat dissipation, certain portions of the wire (e.g., the middle region) may overheat and break, thus requiring reduced current and reduced motion to operate reliably. The intermediate feed 1204 has the following advantages: the SMA material 1202 has faster wire activation/actuation (faster heating) and reduced power consumption (lower resistive path length) with faster response times. This allows for faster actuator action and the ability to operate at higher motion frequencies.

As shown in fig. 12, the beam 1206 includes an intermediate metal 1208 that is isolated from the rest of the beam 1206 to form an intermediate feed 1204. An insulator 1210, such as those described herein, is disposed on the beam 1206. The insulator 1210 is configured with one or more openings or vias 1212 to provide electrical access to the beam 1206, e.g., to couple the grounding segment 1214b of the contact layer 1214 and to provide contact to the intermediate metal 1208 to form the intermediate feed 1204. According to some embodiments, a contact layer 1214, such as those described herein, includes a power section 1214a and a ground section 1214b to provide actuation/control signals to the piezoelectric bimorph actuator via a power supply contact 1216 and a ground joint 1218. A cover layer 1220, such as those described herein, is disposed over the contact layer 1214 to electrically isolate the contact layer, but at portions of the contact layer 1214 that require electrical coupling (e.g., one or more contacts).

Figure 13 illustrates an end pad cross-section of a piezoelectric bimorph actuator according to the embodiment shown in figure 12. As described above, end pad 1203 is electrically isolated from the rest of contact layer 1214 by a gap 1222 formed between end pad 1203 and contact layer 1214. According to some embodiments of the invention, the gap is formed using etching techniques, including those known in the art. End pad 1203 includes via section 1224 configured to electrically couple end pad 1203 with beam 1206. The via section 1224 is formed in a via 1212, and the via 1212 is formed in the insulator 1210. The SMA material 1202 is electrically coupled to the end pads 1213. The SMA material 1202 may be electrically coupled to the end pads 1213 using techniques including, but not limited to, brazing, resistance welding, laser welding, and direct plating.

Figure 14 shows a medial feed cross-section of a piezoelectric bimorph actuator according to the embodiment shown in figure 12. The medial feed 1204 is electrically coupled with the power source through the contact layer 1214 and is electrically and thermally coupled with the medial metal 1208 by way of a via section 1226 in the medial feed 1204 formed in a via 1212, wherein the via 1212 is formed in the insulator 1210.

The actuators described herein may be used to form actuator assemblies that use multiple warped actuators and/or multiple piezoelectric bimorph actuators. According to an embodiment, the actuators can be stacked on top of each other one on top of the other to increase the stroke distance that can be achieved.

Fig. 15 shows an exploded view of an SMA actuator including two warp actuators according to an embodiment. According to the embodiments described herein, the two

warped actuators

1302, 1304 are arranged relative to each other such that their actions are used to oppose each other. For the various embodiments, the two

tilt actuators

1302, 1304 are configured to move in an opposing relationship to each other to position the lens carrier 1306. For example, the first warp actuator 1302 is configured to receive a power signal that is opposite to the power signal sent to the second warp actuator 1304.

Fig. 16 shows an SMA actuator comprising two warped actuators according to an embodiment. The

warp actuators

1302, 1304 are configured such that the warp arms 1310, 1312 of each

warp actuator

1302, 1304 face each other, and the

slide bases

1314, 1316 of each

warp actuator

1302, 1304 are the outer surfaces of both warp actuators. According to various embodiments, the hanger portion 1308 of each

SMA actuator

1302, 1304 is configured to rest on a portion of an object on which one or more warp-

type actuators

1302, 1304 acts to provide support thereto, e.g., to rest on a lens carrier 1306 moved by the warp actuator using techniques including those described herein.

Fig. 17 shows a side view of an SMA actuator comprising two warp actuators according to an embodiment, showing SMA wires 1318 causing an object, such as a lens carrier, to move in the positive z-direction or in an upward direction.

Fig. 18 shows a side view of an SMA actuator comprising two warp actuators according to an embodiment, showing the direction of the SMA wire 1318 that causes an object, such as a lens carrier, to move in the negative z-direction or in a downward direction.

Fig. 19 shows an exploded view of an assembly including an SMA actuator including two warped actuators, according to an embodiment. The

warp actuators

1902, 1904 are configured such that the warp arms 1910, 1912 of each

warp actuator

1902, 1904 are the outer surfaces of both warp actuators, and the sliding

bases

1914, 1916 of each

warp actuator

1902, 1904 face each other. According to various embodiments, the hanger portion 1908 of each

SMA actuator

1902, 1904 is configured to rest on a portion of an object on which one or more

warped actuators

1902, 1904 act to provide support thereto, e.g., to rest on a lens carrier 1906 that is moved by the warped actuator using techniques including those described herein. For some embodiments, the SMA actuator includes a base portion 1918 configured to receive the second warp actuator 1904. The SMA actuator may also include a cover portion 1920. Fig. 20 shows an SMA actuator comprising two warped actuators comprising a base portion and a cover portion, according to an embodiment.

Fig. 21 shows an SMA actuator comprising two warped actuators according to an embodiment. For some embodiments, the

warped actuators

1902, 1904 are arranged relative to each other such that the hanger portion 1908 of the first warped actuator 1902 is rotated about 90 degrees relative to the hanger portion of the second warped actuator 1904. The 90 degree configuration enables pitch and roll rotation of objects such as the lens carrier 1906. This provides better control over the movement of the lens holder 1906. For the various embodiments, a differential power signal is applied to the SMA wires of each warp actuator pair, which provides pitch and roll rotation of the lens carrier, thereby effecting a tilt OIS action.

Embodiments of SMA actuators that include two warp actuators eliminate the need for a return spring. The use of two warped actuators may improve/reduce hysteresis when position feedback is performed using SMA wire resistances. A reaction force SMA actuator comprising two warped actuators contributes to a more precise position control due to having a lower hysteresis than those actuators comprising a return spring. For some embodiments, such as the embodiment shown in fig. 22, an SMA actuator comprising two

warp actuators

2202, 2204 uses differential power to provide two-axis tilting to the left and

right SMA wires

2218a, 2218b of each

warp actuator

2202, 2204. For example, the left SMA wire 2218a is actuated at a higher power than the right SMA wire 2218 b. This causes the left side of the lens holder 2206 to move downward and the right side to move upward (tilt). For some embodiments, the SMA wires of first warp actuator 2202 are held at equal power to act as a fulcrum to urge the differential abutment of

SMA wires

2218a, 2218b to cause a tilting action. Reversing the power signals applied to the SMA wires, e.g. applying equal power to the SMA wires of the second warp actuator 2202 and applying differential power to the left and

right SMA wires

2218a, 2218b of the second warp actuator 2204, causes the lens carrier 2206 to tilt in the other direction. This provides the ability to tilt the object (e.g. the lens holder) along either axis of motion, or any tilt between the lens and the sensor can be called out to achieve good dynamic tilt, and thus better image quality over all pixels.

Fig. 23 shows an SMA actuator including two warp actuators and a coupler, according to an embodiment. The SMA actuator includes two warped actuators, such as those described herein. First warp actuator 2302 is configured to couple with second warp actuator 2304 using a coupler, such as coupling ring 2305. The

warp actuators

2302, 2304 are arranged relative to each other such that the hanger portion 2308 of the first warp actuator 2302 is rotated approximately 90 degrees relative to the hanger portion 2309 of the second warp actuator 2304. A payload for movement (e.g., a lens or lens assembly) is attached to lens carriage 2306, which is configured to be disposed on the sliding base of first warp actuator 2302.

For various embodiments, equal power may be applied to the SMA wires of first warp actuator 2302 and second warp actuator 2304. This may result in maximizing the z-stroke of the SMA actuator in the positive z-direction. For some embodiments, the stroke of the SMA actuator may have a z-stroke equal to or greater than twice the stroke of other SMA actuators including two warp actuators. For some embodiments, additional springs may be added to urge the two flexures against each other when the power signal is removed from the SMA actuator, thereby helping to push the actuator assembly and payload back down. Equal and opposite power signals may be applied to the SMA wires of the first and

second warp actuators

2302, 2304. This enables the SMA actuator to be moved in the positive z-direction by the warp actuator and in the negative z-direction by the warp actuator, which enables the position of the SMA actuator to be accurately controlled. Additionally, equal and opposite power signals (differential power signals) may be applied to the left and right SMA wires of the first warp actuator 2302 and the second warp actuator 2304 to tilt an object, such as the lens carrier 2306, in the direction of at least one of the two axes.

An embodiment of an SMA actuator comprising two warp actuators and a coupler, such as shown in fig. 23, may be coupled with additional warp actuators and pairs of warp actuators to achieve a greater desired stroke than a single SMA actuator.

Fig. 24 shows an exploded view of an SMA system including an SMA actuator including a warp actuator with a stacked suspension according to an embodiment. As described herein, for some embodiments, an SMA system is configured for use with one or more camera lens elements as an autofocus drive. As shown in fig. 24, the SMA system includes a return spring 2403, which return spring 2403 is configured to move the lens carrier 2405 in a direction opposite to the z-stroke direction when the tension in the SMA wire 2408 decreases as the SMA wire is deactuated, according to various embodiments. For some embodiments, the SMA system includes a housing 2409 configured to receive a return spring 2403 and to act as a sliding bearing to guide the lens carrier in the z-stroke direction. Housing 2409 is also configured to be disposed on warp actuator 2402. Warped actuator 2402 includes a slide base 2401, similar to those described herein. Warp actuator 2402 includes warp arms 2404 coupled to a hanger portion, such as a stacked hanger 2406 formed from a stack. Warp-type actuator 2402 also includes an SMA wire attachment structure, such as a crimp connection 2412 formed in a stack.

As shown in fig. 24, the slide base 2401 is disposed on an optional adapter plate 2414. The adapter plate is configured to mate the SMA system or warp actuator 2402 with other systems, such as OIS, additional SMA systems, or other components. Fig. 25 shows an SMA system 2501 comprising an SMA actuator comprising a warp actuator 2402 with a laminated suspension, according to an embodiment.

Fig. 26 illustrates a warp actuator including stacked hangers, according to an embodiment. Warp actuator 2402 includes warp arm 2404. The warp arm 2404 is configured to move along the z-axis when the SMA wire 2408 is actuated and deactuated as described herein. SMA wire 2408 is attached to a warp type actuator using a crimp connection 2412 formed by the lamination. According to the embodiment shown in fig. 26, warp arms 2404 are coupled to each other by an intermediate portion, such as a stacked hanger 2406. According to various embodiments, stacked suspension 2406 is configured to cradle a portion of an object acted upon by a warp-type actuator to provide support thereto, e.g., a lens carrier that is moved by the warp-type actuator using techniques including those described herein.

Fig. 27 shows a stacked suspension of SMA actuators according to an embodiment. For some embodiments, the laminate hanger 2406 material is a low stiffness material such that it does not resist the actuation motion. For example, the laminate hanger 2406 is formed using a copper layer disposed on a first polyimide layer with a second polyimide layer disposed on the copper. For some embodiments, stacked hangers 2406 are formed on warp arms 2404 using deposition and etching techniques, including those known in the art. For other embodiments, the stacking hanger 2406 is formed separately from the warp arm 2404 and attached to the warp arm 2404 using techniques including welding, adhesives, and other techniques known in the art. For the various embodiments, glue or other adhesive is used on the stack-up hanger 2406 to ensure that the cocking arms 2404 remain in place relative to the lens carrier.

Fig. 28 shows a laminated crimp connection of an SMA actuator according to an embodiment. The stack-formed crimp connection 2412 is configured to attach the SMA wire 2408 to the warp-type actuator and form a circuit joint with the SMA wire 2408. For the various embodiments, the laminate-formed crimp connection 2412 includes a laminate formed of one or more layers of insulation, and one or more conductive layers formed over the crimp portion.

For example, a polyimide layer is disposed on at least a portion of the stainless steel portion to form the crimp 2413. A conductive layer, such as copper, is then disposed on the polyimide layer, which is electrically coupled with one or more signal traces 2415 disposed on the warp-type actuator. Deforming the crimps to bring them into contact with the SMA wire therein also brings the SMA wire into electrical contact with the conductive layer. Thus, the electrically conductive layer coupled with the SMA wire including the one or more signal traces is used to apply a power signal to the SMA wire using techniques including those described herein. For some embodiments, a second polyimide layer is formed on the conductive layer in areas where the conductive layer will not be in contact with the SMA wire. For some embodiments, the laminate-formed crimp connection 2412 is formed on the crimp 2413 using deposition and etching techniques, including those known in the art. For other embodiments, the laminate-formed crimp connection 2412 and one or more electrical traces are formed separately from the crimp 2413 and the warp actuator and attached to the crimp 2412 and the warp actuator using techniques including welding, adhesives, and other techniques known in the art.

Fig. 29 shows an SMA actuator with a stacked-pylon warp actuator. As shown in fig. 29, when a power signal is applied, the SMA wires will contract or shorten to move the buckling arm and the stack hanger in the positive z-direction. The stacked gantry in contact with the object in turn moves the object (e.g., lens carrier) in the positive z-axis direction. When the power signal is reduced or removed, the SMA wire may lengthen and move the buckling arm and the stack suspension in the negative z-direction.

Fig. 30 shows an exploded view of an SMA system including an SMA actuator including a warp actuator, according to an embodiment. As described herein, for some embodiments, an SMA system is configured to be used in conjunction with one or more camera lens elements as an autofocus drive. As shown in fig. 30, the SMA system includes a return spring 3003, which return spring 3003 is configured to move the lens carrier 3005 in a direction opposite the z-stroke direction when the tension in the SMA wire 3008 decreases as the SMA wire is deactuated, according to various embodiments. For some embodiments, the SMA system includes a stiffener 3000 disposed on the return spring 3003. For some embodiments, the SMA system includes a housing 3009 formed of two parts configured to receive the return spring 3003 and function as a sliding support to guide the lens carrier in the z-stroke direction. The housing 3009 is also configured to be disposed on the warp actuator 3002. The warped actuator 3002 includes a slide base 3001 similar to that described herein, formed of two parts. The slide base 3001 is split to electrically isolate the two sides (e.g., one side is grounded and the other is a power supply) since current flows to the wire through various portions of the slide base 3001 according to some embodiments.

Warp actuator 3002 includes warp arm 3004. Each pair of warp actuators 3002 is formed on a separate portion of warp actuator 3002. The warp actuator 3002 also includes an SMA wire attachment structure, such as a resistance weld wire crimp 3012. The SMA system optionally includes a flex circuit 3020 for electrically coupling the SMA wires 3008 to one or more control circuits.

As shown in fig. 30, the slide base 3001 is disposed on an optional adapter plate 3014. The adapter plate is configured to mate the SMA system or warp actuator 3002 with other systems, such as OIS, additional SMA systems, or other components. Fig. 31 shows an SMA system 3101 including an SMA actuator that includes a warp actuator 3002, according to an embodiment.

Fig. 32 includes an SMA actuator according to an embodiment that includes a warp actuator. Warp actuator 3002 includes warp arm 3004. The toggle arm 3004 is configured to move along the z-axis when the SMA wire 3012 is actuated and deactuated as described herein. SMA wire 2408 is attached to resistance wire crimp 3012. According to the embodiment shown in fig. 32, the warp arm 3004 is configured to mate with an object (e.g., a lens carrier) without using the middle portion of the dual yoke capture joint.

Fig. 33 shows a double yoke capture joint of a pair of toggle arms of an SMA actuator according to an embodiment. Fig. 33 also shows plated pads for attaching an optional flexible circuit to the slide base. For some embodiments, the plated pads are formed using gold. Fig. 34 shows a resistance weld crimp for an SMA actuator used to attach an SMA wire to a warp type actuator, according to an embodiment. For some embodiments, glue or adhesive may also be disposed on top of the weld to aid mechanical strength and to act to relieve fatigue strain during handling and impact loading.

Fig. 35 shows an SMA actuator including a warped actuator with a double yoke capture joint. As shown in fig. 35, when a power signal is applied, the SMA wire contracts or shortens to move the buckling arm in the positive z-direction. The dual yoke capture tabs contact the object, thereby moving the object (e.g., lens carrier) in the positive Z direction. When the power signal is reduced or removed, the SMA wire stretches and moves the warp arm in the negative z-direction. The yoke capture feature enables the warp arm to be held in place relative to the lens carrier.

Figure 36 illustrates an SMA piezoelectric bimorph liquid lens according to an embodiment. SMA piezoelectric bimorph liquid lens 3501 includes a liquid lens subassembly 3502, a housing 3504, and an electrical circuit with SMA actuator 3506. For various embodiments, the SMA actuator includes four piezoelectric bimorph actuators 3508, such as the embodiments described herein. Piezoelectric bimorph actuator 3508 is configured to push against formed bump 3510 located on flexible membrane 3512. The ring bends the membrane 3512/liquid 3514 to assume a shape (warp) to alter the optical path through the membrane 3512/liquid 3514. Liquid containment ring 3516 is used to contain liquid 3514 between membrane 3512 and lens 3518. Equal force from the piezo bimorph actuator changes the focus point of the image in the Z direction (perpendicular to the lens), which makes it useful as an autofocus. According to some embodiments, the different forces from piezoelectric bimorph actuator 3508 may move the light ray in the direction of the X, Y axis, which makes it useful as an optical image stabilizer. By appropriate control of each actuator, both OIS and AF functions can be implemented. For some embodiments, three actuators are used. The circuit with the SMA actuator 3506 includes one or more contacts 3520 for control signals to actuate the SMA actuator. According to some embodiments including four SMA actuators, the circuit with SMA actuator 3506 includes four power circuit control contacts and a common return contact for each SMA actuator.

Fig. 37 shows an SMA piezoelectric bimorph liquid lens according to an embodiment in perspective view. Fig. 38 shows a cross-sectional view and a bottom view of an SMA piezoelectric bimorph liquid lens according to an embodiment.

Fig. 39 shows an SMA system including an SMA actuator 3902 having a piezoelectric bimorph actuator, according to an embodiment. The SMA actuator 3902 includes four piezoelectric bimorph actuators using the techniques described herein. As shown in fig. 40, two of the piezoelectric bimorph actuators are configured as positive z-stroke actuators 3904 and the other two are configured as negative z-stroke actuators 3906, fig. 40 showing an SMA actuator 3902 having a piezoelectric bimorph actuator in accordance with an embodiment. Opposing

actuators

3906, 3904 are configured to control motion in both directions throughout a range of travel. This provides the ability to adjust the control code to compensate for tilt. For the various embodiments, two SMA wires 3908 attached to the top of the component achieve a positive z-stroke displacement. Two SMA wires attached to the bottom of the part achieve a negative Z stroke displacement. For some embodiments, each piezoelectric bimorph actuator is attached to an object (e.g., lens holder 3910) using tabs to engage the object. The SMA system includes top springs 3912 configured to provide stability of the lens carrier 3910 in an axis perpendicular to the z-stroke axis (e.g., in the directions of the x-axis and the y-axis). Additionally, top spacer 3914 is configured to be disposed between top spring 3912 and SMA actuator 3902. The bottom spacer 3916 is disposed between the SMA actuator 3902 and the bottom spring 3918. The bottom springs 3918 are configured to provide stability of the lens carrier 3910 in an axis perpendicular to the z-stroke axis, e.g., in the x-axis and y-axis directions. Bottom spring 3918 is configured to be disposed on a base 3920, such as those described herein.

Fig. 41 shows the length 4102 of the piezoelectric bimorph actuator 4103 and the location of the bond pads 4104 for the SMA wire 4206 such that the wire length extends beyond the piezoelectric bimorph actuator. Longer wires than piezo twin-wafer actuators are used to increase stroke and force. Thus, the extension 4108 of the SMA wire 4206 beyond the piezo bimorph actuator 4103 is used to set the stroke and force of the piezo bimorph actuator 4103.

Fig. 42 illustrates an exploded view of an SMA system including an SMA piezoelectric bimorph actuator 4202 according to an embodiment. According to various embodiments, the SMA system is configured to form one or more circuits using separate metallic materials and non-conductive adhesives to independently power the SMA wire. Some embodiments do not affect AF size and include four piezoelectric bimorph actuators, such as those described herein. Two of the piezoelectric bimorph actuators are configured as positive Z-stroke actuators, while the other two are configured as negative Z-stroke actuators. Fig. 43 shows an exploded view of a sub-portion of an SMA actuator according to an embodiment. This subsection includes a negative actuator signal connector 4302, a base 4304 with a piezoelectric bimorph actuator 4306. The negative actuator signal connector 4302 includes wire bond pads 4308 for connecting the SMA wires of the piezoelectric bimorph actuator 4306 using techniques including those described herein. The negative actuator signal connector 4302 is secured to the base 4304 using an adhesive layer 4310. This subsection also includes a positive actuator signal connection 4314 having wire bond pads 4316 for connecting SMA wires 4312 of the piezoelectric bimorph actuator 4306 using techniques including those described herein. The positive actuator signal connector 4314 is secured to the base 4304 using an adhesive layer 4318. Each of the base 4304, negative actuator signal connector 4302, and positive actuator signal connector 4314 is formed of metal, such as stainless steel. The connection pads 4322 on each of the base 4304, the negative actuator signal connector 4302, and the positive actuator signal connector 4314 are configured to electrically couple a control signal and ground to actuate the piezoelectric bimorph actuator 4306 using techniques including those described herein. For some embodiments, the connection pads 4322 are gold plated. Fig. 44 shows a sub-portion of an SMA actuator according to an embodiment. For some embodiments, gold plated pads are formed on the stainless steel layer for solder bonding or other known electrical termination methods. In addition, wire bond pads are formed for signal joints to electrically couple the SMA wires to implement the power signal.

FIG. 45 illustrates a five axis sensor displacement system according to an embodiment. The five axis sensor displacement system is configured to move an object, such as an image sensor, relative to one or more lenses along five axes. This includes X/Y/Z axis translation and pitch/roll tilt. Optionally, the system is configured to use only four axes, tilting the X/Y axis pan and pitch/roll together, and Z-motion at the top using a separate AF. Other embodiments include a five-axis sensor displacement system configured to move one or more lenses relative to an image sensor. For some embodiments, the static lens stack is mounted on the top cover and inserted within the ID (not touching the inside orange movable bracket).

FIG. 46 illustrates an exploded view of a five axis sensor shifting system, according to an embodiment. The five-axis sensor displacement system comprises two circuit components: a flexible sensor circuit 4602, a piezoelectric bimorph actuator circuit 4604; and eight to twelve piezoelectric bimorph actuators 4606 built onto the piezoelectric bimorph circuit components using techniques including those described herein. The five axis sensor displacement system includes a movable carrier 4608 and a housing 4610, the movable carrier 4608 being configured to hold one or more lenses. According to an embodiment, the piezoelectric bimorph actuator circuit 4604 includes eight to twelve SMA actuators, such as those described herein. These SMA actuators are configured to move the movable carriage 4608 along five axes, e.g., in the x-direction, y-direction, z-direction, pitch, and roll, similar to the other five-axis systems described herein.

Figure 47 shows an SMA actuator according to an embodiment comprising a piezoelectric bimorph actuator integrated into the circuit for all actions. Embodiments of SMA actuators may include eight to twelve piezoelectric bimorph actuators 4606. However, other embodiments may include more or fewer. Fig. 48 shows an SMA actuator 4802 according to an embodiment comprising a piezoelectric bimorph actuator integrated into the circuit to perform all actions, the SMA actuator 4802 being formed in part to fit within a respective housing 4804. FIG. 49 illustrates a cross-section of a five axis sensor displacement system according to an embodiment.

Fig. 50 illustrates an SMA actuator 5002 including a piezoelectric bimorph actuator, according to an embodiment. The SMA actuators 5002 are configured to move an image sensor, lens, or other various payloads in the x and y directions using four side-mounted SMA piezo bimorph actuators 5004. Fig. 51 shows a top view of an SMA actuator comprising a piezoelectric bimorph actuator that moves an image sensor, lens, or other various payloads at different x and y positions.

Fig. 52 illustrates an SMA actuator including a piezo bimorph actuator 5202, the piezo bimorph actuator 5202 configured to cassette piezo bimorph autofocus, according to an embodiment. Four top and bottom mounted SMA piezoelectric bimorph actuators (such as those described herein) are configured to move together to produce motion in the z-forming direction for autofocus. Fig. 53 illustrates an SMA actuator including a piezoelectric bimorph actuator, two top-mounted piezoelectric bimorph actuators 5302 configured to push down on one or more lenses, according to an embodiment. Fig. 54 shows an SMA actuator including a piezoelectric bimorph actuator, with two bottom-mounted piezoelectric bimorph actuators 5402 configured to push up on one or more lenses, according to an embodiment. Fig. 55 illustrates an SMA actuator including a piezoelectric bimorph actuator according to an embodiment to illustrate four top and bottom mounted SMA piezoelectric bimorph actuators 5502, such as those described herein, the SMA piezoelectric bimorph actuators 5502 used to move one or more lenses to produce a tilting action.

Fig. 56 shows an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a two-axis lens-displacing OIS (apparatus), according to an embodiment. For some embodiments, the two-axis lens shift OIS is configured to move the lens in the X/Y axis. For some embodiments, the Z-axis motion is from a separate AF, such as those described herein. Four piezo bimorph actuators push one side of the autofocus to achieve OIS action. Fig. 57 shows an exploded view of an SMA system including an SMA actuator 5802 according to an embodiment, the SMA actuator 5802 including a piezoelectric bimorph actuator 5806 configured as a biaxial lens displacement OIS. Fig. 58 illustrates a cross-section of an SMA system including an SMA actuator 5802, the SMA actuator 5802 including a piezoelectric bimorph actuator 5806 configured as a biaxial lens displacement OIS, according to an embodiment. Fig. 59 illustrates a cassette piezo bimorph actuator 5802 for use in an SMA system according to an embodiment, the cassette piezo bimorph actuator 5802 configured as a biaxial lens displacement OIS as it was fabricated prior to being shaped for assembly in the system. Such a system may be configured to have a high OIS stroke OIS (e.g., +/-200um or higher). In addition, such an embodiment is configured to use four sliding bearings (e.g., POM sliding bearings) to have a wide range of motion and good OIS dynamic tilt. Embodiments are configured to be easily integrated with AF designs (e.g., VCM or SMA).

Fig. 60 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a five-axis lens-shift OIS and auto-focus, according to an embodiment. For some embodiments, the five-axis lens shift OIS and autofocus are configured to move the lens in the X/Y/Z axis. For some embodiments, pitch and yaw axis motion is used for dynamic pitch adjustment capability. Eight piezoelectric bimorph actuators are used to provide motion to the autofocus and OIS using the techniques described herein. Fig. 61 shows an exploded view of an SMA system according to an embodiment comprising an SMA actuator 6202, the SMA actuator 6202 comprising a piezoelectric bimorph actuator 6204 configured as a five-axis lens shift OIS and autofocus according to an embodiment. Fig. 62 illustrates a cross-section of an SMA system including an SMA actuator 6202, the SMA actuator 6202 including a piezoelectric bimorph actuator 6204 configured as a five-axis lens shift OIS and autofocus, according to an embodiment. Fig. 63 illustrates a cassette piezo bimorph actuator 6202 for an SMA system according to an embodiment, the cassette piezo bimorph actuator 6202 configured as a five-axis lens shift OIS and auto focus as it was fabricated prior to being shaped for assembly in the system. Such a system may be configured to have a high OIS stroke OIS (e.g., +/-200um or higher) and a high autofocus stroke (e.g., 400um or higher). In addition, such embodiments can accommodate any tilt and eliminate the need for a separate autofocus assembly.

Fig. 64 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as an extrapolated cassette, according to an embodiment. For some embodiments, the piezoelectric bimorph actuator assembly is configured to be wrapped around an object, such as a lens carrier. The X/Y/Z stiffness of the flexible portion is low because the circuit assembly moves with the lens holder. The tail pads of the circuit are static. The extrapolation cassette may be configured as four or eight piezoelectric bimorph actuators. Thus, the extrapolation box may be configured as four piezoelectric bimorph actuators on each side to achieve OIS motion in the X and Y axes. The extrapolation cassette may be configured as four piezoelectric bimorph actuators on the top and bottom to achieve auto-focus of motion in the Z-axis. The extrapolation box may be configured as eight piezo bimorph actuators on the top, bottom, and sides to achieve OIS and auto-focus motion in the X, Y, and Z axes, and to enable three-axis tilting (pitch/roll/yaw). Fig. 65 illustrates an exploded view of an SMA system including an SMA actuator 6602 that includes a piezoelectric bimorph actuator 6604 configured as a box that is pushed outward, according to an embodiment. Thus, the SMA actuator is configured such that the piezoelectric bimorph actuator acts on the housing 6504 to move the lens carrier 6506 using the techniques described herein. Fig. 66 shows an SMA system including an SMA actuator 6602 that includes a piezoelectric bimorph actuator configured as an out-of-box partially shaped to receive a lens carrier 6603, according to an embodiment. Fig. 67 shows an SMA system that includes an SMA actuator 6602 that includes a piezoelectric bimorph actuator 6604 configured as an extrapolation box as it was manufactured before being shaped to fit in the system, according to an embodiment.

Fig. 68 shows an SMA system including an SMA actuator 6802, the SMA actuator 6802 including a piezoelectric bimorph actuator configured as a three-axis sensor displacement OIS, according to an embodiment. For some embodiments, the z-axis motion is from a separate autofocus system. The four piezoelectric bimorph actuators are configured to push on each side of the sensor carrier 6804 to provide motion to the OIS using the techniques described herein. Fig. 69 shows an exploded view of an SMA comprising an SMA actuator 6802 comprising a piezoelectric bimorph actuator configured as a three-axis sensor displacement OIS, according to an embodiment. Fig. 70 shows a cross-section of an SMA system including an SMA actuator 6802 including a piezoelectric bimorph actuator 6806 configured as a three-axis sensor displacement OIS, according to an embodiment. Fig. 71 illustrates a cassette piezoelectric bimorph actuator 6802 component for use in an SMA system according to an embodiment, the cassette piezoelectric bimorph actuator 6802 component configured as a three-axis sensor displacement OIS as it was manufactured prior to being shaped for assembly in the system. Fig. 72 illustrates a flexible sensor circuit for use in an SMA system configured to shift OIS for a three-axis sensor in accordance with an embodiment. Such a system may be configured to have a high OIS stroke OIS (e.g., +/-200um or higher) and a high autofocus stroke (e.g., 400um or higher). In addition, such an embodiment is configured to use four sliding bearings (e.g., POM sliding bearings) to have a wide two-axis range of motion and good OIS dynamic tilt. Embodiments are configured to be easily integrated with AF designs (e.g., VCM or SMA).

Fig. 73 illustrates an SMA system including an SMA actuator 7302, the SMA actuator 7302 including a piezoelectric bimorph actuator 7304 configured as a six-axis sensor displacement OIS and auto-focus, according to an embodiment. For some embodiments, the six-axis sensor shift OIS and autofocus are configured to move the lens on the X/Y/Z/pitch/yaw/roll axis. For some embodiments, pitch and yaw axis motion enable dynamic pitch adjustment capabilities. Eight piezoelectric bimorph actuators are used to provide motion for auto-focus and OIS using the techniques described herein. Fig. 74 illustrates an exploded view of an SMA system including an SMA actuator 7402 according to an embodiment, the SMA actuator 7402 including a piezoelectric bimorph actuator 7404 configured as a six-axis sensor displacement OIS and auto-focus. Fig. 75 illustrates a cross-section of an SMA system comprising an SMA actuator 7402 according to an embodiment, the SMA actuator 7402 comprising a piezoelectric bimorph actuator configured as a six-axis sensor displacement OIS and auto-focus. Fig. 76 shows a cassette piezoelectric bimorph actuator 7402 for an SMA system configured to displace OIS and autofocus as a manufactured six-axis sensor before being shaped to fit the system according to an embodiment. Fig. 77 illustrates a flexible sensor circuit for use in an SMA system configured as a three-axis sensor displacement OIS, according to an embodiment. Such a system may be configured to have a high OIS stroke OIS (e.g., +/-200um or higher) and a high autofocus stroke (e.g., 400um or greater). In addition, such embodiments can accommodate any tilt and eliminate the need for a separate autofocus assembly.

Fig. 78 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a two-axis camera tilt OIS, according to an embodiment. For some embodiments, the two-axis camera tilt OIS is configured to move the camera along the pitch/yaw axis. Four piezoelectric bimorph actuators are used to push the top and bottom of the autofocus for OIS pitch and yaw motions for the entire camera action using the techniques described herein. Fig. 79 illustrates an exploded view of an SMA system including an SMA actuator 7902 including a piezoelectric bimorph actuator 7904 configured as a two-axis camera tilt OIS, according to an embodiment. Fig. 80 illustrates a cross-section of an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a two-axis camera tilt OIS, according to an embodiment. Fig. 81 illustrates a box piezoelectric bimorph actuator configured as a two-axis camera tilt OIS as fabricated before it is shaped to fit the system for use in an SMA system according to an embodiment. Fig. 82 illustrates a flexible sensor circuit for an SMA system configured as a two-axis camera tilt OIS, according to an embodiment. Such systems may be configured to have a high OIS stroke OIS (e.g., plus/minus 3 degrees or more). Embodiments are configured to be easily integrated with an autofocus ("AF") design (e.g., VCM or SMA).

Fig. 83 illustrates an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a three-axis camera tilt OIS, according to an embodiment. For some embodiments, the two-axis camera tilt OIS is configured to move the camera along the pitch/yaw/roll axis. Four piezo-bimorph actuators are used to push the top and bottom of the autofocus for OIS pitch and yaw motions for the entire camera action using the techniques described herein, and four piezo-bimorph actuators are used to push the sides of the autofocus for OIS roll motions for the entire camera action using the techniques described herein. Fig. 84 illustrates an exploded view of an SMA system including an SMA actuator 8402 including a piezoelectric bimorph actuator 8404 configured as a three-axis camera tilt OIS, according to an embodiment. Fig. 85 shows a cross-section of an SMA system including an SMA actuator including a piezoelectric bimorph actuator configured as a three-axis camera tilt OIS, according to an embodiment. Fig. 86 illustrates a cassette piezo-electric bimorph actuator configured as a three-axis camera tilt OIS as it was fabricated prior to being shaped for assembly in a system, for use in an SMA system according to an embodiment. Fig. 87 shows a flexible sensor circuit for an SMA system configured as a three-axis camera tilt OIS, according to an embodiment. Such systems may be configured to have a high OIS stroke OIS (e.g., plus/minus 3 degrees or more). Embodiments are configured to be easily integrated with AF designs (e.g., VCM or SMA).

Fig. 88 illustrates exemplary dimensions of a piezoelectric bimorph actuator of an SMA actuator according to an embodiment. These dimensions are the preferred embodiment, but those skilled in the art will appreciate that other dimensions may be used based on the desired characteristics of the SMA actuator.

Fig. 89 illustrates a first view of a piezoelectric bimorph actuator 8980 according to one embodiment. The piezoelectric bimorph actuator 8980 includes a conductive metal base layer 8934 (e.g., a stainless steel layer) and a dielectric layer 8939. The illustrated piezoelectric bimorph actuator 8980 enables a configuration with a reduced number of layers as compared to conventional designs. This reduction in the number of layers improves manufacturing efficiency and reduces raw material costs.

For the purposes of this disclosure, the first view is a view of the dielectric side of the piezoelectric bimorph actuator 8980. The piezoelectric bimorph actuator 8980 includes at least one free end (also referred to herein as a "unfixed end"); here two

free ends

8909, 8910 are shown. The piezoelectric bimorph actuator 8980 also includes a fixed end 8930. Free end 8910 is connected to fixed end 8930 by piezoelectric bimorph arm 8921. Free end 8908 is connected to fixed end 8930 by piezoelectric bimorph arm 8923.

According to some embodiments, the free end 8908 includes a load point that includes a contact member 8912 extending from the tongue portion 8907. According to some embodiments, the tongue 8907 is made primarily of stainless steel. Similarly, according to some embodiments, the free end 8910 includes a load point that includes a contact member 8909 extending from the tongue portion 8911. The contact member 8912 may also include a contact material, such as stainless steel. The contact member 8912 is configured to engage with any component, such as a lens holder or other object. In this configuration, the piezoelectric bimorph actuator 8980 is configured to move in the z-direction when actuated and lift an object, such as a lens carrier, in the z-direction.

According to some embodiments, piezoelectric bimorph arm 8921 comprises one or more SMA materials, such as SMA strips or SMA wires (e.g., those described herein). According to some embodiments, the SMA material is fixed to the piezoelectric bimorph arm 8921 using techniques including those described herein. According to some embodiments, the SMA material is secured to the beam 8921 using an adhesive film material, epoxy, or other attachment technique. The piezoelectric bimorph arm 8921 further includes a conductive metal base layer 8934 and optionally a dielectric layer 8926. Similarly, the second piezoelectric bimorph arm 8923 comprises a conductive metallic base layer and optionally a dielectric layer 8924. The conductive metal base layer 8934 may be formed from a conductive metal material including, but not limited to, stainless steel, copper alloys, gold, nickel, other conductive materials, and combinations thereof.

For some embodiments, the piezoelectric bimorph arm is configured as a beam, such as the beams described herein. For example, the conductive metal base layer 8934 is in the form of a stainless steel base in the shape of a beam that extends from the fixed end 8930 to form free ends 8908, 8910, wherein the beam includes the beams described herein. The dielectric layer 8926 extends along the conductive metal base layer 8934 of the first piezoelectric bimorph arm 8921. According to some embodiments, the SMA material extends from the first SMA contact 8987 to the tongue 8907 on the dielectric layer 8926. The SMA material is secured to the first SMA contact 8987 and tongue 8911 using techniques including those described herein. Also, the SMA material extends over dielectric layer 8924 from second SMA contact 8988 to tongue 8907. The SMA material is secured to the second SMA contact 8988 and tongue 8907 using techniques including those described herein. For some embodiments, a dielectric layer may also be disposed on the SMA material. The dielectric layer electrically isolates the SMA material from the conductive metal base layer and other conductive components.

The fixed end 8930 includes a first contact pad 8935 and a second contact pad 8932. The first contact pad 8935 is electrically and mechanically coupled with the SMA material of the first piezoelectric bimorph arm 8921 through a first SMA contact 8987. The first contact pad 8935 is configured to couple with a current source for the SMA material to actuate the first piezoelectric bimorph arm 8921 as described herein. Similarly, the second contact pad 8932 is electrically and mechanically coupled with the SMA material of the second piezoelectric bimorph arm 8923 through a second SMA contact 8988. The second contact pad 8932 is configured to couple with a current source for the SMA material to actuate the second piezoelectric bimorph arm 8923 as described herein. According to various examples of the present disclosure, the first contact pad 8935 and the second contact pad 8932 are gold plated stainless steel pads. The fixed end 8930 also includes an aperture 8936, the aperture 8936 configured to receive a fixing element to mount the piezoelectric bimorph actuator 8980 to a base. The fixed end 8930 of the piezoelectric bimorph actuator 8980 includes a dielectric layer 8939 and a conductive metal base layer 8934.

Fig. 90 illustrates a second view of a piezoelectric bimorph actuator 8980 according to an embodiment. The piezoelectric bimorph actuator 8980 includes a conductive metal base layer 8934. The piezoelectric bimorph actuator 8980 includes two

free ends

8910, 8908 extending from a fixed end 8930 through piezoelectric

bimorph arms

8921, 8923, respectively. According to some embodiments, a portion of the fixed end 8930, the two

free ends

8910, 8908, and the

piezoelectric bimorph arms

8921, 8923 are made of a single conductive metal base layer 8906.

Fixed end 8930 also includes a first conductive metal base element 8931, a second conductive metal base element 8933, and a common conductive metal base layer 8906. The first conductive metal base element 8931, the second conductive metal base element 8933, and the conductive metal base layer 8906 may be separated by a gap defined by a dielectric layer 8939 on the fixed end 8930. In some embodiments, the gap may be a partially or fully etched gap, exposing the dielectric layer 8939 mounted to the first conductive metal base element 8931, the second conductive metal base element 8933, and the common conductive metal base layer 8906. A welded tongue or partially etched feature may be applied to the fixed end 8930 or the free ends 8910, 8908.

The first conductive metal base element 8931 and the second conductive metal base element 8933 are electrically isolated to create an electrical path to the SMA material. This will be described in more detail below. The common conductive metal base layer 8906 is configured to ensure rigidity of the piezoelectric bimorph actuator 8980 assembly and application. In some examples, the first contact pad (identified with reference numeral "8935" in fig. 89) may be a gold pad plated on the first conductive metal base element 8931. Similarly, the second contact pad (identified by reference numeral "8932" in fig. 89) may be a gold pad plated on the second conductive metal base element 8933.

Fig. 91 illustrates a perspective view of a piezoelectric bimorph actuator 8990, according to an embodiment. The first conductive metal base element 8931 and the second conductive metal base element 8933 are electrically separated by a dielectric gap 8939.

The first contact pad 8935 is configured to electrically couple with a power source. The first contact pad 8935 is electrically and mechanically coupled with the first conductive metal base element 8931. The first conductive metal base element 8931 is electrically and mechanically coupled with a first contact 8937, the first contact 8937 configured to connect to the SMA material 8925 of the first piezoelectric bimorph arm 8921. In other words, the first electrically conductive metal base element 8931 is configured to serve as an electrical pathway to the SMA material 8925 of the first piezoelectric bimorph arm 8921.

The temperature of the SMA material 8925 increases due to the current, thus causing the length of the SMA material 8925 to contract. Contraction of the SMA material 8925 lifts the free end 8910 above the plane of the fixed end 8930, effectively raising the first piezoelectric bimorph arm 8921 in the process.

Similarly, the second contact pad 8932 is configured to be electrically coupled to a power source. The second contact pad 8932 is electrically and mechanically connected to a second conductive metal base element 8933. The second conductive metal base element 8933 is also electrically and mechanically connected to a second contact element 8938, said second contact element 8938 being connected to the SMA material 8922 of the second piezoelectric bimorph arm 8923. In other words, the second conductive metal base element 8933 is configured to serve as an electrical pathway to the SMA material 8922 of the second piezoelectric bimorph arm 8923.

The temperature of the SMA material 8922 increases due to the current, thus causing the length of the SMA material 8922 to contract. Contraction of the SMA material 8922 lifts the free end 8908 above the plane of the fixed end 8930, effectively raising the first piezoelectric bimorph arm 8921 in the process.

Fig. 92 illustrates

SMA materials

8925 and 8922 in an exemplary piezoelectric bimorph actuator 8990 according to an embodiment.

SMA material 8925 is electrically coupled to first conductive metal base element 8931 at fixed end 8930. The SMA material 8925 is also electrically coupled to the electrically conductive metal base layer of the tongue 8907 of the free end 8910. According to some embodiments, the SMA material 8922 and the SMA material 8925 are connected in series. Current flows into the common conductive metal base layer 8906 in direction 8995 at the fixed end, through the first piezoelectric bimorph arm 8921 to the conductive metal base of the tongue 8910. The current flows in a direction 8997 through the SMA material 8925 to the first conductive metal base element 8931 and in a direction 8993 toward the first contact pad 8935.

SMA material 8922 is electrically coupled to second conductive metal base element 8933 at fixed end 8930. The SMA material 8922 is also electrically coupled to the conductive metal base of the tongue 8907 of the free end 8908. Current flows in a direction 8991 into the second contact pad 8932 at the fixed end and through the second conductive metal base element 8933 to the SMA material 8922. The current flows through the SMA material 8922 to the conductive metal base of the tongue 8911. Current flows from the tongue 8911 in a direction 8994 through the second piezoelectric bimorph arm 8923 to the common conductive metal base layer 8906. The current flows in the direction 8992 through the SMA material 8922 to the conductive metal base of the tongue 8911 and in the direction 8911 toward the second contact pad 8935.

According to an embodiment, the close proximity of the common conductive metal base layer 8906 and the

SMA materials

8922 and 8925 such as SMA wires along the entire length of the SMA material provides faster cooling of the wires when the current is turned off (i.e., the piezoelectric bimorph actuator is pushed). The result is faster wire deactivation and shorter actuator response time. The heat distribution of the SMA wires or ribbons is improved. For example, the heat distribution is more uniform, enabling a higher total current to be reliably transmitted to the wire.

Fig. 93 illustrates current flow paths of an exemplary piezoelectric bimorph actuator 9310 according to an embodiment. Piezoelectric bimorph actuator 9310 includes a first piezoelectric bimorph arm 9321 comprising one or more SMA materials 9325, such as SMA ribbon or SMA wire. SMA material 9325 may be secured to the beam of first piezoelectric bimorph arm 9321. The first piezoelectric bimorph arm 9321 may also include a conductive metal base layer, and may optionally include a dielectric layer.

SMA material 9325 is electrically coupled to a first electrically conductive metal base element 9337 of fixed end 9330. The SMA material 9325 is also electrically coupled to the conductive metal base layer of the tongue portion 9311 of the free end 9310. Current flow flows into first conductive metal base element 9337 along direction 9301 at the fixed end. The electrically conductive metal base of SMA material 9325 electrically coupled to tongue 9311 provides a return path for the circuit in direction 9303. Current flows in a single conductive metal base layer in direction 9305 from first piezoelectric bimorph arm 9321.

Piezoelectric bimorph actuator 9310 includes a second piezoelectric bimorph arm 9323 comprising one or more SMA materials 9327, such as SMA ribbon or SMA wire. SMA material 9327 may be secured to the beam of second piezoelectric bimorph arm 9323. The second piezoelectric bimorph arm 9323 may also include a conductive metal base layer, and may optionally include a dielectric layer.

SMA material 9327 is electrically coupled to a second electrically conductive metal base element 9338 of fixed end 9330. The SMA material 9327 is also electrically coupled to the conductive metal base layer of the tongue 9313 of the free end 9312. Current flows from the common conductive metal base layer 9338 into the SMA material 9327 at the fixed end in direction 9307. The electrically conductive metal base of SMA material 9327 electrically coupled to tongue 9313 provides a return path for the circuit in direction 9309. Although some examples show two unsecured load point ends, each unsecured load point end is connected to a respective piezoelectric bimorph arm. The present disclosure also provides for a single unsecured load point end attached to more than one piezoelectric bimorph arm.

Fig. 94 illustrates an exemplary piezoelectric bimorph actuator 9400 including a single unsecured load point end 9410 in accordance with an embodiment. A single unsecured load point end 9410 may include

contact members

9408 and 9409 extending from the conductive metal base of the tongue 9411. The

contact members

9408 and 9409 are configured to engage with a component such as a lens holder. Piezoelectric bimorph actuator 9400 includes a first piezoelectric bimorph arm 9421 including one or more SMA materials 9425, such as an SMA ribbon or SMA wire. The SMA material 9425 may be secured to the beam of the first piezoelectric bimorph arm 9421. The first piezoelectric bimorph arm 9421 may also include a conductive metal base layer, and may optionally include a dielectric layer.

The SMA material 9425 may be electrically coupled to the conductive metal base element at the fixed end as discussed with respect to fig. 93. The SMA material 9425 may also be electrically coupled to the conductive metal base layer of the tongue 9411 of the single unsecured load point end 9410. Piezoelectric bimorph actuator 9400 may also include a second piezoelectric bimorph arm 9423 including one or more SMA materials 9422, such as an SMA ribbon or an SMA wire. The SMA material 9422 may be secured to the beam of the second piezoelectric bimorph arm 9423. The second piezoelectric bimorph arm 9423 may also include a conductive metal base layer, and may optionally include a dielectric layer.

The SMA material 9425 and the SMA material 9422 may be electrically coupled to the electrically conductive metal base element 9411 of the single unsecured load point end 9410. Current flows from the common conductive metal base layer into the SMA material 9425 at the fixed end in the direction 9401. The electrically conductive metal base element 9411 with SMA material 9425 electrically coupled to a single unsecured load point end 9410 provides a return path for the electrical circuit into the SMA material 9422 in direction 9402. Current flows from the conductive base element 9411 at the fixed end through the SMA material 9422 in direction 9403 to the common conductive metal base layer.

In this example, the single unsecured load point end 9410 eliminates the concern of using an alternating current flow path (alternativecurrentflowaths) of the conductive metal base element 9411. The single unsecured load point end 9410 also provides a larger footprint (footprint) for the conductive metal base element 9411, thereby providing a flatter surface after etching. The example piezoelectric bimorph actuator 9400 consumes less power than previous examples because the shorter electrical path improves the resistive path. The single unsecured load point end 9410 also supports designs that incorporate different sized and shaped load point structures.

Fig. 95 illustrates an exemplary piezoelectric bimorph actuator 9500 including a single unsecured load point end 9510, according to an embodiment. A single unsecured load point end 9510 may include load point elements 9512 extending from the conductive metal base of tongue 9511. Load point element 9512 is configured to engage a component such as a lens carrier. Point-of-load element 9512 may be made of any material in combination with the conductive metal base layer of tongue portion 9511 to achieve a low friction interface between point-of-load element 9512 and the engaged payload portion of the component. In some examples, the load points may be made primarily of stainless steel.

Piezoelectric bimorph actuator 9500 includes a first piezoelectric bimorph arm 9521 including one or more SMA materials 9525, such as SMA ribbon or SMA wire. SMA material 9525 may be secured to the beam of the first piezoelectric bimorph arm 9521. The first piezoelectric bimorph arm 9521 may also include a conductive metal base layer and may optionally include a dielectric layer.

The SMA material 9525 is electrically coupled to the conductive metal base element of the fixed end as discussed with respect to fig. 93. SMA material 9525 is also electrically coupled to the conductive metal base layer of tongue portion 9511 of single unsecured load point end 9510. Piezoelectric bimorph actuator 9500 may also include a second piezoelectric bimorph arm 9523 comprising one or more SMA materials 9522, such as SMA ribbon or SMA wire. SMA material 9522 may be secured to the beam of the second piezoelectric bimorph arm 9523. The second piezoelectric bimorph arm 9523 may also include a conductive metal base layer and may optionally include a dielectric layer.

The SMA material 9525 and SMA material 9522 are electrically coupled to the conductive metal base element 9511 of the single unsecured load point end 9510. Current flows from the common conductive metal base layer into the SMA material 9525 at the fixed ends in the direction 9501. Electrical grounding of the SMA material 9525 to the conductive metal base element 9411 of the single unsecured load point end 9410 provides a return path for the electrical circuit into the SMA material 9522 in direction 9502. Current flows from the conductive base element 9511 through the SMA material 9522 to the common conductive metal base layer at the fixed end in the direction 9503.

In some examples of the present disclosure, the load point elements 9512 may be manufactured with different sizes and shapes. In some examples of the present disclosure, the load point element 9512 may be attached to the unsecured load point end 9510 using any method, including but not limited to glue, welding, adhesives, and the like. Furthermore, point-of-load element 9512 may be one or more separate pieces. Point-of-load element 9512 is shown on a single unsecured point-of-load end 9510. Additional examples of the present disclosure may include point-of-load elements located on each of the unsecured point-of-load ends of fig. 88-93, for example.

It will be understood that terms such as "top," "bottom," "above," "below," and the x-, y-, and z-directions used herein as convenient terms refer to the spatial relationship of parts relative to each other, and do not refer to orientation relative to any particular space or gravity. Accordingly, these terms are intended to encompass assembly of parts, whether oriented in the particular orientation shown in the drawings and described in the specification, inverted relative to that orientation, or any other rotational variation.

It is to be understood that the term "invention" as used herein is not to be construed as representing only a single invention having a single essential element or group of elements. Similarly, it should also be understood that the term "invention" encompasses many individual innovations, which may be considered separate inventions. Although the present invention has been described in detail with respect to the preferred embodiments and the accompanying drawings thereof, it should be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and substance of the invention. The scope of the invention. Additionally, the techniques described herein may be used to fabricate devices having two, three, four, five, six, or more typically n piezoelectric bimorph actuators and warped actuators. It is, therefore, to be understood that the detailed description and drawings set forth above are not intended to limit the breadth of the invention, but should be inferred only from the appended claims and their legal equivalents when appropriately interpreted.

Claims

1. A piezoelectric bimorph actuator, characterized in that it comprises:

a fixed end including a dielectric layer and a conductive metal base layer;

at least one piezoelectric bimorph arm extending from the fixed end, the at least one piezoelectric bimorph arm being made of the conductive metal base layer;

at least one free end, each of the at least one free end extending from the at least one piezoelectric bimorph arm; and

one or more SMA materials extending between the fixed end and the at least one free end, the one or more SMA materials being isolated from the electrically conductive metal base layer.

2. A piezoelectric bimorph actuator according to claim 1, characterized in that the electrically conductive metal base layer is separated into a first electrically conductive metal base element, a second electrically conductive metal base element and a common electrically conductive metal base layer by a gap defined by the dielectric layer.

3. The piezoelectric bimorph actuator according to claim 2, characterized in that the gap is a partially or fully etched gap to expose the dielectric layer mounted to the first conductive metal base element, the second conductive metal base element and the common conductive metal base layer.

4. A piezoelectric bimorph actuator according to claim 2, characterized in that said at least one piezoelectric bimorph arm is made of said common conductive metal base layer and of said dielectric layer.

5. The piezoelectric bimorph actuator according to claim 2, characterized in that the first conductive metal base element and the second conductive metal base element are electrically isolated.

6. A piezoelectric bimorph actuator according to claim 2, characterized in that one of the one or more SMA materials is electrically coupled to the first electrically conductive metal base element of the fixed end and to the electrically conductive metal base layer of the at least one free end.

7. A piezoelectric bimorph actuator according to claim 2, characterized in that one of the one or more SMA materials is electrically coupled to the second electrically conductive metal base element of the fixed end and to the electrically conductive metal base layer of the at least one free end.

8. A piezoelectric bimorph actuator according to claim 1, characterized in that said at least one free end comprises a tongue made of the conductive metal base layer and a contact member extending from the tongue.

9. The piezoelectric bimorph actuator according to claim 1, characterized in that said at least one free end comprises a single unsecured load point end connected to both piezoelectric bimorph arms.

10. The piezoelectric bimorph actuator according to claim 9, characterized in that said single unsecured load point comprises a load point element.

11. A piezoelectric bimorph actuator according to claim 1, characterized in that the one or more SMA materials comprise SMA strips or SMA wires.

12. A piezoelectric bimorph actuator according to claim 1, characterized in that the one or more SMA materials are fixed to the at least one piezoelectric bimorph arm using an adhesive film material.

13. The piezoelectric bimorph actuator according to claim 1, characterized in that the conductive metal base layer is made of at least one of stainless steel, copper alloy, gold and nickel.

14. A piezoelectric bimorph actuator according to claim 1, characterized in that the fixed end comprises a first contact pad electrically and mechanically coupled to the SMA material of the first piezoelectric bimorph arm, the first contact pad being a gold-plated stainless steel pad.

15. A piezoelectric bimorph actuator according to claim 1, characterized in that the fixed end comprises a second contact pad electrically and mechanically coupled to the SMA material of the second piezoelectric bimorph arm, the second contact pad being a gold-plated stainless steel pad.

16. An actuator, characterized in that the actuator is made of a dielectric layer and a conductive metal base layer; the actuator includes:

a fixed end, wherein the conductive metal base layer is separated at the fixed end by a gap defined by the dielectric layer into a first conductive metal base element, a second conductive metal base element, and a common conductive metal base layer;

at least one piezoelectric bimorph arm extending from the fixed end, the at least one piezoelectric bimorph arm being made of the common conductive metal base layer and the dielectric layer;

one or more SMA materials extending between the fixed end and the at least one free end, the one or more SMA materials being separated from the conductive metal base layer by the dielectric layer.

17. The actuator of claim 16, wherein the first and second electrically conductive metal base elements are electrically isolated.

18. An actuator of claim 16, wherein one of the one or more SMA materials is electrically coupled to the first conductive metal base element of the fixed end and to the conductive metal base layer of the at least one free end.

19. An actuator of claim 16, wherein one of the one or more SMA materials is electrically coupled to the second conductive metal base element of the fixed end and to the conductive metal base layer of the at least one free end.

20. The actuator of claim 16, wherein the at least one free end includes a tongue portion made of the conductive metal base layer and a contact member extending from the tongue portion.