CN114397478A - Single-axis differential resonant beam gauge outfit module and accelerometer - Google Patents
Single-axis differential resonant beam gauge outfit module and accelerometer Download PDFInfo
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- CN114397478A CN114397478A CN202111440050.8A CN202111440050A CN114397478A CN 114397478 A CN114397478 A CN 114397478A CN 202111440050 A CN202111440050 A CN 202111440050A CN 114397478 A CN114397478 A CN 114397478A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/03—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses by using non-electrical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
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Abstract
The invention relates TO a single-shaft differential resonance beam gauge outfit module and an accelerometer, which comprise a vacuum sealing element and two TO components; the vacuum sealing element comprises a sealing cavity with two open ends; the two TO components are symmetrically packaged at two ends of the sealed cavity; each TO part comprises a TO base, a resonance beam chip, an ASIC hybrid integrated circuit, a getter component, a getter baffle, a ceramic column and a contact pin; the gauge outfit module adopts two TO parts which are symmetrically packaged at two ends of a sealed cavity TO form a differential mode structure, so that the gauge outfit module has good environmental adaptability and high precision in the whole temperature range; the accelerometer is integrated by four independent gauge outfit modules through redundant configuration layout, and compared with the accelerometer with independent three shafts, the accelerometer has the advantages of small mass and volume, compact structure, and higher precision and reliability.
Description
Technical Field
The invention relates to the technical field of quartz resonance beam accelerometers, in particular to a single-axis differential resonance beam gauge outfit module and an accelerometer.
Background
The quartz resonance beam accelerometer is a sensor which converts the measured acceleration into the natural frequency change of the quartz resonance beam by utilizing the resonance type measuring principle, and can be widely applied to the fields of missile attitude control, inertial navigation, earth resource exploration and the like due to the advantages of large range, high precision, small volume, low power consumption, digital output and the like, thereby having important military value and civil value.
At present, the core sensitive element of the quartz resonant beam accelerometer is a resonant beam chip, and the working principle is as follows: based on the inverse piezoelectric effect of the single crystal quartz, the resonance beam works in a resonance state, the inertia force acting on the mass block of the chip is converted into the axial force of the resonance beam by utilizing the micro-lever structure of the chip of the resonance beam, the resonance frequency of the resonance beam is changed due to the change of the axial force of the resonance beam, and the external inertia force is sensed by detecting the change value of the resonance frequency. The resonant beam chip must work in a vacuum environment, and after the resonant beam chip is hermetically packaged by a vacuum sealing element, the resonant beam chip works in an open-loop state, and the environmental temperature has a large influence on zero offset during working. And the oscillating circuit matched with the oscillating circuit is generally arranged outside the vacuum seal, and can generate larger phase drift under the influence of environment. In addition, the vacuum sealing element can release impurity gas in long-term operation, and the change of the vacuum environment in the cavity causes the change of the working characteristics of the resonant beam chip.
In addition, with the development of the inertial application technology, the single-axis accelerometer cannot meet the requirements of performance and function, and the development of a three-axis accelerometer is required. The traditional inertial navigation unit generally adopts a scheme of orthogonally assembling 3 independent single-axis accelerometers, the scheme puts high requirements on the overall design of an inertial navigation system, and has the defects of complex assembly, large volume and mass, high cost, low reliability and the like, so that the development of a high-reliability high-precision integrated three-axis resonant beam accelerometer with redundant characteristics is urgently needed.
Disclosure of Invention
Based on the above description, the invention provides a single-axis differential resonant beam gauge outfit module, which is used for solving the technical problems of low reliability and low environmental adaptability of a resonant beam accelerometer in the prior art.
The technical scheme for solving the technical problems is as follows:
a single-shaft differential resonance beam gauge outfit module comprises a vacuum sealing element and two TO components;
the vacuum sealing element comprises a sealing cavity with two open ends;
the two TO components are symmetrically packaged at two ends of the sealed cavity; each TO part comprises a TO base, a resonance beam chip, an ASIC hybrid integrated circuit, a getter component, a getter baffle, a ceramic column and a contact pin; an accommodating cavity with an opening at one end is formed in the TO base, the contact pin is connected TO the TO base and extends into the accommodating cavity, the ceramic column is installed on the outer side of the contact pin TO ensure the insulation of the contact pin and the TO base, the ASIC hybrid integrated circuit is installed on the end face of the ceramic column, the resonance beam chip is connected TO the end portion of the contact pin, the ASIC hybrid integrated circuit is located between the resonance beam chip and the bottom face of the accommodating cavity, the getter assembly is installed on the TO base and is fixedly connected TO one side, away from the resonance beam chip, of the ASIC hybrid integrated circuit, the getter baffle is installed at the opening of the accommodating cavity of the TO base, and the getter assembly and the ASIC hybrid integrated circuit are respectively located on two sides of the getter baffle; the ends of the two TO components with the resonant beam chips are arranged opposite TO each other.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
the meter head module adopts two TO components which are symmetrically packaged at two ends of a sealed cavity TO form a differential mode structure, can eliminate common mode noise, reduce an offset temperature coefficient and a second-order nonlinear coefficient, and has good environmental adaptability and high precision in a full temperature range; in addition, the getter assembly is arranged in the gauge head module, so that the vacuum degree change caused by the release of miscellaneous gas in a sealed cavity of the gauge head module is avoided, the stable working environment of the resonant beam chip and the ASIC hybrid integrated circuit is ensured, and the reliability of the gauge head module is enhanced.
On the basis of the technical scheme, the invention can be further improved as follows.
Furthermore, each getter component comprises a getter, two getter leads, two lead pads, two getter ceramic columns and two getter pins, the two getter leads are respectively connected TO two ends of the getter, the getter pins are installed on the TO base at intervals, one end of each getter ceramic column extends into the containing cavity, the getter ceramic columns are installed on the outer sides of the getter pins TO ensure the insulation of the getter pins and the TO base, and the two getter leads are respectively connected TO the end portions of the two getter pins through the two lead pads.
Further, the gap between the getter baffle and the getter is not less than 0.5 mm.
Further, a gap between the ASIC hybrid integrated circuit and the getter baffle is not less than 0.2 mm.
Furthermore, the vacuum sealing element further comprises an air exhaust copper pipe, the air exhaust copper pipe is welded on the outer side of the sealing cavity in an airtight mode, and the air exhaust copper pipe is communicated with the inner space of the sealing cavity.
Further, an annular flange is formed on the TO base, and the annular flange is provided with a sealing end face used for being hermetically sealed with the end face of the sealing cavity.
The application also provides an accelerometer, including triaxial support and four table head modules of any one of claims 1 to 6, triaxial support has an installation face and the assembly face that four slopes set up, the installation face is located triaxial support's bottom, four the assembly face is followed in proper order triaxial support's circumference sets up and forms a bottom surface size and is greater than the four-edge platform structure of top surface size, each be formed with an assembly hole on the assembly face, four table head module one-to-one through install in the assembly hole.
The technical scheme has the following beneficial technical effects:
the accelerometer is integrated by four independent gauge head modules through redundant configuration layout, and compared with the accelerometer with three independent axes, the accelerometer has the advantages of small mass and volume, compact structure, and higher precision and reliability.
On the basis of the technical scheme, the invention can be further improved as follows.
Furthermore, the straight lines of the normals of all the assembling surfaces are intersected at one point, and the included angle between the normal of the assembling surface and the normal direction of the installing surface ranges from 50 degrees to 60 degrees.
Furthermore, the gauge outfit module is locked with the triaxial support through a fixing screw after being assembled.
Drawings
Fig. 1 is a schematic structural diagram of a single-axis differential resonant beam meter head module according to an embodiment of the present invention;
in FIG. 2, A is a schematic perspective view of a TO part and B is a schematic cross-sectional view of the TO part;
fig. 3 is a schematic structural diagram of an accelerometer according to a second embodiment of the present invention;
fig. 4 is a schematic diagram of a layout of four sets of redundant header modules according to a second embodiment of the present invention.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that spatial relationship terms, such as "under", "below", "beneath", "below", "over", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. The "connection" in the following embodiments is understood as "electrical connection", "communication connection", or the like if the connected circuits, modules, units, or the like have electrical signals or data transmission therebetween.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
Example one
The embodiment one provides a single-shaft differential resonance beam meter head module 10 which comprises a vacuum seal 1 and two TO parts 2.
The vacuum sealing element 1 comprises a sealing cavity 11 and an air-extracting copper pipe 12.
Wherein, the two ends of the sealed cavity 1 are opened, the air exhaust copper pipe 12 is air-tightly welded on the outer side of the sealed cavity 11, and the air exhaust copper pipe 12 is communicated with the inner space of the sealed cavity 11.
The two TO parts 2 are symmetrically packaged at two ends of the sealed cavity 1; each TO part 2 includes a TO base 21, a resonator beam chip 22, an ASIC hybrid integrated circuit 23, a getter assembly 24, a getter baffle 25, ceramic posts 26, and pins 27.
An accommodating cavity with an opening at one end is formed on the TO base 21, the pin 27 is connected TO the TO base 21 and extends into the accommodating cavity, the ceramic column 26 is installed outside the pin 27 TO ensure the insulation of the pin 27 and the TO base 21, the ASIC hybrid integrated circuit 23 is installed on the end face of the ceramic column 26, the resonance beam chip 22 is connected TO the end part of the pin 27, the ASIC hybrid integrated circuit 23 is located between the resonance beam chip 22 and the bottom surface of the accommodating cavity, the getter component 24 is installed on the TO base 21 and is fixedly connected TO one side of the ASIC hybrid integrated circuit 23 far away from the resonance beam chip 22, the getter baffle 25 is installed at the opening of the accommodating cavity of the TO base 21, and the getter component 24 and the ASIC hybrid integrated circuit 22 are respectively located at two sides of the getter baffle 25; the ends of the two TO components 21 having the resonant beam chips 22 are disposed opposite each other.
Each getter assembly 24 comprises a getter 241, two getter leads 242, two lead pads 243, two getter ceramic columns 244 and two getter pins 245, wherein the two getter leads 242 are respectively connected TO two ends of the getter 241, the getter pins 245 are installed at the TO base 21 at intervals, one end of each getter pin extends into the accommodating cavity, the getter ceramic columns 244 are installed outside the getter pins 245 TO ensure the insulation between the getter pins 245 and the TO base 21, and the two getter leads 242 are respectively connected TO the ends of the two getter pins 245 through the two lead pads 243.
Wherein, the gap between the getter baffle and the getter is not less than 0.5 mm; the gap between the ASIC hybrid integrated circuit and the getter baffle is not less than 0.2 mm.
In order TO ensure effective sealing of the TO member 2 and the sealed housing 1, an annular flange 211 is formed on the TO base 21, and the annular flange 211 has a sealing end face for hermetically sealing with the end face of the sealed housing 1.
In order to better understand the embodiments of the present application, the following describes the fabrication of the header module 10 in detail.
The first step is as follows: fabrication of TO part 2:
(1) the TO base 21, the pin 27 and the getter pin 245 are made of Kovar alloy, and after the cleaning, the TO base, the pin 27 and the getter pin are heated TO 600 ℃ TO 1100 ℃ in a hydrogen atmosphere for 10 TO 30min TO carry out hydrogen burning annealing treatment.
(2) After the TO base 21, the getter ceramic column 244, the inserting pin 27, the getter inserting pin 245 and the getter ceramic column 244 are assembled, the assembly is fixed through a tool, the assembly is hermetically welded by adopting brazing filler metal, the brazing filler metal is selected TO be welded at the temperature of between 700 and 900 ℃, and the leakage rate of the TO base 21 is superior TO 10 & lt-11 & gtPa/m3S, ensure electrical isolation between pin 27, getter pin 245 and TO base 21.
(3) The getter 241 is respectively welded on the two getter pins 245 through lead pads 243 at two ends, the temperature of the getter 241 is not higher than 450 ℃ during welding, and the welding mode adopts laser spot welding.
(4) The getter baffle 245 is assembled and fixed at the opening of the containing cavity of the TO base 21 in a laser spot welding mode, and the temperature of the getter 241 is not higher than 450 ℃ during fixed welding. After assembly, the gap between the getter baffle 245 and the getter 241 is not less than 0.5 mm.
(5) The ASIC hybrid integrated circuit 23 is assembled and fixed on the end faces of the 4 ceramic posts 26 in a way of adopting high-temperature glue, the curing temperature is not more than 450 ℃, and the glass transition temperature of the high-temperature glue is not lower than 300 ℃. The ASIC hybrid integrated circuit 23 and the ceramic posts 26 are electrically interconnected by gold wires. After assembly, the gap between the ASIC hybrid integrated circuit 23 and the getter baffle 25 is not less than 0.2 mm.
(6) The resonant beam chip 22 is fixed on the end face of the contact pin 27 through 4 points and is fixed through high-temperature glue, the curing temperature does not exceed 300 ℃, and the conversion temperature of high-temperature glue glass is not lower than 260 ℃; the resonant beam chip 22 and the ASIC hybrid integrated circuit 23 are electrically interconnected by gold wires.
The second step is that: manufacturing of the vacuum seal 1:
(1) the sealing cavity 11 of the vacuum sealing element 1 is made of kovar alloy, after parts are cleaned, the parts are heated to 600-1100 ℃ in a hydrogen atmosphere for 10-30 min, and then hydrogen burning annealing treatment is carried out;
(2) the air exhaust copper pipe 12 of the vacuum sealing element 1 is made of an oxygen-free copper material, the copper pipe is pickled to remove surface oxides, and the copper pipe is dried after being cleaned.
(3) After the sealed cavity 11 and the air exhaust copper pipe 12 are assembled, brazing filler metal is adopted for airtight welding. The selective welding temperature of the brazing filler metal is between 700 and 900 ℃, and the leakage rate of the vacuum sealing element 1 is superior to 10-11Pa/m3·s。
The third step: manufacturing the gauge head module 10:
(1) two TO parts are provided, TO part 2 and TO part 2 ', respectively, and TO part 2' are assembled and fixed with the vacuum sealing 1, respectively. When assembled, the TO components 2 and 2' are arranged in mirror image with respect TO the vacuum seal 1, forming a differential structural form. The sealing end surface of the TO base 21 of the TO component 2 is hermetically sealed with the upper sealing surface 1a of the vacuum sealing member 1, and the sealing end surface of the TO base 21 'of the TO component 2' is hermetically sealed with the lower sealing surface 1b of the vacuum sealing member 1. The sealing method can be low-temperature solder sealing or laser welding, and during sealing, the temperature of the resonant beam chip 22 and the ASIC hybrid integrated circuit 23 is ensured not to exceed 200 ℃.
(2) The gauge head module 10 is connected with a vacuum processing system through an air exhaust copper pipe 12, a vacuum generator and a valve of the vacuum processing system are started to leak the gauge head module 10 integrally, and the leak rate is better than 10-11Pa/m3S. The vacuum degree in the gauge head module 10 is better than 10-7And after Pa, starting and baking the gauge head module 1, keeping the temperature of the gauge head module 1 between 150 ℃ and 200 ℃, keeping the temperature for 24h to 72h, and then cooling naturally to room temperature.
(3) Two ends of the special activation power supply for the getter are respectively connected with two electrodes of the getter 241 through the getter inserting needle 245, the activation power supply is started, the getter is activated, the activation time is 10min to 20min, and the activation power supply is closed.
(4) The vacuum generator and the valve of the vacuum processing system are closed, and the pumping copper pipe 12 is sealed and pinched off by ultrasonic welding.
The meter head module 10 adopts two TO parts 2 which are symmetrically packaged at two ends of a sealed cavity 11 TO form a differential mode structure, so that common mode noise can be eliminated, an offset temperature coefficient and a second-order nonlinear coefficient are reduced, the environmental adaptability is good, and the precision is high in the full temperature range; in addition, the getter assembly 24 is arranged in the gauge head module 10, so that the vacuum degree change caused by the release of miscellaneous gases in the sealed cavity 11 of the gauge head module 10 is avoided, the resonant beam chip 22 and the ASIC hybrid integrated circuit 23 are ensured to obtain a stable working environment, and the reliability of the gauge head module 10 is enhanced.
Example two
The embodiment provides an accelerometer 100, including triaxial support 20 and four first embodiment gauge outfit modules 10, triaxial support 20 has an installation face 20a and four obliquely arranged assembly faces 20b, installation face 20a is located the bottom of triaxial support 20, four assembly faces 20b set up in proper order along the circumference of triaxial support 20 and form a rectangular terrace structure that bottom surface size is greater than the top surface size, be formed with an assembly hole 20c on each assembly face 20b, four gauge outfit modules 10 one-to-one pass through install in assembly hole 20c, and lock through set screw 30.
Preferably, all the straight lines of the normal lines of the mounting surface 20b intersect at a point, and the included angle between the normal line of the mounting surface 20b and the normal line direction of the mounting surface 20a is in the range of 50 ° to 60 °.
The fabrication of the accelerometer 100 is described in detail below for a better understanding of the embodiments of the present application.
Assembling the accelerometer:
(1) the normal directions of the 4 inclined assembly surfaces 20b respectively correspond to the gauge head module sensitive axes 201, 202, 203 and 204, and the included angles between the directions of all the gauge head module sensitive axes and the installation surface 20a are the same and range from 50 degrees to 60 degrees.
(2) After 4 groups of the gauge head modules 10 are assembled with the assembly holes 20c corresponding to the 4 inclined assembly surfaces 20b, the gauge head modules are locked through the fixing screws 30, and the screws 30 are glued and prevented from loosening.
The accelerometer is integrated by four independent gauge head modules 10 through redundant configuration layout, and compared with the accelerometer with three independent axes, the accelerometer has the advantages of small mass and volume, compact structure, and higher precision and reliability.
It is to be understood that the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and those skilled in the art may make modifications, alterations, additions or substitutions within the spirit and scope of the present invention.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (9)
1. A single-shaft differential resonance beam gauge outfit module is characterized by comprising a vacuum sealing element and two TO components;
the vacuum sealing element comprises a sealing cavity with two open ends;
the two TO components are symmetrically packaged at two ends of the sealed cavity; each TO part comprises a TO base, a resonance beam chip, an ASIC hybrid integrated circuit, a getter component, a getter baffle, a ceramic column and a contact pin; an accommodating cavity with an opening at one end is formed in the TO base, the contact pin is connected TO the TO base and extends into the accommodating cavity, the ceramic column is installed on the outer side of the contact pin TO ensure the insulation of the contact pin and the TO base, the ASIC hybrid integrated circuit is installed on the end face of the ceramic column, the resonance beam chip is connected TO the end portion of the contact pin, the ASIC hybrid integrated circuit is located between the resonance beam chip and the bottom face of the accommodating cavity, the getter assembly is installed on the TO base and is fixedly connected TO one side, away from the resonance beam chip, of the ASIC hybrid integrated circuit, the getter baffle is installed at the opening of the accommodating cavity of the TO base, and the getter assembly and the ASIC hybrid integrated circuit are respectively located on two sides of the getter baffle; the ends of the two TO components with the resonant beam chips are arranged opposite TO each other.
2. The single-shaft differential resonance beam gauge outfit module of claim 1, wherein each getter assembly comprises a getter, two getter leads, two lead pads, two getter ceramic columns and two getter pins, wherein the two getter leads are respectively connected TO two ends of the getter, the getter pins are installed on the TO base at intervals, one end of each getter pin extends into the accommodating cavity, the getter ceramic columns are installed on the outer sides of the getter pins TO ensure the insulation between the getter pins and the TO base, and the two getter leads are respectively connected TO the ends of the two getter pins through the two lead pads.
3. The single-axis differential resonance beam head module set forth in claim 2, wherein a gap between the getter baffle and the getter is not less than 0.5 mm.
4. The single-axis differential resonance beam head module set forth in claim 2, wherein a gap between the ASIC hybrid integrated circuit and the getter baffle is not less than 0.2 mm.
5. The single-axis differential resonance beam gauge outfit module of claim 1, wherein the vacuum sealing element further comprises a pumping copper tube, the pumping copper tube is hermetically welded to the outer side of the seal cavity, and the pumping copper tube is communicated with the inner space of the seal cavity.
6. The single-axis differential resonance beam head module set forth in claim 1, wherein an annular flange is formed on said TO base, said annular flange having a sealing end face for hermetically sealing with an end face of said sealed cavity.
7. An accelerometer, comprising a three-axis support and four gauge outfit modules according to any one of claims 1 to 6, wherein the three-axis support has a mounting surface and four obliquely arranged mounting surfaces, the mounting surface is located at the bottom end of the three-axis support, the four mounting surfaces are sequentially arranged along the circumferential direction of the three-axis support to form a quadrangular frustum structure with a bottom surface size larger than a top surface size, a mounting hole is formed on each mounting surface, and the four gauge outfit modules are correspondingly mounted in the mounting holes in a one-to-one manner.
8. The accelerometer of claim 7, wherein all the normal lines of the mounting surfaces intersect at a point, and the normal line of the mounting surface forms an included angle with the normal direction of the mounting surface in the range of 50 ° to 60 °.
9. The accelerometer of claim 7, wherein said header module is secured to said triaxial frame by a set screw after assembly.
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| CN202111440050.8A CN114397478B (en) | 2021-11-30 | 2021-11-30 | Single-axis differential resonance Liang Biaotou module and accelerometer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111440050.8A CN114397478B (en) | 2021-11-30 | 2021-11-30 | Single-axis differential resonance Liang Biaotou module and accelerometer |
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| CN114397478B CN114397478B (en) | 2024-05-10 |
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